Lamp beads, lamp panels and display devices
By setting a buffer portion in the lamp bead to provide resistance, the problems of low efficiency and poor accuracy in the large amount of transfer of Micro-LED chips are solved, and accurate alignment and efficient transfer are achieved, simplifying the process flow.
Patent Information
- Application Number
- CN202411216532.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-02
- Publication Date
- 2024-12-06
- Estimated Expiration
- 2044-09-02
AI Technical Summary
The huge transfer of Micro-LED chips is low efficiency and poor accuracy during the production process, which affects the production of Micro-LED panels, leading to technical difficulties and promotion obstacles.
A lamp bead is designed, including the lamp bead main body, a buffer part and a mating part. The buffer part provides resistance during the falling process of the lamp bead, prevents rotation and flips, and ensures accurate alignment and efficient transfer.
It improves the accuracy and efficiency of huge transfers, reduces process complexity, avoids the increase and removal steps of counterweights, and enhances the balance and installation accuracy of lamp beads in huge transfers.
Smart Images

Figure CN118763167B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of mass transfer technology, and in particular to a lamp bead, a lamp board and a display device. Background Art
[0002] With the development of display technology, the production process of micro-components has become a development trend of display panels, such as micro light emitting diodes (LED), namely Micro-LED technology. Micro-LED has the characteristics of self-luminous display, and its advantages include full solid state, long life, high brightness, low power consumption, small size, ultra-high resolution, and can be used in extreme environments such as high temperature or radiation. Compared with the organic light-emitting diode (OLED) technology, which is also a self-luminous display, Micro-LED is not only more efficient and has a longer life, but the material is not easily affected by the environment and is relatively stable, and it can also avoid the phenomenon of afterimage.
[0003] However, mass transfer of Micro-LED chips is a difficult point in the production process. Since Micro-LED chips are very small, mass transfer requires very high efficiency, yield rate and transfer accuracy. Therefore, mass transfer technology has become the biggest technical difficulty in the production process of Micro-LED panels, hindering the promotion and use of Micro-LED technology.
[0004] Therefore, it is a technical problem that needs to be urgently solved by those skilled in the art to provide a lamp bead, a lamp board and a display device that can realize mass transfer of chips while achieving precise alignment, improving mass transfer efficiency and simplifying the process flow. Summary of the invention
[0005] The purpose of the present application is to provide a lamp bead, a lamp board and a display device, which, by providing a buffer portion, prevents the lamp bead from rotating and flipping and affecting the accuracy of lamp bead installation, thereby achieving precise alignment of the lamp bead during mass transfer.
[0006] The present application discloses a lamp bead, which is applied to a lamp board, wherein the lamp bead comprises a lamp bead body, a buffer portion and a matching portion: the lamp bead body comprises a first end and a second end which are far away from each other, the first end being an end of the lamp bead body close to a light emitting surface, and the second end being an end of the lamp bead body away from the light emitting surface; the buffer portion is arranged on the first end of the lamp bead body, and the buffer portion surrounds the first end of the lamp bead body; the matching portion is arranged on the second end of the lamp bead body, and the matching portion matches the lamp board to install the lamp bead on the lamp board; wherein, when the lamp bead is installed, the buffer portion provides resistance for the lamp bead so that the lamp bead is installed to a corresponding position on the lamp board.
[0007] Optionally, the buffer portion is a reflective sheet, and the reflective sheet is arranged to surround the first end of the lamp bead body.
[0008] Optionally, a counterweight portion is further provided in the lamp bead body, and the counterweight portion is arranged between the first end and the second end; wherein the mass of the counterweight portion close to the outside of the lamp bead body is greater than the mass of the counterweight portion close to the center of the lamp bead body.
[0009] Optionally, an electrode layer is further provided on the second end of the lamp bead body, and the electrode layer is connected to the lamp board.
[0010] Optionally, the lamp bead further includes a grounding column, and the grounding column is arranged on the second end of the lamp bead body.
