A buffer device for uniform pressing of a multi-layer circuit board
Through the design of buffer components and typesetting components, the problems of pressure uniformity and insufficient buffering capacity in multi-layer pressing of circuit boards are solved, uniform pressing and stability of circuit boards are achieved, and the quality of circuit boards is improved.
Patent Information
- Application Number
- CN202411436107.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-15
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2044-10-15
AI Technical Summary
The existing multi-layer lamination technology for circuit boards has deficiencies in pressure uniformity and buffering capacity, resulting in unstable circuit board quality.
The design of buffer components and layout components, including sliding plates, buffer pads, buffer springs and dampers, ensures uniform pressure distribution and balanced plate thickness through reasonable plate arrangement and buffer structure, and uses components such as hydraulic cylinders and limit columns to improve pressing accuracy and stability.
It achieves uniform lamination of multiple layers of circuit boards, ensures uniform distribution of adhesive and balanced board thickness, reduces the risk of circuit board damage, and improves lamination quality and stability.
Smart Images
Figure CN119317046B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of circuit board manufacturing, and particularly relates to a buffer device for uniform pressing of multiple layers of a circuit board. BACKGROUND
[0002] A circuit board is an indispensable component in electronic devices, which provides a mechanical platform for fixing and connecting electronic components and transmits electronic signals through conductive paths. The circuit board makes the layout and connection of electronic components more orderly, stable and reliable. The manufacturing process of the circuit board includes design, manufacturing file preparation, material selection, image transfer, etching, lamination, drilling, electroplating, solder mask, surface treatment, component assembly and welding. With the development of electronic devices towards miniaturization and high performance, the manufacturing technology of the circuit board is also constantly improving, such as using thinner substrates, finer line widths and higher density assembly technology. The design and manufacturing of the circuit board are important links in the field of electronic engineering, which directly affect the performance, reliability and cost of electronic products. In the manufacturing of a multilayer circuit board, the multilayer circuit board needs to be pressed, and therefore, a buffer device for uniform pressing of multiple layers of a circuit board is particularly needed.
[0003] However, in the existing production process of the circuit board, the uniform distribution of adhesive and the thickness balance of the board layers in the pressing stage are crucial. However, the traditional pressing technology has deficiencies in pressure uniformity and buffering capacity, which may cause fluctuations and instability in the quality of the final circuit board. SUMMARY
[0004] The present application relates to the technical field of circuit board manufacturing, and particularly relates to a buffer device for uniform pressing of multiple layers of a circuit board.
[0005] In order to achieve the above object, the present application provides the following technical scheme: a buffer device for multi-layer uniform pressing of a circuit board, comprising a fixed frame, the inner side surface of the fixed frame is fixedly connected with a control center, one side surface of the fixed frame is fixedly connected with a side plate, the upper surface of the side plate is threadedly connected with a supporting rod, the upper surface of the fixed frame is fixedly connected with a panel, the upper surface of the panel is fixedly connected with a vertical plate, the upper surface of the vertical plate is fixedly connected with a top plate, the upper surface of the top plate is provided with a pressing assembly, the inner side surface of the pressing assembly is provided with a mold assembly, the mold assembly comprises a limiting groove, a limiting block, a sliding block, a positioning groove, a positioning block, a lower mold, a guide column, an upper mold and a guide groove, the outer side surface of the mold assembly is provided with a buffer assembly, and the upper surface of the buffer assembly is provided with a layout assembly;
[0006] The buffer assembly comprises a sliding plate, a sliding hole, a buffer pad, a connecting block, a buffer spring and a damper, the outer side surface of the guide column is slidably connected with the sliding plate, the upper surface of the sliding plate is provided with the sliding hole, the upper surface of the sliding plate is fixedly connected with the buffer pad, the lower surface of the sliding plate is fixedly connected with the connecting block, the lower surface of the connecting block is fixedly connected with the buffer spring, and the lower surface of the buffer spring is fixedly connected with the damper.
[0007] Preferably, the side plate is provided with a plurality of groups on the outer side surface of the fixed frame, and the vertical plate is symmetrically arranged with the central axis of the top plate.
[0008] Preferably, the sliding hole is provided with a plurality of groups on the surface of the sliding plate, and the inner side size of the sliding hole is consistent with the outer side size of the guide column.
[0009] Preferably, the connecting block is provided with a plurality of groups on the lower surface of the sliding plate, and the damper is fixedly connected with the lower mold.
