Method for preparing multi-material composite integrated circuit device based on laser 3D printing

Abstract

The invention provides a method for preparing a multi-material composite integrated circuit device based on laser 3D printing, and the method comprises the steps: building a three-dimensional structure model of a to-be-prepared multi-material composite integrated circuit device, and obtaining a three-dimensional structure model of the to-be-prepared multi-material composite integrated circuit device by using a laser 3D printer according to layered slicing and set process parameters; printing a mechanical structure of the multi-material composite integrated circuit device layer by layer; a conductive material is injected into the reserved conductive channel in a micro-injection mode, and micro die-casting forming of the electronic structure is achieved; and then carrying out a co-firing process at a preset temperature, so that the mechanical structure and the electronic structure are firmly combined, and finally, carrying out packaging. According to the method, the limitation of a traditional multi-material integrated circuit preparation technology is broken through, the design flexibility can be improved, the structure fineness can be improved, the preparation process is simple and rapid, the process preparation period and cost are reduced, and the method is more suitable for the customization requirements of rapid iteration and personalized devices.

Description

Technical Field

[0001] The present invention belongs to the field of integrated circuits, and in particular relates to a method for preparing a multi-material composite integrated circuit device based on laser 3D printing. Background Art

[0002] With the rapid development of information technology, integrated circuit devices are increasingly used in modern electronic devices. In the electronics and microelectronics industries, the demand for multi-material composite integrated circuit devices (MMIC) is growing. The multi-material composite structure constructed by utilizing the characteristics of different materials, including semiconductors, insulators and metals, helps to improve the performance of the device and enable it to operate at a wider range of operating frequencies and in more harsh environments. These devices are widely used in communications, computers, sensors, energy and biomedicine. The core of their preparation technology lies in how to effectively integrate and process a variety of different materials.

[0003] Traditional methods for preparing multi-material integrated circuit devices, such as thin film deposition and wet chemical processes, micro-electromechanical systems (MEMS) processing technology, inkjet printing technology, and low-temperature co-fired ceramics (LTCC) and high-temperature co-fired ceramics (HTCC) technologies, play an important role in the preparation of MMICs. Although thin film deposition technologies such as PVD and CVD can process a variety of materials and make complex stacked structures, the high temperature process may damage some materials, limiting the scope of use of these technologies. Wet chemical processes have advantages in low-cost continuous production, but for the production of more complex MMIC structures, it is difficult to provide the level of precision that can be achieved by photolithography or thin film deposition technology. Micro-electromechanical systems (MEMS) processing technology can prepare multifunctional devices such as highly integrated and feature-rich sensors, but the design and manufacturing process is complex, and the prepared microstructures are often fragile and susceptible to physical damage. Inkjet printing technology has extremely high design freedom and can create complex or customized geometries. It can be used for small-batch production and rapid prototyping, but the types of materials available are limited. Low-temperature co-fired ceramic (LTCC) and high-temperature co-fired ceramic (HTCC) technologies are suitable for the production of high-density multi-layer integrated circuits and have good high-temperature resistance, especially HTCC, which is suitable for high-temperature application environments, but has a long production cycle and is not suitable for the preparation of integrated circuit devices with various complex curved shapes. Summary of the invention

[0004] In view of the deficiencies of the above-mentioned prior art, the present invention provides a method for preparing multi-material composite integrated circuit devices based on laser 3D printing. This method breaks through the material and structural limitations of traditional preparation processes, provides an alternative solution that can greatly improve MMIC performance and production efficiency, and can achieve rapid development and manufacturing of multi-material composite integrated circuit devices in a shorter time and at a lower cost.

[0005] The present invention is achieved through the following technical solutions:

[0006] A method for preparing a multi-material composite integrated circuit device based on laser 3D printing comprises the following steps:

[0007] (1) Using computer-aided design software, a three-dimensional structural model of the multi-material composite integrated circuit device to be prepared is established, and the conductive part of the three-dimensional structural model is reserved as a hollow conductive channel.

[0008] (2) Based on the three-dimensional structure model established in step (1), perform layered slicing and process parameter setting.

[0009] (3) Using a laser 3D printer, the mechanical structure of the multi-material composite integrated circuit device is printed layer by layer according to the layered slicing and set process parameters.

[0010] (4) With respect to the mechanical structure of the multi-material composite integrated circuit device prepared in step (3), the conductive material is injected into the reserved conductive channel by microinjection according to its electronic structure, thereby realizing micro-die casting of the electronic structure.

