Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel includes: a substrate including a conductive layer and a via hole exposing a portion of the conductive layer; the isolation structure is located on the side, provided with the via holes, of the substrate, and the isolation structure comprises a plurality of isolation openings; the light-emitting units comprise a plurality of light-emitting devices, the light-emitting devices are at least partially located in the isolation openings, each light-emitting device comprises a first electrode layer, the first electrode layers extend into the via holes and are in contact with the conductive layer, and the light-emitting devices comprise first light-emitting devices; the packaging layer is located on the side, away from the substrate, of the isolation structure, and the packaging layer comprises a plurality of first packaging parts; the orthographic projection of the first packaging part on the substrate covers the orthographic projection of the first light-emitting device on the substrate; wherein in at least part of adjacent light emitting units, the orthographic projection of the first packaging part on the substrate covers the orthographic projection of at least one via hole on the substrate.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] With the development of display technology, organic light emitting diode (OLED) display products have occupied the high-end display product market in recent years due to their excellent picture quality and wide application scenarios. OLED display panels have the advantages of being thin, light, flexible, high contrast, and wide color gamut, and have gradually occupied a place in the field of small-size displays. As a result, users' demand for the display performance of OLED display panels has also increased. Summary of the invention

[0003] In view of this, embodiments of the present application provide a display panel, a method for manufacturing the same, and a display device.

[0004] In a first aspect, the present application provides a display panel, comprising:

[0005] A substrate, comprising a conductive layer and a via hole, wherein the via hole exposes a portion of the conductive layer;

[0006] An isolation structure is located on a side of the substrate having the via hole, and the isolation structure includes a plurality of isolation openings;

[0007] A plurality of light-emitting unit groups, each light-emitting unit group comprising a plurality of light-emitting devices, wherein the light-emitting devices are at least partially located in the isolation openings, the light-emitting devices comprising a first electrode layer, the first electrode layer extending into the via holes and contacting the conductive layer, and the plurality of light-emitting devices including a first light-emitting device;

[0008] The encapsulation layer is located on a side of the isolation structure away from the substrate, and the encapsulation layer includes a plurality of first encapsulation parts; the orthographic projection of the first encapsulation part on the substrate covers the orthographic projection of the first light-emitting device on the substrate;

[0009] Among them, in at least some adjacent light-emitting unit groups, the first packaging part extends outward from the isolation opening and is connected to the isolation structure on a side away from the substrate, and the orthographic projection of the first packaging part on the substrate covers the orthographic projection of at least one via on the substrate.

[0010] In one embodiment, the first light-emitting device includes a first light-emitting functional layer and a second electrode layer which are stacked, and the first light-emitting functional layer is located on a side of the second electrode layer close to the substrate;

[0011] In at least some adjacent light-emitting unit groups, the first light-emitting functional layer extends outward from the isolation opening and is connected to the side of the isolation structure facing away from the substrate, and the orthographic projection of the first light-emitting functional layer on the substrate covers the orthographic projection of at least one via hole on the substrate; and / or, the second electrode layer extends outward from the isolation opening and is connected to the side of the isolation structure facing away from the substrate, and the orthographic projection of the second electrode layer on the substrate covers the orthographic projection of at least one via hole on the substrate;

[0012] Preferably, the first electrode layer is located between the substrate and the isolation structure, and is at least partially exposed to the isolation opening;

[0013] Preferably, the orthographic projection of the isolation structure on the plane where the substrate is located covers the orthographic projection of the via hole on the plane where the substrate is located.

[0014] In one embodiment, the plurality of light emitting devices further comprises: a second light emitting device and a third light emitting device;

[0015] The encapsulation layer further includes a second encapsulation portion and a third encapsulation portion, wherein the orthographic projection of the second encapsulation portion on the substrate covers the orthographic projection of the second light-emitting device on the substrate, and the orthographic projection of the third encapsulation portion on the substrate covers the orthographic projection of the third light-emitting device on the substrate.

[0016] In one embodiment, the orthographic projection of the second packaging portion on the substrate covers the orthographic projection of at least one via hole on the substrate; and / or,

[0017] The orthographic projection of the third packaging portion on the substrate covers the orthographic projection of at least one via hole on the substrate.

[0018] In one embodiment, the second light-emitting device includes a second light-emitting functional layer and a third electrode layer which are stacked, and the second light-emitting functional layer is located on a side of the third electrode layer close to the substrate;

[0019] The orthographic projection of the second light-emitting functional layer on the substrate covers the orthographic projection of at least one via hole on the substrate; and / or the orthographic projection of the third electrode layer on the substrate covers the orthographic projection of at least one via hole on the substrate.

[0020] In one embodiment, the third light-emitting device includes a third light-emitting functional layer and a fourth electrode layer which are stacked, and the third light-emitting functional layer is located on a side of the fourth electrode layer close to the substrate;

[0021] The orthographic projection of the third light-emitting functional layer on the substrate covers the orthographic projection of at least one via hole on the substrate; and / or the orthographic projection of the fourth electrode layer on the substrate covers the orthographic projection of at least one via hole on the substrate.

[0022] In one embodiment, in the same light emitting unit group, the second light emitting device and the third light emitting device are located on the same side of the first light emitting device.

[0023] In one embodiment, one light-emitting device corresponds to one via hole, and the via hole is located on a side of the first light-emitting device close to the second light-emitting device and the third light-emitting device, or the via hole is located between the second light-emitting device and the third light-emitting device, or the via hole corresponding to the first light-emitting device is located on a side of the first light-emitting device close to the second light-emitting device and the third light-emitting device, and the via hole corresponding to the second light-emitting device and the third light-emitting device is located between the second light-emitting device and the third light-emitting device.

[0024] In one embodiment, the light emitting unit group is arranged along a first direction and a second direction, and the first direction intersects the second direction; in the same light emitting unit group, the second light emitting device and the third light emitting device are arranged along the second direction, and in the first direction, the second light emitting device and the third light emitting device are located on one side of the first light emitting device;

[0025] Preferably, in the second direction, in at least some of the adjacent light-emitting unit groups, the first encapsulation portion extends outward from the isolation opening and is connected to the isolation structure at a side facing away from the substrate;

[0026] Preferably, the first direction and the second direction are perpendicular to each other.

[0027] In one embodiment, the first light emitting device includes a first sub-light emitting device and a second sub-light emitting device arranged along the second direction, and the first sub-light emitting device and the second sub-light emitting device correspond to the same via hole;

[0028] Preferably, in the same light emitting unit group, the via hole is located on a side of the first light emitting device close to the second light emitting device, or the via hole is located on a side of the third light emitting device close to the first light emitting device and the second light emitting device.

[0029] In one embodiment, the isolation structure includes a first portion and a second portion stacked together, the first portion is located on a side of the second portion facing away from the substrate, and an orthographic projection of the second portion on the substrate is located within an orthographic projection of the first portion on the substrate;

[0030] Preferably, the isolation structure further comprises a third portion, which is located on a side of the second portion close to the substrate, and an orthographic projection of the second portion on the substrate is located within a range of an orthographic projection of the third portion on the substrate.