[0011] Optionally, the lamp bead further includes a light-emitting chip and a color matching layer, the light-emitting chip is arranged in the lamp bead body, the color matching layer is arranged on a side of the first end of the light-emitting chip close to the lamp bead body, and the light emitted by the light-emitting chip passes through the color matching layer to form light of the same or different colors; wherein the color matching layer includes a first color area, a second color area and a third color area of the same area, the light emitted by the light-emitting chip is converted into a first color light when passing through the first color area, the light emitted by the light-emitting chip is converted into a second color light when passing through the second color area, and the light emitted by the light-emitting chip is converted into a third color light when passing through the third color area.
[0012] Optionally, the lamp bead further includes a packaging layer, the packaging layer is arranged on a side of the color matching layer away from the light-emitting chip, and the buffer portion is arranged on a side of the packaging layer away from the center of the lamp bead body.
[0013] The present application also discloses a lamp board, which is applied to a display panel. The lamp board includes a base plate, a magnetic attraction layer, a flat layer, a power distribution layer and a plurality of lamp beads as described above. The magnetic attraction layer is arranged on the base plate; the flat layer is arranged on the magnetic attraction layer, and a plurality of mounting slots are arranged on the flat layer and the magnetic attraction layer; the power distribution layer is arranged at the bottom of the mounting slot; the lamp beads are installed on the mounting slots; wherein, when the lamp beads are installed on the mounting slots, the power distribution layer provides power for the lamp beads.
[0014] Optionally, the light panel further includes a plastic frame, which is arranged on the bottom plate and located at the periphery of the bottom plate.
[0015] The present application also discloses a display device, including a display panel and a driving circuit, wherein the display panel includes the light board as described above, and the driving circuit drives the display panel.
[0016] The lamp beads of the present application are provided with a buffer part, which provides resistance for the lamp beads during the falling process, thereby increasing the balance of the lamp beads during the mass transfer process, better resisting external disturbances during the mass transfer process, and preventing the lamp beads from rotating and flipping during the falling process and affecting the accuracy of the lamp bead installation, thereby achieving precise alignment of the lamp beads during mass transfer and improving the efficiency of mass transfer. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:
[0018] Figure 1 This is a schematic diagram of the overall structure of a lamp bead according to the first embodiment of the present application;
[0019] Figure 2 This is a schematic diagram of a top view of a lamp bead according to the first embodiment of the present application;
[0020] Figure 3 is a structural schematic diagram of a light board according to the second embodiment of the present application;
[0021] Figure 4 This is a schematic diagram of the structure of a lamp board after lamp beads are installed in the second embodiment of the present application;
[0022] Figure 5 This is a schematic diagram of the overall structure of a light board according to the second embodiment of the present application;
[0023] Figure 6 is a structural schematic diagram of a display device according to the third embodiment of the present application;
[0024] Figure 7 It is a bending test data diagram of the base plate of the present application.
[0025] Among them, 100, lamp beads; 110, lamp bead body; 111, counterweight part; 120, buffer part; 130, matching part; 140, electrode layer; 150, grounding column; 160, light-emitting chip; 170, color matching layer; 171, first color area; 172, second color area; 173, third color area; 180, packaging layer; 200, lamp board; 210, bottom plate; 220, magnetic layer; 230, flat layer; 231, installation slot; 240, power distribution layer; 250, rubber frame; 261, lower diffusion layer; 262, lower prism layer; 263, upper prism layer; 264, upper diffusion layer; 265, glass substrate; 300, display panel; 400, driving circuit; 500, display device. DETAILED DESCRIPTION
[0026] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative, but the present application can be implemented in many alternative forms and should not be construed as being limited to only the embodiments described herein.
[0027] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, features defined as "first" and "second" may explicitly or implicitly include one or more of the features; "plurality" means two or more. The term "including" and any variation thereof means non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components and / or combinations thereof may exist or be added.
[0028] In addition, terms indicating orientation or positional relationships, such as “center,” “lateral,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inside,” and “outside,” are described based on the orientation or relative positional relationships shown in the accompanying drawings and are merely simplified descriptions for the convenience of describing the present application. They do not indicate that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limitations on the present application.
