LED lamp bead packaging structure

Abstract

The invention relates to the technical field of LED lamp bead packaging, in particular to an LED lamp bead packaging structure. According to the technical scheme, the working table comprises a primary working table and a secondary working table, wherein the primary working table and the secondary working table can be integrated; the working mother table comprises a first objective table, a first sinking groove for containing a lamp bead support is formed in the first objective table, the working son table comprises a second objective table, a second sinking groove for containing a lamp bead shell is formed in the second objective table, and when the working mother table and the working son table are combined into a whole, the first sinking groove and the second sinking groove form a lamp bead packaging position. When the lamp bead is packaged, the lamp bead bracket and the lamp bead shell are respectively positioned and then are combined through mechanical precision matching, so that the grade of the lamp bead is greatly improved; glue injection is carried out in a negative pressure mode, so that the glue can enter a packaging link; meanwhile, the negative pressure condition is beneficial to elimination of bubbles in the colloid; and the product yield is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED lamp bead packaging, and in particular to an LED lamp bead packaging structure. Background Art

[0002] There are three main types of LED packaging: dispensing, potting, and molding. Molding, potting, and dispensing methods. Molding or potting methods are to first customize a set of molds, use a molding machine, put glue and substrate in the mold, solidify and shape at high temperature, and complete chip packaging after demolding; dispensing method is to use high thixotropic glue, squeeze out a certain amount of glue through a dispensing machine, and complete LED chip packaging after high-temperature baking. Basically, the difficulty of process control is bubbles and lack of materials. The design is mainly about the selection of materials, and the selection of epoxy and brackets with good combination. In order to produce high-yield LED lamp beads, manual operation is not enough to meet the needs. In order to improve the production yield, the following problems will need to be overcome: how to accurately keep the posture of the packaged lamp beads uniform and correct during the packaging and injection process; how to reduce the retention of bubbles and lack of glue during the injection process; further improve the lamp bead yield and improve production efficiency. Summary of the invention

[0003] The purpose of the present invention is to solve the problems existing in the background technology and to provide an LED lamp bead packaging structure which can reduce the bubble retention of the colloid during the packaging process and is conducive to the correct packaging quality.

[0004] The technical solution of the present invention is: an LED lamp bead packaging structure, comprising a working mother table and a working sub-table, and the working mother table and the working sub-table can be integrated;

[0005] The working mother platform includes a loading platform 1, on which a sinking groove 1 for accommodating a lamp bead bracket is arranged, and the working sub-platform includes a loading platform 2, on which a sinking groove 2 for accommodating a lamp bead shell is arranged. When the working mother platform and the working sub-platform are integrated, the sinking groove 1 and the sinking groove 2 form a lamp bead packaging position;

[0006] The working sub-table forms a closed cavity inside, and a suction hole is arranged on the second sinking groove to connect the closed cavity with the outside. The closed cavity is connected to the vacuum pump through a hose. When the vacuum pump is working, the pressure in the closed cavity is reduced to adsorb the lamp bead shell located on the closed cavity.

[0007] A channel is processed on the worktable one at the central diagonal of the sink groove one, and a glue injection component and a pressure-passing component are provided on the worktable two. When the working mother platform and the working sub-platform are buckled together, the glue injection component and the pressure-passing component correspond to and are connected to the two ends of the channel. The glue injection component is connected to an external device and is used for glue injection. When the pressure-passing component senses an increase in temperature, the channel is connected to the closed cavity.

[0008] An LED lamp bead is packaged using an LED lamp bead packaging structure, comprising a lamp bead body including a substrate, an LED wick and a cover cap, wherein a sink body is provided on the substrate, the LED wick is fixed in the sink body, a glue injection groove is provided at the diagonal portion of the substrate, the cover cap is adapted to the sink body and a glue injection port is provided at the diagonal portion corresponding to the glue injection groove.