[0031] In one embodiment, the display panel further includes: a pixel defining layer located between the substrate and the isolation structure, wherein the orthographic projection of the pixel defining layer on the plane where the substrate is located covers the orthographic projection of the via on the plane where the substrate is located;

[0032] Preferably, the substrate further comprises a substrate and a planarization layer, the substrate is located on a side of the planarization layer away from the pixel defining layer, and the planarization layer has a via hole;

[0033] Preferably, the encapsulation layer comprises an inorganic material.

[0034] A second aspect of the present application provides a display panel, including:

[0035] A substrate, comprising a conductive layer and a via hole, wherein the via hole exposes a portion of the conductive layer;

[0036] An isolation structure, located on a side of the substrate having the via hole, the isolation structure comprising a plurality of isolation openings;

[0037] A plurality of light-emitting unit groups, each light-emitting unit group comprising a plurality of light-emitting devices, wherein the light-emitting devices are at least partially located in the isolation openings, the light-emitting devices comprising a first electrode layer, the first electrode layer extending into the via holes and contacting the conductive layer, and the plurality of light-emitting devices including a first light-emitting device;

[0038] The encapsulation layer is located on the side of the isolation structure away from the substrate, and the encapsulation layer includes multiple first encapsulation parts; the first encapsulation parts are mesh structures, and the orthographic projections of the first encapsulation parts on the substrate cover the orthographic projections of multiple first light-emitting devices on the substrate and the orthographic projection of at least one via on the substrate.

[0039] A third aspect of the present application provides a method for preparing a display panel, comprising:

[0040] Providing a substrate having a conductive layer and a via hole, wherein the via hole exposes a portion of the conductive layer;

[0041] A first electrode layer is prepared on a side of the substrate having a via hole, wherein the first electrode layer extends into the via hole and contacts the conductive layer;

[0042] Prepare an isolation structure on a side of the first electrode layer facing away from the substrate, wherein the isolation structure includes a plurality of isolation openings;

[0043] Sequentially preparing a first light-emitting functional layer and a second electrode layer in the isolation opening to obtain a first light-emitting device in a plurality of light-emitting unit groups;

[0044] Preparing an encapsulation layer including a plurality of first encapsulation parts on a side of the isolation structure away from the substrate, wherein the orthographic projection of the first encapsulation part on the substrate covers the orthographic projection of the first light-emitting device on the substrate;

[0045] Among them, in at least some adjacent light-emitting unit groups, the first packaging part extends outward from the isolation opening and is connected to the isolation structure on a side away from the substrate, and the orthographic projection of the first packaging part on the substrate covers the orthographic projection of at least one via on the substrate.

[0046] In one embodiment, sequentially preparing a first light-emitting functional layer and a second electrode layer in the isolation opening includes:

[0047] A first light-emitting functional material layer and a second conductive layer are sequentially prepared on a side of the isolation structure away from the substrate, wherein the orthographic projections of the first light-emitting functional material layer and the second conductive layer on the substrate cover the orthographic projections of the isolation opening and the isolation structure on the substrate;

[0048] Performing patterning on the second conductive layer and the first light-emitting functional material layer, removing the first light-emitting functional material layer and the second conductive layer at the isolation opening positions corresponding to the second light-emitting device and the third light-emitting device, and obtaining the first light-emitting device;

[0049] In the same light emitting unit group, the second light emitting device and the third light emitting device are located on the same side of the first light emitting device.

[0050] A fourth aspect of the present application provides a display device, comprising the above-mentioned display panel, or comprising a display panel prepared by the above-mentioned preparation method.

[0051] According to the display panel provided in the embodiment of the present application, between two adjacent light-emitting unit groups, the first packaging part is connected to each other on the side of the isolation structure facing away from the substrate, which is beneficial to reducing the suspension between the first packaging part and the isolation structure, and effectively reducing the risk of peeling of the first packaging part; at the same time, the first packaging part covers at least one via hole, which can effectively protect the first electrode layer in the via hole from corrosion, thereby avoiding failure of the light-emitting device and improving the manufacturing yield of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 The figure is a schematic diagram of a top view of the structure of a display panel in one embodiment of the present application.

[0053] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure of the display panel along the AA' direction.

[0054] Figure 3 This is a schematic diagram of a top view of the structure of a display panel in another embodiment of the present application.

[0055] Figure 4 for Figure 3 A schematic diagram of a cross-sectional structure of a display panel along the BB' direction.

[0056] Figure 5 for Figure 3 Another schematic diagram of the cross-sectional structure of the display panel along the BB' direction is shown in FIG.

[0057] Figure 6 This is a schematic diagram of a top view of the structure of a display panel in another embodiment of the present application.

[0058] Figure 7 This is a schematic diagram of a top view of the structure of a display panel in another embodiment of the present application.

[0059] Figure 8 This is a schematic diagram of a top view of the structure of a display panel in another embodiment of the present application.

[0060] Fig. 9This is a schematic diagram of a top view of the structure of a display panel in another embodiment of the present application.

[0061] Fig.10 This is a schematic diagram of a top view of the structure of a display panel in another embodiment of the present application.

[0062] Fig.11 for Figure 3 Another schematic diagram of the cross-sectional structure of the display panel along the BB' direction is shown in FIG.

[0063] Fig.12 This is a schematic diagram of the cross-sectional structure of an isolation structure according to an embodiment of the present application.

[0064] Fig.13 This is a schematic cross-sectional view of an isolation structure according to another embodiment of the present application.

[0065] Fig.14 This is a schematic cross-sectional view of an isolation structure according to another embodiment of the present application.

[0066] Fig.15 The figure is a schematic flow chart of a method for preparing a display panel in one embodiment of the present application. DETAILED DESCRIPTION

[0067] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0068] In addition, in order to better illustrate the present application, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods and means well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.

[0069] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0070] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0071] The present application provides a display panel according to a first aspect. Figures 1 to 4The structural schematic diagram of the display panel shown in the figure, the display panel includes: a substrate 100, including a conductive layer 110 and a via hole 120, the via hole 120 exposing a portion of the conductive layer 110; an isolation structure 200, located on a side of the substrate 100 having the via hole 120, the isolation structure 200 having a plurality of isolation openings 210; a plurality of light-emitting unit groups 300, the light-emitting unit groups 300 including a plurality of light-emitting devices 310, the light-emitting devices 310 at least partially located in the isolation openings 210, the light-emitting devices 310 including a first electrode layer 301, the first electrode layer 301 extending into the via hole 120 and in contact with the conductive layer 110, the plurality of light-emitting devices 310 includes a first light-emitting device 311; a packaging layer 400, which is located on the side of the isolation structure 200 away from the substrate 100, and the packaging layer 400 includes a plurality of first packaging parts 410; the orthographic projection of the first packaging part 410 on the substrate 100 covers the orthographic projection of the first light-emitting device 311 on the substrate 100; wherein, in at least some adjacent light-emitting unit groups 300, the first packaging part 410 extends outward from the isolation opening 210 and is connected on the side of the isolation structure 200 away from the substrate 100, and the orthographic projection of the first packaging part 410 on the substrate 100 covers the orthographic projection of at least one via 120 on the substrate 100.

