Piezoelectric actuator array structure for deformable mirror and deformable mirror
By setting a perforation and insulating sleeve on the base and combining the parallel design of the circuit board, the problem of chaotic lead wires of the piezoelectric driver array is solved, achieving high-density arrangement and miniaturization.
Patent Information
- Application Number
- CN202411258865.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2024-12-13
AI Technical Summary
The existing piezoelectric driver array is relatively chaotic when the lead-out line is drawn out, resulting in the array being unable to be closely arranged, affecting space utilization and miniaturization.
A piezoelectric driver array structure for deforming mirrors is designed, in which a perforation is provided on the base so that the lead-out member is drawn out from the end of the piezoelectric driver, and the overall parallel connection is achieved through an insulating sleeve and the circuit board to reduce the process complexity.
It realizes neat lead-out of the lead-out parts, reduces the spacing of the piezoelectric driver, improves the space density and array reliability, and is suitable for the production of high-density piezoelectric driver arrays.
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Figure CN119134957A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of piezoelectric actuators, and in particular to a piezoelectric actuator array structure for a deformable mirror and a deformable mirror. Background Art
[0002] Piezoelectric actuators are high-precision components that can be micro-driven and micro-controlled. Piezoelectric actuators can be assembled into arrays to make deformable mirrors, which are used in adaptive optics to achieve precision imaging, focusing and other functions in laser communications and other fields. With the trend of precision and miniaturization in the application of deformable mirrors, it is often necessary to assemble piezoelectric actuator arrays with higher density in a unit space.
[0003] However, the lead wires of the existing piezoelectric driver are led out from the side of the piezoelectric driver. When the number of piezoelectric drivers in the piezoelectric driver array is large, not only does it cause confusion when the lead wires are led out, but it also causes the piezoelectric driver array to be unable to be arranged closely. Summary of the invention
[0004] In view of this, an embodiment of the present application provides a piezoelectric driver array structure for a deformable mirror and a deformable mirror to solve the problem of confusion when leading out lead wires.
[0005] The first aspect of the present application proposes a piezoelectric driver array structure for a deformable mirror, including a piezoelectric driver array and a base, wherein the piezoelectric driver array includes a plurality of piezoelectric drivers, and the ends of the plurality of piezoelectric drivers are fixed on the base; the piezoelectric driver includes a driver body and a lead-out piece connected to the driver body, and the base has a first through hole for the lead-out piece to pass through.
[0006] The beneficial effects of the piezoelectric driver array structure for the deformable mirror provided in the embodiment of the present application are as follows: by arranging a first through hole on the base, the lead-out piece is led out from the end of the piezoelectric driver and passes through the first through hole to be connected with other devices; compared with the lead-out line being led out from the side of the piezoelectric driver, when the number of piezoelectric drivers in the piezoelectric driver array is large, it not only ensures that the lead-out piece is led out more neatly, but also can reduce the spacing between the piezoelectric drivers, so that the piezoelectric driver array can be arranged with high density in a limited space, thereby improving space utilization and being conducive to the miniaturization of the deformable mirror.
[0007] In some embodiments, the base is a metal base, and the piezoelectric driver array structure for the deformable mirror further includes an insulating sleeve disposed in the first through hole.
[0008] The beneficial effects of adopting the above technical solution are as follows: the metal seat has a higher structural strength and is not easily deformed, so as to ensure the stability of each piezoelectric driver of the piezoelectric driver array being fixed on the base; and an insulating sleeve is arranged in the first through-hole to prevent the lead-out piece from contacting the hole wall of the first through-hole and causing a short circuit.
[0009] In some embodiments, at least one end of the insulating sleeve is provided with an annular flange, and the annular flange covers the edge of the first through hole.
[0010] The beneficial effect of adopting the above technical solution is: avoiding the short circuit caused by the piezoelectric driver contacting the hole edge of the first perforation during the assembly process, and further ensuring the reliability of the piezoelectric driver array.
[0011] In some embodiments, the lead-out member is a lead-out sheet, and the first through-hole is a strip-shaped hole.