[0011] (5) For multi-material composite integrated circuit devices with completed mechanical and electronic structures, a co-firing process at a preset temperature is performed to form a firm bond between the mechanical and electronic structures.

[0012] (6) Package the prepared multi-material composite integrated circuit devices through laser 3D printing.

[0013] Preferably, in step (3), the ceramic-based mechanical structure is degreased and sintered after printing is completed.

[0014] Preferably, in step (4), in the case of multi-material composite injection, one material is first injected into the conductive channel, and after it is partially solidified, another one or more materials are injected; before the two different materials come into contact, the interface is activated by interface activation technology, nanoparticle enhancement technology or interface polymerization method to achieve composite of different functional materials.

[0015] The present invention has the following beneficial effects:

[0016] (1) The present invention is based on 3D printing technology, combining high design freedom with the advantages of traditional multi-material preparation methods. First, 3D printing technology is used to quickly and accurately establish a matrix including an insulating layer, a conductive layer and a structural layer, and a composite structure with multiple functions can be designed. Subsequently, precision injection technology is used to inject different metal materials into the predetermined mold formed by 3D printing to form the conductive path and other functional units of the integrated circuit device. This method breaks through the material and structural limitations of traditional preparation processes and provides an alternative solution that can greatly improve the performance and production efficiency of MMICs.

[0017] (2) The present invention combines the high precision and design freedom of 3D printing technology to flexibly prepare complex integrated circuit device structures. Compared with traditional processing technology, this method simplifies the manufacturing process, reduces material and manufacturing costs, and improves the manufacturing efficiency and performance stability of the device.

[0018] (3) The production process of the present invention does not require the preparation and molding of complex molds, and can directly construct more complex and sophisticated geometric structures and microstructures in three-dimensional space, thereby enabling the rapid development and manufacturing of multi-material composite integrated circuit devices in a shorter time and at a lower cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The external structure diagram of the three-dimensional multilayer cylindrical capacitor prepared by the method of the present invention;

[0020] Figure 2 A cross-sectional view of a three-dimensional multilayer cylindrical capacitor prepared by the method of the present invention; DETAILED DESCRIPTION

[0021] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] The method for preparing a multi-material composite integrated circuit device based on laser 3D printing of the present invention is used to prepare a three-dimensional multilayer cylindrical capacitor. The specific implementation method is as follows:

[0023] (1) Use computer-aided design software to draw a three-dimensional model of a cylindrical capacitor, such as Figure 1-2As shown, the cylindrical capacitor includes two semi-cylindrical capacitors 1 and two outer electrodes 5 arranged between the two semi-cylindrical capacitors 1. The outer electrode 5 is in the shape of a flat plate with a thickness of r, which is arranged along the radial direction of the cylindrical capacitor. The two are separated by a solid cylinder 6, and the upper and lower ends of the outer electrode 5 extend to the upper and lower bottom surfaces of the cylindrical capacitor, thereby realizing the structural parallel connection of the two semi-cylindrical capacitors 1. Each semi-cylindrical capacitor 1 is internally connected by 10 independent capacitors 2 in parallel. The structure of each independent capacitor 2 includes a dielectric layer 3 and an inner electrode 4. All dielectric layers 3 and inner electrodes 4 are arranged alternately in sequence and are in the shape of a half cylindrical shell with a thickness of r. The design of the cylindrical capacitor can increase the surface area of ​​the inner electrode and thus increase the capacitance value of the capacitor. The outer electrode 5 and the inner electrode 4 are designed to be reserved in the form of reserved holes.

[0024] The structural parameters of the cylindrical capacitor in this embodiment are as follows: the bottom circle diameter of the cylindrical capacitor is 6 mm, the height is 3 mm, the dielectric layer 3 is 0.1 mm thick, the inner electrode 4 is 0.1 mm thick, the outer electrode layer 5 is 0.1 mm thick, and the solid cylinder 6 has a diameter of 0.2 mm.

[0025] (2) Export the 3D model drawn by the software to STL format, and then set the slice and print parameters. Set the slice thickness to 0.05mm, and slice 60 layers in total. Set the printing power to 1.5W, and the flow rate and speed of the pump material: 10ml each time, a total of 600ml. The printing process must be strictly controlled to ensure inter-layer accuracy and sufficient structural strength.

[0026] (3) A stereolithography (SLA) photopolymerization 3D printer with a 355 nm wavelength 3 W ultraviolet solid laser is selected to print the basic structure of the cylindrical capacitor layer by layer according to the layered slicing and process parameter settings, including the dielectric layer 3 and the non-conductive part of the electrode, and the inner electrode 4 and the outer electrode 5 are partially left in the form of reserved holes.