[0072] It should be noted that the light emitting unit group 300 includes the light emitting device 310 located in the isolation opening 210 , and also includes the light emitting device 310 located outside the isolation opening 210 .

[0073] According to the display panel provided in the embodiment of the present application, between two adjacent light-emitting unit groups 300, the first packaging part 410 is interconnected on the side of the isolation structure 200 facing away from the substrate 100, which is beneficial to reduce the suspension between the first packaging part 410 and the isolation structure 200, and effectively reduce the risk of peeling of the first packaging part 410; at the same time, the first packaging part 410 covers at least one via 120, which can effectively protect the first electrode layer 301 in the via 120 from corrosion, thereby avoiding failure of the light-emitting device 310 and improving the manufacturing yield of the display panel.

[0074] In one embodiment, in the same light emitting unit group 300 , the orthographic projection of the first encapsulation part 410 on the substrate 100 covers the orthographic projections of all via holes 120 on the substrate 100 .

[0075] In one embodiment, the first light-emitting device 311 includes a first light-emitting functional layer 302 and a second electrode layer 303 which are stacked, and the first light-emitting functional layer 302 is located on a side of the second electrode layer 303 close to the substrate 100; in at least some adjacent light-emitting unit groups 300, the first light-emitting functional layer 302 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 facing away from the substrate 100, and the orthographic projection of the first light-emitting functional layer 302 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. In another embodiment, in at least some adjacent light-emitting unit groups 300, the second electrode layer 303 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 facing away from the substrate 100, and the orthographic projection of the second electrode layer 303 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. In another embodiment, in at least some adjacent light-emitting unit groups 300, the first light-emitting functional layer 302 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 facing away from the substrate 100, and the orthographic projection of the first light-emitting functional layer 302 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100; and the second electrode layer 303 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 facing away from the substrate 100, and the orthographic projection of the second electrode layer 303 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. Thus, the first light-emitting functional layer 302 and / or the second electrode layer 303 can effectively protect the first electrode layer 301 in the via hole, further reducing the risk of failure of the light-emitting unit group.

[0076] In one embodiment, the first electrode layer 301 is located between the substrate 100 and the isolation structure 200 , and is at least partially exposed to the isolation opening 210 .

[0077] In one embodiment, referring to Figure 5 In the structural diagram of the display panel shown in FIG. 1 , the orthographic projection of the isolation structure 200 on the plane where the substrate 100 is located covers the orthographic projection of the via hole 120 on the plane where the substrate 100 is located. Thus, the isolation structure 200 can effectively protect the first electrode layer 301 in the via hole, further reducing the risk of failure of the light-emitting unit group.

[0078] In one embodiment, referring to Figure 6 In the schematic diagram of the top view of the display panel shown, the plurality of light-emitting devices 310 further include: a second light-emitting device 312 and a third light-emitting device 313; the encapsulation layer 400 further includes a second encapsulation portion 420 and a third encapsulation portion 430, the orthographic projection of the second encapsulation portion 420 on the substrate 100 covers the orthographic projection of the second light-emitting device 312 on the substrate 100, and the orthographic projection of the third encapsulation portion 430 on the substrate 100 covers the orthographic projection of the third light-emitting device 313 on the substrate 100. It should be noted that, Figures 6 to 10 as well as Figure 1 and Figure 3 In the top view, the first light emitting device 311 is located below the first packaging portion 410 and cannot be seen. The second light emitting device 312 is located below the second packaging portion 410.

[0079] The second light emitting device 312 cannot be seen below 420, and the third light emitting device 313 is located below the third packaging part 430, so the third light emitting device 313 cannot be seen. Therefore, using dotted lines to represent the first light emitting device 311, the second light emitting device 312 and the third light emitting device 313 cannot be understood as a limitation of the present application.

[0080] Exemplarily, the light emitting device 310 includes light emitting devices of various colors, such as a red light emitting device R, a green light emitting device G, a blue light emitting device B, etc. Exemplarily, the first light emitting device 311 is a blue light emitting device B, the second light emitting device 312 is a red light emitting device R, and the third light emitting device 313 is a green light emitting device G. Of course, the above possible light emitting devices are only used for example and cannot be understood as limiting the present application. The colors of the first light emitting device 311, the second light emitting device 312, and the third light emitting device 313 can be flexibly selected according to actual conditions, and will not be described in detail here.

[0081] In one embodiment, referring to Figure 6 , the orthographic projection of the second packaging portion 420 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. In another embodiment, referring to Figure 7 In the schematic diagram of the top view of the display panel shown, the orthographic projection of the third encapsulation part 430 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. In another embodiment, the orthographic projection of the second encapsulation part 420 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100, and the orthographic projection of the third encapsulation part 430 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. Thus, the second encapsulation part 420 and / or the third encapsulation part 430 can further improve the protection of the first electrode layer 301 in the via hole 120, and can better prevent the first electrode layer 301 from being corroded.

[0082] In one embodiment, the second light-emitting device 312 includes a second light-emitting functional layer and a third electrode layer which are stacked, and the second light-emitting functional layer is located on the side of the third electrode layer close to the substrate; the orthographic projection of the second light-emitting functional layer on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. In another embodiment, the orthographic projection of the third electrode layer on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. In another embodiment, the orthographic projection of the second light-emitting functional layer on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100, and the orthographic projection of the third electrode layer on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. Thus, the second light-emitting functional layer and the third electrode layer of the second light-emitting device 312 can further improve the protection of the first electrode layer 301 in the via hole 120, and can better prevent the first electrode layer 301 from being corroded.

[0083] In one embodiment, the third light-emitting device 313 includes a third light-emitting functional layer and a fourth electrode layer which are stacked, and the third light-emitting functional layer is located on the side of the fourth electrode layer close to the substrate 100; the orthographic projection of the third light-emitting functional layer on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. In another embodiment, the orthographic projection of the fourth electrode layer on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. In another embodiment, the orthographic projection of the third light-emitting functional layer on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100, and the orthographic projection of the fourth electrode layer on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. Thus, the third light-emitting functional layer and the fourth electrode layer of the third light-emitting device 313 can further improve the protection of the first electrode layer 301 in the via hole 120, and can better prevent the first electrode layer 301 from being corroded.

[0084] In one embodiment, referring to Figure 6 In the same light-emitting unit group 300, the second light-emitting device 312 and the third light-emitting device 313 are located on the same side of the first light-emitting device 311. Thus, there is a gap between the second light-emitting device 312 and the third light-emitting device 313, which facilitates the first packaging part 410 of the first light-emitting device 311 to be connected to each other on the side of the isolation structure 200 away from the substrate 100, which can effectively reduce the risk of hanging between the isolation structure 200 and the first packaging part 410, and has an excellent effect of reducing the risk of peeling of the first packaging part 410.