[0012] The beneficial effects of adopting the above technical solution are as follows: the lead-out sheets are thinner, which can further reduce the spacing between the piezoelectric drivers and is more conducive to the production of a high-density piezoelectric driver array.
[0013] In some embodiments, the lead-out piece has a connection hole.
[0014] The beneficial effect of adopting the above technical solution is that such a design not only facilitates the connection of the external wire to the lead-out piece, but also facilitates the welding of the lead-out piece to the circuit board.
[0015] In some embodiments, the piezoelectric driver array structure for the deformable mirror also includes a circuit board, which is located on the side of the base facing away from the piezoelectric driver array, and the circuit board has a second through hole, and the lead-out member passes through the first through hole and the second through hole in sequence and is bent and connected to the circuit of the circuit board.
[0016] The beneficial effects of adopting the above technical solution are as follows: With such a design, the overall parallel connection of the piezoelectric actuators can be realized through the circuit board, which reduces the process complexity and is more conducive to the production of a high-density piezoelectric actuator array.
[0017] In some embodiments, the lead-out member is a lead-out wire, and the first through-hole is a circular hole, an elliptical hole, or a polygonal hole.
[0018] The beneficial effect of adopting the above technical solution is as follows: with such a design, the lead wire can be connected to other external devices without being connected to an external wire after passing through the first through hole.
[0019] In some embodiments, the piezoelectric driver includes two lead-out members, and the base is provided with two first through holes at positions corresponding to the piezoelectric driver.
[0020] The beneficial effects of adopting the above technical solution are as follows: the two lead-out pieces are respectively the positive lead-out piece and the negative lead-out piece, and the positive lead-out piece and the negative lead-out piece respectively pass through the two first perforations, so that all the lead-out pieces are led out from the ends of the piezoelectric driver and respectively pass through the first perforations to be connected with other devices, further ensuring that the lead-out pieces are neat when being led out.
[0021] In some embodiments, the two lead-out members of the same piezoelectric driver are located on opposite sides of the driver body.
[0022] The beneficial effect of adopting the above technical solution is that, with this design, the two lead-out pieces of the same piezoelectric driver are far apart and are less likely to interfere with each other.
[0023] A second aspect of the present application provides a deformable mirror, which includes a piezoelectric driver array structure for a deformable mirror as described in the first aspect.
[0024] The deformable mirror adopts any one or more embodiments of the piezoelectric driver array structure for the deformable mirror, and thus has the beneficial effects of the above embodiments, which will not be described one by one here.
[0025] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or conventional technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0027] Figure 1 is a schematic structural diagram of a piezoelectric driver array structure for a deformable mirror provided in some embodiments of the present application;
[0028] Figure 2 yes Figure 1 A schematic diagram of the structure of the medium voltage electric drive from the first perspective;
[0029] Figure 3 yes Figure 1 A schematic diagram of the structure of the medium voltage electric drive from a second perspective;
[0030] Figure 4 yes Figure 1 Schematic diagram of the structure of the middle base;
[0031] Figure 5 yes Figure 4 The enlarged view of point A in the middle;
[0032] Figure 6 is a schematic structural diagram of a piezoelectric driver array structure for a deformable mirror provided in some other embodiments of the present application;
[0033] Figure 7 yes Figure 6 Schematic diagram of the structure of the medium voltage electric drive;
[0034] Figure 8 is a schematic structural diagram of a piezoelectric driver array structure for a deformable mirror provided in some further embodiments of the present application;
[0035] Fig. 9 yes Figure 8 Schematic diagram of the structure of the medium voltage electric drive;
[0036] Fig.10 yes Figure 8 Schematic diagram of the structure of the base and circuit board.
[0037] The meanings of the marks in the figure are:
[0038] 100. Piezoelectric actuator array structure for deformable mirror;
[0039] 10. Piezoelectric driver array; 11. Piezoelectric driver; 111. Driver body; 1111. Piezoelectric driver unit; 1112. Insulator; 1113. Conductive layer; 1114. Conductive sheet; 11141. Center hole; 11142. Arc hole; 112. Lead-out member; 1121. Connection hole;
[0040] 20. base; 21. first perforation;
[0041] 30. Insulating sleeve; 31. Annular flange;
[0042] 40, circuit board; 41, second through hole; 42, circuit; 42a, positive circuit; 42b, negative circuit;
[0043] 50. External wiring. DETAILED DESCRIPTION
[0044] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.
