Liquid cooling module and electronic equipment

Abstract

The embodiment of the invention provides a liquid cooling module and electronic equipment, and the liquid cooling module comprises a body and a cooling liquid. The body is provided with a cooling flow channel, a plurality of first electromagnetic coils and a plurality of second electromagnetic coils, the cooling flow channel is filled with the cooling liquid, and the cooling liquid is conductive liquid or magnetic liquid; the second electromagnetic coils and the first electromagnetic coils are arranged on the two sides of the cavity wall of the cooling flow channel in a one-to-one correspondence mode, and the first electromagnetic coils and the second electromagnetic coils are arranged in the extending direction of the cooling flow channel in a spaced mode. And the first electromagnetic coil and the second electromagnetic coil generate a magnetic field under the condition of electrification, so that the cooling liquid flows in the cooling flow channel. According to the liquid cooling module, the cooling liquid can circularly flow through magnetic force, and the liquid cooling module has the characteristic of no mechanical vibration.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation devices, and in particular to a liquid cooling module and an electronic device. Background Art

[0002] In order to improve the performance of electronic devices, some electronic devices are equipped with liquid cooling modules to dissipate heat for electronic devices such as processors that need heat dissipation. The liquid cooling module in the related art uses a micro piezoelectric pump to drive the flow of coolant, thereby "distributing" the heat of the components that need heat dissipation to prevent the temperature of the components that need heat dissipation from being too high. The micro piezoelectric pump used in the related art will generate mechanical vibrations during operation, affecting the normal use of electronic devices. Summary of the invention

[0003] The embodiments of the present application provide a liquid cooling module and an electronic device to solve the problem in the related art that the liquid cooling module may generate mechanical vibration during operation.

[0004] In order to solve the above technical problems, this application is implemented as follows: In a first aspect, an embodiment of the present application provides a liquid cooling module.

[0005] The liquid cooling module provided in the embodiment of the present application includes: a body and a coolant; the body is provided with a cooling channel, a plurality of first electromagnetic coils and a plurality of second electromagnetic coils, the coolant is filled in the cooling channel, the coolant is a conductive liquid, or the coolant is a magnetic liquid; the second electromagnetic coils and the first electromagnetic coils are arranged on both sides of the cavity wall of the cooling channel in a one-to-one correspondence, and each of the first electromagnetic coils and each of the second electromagnetic coils are respectively arranged at intervals along the extension direction of the cooling channel; the first electromagnetic coils and the second electromagnetic coils generate a magnetic field when energized, so that the coolant flows in the cooling channel.

[0006] Optionally, the body includes a first cover plate, a support structure, and a second cover plate stacked in sequence, and the first cover plate, the support structure, and the second cover plate form the cooling channel.

[0007] Optionally, the first cover plate includes a first film layer, a first conductor layer, a first insulating layer, a second conductor layer and a second film layer which are stacked; the first conductor layer is provided with the first electromagnetic coil, and the second conductor layer is provided with a first wire electrically connected to the first electromagnetic coil.

[0008] Optionally, the second cover plate includes a third film layer, a third conductor layer, a second insulating layer, a fourth conductor layer and a fourth film layer which are stacked; the fourth conductor layer is provided with the second electromagnetic coil, and the third conductor layer is provided with a second wire electrically connected to the second electromagnetic coil.

[0009] In a second aspect, an embodiment of the present application provides an electronic device.

[0010] The electronic device provided in the embodiment of the present application includes: any one of the liquid cooling modules provided in the embodiment of the present application.

[0011] Optionally, the first electromagnetic coil includes three first sub-coils arranged in sequence along the extension direction of the cooling channel, the main body is provided with a first connection node, a second connection node, a third connection node and a fourth connection node, the first ends of the three first sub-coils are respectively connected to the first connection node, the second connection node and the third connection node, and the second ends of the three first sub-coils are all connected to the fourth connection node; the electronic device also includes a three-phase power supply module, the first connection node, the second connection node and the third connection node are connected to each phase line of the three-phase power supply module one by one, and the fourth connection node is connected to the neutral line of the three-phase power supply module.

[0012] Optionally, the second electromagnetic coil includes three second sub-coils arranged in sequence along the extension direction of the cooling channel, the main body is provided with a fifth connection node, a sixth connection node, a seventh connection node and an eighth connection node, the first ends of the three second sub-coils are respectively connected to the fifth connection node, the sixth connection node and the seventh connection node, and the second ends of the three second sub-coils are all connected to the eighth connection node; the fifth connection node, the sixth connection node and the seventh connection node are respectively connected to each phase line of the three-phase electric power supply module, and the eighth connection node is used to connect to the neutral line of the three-phase electric power supply module, wherein the relatively distributed second sub-coil and the first sub-coil are respectively connected to the same phase line of the three-phase electric power supply module.

