Compression molding method for quartz / phenolic aldehyde end of temperature sensor with embedded probe

Abstract

The invention discloses a compression molding method for a quartz / phenolic aldehyde end of an embedded probe temperature sensor. The compression molding method comprises the following steps: molding and processing a probe temperature sensor protection bracket; packaging the probe temperature sensor; forming an end part; and machining the end part. According to the invention, the flexibility of the compression molding process, the designability of the material and the excellent ablation resistance of the quartz fiber and the phenolic resin are fully utilized, so that the problem that the operation cannot be carried out due to the characteristics of the molding process is avoided, and the preparation difficulty of a workpiece is reduced; the quartz / phenolic aldehyde composite material is adopted to replace a traditional conical metal piece to be internally arranged, so that the total mass of the end is greatly reduced; the formed product is high in size precision, good in internal quality and low in manufacturing cost, the overall pneumatic appearance structure of the end is not damaged under the condition that the requirement for normal use of the embedded probe type temperature sensor is met, and material selection and design of the end are obviously improved through force and heat test examination.

Description

Technical Field

[0001] The invention belongs to the technical field of preparation of aviation and aerospace bearing / heat-proof structural parts, and relates to a compression molding method of a quartz / phenolic end of an embedded probe temperature sensor. Background Art

[0002] When a certain product is flying, it will generate extreme aerodynamic forces, aerodynamic heat and other complex physical phenomena. The head of the product is subjected to rapid friction from the high-temperature airflow, generating a large amount of heat in a short period of time, which is transferred to the surface of the product to form higher temperatures in different areas. Under the action of high pressure and high overload, the structure of the terminal may be damaged or even disintegrated. If the terminal adopts an over-heat protection design, it will not only increase the manufacturing cost and product weight, but also cause asymmetric ablation of the product, resulting in unstable flight. Therefore, it is necessary to prepare a terminal with high stability, high adaptability, low cost, and the ability to detect actual temperature changes during flight, so as to provide a basis for the selection of materials and the design of heat protection structures for the terminals used in subsequent flight products.

[0003] At present, the mainstream materials used in terminals are mainly resin-based, carbon-based and ceramic-based. Among them, carbon-based heat protection materials are mainly carbon / carbon composite materials, that is, carbon fiber braids are deposited with carbon or impregnated with carbon through chemical vapor deposition (CVD), and then carbonized or graphitized. If there is a temporary change in the flight mission, the sublimation effect of the carbon-based material cannot be exerted, and it becomes a simple oxidation combustion, which cannot achieve the expected heat protection effect. Ceramic-based heat protection materials are mainly carbon / quartz composite materials. The molding process is to melt the submicron-level matrix particles at high temperature in an inert gas atmosphere and then impregnate them on the preform of the reinforcement material. The process method has very high requirements on the equipment. These two preparation methods can only bond the temperature sensor to them through post-molding processing, which destroys the integrity of the terminal. Under extreme flight conditions, the terminal may burst into fire and disintegrate. The main components of high-silica fiber and quartz fiber in the resin base are silicon dioxide. The latent heat of silicon dioxide vaporization is 3000kcal, which can further absorb aerodynamic heat. After melting at high temperature, it forms a liquid film with high viscosity, which is not easily washed away under high airflow. Phenolic resin immediately carbonizes at high temperature to form a carbon atom skeleton layer with high heat resistance, high strength, and not easily washed away. The combination of the two forms a carbonization-melting ablative material, which can further radiate and block heat flow. At the same time, the compression molding process adopted has strong designability and operability. The traditional molding of the end is to directly mold the conical metal part after sandblasting. Summary of the invention

[0004] (I) Purpose of the invention

[0005] The purpose of the present invention is to provide a method for molding a quartz / phenolic terminal with an embedded probe temperature sensor, which can not only meet the requirements of flight products for load bearing and heat protection, but also collect real-time change data of the terminal temperature during flight.

