Anti-radiation interference debugging system for metal radiating fin

Abstract

The invention relates to the technical field of PCBs, and provides a metal cooling fin anti-radiation interference debugging system which comprises a PCB, a metal cooling fin, a chip and a connecting piece. The chip is welded on the PCB, the metal cooling fin is connected with the PCB through a fixing column, and one end face, facing the PCB, of the metal cooling fin is attached to one end face, far away from the PCB, of the chip; the connecting piece is detachably arranged on the edge of the fixing column; when the edge of the fixing column is provided with the connecting piece, the fixing column is in short circuit connection with the PCB; and when the edge of the fixing column is not provided with the connecting piece, the fixing column is disconnected from the PCB. Through the detachable connecting piece, the connection state between the metal cooling fin and the PCB can be rapidly adjusted, so that the problem of radiation interference can be flexibly solved, the fixed column does not need to be physically cut off or the PCB does not need to be changed on a large scale, and the problem that the connection relation between the fixed column and the PCB is inconvenient to adjust when the radiation interference exceeds the standard is solved.

Description

Technical Field

[0001] The present application relates to the technical field of PCB, and in particular to a metal heat sink anti-radiation interference debugging system. Background Art

[0002] In modern electronic devices, as operating speeds increase, such as 4K smart displays, TVs, and high-frequency processors (CPUs), graphics processing units (GPUs), and memory (DDR), the heat generated by the devices also increases. In order to effectively dissipate heat, metal heat sinks are generally installed above the chips of these heat sources. These metal heat sinks are usually fixed to the circuit board (PCB) through fixing posts, and the metal heat sink is directly attached to the chip to dissipate heat to keep the chip temperature within a safe range.

[0003] In the related technical means, a plurality of fixing columns are provided on the metal heat sink, and then the fixing columns are firmly locked to the metal heat sink by adding solder on the back side, and then the fixing columns are welded to the PCB board to achieve the effect of fixing the metal heat sink to the PCB board through the fixing columns. The metal heat sink is attached to the top of the chip to dissipate the high temperature generated by the chip when it is working, thereby achieving heat dissipation for the chip.

[0004] With regard to the above technical solution, although the heat dissipation of the chip can be achieved by attaching a metal heat sink to the top of the chip, when the metal heat sink is attached to the top of the chip, the metal heat sink is large in size and is prone to high-frequency radiation interference. When actual testing and verification finds that the radiation interference exceeds the standard, it is necessary to modify the connection relationship between the fixing column and the PCB board to find a way to minimize radiation and achieve the best performance. However, since the fixing column is directly connected and soldered to the PCB board, it is necessary to cut off the fixing column, scrape the copper sheet to separate the ground, or re-modify the PCB before the radiation interference verification can be performed again. The connection relationship between the fixing column and the PCB board is inconvenient to adjust, which increases the product R&D cost and R&D cycle. Summary of the invention

[0005] In order to improve the problem that the connection relationship between the fixed column and the PCB board is inconvenient to adjust when the radiation interference exceeds the standard during actual testing and verification, the present application provides a metal heat sink anti-radiation interference debugging system.

[0006] The present invention provides a metal heat sink anti-radiation interference debugging system, comprising a PCB board, a metal heat sink, a chip and a connector; the chip is welded on the PCB board, and the metal heat sink is connected to the PCB board via a fixing column, wherein an end surface of the metal heat sink facing the PCB board is attached to an end surface of the chip away from the PCB board; the connector is detachably arranged on the edge of the fixing column; when the connector is installed on the edge of the fixing column, the fixing column is short-circuited with the PCB board; when the connector is not installed on the edge of the fixing column, the fixing column is disconnected from the PCB board.

[0007] As a preferred solution, a mounting groove is provided on the PCB board, and the connecting member is detachably mounted on the mounting groove.

[0008] As a preferred solution, the fixing columns include at least two, and the number of the mounting slots is consistent with the number of the fixing columns.

[0009] As a preferred solution, the system includes an electromagnetic compatibility testing device, which includes a plurality of sensors, all of which are arranged at predetermined positions on the PCB board to capture electromagnetic radiation data.

[0010] As a preferred solution, the system further comprises a robotic arm, which installs or removes the connector according to the electromagnetic radiation data.

[0011] As a preferred solution, the connecting member is a 0Ω resistor.