[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.
[0046] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.
[0047] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0048] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.
[0049] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).
[0050] In the description of the embodiments of the present application, the orientations or positional relationships indicated by technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the embodiments of the present application.
[0051] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.
[0052] The first embodiment of the present application proposes a piezoelectric driver array structure for a deformable mirror, which can be used in precision optical components such as deformable mirrors / adaptive optics that require a large capacity density, and is mainly used in laser communications, laser weapons and other fields. Figure 1 , Figure 2 , Figure 4 and Figure 5 The piezoelectric driver array structure 100 for a deformable mirror includes a piezoelectric driver array 10 and a base 20. The piezoelectric driver array 10 includes a plurality of piezoelectric drivers 11, and the ends of the plurality of piezoelectric drivers 11 are fixed on the base 20; the piezoelectric driver 11 includes a driver body 111 and a lead-out member 112 connected to the driver body 111, and the base 20 has a first through hole 21 for the lead-out member 112 to pass through.
[0053] The piezoelectric driver 11 is arranged along the first direction X, and the end of the piezoelectric driver 11 is fixed on the base 20, that is, one end of the piezoelectric driver 11 in the first direction X is fixed on the base 20. It can be understood that one end of the piezoelectric driver 11 can be fixed on the base 20 by bonding, welding, fastener connection, etc.
[0054] Optionally, the driver body 111 includes a plurality of piezoelectric drive units 1111 stacked along a first direction X, and a conductive layer 1113 located on one side of the plurality of piezoelectric drive units 1111 perpendicular to the first direction X. According to the deformation requirement of the driver body 111, two, three, four or more piezoelectric drive units 1111 may be stacked along the first direction X; for example, eight piezoelectric drive units 1111 are stacked along the first direction X.
[0055] The shape of the piezoelectric driving unit 1111 is not limited in the present application. For example, the piezoelectric driving unit 1111 may be a rectangular block structure, a circular block structure, etc.
[0056] There are two conductive layers 1113, namely a positive conductive layer and a negative conductive layer, and both the positive conductive layer and the negative conductive layer extend along the first direction X. The positive conductive layer includes a plurality of positive conductive segments arranged along the first direction X, and the plurality of positive conductive segments are arranged corresponding to the plurality of piezoelectric drive units 1111 respectively; the negative conductive layer includes a plurality of negative conductive segments arranged along the first direction X, and the plurality of negative conductive segments are arranged corresponding to the plurality of piezoelectric drive units 1111 respectively.
[0057] Optionally, the conductive layer 1113 is a silver layer. The conductive layer 1113 made of silver material has excellent conductivity and can effectively improve the current transmission efficiency and stability between the piezoelectric drive units 1111. Of course, the conductive layer 1113 can also be made of other conductive materials, such as copper, aluminum, etc.
[0058] It should be noted that each piezoelectric drive unit 1111 is provided with a positive electrode layer and a negative electrode layer on both sides of the first direction X. Optionally, multiple positive electrode layers and multiple negative electrode layers are alternately arranged in the first direction X, wherein all the positive electrode layers are connected to the positive conductive layer, and all the negative electrode layers are connected to the negative conductive layer.
[0059] The lead-out member 112 is connected to the driver body 111 . It can be understood that the lead-out member 112 can be fixedly connected to the driver body 111 by welding, bonding, or the like.
[0060] It can be understood that the lead-out piece 112 can be directly connected to the conductive layer 1113; or, the driver body 111 also includes a conductive sheet 1114 connected to the conductive layer 1113, and the lead-out piece 112 is connected to the conductive sheet 1114 to be connected to the conductive layer 1113 through the conductive sheet 1114; wherein the conductive sheet 1114 can correspond to one or more piezoelectric drive units 1111.