[0085] In one embodiment, one light emitting device 310 corresponds to one via hole 120, and the via hole 120 is located on one side of the first light emitting device 311 close to the second light emitting device 312 and the third light emitting device 313 (see Figure 1), or the via hole 120 is located between the second light emitting device 312 and the third light emitting device 313, or the via hole 120 corresponding to the first light emitting device 311 is located on the side of the first light emitting device 311 close to the second light emitting device 312 and the third light emitting device 313, and the via hole corresponding to the second light emitting device 312 and the third light emitting device 313 is located between the second light emitting device 312 and the third light emitting device 313 (see Figure 3 ). Thus, the arrangement of the via holes 120 is conducive to the first packaging part 410 covering all the via holes 120 , and the first packaging part 410 has an excellent protection effect on the first electrode layer 301 in the via holes 120 .

[0086] In one embodiment, referring to Figure 6 The isolation opening 210 corresponding to the first light emitting device 310 is provided with a recessed portion 211, and the via hole 120 corresponding to the first light emitting device 310 is at least partially located in the recessed portion 211. Therefore, the recessed portion 211 is more convenient for the arrangement of the via hole 120 and hardly affects the display effect.

[0087] In one embodiment, referring to Figure 1 , the light-emitting unit group 300 is arranged along the first direction a and the second direction b, and the first direction a and the second direction b intersect; in the same light-emitting unit group 300, the second light-emitting device 312 and the third light-emitting device 313 are arranged along the second direction b, and in the first direction a, the second light-emitting device 312 and the third light-emitting device 313 are located on one side of the first light-emitting device 311. Therefore, the arrangement of the vias 120 and the arrangement of the light-emitting devices 310 are more conducive to the first packaging part 410 covering all the vias 120, and the first packaging part 410 has an excellent protection effect on the first electrode layer 301 in the vias 120.

[0088] In a preferred embodiment, the first direction a and the second direction b are perpendicular to each other, which is more conducive to the manufacture of the display panel, reduces the manufacturing difficulty, and improves the yield of the display panel.

[0089] In one embodiment, referring to Figure 8 In the schematic diagram of the top view of the display panel shown, in the second direction b, in at least some of the adjacent light-emitting unit groups 300, the first encapsulation part 410 extends outward from the isolation opening 210 and is connected on the side of the isolation structure 200 away from the substrate 100. Thus, the first encapsulation parts 410 of two adjacent first light-emitting devices 311 are connected together on the side of the isolation structure 200 away from the substrate 100, which can effectively avoid the phenomenon of hanging between the first encapsulation part 410 and the isolation structure 200 between the two adjacent first light-emitting devices 311, reduce the risk of glass of the first encapsulation part 410, and help improve the yield of the display panel.

[0090] In one embodiment, referring to Fig. 9 In the schematic diagram of the top view of the display panel shown in the figure, the first light-emitting device 311 includes a first sub-light-emitting device 3111 and a second sub-light-emitting device 3112 arranged along the second direction b, and the first sub-light-emitting device 3111 and the second sub-light-emitting device 3112 correspond to the same via hole 120. Exemplarily, the first electrode layer 301 of the first sub-light-emitting device 3111 and the second sub-light-emitting device 3112 is the same electrode layer, and the first electrode layer 301 is in contact with the conductive layer 110 through a via hole 120. Exemplarily, there is a gap between the first sub-light-emitting device 3111 and the second sub-light-emitting device 3112. At this time, referring to Fig.10 , the second packaging parts 420 of the second light-emitting devices 312 in two adjacent light-emitting unit groups 300 can be interconnected on the side of the isolation structure 200 away from the substrate 100; or, the third packaging parts 430 of the third light-emitting devices 313 in two adjacent light-emitting unit groups 300 can be interconnected on the side of the isolation structure 200 away from the substrate 100. The design is more flexible and diverse, and is more conducive to realizing the protection of the first electrode layer 301 in the via 120 by the packaging layer 400.

[0091] In one embodiment, in the same light emitting unit group 300, the via hole 120 is located on a side of the first sub-light emitting device 3111 close to the second sub-light emitting device 3112 (refer to Fig. 9 ), or the via hole 120 is located on one side of the third light emitting device 313 close to the first sub-light emitting device 3111 and the second sub-light emitting device 3112 (refer to Fig.10 ). Thus, the via hole 120 can be disposed at more diverse positions, which is beneficial for the packaging layer 400 to protect the first electrode layer 301 in the via hole 120 .

[0092] Exemplarily, the first light-emitting device 311 is used as an example for explanation, one of the first electrode layer 301 and the second electrode layer 303 is an anode, and the other is a cathode. Taking the first electrode layer 301 as an anode and the second electrode layer 303 as a cathode as an example for explanation, the first light-emitting functional layer 302 includes a light-emitting layer, and may also include at least one of a hole injection layer (HIL), a hole transport layer (HTL) and an electron blocking layer (EBL) located between the first electrode layer 301 and the light-emitting layer, and at least one of an electron injection layer (EIL), an electron transport layer (ETL) and a hole blocking layer (HBL) located between the light-emitting layer and the second electrode layer 303. The structures of the remaining light-emitting devices can refer to the structure of the first light-emitting device 311, and will not be described in detail here.

[0093] In one embodiment, referring to Fig.12 and Fig.13 The structural schematic diagram of the isolation structure shown in FIG. 2 shows that the isolation structure 200 includes a first portion 201 and a second portion 202 stacked together, wherein the first portion 201 is located on a side of the second portion 202 facing away from the substrate 100, and the orthographic projection of the second portion 202 on the substrate 100 is located within the orthographic projection of the first portion 201 on the substrate 100.

[0094] Exemplarily, the second part 202 can be designed as an independent film layer, that is, there is no physical interface inside the second part 202, and each part is composed of the same material, for example, the material of the second part 202 is aluminum. Alternatively, the second part 202 can be designed to be composed of at least two film layers stacked. For example, the second part 202 is formed by stacking two conductive film layers. The materials of the two conductive film layers can be molybdenum and aluminum, respectively, and the conductive film layer composed of molybdenum is located between the substrate 100 and the conductive film layer composed of aluminum. Exemplarily, the second part 202 includes a conductive sub-part, or the second part 202 itself is a conductive structure. The material of the first part 201 can be an organic material, an inorganic material, or a metal material. In the case where the first part 201 is a metal material, the material of the first part 201 can be titanium.

[0095] In one embodiment, referring to Fig.14 As shown in the structural schematic diagram of the isolation structure, the isolation structure 200 also includes a third portion 203 located on a side of the second portion 202 close to the substrate 100 , and the orthographic projection of the second portion 202 on the substrate 100 is located within the orthographic projection range of the third portion 203 on the substrate 100 .

[0096] In one implementation, the third portion 203 includes a conductive material. Exemplarily, the light emitting layer is spaced apart from the isolation structure 200 , and more specifically, the light emitting layer is spaced apart from the third portion 203 .