[0029] In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internally connected between two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0030] The present application is described in detail below with reference to the accompanying drawings and optional embodiments. It should be noted that, under the premise of no conflict, the embodiments or technical features described below can be arbitrarily combined to form new embodiments.
[0031] The inventor of the present application discovered during the assembly process of the Micro-LED display that when the lamp beads are transferred in large quantities to the lamp board, the existing mass transfer requirements are very high, which is a relatively large technical difficulty. If the mass transfer is wrong or not in place, it is necessary to manually readjust the position. In particular, in the existing lamp bead installation process that achieves mass transfer by falling, the lamp beads are light in weight (due to their small size) during the falling process, and the lamp beads may rotate and flip during the falling installation process, affecting the installation accuracy of the lamp beads, resulting in unsuccessful mass transfer of the lamp beads. If a new type of counterweight or weight is added to the lamp bead, the lamp bead needs to maintain a relatively high height when falling to maintain the shape of the lamp bead, and generally the counterweight or weight needs to be peeled off and removed after the installation is completed, which increases the process steps of the mass transfer and is very inconvenient. Under this premise, the inventor redesigned the structure of the lamp bead and the lamp board to obtain the technical solution of the present application, and the specific contents are as follows.
[0032] like Figure 1 As shown, as the first embodiment of the present application, a lamp bead 100 is disclosed, and the lamp bead 100 is applied to a lamp board 200. The lamp bead 100 includes a lamp bead body 110, a buffer portion 120 and a matching portion 130. The lamp bead body 110 includes a first end and a second end that are far away from each other, the first end is an end of the lamp bead body 110 close to the light emitting surface, and the second end is an end of the lamp bead body 110 away from the light emitting surface. The buffer portion 120 is arranged on the first end of the lamp bead body 110, and the buffer portion 120 is arranged to enclose the first end of the lamp bead body 110. The matching portion 130 is arranged on the second end of the lamp bead body 110, and the matching portion 130 matches the lamp board 200 to install the lamp bead 100 on the lamp board 200; when the lamp bead 100 is installed, the buffer portion 120 provides resistance for the lamp bead 100, so that the lamp bead 100 is installed at a corresponding position on the lamp board 200;
[0033] The lamp bead 100 of this embodiment can be arranged on the square of the lamp board 200 when a large amount of transfer is performed, and can be placed corresponding to the position on the lamp board 200 where the lamp bead 100 is required to be installed. The lamp bead 100 falls down by relying on its own weight. In this process, since the buffer part 120 is arranged to enclose the first end of the lamp bead body 110, the buffer part 120 provides a resistance for the lamp bead 100 during the falling process, so that the lamp bead 100 will not rotate and flip during the falling process. The lamp bead 100 is precisely aligned while being transferred in bulk, thereby improving the efficiency of mass transfer. Compared with the existing solution of directly allowing the lamp bead 100 to fall, the lamp bead 100 of this embodiment is provided with a buffer portion 120, which provides resistance for the lamp bead 100 during the falling process, so as to prevent the lamp bead 100 from rotating and flipping during the falling process and affecting the installation accuracy of the lamp bead 100. 0, when the lamp bead 100 of this embodiment is dropped, the lamp bead 100 can be dropped at a relatively low height, and the buffer portion 120 provides resistance for the lamp bead 100 to improve the installation accuracy of the lamp bead 100, and after the installation is completed, the next installation process can be directly carried out without adding a process for removing the counterweight or weight, thereby avoiding adding a large amount of transfer processes; in general, the lamp bead 100 of this embodiment is provided with a buffer portion 120, and the buffer portion 120 is provided at the lamp During the falling process of the bead 100, resistance is provided for the lamp bead 100, which increases the balance of the lamp bead 100 during the mass transfer process, better resists external disturbances during the mass transfer process, and prevents the lamp bead 100 from rotating and flipping during the falling process, thereby affecting the installation accuracy of the lamp bead 100, thereby achieving precise alignment of the lamp bead 100 during the mass transfer and improving the mass transfer efficiency; wherein, the matching portion 130 can be a magnetic structure, and a corresponding magnetic layer 220 can be provided on the lamp board 200 to assist in completing the installation of the lamp bead 100.
