Coupling cleaning nozzle
Through cleaning nozzles that couple dry ice particles and plasma, the problem that the prior art cannot be applied to water-sensitive or poorly sealed precision devices and efficient cleaning of pollutants at various levels is solved, and the substrate temperature control and efficient cleaning are achieved, reducing noise and static problems.
Patent Information
- Application Number
- CN202411749957.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2025-01-03
AI Technical Summary
The existing substrate cleaning devices cannot have the advantages of being suitable for precision devices that are sensitive to water or have poor sealing, not causing large temperature differences in the substrate, and being able to efficiently clean pollutants of various levels of thickness.
A coupled cleaning nozzle is designed to clean the surface of the substrate by combining dry ice particles and plasma. Through the design of dry ice channels and plasma channels and nozzles, the substrate temperature is controlled within a certain range to avoid thermal damage and ionic contamination, and Reduce static electricity generation through multiple nozzles and electrostatic balance rings, improving cleaning efficiency.
This coupled cleaning nozzle is suitable for precision devices with water-sensitive or poor sealing. It keeps the substrate temperature in the range of 10°C to 60°C, avoids thermal damage and ionic contamination, and efficiently removes pollutants of different thicknesses, reduces noise and reduces static problems.
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Figure CN119237187A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of substrate surface cleaning, and in particular to a coupled cleaning nozzle. Background Art
[0002] Existing devices for cleaning substrates such as printed circuit boards and semiconductor devices generally clean the surface of the substrate based on a liquid phase cleaning method, a vaporization cleaning method or a plasma cleaning method, wherein the liquid phase cleaning method cleans the substrate based on an organic solvent or aqueous solution, the vaporization cleaning method cleans the substrate based on the impact of dry ice particles on the substrate, and the plasma cleaning method cleans the substrate based on the impact of a plasma flame formed by plasma on the substrate. However, the liquid phase cleaning method is not suitable for precision devices that are sensitive to water or have poor sealing properties; dry ice will cool down rapidly during the vaporization cleaning process, which may cause the substrate temperature to drop, resulting in a large difference between the substrate temperature and the normal temperature of the substrate, resulting in the vaporization cleaning method being only suitable for scenarios where the substrate can accept a large temperature difference, and having a narrow application range; the plasma cleaning method is only suitable for quickly cleaning contaminants with a thickness of the nanometer level, and cannot efficiently clean contaminants with a thickness of the micrometer level and the millimeter level. Therefore, the existing substrate cleaning device cannot have the advantages of being suitable for precision devices that are sensitive to water or have poor sealing properties, not causing a large temperature difference in the substrate, and being able to efficiently clean contaminants of various thickness levels.
[0003] Therefore, the existing technology needs to be improved and developed. Summary of the invention
[0004] The purpose of the present application is to provide a coupled cleaning nozzle, aiming to solve the problem that the existing substrate cleaning device cannot have the advantages of being suitable for precision devices that are sensitive to water or have poor sealing, not causing large temperature differences in the substrate, and being able to efficiently clean pollutants of various layer thicknesses.
[0005] In a first aspect, the present application provides a coupled cleaning nozzle, which is installed on a substrate cleaning device, comprising: case; A dry ice channel is arranged in the shell, and one end of the channel is used to place dry ice particles; A first plasma channel, disposed in the housing, one end of which is used to pass plasma; The first nozzle is arranged on the shell and is connected with the other end of the dry ice channel and the other end of the first plasma channel.
[0006] The coupled cleaning nozzle provided in the present application is suitable for precision devices that are sensitive to water or have poor sealing properties, and the coupled cleaning nozzle of the present application can keep the temperature of the substrate within a certain temperature range, thereby avoiding thermal damage, thermal deformation stress or ion contamination caused by excessively high or low substrate temperature, and the coupled cleaning nozzle of the present application can efficiently remove a variety of contaminants of different thicknesses on the surface of the substrate.
[0007] Optionally, the coupled cleaning nozzle further comprises: A second plasma channel is disposed in the housing, one end of which is used to pass plasma; A plurality of second nozzles are arranged on the shell in a circular array with the axis of the first nozzle as the axis center, and are communicated with the other end of the second plasma channel.