[0006] (II) Technical solution

[0007] In order to solve the above technical problems, the present invention provides a method for molding a quartz / phenolic end cap of an embedded probe temperature sensor, comprising the following steps:

[0008] (1) Forming and processing of the probe temperature sensor protection bracket: The bracket is divided into two parts, the central docking groove is used to arrange the sensor, and the docking surface is also provided with positioning protrusions and positioning grooves; prepare short fiber quartz / phenolic premix, mold, press the probe temperature sensor protection bracket preform blank, process the probe temperature sensor protection bracket blank, and obtain the conical probe temperature sensor protection bracket. A protection rod is set at the end of the bracket to prevent damage to the sensor when the press is closed in step 3.

[0009] (2) Encapsulation of the probe temperature sensor: wiring of the probe temperature sensor, bonding of the probe temperature sensor, assembly of the probe temperature sensor bracket, on-off detection of the probe temperature sensor, bonding and encapsulation of the probe temperature sensor, curing of the probe temperature sensor bracket, processing into an irregular stepped groove, and obtaining a probe temperature sensor built-in component.

[0010] (3) Forming of the terminal component: prepare short fiber quartz / phenolic premix, place the probe temperature sensor built-in component into the terminal mold, fill the inner circle of short fiber quartz / phenolic premix in the terminal mold, preform, perform on-off detection of the probe temperature sensor, fill the outer circle of long fiber quartz / phenolic premix in the terminal component, perform compression molding, and test the probe temperature sensor to obtain a rough finished product of quartz / phenolic terminal with embedded probe temperature sensor. The terminal component mold includes an upper mold and a lower mold. The upper mold is used to fix the probe temperature sensor built-in component. It is an inverted convex shape. Its top plane contacts the press machine. The bottom surface is provided with a built-in component positioning groove. The two side steps are provided with positioning pins that dock with the lower mold. The lower mold is a concave shape and contains a mold cavity for molding the terminal component. The loading process is centered on the probe temperature sensor built-in component. The inner circle of the terminal component is defined as the area around the probe temperature sensor built-in component, and the outer circle of the terminal component is defined as the area around the inner surface of the lower mold cavity.

[0011] (4) Processing of the terminal parts: The rough finished product of the quartz / phenolic terminal structure part of the embedded probe temperature sensor is machined to remove the front part of the protective rod, and the terminal product is placed in an oven for post-curing to obtain the quartz / phenolic terminal part of the embedded probe temperature sensor.

[0012] Furthermore, in step (1), the short-fiber quartz / phenolic short-fiber quartz is used as a reinforcing material, and the quartz fiber bundle is cut, and the length of the cut fiber does not exceed 30 mm to 50 mm.

[0013] Furthermore, the matrix material of the short fiber quartz / phenolic premix in step (1) is one or a mixture of several of amine phenolic resin, magnesium phenolic resin and boron phenolic resin.

[0014] Further preferably, the resin of the short fiber quartz / phenolic premix is ​​magnesium phenolic resin.

[0015] Furthermore, in step (1) of the mold filling, the short fiber quartz / phenolic premix is ​​preheated in an oven at a temperature of 80°C to 90°C for a period of 20 to 30 minutes. The short fiber quartz / phenolic premix is ​​evenly loaded into the mold cavity in two batches.

[0016] Furthermore, in step (1), the preform blank of the pressed probe temperature sensor protection bracket is prepared by closing the mold, preheating, keeping the temperature, applying contact pressure, heating, pressurizing, keeping the temperature, and maintaining the pressure to obtain the preform blank of the pressed probe temperature sensor protection bracket.

[0017] Further preferably, the mold closing is to close the upper and lower molds on a hydraulic press.

[0018] Further preferably, in the pre-heating, the mold temperature is heated by an electric heating rod from room temperature to 80° C. to 90° C. within 40 min to 45 min.

[0019] More preferably, the heat preservation maintains the mold temperature at 80° C. to 90° C. for 40 min to 50 min.

[0020] Further preferably, the contact pressure is applied by using a hydraulic press to apply a gauge pressure of 1 MPa to 2 MPa during the 20 to 25 min heat preservation.

[0021] Further preferably, the heating is to increase the temperature of the mold to 120° C. to 130° C. at a rate of 2° C. to 5° C. per 10 min.