[0012] As a preferred solution, the four fixed columns are respectively fixed column H1, fixed column H2, fixed column H3 and fixed column H4, and the number of the connecting parts is the same as the number of the fixed columns, namely connecting part R1, connecting part R2, connecting part R3 and connecting part R4; the electromagnetic radiation data when the connecting part R1 is connected or disconnected to the fixed column H1 is recorded respectively; the electromagnetic radiation data when the connecting part R2 is connected or disconnected to the fixed column H2 is recorded respectively; the electromagnetic radiation data when the connecting part R3 is connected or disconnected to the fixed column H3 is recorded respectively; the electromagnetic radiation data when the connecting part R4 is connected or disconnected to the fixed column H4 is recorded respectively, for a total of 16 combinations of electromagnetic radiation data, and the fixed column and the connecting part with the best connection in electromagnetic radiation data are selected for connection to find the state with minimal radiation interference.

[0013] Compared with the prior art, the present application has the following beneficial effects: short R&D cycle and high flexibility. Through the detachable connector, the connection state between the metal heat sink and the PCB board can be quickly adjusted, so as to flexibly deal with the radiation interference problem, without the need to physically cut the fixing column or make large-scale PCB board design changes, reducing the reliance on complex welding and mechanical changes, and improving the problem of inconvenient adjustment of the connection relationship between the fixing column and the PCB board when the radiation interference exceeds the standard in actual test verification. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0015] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0016] Figure 1 It is a structural schematic diagram of a metal heat sink anti-radiation interference debugging system provided by an embodiment of the present invention; Figure 2 The present invention provides a schematic block diagram of a metal heat sink anti-radiation interference debugging system.

[0017] Description of reference numerals: 1. PCB board; 11. Mounting slot; 2. Metal heat sink; 3. Chip; 4. Connector; 5. Fixing column; 6. Electromagnetic compatibility test device; 61. Sensor; 7. Robotic arm. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions.

[0020] It should also be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0021] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0022] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0023] Embodiment 1: like Figure 1 to Figure 2 As shown, the present application provides a metal heat sink anti-radiation interference debugging system, including a PCB board 1, a metal heat sink 2, a chip 3 and a connector 4.

[0024] The chip 3 is soldered on the PCB board 1, and the metal heat sink 2 is connected to the PCB board 1 through a fixing column 5, wherein one end surface of the metal heat sink 2 facing the PCB board 1 is attached to the end surface of the chip 3 away from the PCB board 1, and the connector 4 is detachably arranged on the edge of the fixing column 5.

[0025] By soldering the chip 3 on the PCB board 1 and ensuring that the end surface of the metal heat sink 2 facing the PCB board 1 is attached to the end surface of the chip 3 away from the PCB board 1; effective thermal contact is achieved between the metal heat sink 2 and the chip 3, so that the heat generated by the chip 3 can be directly transferred to the metal heat sink 2 and dissipated to the environment through the metal heat sink 2, thereby effectively controlling the temperature of the chip 3; and a detachable connector 4 is provided at the edge of the fixing column 5, so that a flexible connection between the metal heat sink 2 and the PCB board 1 through the fixing column 5 is achieved, allowing the connector 4 to be quickly replaced as needed during testing and debugging to adjust the electrical connection state between the fixing column 5 and the PCB board 1.

[0026] When the connector 4 is installed on the edge of the fixing column 5 , the fixing column 5 is short-circuited to the PCB board 1 .

[0027] By installing the connector 4 on the edge of the fixing column 5, the fixing column 5 is short-circuited with the PCB board 1; when it is necessary to enhance the thermal conductivity or electrical performance, the connection between the metal heat sink 2 and the PCB board 1 can be strengthened by the short-circuit connection; if it is detected that the radiation interference exceeds the standard, the direct electrical connection between the metal heat sink 2 and the PCB board 1 can be reduced by connecting or disconnecting to reduce interference.

[0028] When the connector 4 is not installed on the edge of the fixing column 5 , the fixing column 5 is disconnected from the PCB board 1 .

[0029] When the connector 4 is not installed on the edge of the fixing column 5, the fixing column 5 is disconnected from the PCB board 1; during the radiation interference test, if it is detected that the radiation interference exceeds the standard, the direct electrical connection between the metal heat sink 2 and the PCB board 1 can be reduced by connecting or disconnecting to reduce interference.