[0009] Compared with the prior art, the present invention has the following beneficial technical effects:

[0010] By using the buckling of the working mother table and the working sub-table, it is convenient to completely combine the lamp beads together and facilitate the mutual combination of packaging, which further improves the convenience of use and improves the accuracy of alignment, ensuring that the lamp beads can be properly positioned after sealing and achieve a high yield rate;

[0011] When the working mother table and the working sub-table are combined, the driving component and the vacuum pump are started by the external control device at the same time, and then the vacuum pump adsorbs the lamp bead components and makes the closed cavity negative pressure. The heat source provided by the working mother table prompts the opening of the pressure-passing component, and under the action of the pressure-passing component, the closed cavity is connected with the channel and the installation position to form a negative pressure. When injecting glue, it is convenient for the colloid to enter the cavity of the lamp bead to be packaged, which is convenient for the packaging to be completed. The extended channel is conducive to the retention of excess colloid, reducing the gap of the lamp bead caused by lack of glue, and realizing the improvement of the yield rate of packaged lamp beads;

[0012] Since a negative pressure injection environment is set up and a cavity is set at the injection point, when bubbles remain in the colloid, the bubbles will expand and burst rapidly when encountering a negative pressure environment, thereby reducing the source of bubbles in the colloid itself during the injection process, thereby improving the production yield of the lamp beads. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A structural schematic diagram of an embodiment of the present invention is provided;

[0014] Figure 2 for Figure 1 A structural diagram from another perspective;

[0015] Figure 3 for Figure 1 A bottom-up stereogram of

[0016] Figure 4 for Figure 2 Schematic diagram of the internal structure;

[0017] Figure 5 for Figure 4 A schematic diagram of the enlarged structure at point A;

[0018] Figure 6 for Figure 1 A schematic diagram of the structure in a closed state;

[0019] Figure 7 for Figure 6 A schematic diagram of the enlarged structure at B;

[0020] Figure 8 for Figure 6 A schematic diagram of the enlarged structure at C;

[0021] Fig. 9 It is a schematic diagram of the structure of the lamp bead body in the invention.

[0022] Reference numerals:

[0023] 1. Working mother platform; 11. Loading platform 1; 12. Sinking tank 1; 13. Input tank; 14. Overflow tank; 15. Heat insulation box; 16. Valve 1; 17. Valve 2; 18. Discharge valve;

[0024] 2. Working sub-table; 21. Loading table 2; 22. Enclosed cavity; 23. Sinking tank 2; 24. Suction hole;

[0025] 3. Snap-fitting parts; 31. Fixed arm 1; 32. Arm shaft; 33. Fixed arm 2;

[0026] 4. Driving component; 41. Driving motor; 42. Worm; 43. Worm wheel;

[0027] 5. Vacuum pump;

[0028] 6. Glue injection component; 61. Receptacle; 62. Glue injection tube; 63. Glue injection valve;

[0029] 7. Pressure-passing component; 71. Vertical pipe; 72. Hole groove; 73. Adjustment sleeve; 74. Liquid box; 75. Flow pipe; 76. Sub-liquid cylinder; 77. Piston; 78. Moving column; 79. Connecting piece;

[0030] 8. Lamp bead body; 81. Base plate; 82. Sink body; 83. LED wick; 84. Glue injection groove; 85. Cover cap; 86. Glue injection port. DETAILED DESCRIPTION

[0031] The technical solution of the present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0032] Embodiment 1

[0033] like Figure 1-8 As shown, the LED lamp bead packaging structure proposed by the present invention includes a working mother platform 1 and a working sub-platform 2. The working mother platform 1 and the working sub-platform 2 can be attached to each other to form a combined structure through an external pressure structure. The working mother platform 1 is used to provide preheating and curing temperature.