[0061] Optionally, the base 20 is a disk structure, for example, the base 20 may be a circular disk, an elliptical disk, a polygonal disk, etc.; when the base 20 is a polygonal disk, the base 20 may be a triangular disk, a quadrilateral disk, a pentagonal disk, etc.
[0062] The first through hole 21 extends through the base 20 along the first direction X.
[0063] The piezoelectric driver array structure 100 for a deformable mirror provided in the embodiment of the present application has the following beneficial effects: by setting a first through hole 21 on the base 20, the lead-out piece 112 is led out from the end of the piezoelectric driver 11 and passes through the first through hole 21 to be connected with other devices; compared with the lead-out line being led out from the side of the piezoelectric driver 11, when the number of piezoelectric drivers 11 in the piezoelectric driver array 10 is large, not only can the lead-out piece 112 be ensured to be neat, but also the spacing between the piezoelectric drivers 11 can be reduced, so that the piezoelectric driver array 10 can be arranged with high density in a limited space, thereby improving space utilization and being conducive to the miniaturization of the deformable mirror.
[0064] Please refer to Figure 2 In some embodiments, the piezoelectric driver 11 further includes two insulating members 1112, which are located at two ends of the piezoelectric driver 11 in the first direction X, that is, the plurality of piezoelectric drive units 1111 are located between the two insulating members 1112. The insulating member 1112 may be an insulating plate or an insulating block.
[0065] Please also refer to Figure 4 and Figure 5 In some embodiments, the base 20 is a metal base, and the piezoelectric driver array structure 100 for a deformable mirror further includes an insulating sleeve 30 disposed in the first through hole 21 .
[0066] It is understandable that the metal seat can be made of iron, steel, aluminum and other materials.
[0067] The shape of the insulating sleeve 30 is adapted to the shape of the first through hole 21 ; it can be understood that the insulating sleeve 30 can be made of materials such as plastic and silicone.
[0068] Since the metal seat has a high structural strength and is not prone to deformation, it can ensure the stability of each piezoelectric driver 11 of the piezoelectric driver array 10 fixed on the base 20; and an insulating sleeve 30 is arranged in the first through hole 21 to prevent the lead-out piece 112 from contacting the hole wall of the first through hole 21 and causing a short circuit.
[0069] In other embodiments, the base 20 may be an insulating base having structural strength that meets requirements, in which case an insulating sleeve 30 is not required to be provided in the first through hole 21; or, when the base 20 is a metal base, the insulating sleeve 30 may not be provided, but an insulating material may be coated on the hole wall of the first through hole 21 to form an insulating layer.
[0070] Please refer to Figure 5 In some embodiments, an annular flange 31 is provided at both ends of the insulating sleeve 30 , and the two annular flanges 31 cover the edge of both ends of the first through hole 21 .
[0071] The two ends of the insulating sleeve 30 refer to the two ends of the insulating sleeve 30 in the first direction X.
[0072] By adopting the above technical solution, a short circuit caused by the piezoelectric driver 11 contacting the edge of the first through hole 21 during the assembly process is avoided, and the reliability of the piezoelectric driver array 10 is further ensured.
[0073] In other embodiments, the annular flange 31 may be provided at only one end of the insulating sleeve 30 , or the annular flange 31 may not be provided at both ends of the insulating sleeve 30 .
[0074] Please also refer to Figure 2 and Figure 5 In some embodiments, the lead-out member 112 is a lead-out sheet, and the first through-hole 21 is a strip-shaped hole.
[0075] The thickness direction of the lead-out sheet is perpendicular to the conductive layer 1113 .
[0076] Optionally, the length of the strip-shaped hole is greater than the maximum width of the lead-out piece, so as to ensure that the lead-out piece can pass through the strip-shaped hole smoothly.
[0077] Optionally, the lead-out piece is connected to the conductive layer 1113 through the conductive sheet 1114 , wherein the lead-out piece may be integrally formed with the conductive sheet 1114 , and the lead-out piece may also be fixed (may be but not limited to be welded) on the conductive sheet 1114 .