[0022] Further preferably, the pressurization is performed by applying a gauge pressure of 15 MPa to 18 MPa using a hydraulic press after the temperature is increased.

[0023] Further preferably, the insulation time within the 120℃~130℃ system is calculated as t=a*d, wherein t is the insulation time, in min; a is the magnesium phenolic insulation coefficient, in the range of 4~5min, in min / mm; d is the total thickness of the probe temperature sensor protection bracket preform blank, in mm.

[0024] Further preferably, during the heat preservation period, the pressure is maintained by adjusting the pressure gauge of the press by a hydraulic press so that the pressure gauge of the press is always within the range of 15 MPa to 18 MPa.

[0025] Furthermore, in step (1), the probe temperature sensor protection bracket blank is processed by cutting and milling the probe temperature sensor protection bracket blank into two semi-cones, and a probe sensor reserved groove and a concave-convex semicircular positioning combination structure are processed on the plane of the semi-cone.

[0026] Further preferably, the semi-cone has a skirt-shaped cross section and a semi-cylindrical top.

[0027] Further preferably, the probe sensor reserved groove and the concave-convex semicircular positioning combination structure are processed on the plane on the semi-cone, a 5mm probe sensor reserved groove is milled on the semi-cone, and the concave-convex circular combination structures are processed at both ends of the reserved groove.

[0028] Furthermore, in the wiring of the probe temperature sensor in step (2), the probe temperature sensor wire is placed in the reserved groove of the probe temperature sensor protection bracket processed in step (1).

[0029] Furthermore, in step (2), the probe temperature sensor is bonded by cutting and fixing the probe temperature sensor at different points using conventional 3M908 double-sided tape.

[0030] Furthermore, in step (2), the probe temperature sensor bracket is assembled by positioning the two halves of the probe temperature sensor bracket according to the concave and convex circular grooves to form a whole.

[0031] Furthermore, in step (2), the on-off detection of the probe temperature sensor is performed by using a digital display temperature controller or other equipment to test the on-off of the probe temperature sensor.

[0032] Furthermore, in step (2), the probe temperature sensor is bonded and packaged and the probe temperature sensor bracket is cured, and the probe temperature sensor bracket is fixed by vacuum compaction, and magnesium phenolic resin is injected into the vacuum nozzle at the other end, and then placed in a drying oven set at 120° C. and cured for 12 hours.

[0033] Furthermore, in step (2), the step is processed into a stepped shape, three conformal fixtures are used to fix the probe temperature sensor, and an irregular stepped groove is machined using a lathe to obtain a probe temperature sensor built-in component.

[0034] Furthermore, in the preparation of the short fiber quartz / phenolic premix in step (3), the operation method is the same as that in step (1), and the length of the fibers cut from the quartz fiber bundle does not exceed 15 mm to 20 mm.

[0035] Furthermore, in step (3), the probe temperature sensor built-in component is assembled by assembling the probe temperature sensor built-in component of step (2) with the metal end handle, the probe temperature sensor reserved line is led out of the reserved hole next to the upper mold, a silicone rubber adhesive is prepared, the reserved hole is sealed with silicone rubber, the temperature of the upper mold of the hydraulic press is increased, and the silicone rubber is cured at a temperature of 80°C to 120°C for 4h to 8h.

[0036] Furthermore, in step (3), the inner ring short fiber quartz / phenolic premix and preforming are loaded, and the mold is preheated to 80°C to 90°C in advance using a hydraulic press, and the quartz fiber premix with a length of 15mm to 20mm is baked as in step (1), with a preheating temperature of 80°C to 90°C and a preheating time of 20min to 30min. The premix is ​​then loaded into the mold cavity so that it is evenly distributed on the outside of the probe-type temperature sensor built-in component, the mold temperature is set to 90°C, the insulation time is 30min, and a pressure of 2MPa to 3MPa is applied.

[0037] Furthermore, the on-off detection of the probe temperature sensor in step (3) is the same as the on-off detection of the probe temperature sensor in step (2).