[0013] Optionally, the liquid cooling module is provided with a first electrical connection contact, a second electrical connection contact, a third electrical connection contact and a fourth electrical connection contact; the first electrical connection contact is respectively connected to the first connection node and the fifth connection node, the second electrical connection contact is respectively connected to the second connection node and the sixth connection node, the third electrical connection contact is respectively connected to the third connection node and the seventh connection node, and the fourth electrical connection contact is respectively connected to the fourth connection node and the eighth connection node.

[0014] Optionally, the circuit board of the electronic device is provided with a first electrical connector, a second electrical connector, a third electrical connector and a fourth electrical connector, the first electrical connector, the second electrical connector and the third electrical connector are connected to the phase lines of the three-phase electrical power supply module one by one, and the fourth electrical connector is connected to the neutral line of the three-phase electrical power supply module; the first electrical connector is electrically connected to the first electrical connection contact, the second electrical connector is electrically connected to the second electrical connection contact, the third electrical connector is electrically connected to the third electrical connection contact, and the fourth electrical connector is electrically connected to the fourth electrical connection contact.

[0015] Optionally, the electronic device includes a circuit board and a frame, the circuit board is arranged in the frame, the circuit board is provided with a heat dissipation element, and the heat dissipation element is thermally coordinated with the liquid cooling module.

[0016] At least one of the above technical solutions adopted in the embodiments of the present application can achieve the following beneficial effects: In an embodiment of the present application, the second electromagnetic coil and the first electromagnetic coil are arranged on both sides of the cavity wall of the cooling channel in a one-to-one correspondence, and each first electromagnetic coil and each second electromagnetic coil are arranged at intervals along the extension direction of the cooling channel, and the cooling liquid is filled in the cooling channel. Thus, when the first electromagnetic coil and the second electromagnetic coil are energized, if the coolant is a conductive liquid, the coolant can generate an induced current, and the induced current will generate a magnetic field. Then, the magnetic field generated by the first electromagnetic coil and the second electromagnetic coil can be used to make the coolant flow in the cooling channel. When the first electromagnetic coil and the second electromagnetic coil are energized, if the coolant is a magnetic liquid, the magnetic field generated by the first electromagnetic coil and the second electromagnetic coil can be used to make the coolant flow in the cooling channel.

[0017] Furthermore, when the coolant flows through the area surrounding the component that needs heat dissipation, it can take away some of the heat, and then the heat can be "distributed" to various parts of the liquid cooling module through the circulation of the coolant to reduce the temperature of the component that needs heat dissipation.

[0018] From the above content, it can be seen that when the liquid cooling module is in working state, it is mainly the coolant that is flowing, and no other mechanical structure is moving, so it is not easy to generate mechanical vibration. In addition, by adopting the solution provided in the embodiment of the present application, there is no need to set up a drive pump to drive the cooling medium to flow. Compared with the related art, the liquid cooling module provided in the embodiment of the present application has the advantages of simple structure and small size.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] Figure 1 A schematic diagram of a liquid cooling module provided in an embodiment of the present application; Figure 2 A schematic cross-sectional view of a body of a liquid cooling module provided in an embodiment of the present application; Figure 3 A schematic diagram of an exploded view of a body of a liquid cooling module provided in an embodiment of the present application; Figure 4 A partial cross-sectional view of a first cover plate provided in an embodiment of the present application; Figure 5 A partial cross-sectional view of a second cover plate provided in an embodiment of the present application; Figure 6 A schematic diagram of the arrangement of a first electromagnetic coil provided in an embodiment of the present application; Figure 7 A schematic diagram of the arrangement of a second electromagnetic coil provided in an embodiment of the present application; Figure 8 A schematic diagram of a cooling channel provided in an embodiment of the present application; Fig. 9 A schematic diagram of the corresponding relationship between a first electromagnetic coil and a cooling channel provided in an embodiment of the present application; Fig.10 A schematic diagram of a single set of first electromagnetic coils provided in an embodiment of the present application; Fig.11 A schematic diagram of three-phase electricity output by a three-phase power supply module provided in an embodiment of the present application; Fig.12 A schematic diagram of a single set of first electromagnetic coils, a three-phase power supply module and a battery provided in an embodiment of the present application; Fig.13 A schematic diagram of a magnetic field condition of a single group of first electromagnetic coils under the action of a three-phase electrical signal at time 1 provided in an embodiment of the present application; Fig.14 A schematic diagram of a magnetic field condition of a single group of first electromagnetic coils provided in an embodiment of the present application under the action of a three-phase electrical signal at time 2; Fig.15 A schematic diagram of a magnetic field condition of a single group of first electromagnetic coils provided in an embodiment of the present application under the action of a three-phase electrical signal at time 3; Fig.16 A schematic diagram of the magnetic field of a first electromagnetic coil and a second electromagnetic coil of a liquid cooling module provided in an embodiment of the present application under the action of a three-phase electrical signal at time 1; Fig.17 A schematic diagram of the magnetic field of a first electromagnetic coil and a second electromagnetic coil of a liquid cooling module provided in an embodiment of the present application under the action of a three-phase electrical signal at time 2; Fig.18 A schematic diagram of the magnetic field of a first electromagnetic coil and a second electromagnetic coil of a liquid cooling module provided in an embodiment of the present application under the action of a three-phase electrical signal at time 3; Fig.19 A schematic diagram of an electronic device provided in an embodiment of the present application; Fig. 20 An exploded schematic diagram of an electronic device provided in an embodiment of the present application; Fig.21 A partial cross-sectional view of an electronic device provided in an embodiment of the present application; Fig. 22 A partial schematic diagram of a liquid cooling module provided in an embodiment of the present application, showing a portion where contacts are provided.