[0097] Exemplarily, the second portion 202 is a conductive film layer made of aluminum, and the third portion 203 is a conductive film layer made of molybdenum. In this case, the cross section of the isolation structure 200 is in an I-shape.

[0098] The composition, preparation, etc. of the isolation structure 200 are described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and C Further description is provided in N117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0099] In one embodiment, referring to Figure 1 The display panel further includes: a pixel defining layer 500 located between the substrate 100 and the isolation structure 200 , wherein the orthographic projection of the pixel defining layer 500 on the plane where the substrate 100 is located covers the orthographic projection of the via 120 on the plane where the substrate 100 is located.

[0100] For example, refer to Figure 1 The pixel defining layer has a plurality of openings, the first electrode layer 301 is located between the pixel defining layer 500 and the substrate 100, part of the first light-emitting functional layer 302 is located in the opening of the pixel defining layer, and the remaining part of the light-emitting layer 412 is located in the isolation opening 210 of the isolation structure; part of the second electrode layer 303 is located in the opening of the pixel defining layer, and the remaining part of the second electrode layer 303 is located in the isolation opening 210 of the isolation structure.

[0101] It should be noted that the pixel defining layer is a conventional pixel defining layer in the prior art, and will not be described in detail here.

[0102] In one embodiment, referring to Fig.11 As shown in the cross-sectional structural diagram of the display panel, the substrate 100 further includes a substrate 101 and a planarization layer 102 . The substrate 101 is located on a side of the planarization layer 102 away from the pixel defining layer 500 . The planarization layer 102 has a via 120 .

[0103] Exemplarily, the substrate 100 includes a substrate 101, an active layer and a metal layer between the substrate 101 and the planarization layer 102, and an insulating layer between the active layer and the metal layer. It should be noted that the display panel includes a pixel driving circuit, the pixel driving circuit includes an active layer and a metal layer, and the rest of the structure of the pixel driving circuit can refer to the prior art, which will not be described in detail here.

[0104] In one embodiment, the substrate may be a glass-based substrate. In one embodiment, the substrate may include an organic resin material such as epoxy resin, triazine, silicone resin or polyimide. For example, the substrate may be a FR4 type printed circuit board (PCB), or may be a flexible PCB that is easily deformed. In one embodiment, the substrate may include a ceramic material such as silicon nitride, aluminum nitride or aluminum oxide, or may include a metal or a metal compound. For example, the substrate may be a metal core printed circuit board (MCPCB) or a metal copper clad laminate (MCCL).

[0105] In one embodiment, the encapsulation layer 400 includes an inorganic material. Exemplarily, the materials of the first encapsulation part 410, the second encapsulation part 420, and the third encapsulation part 430 are inorganic materials, which are prepared by chemical vapor deposition (CVD). Exemplarily, the display panel also includes an organic encapsulation layer and an inorganic encapsulation layer, the organic encapsulation layer is located on the side of the encapsulation layer 400 away from the substrate 100, the inorganic encapsulation layer is located on the side of the organic encapsulation layer away from the substrate 100, the organic encapsulation layer includes an organic material, which is prepared by an inkjet printing (IJP) method, and the inorganic encapsulation layer includes an inorganic material, which is prepared by a chemical vapor deposition (CVD) method.

[0106] A second aspect of the present application provides a display panel, referring to Figure 8The cross-sectional structure diagram of the display panel shown in the figure, the display panel includes: a substrate 100, including a conductive layer 110 and a via hole 120, the via hole 120 exposing a portion of the conductive layer 110; an isolation structure 200, located on a side of the substrate 100 having the via hole 120, the isolation structure 200 having a plurality of isolation openings 210; a plurality of light-emitting unit groups 300, the light-emitting unit groups 300 including a plurality of light-emitting devices 310, the light-emitting devices 310 at least partially located in the isolation openings 210, the light-emitting devices 310 including a first electrode layer 301 The first electrode layer 301 extends into the via hole 120 and contacts the conductive layer 110, and the plurality of light-emitting devices 310 include a first light-emitting device 311; the encapsulation layer 400 is located on the side of the isolation structure 200 away from the substrate 100, and the encapsulation layer 400 includes a plurality of first encapsulation parts 410; the first encapsulation part 410 is a mesh structure, and the orthographic projection of the first encapsulation part 410 on the substrate 100 covers the orthographic projection of the plurality of first light-emitting devices 311 on the substrate 100 and the orthographic projection of at least one via hole 120 on the substrate 100.

[0107] It can be understood that the first packaging part 410 is a mesh structure, and includes a plurality of through holes in the first packaging part 410, the positions of the through holes correspond to the positions of the second light-emitting device and the third light-emitting device, and the orthographic projection of the second light-emitting device on the substrate 100 is located within the range of the orthographic projection of the through holes on the substrate 100, and the orthographic projection of the third light-emitting device on the substrate 100 is located within the range of the orthographic projection of the through holes on the substrate 100. The rest of the first packaging part 410 except the through holes is a continuous structure.

[0108] According to the display panel of this embodiment, the setting of the mesh-shaped first packaging part 410 is conducive to the interconnection of the first packaging part 410 between two adjacent light-emitting unit groups 300 on the side of the isolation structure 200 away from the substrate 100, which is conducive to reducing the suspension between the first packaging part 410 and the isolation structure 200, and effectively reducing the risk of peeling of the first packaging part 410; at the same time, the first packaging part 410 covers at least one via 120, which can effectively protect the first electrode layer 301 in the via 120 from corrosion, thereby avoiding failure of the light-emitting device 310 and improving the manufacturing yield of the display panel.

[0109] It should be noted that the substrate, isolation structure, encapsulation layer, light-emitting unit group, and light-emitting device are consistent with the previous description and will not be elaborated here.

[0110] In one embodiment, in the same light emitting unit group 300 , the orthographic projection of the first encapsulation part 410 on the substrate 100 covers the orthographic projections of all via holes 120 on the substrate 100 .

[0111] In one embodiment, the first light-emitting device 311 includes a first light-emitting functional layer 302 and a second electrode layer 303 which are stacked, and the first light-emitting functional layer 302 is located on a side of the second electrode layer 303 close to the substrate 100; in at least some adjacent light-emitting unit groups 300, the first light-emitting functional layer 302 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 facing away from the substrate 100, and the orthographic projection of the first light-emitting functional layer 302 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. In another embodiment, in at least some adjacent light-emitting unit groups 300, the second electrode layer 303 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 facing away from the substrate 100, and the orthographic projection of the second electrode layer 303 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. In another embodiment, in at least some adjacent light-emitting unit groups 300, the first light-emitting functional layer 302 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 facing away from the substrate 100, and the orthographic projection of the first light-emitting functional layer 302 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100; and the second electrode layer 303 extends outward from the isolation opening 210 and is connected to the side of the isolation structure 200 facing away from the substrate 100, and the orthographic projection of the second electrode layer 303 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. Thus, the first light-emitting functional layer 302 and / or the second electrode layer 303 can effectively protect the first electrode layer 301 in the via hole, further reducing the risk of failure of the light-emitting unit group.

