Packaging structure and packaging device

Abstract

The invention discloses a packaging structure and a packaging device. The packaging structure comprises a metal substrate, a ceramic wall body structure and a lead, the ceramic wall body structure and the lead are located on one side of the metal substrate, the ceramic wall body structure comprises at least two cavities, the cavities are communicated with the surface, close to one side of the ceramic wall body structure, of the metal substrate, the lead is connected with the ceramic wall body structure, and the at least two cavities comprise the first cavity and the second cavity. The first cavity and the second cavity are arranged in the first direction, and the first direction is parallel to the surface of the side, close to the ceramic wall structure, of the metal substrate. According to the packaging structure and the packaging device provided by the embodiment of the invention, at least two independent cavities are arranged on the same metal substrate, so that the combined packaging of high-power multi-electronic elements is met, the length-width ratio of a single cavity can be reduced, the problem of cracking caused by mismatching of thermal expansion coefficients of a ceramic wall body structure and the metal substrate is solved, and the service life of the ceramic wall body structure and the metal substrate is prolonged. And the integration level is higher, the cost is lower, and the assembly consistency is better.

Description

Technical Field

[0001] The present invention relates to the field of microelectronics and packaging technology, and in particular to a packaging structure and a packaging device. Background Art

[0002] Ceramic packaging has the characteristics of high power, high reliability, and hermetic packaging, and is indispensable in the packaging field with high reliability requirements.

[0003] As the power required for packaging becomes larger and larger, it is necessary to realize ceramic packaging of multiple power chips. The existing technology meets the high power demand by splicing together multiple independent packaging devices that encapsulate a single power chip. However, the manufacturing cost of multiple independent packaging devices is higher, the raw material cost is also higher, and the packaging consistency is poor.

[0004] If multiple power chips are to be assembled in the same package, the package needs to have a larger cavity size, and the cavity of the ceramic shell in the package needs to be designed with a higher aspect ratio in order to accommodate multiple power chips. Since ceramic materials have a low thermal expansion coefficient, and the metal at the bottom of the package often has a large thermal expansion coefficient, when the ceramic shell and the metal are welded together, the ceramic will crack due to inconsistent thermal expansion coefficients, which will limit the size of the ceramic shell, especially the increase in the aspect ratio. Summary of the invention

[0005] The present invention provides a packaging structure and a packaging device, which can solve the problem of ceramic cracking while realizing high-power packaging in a packaging device.

[0006] According to one aspect of the present invention, there is provided a packaging structure, comprising a metal substrate and a ceramic wall structure and leads located on one side of the metal substrate;

[0007] The ceramic wall structure comprises at least two cavities, the cavities are connected to the surface of the metal substrate close to the ceramic wall structure, and the lead is connected to the ceramic wall structure;

[0008] The at least two cavities include a first cavity and a second cavity, the first cavity and the second cavity are arranged along a first direction, and the first direction is parallel to a surface of the metal substrate close to the ceramic wall structure.

[0009] Optionally, the aspect ratio of the ceramic wall structure is greater than or equal to 3.

[0010] Optionally, the first cavity and the second cavity are arranged adjacent to each other, and the shortest distance between the first cavity and the second cavity is d1, where d1≤1 mm.

[0011] Optionally, the ceramic wall structure includes at least two ceramic walls, the at least two ceramic walls include a first ceramic wall and a second ceramic wall, the first ceramic wall and the second ceramic wall are adjacently arranged, and the first ceramic wall is arranged around the first cavity, and the second ceramic wall is arranged around the second cavity;

[0012] The shortest distance between the first ceramic wall and the second ceramic wall is less than or equal to 200 μm.

[0013] Optionally, the ceramic wall structure includes at least two ceramic walls, the at least two ceramic walls include a first ceramic wall and a second ceramic wall, the first ceramic wall and the second ceramic wall are adjacently arranged, and the first ceramic wall is arranged around the first cavity, and the second ceramic wall is arranged around the second cavity;

[0014] The first ceramic wall comprises a first sub-wall and a second sub-wall connected to each other, and the first sub-wall is located on a side of the second sub-wall close to the second ceramic wall;

[0015] The second ceramic wall includes a third sub-wall and a fourth sub-wall connected to each other, and the third sub-wall is located on a side of the fourth sub-wall close to the first ceramic wall;

[0016] The thickness of the first sub-wall is smaller than the thickness of the second sub-wall, and / or the thickness of the third sub-wall is smaller than the thickness of the fourth sub-wall.

[0017] Optionally, the ceramic wall structure includes at least two ceramic walls, the at least two ceramic walls include a first ceramic wall and a second ceramic wall, the first ceramic wall and the second ceramic wall are adjacently arranged, and the first ceramic wall is arranged around the first cavity, and the second ceramic wall is arranged around the second cavity;

[0018] The first ceramic wall comprises a first sub-wall and a second sub-wall connected to each other, and the first sub-wall is located on a side of the second sub-wall close to the second ceramic wall;

[0019] The second ceramic wall includes a third sub-wall and a fourth sub-wall connected to each other, and the third sub-wall is located on a side of the fourth sub-wall close to the first ceramic wall;

[0020] The first sub-wall and the third sub-wall are the same sub-wall structure.

[0021] Optionally, the ceramic wall structure includes at least two ceramic walls, and the at least two ceramic walls and the at least two cavities are arranged correspondingly;

[0022] The packaging structure comprises at least two leads, and the at least two leads are correspondingly connected to at least two ceramic walls;

[0023] The lead includes a first sub-lead and a second sub-lead, the first sub-lead and the second sub-lead are respectively located at two opposite sides of the ceramic wall, and the arrangement direction of the first sub-lead and the second sub-lead intersects with the first direction.

[0024] Optionally, the packaging structure further includes a packaging cover plate, which is located on a side of the ceramic wall structure away from the metal substrate, and covers the cavity.

[0025] Optionally, the ceramic wall structure includes at least two ceramic walls, and the at least two ceramic walls and the at least two cavities are arranged correspondingly;

[0026] At least two of the ceramic walls have the same height.

[0027] According to another aspect of the present invention, a packaging device is provided, comprising any packaging structure described in the first aspect and an electronic component, wherein the electronic component is located in the cavity and is electrically connected to the lead.

