Device and method for measuring directional emissivity of material

Abstract

The invention belongs to the technical field of emissivity measurement equipment, and particularly relates to a device and a method for measuring directional emissivity of a material. The equipment comprises a heating furnace, a thermal infrared imager, a connecting mechanism, a lifting mechanism and an electric rotating arm, the heating furnace is used for heating a material sample placed in the heating furnace to a specified temperature, and the thermal infrared imager is arranged above the heating furnace and used for detecting the thermal radiation temperature of the material sample through an opening in the upper portion of the heating furnace; the thermal infrared imager is connected with the lifting mechanism through the connecting mechanism, the lifting mechanism is used for adjusting the height of the thermal infrared imager, the electric rotating arm is connected with the bottom of the lifting mechanism, and when the electric rotating arm rotates to drive the lifting mechanism, the connecting mechanism and the thermal infrared imager to rotate at the same angle, the observation angle between the thermal infrared imager and a material sample is adjusted. According to the invention, the universality and convenience of the measurement of the directional emissivity of the material can be improved.

Description

Technical Field

[0001] The invention belongs to the technical field of emissivity measurement equipment, and in particular relates to a device and method for measuring the directional emissivity of a material. Background Art

[0002] Infrared thermal imaging technology detects the infrared radiation of the target object and converts the temperature distribution image of the target object into a visible image through signal processing, photoelectric conversion and other means. Infrared thermal imaging technology is widely used in industry, medical treatment, security and other fields. When the emissivity of the material is unknown, the use of infrared thermal imaging technology will increase the error of the temperature measurement result, resulting in a decrease in the temperature measurement accuracy.

[0003] The measurement of emissivity in the prior art is relatively simple. Usually, a measurement bench is built to measure the emissivity of only individual materials. For example, the patent with publication number CN116183034A builds a simple measurement device for measuring the infrared emissivity of the surface of an aviation component based on a uniform temperature field. The device includes an infrared detector, a platform, a constant temperature box, a processor, a data cable, and a reference board. This simply built emissivity measurement device has poor versatility, low measurement efficiency, and poor measurement convenience. Summary of the invention

[0004] In view of the above problems, a material directional emissivity measuring device and method are proposed, aiming to solve the technical problems of poor versatility, inconvenient use and low measurement efficiency of material directional emissivity measuring devices in the prior art.

[0005] In the first aspect, the present invention provides a material directional emissivity measuring device, including a heating furnace, an infrared thermal imager, a connecting mechanism, a lifting mechanism, and an electric rotating arm. The heating furnace heats the material sample placed inside to a preset temperature. The infrared thermal imager is placed above the heating furnace and is used to detect the thermal radiation temperature of the material sample through an opening above the heating furnace. The infrared thermal imager is connected to the lifting mechanism through a connecting mechanism. The lifting mechanism is used to adjust the height of the infrared thermal imager. The electric rotating arm is connected to the bottom of the lifting mechanism. When the electric rotating arm rotates, it drives the lifting mechanism, the connecting mechanism, and the infrared thermal imager to rotate at the same angle, thereby adjusting the observation angle between the infrared thermal imager and the material sample.

[0006] Furthermore, a thermocouple sensor is provided in the heating furnace, and the thermocouple sensor is used to detect the temperature of the material sample.

[0007] Furthermore, the connecting mechanism includes a connecting rod, a slider, a fixed plate, and a fixed block. The fixed block is used to fix the infrared thermal imager. The two ends of the connecting rod are respectively connected to the fixed block and the fixed plate. The end of the fixed plate away from the connecting rod is connected to the slider. The slider is provided with a slide groove running through the upper and lower parts. The connecting mechanism is connected to the lifting mechanism through the slide groove.

[0008] Furthermore, bosses are provided at both upper and lower ends of the fixing block, and the bosses are used to limit the upper and lower positions of the infrared thermal imager. A latch is provided at one end of the fixing block away from the connecting rod, a hinge is provided at one end of the latch, and a buckle seat is connected to the other end.

[0009] Furthermore, the lifting mechanism comprises a scale plate, and the scale plate passes through a slide groove connected to the slider.

[0010] Furthermore, the electric rotating arm includes a motor and a turntable, the output shaft of the motor is connected to the turntable through a transmission gear, and the upper end of the turntable is connected to a scale plate.