[0038] Furthermore, in step (3), the long fiber quartz / phenolic premix of the outer ring of the end piece is filled, and the quartz fiber premix with a length of 30 mm to 50 mm described in step (1) is evenly loaded into the mold in 5 times, during which the mold temperature is maintained at 80°C to 90°C, and a hydraulic press is used to perform mold pre-pressing multiple times during the filling of the premix.

[0039] Furthermore, the curing system of the compression molding in step (3) is as follows: the temperature is kept at 80°C to 90°C for 20 minutes, and the temperature is increased to 150°C to 160°C at a heating rate of 2°C to 3°C / 10min. During the heating period, pressure is applied every 10 minutes, and the pressures are set to 5MPa, 10MPa, and 12MPa in sequence. The final pressure is 12MPa to 15MPa, and the temperature is kept at 150°C to 160°C for 20h to 24h.

[0040] Furthermore, in the probe temperature sensor test of step (3), temperature change data of the probe temperature sensor is detected in real time during the compression molding process.

[0041] Furthermore, in step (4), the rough finished product of the quartz / phenolic end structure of the embedded probe temperature sensor is machined to remove part of the front protection rod, and part of the protection rod is removed according to the reserved size.

[0042] Furthermore, the end product of step (4) is placed in an oven for post-curing, and the drying temperature of the oven is set to 150° C. to 160° C., and the drying time is 12 h to 24 h. The temperature is naturally reduced along with the oven.

[0043] (III) Beneficial effects

[0044] The above-mentioned technical scheme provides a method for compression molding of the quartz / phenolic terminal of the embedded probe temperature sensor, which makes full use of the flexibility of the compression molding process, the designability of the material and the excellent ablation resistance of the quartz fiber and phenolic resin itself, avoids the problem of being unable to operate due to the characteristics of the molding process, and reduces the difficulty of preparing the parts; the use of quartz / phenolic composite materials instead of traditional conical metal parts greatly reduces the total mass of the terminal; the product after molding has high dimensional accuracy, good internal quality and low manufacturing cost, and does not destroy the overall aerodynamic shape structure of the terminal while meeting the normal use of the embedded probe temperature sensor. After force and thermal test assessment, the material selection and design of the terminal have been significantly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 Schematic diagram of the cross-sectional structure of the probe temperature sensor protection bracket.

[0046] Figure 2 This is a schematic diagram of the upper surface structure of the reserved groove and semicircular positioning combination of the half-probe temperature sensor protection bracket.

[0047] Figure 3-1 , 3-2 They are the front view and left view of the metal end handle respectively.

[0048] Figure 4 Schematic diagram of the cross-sectional structure of the upper die.

[0049] Figure 5-1 , 5-2 They are the front view and left view of the end structural component respectively.

[0050] As shown in the figure: stepped groove 1, protective bracket 2, convex circular positioning combination structure 3, concave circular positioning combination structure 4, reserved groove 5, metal end handle 6, reserved hole 7, fixing pin hole 8, end structure component 9. DETAILED DESCRIPTION

[0051] In order to make the purpose, content and advantages of the present invention more clear, the specific implementation methods of the present invention are further described in detail below in conjunction with the drawings and examples.

[0052] Reference Figure 1 to Figure 5-2 As shown, the molding method of the quartz / phenolic terminal of the embedded probe temperature sensor in this embodiment includes the following steps:

[0053] (1) Molding and processing of probe temperature sensor protection bracket

[0054] Cut the quartz fiber tow into 30mm~50mm, weigh an appropriate amount of magnesium phenolic resin, and mix them thoroughly according to the weight ratio of quartz fiber: magnesium phenolic resin = 6:4 to prepare the required prepreg. Preheat the short fiber quartz / phenolic premix in an oven, preheating temperature: 80℃~90℃, preheating time: 20min~30min. Evenly load 2 parts of the short fiber quartz / phenolic premix into the mold cavity of the pressed blank twice. Close the mold, preheat, keep warm, apply contact pressure, heat, pressurize, keep warm, and keep pressure to obtain the pressed probe temperature sensor protection bracket preform blank. The curing system is: heat the mold temperature from room temperature to 80℃~90℃ in 40min~45min through an electric heating rod, maintain the mold temperature at 80℃~90℃, keep warm at this temperature for 40min~50min, and use a hydraulic press to apply a gauge pressure of 1MPa~2MPa when the insulation time reaches 20min~25min. Then the mold temperature is raised to 120℃~130℃ at a rate of 2℃-5℃ / 10min. After the temperature is raised, a hydraulic press is used to apply a gauge pressure of 15MPa~18MPa. The insulation time within the 120℃~130℃ system is calculated as t=a*d, where t is the insulation time in min; a is the magnesium phenolic insulation coefficient, which ranges from 4 to 5min in min / mm; d is the total thickness of the probe temperature sensor protection bracket preform blank in mm. During this period, the hydraulic press is used to adjust the press gauge pressure to always be within the range of 15MPa~18MPa.

[0055] Cut and mill the probe temperature sensor protection bracket blank Figure 1 The cross section shown is skirt-shaped, and the top is two semi-conical shapes of a semi-cylinder. The plane processing on the semi-conical shape is as follows: Figure 2 The 5 mm probe sensor reserved groove 5 and both ends of the reserved groove are respectively processed with a convex circular positioning combination structure 3 and a concave circular positioning combination structure 4.

[0056] (2) Packaging of probe temperature sensor

[0057] Place the probe temperature sensor in the reserved slot 5 of the protection bracket. Use the commonly used 3M908 double-sided tape on the market to fix the probe temperature sensor at the end point and the middle point of the sensor wiring. Figure 1The two halves of the probe temperature sensor bracket shown are positioned and combined into a whole according to the convex circular positioning combination structure 3 and the concave circular positioning combination structure 4. Use a digital display temperature controller or other equipment to test the on-off of the probe temperature sensor to ensure that the probe temperature sensor can work normally. Make a vacuum bag, reserve a glue nozzle and an exhaust port, prepare magnesium phenolic resin, connect the glue feed pipeline, close the glue nozzle switch, and use vacuum compaction to compact and fix the probe temperature sensor bracket. The reserved concave and convex circular combination structure prevents the protective bracket from shifting. When the vacuum bag pressure is between 0.08MPa and 0.1MPa, turn on the glue nozzle switch and inject magnesium phenolic resin. The resin needs to be debubbled during the glue injection process until the resin flowing out of the catheter position of the vacuumed part is no longer mixed with bubbles. After the magnesium phenolic resin fills the vacuum bag, close the exhaust valve, put it in the drying oven, set the temperature to 120°C, and cure it for 12 hours. Use three accompanying tooling to fix the probe temperature sensor on the machine tool, and turn the probe temperature sensor protection bracket into the following shape: Figure 1 The irregular stepped groove 1 shown in the figure obtains the probe temperature sensor built-in component.

[0058] (3) Forming of end parts

[0059] In the same manner as step (1), the quartz fiber bundle is cut into pieces of 15 mm to 20 mm to prepare a short fiber quartz / phenolic premix. Figure 1 The probe temperature sensor built-in component shown in FIG. 3 is assembled with the metal end handle shown in FIG. 3 , that is, the probe temperature sensor protection bracket 2 is inserted into the metal end handle 6, and the probe temperature sensor reserved line is led out as shown in FIG. Figure 4 A hole 7 is reserved next to the upper mold as shown, and a pin is used to pass through the metal end handle fixing pin hole 8 to fix the probe temperature sensor built-in component to the mold. Prepare silicone rubber adhesive, seal the reserved hole 7 with silicone rubber, increase the temperature of the upper mold of the hydraulic press, and cure the silicone rubber at a temperature of 80℃~120℃ for 4h~8h. Use a hydraulic press to preheat the mold to 80℃~90℃ in advance, and bake the premix of quartz fiber with a length of 15mm~20mm. The preheating temperature of the premix is ​​80℃~90℃, and the preheating time is 20min~30min. Then, load it into the mold cavity so that it is evenly distributed as shown. Figure 1On the outside of the probe temperature sensor built-in shown, set the mold temperature to 90℃, keep warm for 30min, and apply a pressure of 2MPa~3MPa. Check the on / off status of the probe temperature sensor. Ensure that the probe temperature sensor works normally. Preheat the premix of quartz fiber with a length of 30mm~50mm in an oven at a preheating temperature of 80℃~90℃ and a preheating time of 20min~30min, then evenly load it into the mold in 5 times, during which the mold temperature is maintained at 80℃~90℃. Use a hydraulic press to pre-press the mold several times during the premix loading. After the loading is completed, the end is cured and formed. The curing system is: keep warm at 80℃~90℃ for 20min, and heat to 150℃~160℃ at a heating rate of 2℃~3℃ / 10min. During the heating period, pressure is applied every 10 minutes. The pressure is set to 5MPa, 10MPa, and 12MPa in sequence. The final pressure is 12MPa~15MPa, and the temperature is kept at 150℃~160℃ for 20h~24h. During the molding process, the temperature change data of the probe temperature sensor is detected in real time.