[0112] In one embodiment, the first electrode layer 301 is located between the substrate 100 and the isolation structure 200 , and is at least partially exposed to the isolation opening 210 .

[0113] In one embodiment, referring to Figure 5 In the structural diagram of the display panel shown in FIG. 1 , the orthographic projection of the isolation structure 200 on the plane where the substrate 100 is located covers the orthographic projection of the via hole 120 on the plane where the substrate 100 is located. Thus, the isolation structure 200 can effectively protect the first electrode layer 301 in the via hole, further reducing the risk of failure of the light-emitting unit group.

[0114] In one embodiment, referring to Figure 6 As shown in the schematic diagram of the top structure of the display panel, the multiple light-emitting devices 310 also include: a second light-emitting device 312 and a third light-emitting device 313; the encapsulation layer 400 also includes a second encapsulation part 420 and a third encapsulation part 430, the orthographic projection of the second encapsulation part 420 on the substrate 100 covers the orthographic projection of the second light-emitting device 312 on the substrate 100, and the orthographic projection of the third encapsulation part 430 on the substrate 100 covers the orthographic projection of the third light-emitting device 313 on the substrate 100.

[0115] Exemplarily, the light emitting device 310 includes light emitting devices of various colors, such as a red light emitting device R, a green light emitting device G, a blue light emitting device B, etc. Exemplarily, the first light emitting device 311 is a blue light emitting device B, the second light emitting device 312 is a red light emitting device R, and the third light emitting device 313 is a green light emitting device G. Of course, the above possible light emitting devices are only used for example and cannot be understood as limiting the present application. The colors of the first light emitting device 311, the second light emitting device 312, and the third light emitting device 313 can be flexibly selected according to actual conditions, and will not be described in detail here.

[0116] In one embodiment, referring to Figure 6 , the orthographic projection of the second packaging portion 420 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. In another embodiment, referring to Figure 7 In the schematic diagram of the top view of the display panel shown, the orthographic projection of the third encapsulation part 430 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. In another embodiment, the orthographic projection of the second encapsulation part 420 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100, and the orthographic projection of the third encapsulation part 430 on the substrate 100 covers the orthographic projection of at least one via hole 120 on the substrate 100. Thus, the second encapsulation part 420 and / or the third encapsulation part 430 can further improve the protection of the first electrode layer 301 in the via hole 120, and can better prevent the first electrode layer 301 from being corroded.

[0117] It should be noted that the structure of the display panel of this embodiment can be combined with the structure of the display panel described above in whole or in part, and will not be described in detail here.

[0118] A third aspect of the present application provides a method for preparing a display panel, referring to Fig.15 The schematic flow chart of the method for preparing a display panel is shown, and the method for preparing a display panel includes the following process.

[0119] S100: providing a substrate having a conductive layer and a via hole, wherein the via hole exposes a portion of the conductive layer.

[0120] It should be noted that the substrate is consistent with the previous description and will not be described in detail here.

[0121] S200: preparing a first electrode layer on a side of the substrate having a via hole, wherein the first electrode layer extends into the via hole and contacts the conductive layer.

[0122] It should be noted that the first electrode layer is consistent with the above description and will not be described in detail here.

[0123] S300: preparing an isolation structure on a side of the first electrode layer facing away from the substrate, wherein the isolation structure includes a plurality of isolation openings.

[0124] It should be noted that the isolation structure is consistent with the previous description and will not be elaborated here.

[0125] Exemplarily, the orthographic projection of the isolation structure on the plane where the substrate is located covers the orthographic projection of the via on the plane where the substrate is located, and preparing the isolation structure on the side of the first electrode layer facing away from the substrate includes: preparing a whole layer of isolation material layer on the side of the first electrode layer facing away from the substrate, patterning the isolation material layer, removing the isolation material layers corresponding to the positions of the first light-emitting device, the second light-emitting device and the third light-emitting device, and obtaining an isolation structure with multiple isolation openings.

[0126] S400: sequentially preparing a first light-emitting functional layer and a second electrode layer in the isolation opening to obtain a first light-emitting device in a plurality of light-emitting unit groups.

[0127] It should be noted that the first light-emitting functional layer and the second electrode layer are consistent with the above description and will not be described in detail here.

[0128] In one embodiment, sequentially preparing the first light-emitting functional layer and the second electrode layer in the isolation opening includes: sequentially preparing the first light-emitting functional material layer and the second conductive layer on the side of the isolation structure away from the substrate, the orthographic projections of the first light-emitting functional material layer and the second conductive layer on the substrate covering the orthographic projections of the isolation opening and the isolation structure on the substrate; patterning the second conductive layer and the first light-emitting functional material layer, removing the first light-emitting functional material layer and the second conductive layer at the isolation opening position corresponding to the second light-emitting device and the third light-emitting device, and obtaining the first light-emitting device; in the same light-emitting unit group, the second light-emitting device and the third light-emitting device are located on the same side of the first light-emitting device. Thus, in the above preparation method, the first light-emitting functional layer and the second electrode layer of the obtained first light-emitting device cover the via hole, and the first light-emitting functional layers of the first light-emitting devices of adjacent light-emitting units are interconnected on the side of the isolation structure away from the substrate, and the second electrode layers of the first light-emitting devices are interconnected on the side of the isolation structure away from the substrate, which can effectively prevent the first electrode layer in the via hole from being corroded by the etching solution used in the subsequent second light-emitting device and third light-emitting device manufacturing process.

[0129] S500: preparing an encapsulation layer including a plurality of first encapsulation parts on a side of the isolation structure facing away from the substrate, wherein the orthographic projections of the first encapsulation parts on the substrate cover the orthographic projections of the first light-emitting devices on the substrate.

[0130] It should be noted that the encapsulation layer and the first encapsulation part are consistent with the above description and will not be elaborated herein.

[0131] It should be noted that, in at least some adjacent light-emitting unit groups, the first packaging portion extends outward from the isolation opening and is connected to the side of the isolation structure away from the substrate, and the orthographic projection of the first packaging portion on the substrate covers the orthographic projection of at least one via on the substrate.

[0132] In a specific embodiment, the method for preparing a display panel includes the following steps:

[0133] S1: providing a substrate having a conductive layer and a via hole, wherein the via hole exposes a portion of the conductive layer.

[0134] S2: preparing a first electrode layer on a side of the substrate having the via hole, wherein the first electrode layer extends into the via hole and contacts the conductive layer.

[0135] S3: preparing an isolation structure on a side of the first electrode layer facing away from the substrate, wherein the isolation structure comprises a plurality of isolation openings.

[0136] S4: On the side of the isolation structure facing away from the substrate, a first light-emitting functional material layer and a second conductive layer are sequentially prepared, and the orthographic projections of the first light-emitting functional material layer and the second conductive layer on the substrate cover the orthographic projections of the isolation opening and the isolation structure on the substrate; the second conductive layer and the first light-emitting functional material layer are patterned, and the first light-emitting functional material layer and the second conductive layer at the isolation opening positions corresponding to the second light-emitting device and the third light-emitting device are removed to obtain a first light-emitting device. A plurality of first packaging parts are prepared on the side of the isolation structure facing away from the substrate, and the orthographic projections of the first packaging parts on the substrate cover the orthographic projections of the first light-emitting device on the substrate.