[0010] Preferably, the pressing assembly comprises a hydraulic cylinder, a limiting column, a bottom plate, a pressing plate and a through hole, the upper surface of the top plate is fixedly connected with the hydraulic cylinder, the lower surface of the top plate is fixedly connected with the limiting column, the lower surface of the limiting column is fixedly connected with the bottom plate, the lower surface of the hydraulic cylinder is fixedly connected with the pressing plate, and the upper surface of the pressing plate is provided with the through hole.
[0011] Preferably, the limiting column is provided with a plurality of groups on the upper surface of the top plate, and the outer side size of the limiting column is consistent with the inner side size of the through hole.
[0012] Preferably, the inner side surface of the bottom plate is provided with a limiting groove, the inner side surface of the limiting groove is slidably connected with a limiting block, one side surface of the limiting block is fixedly connected with a sliding block, the upper surface of the sliding block is provided with a positioning groove, the upper surface of the positioning groove is slidably connected with a positioning block, the upper surface of the positioning block is fixedly connected with a lower mold, the upper surface of the lower mold is fixedly connected with a guide column, the outer side surface of the guide column is slidably connected with an upper mold, and the lower surface of the upper mold is provided with a guide groove.
[0013] Preferably, the inner side dimension of the positioning groove and the outer side dimension of the positioning block are matched, and the positioning groove is provided with a plurality of groups on the surface of the sliding block.
[0014] Preferably, the upper mold is fixedly connected with the pressing plate, the outer side dimension of the guide column and the inner wall dimension of the guide groove are matched, and the guide column is provided with a plurality of groups.
[0015] Preferably, the layout assembly comprises a first new cowhide paper, a first high-expansion steel plate, a first layer of circuit board, a first prepreg, a second prepreg, a second layer of circuit board, a third prepreg, a fourth prepreg, a third layer of circuit board, a second high-expansion steel plate and a second new cowhide paper, the upper surface of the buffer pad is placed with the first new cowhide paper, the upper surface of the first new cowhide paper is placed with the first high-expansion steel plate, the upper surface of the first high-expansion steel plate is placed with the first layer of circuit board, the upper surface of the first layer of circuit board is placed with the first prepreg, the upper surface of the first prepreg is placed with the second prepreg, the upper surface of the second prepreg is placed with the second layer of circuit board, the upper surface of the second layer of circuit board is placed with the third prepreg, the upper surface of the third prepreg is placed with the fourth prepreg, the upper surface of the fourth prepreg is placed with the third layer of circuit board, the upper surface of the third layer of circuit board is placed with the second high-expansion steel plate, and the upper surface of the second high-expansion steel plate is placed with the second new cowhide paper.
[0016] Compared with the prior art, the beneficial effects of the circuit board multi-layer uniform pressing buffer device are as follows: through the arrangement of the buffer assembly and the layout assembly, reasonable layout is needed before the circuit board pressing operation, first, the first new kraft paper is placed on the upper surface of the buffer pad, the new kraft paper has the effect of preventing slipping, which can prevent the slippage and misplacement of the layers of materials in the subsequent operation process, then, the first high-expansion steel plate is placed on the first new kraft paper, the high-expansion steel plate can play the role of buffering the pressure in the pressing process, when the pressure applied by the pressing assembly is received, the high-expansion steel plate can deform to a certain extent according to the size of the pressure, so as to disperse the pressure and make the pressure more uniformly transmitted to each layer of circuit board and prepreg, the first layer of circuit board is placed on the first high-expansion steel plate, then the first prepreg, the second prepreg, the second layer of circuit board, the third prepreg, the fourth prepreg and the third layer of circuit board are sequentially placed on the first layer of circuit board, the prepreg will be melted by heat in the pressing process and filled in the gap between the circuit boards to play the role of bonding and fixing the circuit boards, different prepregs can be selected according to the requirements and process parameters of the circuit board to ensure good bonding effect and electrical performance, the second high-expansion steel plate is placed on the third layer of circuit board to further enhance the buffering effect, finally, the second new kraft paper is placed on the second high-expansion steel plate to also play the role of preventing slipping and ensure the stability of the entire layout structure in the pressing