[0030] In this embodiment, the chip 3 is soldered on the PCB board 1, and the metal heat sink 2 is ensured to be closely fitted with the chip 3 to absorb and dissipate the heat generated by the chip 3 during operation. The metal heat sink 2 is connected to the PCB board 1 through the fixing column 5 located at its edge, and a detachable connector 4 is installed at the edge of the fixing column 5. The presence or absence of these connectors 4 determines whether the fixing column 5 forms an electrical connection with the PCB board 1. When it is necessary to adjust the radiation interference performance between the metal heat sink 2 and the PCB board 1, by simply adding or removing the connector 4, the connection state between the fixing column 5 and the PCB board 1 can be quickly changed, so that the fixing column 5 and the PCB board 1 are short-circuited or disconnected, which is convenient for rapid debugging and verification of radiation interference, effectively improving the flexibility of the design of the metal heat sink 2 and reducing the debugging cost. Through the detachable connector 4, the connection state between the metal heat sink 2 and the PCB board 1 can be quickly adjusted, so as to flexibly deal with possible radiation interference problems without physically cutting the fixing column 5 or making large-scale design changes to the PCB board 1. It reduces the reliance on complex welding and mechanical changes, thereby reducing the R&D cycle and cost, while also improving the testability and reusability of product design, and providing an effective tool for thermal management and electromagnetic compatibility adjustment of electronic equipment.

[0031] Embodiment 2: like Figure 1 to Figure 2 As shown, a mounting groove 11 is provided on the PCB board 1 , and the connector 4 is detachably mounted on the mounting groove 11 .

[0032] By designing dedicated mounting grooves 11 on the PCB board 1 and allowing the connectors 4 to be detachably mounted on these mounting grooves 11, the flexibility and repeatability of the installation of the connectors 4 are achieved, so that the connectors 4 can be quickly replaced according to test requirements, thereby adjusting the electrical connection state between the metal heat sink 2 and the PCB board 1 to cope with different electromagnetic interference test scenarios.

[0033] There are at least two fixing posts 5 , and the number of the mounting slots 11 is the same as the number of the fixing posts 5 .

[0034] By ensuring that each fixing column 5 corresponds to a mounting slot 11 and the number of fixing columns 5 is at least two, a stable and uniform physical and electrical connection is achieved between the metal heat sink 2 and the PCB board 1, thereby enhancing the stability of the overall structure and providing sufficient fixing points to support the metal heat sink 2.

[0035] like Figure 1 to Figure 2 As shown, the anti-radiation interference debugging system of the metal heat sink 2 includes an electromagnetic compatibility testing device 6, and the electromagnetic compatibility testing device 6 includes a plurality of sensors 61. All sensors 61 are arranged at predetermined positions on the PCB board 1 to capture electromagnetic radiation data.

[0036] By integrating the electromagnetic compatibility test device 6 and deploying multiple sensors 61 at predetermined positions on the PCB board 1, real-time monitoring of the electromagnetic radiation generated when the cooling system is working is achieved, making the data collection of electromagnetic radiation more accurate and comprehensive, and facilitating analysis and adjustment.

[0037] The anti-radiation interference debugging system of the metal heat sink 2 also includes a mechanical arm 7, which installs or removes the connector 4 according to the electromagnetic radiation data.

[0038] By configuring the mechanical arm 7 to automatically adjust the installation state of the connector 4 according to the electromagnetic radiation data, the automated debugging of the system is realized, which greatly improves the debugging efficiency and accuracy, reduces human errors, and makes the debugging process faster and more accurate.

[0039] The connecting member 4 is a 0Ω resistor.

[0040] By using a 0Ω resistor as the connector 4, it is possible to quickly make an electrical connection or disconnection during the test, which is easy to control and has minimal impact on the system, and is convenient for evaluating changes in electromagnetic radiation under different connection states.

[0041] like Figure 1 to Figure 2As shown, preferably there are four fixed columns 5, namely fixed column H1, fixed column H2, fixed column H3 and fixed column H4, and the number of connectors 4 is the same as the number of fixed columns 5, namely connector R1, connector R2, connector R3 and connector R4; the electromagnetic radiation data when connector R1 is connected or disconnected to the fixed column H1 is recorded respectively; the electromagnetic radiation data when connector R2 is connected or disconnected to the fixed column H2 is recorded respectively; the electromagnetic radiation data when connector R3 is connected or disconnected to the fixed column H3 is recorded respectively; the electromagnetic radiation data when connector R4 is connected or disconnected to the fixed column H4 is recorded respectively, for a total of 16 combinations of electromagnetic radiation data, and the fixed column 5 and connector 4 with the best connection in electromagnetic radiation data are selected for connection to find the state with the least radiation interference.

[0042] By recording the electromagnetic radiation data of each connection or disconnection combination of the connector 4 and the fixing column 5, and analyzing and comparing them, it is possible to accurately identify and select the best electromagnetic compatibility configuration, optimize the design of the heat dissipation system to reduce electromagnetic interference, and ensure the optimization of system performance.