[0137] S5: On the side of the isolation structure facing away from the substrate, a second light-emitting functional material layer and a third conductive layer are sequentially prepared, and the orthographic projections of the second light-emitting functional material layer and the third conductive layer on the substrate cover the orthographic projections of the isolation opening and the isolation structure on the substrate; the second light-emitting functional material layer and the third conductive layer are patterned, and the second light-emitting functional material layer and the third conductive layer at the isolation opening position corresponding to the second light-emitting device are retained to obtain a second light-emitting device. A plurality of second encapsulation parts are prepared on the side of the isolation structure facing away from the substrate, and the orthographic projections of the second encapsulation parts on the substrate cover the orthographic projections of the second light-emitting device on the substrate.

[0138] S6: Prepare a third light-emitting functional material layer and a fourth conductive layer in sequence on the side of the isolation structure facing away from the substrate, and the orthographic projections of the third light-emitting functional material layer and the fourth conductive layer on the substrate cover the orthographic projections of the isolation opening and the isolation structure on the substrate; pattern the third light-emitting functional material layer and the fourth conductive layer, and retain the third light-emitting functional material layer and the fourth conductive layer at the isolation opening position corresponding to the third light-emitting device to obtain a third light-emitting device. Prepare multiple third packaging parts on the side of the isolation structure facing away from the substrate, and the orthographic projections of the third packaging parts on the substrate cover the orthographic projections of the third light-emitting device on the substrate. In the same light-emitting unit, the second light-emitting device and the third light-emitting device are located on the same side of the first light-emitting device.

[0139] In the above preparation process, the first light-emitting device and the first packaging part are prepared first. The first light-emitting functional layer and the second electrode in the first packaging part and the first light-emitting device can effectively protect the first electrode layer in the via hole from being corroded by the etching solution used in the subsequent patterning process of the second light-emitting device and the third light-emitting device, thereby avoiding failure of the light-emitting unit and improving the display panel manufacturing yield.

[0140] A fourth aspect of the present application provides a display device, comprising the above-mentioned display panel, or comprising a display panel prepared by the above-mentioned preparation method.

[0141] It should be noted that, in addition to the above-mentioned display panel, the display device may also include structures that a conventional display device should have, such as a touch panel, a driving chip, a housing and other structures, which will not be described in detail here.

[0142] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0143] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A display panel, characterized in that: include: A substrate, comprising a conductive layer and a via hole, wherein the via hole exposes a portion of the conductive layer; An isolation structure, located on a side of the substrate having the via hole, the isolation structure comprising a plurality of isolation openings; A plurality of light-emitting unit groups, each of which includes a plurality of light-emitting devices, each of which is at least partially located in the isolation opening, and each of which includes a first electrode layer, the first electrode layer extending into the via hole and contacting the conductive layer, and the plurality of light-emitting devices including a first light-emitting device; An encapsulation layer, located on a side of the isolation structure away from the substrate, the encapsulation layer comprising a plurality of first encapsulation parts; The orthographic projection of the first encapsulation portion on the substrate covers the orthographic projection of the first light-emitting device on the substrate; Among them, in at least some adjacent light-emitting unit groups, the first packaging part extends outward from the isolation opening and is connected to the side of the isolation structure away from the substrate, and the orthographic projection of the first packaging part on the substrate covers the orthographic projection of at least one via on the substrate.

2. The display panel according to claim 1, characterized in that: The first light-emitting device comprises a first light-emitting functional layer and a second electrode layer which are stacked, and the first light-emitting functional layer is located on a side of the second electrode layer close to the substrate; In at least some of the adjacent light-emitting unit groups, the first light-emitting functional layer extends outward from the isolation opening and is connected to the isolation structure at a side facing away from the substrate, and the orthographic projection of the first light-emitting functional layer on the substrate covers the orthographic projection of at least one via hole on the substrate; And / or, the second electrode layer extends outward from the isolation opening and is connected to the isolation structure at a side facing away from the substrate, and an orthographic projection of the second electrode layer on the substrate covers an orthographic projection of at least one of the via holes on the substrate; Preferably, the first electrode layer is located between the substrate and the isolation structure, and is at least partially exposed to the isolation opening; Preferably, the orthographic projection of the isolation structure on the plane where the substrate is located covers the orthographic projection of the via hole on the plane where the substrate is located; Preferably, in the same light-emitting unit group, the orthographic projection of the first packaging part on the substrate covers the orthographic projections of all the via holes on the substrate.

3. The display panel according to claim 1 or 2, characterized in that: The plurality of light emitting devices further comprises: a second light emitting device and a third light emitting device; The encapsulation layer further includes a second encapsulation portion and a third encapsulation portion, wherein the orthographic projection of the second encapsulation portion on the substrate covers the orthographic projection of the second light emitting device on the substrate, and the orthographic projection of the third encapsulation portion on the substrate covers the orthographic projection of the third light emitting device on the substrate.

4. The display panel according to claim 3, characterized in that: The orthographic projection of the second packaging portion on the substrate covers the orthographic projection of at least one of the via holes on the substrate; and / or, The orthographic projection of the third packaging portion on the substrate covers the orthographic projection of at least one of the via holes on the substrate.

5. The display panel according to claim 4, characterized in that: The second light emitting device comprises a second light emitting functional layer and a third electrode layer which are stacked, and the second light emitting functional layer is located on a side of the third electrode layer close to the substrate; The orthographic projection of the second light-emitting functional layer on the substrate covers the orthographic projection of at least one of the via holes on the substrate; And / or, the orthographic projection of the third electrode layer on the substrate covers the orthographic projection of at least one of the via holes on the substrate.

6. The display panel according to claim 4 or 5, characterized in that: The third light-emitting device comprises a third light-emitting functional layer and a fourth electrode layer which are stacked, and the third light-emitting functional layer is located on a side of the fourth electrode layer close to the substrate; The orthographic projection of the third light-emitting functional layer on the substrate covers the orthographic projection of at least one of the via holes on the substrate; And / or, the orthographic projection of the fourth electrode layer on the substrate covers the orthographic projection of at least one of the via holes on the substrate.

7. The display panel according to claim 3, characterized in that: In the same light emitting unit group, the second light emitting device and the third light emitting device are located on the same side of the first light emitting device.

8. The display panel according to claim 7, characterized in that: One of the light-emitting devices corresponds to one of the via holes, and the via hole is located on a side of the first light-emitting device close to the second light-emitting device and the third light-emitting device, or the via hole is located between the second light-emitting device and the third light-emitting device, or the via hole corresponding to the first light-emitting device is located on a side of the first light-emitting device close to the second light-emitting device and the third light-emitting device, and the via holes corresponding to the second light-emitting device and the third light-emitting device are located between the second light-emitting device and the third light-emitting device; Preferably, the isolation opening corresponding to the first light emitting device is provided with a recessed portion, and the via hole corresponding to the first light emitting device is at least partially located in the recessed portion.