[0022] Description of reference numerals: 1- Electronic equipment; 10-liquid cooling module; 11-body; 111-cooling channel; 112-first electromagnetic coil; 1121-first sub-coil; 113-second electromagnetic coil; 1131-second sub-coil; 114-first cover plate; 1141-first film layer; 1142-first conductor layer; 1143-first insulation layer; 1144-second conductor layer; 11441-first conductor; 1145-second film layer; 115-support structure; 116-second cover plate; 1161-third film layer; 1162-third conductor layer; 11621-third Two conductors; 1163-second insulating layer; 1164-fourth conductor layer; 1165-fourth film layer; 1171-first connection node; 1172-second connection node; 1173-third connection node; 1174-fourth connection node; 1175-fifth connection node; 1176-sixth connection node; 1177-seventh connection node; 1178-eighth connection node; 12-cooling liquid; 131-first electrical connection contact; 132-second electrical connection contact; 133-third electrical connection contact; 134-fourth electrical connection contact; 20-circuit board; 21-first electrical connector; 22-second electrical connector; 23-third electrical connector; 24-fourth electrical connector; 25-heat dissipation element; 30-frame; 40- three-phase power supply module; 50-Battery. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0024] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0025] In addition, although the terms used in this application are selected from well-known and commonly used terms, some terms mentioned in the specification of this application may be selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant parts of the description of this article.

[0026] Furthermore, it is required that the present application be understood not only by the actual terms used but also by the meanings connoted by each term.

[0027] The technical solutions provided by various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.

[0028] The present application embodiment provides a liquid cooling module. Figures 1 to 18 The liquid cooling module 10 provided in the embodiment of the present application includes: a main body 11 and a cooling liquid 12.

[0029] The body 11 is provided with a cooling channel 111, a plurality of first electromagnetic coils 112 and a plurality of second electromagnetic coils 113. The cooling liquid 12 is filled in the cooling channel 111. The cooling liquid 12 is a conductive liquid, or the cooling liquid 12 is a magnetic liquid. The second electromagnetic coils 113 are arranged on both sides of the cavity wall of the cooling channel 111 in a one-to-one correspondence with the first electromagnetic coils 112. Each first electromagnetic coil 112 and each second electromagnetic coil 113 are arranged at intervals along the extension direction of the cooling channel 111. In other words, each first electromagnetic coil 112 is arranged at intervals along the extension direction of the cooling channel 111, and each second electromagnetic coil 113 is also arranged at intervals along the extension direction of the cooling channel 111, and the first electromagnetic coil 112 and the second electromagnetic coil 113 are arranged on both sides of the cavity wall of the cooling channel 111. Further, the first electromagnetic coil 112 and the second electromagnetic coil 113 generate a magnetic field when powered on, so that the cooling liquid 12 flows in the cooling channel 111.