[0034] The working mother platform 1 includes a loading platform 11, on which a sunken groove 12 for accommodating a lamp bead bracket is provided. The working sub-platform 2 includes a loading platform 21, on which a sunken groove 23 for accommodating a lamp bead shell is provided. When the working mother platform 1 and the working sub-platform 2 are integrated, the sunken groove 12 and the sunken groove 23 form a lamp bead packaging position; thereby forming a complete lamp bead and combining them together completely, and because the slots with fixed positions are used, the positions of the combined lamp beads are correct.

[0035] The working sub-table 2 forms a closed cavity 22 inside, and a suction hole 24 is set on the sinking groove 23 to connect the closed cavity 22 with the outside world. The closed cavity 22 is connected to the vacuum pump 5 through a hose. In this embodiment, the function of the vacuum pump 5 is to form a negative pressure in the closed cavity 22, and its functions can be replaced by existing technologies according to specific needs. When the vacuum pump 5 is working, it reduces the pressure in the closed cavity 22 to adsorb the lamp bead shell located on the closed cavity 22, so as to avoid the lamp bead shell falling off due to its own gravity when the working mother table 1 and the working sub-table 2 are combined, which is conducive to the packaging of the lamp beads. In addition, the pressure value in the closed cavity 22 of the vacuum pump 5 can be set by the control device to meet the use requirements.

[0036] A channel is machined on the stage 11 at the center diagonal of the sink 12, which can be referred to Figure 1 , Figure 2 ; The second stage 21 is provided with a glue injection component 6 and a pressure-passing component 7. When the working mother stage 1 and the working sub-stage 2 are buckled, the glue injection component 6 and the pressure-passing component 7 correspond to and are connected to the two ends of the channel. The glue injection component 6 is connected to an external device and is used for glue injection. When the pressure-passing component 7 senses an increase in temperature, the channel is connected to the closed cavity 22. In this embodiment, the function of the glue injection component 6 is to ensure that the colloid can pass through it into the channel during glue injection, and then encapsulate the lamp beads; when not in use, the glue injection component 6 will be in a normally closed state. The function of the pressure-passing component 7 is to wait for a while after the working mother stage 1 and the working sub-stage 2 are fitted, and then connect the closed cavity 22 with the channel and the lamp bead encapsulation position, to ensure that the working mother stage 1 and the working sub-stage 2 are in a completely closed condition to avoid air leakage.

[0037] It should be noted that the number of the sinking trough 12 and its corresponding sinking trough 23 can be set to multiple, and the reasonable structure allocation can be designed according to actual needs to complete the position distribution; specifically, in this embodiment, they are set to four, and the specific reference can be made to Figure 1 .

[0038] In order to solve the problem of the yield rate of lamp beads in the process of encapsulating LED lamp beads, this embodiment is adopted for implementation. The working principle of this embodiment is: by combining and fitting the working mother platform 1 and the working sub-platform 2, a complete lamp bead encapsulation position is formed between the working mother platform 1 and the working sub-platform 2, and by using the vacuum pump 5 to form a negative pressure in the closed cavity 22, the lamp bead components on the second sinking groove 23 are adsorbed and will not fall off during the transfer process; at the same time, due to the combination of the positioning method of the components, the position of the lamp beads can be greatly improved, and the hidden danger of the defective rate of the lamp beads can be reduced. Since the working mother platform 1 can be at different encapsulation temperatures, through different application temperature changes, the lamp bead encapsulation position on the working mother platform 1 is connected with the channel and the closed cavity 22, forming a good negative pressure environment, which is conducive to the entry of the colloid during the encapsulation process, reducing the impact of the glue output due to the excessively high glue injection resistance, and helping to reduce the defective rate of lamp bead encapsulation.

[0039] Embodiment 2

[0040] like Figure 1-8 As shown, the LED lamp bead packaging structure proposed by the present invention includes a working mother platform 1 and a working sub-platform 2. The working mother platform 1 and the working sub-platform 2 can be attached to each other to form a combined structure through an external pressure structure. The working mother platform 1 is used to provide preheating and curing temperature.