[0028] The packaging structure and packaging device provided by the embodiment of the present invention form at least two cavities by setting a ceramic wall structure on the same metal substrate, thereby obtaining a packaging structure with a larger overall aspect ratio. The ceramic packaging of multiple electronic components can be realized in one packaging structure, which can meet the combined packaging of high-power multi-electronic components while reducing the aspect ratio of a single cavity, ensuring that the aspect ratio of a single cavity is not too large, thereby solving the problem of cracking caused by the mismatch between the thermal expansion coefficients of the ceramic wall structure and the metal substrate. In addition, in the packaging structure provided by the embodiment of the present invention, multiple electronic components can be packaged on the same metal substrate, with higher integration, lower cost, and better assembly consistency.

[0029] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1A schematic diagram of a packaging structure provided by an embodiment of the present invention;

[0032] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure along the A-A' direction;

[0033] Figure 3 A schematic diagram of another packaging structure provided by an embodiment of the present invention;

[0034] Figure 4 A schematic diagram of a structure of another packaging structure provided by an embodiment of the present invention;

[0035] Figure 5 A schematic diagram of a structure of another packaging structure provided by an embodiment of the present invention;

[0036] Figure 6 A schematic diagram of a structure of another packaging structure provided by an embodiment of the present invention;

[0037] Figure 7 A schematic diagram of a structure of another packaging structure provided by an embodiment of the present invention;

[0038] Figure 8 A schematic diagram of a structure of another packaging structure provided by an embodiment of the present invention;

[0039] Fig. 9 A schematic diagram of a structure of another packaging structure provided by an embodiment of the present invention;

[0040] Fig.10 for Fig. 9 Schematic diagram of the cross-sectional structure along the B-B' direction;

[0041] Fig.11 for Fig. 9 Schematic diagram of the cross-sectional structure along the C-C' direction;

[0042] Fig.12 A schematic diagram of the structure of a packaging device provided by an embodiment of the present invention;

[0043] Fig.13 A schematic structural diagram of another packaging device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0044] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0045] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0046] Figure 1 A schematic diagram of a packaging structure provided by an embodiment of the present invention is provided. Figure 2 for Figure 1 The schematic diagram of the cross-sectional structure along the A-A' direction is as follows: Figure 1 and Figure 2 As shown, the packaging structure provided by the embodiment of the present invention includes a metal substrate 10 and a ceramic wall structure 11 and a lead 12 located on one side of the metal substrate 10. The ceramic wall structure 11 includes at least two cavities 13, the cavity 13 is connected to the surface of the metal substrate 10 close to the ceramic wall structure 11, and the lead 12 is connected to the ceramic wall structure 11. The at least two cavities 13 include a first cavity 131 and a second cavity 132, and the first cavity 131 and the second cavity 132 are arranged along a first direction X, and the first direction X is parallel to the surface of the metal substrate 10 close to the ceramic wall structure 11.

[0047] Specifically, Figure 1 and Figure 2 As shown, the packaging structure is provided with a metal substrate 10, which is made of metal material and can play a good heat dissipation role.

[0048] A ceramic wall structure 11 is provided on one side of the metal substrate 10. The ceramic wall structure 11 is hollowed out to form at least two independent cavities 13 in the ceramic wall structure 11. The cavity 13 is used to place electronic components so that the packaging structure can ceramic package the electronic components to form a packaged device. A lead 12 is also connected to the ceramic wall structure 11. One end of the lead 12 is used to form an electrical connection with the electronic components in the cavity 13. The other end of the lead 12 extends to the outside of the packaging structure so that signal transmission can be achieved between the electronic components in the cavity 13 and the circuit outside the packaging structure. Figure 1 and Figure 2As shown, the lead 12 can be arranged on the side of the ceramic wall structure 11 away from the metal substrate 10, and the lead 12 is connected to the surface of the ceramic wall structure 11 away from the metal substrate 10, so as to facilitate the subsequent connection between the lead 12 and the electronic component.

[0049] Furthermore, the cavity 13 is connected to the surface of the metal substrate 10 close to the ceramic wall structure 11, so that the electronic components can be placed on the surface of the metal substrate 10 in the cavity 13, so that the electronic components contact the metal substrate 10, thereby enabling the metal substrate 10 to better dissipate heat for the electronic components.

[0050] Continue to refer Figure 1 and Figure 2 The cavity 13 of the packaging structure includes at least a first cavity 131 and a second cavity 132, and the first cavity 131 and the second cavity 132 are arranged along a first direction X on a surface of one side of the metal substrate 10, wherein the first direction X is parallel to a surface of the metal substrate 10 close to a side of the ceramic wall structure 11.

[0051] Among them, each cavity 13 can be provided with at least one electronic component, and the first cavity 131 and the second cavity 132 can be used to encapsulate at least two electronic components, so that the packaging structure can realize the ceramic packaging of at least two electronic components on the same metal substrate 10, thereby meeting the combined packaging requirements of high-power multi-electronic components. At the same time, at least two cavities 13 are arranged on the same metal substrate 10 to form a multi-chamber structure. While obtaining a packaging structure with a larger overall length-to-width ratio, the length-to-width ratio of a single cavity 13 can be reduced to ensure that the length-to-width ratio of a single cavity 13 is not too large, thereby solving the problem of cracking caused by the mismatch of the thermal expansion coefficients of the ceramic wall structure 11 and the metal substrate 10.

[0052] For example, taking the example of encapsulating a 250W electronic component in the first cavity 131 and encapsulating a 250W electronic component in the second cavity 132, the packaging structure in this embodiment can realize the ceramic packaging of two electronic components on the same metal substrate 10, thereby realizing the packaging of a 500W high-power electronic component in one packaging structure.

[0053] In the prior art, each packaging structure is only provided with one cavity. Since the aspect ratio of a single cavity is limited, it is difficult to meet the combined packaging of multiple electronic components with higher power. Therefore, if the packaging of 500W electronic components is to be achieved, two independent packaging structures need to be spliced ​​together, which results in higher manufacturing costs and raw material costs. In addition, since certain tolerances will be generated during splicing, the packaging consistency between different packaging structures will be poor.