[0030] In this way, in the embodiment of the present application, the second electromagnetic coil 113 and the first electromagnetic coil 112 are arranged on both sides of the cavity wall of the cooling channel 111 in a one-to-one correspondence, and each first electromagnetic coil 112 and each second electromagnetic coil 113 are arranged at intervals along the extension direction of the cooling channel 111, and the cooling liquid 12 is filled in the cooling channel 111. Therefore, when the first electromagnetic coil 112 and the second electromagnetic coil 113 are energized, if the cooling liquid 12 is a conductive liquid, the cooling liquid 12 can generate an induced current, and the induced current will generate a magnetic field. Then, the magnetic field generated by the first electromagnetic coil 112 and the second electromagnetic coil 113 can be used to make the cooling liquid 12 flow in the cooling channel 111. When the first electromagnetic coil 112 and the second electromagnetic coil 113 are energized, if the cooling liquid 12 is a magnetic liquid, the magnetic field generated by the first electromagnetic coil 112 and the second electromagnetic coil 113 can be used to make the cooling liquid 12 flow in the cooling channel 111.

[0031] Furthermore, the coolant 12 can take away some heat when flowing through the area around the component that needs heat dissipation, and then the heat can be "distributed" to various parts of the liquid cooling module 10 through the circulation of the coolant 12 to reduce the temperature of the component that needs heat dissipation.

[0032] From the above content, it can be seen that when the liquid cooling module 10 is in working state, it is mainly the coolant 12 that is flowing, and no other mechanical structure is moving, so it is not easy to generate mechanical vibration. In addition, by adopting the solution provided in the embodiment of the present application, there is no need to set a drive pump to drive the cooling medium to flow. Compared with the related art, the liquid cooling module 10 provided in the embodiment of the present application has the advantages of simple structure and small size.

[0033] In some embodiments, the cooling channel 111 is connected end to end, and the coolant 12 can circulate in the cooling channel 111. Alternatively, in some embodiments, the cooling channel 111 is connected to a cooling container. The coolant 12 in the cooling container is transported to the cooling channel 111 through the outlet of the cooling container, and the coolant 12 that absorbs heat flows back to the cooling container through the inlet of the cooling container, and the cycle repeats.

[0034] For example, when the coolant 12 is a conductive liquid, the coolant 12 may be a liquid metal or an electrolyte solution. It should be noted that a person skilled in the art can determine by experiment the solubility required for the electrolyte solution to flow smoothly under the action of a magnetic field, which will not be described in detail here. When the coolant 12 is a magnetic liquid, various magnetic fluids with relatively mature technology can be selected as the coolant 12.

[0035] refer to Figures 1 to 3 In some embodiments, the body 11 includes a first cover plate 114, a support structure 115, and a second cover plate 116 stacked in sequence. Figure 8 The first cover plate 114, the support structure 115 and the second cover plate 116 form a cooling channel 111. In this way, the manufacturing cost of the body 11 can be reduced by stacking the first cover plate 114, the support structure 115 and the second cover plate 116 in sequence to form the cooling channel 111, and it is easy to manufacture a light and thin liquid cooling module 10.

[0036] refer to Figure 4 In some embodiments, the first cover plate 114 includes a first film layer 1141, a first conductor layer 1142, a first insulating layer 1143, a second conductor layer 1144, and a second film layer 1145. The first conductor layer 1142 is provided with a first electromagnetic coil 112, and the second conductor layer 1144 is provided with a first wire 11441 electrically connected to the first electromagnetic coil 112.

[0037] Exemplarily, the first film layer 1141 and the second film layer 1145 are located on the two opposite outer surfaces of the first cover plate 114, and thus, the first film layer 1141 and the second film layer 1145 can be made of a material with good wear resistance. In addition, the first film layer 1141 and the second film layer 1145 cover the outside of the conductor layer, and thus, the first film layer 1141 and the second film layer 1145 can be made of an insulating material. The first conductor layer 1142 and the second conductor layer 1144 can be made of a material with good conductivity such as aluminum, copper, and silver. The first insulating layer 1143 can be provided with some perforations as needed, and conductive materials can be filled in the perforations to facilitate electrical connection between the first wire 11441 and the first electromagnetic coil 112. It should be noted that the first cover plate 114 can be made by referring to the manufacturing process of the flexible circuit board in the relevant technology, and the manufacturing method of the first cover plate 114 will not be described in detail here.

[0038] refer to Figure 5 In some embodiments, the second cover plate 116 includes a stacked third film layer 1161, a third conductor layer 1162, a second insulating layer 1163, a fourth conductor layer 1164 and a fourth film layer 1165; the fourth conductor layer 1164 is provided with a second electromagnetic coil 113, and the third conductor layer 1162 is provided with a second wire 11621 electrically connected to the second electromagnetic coil 113.