[0008] Optionally, the coupled cleaning nozzle further comprises: A third plasma channel is provided on the housing, one end of which is used for introducing plasma; The electrostatic balance ring is arranged on the shell with the axis of the first nozzle as the axis, is connected with the other end of the third plasma channel, and has a plurality of third nozzles arranged in a circular array with the axis of the first nozzle as the axis center.
[0009] Optionally, the coupled cleaning nozzle further comprises: The hot air channel is arranged on the shell, one end of which is used for introducing hot air, and the other end of which is connected with the third nozzle.
[0010] Optionally, an inner wall of a middle portion of the dry ice channel contracts toward the first nozzle.
[0011] In this embodiment, the present application can reduce the noise generated by the high-speed airflow and the noise generated by the dry ice particles impacting the substrate surface.
[0012] Optionally, the contraction angle range of the inner wall in the middle of the dry ice channel is [5°, 20°].
[0013] In this embodiment, the coupled cleaning nozzle of the present application is set with a contraction angle range, which can reduce the noise generated by the high-speed airflow and the noise generated by the dry ice particles impacting the substrate surface while ensuring that the dry ice particles are in full contact with the substrate surface.
[0014] Optionally, the ejection end of the first nozzle is a sawtooth structure.
[0015] Optionally, a negative pressure extraction opening is provided on one side of the first nozzle; The coupled cleaning nozzle is connected with a negative pressure extraction mechanism; One side of the shell is provided with a negative pressure extraction interface, one end of the negative pressure extraction interface is communicated with the negative pressure extraction opening, and the other end is connected with the negative pressure extraction mechanism.
[0016] Optionally, the coupled cleaning nozzle further comprises: The confluence channel is arranged in the shell, and the dry ice channel and the first plasma channel are connected with the first nozzle through the confluence channel.
[0017] Optionally, there are multiple first plasma channels and one-to-one corresponding confluence channels, and the multiple first plasma channels are respectively connected to the first nozzle through the multiple confluence channels; The coupled cleaning nozzle includes: A plurality of shunt channels are arranged in the shell, one end of which is connected with the other end of the dry ice channel, and the other end of which is connected with the other end of the plurality of first plasma channels in a one-to-one correspondence.
[0018] From the above, it can be seen that the present application provides a coupled cleaning nozzle, which is suitable for precision devices that are sensitive to water or have poor sealing, and the coupled cleaning nozzle of the present application can keep the temperature of the substrate within a certain temperature range, thereby avoiding thermal damage, thermal deformation stress or ion contamination caused by the substrate temperature being too high or too low, and the coupled cleaning nozzle of the present application can efficiently remove a variety of contaminants of different thicknesses on the surface of the substrate.
[0019] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or be understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the written description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 A schematic diagram of the structure of a coupled cleaning nozzle provided in an embodiment of the present application.
[0021] Figure 2 A cross-sectional view of a coupled cleaning nozzle provided in an embodiment of the present application.
[0022] Figure 3 This is an enlarged view of point A in the cross-sectional view of a coupled cleaning nozzle provided in an embodiment of the present application.
[0023] Figure 4 This is an enlarged view of point B in the cross-sectional view of a coupled cleaning nozzle provided in an embodiment of the present application.
[0024] Figure 5 A schematic structural diagram of a coupled cleaning nozzle and a substrate cleaning device provided in an embodiment of the present application.
[0025] Figure 6 A schematic structural diagram of a coupled cleaning nozzle and a negative pressure extraction mechanism provided in an embodiment of the present application.
[0026] Explanation of reference numerals: 1. Shell; 11. First nozzle; 12. Second nozzle; 13. Third plasma channel; 14. Third nozzle; 15. Hot air channel; 16. Negative pressure extraction opening; 17. Negative pressure extraction interface; 18. Mounting portion; 2. Dry ice channel; 3. First plasma channel; 4. Second plasma channel; 5. Converging channel; 6. Electrostatic balance ring; 7. Diverting channel; 8. Through hole; 10. Substrate cleaning device; 20. Negative pressure extraction mechanism. DETAILED DESCRIPTION
[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.