[0060] (4) Processing of end parts

[0061] After the curing is completed, it is cooled naturally, and the end is demoulded using an ejection device. The rough finished product of the quartz / phenolic end structure of the embedded probe temperature sensor is machined according to the reserved size and the front part of the protective rod is removed. In order to ensure that the magnesium phenolic resin is completely cured, the end product is placed in an oven for post-curing. The drying temperature of the oven is set to 150℃~160℃, and the drying time is 12h~24h. After the curing is completed, the temperature is naturally lowered with the furnace. The embedded probe temperature sensor quartz / phenolic end structure 9 as shown in Figure 5 is obtained.

[0062] It can be seen from the above technical solution that the present invention has the following significant features:

[0063] (1) The probe temperature sensor is innovatively built into the terminal, achieving integral molding with the terminal.

[0064] (2) Compared with other preparation processes, the probe temperature sensor is directly built-in without machining or bonding, ensuring the aerodynamic shape of the end.

[0065] (3) Use composite internal parts instead of metal internal parts to reduce the weight of the terminal;

[0066] (4) The design of the stepped protection bracket combined with the irregular distribution of short fibers during molding improves the interface bonding strength between the built-in components and the end caps;

[0067] (5) The probe temperature sensor bonding package further protects the probe temperature sensor and prevents the sensor from being damaged during subsequent molding;

[0068] (6) The compression molding method is reliable, highly repeatable, and has a reasonable process coordination relationship, which reduces the difficulty of the molding process.

[0069] (7) Taking full advantage of the curing characteristics of phenolic resin, a gradient molding temperature level is set to pre-cure the protective bracket and then co-curing it with the end, thereby improving the mechanical and thermal properties of the product.

[0070] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for molding a quartz / phenolic end cap of an embedded probe temperature sensor, characterized in that: The following steps are involved: (1) Molding and processing of the probe temperature sensor protection bracket: The bracket is divided into two parts, the central docking groove is used to arrange the sensor, and the docking surface is provided with a positioning protrusion and a positioning groove; prepare short fiber quartz / phenolic premix, mold, press the probe temperature sensor protection bracket preform blank, process the probe temperature sensor protection bracket blank, and obtain a conical probe temperature sensor protection bracket; a protection rod is provided at the end of the bracket to prevent damage to the sensor when the press is closed in step (3); (2) Encapsulation of the probe temperature sensor: wiring the probe temperature sensor, bonding the probe temperature sensor, assembling the probe temperature sensor bracket, detecting the on-off state of the probe temperature sensor, bonding and encapsulating the probe temperature sensor, curing the probe temperature sensor bracket, and processing into an irregular stepped groove to obtain a probe temperature sensor built-in component; (3) Forming of the terminal component: preparing short fiber quartz / phenolic premix, placing the probe temperature sensor built-in component into the terminal mold, filling the inner circle of short fiber quartz / phenolic premix into the terminal mold, preforming, testing the probe temperature sensor on and off, filling the outer circle of long fiber quartz / phenolic premix into the terminal component, compression molding, and testing the probe temperature sensor to obtain a rough finished product of the quartz / phenolic terminal with an embedded probe temperature sensor; the terminal component mold includes an upper mold and a lower mold, the upper mold is used to fix the probe temperature sensor built-in component, is an inverted convex shape, its top plane contacts the press, the bottom surface is provided with a built-in component positioning groove, and the two side steps are provided with positioning pins that dock with the lower mold; the lower mold is a concave shape, including a mold cavity for molding the terminal component, the charging process is centered on the probe temperature sensor built-in component, the inner circle of the terminal component is defined as the area around the probe temperature sensor built-in component, and the outer circle of the terminal component is defined as the area around the inner surface of the lower mold cavity; (4) Processing of the terminal parts: The rough finished product of the quartz / phenolic terminal structure part of the embedded probe temperature sensor is machined to remove the front part of the protective rod, and the terminal product is placed in an oven for post-curing to obtain the quartz / phenolic terminal part of the embedded probe temperature sensor.