[0034] The inventor of the present application also considered that although a buffer portion 120 is added to the lamp bead 100, and the buffer portion 120 encloses the first end of the lamp bead body 110 to improve the installation accuracy of the lamp bead 100 during the mass transfer process, after the lamp bead 100 is installed on the lamp board 200, the buffer portion 120 will affect the spacing between the lamp beads 100, so that a certain spacing distance is required between the lamp beads 100, which may cause the light board 200 to have inconsistent light intensity in different areas due to the spacing distance when emitting light. Therefore, the inventor of the present application sets the buffer portion 120 as a reflective sheet, and the reflective sheet is set to enclose the first end of the lamp bead body 110. In this way, when the lamp bead 100 is installed on the lamp board 200, Figure 4As shown, even if there is a distance between the lamp beads 100 and the lamp beads 100, the reflective sheet arranged on the lamp beads 100 can reflect the light emitted by the lamp beads 100 for utilization, which can improve the light utilization rate of the lamp beads 100 to a certain extent and can maintain the light intensity of each area of the lamp board 200 to be consistent; at the same time, the reflective sheet can be made of foam material, which can be a soft foam material formed by physical foaming or cross-linking foaming with raw materials such as plastic (PE, EVA, etc.) and rubber (SBR, CR, etc.) and auxiliary materials such as catalysts, foam stabilizers, and foaming agents, or a structural foam material based on plastic (PVC, PET, etc.) and modified by a penetrating aromatic amide polymerization network. There are holes and gaps between the foaming materials, so that the reflective sheet can better provide resistance for the lamp beads 100 during the falling process, so as to increase the balance of the lamp beads 100 during the mass transfer process and improve the installation accuracy of the lamp beads 100.
[0035] Furthermore, in order to further improve the installation accuracy of the lamp bead 100 during the installation process, a counterweight portion 111 is further provided in the lamp bead body 110, and the counterweight portion 111 is arranged between the first end and the second end, and the mass of the counterweight portion 111 close to the outside of the lamp bead body 110 is greater than the mass of the counterweight portion 111 close to the center of the lamp bead body 110. The counterweight portion 111 is arranged in this way, so that the center of gravity of the lamp bead 100 can be maintained at the center of the lamp bead 100 during the process of massive transfer of the lamp bead 100, and the lamp bead 100 will not rotate and flip due to the change of the center of gravity of the lamp bead 100 during the falling process. After the counterweight portion 111 is provided, the lamp bead 100 can accurately fall on the preset position of the lamp board 200 under the joint action of the counterweight portion 111 and the buffer portion 120, thereby avoiding the problem of displacement and tipping of the lamp bead 100.
[0036] like Figure 2As shown, in order to enable the lamp bead 100 to meet the lighting requirements, the lamp bead 100 also includes a light-emitting chip 160 and a color matching layer 170, the light-emitting chip 160 is arranged in the main body of the lamp board 200, the color matching layer 170 is arranged on one side of the first end of the light-emitting chip 160 close to the lamp bead main body 110, the light emitted by the light-emitting chip 160 passes through the color matching layer 170 to form light of the same or different colors, the color matching layer 170 includes a first color area 171, a second color area 172 and a third color area 173 of the same area, the light emitted by the light-emitting chip 160 is converted into a first color light when passing through the first color area 171, the light emitted by the light-emitting chip 160 is converted into a second color light when passing through the second color area 172, and the light emitted by the light-emitting chip 160 is converted into a third color light when passing through the third color area 173. In this embodiment, In the embodiment, the first color light can be red light, the second color light can be green light, and the third color light can be blue light. Of course, the first color light, the second color light and the third color light can be combined to form the same color, or displayed in different colors; specifically, the color matching layer 170 can be a quantum dot layer (i.e., QD layer) or a fluorescent layer to convert colors, and the light-emitting chip 160 can be arranged in the central area of the lamp bead body 110, so that the light emitted by the light-emitting chip 160 can be evenly dispersed in the first color area 171, the second color area 172 and the third color area 173 of the color matching layer 170, so that the light intensity emitted by the first color area 171, the second color area 172 and the third color area 173 of the color matching layer 170 is almost consistent; in this embodiment, the counterweight portion 111 is arranged on the periphery of the light-emitting chip 160.