[0028] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0029] First, as Figure 1 and Figure 2 As shown, the present application provides a coupled cleaning nozzle, which is installed on a substrate cleaning device 10, including: Shell 1; A dry ice channel 2 is provided in the housing 1, one end of which is used for placing dry ice particles; A first plasma channel 3 is arranged in the housing 1, one end of which is used to pass plasma; The first nozzle 11 is disposed on the housing 1 and is connected to the other end of the dry ice channel 2 and the other end of the first plasma channel 3 .
[0030] Specifically, when the surface of the substrate needs to be cleaned, the first nozzle 11 is aimed at the surface of the substrate, dry ice particles are input into one end of the dry ice channel 2, and plasma is input into one end of the first plasma channel 3, so that the dry ice particles and plasma are ejected from the first nozzle 11 together to clean the surface of the substrate. At this time, the dry ice particles quickly impact the surface of the substrate, quickly absorb heat and sublimate into carbon dioxide gas. This process can make the pollutants on the surface of the substrate become brittle and peel off from the surface of the substrate; and the high-energy particles in the plasma can react with the pollutants on the surface of the object, and remove the pollutants with smaller thickness that are difficult to remove with dry ice through ion impact, dissociation, oxidation, reduction, etc.
[0031] More specifically, the cleaning method based on dry ice and plasma does not use liquid to clean the surface of the substrate, and is suitable for precision devices that are sensitive to water or have poor sealing. In addition, dry ice and plasma can efficiently remove a variety of contaminants of different thicknesses on the surface of the substrate.
[0032] In addition, in the scenario of cleaning the substrate based on the existing dry ice cleaning method, the substrate will cool down rapidly when the dry ice particles impact the surface of the substrate, which may cause the water vapor in the air to liquefy, while the pollutants in the air in the form of ions remain on the surface of the substrate after cleaning along with the water vapor, resulting in ion contamination, and may damage precision devices that are sensitive to water or have poor sealing; and in the scenario of cleaning the substrate based on the existing plasma cleaning method, the temperature of the plasma flame is generally higher than 200°C, and it may cause thermal damage and thermal deformation stress after impacting the surface of the substrate; and when the coupled cleaning nozzle of the present application is used to clean the surface of the substrate based on dry ice particles and plasma, the average temperature of the fluid used to clean the surface of the substrate is generally between 10°C and 60°C. When the dry ice particles and plasma are evenly distributed in the fluid, the dry ice particles and plasma keep the surface of the substrate as a whole at 10°C to 60°C so that the substrate does not produce a large temperature difference. Therefore, the coupled cleaning nozzle of the present application is used to clean the surface of the substrate, which can keep the temperature of the substrate within a certain temperature range, thereby avoiding the substrate temperature being too high or too low to cause thermal damage, thermal deformation stress or ion contamination.
[0033] The coupled cleaning nozzle of the present application is suitable for precision devices that are sensitive to water or have poor sealing, and the coupled cleaning nozzle of the present application can keep the temperature of the substrate within a certain temperature range, thereby avoiding thermal damage, thermal deformation stress or ion contamination caused by excessively high or low substrate temperature, and the coupled cleaning nozzle of the present application can efficiently remove a variety of contaminants of different thicknesses on the surface of the substrate.
[0034] Preferably, one end of the dry ice channel 2 is also used for placing an antistatic agent.
[0035] Specifically, existing dry ice cleaning methods may generate dry ice friction static electricity, which is not suitable for electrostatic sensitive devices. Therefore, in this embodiment, the coupled cleaning nozzle of the present application can reduce static electricity generation based on the antistatic agent when the plasma sprayed by the first nozzle 11 activates the antistatic agent, and is suitable for electrostatic sensitive devices.
[0036] In some preferred embodiments, the coupled cleaning nozzle further comprises: A second plasma channel 4 is arranged in the housing 1, and one end of the second plasma channel 4 is used for introducing plasma; A plurality of second nozzles 12 are arranged in a circular array on the housing 1 with the axis of the first nozzle 11 as the axis center, and are connected to the other end of the second plasma channel 4 .
[0037] Specifically, the existing dry ice cleaning method may generate dry ice friction static electricity and is not suitable for electrostatic sensitive devices. When the coupled cleaning nozzle based on this embodiment is used to clean the surface of the substrate, the plasma ejected from the second nozzle 12 can cooperate with the plasma ejected from the first nozzle 11 to balance the static charge generated near the first nozzle 11, thereby reducing the generation of static electricity.