[0011] Furthermore, the heating furnace is placed on the chassis and is limited by L-shaped fixings arranged on all sides. A PTC heating plate is arranged at the bottom of the heating furnace, and the PTC heating plate is used to heat the detection material.

[0012] In a second aspect, the present invention further provides a material directional emissivity measurement method, which is implemented using the above-mentioned material directional emissivity measurement device, and the method comprises:

[0013] Step S1: placing a material sample in a heating area in a heating furnace and heating the material sample to a set temperature;

[0014] Step S2: installing the infrared thermal imager on the fixing block of the connecting mechanism, and fixing the infrared thermal imager so that the normal direction of its viewing angle is perpendicular to the surface of the material sample to be tested;

[0015] Step S3: adjusting the position of the connecting mechanism on the lifting mechanism so that the infrared thermal imager can clearly focus on the material sample to be tested;

[0016] Step S4: rotating the electric rotating arm so that the infrared thermal imager can detect the temperature of the material sample within a preset measurement viewing angle, and recording the thermal imaging temperatures corresponding to different detection angles measured by the infrared thermal imager;

[0017] Step S5: using a thermocouple sensor to measure the real temperature of the material sample, and respectively calculating the thermal imaging temperature and the radiation amount corresponding to the real temperature;

[0018] Step S6: Calculate the directional emissivity of the material sample at different detection angles of the infrared thermal imager according to the radiation corresponding to the thermal imaging temperature, the radiation corresponding to the real temperature, and the radiation corresponding to the ambient temperature.

[0019] Furthermore, in step S6, the directional emissivity of the material sample at different detection angles of the infrared thermal imager is calculated according to the radiation corresponding to the thermal imaging temperature, the radiation corresponding to the real temperature, and the radiation corresponding to the ambient temperature.

[0020] The difference between the radiation amount of the thermal imaging temperature and the radiation amount corresponding to the ambient temperature at different detection angles of the infrared thermal imager, and the difference between the radiation amount corresponding to the real temperature and the radiation amount corresponding to the ambient temperature are calculated. According to the ratio of the two, the directional emissivity of the material sample at different detection angles of the infrared thermal imager is obtained.

[0021] Compared with the prior art, the beneficial effects of the present invention are: improving the versatility and convenience of material directional emissivity measurement. The measuring device provided by the present invention includes a heating furnace, an infrared thermal imager, a connecting mechanism, a lifting mechanism, an electric rotating arm, and a chassis. The heating furnace is located above the chassis and is used to heat the material sample placed inside to a specified temperature. The infrared thermal imager is placed above the heating furnace and is used to detect the thermal radiation temperature of the material sample through the opening above the heating furnace. The infrared thermal imager is connected to the lifting mechanism through a connecting mechanism. The lifting mechanism is used to adjust the height of the infrared thermal imager. The electric rotating arm is connected to the bottom of the lifting mechanism. When the electric rotating arm rotates, the lifting mechanism, the connecting mechanism, and the infrared thermal imager are driven to rotate at the same angle to adjust the observation angle between the infrared thermal imager and the material sample. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0023] Figure 1 A schematic structural diagram of a material directional emissivity measurement device at one viewing angle provided by an embodiment of the present invention;

[0024] Figure 2 A schematic structural diagram of a material directional emissivity measurement device from another perspective provided by an embodiment of the present invention;

[0025] Figure 3 A schematic diagram of the structure of a connecting mechanism provided by an embodiment of the present invention;

[0026] Figure 4 A flow chart of a material directional emissivity measurement method provided by an embodiment of the present invention;

[0027] Figure 5 A schematic diagram of material directional emissivity measurement results provided by an embodiment of the present invention.