[0039] Exemplarily, the third film layer 1161 and the fourth film layer 1165 are located on the outer surfaces of the second cover plate 116 that are opposite to each other, and thus, the third film layer 1161 and the fourth film layer 1165 can be made of a material with good wear resistance. In addition, the third film layer 1161 and the fourth film layer 1165 are covered outside the conductor layer, and thus, the third film layer 1161 and the fourth film layer 1165 can be made of an insulating material. The third conductor layer 1162 and the fourth conductor layer 1164 can be made of a material with good conductivity such as aluminum, copper, and silver. The second insulating layer 1163 can be provided with some perforations as needed, and conductive materials can be filled in the perforations to facilitate electrical connection between the second wire 11621 and the second electromagnetic coil 113. It should be noted that the second cover plate 116 can be made by referring to the manufacturing process of the flexible circuit board in the relevant technology, and the manufacturing method of the second cover plate 116 will not be described in detail here.

[0040] In some embodiments, the first cover plate 114 is a first flexible circuit board, the support structure 115 is made of a flexible material, and the second cover plate 116 is a second flexible circuit board, so that the liquid cooling module 10 has a bendable property, thereby facilitating the application of the liquid cooling module 10 to foldable electronic devices. For example, the liquid cooling module 10 can be applied to foldable screen mobile phones.

[0041] Although, in the process of implementing the solution provided by the embodiment of the present application, those skilled in the art can flexibly set the first electromagnetic coil 112 and the second electromagnetic coil 113 as required, and the electrical signals transmitted to the first electromagnetic coil 112 and the second electromagnetic coil 113, in combination with the electromagnetic induction principle and Lenz's law. However, in order to facilitate those skilled in the art to better implement the solution provided by the embodiment of the present application, a more detailed example is provided below for reference by those skilled in the art.

[0042] In some embodiments, the electronic device equipped with the liquid cooling module 10 includes a three-phase power supply module 40 and a battery 50. The three-phase power supply module 40 can be used to convert the direct current output of the battery 50 into a three-phase power output. Fig.11 , three-phase electricity includes phase A, phase B and phase C. Phase A, phase B and phase C have the same frequency, equal amplitude and phase difference of 120 degrees. Correspondingly, reference Fig.12The three-phase power supply module 40 includes a phase A line, a phase B line, a phase C line and a neutral line (which can be recorded as N). It should be noted that the three-phase power supply module 40 can be purchased directly from a corresponding electronic component supplier, so its structure and working principle are not described in detail here.

[0043] refer to Fig.10 In some embodiments, the first electromagnetic coil 112 includes three first sub-coils 1121 sequentially arranged along the extension direction of the cooling channel 111. Alternatively, the solution provided in the embodiment of the present application can be understood as that the body 11 is provided with a plurality of first sub-coils 1121, three adjacent first sub-coils 1121 form a group, and a group of first sub-coils 1121 constitutes the first electromagnetic coil 112.

[0044] Combination Figure 6 The body 11 is provided with a first connection node 1171, a second connection node 1172, a third connection node 1173 and a fourth connection node 1174. The first ends of the three first sub-coils 1121 are connected to the first connection node 1171, the second connection node 1172 and the third connection node 1173 respectively, and the second ends of the three first sub-coils 1121 are connected to the fourth connection node 1174. The first connection node 1171, the second connection node 1172 and the third connection node 1173 are connected to the phase lines of the three-phase power supply module 40 respectively, and the fourth connection node 1174 is connected to the neutral line of the three-phase power supply module 40.

[0045] by Fig.12 For example, the first first sub-coil 1121 can be recorded as an A sub-coil, the second first sub-coil 1121 can be recorded as a B sub-coil, and the third first sub-coil 1121 can be recorded as a C sub-coil. Further, the first end of each A sub-coil is connected to the A phase line via the first connection node 1171, and the second end of each A sub-coil is connected to the neutral line of the three-phase power supply module 40 via the fourth connection node 1174. In this way, the A-phase electrical signal can be transmitted to each A sub-coil electrically connected thereto. The first end of each B sub-coil is connected to the B phase line via the second connection node 1172, and the second end of each B sub-coil is connected to the neutral line of the three-phase power supply module 40 via the fourth connection node 1174. In this way, the B-phase electrical signal can be transmitted to each B sub-coil electrically connected thereto. The first end of each C sub-coil is connected to the C phase line via the first connection node 1171, and the second end of each C sub-coil is connected to the neutral line of the three-phase power supply module 40 via the fourth connection node 1174. In this way, the C-phase electrical signal can be transmitted to each C sub-coil electrically connected thereto.