[0037] Among them, an electrode layer 140 is also provided on the second end of the lamp bead body 110, and the electrode layer 140 is connected to the lamp board 200. After the lamp bead 100 is installed on the lamp board 200, the lamp board 200 supplies power to the lamp bead 100 through the electrode layer 140, so that the lamp board 200 controls the lamp bead 100 to emit light; the second end of the lamp bead 100 is conical, and the electrode layer 140 covers the second end of the lamp bead body 110. A distribution layer 240 corresponding to the electrode layer 140 is provided on the lamp board 200. When the lamp bead 100 is installed on the lamp board 200, the electrode layer 140 cooperates with the distribution layer 240 so that the lamp board 200 can supply power to the lamp bead 100.
[0038] like Figure 1As shown, the lamp bead 100 further includes an encapsulation layer 180, which is arranged on a side of the color layer 170 away from the light-emitting chip 160, and the encapsulation layer 180 covers the color layer 170 to protect the color layer 170, and the buffer portion 120 is arranged on a side of the encapsulation layer 180 away from the center of the lamp bead body 110, so that the buffer layer will not affect the light emission of the lamp bead 100; the lamp bead 100 further includes a grounding column 150, which is arranged on the second end of the lamp bead body 110, and the grounding column 150 is connected to the grounding end of the lamp board 200, and the grounding column 150 is used for grounding, so as to discharge the static electricity generated on the lamp bead 100 to the lamp board 200 through the grounding column 150, so as to protect the lamp bead 100 prevents it from being broken down by static electricity; wherein, in order to prevent the grounding column 150 from contacting the lamp board 200 first and causing the grounding column 150 to break during the mass transfer of the lamp bead 100, an elastic member is also provided on the lamp bead 100, and the elastic member is arranged on one end of the grounding column 150 close to the light-emitting chip 160. In this way, even if the grounding column 150 contacts the lamp board 200 first during the mass transfer of the lamp bead 100, the elastic member is elastically deformed and compressed after being squeezed by the grounding column 150, so as to prevent the grounding column 150 from breaking. It should be noted that the setting of the grounding column 150 and the elastic member only needs to satisfy the elastic deformation and compression of the elastic member after being squeezed by the grounding column 150. Designers can make specific designs according to actual conditions, which will not be elaborated here.
[0039] like Figure 3 and Figure 4 As shown, as a second embodiment of the present application, a lamp board 200 is disclosed, and the lamp board 200 is applied to a display panel 300. The lamp board 200 includes a bottom plate 210, a magnetic absorption layer 220, a flat layer 230, a power distribution layer 240 and the lamp bead 100 described in the above embodiment. The magnetic absorption layer 220 is arranged on the bottom plate 210, and the flat layer 230 is arranged on the magnetic absorption layer 220. A plurality of mounting slots 231 are provided on the flat layer 230 and the magnetic absorption layer 220. The power distribution layer 240 is arranged at the bottom of the mounting slot 231. The lamp bead 100 is installed on the mounting slot 231. The power distribution layer 240 provides power for the lamp bead 100. When the lamp bead 100 is installed on the lamp board 200, the structure of the lamp board 200 is as shown in FIG. Figure 4 shown.
[0040] During installation, the lamp bead 100 is first placed above the lamp board 200 corresponding to the installation slot 231 on the lamp board 200, and the mass transfer installation of the lamp bead 100 is completed by relying on the weight of the lamp bead 100 itself. Under the action of the buffer part 120, the lamp bead 100 provides a resistance for the lamp bead 100 during the falling process, so that the lamp bead 100 will not rotate and flip during the falling process to affect the installation accuracy of the lamp bead 100, so that the lamp bead 100 can be accurately aligned, and the lamp bead 100 can be accurately installed on the installation slot 231 on the lamp board 200 to complete the mass transfer installation, thereby facilitating the next step of the installation process and improving the efficiency of the mass transfer to a certain extent.