[0054] In this embodiment, a small pitch "I"-shaped package is implemented in a packaging structure, which can make the ceramic package of multiple electronic components more integrated and less expensive, and multiple electronic components can be packaged on the same metal substrate 10, with better assembly consistency. For example, in the dual-channel package of RF electronic components, the upper and lower RF consistency can be better and the RF performance can be better.

[0055] It should be noted that Figure 1 In the figure, only the packaging structure including two cavities 13 (first cavity 131 and second cavity 132) is used as an example for explanation, but it is not limited to this. In other embodiments, the packaging structure may also include more cavities 13 to realize ceramic packaging of more electronic components and meet higher power packaging requirements.

[0056] For example, Figure 3 A schematic diagram of another packaging structure provided by an embodiment of the present invention is shown in FIG. Figure 3 As shown, the packaging structure may also include three cavities 13, and the three cavities 13 may all be arranged along the first direction X.

[0057] In other embodiments, the packaging structure may further include more cavities 13. Similarly, all cavities 13 may be arranged along the first direction X to achieve a larger overall aspect ratio, realize ceramic packaging of more electronic components, and meet higher power packaging requirements.

[0058] It should be further explained that the material of the metal substrate 10 may include at least one of copper, molybdenum and tungsten.

[0059] For example, the material of the metal substrate 10 may be copper to achieve a better heat dissipation effect.

[0060] For another example, the material of the metal substrate 10 may be molybdenum or tungsten, so that the thermal expansion coefficient of the metal substrate 10 is closer to the thermal expansion coefficient of the ceramic wall structure 11, thereby improving to a certain extent the problem of ceramic cracking caused by inconsistent thermal expansion coefficients between the ceramic wall structure 11 and the metal substrate 10 when the ceramic wall structure 11 and the metal substrate 10 are connected.

[0061] In some embodiments, the material of the metal substrate 10 can also be tungsten-copper alloy or molybdenum-copper alloy, so that the thermal expansion coefficient of the metal substrate 10 can be more closely matched with the thermal expansion coefficient of the ceramic wall structure 11 while achieving good heat dissipation effect, thereby improving the problem of ceramic cracking caused by inconsistent thermal expansion coefficients between the ceramic wall structure 11 and the metal substrate 10.

[0062] In other embodiments, the metal substrate 10 may also adopt a structure in which a copper layer, a molybdenum layer and a copper layer are stacked in sequence, so that the thermal expansion coefficient of the metal substrate 10 is more closely matched with the thermal expansion coefficient of the ceramic wall structure 11 while achieving a good heat dissipation effect, thereby improving the problem of ceramic cracking.

[0063] In addition, the ceramic wall structure 11 is made of a ceramic material, and the material of the ceramic wall structure 11 may include at least one of aluminum oxide, aluminum nitride, beryllium oxide, boron nitride and silicon carbide.

[0064] For example, the material of the ceramic wall structure 11 may be aluminum oxide to reduce the cost of raw materials.

[0065] For another example, the material of the ceramic wall structure 11 may also be aluminum nitride, beryllium oxide, boron nitride or silicon carbide, so that the ceramic wall structure 11 has good thermal conductivity.

[0066] Optionally, the lead wire 12 is made of a metal material, and the material of the lead wire 12 may include at least one of Kovar alloy, copper, copper alloy and iron alloy.

[0067] For example, the material of the lead 12 may be a kovar alloy, which has a relatively constant low or medium thermal expansion coefficient, and can make the thermal expansion coefficient of the lead 12 close to that of the ceramic wall structure 11, thereby helping to achieve a matching connection effect between the lead 12 and the ceramic wall structure 11. At the same time, the use of the kovar alloy can also make the lead 12 have good conductivity and strength. Among them, the kovar alloy may include iron-nickel, iron-nickel-cobalt or iron-nickel-chromium alloy, which is not specifically limited in the embodiment of the present invention.

[0068] In other embodiments, the material of the lead 12 may also be copper, copper alloy or iron alloy, so as to have good conductivity and strength and low cost.

[0069] Furthermore, the ceramic wall structure 11 and the metal substrate 10 can be connected by metal solder to have good reliability, and at the same time, airtight packaging can be achieved.

[0070] Among them, the metal solder may include silver-copper solder, and the ceramic wall structure 11 and the metal substrate 10 can be welded together by the silver-copper solder at a high temperature (eg, about 800° C.), which has good reliability, mature technology, and is easy to implement.

[0071] It should be noted that before the ceramic wall structure 11 and the metal substrate 10 are welded by metal solder, the surface of the ceramic wall structure 11 for contacting and connecting with the metal substrate 10 may be metallized to facilitate subsequent welding.

[0072] Among them, during the metallization treatment, metal tungsten slurry can be printed on the surface of the ceramic wall structure 11 used to connect to the metal substrate 10. After the ceramic wall structure 11 is sintered into cooked porcelain, a metallization layer can be formed on the surface of the ceramic wall structure 11 used to connect to the metal substrate 10, thereby realizing the metallization of the surface of the ceramic wall structure 11, but it is not limited to this.

[0073] In other embodiments, the ceramic wall structure 11 and the metal substrate 10 may also be bonded together by glue (such as organic glue) to further reduce the risk of cracking of the ceramic wall structure 11, but the present invention is not limited thereto.

[0074] In addition, the lead 12 and the ceramic wall structure 11 can also be connected by metal solder to have good reliability, wherein the metal solder may include silver-copper solder. The lead 12 and the ceramic wall structure 11 can be welded together by silver-copper solder at high temperature (for example, about 800°C), with good reliability, mature technology, and easy implementation.

[0075] Similarly, before the ceramic wall structure 11 and the lead 12 are welded by metal solder, the surface of the ceramic wall structure 11 for contacting and connecting with the lead 12 may be metallized to facilitate subsequent welding.

[0076] Among them, during the metallization treatment, metal tungsten slurry can be printed on the surface of the ceramic wall structure 11 for connecting the lead 12. After the ceramic wall structure 11 is sintered into cooked porcelain, a metallization layer can be formed on the surface of the ceramic wall structure 11 for connecting the lead 12, thereby realizing the metallization of the surface of the ceramic wall structure 11, but it is not limited to this.