[0046] refer to Figures 10 to 13 At time 1, the A sub-coil is conducting in the forward direction, generating an upward magnetic field; the B sub-coil voltage is zero, and the magnetic field strength is zero; the C sub-coil is conducting in the reverse direction, generating a downward magnetic field. Figures 10 to 12and Fig.14 At time 2, sub-coil A conducts in the reverse direction, generating a downward magnetic field; sub-coil B conducts in the forward direction, generating an upward magnetic field; sub-coil C has zero voltage and zero magnetic field strength. Figure 10 to Figure 11 and Fig.15 At time 3, the voltage of sub-coil A is zero and the magnetic field strength is zero; sub-coil B is reversely conducted, generating a downward magnetic field; sub-coil C is forwardly conducted, generating an upward magnetic field.

[0047] Furthermore, for each of the first sub-coils 1121 arranged in sequence, when the three-phase power supply module 40 transmits three-phase power to each of the first sub-coils 1121, the magnetic field on the first sub-coils 1121 "moves" in sequence along the arrangement direction of the first sub-coils 1121. Figures 16 to 18 , which is similar to pulling a magnet from left to right, so that when the coolant 12 generates a magnetic field, the magnet moving from left to right can "pull" the coolant 12 to flow from left to right.

[0048] In some embodiments, the arrangement of the second electromagnetic coil 113 is similar to that of the first electromagnetic coil 112. The second electromagnetic coil 113 includes three second sub-coils 1131 arranged in sequence along the extension direction of the cooling channel 111. Figure 7 The body 11 is provided with a fifth connection node 1175, a sixth connection node 1176, a seventh connection node 1177 and an eighth connection node 1178. The first ends of the three second sub-coils 1131 are connected to the fifth connection node 1175, the sixth connection node 1176 and the seventh connection node 1177 in one-to-one correspondence, and the second ends of the three second sub-coils 1131 are connected to the eighth connection node 1178. The fifth connection node 1175, the sixth connection node 1176 and the seventh connection node 1177 are connected to the phase lines of the three-phase power supply module 40 in one-to-one correspondence, and the eighth connection node 1178 is used to connect to the neutral line of the three-phase power supply module 40. Among them, the relatively distributed second sub-coil 1131 and the first sub-coil 1121 are respectively connected to the same phase line of the three-phase power supply module 40. In this way, the magnetic field directions of the first sub-coil 1121 and the second sub-coil 1131 relative to each other can be made the same, which can play a role in strengthening the magnetic field.

[0049] In some embodiments, reference Fig. 22The liquid cooling module 10 is provided with a first electrical connection contact 131, a second electrical connection contact 132, a third electrical connection contact 133 and a fourth electrical connection contact 134. Exemplarily, the first electrical connection contact 131 is connected to the first connection node 1171 and the fifth connection node 1175, respectively, the second electrical connection contact 132 is connected to the second connection node 1172 and the sixth connection node 1176, respectively, the third electrical connection contact 133 is connected to the third connection node 1173 and the seventh connection node 1177, respectively, and the fourth electrical connection contact 134 is connected to the fourth connection node 1174 and the eighth connection node 1178, respectively.

[0050] The present application embodiment provides an electronic device. Figures 19 to 22 , the electronic device 1 provided in the embodiment of the present application includes: any one of the liquid cooling modules 10 provided in the embodiment of the present application. Exemplarily, the electronic device 1 can be a mobile phone, a tablet computer, a smart watch, a smart bracelet, etc.

[0051] In some embodiments, the electronic device 1 includes a circuit board 20. The circuit board 20 is provided with a first electrical connector 21, a second electrical connector 22, a third electrical connector 23 and a fourth electrical connector 24. The first electrical connector 21, the second electrical connector 22, and the third electrical connector 23 are connected to each phase line of the three-phase power supply module 40 in a one-to-one correspondence. Exemplarily, the first electrical connector 21 is connected to the A phase line of the three-phase power supply module 40, the second electrical connector 22 is connected to the B phase line of the three-phase power supply module 40, and the third electrical connector 23 is connected to the C phase line of the three-phase power supply module 40. The fourth electrical connector 24 is connected to the neutral line of the three-phase power supply module 40.

[0052] In addition, the first electrical connector 21 is electrically connected to the first electrical connection contact 131 , the second electrical connector 22 is electrically connected to the second electrical connection contact 132 , the third electrical connector 23 is electrically connected to the third electrical connection contact 133 , and the fourth electrical connector 24 is electrically connected to the fourth electrical connection contact 134 .