[0041] like Figure 5 As shown, the lamp board 200 also includes a lower diffusion layer 261, a lower prism layer 262, an upper prism layer 263 and an upper diffusion layer 264, the lower diffusion layer 261 is arranged on the lamp bead 100, the lower prism layer 262 is arranged on the side of the lower diffusion layer 261 away from the lamp bead 100, the upper prism layer 263 is arranged on the side of the lower prism layer 262 away from the lower diffusion layer 261, and the upper diffusion layer 264 is arranged on the side of the upper prism layer 263 away from the lower prism layer 262. After the lamp bead 100 is installed on the lamp board 200 through mass transfer, when all the lamp beads 100 are installed, the lower diffusion layer 261, the lower prism layer 262, the upper prism layer 263 and the upper diffusion layer 264 are installed on the lamp board 200 in sequence to complete the assembly of the lamp board 200. The light emitted by the lamp bead 100, after being diverged by the lower diffusion layer 261, is incident on the lower prism layer 262 and the upper prism layer 263. The lower prism layer 262 and the upper prism layer 263 will refract part of the light in the direction of the lamp bead 100, and then be reflected again by the buffer portion 120 made of the reflective sheet to be emitted in the direction away from the lamp bead 100, so that under the action of the lower diffusion layer 261, the lower prism layer 262, the upper prism layer 263, the upper diffusion layer 264 and the buffer portion 120 made of the reflective sheet, the intensity of light emitted from various areas of the lamp board 200 tends to be consistent. The lamp board 200 also includes a glass substrate 265, which is arranged on one end of the upper diffusion layer 264 away from the upper prism layer 263, and the glass substrate 265 protects the structure in the lamp board 200. And, as Figure 3 As shown, the light board 200 is further provided with a plastic frame 250, which is arranged on the bottom plate 210 and is located at the periphery of the bottom plate 210. One end of the bottom plate 210 is bent to cooperate with the plastic frame 250 to form a Figure 3The inventor of the present application has concluded through experiments that the bottom plate 210 and the rubber frame 250 of the structure have strong bending resistance, that is, when subjected to external forces of the same magnitude, the deformation of the structure is small, so the stability of the entire lamp board 200 is better and not easy to deform. During the process of installing the lamp beads 100 on the lamp board 200, the lamp board 200 is not easily damaged.
[0042] The experimental simulation results are as follows Figure 7 As shown, the inventor of the present application has made three structures for comparison. The shape of the bottom plate 210 and the rubber frame 250 set in this scheme is structure three; in the design of structure one, the bottom plate and the rubber frame are spliced, the bottom plate is a straight plate and is directly spliced on the rubber frame. When the design of this structure one is subjected to the force generated by a weight of 25 kg, the maximum deformation generated is 10.015 mm; in the design of structure two, the bottom plate is L-shaped, and a horizontal plate and a vertical plate are set on the bottom plate. The vertical plate is spliced with the rubber frame. When the design of this structure two is subjected to the force generated by a weight of 25 kg, the maximum deformation generated is 9.7863 mm; In the third design, the base plate 210 is designed to be hook-shaped, and a groove matching the base plate 210 is provided on the rubber frame 250. The base plate 210 and the rubber frame 250 are spliced to form structure three. When the design of structure three is subjected to the force generated by a weight of 25 kg, the maximum deformation produced is 9.4875 mm. From the above experimental results, the design of structure three has the smallest deformation range when subjected to a weight of 25 kg, that is, the deformation of the base plate 210 is small, the stability of the entire lamp board 200 is better, and it is not easy to deform. During the process of installing the lamp beads 100 on the lamp board 200, the lamp board 200 is not easily damaged.