[0028] In the figure: 1. Heating furnace; 2. Infrared thermal imager; 3. Connecting mechanism; 301. Connecting rod; 302. Slider; 303. Fixed plate; 304. Fixed block; 3041. Boss; 3042. Buckle seat; 3043. Tongue; 3044. Hinge; 4. Lifting mechanism; 401. Scale plate; 5. Electric rotating arm; 501. Motor; 502. Turntable; 6. Mounting seat; 7. Chassis; 8. Control panel. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical scheme and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. Obviously, the specific embodiments described herein are only used to explain the present invention and are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0030] like Figures 1 to 3 As shown, this embodiment discloses a material directional emissivity measuring device, including a heating furnace 1, an infrared thermal imager 2, a connecting mechanism 3, a lifting mechanism 4, an electric rotating arm 5, and a chassis 7. The heating furnace 1 is located above the chassis 7 and is used to heat the material sample placed inside to a preset temperature. The infrared thermal imager 2 is placed above the heating furnace 1 and is used to detect the thermal radiation temperature of the material sample through the opening above the heating furnace 1. The infrared thermal imager 2 is connected to the lifting mechanism 4 through the connecting mechanism 3. The lifting mechanism 4 is used to adjust the height of the infrared thermal imager 2. The electric rotating arm 5 is connected to the bottom of the lifting mechanism 4. When the electric rotating arm 5 rotates, it drives the lifting mechanism 4, the connecting mechanism 3, and the infrared thermal imager 2 to rotate at the same angle, so as to adjust the observation angle between the infrared thermal imager 2 and the material sample.

[0031] Furthermore, a fixture is provided in the heating furnace 1 to fix different material samples, and a thermocouple sensor is provided in the heating furnace 1, and the thermocouple sensor is used to detect the temperature of the material sample. Among them, the number of thermocouple sensors can be one or more. And the outer periphery of the heating furnace 1 is fixed to the upper surface of the chassis 7 by a limit plate. In addition, a circular hole is opened above the heating furnace 1, and the diameter of the circular hole is suitable so that the infrared thermal imager 2 does not block the material sample to be tested within the 80° measurement viewing angle.

[0032] Furthermore, the connection mechanism 3 includes a connecting rod 301, a slider 302, a fixed plate 303, and a fixed block 304. The fixed block 304 is used to fix the infrared thermal imager 2. Both ends of the connecting rod 301 are connected to the fixed block 304 and the fixed plate 303 respectively. The end of the fixed plate 303 away from the connecting rod 301 is connected to the slider 302. The slider 302 is provided with a slide groove running through the upper and lower parts. The connection mechanism 3 is connected to the lifting mechanism 4 through the slide groove. It should be further explained that the fixed block 304 is slidably connected to the lifting mechanism 4 through the slide groove, and can achieve self-locking and non-sliding when there is no external force intervention.

[0033] Furthermore, bosses 3041 are provided at both upper and lower ends of the fixing block 304, and the number of bosses 3041 is two at both ends. The bosses 3041 are used to limit the upper and lower positions of the infrared thermal imager 2. A latch tongue 3043 is provided at one end of the fixing block 304 away from the connecting rod 301. A hinge 3044 is provided at one end of the tongue root of the latch tongue 3043, and a buckle seat 3042 is connected at the other end. The arrangement of the latch tongue 3043, the hinge 3044, and the buckle seat 3042 facilitates the replacement and position limiting of the infrared thermal imager 2.

[0034] Furthermore, the lifting mechanism 4 includes a scale plate 401 , which passes through a slide groove connected to the slider 302 , and is marked with scales to facilitate the user to adjust the focus of the infrared thermal imager 2 .

[0035] Furthermore, the electric rotating arm 5 includes a motor 501 and a rotating disk 502. The output shaft of the motor 501 is connected to the rotating disk 502 through a transmission gear, and the upper end of the rotating disk 502 is connected to the scale plate 401. In this way, the motor 501 rotates at an angle, driving the rotating disk 502 to rotate, and then driving the scale plate 401 to rotate at the same angle, and finally driving the infrared thermal imager 2 to rotate at the same angle, which is convenient for measuring the emissivity of the material sample to be measured at different angles.

[0036] Furthermore, the heating furnace 1 is placed on the chassis 7 and is limited by L-shaped fixings arranged around it. A PTC heating plate is arranged at the bottom of the heating furnace 1, and the PTC heating plate is used to heat the test material. Furthermore, a material direction emission path measurement device provided in this embodiment also includes a mounting seat 6 and a control panel 8, wherein the motor 501 and the turntable 502 are both mounted on the upper surface of the chassis 7 through the mounting seat 6, and the control panel 8 is mounted on the front panel of the chassis 7. The control panel 8 includes a monitoring display screen, a start button, a stop button, an emergency stop switch, a mode switching switch, etc. The operation and status monitoring of the device can be realized through the control panel 8.

[0037] Furthermore, it also includes a controller, which is placed in the chassis 7. The controller obtains the directional emissivity of the material sample at different detection angles based on the radiation of the thermal imaging temperature at different detection angles of the infrared thermal imager 2, the radiation corresponding to the ambient temperature, and the radiation corresponding to the actual temperature of the material sample detected by the thermocouple sensor.