[0038] In this embodiment, the coupled cleaning nozzle of the present application is provided with a second nozzle 12, which can reduce the generation of static electricity and is suitable for electrostatically sensitive devices.
[0039] Preferably, the height of the first nozzle 11 is greater than that of the second nozzle 12 , and the diameter of the outlet thereof is greater than the diameter of the outlet of the second nozzle 12 .
[0040] In some preferred embodiments, the coupled cleaning nozzle further comprises: A third plasma channel 13 is provided on the housing 1, one end of which is used for introducing plasma; The electrostatic balance ring 6 is arranged on the housing 1 with the axis of the first nozzle 11 as the axis, and is connected to the other end of the third plasma channel 13. It has a plurality of third nozzles 14 arranged in a circular array with the axis of the first nozzle 11 as the axis center.
[0041] In this embodiment, the coupled cleaning nozzle of the present application is provided with an electrostatic balance ring 6 having a third nozzle 14, which can eject plasma during the substrate cleaning process based on the electrostatic balance ring 6 which can be equivalent to a ring-shaped ion wind snake, thereby generating positive and negative ions to cooperate with the plasma ejected from the first nozzle 11 to balance the static charge generated near the first nozzle 11, thereby reducing the generation of static electricity, and is suitable for electrostatic sensitive devices.
[0042] Preferably, the electrostatic balance ring 6 is made of metal.
[0043] Preferably, the electrostatic balance ring 6 is disposed around the plurality of second nozzles 12 .
[0044] In some preferred embodiments, the coupled cleaning nozzle further comprises: The hot air channel 15 is provided on the housing 1 , one end of which is used for introducing hot air, and the other end of which is connected to the third nozzle 14 .
[0045] In this embodiment, the coupled cleaning nozzle of the present application is provided with a hot air channel 15, which can enable the hot air to carry the plasma and be ejected from the third nozzle 14, so that the plasma can impact the surface of the substrate at a higher moving speed so as to react more fully with the pollutants on the surface of the substrate, and can further prevent the generation of condensed water on the surface of the substrate due to excessively low temperature, thereby causing ion contamination.
[0046] like Figure 3 As shown, in some preferred embodiments, the inner wall of the middle portion of the dry ice channel 2 shrinks toward the first nozzle 11 .
[0047] Specifically, since the inner wall in the middle of the dry ice channel 2 contracts toward the first nozzle 11, the speed of the high-speed airflow used to spray dry ice particles will increase when passing through the middle of the dry ice channel 2, and the impact force of the dry ice particles on the surface of the substrate will increase accordingly. Therefore, in this embodiment, the present application can increase the impact force of the dry ice particles on the surface of the substrate to better remove pollutants on the surface of the substrate.
[0048] In some preferred embodiments, the contraction angle of the inner wall in the middle of the dry ice channel 2 is in the range of [5°, 20°].
[0049] Specifically, the greater the contraction angle of the inner wall at the connection between the first nozzle 11 and the dry ice channel 2, the greater the speed of the high-speed airflow used to spray the dry ice particles when passing through the middle of the dry ice channel 2, and the greater the impact force of the dry ice particles on the surface of the substrate. However, in order to ensure that the process of the dry ice particles impacting the surface of the substrate and the high-speed airflow do not generate too much noise, it is necessary to prevent the speed of the high-speed airflow used to spray the dry ice particles from being too fast. Therefore, in this embodiment, the coupled cleaning nozzle of the present application is set with a contraction angle range, which can increase the impact force of the dry ice particles on the surface of the substrate to better remove pollutants on the surface of the substrate on the basis of ensuring that the process of the dry ice particles impacting the surface of the substrate and the high-speed airflow do not generate too much noise.
[0050] Preferably, the contraction angle range of the inner wall at the connection between the first nozzle 11 and the dry ice channel 2 is [5°, 15°].
[0051] like Figure 4 As shown, in some preferred embodiments, the ejection end of the first nozzle 11 is a sawtooth structure.