process, when the pressing assembly starts to work, the pressing plate moves downward, the pressure is transmitted to the layout assembly through the upper die, at this time, the high-expansion steel plate, the prepreg and the new kraft paper jointly act to make the pressure uniformly distributed, realizing the multi-layer uniform pressing of the circuit board and ensuring the thickness balance of the board layers and the uniform distribution of the adhesive, when the circuit board is pressed, the upper die presses the lower die, the guide column plays the role of guiding, the sliding plate can slide along the outer surface of the guide column, when the pressure is transmitted, the buffer pad on the upper surface of the sliding plate first absorbs and relieves part of the pressure, then the pressure continues to be transmitted downward, the sliding plate moves downward, the connecting block below the sliding plate moves together with the sliding plate, the buffer spring connected below the connecting block starts to be compressed, the buffer spring further absorbs the pressure through the elastic deformation in the compression process to play the role of buffering, at the same time, the damper connected with the buffer spring also starts to play the role, the damper converts the energy generated by the pressure into heat energy and other forms of energy through the internal damping mechanism and gradually consumes them, so as to reduce the impact of the pressure and ensure that the entire device can stably buffer when subjected to the pressure, protect the circuit board and reduce the damage to the circuit board. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 It is a side view of the appearance structure of the present application;
[0018] Figure 2Schematic diagram of the mutual cooperation structure of the side plate and the supporting rod of the present application;
[0019] Figure 3 Schematic diagram of the mutual cooperation structure of the panel and the vertical plate of the present application;
[0020] Figure 4 Schematic diagram of the mutual cooperation structure of the limiting block and the sliding block of the present application;
[0021] Figure 5 Schematic diagram of the mutual cooperation structure of the pressing plate and the upper mold of the present application;
[0022] Figure 6 Schematic diagram of the mutual cooperation structure of the sliding plate and the buffer pad of the present application;
[0023] Figure 7 Schematic diagram of the mutual cooperation structure of the lower mold and the guide column of the present application;
[0024] Figure 8 Schematic diagram of the mutual cooperation structure of the present application Figure 1 Enlarged structure schematic diagram of position A in the present application;
[0025] Figure 9 Schematic diagram of the mutual cooperation structure of the present application Figure 7 Enlarged structure schematic diagram of position B in the present application.
[0026] In the figure: 1, fixed frame; 2, control center; 3, side plate; 4, supporting rod; 5, panel; 6, vertical plate; 7, top plate; 8, pressing assembly; 801, hydraulic cylinder; 802, limiting column; 803, bottom plate; 804, pressing plate; 805, through hole; 9, mold assembly; 901, limiting groove; 902, limiting block; 903, sliding block; 904, positioning groove; 905, positioning block; 906, lower mold; 907, guide column; 908, upper mold; 909, guide groove; 10, buffer assembly; 1001, sliding plate; 1002, sliding hole; 1003, buffer pad; 1004, connecting block; 1005, buffer spring; 1006, damper; 11, layout assembly; 1101, first new kraft paper; 1102, first high-expansion steel plate; 1103, first layer of circuit board; 1104, first prepreg; 1105, second prepreg; 1106, second layer of circuit board; 1107, third prepreg; 1108, fourth prepreg; 1109, third layer of circuit board; 1110, second high-expansion steel plate; 1111, second new kraft paper. DETAILED DESCRIPTION
[0027] Clearly, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by a person of ordinary skill in the art without creative labor fall within the protection scope of the present application.
[0028] Please refer to Figures 1-9 The present application provides a technical scheme: a buffer device for uniform pressing of a multi-layer circuit board, comprising a fixed frame 1, the inner surface of the fixed frame 1 is fixedly connected with a control center 2, one side surface of the fixed frame 1 is fixedly connected with a side plate 3, the upper surface of the side plate 3 is threadedly connected with a supporting rod 4, the upper surface of the fixed frame 1 is fixedly connected with a panel 5, the upper surface of the panel 5 is fixedly connected with a vertical plate 6, the upper surface of the vertical plate 6 is fixedly connected with a top plate 7, the upper surface of the top plate 7 is provided with a pressing assembly 8, the inner surface of the pressing assembly 8 is provided with a mold assembly 9, the mold assembly 9 comprises a limiting groove 901, a limiting block 902, a sliding block 903, a positioning groove 904, a positioning block 905, a lower mold 906, a guide column 907, an upper mold 908 and a guide groove 909, the outer surface of the mold assembly 9 is provided with a buffer assembly 10, and the upper surface of the buffer assembly 10 is provided with a layout assembly 11.