[0078] Optionally, the conductive sheet 1114 extends along the first direction X and corresponds to a plurality of piezoelectric drive units 1111 of the same piezoelectric drive 11. With this design, even if the conductive layer 1113 between two adjacent piezoelectric drive units 1111 is cracked, the electrode layers between the two adjacent piezoelectric drive units 1111 can be connected through the conductive sheet 1114, thereby avoiding an open circuit, ensuring that the piezoelectric drive 11 can be used normally, and improving the service life of the piezoelectric drive 11. At the same time, the conductive sheet 1114 can also increase the overall structural strength of the piezoelectric drive 11.
[0079] The conductive sheet 1114 is provided with a central hole 11141 and an arc hole 11142 at a position corresponding to the piezoelectric drive unit 1111, and the arc hole 11142 is arranged around the central hole 11141; wherein, there can be one or more arc holes 11142, and when there are multiple arc holes 11142, the multiple arc holes 11142 are arranged at intervals along the circumference of the central hole 11141. In this way, the central hole 11141 and the arc hole 11142 can be used for welding to increase the welding area, and the welding area is distributed more evenly, which is conducive to improving the stability of welding between the conductive sheet 1114 and the conductive layer 1113. Optionally, the central hole 11141 is a circular hole.
[0080] By adopting the above technical solution, the lead-out sheets are thinner, which can further reduce the spacing between the piezoelectric drivers 11 and is more conducive to the manufacture of a high-density piezoelectric driver array 10.
[0081] In other embodiments, the lead-out member 112 is a lead-out wire, and the first through-hole 21 is a circular hole, an elliptical hole, or a polygonal hole; optionally, the lead-out wire is connected to the conductive layer 1113 through a conductive sheet 1114 .
[0082] Please also refer to Figure 2 , Figure 7 and Figure 8 In some embodiments, the lead-out piece has a connection hole 1121 .
[0083] In the present application, the shape of the connection hole 1121 is not limited. For example, the shape of the connection hole 1121 can be a circular hole, an elliptical hole, a polygonal hole, etc.
[0084] It can be understood that one or more connecting holes 1121 can be provided on the same lead-out plate.
[0085] When there are multiple connection holes 1121 on the same lead-out plate, the multiple connection holes 1121 on the same lead-out plate can be arranged along the first direction X; or, the multiple connection holes 1121 on the same lead-out plate are arranged in a direction perpendicular to the first direction X; or, when there are three connection holes 1121 on the same lead-out plate, the three connection holes 1121 can be arranged in a herringbone shape.
[0086] By providing the connection hole 1121 on the lead-out piece, it is not only convenient to connect the external wire 50 to the lead-out piece, but also convenient to solder the lead-out piece to the circuit board 40 .
[0087] In other embodiments, the connection hole 1121 may not be provided on the lead-out sheet.
[0088] Please refer to Figures 8 to 10 In some embodiments, the piezoelectric driver array structure 100 for the deformable mirror also includes a circuit board 40, which is located on the side of the base 20 facing away from the piezoelectric driver array 10, and the circuit board 40 has a second through hole 41. The lead-out member 112 passes through the first through hole 21 and the second through hole 41 in sequence and is bent and connected to the line 42 of the circuit board 40.
[0089] The circuit board 40 is fixed (may be but not limited to be bonded) on the base 20 .
[0090] It can be understood that the shape of the circuit board 40 is compatible with the shape of the base 20. For example, the shape of the base 20 is circular, and correspondingly, the shape of the circuit board 40 is circular; or, the shape of the base 20 is elliptical, and correspondingly, the shape of the circuit board 40 is elliptical; or, the shape of the base 20 is polygonal, and correspondingly, the shape of the circuit board 40 is polygonal.
[0091] Optionally, the number of the second through-holes 41 is the same as the number of the first through-holes 21 and they are arranged in one-to-one correspondence. It can be understood that each second through-hole 41 is arranged in alignment with each first through-hole 21 in the first direction X.
[0092] Optionally, each piezoelectric driver 11 includes two lead-out members 112, the two lead-out members 112 are respectively a positive lead-out member and a negative lead-out member. Correspondingly, the circuit 42 is provided with two groups, one group is a positive circuit 42a, and the other group is a negative circuit 42b. The positive circuit 42a is connected to all the positive lead-out members, and the negative circuit 42b is connected to all the negative lead-out members.