[0077] In summary, the packaging structure provided by the embodiment of the present invention forms at least two cavities by setting a ceramic wall structure on the same metal substrate, thereby obtaining a packaging structure with a larger overall aspect ratio. The ceramic packaging of multiple electronic components can be realized in one packaging structure, which can meet the combined packaging of high-power multi-electronic components while reducing the aspect ratio of a single cavity, ensuring that the aspect ratio of a single cavity is not too large, thereby solving the problem of cracking caused by the mismatch between the thermal expansion coefficients of the ceramic wall structure and the metal substrate. In addition, in the packaging structure provided by the embodiment of the present invention, multiple electronic components can be packaged on the same metal substrate, with higher integration, lower cost, and better assembly consistency.

[0078] Optionally, the aspect ratio of the ceramic wall structure 11 is greater than or equal to 3; preferably, when the aspect ratio of the cavity 13 is less than 3, the use of the present invention to realize multiple electronic component packaging on the same substrate can further reduce the possibility of breakage during the packaging process.

[0079] Among them, Figure 1As shown, the aspect ratio of the ceramic wall structure 11 refers to the ratio between the farthest length of the ceramic wall structure 11 in the first direction X and the farthest length of the ceramic wall structure 11 in the second direction Y, and the second direction Y is perpendicular to the first direction X. In this embodiment, by arranging at least two cavities 13 along the first direction X on the same metal substrate 10, a packaging structure in which the overall aspect ratio of the ceramic wall structure 11 is greater than or equal to 3, or even greater than or equal to 5 can be achieved, so that ceramic packaging of more electronic components can be achieved on one metal substrate 10 while avoiding ceramic cracking, meeting the packaging requirements of higher power, and helping to reduce the number of packaging times and reduce manufacturing costs.

[0080] Optionally, setting the aspect ratio of a single cavity 13 to be less than or equal to 3 is helpful to reduce the risk of cracking due to mismatch in thermal expansion coefficients between the ceramic wall structure 11 and the metal substrate 10 .

[0081] Continue to refer Figure 1 Optionally, the first cavity 131 and the second cavity 132 are arranged adjacent to each other, and the shortest distance between the first cavity 131 and the second cavity 132 is d1, where d1≤1mm.

[0082] The first cavity 131 and the second cavity 132 are both disposed on the same metal substrate 10 , which helps to reduce the distance between the first cavity 131 and the second cavity 132 .

[0083] In this embodiment, the shortest distance d1 between the first cavity 131 and the second cavity 132 is reduced to 1 mm or less, which is beneficial to saving the area of ​​the metal substrate 10 and realizing the miniaturized design of the packaging structure. At the same time, when the size of the metal substrate 10 remains unchanged, more cavities 13 can be arranged, thereby realizing ceramic packaging of more electronic components and meeting the packaging requirements of higher power.

[0084] In addition, the shortened distance between the first cavity 131 and the second cavity 132 is also beneficial to improving the consistency of electronic component assembly, reducing the difficulty of circuit matching, and the support of the ceramic wall structure 11 will also be better.

[0085] It should be noted that the specific value of the shortest distance d1 between the first cavity 131 and the second cavity 132 can be set according to actual needs. For example, the shortest distance d1 can be further reduced to 500 μm and below to further save the area of ​​the metal substrate 10, improve the consistency of electronic component assembly, and improve the supporting performance of the ceramic wall structure 11, but it is not limited to this.

[0086] In other embodiments, if the package structure includes more cavities 13 (eg Figure 3The packaging structure shown in the figure) can set the shortest distance between any two adjacent cavities 13 to be less than or equal to 1 mm, or even less than or equal to 500 μm, so as to further save the area of ​​the metal substrate 10, improve the consistency of electronic component assembly, and improve the supporting performance of the ceramic wall structure 11, which will not be repeated here.

[0087] Continue to refer Figure 1 Optionally, the ceramic wall structure 11 includes at least two ceramic walls 110, the at least two ceramic walls 110 include a first ceramic wall 111 and a second ceramic wall 112, the first ceramic wall 111 and the second ceramic wall 112 are adjacent to each other, and the first ceramic wall 111 is arranged around the first cavity 131, and the second ceramic wall 112 is arranged around the second cavity 132, and the shortest distance d2 between the first ceramic wall 111 and the second ceramic wall 112 is less than or equal to 200μm.

[0088] Specifically, Figure 1 As shown, the ceramic wall structure 11 includes at least two ceramic walls 110 , and the at least two ceramic walls 110 and at least two cavities 13 can be arranged in a one-to-one correspondence, that is, the ceramic wall 110 is arranged around the corresponding cavity 13 , or the cavity 13 is located in the corresponding ceramic wall 110 .

[0089] Among them, Figure 1 As shown, at least two ceramic walls 110 include a first ceramic wall 111 and a second ceramic wall 112, and the first ceramic wall 111 and the second ceramic wall 112 are arranged on a surface of one side of the metal substrate 10 along a first direction X. The first ceramic wall 111 and the second ceramic wall 112 are arranged adjacent to each other, and the first ceramic wall 111 is hollowed out to form a first cavity 131 in the first ceramic wall 111; the second ceramic wall 112 is hollowed out to form a second cavity 132 in the second ceramic wall 112. At this time, the first cavity 131 and the second cavity 132 are adjacently arranged cavities.

[0090] In this embodiment, the shortest distance d2 between the first ceramic wall 111 and the second ceramic wall 112 is less than or equal to 200 μm, and can even be less than or equal to 100 μm, so as to save the area of ​​the metal substrate 10, improve the consistency of electronic component assembly, and improve the supporting performance of the ceramic wall structure 11, but is not limited to this.

[0091] Furthermore, if Figure 1As shown, the shortest distance d2 between the first ceramic wall 111 and the second ceramic wall 112 can be greater than 0, that is, there is a gap between the first ceramic wall 111 and the second ceramic wall 112, so that the first ceramic wall 111 and the second ceramic wall 112 are both independent ceramic walls 110. While obtaining a ceramic wall structure 11 with a larger overall length-to-width ratio, the length-to-width ratio of a single ceramic wall 110 (for example, the first ceramic wall 111 or the second ceramic wall 112) can be reduced, ensuring that the length-to-width ratio of a single ceramic wall 110 is not too large, which is beneficial to further reduce the risk of cracking due to the mismatch of the thermal expansion coefficients of the ceramic wall structure 11 and the metal substrate 10.