[0029] The buffer assembly 10 comprises a sliding plate 1001, a sliding hole 1002, a buffer pad 1003, a connecting block 1004, a buffer spring 1005 and a damper 1006, the outer side surface of the guide column 907 is slidably connected with the sliding plate 1001, the upper surface of the sliding plate 1001 is provided with the sliding hole 1002, the upper surface of the sliding plate 1001 is fixedly connected with the buffer pad 1003, the lower surface of the sliding plate 1001 is fixedly connected with the connecting block 1004, the lower surface of the connecting block 1004 is fixedly connected with the buffer spring 1005, the lower surface of the buffer spring 1005 is fixedly connected with the damper 1006, through the arrangement of the sliding plate 1001, the sliding hole 1002, the buffer pad 1003, the connecting block 1004, the buffer spring 1005 and the damper 1006, when the circuit board is pressed, the upper die 908 is pressed against the lower die 906, the guide column 907 plays a guiding role, the sliding plate 1001 can slide along the outer side surface of the guide column 907, when the pressure is transmitted, the buffer pad 1003 on the upper surface of the sliding plate 1001 is first contacted, the buffer pad 1003 preliminarily absorbs and relieves part of the pressure, then the pressure continues to be transmitted downward, the sliding plate 1001 moves downward, the connecting block 1004 below the sliding plate 1001 moves together with the sliding plate 1001, the buffer spring 1005 connected below the connecting block 1004 starts to be compressed, the buffer spring 1005 further absorbs the pressure through the elastic deformation in the compression process, plays a buffering role, at the same time, the damper 1006 connected with the buffer spring 1005 also starts to play a role, the damper 1006 converts the energy generated by the pressure into heat energy and other forms of energy through the internal damping mechanism and gradually consumes them, thereby reducing the impact of the pressure, ensuring that the whole device can smoothly buffer when subjected to pressure, protecting the circuit board and reducing damage to the circuit board.
[0030] Further, the side plates 3 are arranged on the outer side surface of the fixing frame 1, the vertical plates 6 are symmetrically arranged with the central axis of the top plate 7, through the arrangement of the side plates 3, in use, the surface of the side plates 3 is threadedly connected with the support rods 4, a plurality of side plates 3 and support rods 4 can support and reinforce the fixing frame 1 from different directions, improving the stability and anti-deformation ability of the fixing frame 1.
[0031] Further, the sliding holes 1002 are arranged on the surface of the sliding plate 1001, the inner size of the sliding holes 1002 matches the outer size of the guide column 907, through the arrangement of the sliding holes 1002, in use, the sliding holes 1002 cooperate with the guide column 907, on one hand, the stability of the sliding plate 1001 sliding on the guide column 907 is increased, when external pressure acts on the whole device, the sliding plate 1001 is subjected to forces in different directions, the sliding holes 1002 jointly act to ensure that the sliding plate 1001 always smoothly slides along the predetermined direction of the guide column 907, and deviation or shaking does not occur.
[0032] Further, the connecting blocks 1004 are arranged on the lower surface of the sliding plate 1001, the damper 1006 is fixedly connected with the lower mold 906, through the arrangement of the damper 1006, in use, the damper 1006 is fixedly connected with the lower mold 906, when external force makes the sliding plate 1001 move downward, the connecting blocks 1004 transmit the force to the buffer spring 1005, the buffer spring 1005 is compressed, at the same time, part of the force is transmitted to the damper 1006 through the connecting blocks 1004, the damper 1006 can transmit the force to the lower mold 906 due to the fixed connection with the lower mold 906, and the energy generated by the pressure is converted into heat energy or other forms of energy consumption through the damping effect of the damper 1006, so as to reduce the impact of the pressure.
[0033] Further, the pressing assembly 8 comprises a hydraulic cylinder 801, a limiting column 802, a bottom plate 803, a pressing plate 804 and a through hole 805, the upper surface of the top plate 7 is fixedly connected with the hydraulic cylinder 801, the lower surface of the top plate 7 is fixedly connected with the limiting column 802, the lower surface of the limiting column 802 is fixedly connected with the bottom plate 803, the lower surface of the hydraulic cylinder 801 is fixedly connected with the pressing plate 804, the upper surface of the pressing plate 804 is provided with the through hole 805, through the arrangement of the hydraulic cylinder 801, the limiting column 802, the bottom plate 803, the pressing plate 804 and the through hole 805, in use, the hydraulic cylinder 801 is started to generate downward thrust, the thrust is transmitted to the pressing plate 804 fixedly connected below, the pressing plate 804 is pushed downward to move, the limiting column 802 fixedly connected below the top plate 7 plays a guiding role in the whole pressing process, when the pressing plate 804 moves downward under the pushing of the hydraulic cylinder 801, the limiting column 802 passes through the through hole 805 to ensure that the pressing plate 804 can only move in the vertical direction, so as to prevent deviation in the horizontal direction and ensure the accuracy and stability of pressing.
[0034] Further, the plurality of limiting columns 802 are arranged on the upper surface of the top plate 7, and the outer dimension of the limiting column 802 is consistent with the inner dimension of the through hole 805. When in use, the through hole 805 on the surface of the pressing plate 804 slides along the limiting column 802, preventing the horizontal deviation of the pressing plate 804, thereby ensuring the accuracy and stability of the pressing.