[0093] The lead-out piece 112 passes through the first through-hole 21 and the second through-hole 41 in sequence and is bent and connected to the circuit 42 of the circuit board 40. It can be understood that the lead-out piece 112 first passes through the first through-hole 21 and the second through-hole 41 in sequence, then is bent on the surface of the circuit board 40, and finally is welded on the circuit 42.
[0094] By adopting the above technical solution, the overall parallel connection of the piezoelectric driver 11 can be achieved through the circuit board 40, which reduces the process complexity and is more conducive to the manufacture of a high-density piezoelectric driver array 10.
[0095] In other embodiments, Figure 6 and Figure 7 As shown, the circuit board 40 may not be provided, and the lead-out pieces are connected to external devices via external wires 50 to achieve independent power supply for the piezoelectric driver 11 .
[0096] Please refer to Figure 2 and Figure 3 In some embodiments, the piezoelectric driver 11 includes two lead-out members 112 , and the base 20 is provided with two first through holes 21 at positions corresponding to the piezoelectric driver 11 .
[0097] The two lead-out members 112 are respectively a positive lead-out member and a negative lead-out member. Since two first through holes 21 are provided at positions of the base 20 corresponding to the piezoelectric driver 11 , the positive lead-out member and the negative lead-out member pass through the two first through holes 21 respectively.
[0098] By adopting the above technical solution, the positive lead-out piece and the negative lead-out piece pass through the two first perforations 21 respectively, so that all the lead-out pieces 112 are led out from the ends of the piezoelectric driver 11 and pass through the first perforations 21 respectively to be connected with other devices, further ensuring that the lead-out pieces 112 are neat when being led out.
[0099] In other embodiments, the piezoelectric driver 11 includes two lead-out pieces 112 , and a first through hole 21 is provided on the base 20 at a position corresponding to the piezoelectric driver 11 , wherein one of the lead-out pieces 112 passes through the first through hole 21 , and the other lead-out piece 112 is still led out from the side of the piezoelectric driver 11 .
[0100] Please also refer to Figure 2 and Figure 3 In some embodiments, the two lead-out members 112 of the same piezoelectric driver 11 are located on opposite sides of the driver body 111 .
[0101] By adopting the above technical solution, the two lead-out members 112 of the same piezoelectric driver 11 are far apart and are not prone to interference.
[0102] In other embodiments, the two lead pieces 112 of the same piezoelectric driver 11 may be located on adjacent sides of the driver body 111; or, the two lead pieces 112 of the same piezoelectric driver 11 may be located on the same side of the driver body 111, in which case the positive conductive layer and the negative conductive layer located on the same side of the driver body 111 are isolated.
[0103] The manufacturing method of the piezoelectric driver array structure 100 for a deformable mirror provided in some embodiments of the present application is as follows:
[0104] Embodiment 1
[0105] (1) A piezoelectric actuator array 10 is made of twelve 5*5*18 mm piezoelectric actuators 11. A base 20 with a diameter of 26 mm is selected as the bottom support of the product. A first through hole 21 is designed with a 1 mm gap between two piezoelectric actuators 11 of the base 20. An insulating sleeve 30 is designed. The hole size of the insulating sleeve 30 is 2*0.1 mm. The structures of the base 20 and the insulating sleeve 30 are as follows: Figure 4 shown.
[0106] (2) The twelve piezoelectric drivers 11 are mounted on the base 20 , and the lead pieces 112 of the piezoelectric drivers 11 are passed through the first through holes 21 of the base 20 .
[0107] (3) After the twelve piezoelectric drivers 11 are installed, the external wires 50 can be welded to each piezoelectric driver 11 independently; or the twelve piezoelectric drivers 11 can be connected in parallel through wires, and then the external wires 50 can be welded to each piezoelectric driver 11. Figure 6shown.