[0092] In other embodiments, the packaging structure may further include more ceramic walls 110 (eg Figure 3 The packaging structure shown in the figure) can set the shortest distance between any two adjacent ceramic walls 110 to be less than or equal to 200 μm, or even less than or equal to 100 μm, so as to further save the area of ​​the metal substrate 10, improve the consistency of electronic component assembly, and improve the supporting performance of the ceramic wall structure 11, but is not limited to this.

[0093] In addition, if Figure 3 As shown, the shortest distance between any two adjacent ceramic walls 110 can also be set to be greater than 0, so that each ceramic wall 110 is an independent ceramic wall 110, which is beneficial to further reduce the risk of cracking due to the mismatch of thermal expansion coefficients between the ceramic wall structure 11 and the metal substrate 10.

[0094] Figure 4 A schematic diagram of another packaging structure provided by an embodiment of the present invention is shown in FIG. Figure 4 As shown, optionally, the ceramic wall structure 11 includes at least two ceramic walls 110, and the at least two ceramic walls 110 include a first ceramic wall 111 and a second ceramic wall 112. The first ceramic wall 111 and the second ceramic wall 112 are arranged adjacent to each other, and the first ceramic wall 111 is arranged around the first cavity 131, and the second ceramic wall 112 is arranged around the second cavity 132. The first ceramic wall 111 includes a first sub-wall 21 and a second sub-wall 22 connected to each other, and the first sub-wall 21 is located on a side of the second sub-wall 22 close to the second ceramic wall 112. The second ceramic wall 112 includes a third sub-wall 23 and a fourth sub-wall 24 connected to each other, and the third sub-wall 23 is located on a side of the fourth sub-wall 24 close to the first ceramic wall 111. The thickness of the first sub-wall 21 is less than the thickness of the second sub-wall 22, and / or the thickness of the third sub-wall 112A is less than the thickness of the fourth sub-wall 112B.

[0095] Specifically, the ceramic wall 110 may be composed of at least two interconnected sub-walls, wherein the at least two interconnected sub-walls may be arranged around the cavity 13 to form a ring-shaped ceramic wall 110 .

[0096] In this embodiment, if Figure 4 As shown, the first ceramic wall 111 may be composed of a first sub-wall 21 and a second sub-wall 22 connected to each other, and the first sub-wall 21 and the second sub-wall 22 are arranged around the first cavity 131, wherein the first sub-wall 21 is a sub-wall adjacent to the second ceramic wall 112, and the second sub-wall 22 is a sub-wall not adjacent to the second ceramic wall 112. Similarly, the second ceramic wall 112 is composed of a third sub-wall 23 and a fourth sub-wall 24 connected to each other, and the third sub-wall 23 and the fourth sub-wall 24 are arranged around the second cavity 132, wherein the third sub-wall 23 is a sub-wall adjacent to the first ceramic wall 111, and the fourth sub-wall 24 is a sub-wall not adjacent to the first ceramic wall 111. The thickness of the first sub-wall 21 is d3, the thickness of the second sub-wall 22 is d4, the thickness of the third sub-wall 23 is d5, the thickness of the fourth sub-wall 24 is d6, and d3<d4, and / or d5<d6.

[0097] In this way, the thickness of the sub-wall between the cavity 13 (i.e., the first cavity 131) of the first ceramic wall 111 and the cavity 13 (i.e., the second cavity 132) of the second ceramic wall 112 is reduced, so that the thickness of the sub-wall between the cavity 13 (i.e., the first cavity 131) of the first ceramic wall 111 and the cavity 13 (i.e., the second cavity 132) of the second ceramic wall 112 is smaller than the thickness of the sub-walls of the first ceramic wall 111 and the second ceramic wall 112 on other surfaces, thereby reducing the thickness of the first ceramic wall 111. The distance between the cavity 13 of the ceramic wall 111 (i.e., the first cavity 131) and the cavity 13 of the second ceramic wall 112 (i.e., the second cavity 132), under the condition that the area of ​​the cavity 13 remains unchanged, is conducive to saving the area of ​​the metal substrate 10 and realizing the miniaturized design of the packaging structure. At the same time, under the condition that the size of the metal substrate 10 remains unchanged, more ceramic walls 110 can be arranged, which helps to form more cavities 13 and realize ceramic packaging of more electronic components to meet the packaging requirements of higher power.

[0098] In addition, the thickness of the sub-wall between the cavity 13 of the first ceramic wall 111 (ie, the first cavity 131) and the cavity 13 of the second ceramic wall 112 (ie, the second cavity 132) is reduced, which is also beneficial to improving the consistency of electronic component assembly and reducing the difficulty of circuit matching.

[0099] It should be noted that the thickness of the sub-wall described in each embodiment of the present invention refers to the thickness of the sub-wall in a direction parallel to the surface of the metal substrate 10 close to the ceramic wall structure 11, which will not be repeated in other embodiments.

[0100] In addition, the specific values ​​of the sub-wall thickness between the cavity 13 of the first ceramic wall 111 (i.e., the first cavity 131) and the cavity 13 of the second ceramic wall 112 (i.e., the second cavity 132) can be set according to actual needs. For example, when the thickness d4 of the second sub-wall 22 and the thickness d6 of the fourth sub-wall 24 are approximately 500 μm, the thickness d3 of the first sub-wall 21 and the thickness d5 of the third sub-wall 23 can be set to approximately 250 μm, so that the shortest distance between the cavity 13 of the first ceramic wall 111 and the cavity 13 of the second ceramic wall 112 is the same as the thickness d4 of the second sub-wall 22 / the thickness d6 of the fourth sub-wall 24, which is beneficial for saving the area of ​​the metal substrate 10 while improving the consistency of electronic component assembly and ensuring the supporting performance of the ceramic wall structure 11.