[0043] At the same time, since the layouts of integrated circuit boards vary greatly, the conditions of the chip 3 operating frequency multiplication coupling emission are also different, so the effects of grounding and not grounding the fixed feet of the metal heat sink 2 are also different.

[0044] For example, the metal heat sink 2 has 4 fixed feet, each fixed foot has 2 states, and there are a total of 16 combination states. The 0Ω resistor can be simply and quickly added or deleted to quickly find the method with the minimum radiation and the best performance. It can effectively assist engineers to solve the radiation interference problem generated by the H-shaped metal heat sink 2 and improve the EMI exceeding the standard problem generated by this type of metal heat sink 2, find the solution with the minimum radiation interference and the best solution for the system, and shorten its development cycle and difficulty.

[0045] In this embodiment, by designing a special mounting groove 11 on the PCB board 1 and configuring a detachable 0Ω resistor as a connector 4, combined with the use of an automated electromagnetic compatibility test device 6 and a mechanical arm 7, accurate and automated debugging of the anti-radiation interference system of the metal heat sink 2 is achieved. During the operation of the electronic equipment, the connection state between the metal heat sink 2 and the PCB board 1 is automatically adjusted according to the electromagnetic radiation data collected in real time to find the best heat dissipation and electromagnetic compatibility configuration. This not only reduces the time and cost of manual debugging, but also improves the reliability and stability of the equipment in a complex environment. In addition, the system ensures the optimal performance of the metal heat sink 2 under different working conditions through careful testing and adjustment, while effectively controlling electromagnetic interference and ensuring the high performance and long-term stable operation of the product. The metal heat sink 2 is prevented from coupling and emitting multiple times the working frequency of the chip 3, and the metal heat sink 2 is fixed to the PCB board 1 through multiple fixing columns 5, which enhances the reliability and product quality of the product.

[0046] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A metal heat sink anti-radiation interference debugging system, characterized in that: It comprises a PCB board (1), a metal heat sink (2), a chip (3) and a connector (4); The chip (3) is welded on the PCB (1), and the metal heat sink (2) is connected to the PCB (1) via a fixing column (5), wherein one end surface of the metal heat sink (2) facing the PCB (1) is affixed to one end surface of the chip (3) away from the PCB (1); The connecting member (4) is detachably arranged on the edge of the fixing column (5); When the connector (4) is installed on the edge of the fixing column (5), the fixing column (5) is short-circuited to the PCB board (1); When the connector (4) is not installed on the edge of the fixing column (5), the fixing column (5) is disconnected from the PCB board (1).

2. The metal heat sink (2) anti-radiation interference debugging system according to claim 1, characterized in that: The PCB board (1) is provided with a mounting groove (11), and the connecting piece (4) is detachably mounted on the mounting groove (11).

3. The metal heat sink (2) anti-radiation interference debugging system according to claim 2, characterized in that: The fixing columns (5) include at least two, and the number of the mounting grooves (11) is consistent with the number of the fixing columns (5).

4. The metal heat sink (2) anti-radiation interference debugging system according to claim 1, characterized in that: The system comprises an electromagnetic compatibility testing device (6), wherein the electromagnetic compatibility testing device (6) comprises a plurality of sensors (61), wherein all the sensors (61) are arranged at predetermined positions on the PCB board (1) and are used to capture electromagnetic radiation data.

5. The metal heat sink (2) anti-radiation interference debugging system according to claim 4, characterized in that: The system also includes a mechanical arm (7), and the mechanical arm (7) installs or removes the connecting member (4) according to the electromagnetic radiation data.

6. The metal heat sink (2) anti-radiation interference debugging system according to claim 1, characterized in that: The connecting piece (4) is a 0Ω resistor.

7. The metal heat sink (2) anti-radiation interference debugging system according to claim 1, characterized in that: The four fixing columns (5) are respectively a fixing column H1, a fixing column H2, a fixing column H3 and a fixing column H4. The number of the connecting members (4) is the same as the number of the fixing columns (5), namely connecting member R1, connecting member R2, connecting member R3 and connecting member R4. Recording electromagnetic radiation data when the connector R1 is connected or disconnected from the fixing column H1; Recording electromagnetic radiation data when the connector R2 is connected or disconnected from the fixing column H2; Recording electromagnetic radiation data when the connector R3 is connected or disconnected from the fixing column H3; The electromagnetic radiation data when the connector R4 is connected or disconnected with the fixing post H4 are recorded respectively, with a total of 16 combinations of electromagnetic radiation data. The fixing post (5) and the connector (4) with the best electromagnetic radiation data are selected for connection to find the state with the least radiation interference.

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