[0053] Exemplarily, the first electrical connector 21, the second electrical connector 22, the third electrical connector 23 and the fourth electrical connector 24 all include metal springs; the first electrical connection contact 131, the second electrical connection contact 132, the third electrical connection contact 133 and the fourth electrical connection contact 134 are all metal sheets (e.g., copper sheets). When the liquid cooling module 10 is assembled in the electronic device 1, each metal spring is elastically abutted against each metal sheet in a one-to-one correspondence, so that each electrical connector is electrically connected to each electrical connection contact in a one-to-one correspondence.

[0054] Exemplarily, the first connection node 1171, the second connection node 1172, the third connection node 1173 and the fourth connection node 1174 are all arranged on the first cover plate 114, the fifth connection node 1175, the sixth connection node 1176, the seventh connection node 1177 and the eighth connection node 1178 are all arranged on the second cover plate 116, and the first electrical connection contact 131, the second electrical connection contact 132, the third electrical connection contact 133 and the fourth electrical connection contact 134 are arranged on the outer surface of the first cover plate 114 or the second cover plate 116.

[0055] The first connection node 1171 and the fifth connection node 1175 are both connected to the first electrical connection contact 131, so that the A-phase electrical signal transmitted to the first electrical connection contact 131 can be transmitted to the first connection node 1171 and the fifth connection node 1175 respectively, and then, the first connection node 1171 transmits the A-phase electrical signal to the first sub-coil 1121 correspondingly connected thereto, and the fifth connection node 1175 transmits the A-phase electrical signal to the second sub-coil 1131 correspondingly connected thereto.

[0056] The second connection node 1172 and the sixth connection node 1176 are both connected to the second electrical connection contact 132, so that the B-phase electrical signal transmitted to the second electrical connection contact 132 can be transmitted to the second connection node 1172 and the sixth connection node 1176 respectively, and then, the second connection node 1172 transmits the B-phase electrical signal to the first sub-coil 1121 correspondingly connected thereto, and the sixth connection node 1176 transmits the B-phase electrical signal to the second sub-coil 1131 correspondingly connected thereto.

[0057] The third connection node 1173 and the seventh connection node 1177 are both connected to the third electrical connection contact 133, so that the C-phase electrical signal transmitted to the third electrical connection contact 133 can be transmitted to the third connection node 1173 and the seventh connection node 1177 respectively, and then, the third connection node 1173 transmits the C-phase electrical signal to the first sub-coil 1121 correspondingly connected thereto, and the seventh connection node 1177 transmits the C-phase electrical signal to the second sub-coil 1131 correspondingly connected thereto.

[0058] In addition, the fourth connection node 1174 and the eighth connection node 1178 are both connected to the fourth electrical connection contact 134, and the fourth electrical connection contact 134 is connected to the neutral line of the three-phase electrical power supply module 40, so that when power is on, each first sub-coil 1121 and each second sub-coil 1131 form a loop with the corresponding A phase line, B phase line or C phase line.

[0059] It should be noted that, exemplarily, if the first electrical connection contact 131, the second electrical connection contact 132, the third electrical connection contact 133 and the fourth electrical connection contact 134 are provided on the first cover plate 114, the first connection node 1171 may be provided on the first electrical connection contact 131, the second connection node 1172 may be provided on the second electrical connection contact 132, the third connection node 1173 may be provided on the third electrical connection contact 133, and the fourth connection node 1174 may be provided on the fourth electrical connection contact 134. In other words, for example, in the case where each contact is a copper sheet, the first copper sheet forms both the first connection node 1171 and the first electrical connection contact 131, the second copper sheet forms both the second connection node 1172 and the second electrical connection contact 132, the third copper sheet forms both the third connection node 1173 and the third electrical connection contact 133, and the fourth copper sheet forms both the fourth connection node 1174 and the fourth electrical connection contact 134.

[0060] In some embodiments, the electronic device 1 includes a circuit board 20 and a frame 30. The circuit board 20 is disposed in the frame 30, and the circuit board 20 is provided with a heat dissipation component 25, and the heat dissipation component 25 is thermally matched with the liquid cooling module 10. Exemplarily, the heat dissipation component 25 is a processor. The surface of the heat dissipation component 25 may be coated with thermal grease or thermal gel, and the liquid cooling module 10 is thermally matched with the heat dissipation component 25 via the thermal grease or thermal gel.

[0061] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0062] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the embodiments of the present application, and the scope of the embodiments of the present application is defined by the appended claims and their equivalents.