[0038] On the other hand, Figure 4 As shown, this embodiment discloses a material directional emissivity measurement method, which relies on the above-mentioned material directional emissivity measurement device. The method includes:

[0039] Step S1: Place the material sample in the heating area of ​​the heating furnace 1 and heat the material sample to a set temperature. The heating area in the heating furnace can be a resistance heating wire or a PTC heating plate. In this embodiment, the material sample to be measured is stainless steel material, and the heating furnace temperature is set to 300°C.

[0040] Step S2: Install the infrared thermal imager 2 on the fixing block 304 of the connecting mechanism 3, and fix the infrared thermal imager 2 so that the normal direction of its viewing angle is perpendicular to the surface of the material sample to be tested.

[0041] Step S3: adjusting the position of the connecting mechanism 3 on the lifting mechanism 4 so that the infrared thermal imager 2 can clearly focus on the material sample to be tested.

[0042] Step S4: Rotate the electric rotating arm 5 so that the infrared thermal imager 2 detects the temperature of the material sample within the preset measurement angle range, and record the thermal imaging temperature corresponding to different detection angles measured by the infrared thermal imager 2. In this embodiment, the infrared thermal imager 2 measures the temperature of the sample within the measurement angle range of 0-70°. During measurement, the temperatures of the top, middle, bottom, left, and right points of the sample are recorded at each angle, and the average value is measured multiple times as the measured temperature of the infrared thermal imager 2 at that angle.

[0043] In this embodiment, taking stainless steel as an example of the measured material sample, the measurement results of the infrared thermal imager 2 are shown in Table 1 below.

[0044] Table 1

[0045]

[0046] Step S5: Use a thermocouple sensor to measure the real temperature of the material sample, and calculate the thermal imaging temperature and the radiation corresponding to the real temperature. In this embodiment, during measurement, five thermocouple sensors are used to measure the temperatures of the top, middle, bottom, left, and right points of the sample measured by the infrared thermal imager 2, and the average value is taken as the measured temperature of the thermocouple sensor.

[0047] In this embodiment, taking the measured material sample as stainless steel as an example, the measurement results of the thermocouple sensor are shown in Table 2 below.

[0048]

[0049] Step S6: Calculate the directional emissivity of the material sample at different detection angles of the infrared thermal imager 2 according to the radiation corresponding to the thermal imaging temperature, the radiation corresponding to the real temperature, and the radiation corresponding to the ambient temperature.

[0050] Among them, the radiation corresponding to the thermal imaging temperature, the radiation corresponding to the real temperature, and the radiation corresponding to the ambient temperature need to be converted according to the corresponding relationship between temperature and radiation. In this embodiment, the radiation corresponding to the thermal imaging temperature is taken as an example, and the calculation formula for the radiation corresponding to the temperature is constructed as follows:

[0051]

[0052] In the formula, Indicates the radiation wavelength of the sample being tested; Indicates the lower limit of the radiation wavelength of the sample being tested, which is 8μm; Indicates the upper limit of the radiation wavelength of the sample being tested, which is 14μm; C 1 and C 2 is the Planck coefficient; T i The infrared thermal imager measures the temperature of the sample at different angles. It indicates the radiation amount corresponding to the temperature of the sample measured by the infrared thermal imager at different angles.

[0053] The above-constructed radiation amount calculation formula corresponding to the temperature is constructed based on Planck's blackbody radiation law, and will not be elaborated in detail in this embodiment.

[0054] It should be further explained that in step S6, the directional emissivity of the material sample at different detection angles of the infrared thermal imager 2 is calculated based on the radiation corresponding to the thermal imaging temperature, the radiation corresponding to the real temperature, and the radiation corresponding to the ambient temperature. Specifically, the difference between the radiation of the thermal imaging temperature and the radiation corresponding to the ambient temperature at different detection angles of the infrared thermal imager 2, and the difference between the radiation corresponding to the real temperature and the radiation corresponding to the ambient temperature are calculated. According to the ratio of the two, the directional emissivity of the material sample at different detection angles of the infrared thermal imager 2 is obtained.