9. The display panel according to claim 7, characterized in that: The light-emitting unit group is arranged along a first direction and a second direction, and the first direction intersects with the second direction; in the same light-emitting unit group, the second light-emitting device and the third light-emitting device are arranged along the second direction, and in the first direction, the second light-emitting device and the third light-emitting device are located on one side of the first light-emitting device; Preferably, in at least some of the adjacent light emitting unit groups in the second direction, the first encapsulation portion extends outward from the isolation opening and is connected to the isolation structure at a side facing away from the substrate; Preferably, the first direction and the second direction are perpendicular to each other.

10. The display panel according to claim 9, characterized in that: The first light emitting device comprises a first sub-light emitting device and a second sub-light emitting device arranged along the second direction, and the first sub-light emitting device and the second sub-light emitting device correspond to the same via hole; Preferably, the first sub-light emitting device and the second sub-light emitting device share the same first electrode layer; Preferably, in the same light emitting unit group, the via hole is located on a side of the first sub-light emitting device close to the second sub-light emitting device, or the via hole is located on a side of the third light emitting device close to the first sub-light emitting device and the second sub-light emitting device.

11. The display panel according to claim 1, characterized in that: The isolation structure comprises a first portion and a second portion stacked together, the first portion is located on a side of the second portion facing away from the substrate, and an orthographic projection of the second portion on the substrate is located within an orthographic projection of the first portion on the substrate; Preferably, the isolation structure further includes a third portion located on a side of the second portion close to the substrate, and an orthographic projection of the second portion on the substrate is located within a range of an orthographic projection of the third portion on the substrate.

12. The display panel according to claim 1, characterized in that: The display panel further includes: a pixel defining layer, located between the substrate and the isolation structure, wherein the orthographic projection of the pixel defining layer on the plane where the substrate is located covers the orthographic projection of the via hole on the plane where the substrate is located; Preferably, the substrate further comprises a substrate and a planarization layer, the substrate is located on a side of the planarization layer away from the pixel defining layer, and the planarization layer has the via hole; Preferably, the encapsulation layer comprises an inorganic material.

13. A display panel, characterized in that: include: A substrate, comprising a conductive layer and a via hole, wherein the via hole exposes a portion of the conductive layer; An isolation structure, located on a side of the substrate having the via hole, the isolation structure comprising a plurality of isolation openings; A plurality of light-emitting unit groups, each of which includes a plurality of light-emitting devices, each of which is at least partially located in the isolation opening, and each of which includes a first electrode layer, the first electrode layer extending into the via hole and contacting the conductive layer, and the plurality of light-emitting devices including a first light-emitting device; An encapsulation layer, located on a side of the isolation structure away from the substrate, the encapsulation layer comprising a plurality of first encapsulation parts; The first packaging part is a mesh structure, and the orthographic projection of the first packaging part on the substrate covers the orthographic projections of the plurality of first light-emitting devices on the substrate and the orthographic projection of at least one via on the substrate.

14. The display panel according to claim 13, characterized in that: The first light-emitting device comprises a first light-emitting functional layer and a second electrode layer which are stacked, and the first light-emitting functional layer is located on a side of the second electrode layer close to the substrate; In at least some of the adjacent light-emitting unit groups, the first light-emitting functional layer extends outward from the isolation opening and is connected to the isolation structure at a side facing away from the substrate, and the orthographic projection of the first light-emitting functional layer on the substrate covers the orthographic projection of at least one via hole on the substrate; And / or, the second electrode layer extends outward from the isolation opening and is connected to the isolation structure at a side facing away from the substrate, and an orthographic projection of the second electrode layer on the substrate covers an orthographic projection of at least one of the via holes on the substrate; Preferably, the first electrode layer is located between the substrate and the isolation structure, and is at least partially exposed to the isolation opening; Preferably, the orthographic projection of the isolation structure on the plane where the substrate is located covers the orthographic projection of the via hole on the plane where the substrate is located; Preferably, in the same light-emitting unit group, the orthographic projection of the first packaging part on the substrate covers the orthographic projections of all the via holes on the substrate.

15. The display panel according to claim 13 or 14, characterized in that: The plurality of light emitting devices further comprises: a second light emitting device and a third light emitting device; The encapsulation layer further includes a second encapsulation portion and a third encapsulation portion, wherein the orthographic projection of the second encapsulation portion on the substrate covers the orthographic projection of the second light emitting device on the substrate, and the orthographic projection of the third encapsulation portion on the substrate covers the orthographic projection of the third light emitting device on the substrate.

16. The display panel according to claim 15, characterized in that: The orthographic projection of the second packaging portion on the substrate covers the orthographic projection of at least one of the via holes on the substrate; and / or, The orthographic projection of the third packaging portion on the substrate covers the orthographic projection of at least one of the via holes on the substrate.

17. A method for preparing a display panel, characterized in that: include: Providing a substrate having a conductive layer and a via hole, wherein the via hole exposes a portion of the conductive layer; Preparing a first electrode layer on a side of the substrate having the via hole, wherein the first electrode layer extends into the via hole and contacts the conductive layer; preparing an isolation structure on a side of the first electrode layer facing away from the substrate, wherein the isolation structure comprises a plurality of isolation openings; Sequentially preparing a first light-emitting functional layer and a second electrode layer in the isolation opening to obtain a first light-emitting device in a plurality of light-emitting unit groups; Preparing an encapsulation layer including a plurality of first encapsulation parts on a side of the isolation structure away from the substrate, wherein the orthographic projection of the first encapsulation part on the substrate covers the orthographic projection of the first light-emitting device on the substrate; Among them, in at least some adjacent light-emitting unit groups, the first packaging part extends outward from the isolation opening and is connected to the side of the isolation structure away from the substrate, and the orthographic projection of the first packaging part on the substrate covers the orthographic projection of at least one of the vias on the substrate.

18. The preparation method according to claim 17, characterized in that: The step of sequentially preparing a first light-emitting functional layer and a second electrode layer in the isolation opening comprises: A first light-emitting functional material layer and a second conductive layer are sequentially prepared on a side of the isolation structure away from the substrate, wherein the orthographic projections of the first light-emitting functional material layer and the second conductive layer on the substrate cover the orthographic projections of the isolation opening and the isolation structure on the substrate; Performing patterning on the second conductive layer and the first light-emitting functional material layer, removing the first light-emitting functional material layer and the second conductive layer at the isolation opening positions corresponding to the second light-emitting device and the third light-emitting device, to obtain the first light-emitting device; In the same light emitting unit group, the second light emitting device and the third light emitting device are located on the same side of the first light emitting device.

19. A display device, characterized in that: A display panel comprising any one of claims 1 to 16, or a display panel prepared by the preparation method according to claim 17 or 18.

Images