Claims

1. A liquid cooling module, characterized in that: include: body and coolant; The body is provided with a cooling channel, a plurality of first electromagnetic coils and a plurality of second electromagnetic coils, the cooling channel is filled with the cooling liquid, and the cooling liquid is a conductive liquid, or the cooling liquid is a magnetic liquid; The second electromagnetic coils and the first electromagnetic coils are arranged on both sides of the cavity wall of the cooling channel in a one-to-one correspondence, and the first electromagnetic coils and the second electromagnetic coils are arranged at intervals along the extension direction of the cooling channel; The first electromagnetic coil and the second electromagnetic coil generate a magnetic field when energized, so that the coolant flows in the cooling channel.

2. The liquid cooling module according to claim 1, characterized in that: The body includes a first cover plate, a support structure, and a second cover plate stacked in sequence, wherein the first cover plate, the support structure, and the second cover plate form the cooling channel.

3. The liquid cooling module according to claim 2, characterized in that: The first cover plate includes a first film layer, a first conductor layer, a first insulating layer, a second conductor layer and a second film layer which are stacked; the first conductor layer is provided with the first electromagnetic coil, and the second conductor layer is provided with a first wire electrically connected to the first electromagnetic coil.

4. The liquid cooling module according to claim 3, characterized in that: The second cover plate includes a third film layer, a third conductor layer, a second insulating layer, a fourth conductor layer and a fourth film layer which are stacked; the fourth conductor layer is provided with the second electromagnetic coil, and the third conductor layer is provided with a second wire electrically connected to the second electromagnetic coil.

5. An electronic device, characterized in that: include: The liquid cooling module according to any one of claims 1 to 4.

6. The electronic device according to claim 5, characterized in that: The first electromagnetic coil includes three first sub-coils arranged in sequence along the extension direction of the cooling flow channel, the body is provided with a first connection node, a second connection node, a third connection node and a fourth connection node, the first ends of the three first sub-coils are respectively connected to the first connection node, the second connection node and the third connection node in a one-to-one correspondence, and the second ends of the three first sub-coils are all connected to the fourth connection node; The electronic device also includes a three-phase power supply module, the first connection node, the second connection node and the third connection node are connected to the phase lines of the three-phase power supply module one by one, and the fourth connection node is connected to the neutral line of the three-phase power supply module.

7. The electronic device according to claim 6, characterized in that: The second electromagnetic coil comprises three second sub-coils sequentially arranged along the extension direction of the cooling flow channel, the body is provided with a fifth connection node, a sixth connection node, a seventh connection node and an eighth connection node, the first ends of the three second sub-coils are respectively connected to the fifth connection node, the sixth connection node and the seventh connection node in a one-to-one correspondence, and the second ends of the three second sub-coils are all connected to the eighth connection node; The fifth connection node, the sixth connection node and the seventh connection node are connected to the phase lines of the three-phase electric power module one by one, and the eighth connection node is used to connect to the neutral line of the three-phase electric power module, wherein the relatively distributed second sub-coil and the first sub-coil are respectively connected to the same phase line of the three-phase electric power module.

8. The electronic device according to claim 7, characterized in that: The liquid cooling module is provided with a first electrical connection contact, a second electrical connection contact, a third electrical connection contact and a fourth electrical connection contact; The first electrical connection contact is connected to the first connection node and the fifth connection node respectively, the second electrical connection contact is connected to the second connection node and the sixth connection node respectively, the third electrical connection contact is connected to the third connection node and the seventh connection node respectively, and the fourth electrical connection contact is connected to the fourth connection node and the eighth connection node respectively.

9. The electronic device according to claim 8, characterized in that: The circuit board of the electronic device is provided with a first electrical connector, a second electrical connector, a third electrical connector and a fourth electrical connector, the first electrical connector, the second electrical connector and the third electrical connector are connected to the phase lines of the three-phase power supply module one by one, and the fourth electrical connector is connected to the neutral line of the three-phase power supply module; The first electrical connector is electrically connected to the first electrical connection contact, the second electrical connector is electrically connected to the second electrical connection contact, the third electrical connector is electrically connected to the third electrical connection contact, and the fourth electrical connector is electrically connected to the fourth electrical connection contact.

10. The electronic device according to claim 5, characterized in that: The electronic device comprises a circuit board and a frame, wherein the circuit board is arranged in the frame, and a heat dissipation element is arranged on the circuit board, and the heat dissipation element cooperates with the liquid cooling module in a thermally conductive manner.

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