[0052] Specifically, similar to the technical means and technical effects of reducing jet noise based on serrated nozzles in the aviation field, in this embodiment, the coupled cleaning nozzle of the present application sets the ejection end of the first nozzle 11 to a serrated structure, which can make the mixing starting point between the high-speed airflow in the first nozzle 11 and the low-speed airflow outside the shell 1 circumferentially uneven, and can suppress the mixing of the airflow in the first nozzle 11 with the airflow outside the shell 1, thereby effectively reducing the noise generated when the high-speed airflow is mixed with the airflow outside the shell 1.
[0053] like Figure 6 As shown, in some preferred embodiments, a negative pressure extraction opening 16 is provided on one side of the first nozzle 11; The coupled cleaning nozzle is connected to a negative pressure extraction mechanism 20; A negative pressure extraction interface 17 is provided on one side of the housing 1 , one end of the negative pressure extraction interface 17 is communicated with the negative pressure extraction opening 16 , and the other end is connected to the negative pressure extraction mechanism 20 .
[0054] In this embodiment, the coupled cleaning nozzle negative pressure extraction structure of the present application is provided with a negative pressure extraction opening 16 and a negative pressure extraction interface 17, which can extract negative pressure based on the negative pressure extraction mechanism 20 based on the negative pressure extraction opening 16 during the substrate cleaning process, so that dry ice particles and pollutants can be collected by the negative pressure extraction mechanism 20 through the negative pressure extraction opening 16 based on the airflow generated by the negative pressure extraction mechanism 20, thereby preventing pollutants and dry ice particles from impacting and contaminating the substrate cleaning device 10.
[0055] In some preferred embodiments, the coupled cleaning nozzle further comprises: The confluence channel 5 is disposed in the housing 1 , and the dry ice channel 2 and the first plasma channel 3 are connected to the first nozzle 11 through the confluence channel 5 .
[0056] In this embodiment, the coupled cleaning nozzle of the present application is provided with a confluence channel 5, which can fully utilize the internal space of the shell 1, and facilitate the dry ice particles and plasma to be fully mixed and ejected together from the first nozzle 11.
[0057] Preferably, the other end of the first plasma channel 3 narrows toward the first nozzle 11 .
[0058] In this embodiment, the coupled cleaning nozzle of the present application can make the plasma merge with the dry ice particles after the flow rate increases, so as to facilitate the full mixing of the dry ice particles and the plasma.
[0059] In some preferred embodiments, there are multiple first plasma channels 3 and one-to-one corresponding first plasma channels 3, and multiple first plasma channels 3 are connected to the first nozzle 11 through multiple convergence channels 5 respectively; The coupled cleaning nozzle also includes: A plurality of shunt channels 7 are arranged in the housing 1 , one end of which is connected to the other end of the dry ice channel 2 , and the other end of which is connected to the other end of the plurality of first plasma channels 3 in a one-to-one correspondence.
[0060] In this embodiment, the coupled cleaning nozzle of the present application is provided with a plurality of converging channels 5 and a plurality of diverting channels 7, so that the diverted dry ice particles can converge with the plasma from a plurality of different converging channels 5, thereby enabling the dry ice and the plasma to be further evenly mixed.
[0061] Preferably, there are a plurality of first plasma channels 3 and second plasma channels 4; A plurality of first plasma channels 3 and a plurality of second plasma channels 4 are alternately arranged around the dry ice channel 2 .
[0062] In this embodiment, the coupled cleaning nozzle of the present application can make full use of the internal space of the housing 1, so that the dry ice particles and the plasma are evenly mixed and ejected from the first nozzle 11, thereby better controlling the substrate temperature within a certain range and facilitating the plasma to surround the first nozzle 11 and eject from the second nozzle 12. Figure 5 As shown, preferably, one side of the housing 1 has a mounting portion 18 , and the coupled cleaning nozzle is mounted on the substrate cleaning device 10 based on the mounting portion 18 .
[0063] In this embodiment, the coupled cleaning nozzle of the present application is provided with a mounting portion 18 , which enables the coupled cleaning nozzle to be easily mounted on the substrate cleaning device 10 .
[0064] Preferably, the coupled cleaning nozzle is connected to a plasma generating mechanism (not shown); The bottom of the housing 1 has a through hole 8; One end of the first plasma channel 3 and one end of the second plasma channel 4 are connected to the plasma generating mechanism via a pipeline (not shown) passing through the through hole 8 .