[0101] Figure 5 A schematic diagram of another packaging structure provided by an embodiment of the present invention is shown in FIG. Figure 5 As shown, optionally, if the packaging structure includes more ceramic walls 110 (eg Figure 5 The packaging structure shown in the figure includes three ceramic walls 110), and the thickness of the sub-wall between the cavities 13 of any two adjacent ceramic walls 110 can be set to be smaller than the thickness of other sub-walls, thereby reducing the distance between the cavities 13 of any two adjacent ceramic walls 110. Under the condition that the area of ​​the cavity 13 remains unchanged, the area of ​​the metal substrate 10 can be further saved, and a miniaturized design of the packaging structure can be achieved. At the same time, under the condition that the size of the metal substrate 10 remains unchanged, more ceramic walls 110 can be arranged, which helps to form more cavities 13, realize ceramic packaging of more electronic components, and meet the packaging requirements of higher power.

[0102] In addition, the thickness of the sub-wall between the cavities 13 of any two adjacent ceramic walls 110 is reduced, which is also beneficial to improving the consistency of electronic component assembly and reducing the difficulty of circuit matching.

[0103] Figure 6 A schematic diagram of another packaging structure provided by an embodiment of the present invention is shown in FIG. Figure 6As shown, optionally, the ceramic wall structure 11 includes at least two ceramic walls 110, and the at least two ceramic walls 110 include a first ceramic wall 111 and a second ceramic wall 112, the first ceramic wall 111 and the second ceramic wall 112 are arranged adjacent to each other, and the first ceramic wall 111 is arranged around the first cavity 131, and the second ceramic wall 112 is arranged around the second cavity 132, the first ceramic wall 111 includes a first sub-wall 21 and a second sub-wall 22 connected to each other, and the first sub-wall 21 is located on a side of the second sub-wall 22 close to the second ceramic wall 112. The second ceramic wall 112 includes a third sub-wall 23 and a fourth sub-wall 24 connected to each other, and the third sub-wall 23 is located on a side of the fourth sub-wall 24 close to the first ceramic wall 111. The first sub-wall 21 and the third sub-wall 23 are the same sub-wall structure.

[0104] Specifically, Figure 6 As shown, the first ceramic wall 111 may be composed of a first sub-wall 21 and a second sub-wall 22 connected to each other, and the first sub-wall 21 and the second sub-wall 22 are arranged around the first cavity 131, wherein the first sub-wall 21 is a sub-wall adjacent to the second ceramic wall 112, and the second sub-wall 22 is a sub-wall not adjacent to the second ceramic wall 112. Similarly, the second ceramic wall 112 is composed of a third sub-wall 23 and a fourth sub-wall 24 connected to each other, and the third sub-wall 23 and the fourth sub-wall 24 are arranged around the second cavity 132, wherein the third sub-wall 23 is a sub-wall adjacent to the first ceramic wall 111, and the fourth sub-wall 24 is a sub-wall not adjacent to the first ceramic wall 111.

[0105] In this embodiment, the first sub-wall 21 and the third sub-wall 23 are the same sub-wall structure. With such a configuration, the cavity 13 of the first ceramic wall 111 (i.e., the first cavity 131) and the cavity 13 of the second ceramic wall 112 (i.e., the second cavity 132) can share at least part of the ceramic wall (i.e., the sub-wall), which is more helpful to reduce the distance between the cavity 13 of the first ceramic wall 111 (i.e., the first cavity 131) and the cavity 13 of the second ceramic wall 112 (i.e., the second cavity 132). Under the condition that the area of ​​the cavity 13 remains unchanged, it is helpful to save the area of ​​the metal substrate 10 and realize the miniaturized design of the packaging structure. At the same time, under the condition that the size of the metal substrate 10 remains unchanged, more ceramic walls 110 can be arranged, which is helpful to form more cavities 13, realize ceramic packaging of more electronic components, and meet the packaging requirements of higher power.

[0106] In addition, the cavity 13 of the first ceramic wall 111 (ie, the first cavity 131) and the cavity 13 of the second ceramic wall 112 (ie, the second cavity 132) share at least a portion of the ceramic wall, which is also beneficial to improving the consistency of electronic component assembly and reducing the difficulty of circuit matching.

[0107] Figure 7 A schematic diagram of another packaging structure provided by an embodiment of the present invention is shown in FIG. Figure 7 As shown, optionally, if the packaging structure includes more ceramic walls 110 (eg Figure 7 The packaging structure shown in the figure includes three ceramic walls 110, and the cavities 13 of any two adjacent ceramic walls 110 can share at least part of the ceramic wall, thereby reducing the distance between the cavities 13 of any two adjacent ceramic walls 110. Under the condition that the area of ​​the cavity 13 remains unchanged, the area of ​​the metal substrate 10 can be further saved, and the miniaturized design of the packaging structure can be realized. At the same time, under the condition that the size of the metal substrate 10 remains unchanged, more ceramic walls 110 can be arranged, which helps to form more cavities 13 and realize ceramic packaging of more electronic components to meet the packaging requirements of higher power. In addition, the cavities 13 of any two adjacent ceramic walls 110 share at least part of the ceramic wall, which is also conducive to improving the consistency of electronic component assembly and reducing the difficulty of circuit matching.

[0108] Figure 8 A schematic diagram of another packaging structure provided by an embodiment of the present invention is shown in FIG. Figure 8 As shown, optionally, if the packaging structure includes more ceramic walls 110 (eg Figure 8 The packaging structure shown in the figure includes four ceramic walls 110, and it can be arranged that the cavities 13 of two adjacent ceramic walls 110 share at least part of the ceramic wall, and the shortest distance between another part of the adjacent two ceramic walls 110 is greater than 0, thereby reducing the distance between the cavities 13 of any two adjacent ceramic walls 110, saving the area of ​​the metal substrate 10, and reducing the risk of cracking due to the mismatch of the thermal expansion coefficients of the ceramic wall 110 and the metal substrate 10.