[0055] In this embodiment, the directional emissivity calculation formula of the constructed material sample calculated at different angles can be expressed as:

[0056]

[0057] Where, T am is the ambient temperature, T iThe infrared thermal imager measures the temperature of the sample at different angles, T 0 The actual temperature of the sample measured by the thermocouple; S(T i ) represents the thermal radiation corresponding to the temperature of the sample measured by the infrared thermal imager at different angles; S(T am ) represents the thermal radiation corresponding to the ambient temperature; S(T 0 ) represents the thermal radiation corresponding to the actual temperature of the sample measured by the thermocouple; ɛ(θ) represents the directional emissivity of the material sample calculated at different angles.

[0058] In the above-mentioned directional emissivity calculation formula obtained from material samples at different angles, the difference in thermal radiation corresponding to the temperature of the sample measured by the infrared thermal imager at different angles and the actual temperature of the sample measured by the thermocouple is caused by the ambient temperature factor. Because infrared thermal radiation will be disturbed by the ambient temperature, the thermal radiation value detected by the infrared thermal imager will be different from the actual thermal radiation value of the real material sample. Therefore, the difference between the radiation amount of the thermal imaging temperature at different detection angles and the radiation amount corresponding to the ambient temperature, and the difference between the radiation amount corresponding to the actual temperature and the radiation amount corresponding to the ambient temperature, the ratio of the former to the latter can be defined as the directional emissivity of the material sample at different detection angles.

[0059] like Figure 5 Shown is the directional emissivity measurement result of the stainless steel sample provided in this embodiment.

[0060] After obtaining the directional emissivity of the material sample at different detection angles, the temperature measured by the infrared thermal imager can be compensated for the actual measurement angle of the infrared thermal imager according to the emissivity value.

[0061] In this embodiment, the constructed calculation formula for compensating the thermal radiation corresponding to the temperature measured by the infrared thermal imager is as follows:

[0062]

[0063] In the formula, S(T i ) represents the thermal radiation corresponding to the temperature of the sample measured by the infrared thermal imager at different angles; S(T am ) represents the thermal radiation corresponding to the ambient temperature; S(T 0 ) represents the thermal radiation value after compensating the temperature measured by the infrared thermal imager; ɛ(θ) represents the directional emissivity of the material sample calculated at different angles.

[0064] In the above-mentioned calculation formula for compensating the thermal radiation corresponding to the temperature measured by the infrared thermal imager, the result S(T 0 ) represents the thermal radiation value after the temperature measured by the infrared thermal imager is compensated. At the same time, it is actually the thermal radiation value corresponding to the real temperature of the sample measured by the thermocouple in this embodiment.

[0065] After the above-mentioned thermal radiation compensation, the result can be used as the thermal radiation value corresponding to the temperature measured by the infrared thermal imager. Then, through the conversion relationship between the thermal radiation value and the temperature, the infrared thermal imager can display the temperature display value after compensating the temperature measured by the infrared thermal imager.

[0066] The present embodiment provides a device and method for measuring the directional emissivity of a material. A heating furnace, an infrared thermal imager, a connecting mechanism, a lifting mechanism, an electric rotating arm, and a chassis are provided. The heating furnace is located above the chassis and is used to heat the material sample placed inside to a specified temperature. The infrared thermal imager is placed above the heating furnace and is used to detect the thermal radiation temperature of the material sample through the opening above the heating furnace. The infrared thermal imager is connected to the lifting mechanism through the connecting mechanism. The lifting mechanism is used to adjust the height of the infrared thermal imager. The electric rotating arm is connected to the bottom of the lifting mechanism. When the electric rotating arm rotates, it drives the lifting mechanism, the connecting mechanism, and the infrared thermal imager to rotate at the same angle, thereby adjusting the observation angle between the infrared thermal imager and the material sample. In this way, the versatility and convenience of measuring the directional emissivity of the material are improved.

[0067] The above embodiments only express the preferred implementation mode of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A device for measuring the directional emissivity of a material, characterized in that: The invention comprises a heating furnace (1), an infrared thermal imager (2), a connecting mechanism (3), a lifting mechanism (4), and an electric rotating arm (5). The heating furnace (1) heats the material placed inside to a preset temperature. The infrared thermal imager (2) is placed above the heating furnace (1) and is used to detect the thermal radiation temperature of the material sample through an opening above the heating furnace (1). The infrared thermal imager (2) is connected to the lifting mechanism (4) through the connecting mechanism (3). The lifting mechanism (4) is used to adjust the height of the infrared thermal imager (2). The electric rotating arm (5) is connected to the bottom of the lifting mechanism (4). When the electric rotating arm (5) rotates, it drives the lifting mechanism (4), the connecting mechanism (3), and the infrared thermal imager (2) to rotate at the same angle, thereby adjusting the observation angle between the infrared thermal imager (2) and the material sample.