[0027] The material used is alumina ceramic slurry. During this process, the alumina ceramic slurry solidifies under light of a specific wavelength to form a fine three-dimensional structure. After printing, the model is removed from the printing platform, and the support structure is removed. Post-processing processes such as cleaning, heat treatment, and UV curing are performed to improve the structural strength and electrical performance of the capacitor.

[0028] After the post-processing is completed, the device is degreased and sintered to remove the residual organic matter in the device and enhance the structural strength. Degreasing and sintering need to be performed under specific temperature and time conditions to avoid thermal damage to the material. Specifically, the degreasing temperature required for the material is 800°C. The temperature in the degreasing furnace is first increased from room temperature to 294°C at a rate of 1°C / min, and then increased to 385°C at a rate of 0.2°C / min for 120 minutes, and then increased to 455°C at a rate of 120°C / min and continued to be heated for 120 minutes, and then increased to 600°C at a rate of 0.2°C / min. After no insulation is required, the temperature is increased to 700°C, 800°C, and 900°C at a rate of 0.5°C / min. The temperature is kept for 20 minutes in the middle, and then dropped to room temperature at a rate of 3°C / min after reaching 800°C. The sintering temperature curve is as follows: first, the temperature is increased from room temperature to 600°C at a rate of 5°C / min, then to 1250°C at a rate of 3°C / min, then to 1650°C at a rate of 2°C / min, kept at that temperature for 90 minutes, then decreased to 600°C at a rate of 3°C / min, and finally naturally cooled to room temperature.

[0029] (4) For the mechanical structure of the cylindrical capacitor prepared in the previous step, according to the electronic material configuration preset by the electronic functional structure, the conductive material is injected into the reserved electrode channel by microinjection. The inner electrode 4 and the outer electrode 5 can be made of conductive metals such as silver paste and tungsten paste.

[0030] (5) The cylindrical capacitor with the completed mechanical structure and electronic functional structure is subjected to a co-firing process at a preset temperature to form a firm combination of the mechanical structure and the electronic functional structure. The sintering temperature is determined according to the injected electrode material. The selected silver paste sintering temperature is 800°C. Specifically, the temperature is raised to 800°C at a rate of 5°C / min, then kept at this temperature for 10 minutes, and then naturally cooled to room temperature.

[0031] (6) Finally, the prepared capacitor device is packaged. Through integrated 3D printing, the packaging process does not require expensive molds and cutting processes. It only needs to plate a layer of nickel on the outside of the outer electrode 5 to improve high temperature resistance and corrosion resistance, while improving the welding performance on the circuit board. This packaging simplifies the production process and reduces production costs.

[0032] The present invention can be modified in many ways that are obvious to those skilled in the art, and such modifications are not considered to depart from the scope of the present invention. All such modifications that are obvious to those skilled in the art are intended to be included within the scope of the present claims.

Claims

1. A method for preparing a multi-material composite integrated circuit device based on laser 3D printing, characterized in that: The steps include: (1) Using computer-aided design software, a three-dimensional structural model of the multi-material composite integrated circuit device to be prepared is established, and the conductive part of the three-dimensional structural model is reserved as a hollow conductive channel; (2) performing layered slicing and process parameter setting for the three-dimensional structure model established in step (1); (3) Using a laser 3D printer to print the mechanical structure of a multi-material composite integrated circuit device layer by layer according to the layered slicing and set process parameters; (4) With respect to the mechanical structure of the multi-material composite integrated circuit device prepared in step (3), according to its electronic structure, the conductive material is injected into the reserved conductive channel by microinjection to achieve micro-die casting of the electronic structure; (5) For multi-material composite integrated circuit devices with completed mechanical and electronic structures, a co-firing process at a preset temperature is performed to form a firm bond between the mechanical and electronic structures; (6) The prepared multi-material composite integrated circuit devices are packaged by laser 3D printing.

2. The method for preparing a multi-material composite integrated circuit device based on laser 3D printing according to claim 1, characterized in that: In step (3), the ceramic-based mechanical structure is degreased and sintered after printing.

3. The method for preparing a multi-material composite integrated circuit device based on laser 3D printing according to claim 1, characterized in that: In the case of multi-material composite injection in step (4), one material is first injected into the conductive channel, and after it is partially solidified, another one or more materials are injected; before the two different materials come into contact, the interface is activated by interface activation technology, nanoparticle enhancement technology or interface polymerization method to achieve composite of different functional materials.

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