[0109] Continue to refer Figure 1-Figure 8 Optionally, the ceramic wall structure 11 includes at least two ceramic walls 110, and the at least two ceramic walls 110 and the at least two cavities 13 are correspondingly arranged. The packaging structure includes at least two leads 12, and the at least two leads 12 and the at least two ceramic walls 11 are correspondingly connected. The lead 12 includes a first sub-lead 121 and a second sub-lead 122, and the first sub-lead 121 and the second sub-lead 122 are respectively located on opposite sides of the ceramic wall 11, and the arrangement direction of the first sub-lead 121 and the second sub-lead 122 intersects with the first direction X.

[0110] Specifically, Figure 1-Figure 8As shown, at least two ceramic walls 110 and at least two cavities 13 in the ceramic wall structure 11 can be arranged in a one-to-one correspondence, that is, the ceramic wall 110 is arranged around the corresponding cavity 13, or in other words, the cavity 13 is located in the corresponding ceramic wall 110. Each ceramic wall 110 is connected to a lead 12, so that the electronic components packaged in the cavity 13 of each ceramic wall 110 can realize signal transmission with the circuit outside the packaging structure through the lead 12.

[0111] Among them, the lead 12 includes a first sub-lead 121 and a second sub-lead 122. The first sub-lead 121 can be used to connect to the input end of the electronic component to serve as the input lead of the electronic component, so as to enable the circuit outside the packaging structure to input signals to the electronic component in the cavity 13; the second sub-lead 122 can be used to connect to the output end of the electronic component to serve as the output lead of the electronic component, so as to enable the electronic component in the cavity 13 to output signals to the circuit outside the packaging structure.

[0112] Furthermore, if Figure 1-Figure 8 As shown, the first sub-lead 121 and the second sub-lead 122 are respectively located on opposite sides of the ceramic wall 110, which helps to reduce the interference between the input signal and the output signal of the electronic component. At the same time, since at least two ceramic walls 110 are arranged along the first direction X on the surface of one side of the metal substrate 10, the arrangement direction (for example, the second direction Y) of the first sub-lead 121 and the second sub-lead 122 is arranged to intersect with the first direction X, which can prevent the leads 12 connected to different ceramic walls 110 from interfering with each other, which is beneficial to the arrangement of the first sub-lead 121 and the second sub-lead 122.

[0113] It should be noted that if the packaging structure includes more ceramic walls 110, all ceramic walls 110 can be arranged along the first direction X, that is, all ceramic walls 110 are arranged in a "one" shape. On the one hand, while ensuring that the leads 12 connected to different ceramic walls 110 do not interfere with each other, the arrangement design of the leads 12 can be simpler and easier to implement; on the other hand, when the packaging structure is used for the packaging of radio frequency electronic components, multiple radio frequency electronic components can be arranged in a "one" shape (that is, arranged along the first direction X), which is beneficial to improving the radio frequency performance.

[0114] Fig. 9 A schematic diagram of another packaging structure provided by an embodiment of the present invention is shown. Fig.10 for Fig. 9 Schematic diagram of the cross-sectional structure along the B-B' direction, Fig.11 for Fig. 9 Schematic diagram of the cross-sectional structure along the C-C' direction, as shown in Figure 9-11As shown, optionally, the packaging structure provided by the embodiment of the present invention further includes a packaging cover plate 14 , which is located on a side of the ceramic wall structure 11 away from the metal substrate 10 , and covers the cavity 13 .

[0115] Specifically, Figure 9-11 As shown, a packaging cover plate 14 is disposed on the side of the ceramic wall structure 11 facing away from the metal substrate 10, so that the packaging cover plate 14 seals the cavity 13, thereby improving the airtightness of the ceramic package.

[0116] The package cover plate 14 may be made of a ceramic material. The material of the package cover plate 14 may include at least one of aluminum oxide, aluminum nitride, beryllium oxide, boron nitride and silicon carbide, but is not limited thereto.

[0117] Optionally, the material of the packaging cover plate 14 is the same as that of the ceramic wall structure 11 , which helps to achieve a matching connection effect between the packaging cover plate 14 and the ceramic wall structure 11 .

[0118] Continue to refer Figure 9-11 Optionally, the ceramic wall structure 11 includes at least two ceramic walls 110, the at least two ceramic walls 110 and the at least two cavities 13 are arranged correspondingly, and the heights of the at least two ceramic wall structures 11 are the same.

[0119] Specifically, Fig.11 As shown, at least two ceramic walls 110 and at least two cavities 13 in the ceramic wall structure 11 can be arranged in a one-to-one correspondence, that is, the ceramic wall 110 is arranged around the corresponding cavity 13, or in other words, the cavity 13 is located in the corresponding ceramic wall 110.

[0120] In this embodiment, by setting the height H of at least two ceramic walls 110 to be the same, the cavities 13 of at least two ceramic walls 110 can share the same packaging cover plate 14 for sealing, which is also beneficial to improving the consistency of electronic component assembly and reducing the difficulty of circuit matching.

[0121] In other embodiments, if the packaging structure includes more ceramic walls 110, the heights of all the ceramic walls 110 can be set to be the same, so that one packaging cover plate 14 can be used to cover the cavities 13 of all the ceramic walls 110, so that the entire packaging structure only uses one packaging cover plate 14, further improving the consistency of electronic component assembly and reducing the difficulty of circuit matching.

[0122] In addition, all ceramic walls 110 in the packaging structure can be of the same size, that is, all ceramic walls 110 have the same size, which facilitates the manufacture of the packaging cover 14 and helps to further improve the consistency of electronic component assembly and reduce the difficulty of circuit matching.

[0123] Based on the same inventive concept, an embodiment of the present invention further provides a packaging device, Fig.12 A schematic diagram of a packaging device provided by an embodiment of the present invention is shown in FIG. Fig.12 As shown, the packaging device 30 includes the packaging structure and electronic component 31 described in any embodiment of the present invention. Therefore, the packaging device 30 provided by the embodiment of the present invention has the technical effect of the technical solution in any of the above embodiments, and the structures that are the same or corresponding to the above embodiments and the explanation of terms are no longer repeated here.

[0124] Among them, Fig.12 As shown, the electronic component 31 is located in the cavity 13 to achieve ceramic packaging of the electronic component 31. At the same time, the electronic component 31 is electrically connected to the lead 12 to achieve signal transmission between the electronic component 31 and the circuit outside the packaging structure.