2. The method for molding the quartz / phenolic terminal of the embedded probe temperature sensor according to claim 1, characterized in that: In step (1), the short fiber quartz of the short fiber quartz / phenolic premix is ​​the reinforcing material, the quartz fiber bundle is cut, and the length of the cut fiber does not exceed 30 mm to 50 mm; the matrix material of the short fiber quartz / phenolic premix is ​​one or a mixture of aminophenolic resin, magnesium phenolic resin, and boron phenolic resin; the resin of the short fiber quartz / phenolic premix is ​​magnesium phenolic resin.

3. The method for molding the quartz / phenolic terminal of the embedded probe temperature sensor according to claim 2, characterized in that: In step (1), when filling the mold, the short fiber quartz / phenolic premix is ​​preheated in an oven at a temperature of 80°C to 90°C for a period of 20 to 30 minutes. The short fiber quartz / phenolic premix is ​​evenly filled into the mold cavity in two batches.

4. The method for molding the quartz / phenolic terminal of the embedded probe temperature sensor according to claim 3, characterized in that: In step (1), the probe temperature sensor protection bracket preform blank is pressed, the mold is molded, preheated, kept warm, contact pressure is applied, heated, pressurized, kept warm, and kept pressure to obtain a pressed probe temperature sensor protection bracket preform blank; the upper and lower molds are closed on a hydraulic press by the mold closing; the preheating is to heat the mold temperature from room temperature to 80°C to 90°C by an electric heating rod in 40min to 45min; the keeping warm is to maintain the mold temperature at 80°C to 90°C for 40min to 50min; the contact pressure is to use a hydraulic press to apply a gauge pressure of 1MPa to 2MPa during the keeping warm period of 20min to 25min; the For heating, the mold temperature is raised to 120°C~130°C at a rate of 2°C-5°C / 10min; for pressurization, after the heating is completed, a hydraulic press is used to apply a gauge pressure to 15MPa~18MPa; for heat preservation, the heat preservation time within the system of 120°C~130°C is calculated as t=a*d, wherein t is the heat preservation time, and the unit is min; a is the heat preservation coefficient of magnesium phenolic formaldehyde, and the value range is 4~5min, and the unit is min / mm; d is the total thickness of the probe temperature sensor protection bracket preform blank, and the unit is mm; for pressure holding, during the heat preservation period, the hydraulic press is used to adjust the press gauge pressure to always be within the range of 15MPa~18MPa.

5. The method for molding the quartz / phenolic terminal of the embedded probe temperature sensor according to claim 4, characterized in that: In step (1), the probe temperature sensor protection bracket blank is processed by cutting and milling the probe temperature sensor protection bracket blank into two semi-cones, and the probe sensor reserved groove and the concave-convex semicircular positioning combination structure are processed on the plane of the semi-cone; the semi-cone has a skirt-shaped cross-section and a semi-cylindrical head; the probe sensor reserved groove and the concave-convex semicircular positioning combination structure are processed on the plane of the semi-cone, a 5mm probe sensor reserved groove is milled on the semi-cone, and the concave-convex circular combination structure is processed at both ends of the reserved groove.