[0035] Further, the inner surface of the bottom plate 803 is provided with a limiting groove 901, the inner surface of the limiting groove 901 is slidably connected with a limiting block 902, one side surface of the limiting block 902 is fixedly connected with a sliding block 903, the upper surface of the sliding block 903 is provided with a positioning groove 904, the upper surface of the positioning groove 904 is slidably connected with a positioning block 905, the upper surface of the positioning block 905 is fixedly connected with a lower mold 906, the upper surface of the lower mold 906 is fixedly connected with a guide column 907, the outer surface of the guide column 907 is slidably connected with an upper mold 908, the lower surface of the upper mold 908 is provided with a guide groove 909. Through the cooperation of the limiting groove 901, the limiting block 902, the sliding block 903, the positioning groove 904, the positioning block 905, the lower mold 906, the guide column 907, the upper mold 908 and the guide groove 909, when in use, the limiting groove 901 on the inner surface of the bottom plate 803 works with the limiting block 902, when it is necessary to adjust the position of the lower mold 906, the limiting block 902 can slide in the limiting groove 901, thereby driving the sliding block 903 fixedly connected therewith to move, the positioning groove 904 on the upper surface of the sliding block 903 is used to cooperate with the positioning block 905, and the positioning block 905 is fixedly connected with the lower mold 906, so that the lower mold 906 can be stably placed on the sliding block 903, when it is necessary to press different sizes or types of workpieces, the position of the lower mold 906 can be adjusted by the movement of the sliding block 903 in the limiting groove 901 to adapt to different production requirements, and the guide column 907 fixedly connected to the upper surface of the lower mold 906 cooperates with the guide groove 909 provided on the lower surface of the upper mold 908, when pressing, when the upper mold 908 moves downward under the action of the hydraulic cylinder 801, the guide groove 909 slides along the guide column 907, ensuring that the upper mold 908 can accurately align with the lower mold 906, ensuring the accuracy and stability of the pressing, and the cooperation of the guide column 907 and the guide groove 909 can also prevent the upper mold 908 from deviating or shaking during the pressing process, thereby improving the pressing quality.
[0036] Further, the inner size of the positioning groove 904 and the outer size of the positioning block 905 are matched, and the positioning groove 904 is provided on the surface of the sliding block 903 in multiple groups. Through the arrangement of the positioning groove 904 and the positioning block 905, in use, the lower mold 906 will be subjected to the pressure from the upper mold 908 and various impact forces that may be generated, and the matched positioning groove 904 and the positioning block 905 can effectively prevent the displacement or shaking of the lower mold 906, so as to ensure the precision and stability of the pressing operation, ensure that each part of the circuit board is subjected to uniform pressure in the pressing process, and thus improve the product quality.
[0037] Further, the upper mold 908 is fixedly connected with the pressing plate 804, the outer size of the guide column 907 and the inner wall size of the guide groove 909 are matched, the guide column 907 is provided in multiple groups, and through the arrangement of the guide column 907, in use, when the pressing plate 804 drives the upper mold 908 to move downward, the guide groove 909 of the upper mold 908 slides along the guide column 907, so as to prevent the upper mold 908 from being deviated or shaken in the vertical direction, ensure that the upper mold 908 can be accurately aligned with the lower mold 906, avoid the horizontal movement of the upper mold 908 in the pressing process, and further enhance the precision and reliability of the pressing operation.