[0125] It should be noted that the packaging structure can be used for at least one of a power amplifier, a microwave power device, a microwave power amplifier, a radio frequency (RF) amplifier, a radio frequency (RF) power amplifier, a radio frequency (RF) power transistor, a monolithic microwave integrated circuit (MMIC) and a radio frequency (RF) power amplifier transistor.

[0126] The electronic component 31 may include an L-band component implementing a frequency range in the radio spectrum from 1 to 2 gigahertz (GHz), an S-band component covering a frequency range from 2 to 4 GHz, an X-band component implementing a frequency range in the radio spectrum from 7.0 to 11.2 GHz, a C-band component implementing a frequency range in the radio spectrum from 500 to 1000 MHz, a Ku-band component of the electromagnetic spectrum in the microwave frequency range from 12 to 18 GHz, and at least one of a satellite communication component, a Doherty configuration component.

[0127] The electronic component 31 may also include a semiconductor chip, wherein the semiconductor chip may include an integrated circuit.

[0128] Exemplarily, the semiconductor chip may include a wide bandgap semiconductor device, an ultra-wide band device, a GaN-based device, a GaN-on-SiC device, a GaN-on-Si device, a metal semiconductor field effect transistor (MESFET), a metal oxide field effect transistor (MOSFET), a junction field effect transistor (JFET), a bipolar junction transistor (BJT), a laterally diffused metal oxide semiconductor (LDMOS), an insulated gate bipolar transistor (IGBT), a high electron mobility transistor (HEMT) or a wide bandgap (WBG) semiconductor sub-chip, etc.

[0129] It can be understood that any packaging structure provided in the embodiments of the present invention can be used for the ceramic packaging of the electronic component 31 mentioned above.

[0130] Furthermore, if Fig.12 As shown, only one electronic component 31 may be placed in one cavity 13 , but the present invention is not limited thereto.

[0131] Fig.13 A schematic diagram of the structure of another packaging device provided by an embodiment of the present invention, such as Fig.13 As shown, two or more electronic components 31 may be placed in one cavity 13 .

[0132] Different electronic components 31 in one cavity 13 may be connected to the same lead 12 or to different leads 12 , which is not specifically limited in the embodiment of the present invention.

[0133] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A packaging structure, characterized in that: It includes a metal substrate and a ceramic wall structure and a lead located on one side of the metal substrate; The ceramic wall structure comprises at least two cavities, the cavities are connected to the surface of the metal substrate close to the ceramic wall structure, and the lead is connected to the ceramic wall structure; The at least two cavities include a first cavity and a second cavity, the first cavity and the second cavity are arranged along a first direction, and the first direction is parallel to a surface of the metal substrate close to the ceramic wall structure.

2. The packaging structure according to claim 1, characterized in that: The aspect ratio of the ceramic wall structure is greater than or equal to 3.

3. The packaging structure according to claim 1, characterized in that: The first cavity and the second cavity are arranged adjacent to each other, and the shortest distance between the first cavity and the second cavity is d1, where d1≤1 mm.

4. The packaging structure according to claim 1, characterized in that: The ceramic wall structure includes at least two ceramic walls, and the at least two ceramic walls include a first ceramic wall and a second ceramic wall, the first ceramic wall and the second ceramic wall are arranged adjacent to each other, and the first ceramic wall is arranged around the first cavity, and the second ceramic wall is arranged around the second cavity; The shortest distance between the first ceramic wall and the second ceramic wall is less than or equal to 200 μm.

5. The packaging structure according to claim 1, characterized in that: The ceramic wall structure includes at least two ceramic walls, and the at least two ceramic walls include a first ceramic wall and a second ceramic wall, the first ceramic wall and the second ceramic wall are arranged adjacent to each other, and the first ceramic wall is arranged around the first cavity, and the second ceramic wall is arranged around the second cavity; The first ceramic wall comprises a first sub-wall and a second sub-wall connected to each other, and the first sub-wall is located on a side of the second sub-wall close to the second ceramic wall; The second ceramic wall includes a third sub-wall and a fourth sub-wall connected to each other, and the third sub-wall is located on a side of the fourth sub-wall close to the first ceramic wall; The thickness of the first sub-wall is smaller than the thickness of the second sub-wall, and / or the thickness of the third sub-wall is smaller than the thickness of the fourth sub-wall.

6. The packaging structure according to claim 1, characterized in that: The ceramic wall structure includes at least two ceramic walls, and the at least two ceramic walls include a first ceramic wall and a second ceramic wall, the first ceramic wall and the second ceramic wall are arranged adjacent to each other, and the first ceramic wall is arranged around the first cavity, and the second ceramic wall is arranged around the second cavity; The first ceramic wall comprises a first sub-wall and a second sub-wall connected to each other, and the first sub-wall is located on a side of the second sub-wall close to the second ceramic wall; The second ceramic wall includes a third sub-wall and a fourth sub-wall connected to each other, and the third sub-wall is located on a side of the fourth sub-wall close to the first ceramic wall; The first sub-wall and the third sub-wall are the same sub-wall structure.

7. The packaging structure according to claim 1, characterized in that: The ceramic wall structure comprises at least two ceramic walls, and the at least two ceramic walls and the at least two cavities are arranged correspondingly; The packaging structure comprises at least two leads, and the at least two leads are correspondingly connected to at least two ceramic walls; The lead includes a first sub-lead and a second sub-lead, the first sub-lead and the second sub-lead are respectively located at two opposite sides of the ceramic wall, and the arrangement direction of the first sub-lead and the second sub-lead intersects with the first direction.

8. The packaging structure according to claim 1, characterized in that: The packaging structure further includes a packaging cover plate, which is located on a side of the ceramic wall structure away from the metal substrate, and covers the cavity.

9. The packaging structure according to claim 1, characterized in that: The ceramic wall structure comprises at least two ceramic walls, and the at least two ceramic walls and the at least two cavities are arranged correspondingly; At least two of the ceramic walls have the same height.

10. A packaging device, characterized in that: It comprises the packaging structure and the electronic component according to any one of claims 1 to 9, wherein the electronic component is located in the cavity and is electrically connected to the lead.

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