[0108] Embodiment 2
[0109] (1) A piezoelectric driver array 10 is made of twelve 5*5*18 mm piezoelectric drivers 11. A base 20 with a diameter of 26 mm is selected as the bottom support of the product. A first through hole 21 is designed with a 1 mm gap between two piezoelectric drivers 11 of the base 20, and an insulating sleeve 30 is designed. The hole size of the insulating sleeve 30 is 2*0.1 mm. A circuit board 40 is fixed to the bottom of the base 20. The circuit board 40 is designed to realize parallel connection of products at different positions through a line 42. The structure of the base 20 and the circuit board 40 is as follows: Fig.10 shown.
[0110] (2) Twelve piezoelectric drivers 11 are mounted on the base 20 , and the lead-out members 112 of the piezoelectric drivers 11 are passed through the first through holes 21 of the base 20 , and then the lead-out members 112 are bent onto the surface of the circuit board 40 .
[0111] (3) After the twelve piezoelectric drivers 11 are installed, the piezoelectric drivers 11 are soldered to the circuit board 40 at the bottom of the base 20 by reflow soldering or soldering iron soldering to form a whole. Figure 8 shown.
[0112] The second aspect of the present application provides a deformable mirror, which comprises a mirror surface and a deformable mirror piezoelectric driver array structure 100 as in the first aspect, wherein a plurality of deformable mirror piezoelectric driver array structures 100 are connected to the mirror surface and used to drive the mirror surface to deform.
[0113] It can be understood that the mirror surface can be a continuous mirror surface, that is, the mirror surface is a whole thin sheet; or, the mirror surface can also be a spliced mirror surface, that is, the mirror surface is spliced by multiple small sub-mirrors, and each piezoelectric driver 11 is connected to and drives a sub-mirror.
[0114] The deformable mirror adopts any one or more embodiments of the piezoelectric driver array structure 100 for the deformable mirror, and thus has the beneficial effects of the above embodiments, which will not be described one by one here.
[0115] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.
Claims
1. A piezoelectric actuator array structure for a deformable mirror, characterized in that: It includes a piezoelectric driver array and a base, wherein the piezoelectric driver array includes multiple piezoelectric drivers, and the ends of the multiple piezoelectric drivers are fixed on the base; the piezoelectric driver includes a driver body and a lead-out piece connected to the driver body, and the base has a first through-hole for the lead-out piece to pass through.
2. The piezoelectric actuator array structure for a deformable mirror according to claim 1, wherein: The base is a metal base, and the piezoelectric driver array structure for the deformable mirror further includes an insulating sleeve arranged in the first through-hole.
3. The piezoelectric actuator array structure for a deformable mirror according to claim 2, wherein: At least one end of the insulating sleeve is provided with an annular flange, and the annular flange covers the edge of the first through-hole.
4. The piezoelectric actuator array structure for a deformable mirror according to claim 1, wherein: The lead-out member is a lead-out plate, and the first through-hole is a strip-shaped hole.
5. The piezoelectric actuator array structure for a deformable mirror according to claim 4, wherein: The lead-out piece has a connecting hole.
6. The piezoelectric actuator array structure for a deformable mirror according to claim 4, wherein: The piezoelectric driver array structure for the deformable mirror also includes a circuit board, which is located on the side of the base facing away from the piezoelectric driver array. The circuit board has a second through-hole, and the lead-out member passes through the first through-hole and the second through-hole in sequence and is bent and connected to the circuit board.
7. The piezoelectric actuator array structure for a deformable mirror according to claim 1, wherein: The lead-out member is a lead-out wire, and the first through-hole is a circular hole, an elliptical hole or a polygonal hole.
8. The piezoelectric actuator array structure for a deformable mirror according to any one of claims 1 to 7, wherein: The piezoelectric driver includes two lead-out members, and the base is provided with two first through-holes at positions corresponding to the piezoelectric driver.
9. The piezoelectric actuator array structure for a deformable mirror according to claim 8, wherein: The two lead-out members of the same piezoelectric driver are located on opposite sides of the driver body.
10. A deformable mirror, characterized in that: It comprises a piezoelectric driver array structure for a deformable mirror as described in any one of claims 1 to 9.
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Elliptical deformable mirror and design method thereof
CN121978817A