[0038] Further, the layout assembly 11 includes a first new cowhide paper 1101, a first high-expansion steel plate 1102, a first layer of circuit board 1103, a first prepreg 1104, a second prepreg 1105, a second layer of circuit board 1106, a third prepreg 1107, a fourth prepreg 1108, a third layer of circuit board 1109, a second high-expansion steel plate 1110, and a second new cowhide paper 1111. The upper surface of the buffer pad 1003 is placed with the first new cowhide paper 1101, the upper surface of the first new cowhide paper 1101 is placed with the first high-expansion steel plate 1102, the upper surface of the first high-expansion steel plate 1102 is placed with the first layer of circuit board 1103, the upper surface of the first layer of circuit board 1103 is placed with the first prepreg 1104, the upper surface of the first prepreg 1104 is placed with the second prepreg 1105, the upper surface of the second prepreg 1105 is placed with the second layer of circuit board 1106, the upper surface of the second layer of circuit board 1106 is placed with the third prepreg 1107, the upper surface of the third prepreg 1107 is placed with the fourth prepreg 1108, the upper surface of the fourth prepreg 1108 is placed with the third layer of circuit board 1109, the upper surface of the third layer of circuit board 1109 is placed with the second high-expansion steel plate 1110, and the upper surface of the second high-expansion steel plate 1110 is placed with the second new cowhide paper 1111. Through the arrangement of the first new cowhide paper 1101, the first high-expansion steel plate 1102, the first layer of circuit board 1103, the first prepreg 1104, the second prepreg 1105, the second layer of circuit board 1106, the third prepreg 1107, the fourth prepreg 1108, the third layer of circuit board 1109, the second high-expansion steel plate 1110, and the second new cowhide paper 1111, reasonable layout is required before the circuit board pressing operation. First, the first new cowhide paper 1101 is placed on the upper surface of the buffer pad 1003. The new cowhide paper has an anti-skid effect, which can prevent the sliding dislocation of the layers of materials in the subsequent operation process. Then, the first high-expansion steel plate 1102 is placed on the first new cowhide paper 1101. The high-expansion steel plate can buffer the pressure during the pressing process. When subjected to the pressure applied by the pressing assembly 8, the high-expansion steel plate can deform to some extent according to the size of the pressure, thereby dispersing the pressure and making the pressure more uniformly transmitted to the layers of circuit board and prepreg. The first layer of circuit board 1103 is placed on the first high-expansion steel plate 1102. Then, the first prepreg 1104, the second prepreg 1105, the second layer of circuit board 1106, the third prepreg 1107, the fourth prepreg 1108, and the third layer of circuit board 1109 are sequentially placed on the first layer of circuit board 1103. The prepreg will melt and fill the gaps between the circuit boards during the pressing process, thereby playing a role in bonding and fixing the circuit boards. Different prepregs can be selected according to the requirements and process parameters of the circuit board to ensure good bonding effect and electrical performance.A second high expansion steel plate 1110 is placed above the third layer of circuit board 1109 to further enhance the buffering effect. Finally, a second new kraft paper 1111 is placed above the second high expansion steel plate 1110 to also serve as an anti-skid function to ensure the stability of the entire plate arrangement structure during the pressing process. When the pressing assembly 8 starts to work, the pressing plate 804 moves downward and transmits the pressure to the plate arrangement assembly 11 through the upper mold 908. At this time, the high expansion steel plate, the prepreg, and the new kraft paper work together to evenly distribute the pressure, achieving uniform pressing of multiple layers of circuit boards, while ensuring the thickness balance of the board layers and the uniform distribution of the adhesive.
[0039] Working principle: the limit groove 901 and the limit block 902 cooperate with each other when the position of the lower mold 906 needs to be adjusted, the limit block 902 can slide in the limit groove 901, thereby driving the sliding block 903 fixedly connected therewith to move, the positioning groove 904 on the upper surface of the sliding block 903 is used for cooperating with the positioning block 905, the positioning block 905 is fixedly connected with the lower mold 906, so that the lower mold 906 can be stably placed on the sliding block 903, when different sizes or types of workpieces need to be pressed, the position of the lower mold 906 can be adjusted by the movement of the sliding block 903 in the limit groove 901 to adapt to different production requirements, the guide column 907 fixedly connected to the upper surface of the lower mold 906 cooperates with the guide groove 909 opened on the lower surface of the upper mold 908, when the upper mold 908 moves downward under the pushing action of the hydraulic cylinder 801, the guide groove 909 slides along the guide column 907, ensuring that the upper mold 908 can accurately align with the lower mold 906, ensuring the precision and stability of the pressing, at the same time, the cooperation of the guide column 907 and the guide groove 909 can also prevent the upper mold 908 from deviating or shaking during the pressing process, thereby improving the pressing quality, before the circuit board pressing operation, reasonable plate arrangement is needed, first, place the first new kraft paper 1101 on the upper surface of the buffer pad 1003, the new kraft paper has an anti-skid effect, which can prevent the sliding misplacement of each layer of material in the subsequent operation process, then place the first high expansion steel plate 1102 on the first new kraft paper 