[0065] Specifically, the plasma generating mechanism may be an existing mechanism capable of generating plasma, such as a plasma generator.
[0066] From the above, it can be seen that the present application provides a coupled cleaning nozzle, which is suitable for precision devices that are sensitive to water or have poor sealing, and the coupled cleaning nozzle of the present application can keep the temperature of the substrate within a certain temperature range, thereby avoiding thermal damage, thermal deformation stress or ion contamination caused by the substrate temperature being too high or too low, and the coupled cleaning nozzle of the present application can efficiently remove a variety of contaminants of different thicknesses on the surface of the substrate.
[0067] In the embodiments provided in the present application, it should be understood that the disclosed device can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interface, the indirect coupling or communication connection of the device or unit can be electrical, mechanical or other forms.
[0068] In addition, the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0069] Furthermore, the functional modules in the various embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.
[0070] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any such actual relationship or order between these entities or operations.
[0071] The above description is only an embodiment of the present application and is not intended to limit the protection scope of the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A coupled cleaning nozzle, mounted on a substrate cleaning device (10), characterized in that: include: Housing (1); A dry ice channel (2) is arranged in the housing (1), one end of which is used to place dry ice particles; A first plasma channel (3) is arranged in the housing (1), one end of which is used to pass plasma; A first nozzle (11) is arranged on the housing (1) and is connected to the other end of the dry ice channel (2) and the other end of the first plasma channel (3).
2. The coupled cleaning nozzle according to claim 1, characterized in that: The coupled cleaning nozzle also includes: A second plasma channel (4) is arranged in the housing (1), one end of which is used to pass plasma; A plurality of second nozzles (12) are arranged on the housing (1) in a circular array with the axis of the first nozzle (11) as the axis center, and are connected to the other end of the second plasma channel (4).
3. The coupled cleaning nozzle according to claim 1, characterized in that: The coupled cleaning nozzle also includes: A third plasma channel (13), arranged on the housing (1), one end of which is used for introducing plasma; An electrostatic balance ring (6) is arranged on the housing (1) with the axis of the first nozzle (11) as the axis, is connected to the other end of the third plasma channel (13), and has a plurality of third nozzles (14) arranged in a circular array with the axis of the first nozzle (11) as the axis.
4. The coupled cleaning nozzle according to claim 3, characterized in that: The coupled cleaning nozzle also includes: A hot air channel (15) is provided on the housing (1), one end of which is used for introducing hot air, and the other end of which is connected to the third nozzle (14).
5. The coupled cleaning nozzle according to claim 1, characterized in that: The inner wall in the middle of the dry ice channel (2) contracts towards the first nozzle (11).
6. The coupled cleaning nozzle according to claim 5, characterized in that: The contraction angle range of the inner wall in the middle of the dry ice channel (2) is [5°, 20°].
7. The coupled cleaning nozzle according to claim 1, characterized in that: The spraying end of the first nozzle (11) is a sawtooth structure.
8. The coupled cleaning nozzle according to claim 1, characterized in that: A negative pressure extraction opening (16) is provided on one side of the first nozzle (11); The coupled cleaning nozzle is connected to a negative pressure extraction mechanism (20); One side of the housing (1) is provided with a negative pressure extraction interface (17), one end of the negative pressure extraction interface (17) is in communication with the negative pressure extraction opening (16), and the other end is connected to the negative pressure extraction mechanism (20).
9. The coupled cleaning nozzle according to claim 8, characterized in that: The coupled cleaning nozzle also includes: A confluence channel (5) is arranged in the housing (1), and the dry ice channel (2) and the first plasma channel (3) are connected to the first nozzle (11) through the confluence channel (5).
10. The coupled cleaning nozzle according to claim 9, characterized in that: The number of the first plasma channels (3) and the confluence channels (5) is multiple and corresponds one to one, and the multiple first plasma channels (3) are respectively connected to the first nozzle (11) through the multiple confluence channels (5); The coupled cleaning nozzle also includes: A plurality of shunt channels (7) are arranged in the housing (1), one end of which is connected to the other end of the dry ice channel (2), and the other end of which is connected to the other end of the plurality of first plasma channels (3) in a one-to-one correspondence.
Citation Information
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