[0041] Optionally, a snap-fitting component 3 is arranged between the working platform 1 and the working sub-platform 2, and the snap-fitting component 3 includes a fixed arm 1 31, an arm shaft 32 and a fixed arm 2 33. The fixed arm 1 31 is fixed to the working platform 1, and the fixed arm 2 33 is fixed to the working sub-platform 2. The arm shaft 32 and the fixed arm 2 33 are fixed so that when the arm shaft 32 rotates, the working sub-platform 2 can be rotated to fit with the working platform 1 through the fixed arm 2 33.

[0042] Further optionally, a driving component 4 is provided on the working platform 1, and the driving component 4 includes a driving motor 41, a worm 42 and a worm wheel 43. The driving motor 41 is fixed on the working platform 1, the worm 42 is fixed on the output shaft of the driving motor 41, and the worm wheel 43 is fixed on the arm shaft 32 and meshes with the worm 42 for transmission. The meshing of the worm 42 and the worm wheel 43 forms an automatic locking effect, and after the working platform 1 and the working sub-platform 2 are attached to each other, the two can be stably attached together.

[0043] The working mother platform 1 includes a loading platform 11, on which a sunken groove 12 for accommodating a lamp bead bracket is provided. The working sub-platform 2 includes a loading platform 21, on which a sunken groove 23 for accommodating a lamp bead shell is provided. When the working mother platform 1 and the working sub-platform 2 are integrated, the sunken groove 12 and the sunken groove 23 form a lamp bead packaging position.

[0044] The working sub-table 2 forms a closed cavity 22 inside, and a suction hole 24 is set on the second sinking groove 23 to connect the closed cavity 22 with the outside. The closed cavity 22 is connected to the vacuum pump 5 through a hose. When the vacuum pump 5 is working, it reduces the pressure in the closed cavity 22 to adsorb the lamp bead shell located on the closed cavity 22.

[0045] A channel is machined on the stage 11 at the center diagonal of the sink 12, which can be referred to Figure 1 , Figure 2 ; A glue injection component 6 and a pressure component 7 are provided on the worktable 21. When the working mother platform 1 and the working sub-platform 2 are buckled together, the glue injection component 6 and the pressure component 7 correspond to and are connected to the two ends of the channel. The glue injection component 6 is connected to an external device and is used for glue injection. When the pressure component 7 senses an increase in temperature, the channel is connected to the closed cavity 22.

[0046] Optionally, the channel includes an input groove 13 and an overflow groove 14, both of which are processed on the stage 11 and have a depth less than that of the sinking groove 12; so that during the glue injection process, excessive colloid is prevented from remaining in the channel to avoid waste.

[0047] Optionally, the glue injection component 6 includes a cavity 61, a glue injection tube 62 and a glue injection valve 63. The cavity 61 is in the shape of a hemispherical groove and is fixed as a whole with the worktable 2 21. The cavity 61 is connected to a glue injection tube 62 that passes through the worktable 2 21. The glue injection tube 62 is connected to an external glue injection device by connecting the glue injection valve 63. When the glue injection valve 63 is not in use, the glue injection valve 63 is in a normally closed state. During the process of injecting glue into the cavity 61 through the glue injection tube 62, the bubbles in the colloid expand and burst due to the negative pressure environment in the cavity 61. This can reduce the situation where bubbles are retained in the lamp beads during the packaging process due to the bubbles in the colloid itself, thereby reducing the defective rate of lamp beads in production.

[0048] Optionally, the pressure-passing component 7 includes a vertical tube 71 fixedly arranged in the second stage 21, the vertical tube 71 is a circular tube, one end of the vertical tube 71 is connected to the outside and a hole groove 72 is processed on the circumference, the hole groove 72 is used to communicate with the inside of the closed cavity 22, and an adjustment sleeve 73 is provided on the vertical tube 71. A rubber ring is provided between the adjustment sleeve 73 and the vertical tube 71 to ensure sealing. The adjustment sleeve 73 is connected to a control member that senses temperature changes and controls its movement.