[0043] like Figure 6 As shown, as the third embodiment of the present application, a display device 500 is disclosed, wherein the display device 500 includes a display panel 300 and a driving circuit 400, wherein the display panel 300 includes the lamp board 200 as described in the above embodiment, and the driving circuit 400 drives the display panel 300 to be set; the display panel of this embodiment, by arranging a buffer portion on the lamp bead, the buffer portion provides resistance for the lamp bead during the falling process of the lamp bead, thereby increasing the balance of the lamp bead during the mass transfer process, better resisting external disturbances during the mass transfer process, preventing the lamp bead from rotating and flipping during the falling process and affecting the installation accuracy of the lamp bead, achieving precise alignment of the lamp bead in the mass transfer, improving the mass transfer efficiency, and thus improving the installation efficiency of the display device.
[0044] It should be noted that the limitations on the various steps involved in this solution, without affecting the implementation of the specific solution, are not deemed to limit the order of the steps. The steps written in front can be executed first, or later, or even simultaneously. As long as this solution can be implemented, it should be deemed to fall within the scope of protection of this application.
[0045] It should be noted that the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.
[0046] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.
Claims
1. A lamp bead, applied to a lamp board, characterized in that: The lamp beads include: The lamp bead body comprises a first end and a second end which are far away from each other, wherein the first end is an end of the lamp bead body close to the light emitting surface, and the second end is an end of the lamp bead body away from the light emitting surface; A buffer portion is disposed on the first end of the lamp bead body, and the buffer portion surrounds the first end of the lamp bead body; and A matching portion, arranged on the second end of the lamp bead body, the matching portion matches the lamp board to install the lamp bead on the lamp board; Wherein, when the lamp bead is installed, the buffer portion provides resistance for the lamp bead so that the lamp bead is installed at a corresponding position on the lamp board; Wherein, the buffer portion is a reflective sheet, and the reflective sheet is arranged to surround the first end of the lamp bead body.
2. The lamp bead according to claim 1, characterized in that: A counterweight is also provided in the lamp bead body, and the counterweight is arranged between the first end and the second end; Wherein, the mass of the counterweight portion close to the outer side of the lamp bead body is greater than the mass of the counterweight portion close to the center of the lamp bead body.
3. The lamp bead according to claim 1, characterized in that: An electrode layer is also provided on the second end of the lamp bead body, and the electrode layer is connected to the lamp board.
4. The lamp bead according to claim 1, characterized in that: It also includes a grounding column, which is arranged on the second end of the lamp bead body.
5. The lamp bead according to claim 1, characterized in that: It also includes a light-emitting chip and a color matching layer, wherein the light-emitting chip is arranged in the lamp bead body, and the color matching layer is arranged on one side of the light-emitting chip close to the first end of the lamp bead body, and the light emitted by the light-emitting chip passes through the color matching layer to form light of the same or different colors; Wherein, the color matching layer includes a first color area, a second color area and a third color area of the same area, the light emitted by the light emitting chip is converted into the first color light when passing through the first color area, the light emitted by the light emitting chip is converted into the second color light when passing through the second color area, and the light emitted by the light emitting chip is converted into the third color light when passing through the third color area.
6. The lamp bead according to claim 5, characterized in that: It also includes a packaging layer, which is arranged on a side of the color matching layer away from the light emitting chip, and the buffer portion is arranged on a side of the packaging layer away from the center of the lamp bead body.
7. A light board, applied to a display panel, characterized in that: The light board comprises: Base plate; A magnetic attraction layer, arranged on the bottom plate; A flat layer is arranged on the magnetic attraction layer, and a plurality of installation slots are arranged on the flat layer and the magnetic attraction layer; A power distribution layer, arranged at the bottom of the installation slot; and A plurality of lamp beads according to any one of claims 1 to 6, wherein the lamp beads are installed in the installation slots; Wherein, when the lamp bead is installed in the installation slot, the power distribution layer provides power for the lamp bead.
8. The light board according to claim 7, characterized in that: It also includes a plastic frame, which is arranged on the bottom plate and located at the periphery of the bottom plate.
9. A display device, characterized in that: It comprises a display panel and a driving circuit, wherein the display panel comprises the light board as described in any one of claims 7 to 8, and the driving circuit drives the display panel.