1101, the high expansion steel plate can play a role in buffering the pressure during the pressing process, when subjected to the pressure applied by the pressing assembly 8, the high expansion steel plate can deform to a certain extent according to the size of the pressure, thereby dispersing the pressure, so that the pressure is more uniformly transmitted to each layer of circuit board and prepreg, place the first layer of circuit board 1103 on the first high expansion steel plate 1102, then place the first prepreg 1104, the second prepreg 1105, the second layer of circuit board 1106, the third prepreg 1107, the fourth prepreg 1108 and the third layer of circuit board 1109 on the first layer of circuit board 1103 in turn, the prepreg will melt and fill the gap between the circuit boards during the pressing process, playing a role in bonding and fixing the circuit boards, different prepregs can be selected according to the requirements and process parameters of the circuit board to ensure good bonding effect and electrical performance, place the second high expansion steel plate 1110 on the third layer of circuit board 1109 to further enhance the buffering effect, finally, place the second new kraft paper 1111 on the second high expansion steel plate 1110, which also plays an anti-skid role to ensure the stability of the entire plate arrangement structure during the pressing process, when the pressing assembly 8 starts working, the pressing plate 804 moves downward, the pressure is transmitted to the plate arrangement assembly 11 through the upper mold 908, at this time, the high expansion steel plate, the prepreg and the new kraft paper work together to make the pressure uniformly distributed, realizing the multi-layer uniform pressing of the circuit board,At the same time, the thickness of the board layer is balanced and the adhesive is evenly distributed, the hydraulic cylinder 801 is started, and a downward thrust is generated, which is transmitted to the pressing plate 804 fixedly connected below, pushing the pressing plate 804 to move downward, and moving the upper mold 908 at the same time. The limiting column 802 fixedly connected below the top plate 7 plays a guiding role in the entire pressing process. When the pressing plate 804 moves downward under the push of the hydraulic cylinder 801, the limiting column 802 passes through the through hole 805 to ensure that the pressing plate 804 can only move in the vertical direction, preventing it from deviating in the horizontal direction, thereby ensuring the accuracy and stability of the pressing. When pressing the circuit board, the upper mold 908 presses the lower mold 906, and the guide column 907 plays a guiding role. The sliding plate 1001 can slide along the outer surface of the guide column 907. When the pressure is transmitted, it first contacts the buffer pad 1003 on the upper surface of the sliding plate 1001, which preliminarily absorbs and relieves part of the pressure. Then, the pressure continues to be transmitted downward, causing the sliding plate 1001 to move downward. The connecting block 1004 below the sliding plate 1001 moves together with the sliding plate 1001. The buffer spring 1005 connected below the connecting block 1004 begins to be compressed. During the compression process, the buffer spring 1005 further absorbs the pressure through its elastic deformation, playing a buffering role. At the same time, the damper 1006 connected with the buffer spring 1005 also begins to play a role. The damper 1006 converts the energy generated by the pressure into heat energy and other forms of energy through its internal damping mechanism and gradually consumes it, thereby reducing the impact of the pressure. It ensures that the entire device can smoothly buffer when subjected to pressure, protects the circuit board, and reduces damage to the circuit board.
[0040] Although embodiments of the present application have been shown and described, it is to be understood that various modifications, substitutions, replacements and changes can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A buffer device for uniformly pressing multiple layers of a circuit board, comprising a fixing frame (1), characterized in that: The inner surface of the fixing frame (1) is fixedly connected to the control center (2), the side surface of the fixing frame (1) is fixedly connected to the side plate (3), the upper surface of the side plate (3) is threadedly connected to the support rod (4), the upper surface of the fixing frame (1) is fixedly connected to the panel (5), the upper surface of the panel (5) is fixedly connected to the vertical plate (6), the upper surface of the vertical plate (6) is fixedly connected to the top plate (7), the upper surface of the top plate (7) is provided with a pressing assembly (8), the inner surface of the pressing assembly (8) is provided with a mold assembly (9), the mold assembly (9) includes a limiting groove (901), a limiting block (902), a sliding block (903), a positioning groove (904), a positioning block (905), a lower mold (906), a guide column (907), an upper mold (908) and a guide groove (909), the outer surface of the mold assembly (9) is provided with a buffer assembly (10), and the upper surface of the buffer assembly (10) is provided with a typesetting assembly (11); The buffer assembly (10) comprises a sliding plate (1001), a sliding hole (1002), a buffer pad (1003), a connecting block (1004), a buffer spring (1005) and a damper (1006); the outer surface of the guide column (907) is slidably connected to the sliding plate (1001); the upper surface of the sliding plate (1001) is provided with a sliding hole (1002); the upper surface of the sliding plate (1001) is fixedly connected to the buffer pad (1003); the lower surface of the sliding plate (1001) is fixedly connected to the connecting block (1004); the lower surface of the connecting block (1004) is fixedly connected to the buffer spring (1005); and the lower surface of the buffer spring (1005) is fixedly connected to the damper (1006).