6. The method for molding the quartz / phenolic terminal of the embedded probe temperature sensor according to claim 5, characterized in that: In step (2), the wiring of the probe temperature sensor is performed by placing the probe temperature sensor line in the reserved groove of the probe temperature sensor protection bracket processed in step (1); the probe temperature sensor is bonded by using conventional 3M908 double-sided tape to cut and fix the probe temperature sensor at different points; the probe temperature sensor bracket is assembled by positioning the two halves of the probe temperature sensor bracket according to the concave and convex circular grooves to form a whole; the on-off detection of the probe temperature sensor is performed by using a digital display thermostat or other equipment to test the on-off of the probe temperature sensor; the probe temperature sensor bonding package and the probe temperature sensor bracket curing are performed by using vacuum compaction to compact and fix the probe temperature sensor bracket, and magnesium phenolic resin is injected into the vacuum nozzle at the other end, and then the probe temperature sensor is placed in a drying oven set at 120°C and cured for 12 hours; the processing into a stepped shape is performed by using three accompanying tooling to fix the probe temperature sensor, and an irregular stepped groove is machined using a lathe to obtain a probe temperature sensor built-in component.

7. The method for molding the quartz / phenolic terminal of the embedded probe temperature sensor according to claim 6, characterized in that: In step (3), the preparation of the short fiber quartz / phenolic premix is ​​carried out in the same manner as in step (1), and the length of the fibers cut from the quartz fiber bundle does not exceed 15 mm to 20 mm; in the assembly of the probe temperature sensor built-in component, the probe temperature sensor built-in component of step (2) is assembled with the metal end handle, the probe temperature sensor reserved line is led out of the reserved hole next to the upper mold, a silicone rubber adhesive is prepared, the reserved hole is sealed with silicone rubber, the upper mold temperature of the hydraulic press is increased, and the silicone rubber is cured at a temperature of 80°C to 120°C for 4h to 8h.

8. The method for molding the quartz / phenolic terminal of the embedded probe temperature sensor according to claim 7, characterized in that: In step (3), the inner ring short fiber quartz / phenolic premix and preforming are loaded, and the mold is preheated to 80°C to 90°C using a hydraulic press. The premix of quartz fiber with a length of 15mm to 20mm is baked as in step (1). The premix preheating temperature is 80°C to 90°C, and the preheating time is 20min to 30min. The premix is ​​then loaded into the mold cavity so that it is evenly distributed on the outside of the probe temperature sensor built-in component. The mold temperature is set to 90°C, the insulation time is 30min, and the pressure is applied at 2MPa to 3MPa. The on-off detection of the probe temperature sensor is performed in the same way as in step (2).

9. The method for molding the quartz / phenolic terminal of the embedded probe temperature sensor according to claim 8, characterized in that: In step (3), the long fiber quartz / phenolic premix of the outer ring of the end piece is filled, and the quartz fiber premix with a length of 30mm to 50mm described in step (1) is evenly loaded into the mold in 5 times, during which the mold temperature is maintained at 80℃ to 90℃, and a hydraulic press is used to perform mold pre-pressing multiple times during the filling of the premix; the compression molding and curing system are as follows: at 80℃ to 90℃, keep warm for 20min, and heat to 150℃ to 160℃ at a heating rate of 2℃ to 3℃ / 10min. During the heating period, pressure is applied every 10 minutes, and the pressures are set to 5MPa, 10MPa, and 12MPa in sequence. The final pressure is 12MPa to 15MPa, and the temperature is kept at 150℃ to 160℃ for 20h to 24h; the probe temperature sensor test detects the temperature change data of the probe temperature sensor in real time during the compression molding process.

10. The method for molding a quartz / phenolic terminal of an embedded probe temperature sensor according to claim 9, characterized in that: In step (4), the rough finished product of the quartz / phenolic end structure of the embedded probe temperature sensor is machined to remove the front part of the protective rod, and the part of the protective rod is removed according to the reserved size; the end product is placed in an oven for post-curing, and the drying temperature of the oven is set to 150°C ~ 160°C, the drying time is 12h ~ 24h, and the temperature is naturally reduced with the furnace.

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