[0049] The control component includes a liquid box 74, in which expansion liquid is arranged. The liquid box 74 is connected to a sub-liquid cylinder 76 through a flow tube 75. A piston 77 that slides due to the volume change of the expansion liquid is arranged in the sub-liquid cylinder 76. A movable column 78 with one end passing through the sub-liquid cylinder 76 is connected to the piston 77. The movable column 78 is fixed to the adjustment sleeve 73 through a connecting piece 79.

[0050] The expansion fluid in this embodiment is kerosene, which can provide lubrication for the piston 77 while ensuring sufficient volume change when the temperature changes; the sliding range of the adjustment sleeve 73 is adapted to the working temperature change.

[0051] Embodiment 3

[0052] like Figure 1-4 As shown, the LED lamp bead packaging structure proposed by the present invention is based on the first embodiment, and this embodiment also includes: the working mother platform 1 also includes a heat insulation box 15 fixed on the stage 11, the heat insulation box 15 and the stage 11 are combined to form a heating chamber, the heating chamber provides a first temperature to the chamber through the connection valve 16, the heating chamber provides a second temperature to the chamber through the connection valve 2 17, and the heating chamber discharges the substance therein through the discharge valve 18;

[0053] Among them, the first temperature refers to the preheating temperature. The packaging of LED lamp beads is generally carried out with silicone. In order to ensure the good fluidity of silicone, preheating is used to maintain stability; and the curing of silicone requires different temperatures and corresponding times. In order to achieve the purpose of rapid packaging, high-temperature silicone is generally used for packaging, so the second temperature is set to be higher than the first temperature; the specific curing time can be set according to actual needs; in this embodiment, valve one 16 and valve two 17 respectively input different steam pressures to achieve a sufficiently stable temperature; the function of the discharge valve 18 is to connect to the external reflux pipe to discharge condensed water and steam.

[0054] A sealing ring groove is provided on the loading platform 11, which encloses the sinking groove 12, the input groove 13 and the overflow groove 14. A sealing ring is provided in the sealing ring groove to improve the sealing performance of the working mother platform 1 and the working sub-platform 2 after bonding.

[0055] A sealing ring groove is arranged in the second sinking groove 23, and a sealing ring is arranged in the sealing ring groove; the sealing performance when the lamp bead shell is adsorbed is improved to ensure stable adsorption.

[0056] This embodiment also provides an installation method for the LED lamp bead packaging structure. A mounting frame is arranged at the bottom of the stage 11. The mounting holes of the mounting frame are arranged in an axial line and can be installed on a conveying line to provide assembly line production operations.

[0057] The present invention provides an LED lamp bead, referring to Fig. 9As shown, the lamp bead body 8 packaged using the above-mentioned LED lamp bead packaging structure includes a lamp bead body 8 including a substrate 81, an LED wick 83 and a cover 85. The substrate 81 is provided with a sink body 82, and the LED wick 83 is fixed in the sink body 82. The substrate 81 is provided with a glue injection groove 84 at the diagonal, and the cover 85 is adapted to the sink body 82 and a glue injection port 86 is provided at the diagonal to correspond to the glue injection groove 84; the structural design of the glue injection groove 84 and the glue injection port 86 enables the inside of the lamp bead to completely pass through the colloid through the diagonal glue injection during the glue injection process, thereby improving the yield rate of the encapsulated lamp bead. The LED lamp bead of this scheme closely displays the main structural components, and other structures are the same as the prior art.