2. The buffer device for uniformly laminating multiple layers of a circuit board according to claim 1, characterized in that: The side panels (3) are provided in multiple groups on the outer surface of the fixing frame (1), and the vertical panels (6) are symmetrically arranged about the central axis of the top panel (7).
3. The buffer device for uniformly laminating multiple layers of a circuit board according to claim 1, characterized in that: The sliding holes (1002) are provided in multiple groups on the surface of the sliding plate (1001), and the inner dimensions of the sliding holes (1002) match the outer dimensions of the guide posts (907).
4. The buffer device for uniformly laminating multiple layers of a circuit board according to claim 1, characterized in that: The connection blocks (1004) are provided in multiple groups on the lower surface of the sliding plate (1001), and the damper (1006) is fixedly connected to the lower mold (906).
5. The buffer device for uniformly laminating multiple layers of a circuit board according to claim 1, characterized in that: The pressing assembly (8) comprises a hydraulic cylinder (801), a limiting column (802), a bottom plate (803), a pressing plate (804) and a through hole (805); the upper surface of the top plate (7) is fixedly connected to the hydraulic cylinder (801); the lower surface of the top plate (7) is fixedly connected to the limiting column (802); the lower surface of the limiting column (802) is fixedly connected to the bottom plate (803); the lower surface of the hydraulic cylinder (801) is fixedly connected to the pressing plate (804); and the upper surface of the pressing plate (804) is provided with a through hole (805).
6. The buffer device for uniformly laminating multiple layers of a circuit board according to claim 5, characterized in that: Multiple groups of the limiting columns (802) are provided on the upper surface of the top plate (7), and the outer dimensions of the limiting columns (802) match the inner dimensions of the through holes (805).
7. The buffer device for uniformly laminating multiple layers of a circuit board according to claim 5, characterized in that: A limiting groove (901) is provided on the inner surface of the bottom plate (803), the inner surface of the limiting groove (901) is slidably connected to a limiting block (902), a side surface of the limiting block (902) is fixedly connected to a sliding block (903), a positioning groove (904) is provided on the upper surface of the sliding block (903), a positioning block (905) is slidably connected to the upper surface of the positioning groove (904), a lower mold (906) is fixedly connected to the upper surface of the positioning block (905), a guide column (907) is fixedly connected to the upper surface of the lower mold (906), an outer surface of the guide column (907) is slidably connected to an upper mold (908), and a guide groove (909) is provided on the lower surface of the upper mold (908).
8. The buffer device for uniformly laminating multiple layers of a circuit board according to claim 7, characterized in that: The inner dimensions of the positioning grooves (904) match the outer dimensions of the positioning block (905), and a plurality of positioning grooves (904) are provided on the surface of the sliding block (903).
9. The buffer device for uniformly laminating multiple layers of a circuit board according to claim 7, characterized in that: The upper mold (908) is fixedly connected to the pressing plate (804), the outer dimensions of the guide posts (907) match the inner wall dimensions of the guide grooves (909), and multiple groups of the guide posts (907) are provided.
10. The buffer device for uniformly laminating multiple layers of a circuit board according to claim 1, characterized in that: The typesetting component (11) includes a first new kraft paper (1101), a first high expansion steel plate (1102), a first layer of circuit board (1103), a first semi-cured sheet (1104), a second semi-cured sheet (1105), a second layer of circuit board (1106), a third semi-cured sheet (1107), a fourth semi-cured sheet (1108), a third layer of circuit board (1109), a second high expansion steel plate (1110) and a second new kraft paper (1111), the first new kraft paper (1101) is placed on the upper surface of the buffer pad (1003), the first high expansion steel plate (1102) is placed on the upper surface of the first new kraft paper (1101), the first layer of circuit board (1103) is placed on the upper surface of the first high expansion steel plate (1102), the first layer of circuit board (1111) is placed 103) is placed on the upper surface of a first semi-cured sheet (1104), a second semi-cured sheet (1105) is placed on the upper surface of the first semi-cured sheet (1104), a second layer of circuit board (1106) is placed on the upper surface of the second semi-cured sheet (1105), a third semi-cured sheet (1107) is placed on the upper surface of the second layer of circuit board (1106), a fourth semi-cured sheet (1108) is placed on the upper surface of the third semi-cured sheet (1107), a third layer of circuit board (1109) is placed on the upper surface of the fourth semi-cured sheet (1108), a second high expansion steel plate (1110) is placed on the upper surface of the third layer of circuit board (1109), and a second new kraft paper (1111) is placed on the upper surface of the second high expansion steel plate (1110).
Citation Information
Patent Citations
Laminating method and device for metal-based printed circuit board
CN111083885A
PCB pressing device
CN114567977A