2. A material directional emissivity measuring device according to claim 1, characterized in that: A thermocouple sensor is arranged in the heating furnace (1), and the thermocouple sensor is used to detect the temperature of the material sample.

3. A material directional emissivity measuring device according to claim 1, characterized in that: The connecting mechanism (3) comprises a connecting rod (301), a sliding block (302), a fixing plate (303), and a fixing block (304); the fixing block (304) is used to fix the infrared thermal imager (2); two ends of the connecting rod (301) are respectively connected to the fixing block (304) and the fixing plate (303); one end of the fixing plate (303) away from the connecting rod (301) is connected to the sliding block (302); a sliding groove is provided through the upper and lower parts of the sliding block (302); and the connecting mechanism (3) is connected to the lifting mechanism (4) via the sliding groove.

4. A material directional emissivity measuring device according to claim 3, characterized in that: Bosses (3041) are provided at both upper and lower ends of the fixing block (304), and the bosses (3041) are used to limit the upper and lower positions of the infrared thermal imager (2). A latching tongue (3043) is provided at one end of the fixing block (304) away from the connecting rod (301), and a hinge (3044) is provided at one end of the latching tongue (3043), and a buckle seat (3042) is connected to the other end.

5. A material directional emissivity measuring device according to claim 1, characterized in that: The lifting mechanism (4) comprises a scale plate (401), and the scale plate (401) passes through a slide groove connected to the slide block (302).

6. A material directional emissivity measuring device according to claim 1 or 5, characterized in that: The electric rotating arm (5) comprises a motor (501) and a rotating disk (502); the output shaft of the motor (501) is connected to the rotating disk (502) via a transmission gear; the upper end of the rotating disk (502) is connected to a scale plate (401).

7. A material directional emissivity measuring device according to claim 1, characterized in that: The heating furnace (1) is placed on the chassis (7) and is limited in position by L-shaped fixings arranged on all sides. A PTC heating plate is arranged at the bottom of the heating furnace (1), and the PTC heating plate is used to heat the detection material.

8. A method for measuring the directional emissivity of a material, the method being implemented by using the device for measuring the directional emissivity of a material as claimed in any one of claims 1 to 7, characterized in that: The method comprises: Step S1: placing a material sample in a heating area in a heating furnace (1) and heating the material sample to a set temperature; Step S2: installing the infrared thermal imager (2) on the fixing block (304) of the connecting mechanism (3), and fixing the infrared thermal imager (2) so that the normal direction of its viewing angle is perpendicular to the surface of the material sample to be tested; Step S3: adjusting the position of the connecting mechanism (3) on the lifting mechanism (4) so ​​that the infrared thermal imager (2) can clearly focus on the material sample to be tested; Step S4: rotating the electric rotating arm (5) so that the infrared thermal imager (2) performs temperature detection on the material sample within a preset measurement viewing angle range, and recording the thermal imaging temperatures corresponding to different detection angles measured by the infrared thermal imager (2); Step S5: using a thermocouple sensor to measure the real temperature of the material sample, and respectively calculating the thermal imaging temperature and the radiation amount corresponding to the real temperature; Step S6: Calculate the directional emissivity of the material sample at different detection angles of the infrared thermal imager (2) based on the radiation corresponding to the thermal imaging temperature, the radiation corresponding to the real temperature, and the radiation corresponding to the ambient temperature.

9. A material directional emissivity measurement method according to claim 8, characterized in that: In step S6, the directional emissivity of the material sample at different detection angles of the infrared thermal imager (2) is calculated based on the radiation corresponding to the thermal imaging temperature, the radiation corresponding to the real temperature, and the radiation corresponding to the ambient temperature. Specifically, The difference between the radiation amount of the thermal imaging temperature and the radiation amount corresponding to the ambient temperature at different detection angles of the infrared thermal imager (2) and the difference between the radiation amount corresponding to the real temperature and the radiation amount corresponding to the ambient temperature are calculated, and the directional emissivity of the material sample at different detection angles of the infrared thermal imager (2) is obtained based on the ratio of the two.

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