[0058] Based on an LED lamp bead provided in this embodiment, the process of packaging the lamp bead using the LED lamp bead packaging structure is specifically described as follows: the cover 85 in the lamp bead body 8 is placed in the second sinking groove 23 in advance, and the corresponding substrate 81 is placed in the sinking groove 12. It should be noted that the position of the cover 85 and the position of the substrate 81 need to be placed correctly, which can be referred to Figure 1-Figure 3 and Fig. 9 . After the placement is completed, the driving action of the driving component 4 is used in conjunction with the structure of the buckling component 3 to rotate the working sub-table 2, and at the same time, the vacuum pump 5 is started to evacuate the air in the closed cavity 22 to form a negative pressure; the cover 85 is combined with the base plate 81, and the vacuum pump 5 is used to evacuate the negative pressure in the closed cavity 22 to form an effect of adsorbing the cover 85, so as to prevent the cover 85 from falling off during the rotation of the working sub-table 2. After the working mother table 1 and the working sub-table 2 are closed, the pressure-passing component 7 exchanges heat with the heat source to achieve control of the pressure-passing component 7; and the closed cavity 22 is connected with the channel and the lamp bead packaging position, thereby completing negative pressure extraction. For this reason, in the final glue injection, the glue injection component 6 is used to inject glue into the lamp bead packaging position; the quantitative glue injection of the glue injection equipment is connected through the glue injection component 6, so that the colloid enters the input groove 13, and the negative pressure condition causes the bubbles in the colloid to burst, and the colloid flows into the lamp bead body 8 in the packaging position, and enters between the cover 85 and the substrate 81 through the glue injection groove 84, so that the cover 85 and the substrate 81 are packaged. And the colloid invades the lamp bead body 8 in a diagonal manner, which can more completely cover the internal space; the excess residual banana leaves can be retained by the overflow groove 14, while avoiding the problem of lack of glue inside the lamp bead body 8. After the subsequent curing, the colloid retained in the channel can be directly taken out together with the removal of the lamp bead body 8 through the fixed connection of the colloid; and the closing of the working mother platform 1 and the working sub-platform 2. After completing the above-mentioned injection process, valve 2 17 inputs steam so that the lamp bead body 8 on the working mother platform 1 can reach the curing temperature; after the curing is completed, the working mother platform 1 and the working sub-platform 2 are separated by the reverse drive of the driving component 4; the lamp bead body 8 is taken out to complete the entire packaging process of the lamp bead body 8.

[0059] The above-mentioned specific embodiments are only several preferred embodiments of the present invention. Based on the technical solutions of the present invention and the relevant inspirations of the above-mentioned embodiments, those skilled in the art can make various alternative improvements and combinations to the above-mentioned specific embodiments.

Claims

1. An LED lamp bead packaging structure, characterized in that: It comprises a working mother platform (1) and a working sub-platform (2), wherein the working mother platform (1) and the working sub-platform (2) can be integrated into one body; The working mother platform (1) comprises a first loading platform (11), on which a first sinking groove (12) for accommodating a lamp bead bracket is arranged; the working sub-platform (2) comprises a second loading platform (21), on which a second sinking groove (23) for accommodating a lamp bead shell is arranged; when the working mother platform (1) and the working sub-platform (2) are integrated, the first sinking groove (12) and the second sinking groove (23) form a lamp bead packaging position; The working sub-table (2) forms a closed cavity (22) inside, and the second sinking groove (23) is provided with a receiving hole (24) to connect the closed cavity (22) with the outside, and the closed cavity (22) is connected to the suction pump (5) through a hose, and the suction pump (5) reduces the pressure in the closed cavity (22) when working so that the lamp bead shell located on the closed cavity (22) is adsorbed; A channel is machined on the first stage (11) at the central diagonal of the first sink groove (12), and a glue injection component (6) and a pressure component (7) are provided on the second stage (21). When the working mother stage (1) and the working sub-stage (2) are buckled together, the glue injection component (6) and the pressure component (7) correspond to and are connected to the two ends of the channel. The glue injection component (6) is connected to an external device and is used for glue injection. When the pressure component (7) senses an increase in temperature, the channel is connected to the closed cavity (22).

2. The LED lamp bead packaging structure according to claim 1, characterized in that: The channel comprises an input groove (13) and an overflow groove (14); the input groove (13) and the overflow groove (14) are both processed on the object carrier one (11) and the depth of the input groove (13) and the overflow groove (14) is less than the depth of the sinking groove one (12).

3. The LED lamp bead packaging structure according to claim 1 or 2, characterized in that: The glue injection component (6) comprises a cavity (61), a glue injection tube (62) and a glue injection valve (63); the cavity (61) is in the shape of a hemispherical groove and is fixed to the second stage (21) as a whole; the cavity (61) is connected to a glue injection tube (62) passing through the second stage (21); the glue injection tube (62) is connected to an external glue injection device via a glue injection valve (63).

4. The LED lamp bead packaging structure according to claim 1 or 2, characterized in that: The pressure-passing component (7) comprises a vertical tube (71) fixedly arranged in the second stage (21), one end of the vertical tube (71) is communicated with the outside and a hole groove (72) is processed on the circumference, and an adjustment sleeve (73) is slidably sleeved on the vertical tube (71), and the adjustment sleeve (73) is connected to a control member that senses temperature changes and controls its movement; The control component comprises a liquid box (74), wherein the liquid box (74) contains expansion liquid, wherein the liquid box (74) is connected to a sub-liquid cylinder (76) via a flow tube (75), wherein a piston (77) which slides due to the volume change of the expansion liquid is disposed in the sub-liquid cylinder (76), wherein the piston (77) is connected to a movable column (78) having one end passing through the sub-liquid cylinder (76), and wherein the movable column (78) is fixed to the adjustment sleeve (73) via a connecting member (79).

5. The LED lamp bead packaging structure according to claim 1, characterized in that: The workbench (1) further comprises a heat-insulating box (15) fixed on the worktable one (11); the heat-insulating box (15) and the worktable one (11) are combined to form a temperature-raising chamber; the temperature-raising chamber provides a first temperature to the chamber via a connecting valve one (16); the temperature-raising chamber provides a second temperature to the chamber via a connecting valve two (17); and the temperature-raising chamber discharges the substance therein via a discharge valve (18).

6. The LED lamp bead packaging structure according to claim 1, characterized in that: The working mother platform (1) and the working sub-platform (2) are rotated via a locking component (3); the locking component (3) comprises a fixed arm 1 (31), an arm shaft (32) and a fixed arm 2 (33); the fixed arm 1 (31) and the fixed arm 2 (33) are respectively fixed to the working mother platform (1) and the working sub-platform (2); one of the fixed arm 1 (31) or the fixed arm 2 (33) is fixed to the arm shaft (32).

7. The LED lamp bead packaging structure according to claim 6, characterized in that: The workbench (1) is provided with a driving component (4), the driving component (4) comprising a driving motor (41), a worm (42) and a worm wheel (43), the driving motor (41) being fixed on the workbench (1), the worm (42) being fixed on an output shaft of the driving motor (41), and the worm wheel (43) being fixed on an arm shaft (32) and meshing with the worm (42) for transmission.

8. The LED lamp bead packaging structure according to claim 2, characterized in that: The loading platform 1 (11) is provided with a sealing ring groove, which encloses the sinking groove 1 (12), the input groove (13) and the overflow groove (14), and a sealing ring is provided in the sealing ring groove.

9. The LED lamp bead packaging structure according to claim 1 or 8, characterized in that: A sealing ring groove is arranged in the second sinking groove (23), and a sealing ring is arranged in the sealing ring groove.

10. An LED lamp bead, characterized in that: A lamp bead body (8) packaged using the LED lamp bead packaging structure described in any one of claims 1 to 9 comprises a lamp bead body (88) including a substrate (81), an LED wick (83) and a cover (85), wherein a sink body (82) is provided on the substrate (81), the LED wick (83) is fixed in the sink body (82), a glue injection groove (84) is provided at a diagonal position of the substrate (81), and the cover (85) is adapted to the sink body (82) and a glue injection port (86) is provided at a diagonal position corresponding to the glue injection groove (84).

Images