Semiconductor process equipment

Abstract

The invention discloses semiconductor process equipment which comprises a cavity, a base, a plurality of bearing parts and a speed measuring part, the base is rotatably mounted in the cavity, the bearing parts are rotatably mounted on the base, and the bearing parts are used for bearing a to-be-processed part; a driving air channel and a detection through hole are formed in the area, corresponding to the bearing part, of the base, the driving air channel is connected with an air source so as to drive the bearing part to rotate relative to the base, the speed measuring part and the base are relatively fixed, and the speed measuring part and the detection through hole are oppositely arranged; the speed measuring piece is used for detecting the rotating speed of the bearing piece relative to the base. The semiconductor process equipment can solve the problem that the current semiconductor process equipment cannot monitor the rotating speed of the wafer, so that adverse effects on the thickness uniformity and doping uniformity of the wafer are possibly generated due to the fact that the rotating speed of the wafer is relatively high or slow.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor processing technology, and specifically relates to a semiconductor process equipment. Background Art

[0002] Vapor deposition is an important process in the wafer processing process. During the vapor deposition process, the wafer is carried on a support, and the support is rotatably mounted on a base, so that the support can drive the wafer to rotate. At the same time, the base also rotates relative to the cavity driven by the shaft. However, during the wafer processing process, if the speed at which the wafer rotates relative to the base with the support exceeds or falls below the set speed, it will affect the thickness uniformity and doping uniformity of the wafer, and the current semiconductor process equipment does not have the ability to monitor the rotation speed of the wafer. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a semiconductor process equipment to solve the problem that the current semiconductor process equipment cannot monitor the rotation speed of the wafer, which may adversely affect the thickness uniformity and doping uniformity of the wafer due to the faster or slower rotation speed of the wafer.

[0004] The embodiment of the present application discloses a semiconductor process equipment, which includes a chamber, a base, a carrier and a speed measuring part, wherein the base is rotatably installed in the chamber, the number of the carriers is multiple, and each of the carriers is rotatably installed on the base, and each of the carriers is used to carry a workpiece to be processed;

[0005] A driving air channel and a detection through hole are provided in the area of ​​the base corresponding to the supporting member. The driving air channel is connected to an air source to drive the supporting member to rotate relative to the base. The speed measuring member is relatively fixed to the base, and the speed measuring member is arranged relative to the detection through hole. The speed measuring member is used to detect the rotation speed of the supporting member relative to the base.

[0006] An embodiment of the present application discloses a semiconductor process equipment, wherein a base is rotatably mounted within a cavity, and a carrier is rotatably mounted on the base, and a driving air passage is provided in an area of ​​the base corresponding to the carrier, and the driving air passage is connected to an air source, so that a workpiece to be processed carried on the carrier can rotate relative to the base along with the carrier, and the workpiece to be processed can rotate relative to the cavity along with the base.

[0007] At the same time, a detection through hole is also provided in the area corresponding to the carrier on the base. The speed measuring part is relatively fixed to the base, and the speed measuring part and the detection through hole are arranged relative to each other, so that the speed measuring part can use the detection through hole to obtain the rotation condition of the carrier, and then detect the rotation speed of the carrier relative to the base. When there is a difference or a large difference between the detection result and the set speed, the purpose of adjusting the rotation speed of the carrier is achieved by controlling the corresponding driving airway, thereby preventing the carrier from rotating too fast and having an adverse effect on parameters such as thickness uniformity and doping uniformity of the workpiece to be processed. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0009] Figure 1 A schematic diagram of the structure of a semiconductor process equipment disclosed in an embodiment of the present application;

[0010] Figure 2 for Figure 1 An enlarged schematic diagram of a portion of the structure of a semiconductor process equipment is shown;

[0011] Figure 3 It is an exploded schematic diagram of a part of the structure including a base and a carrier in the semiconductor process equipment disclosed in the embodiment of the present application;

[0012] Figure 4 A schematic diagram of the structure of a carrier in a semiconductor process equipment disclosed in an embodiment of the present application;

[0013] Figure 5 for Figure 4 A cross-sectional schematic diagram of a carrier in a semiconductor process equipment is shown;

[0014] Figure 6 A schematic diagram showing the corresponding positions of the driving air channel and the carrier in the semiconductor process equipment disclosed in the embodiment of the present application;

[0015] Figure 7 A schematic diagram of the structure of a base in a semiconductor process equipment disclosed in an embodiment of the present application;

[0016] Figure 8 A schematic diagram of the structure of a cavity and an inductor coil in a semiconductor process device disclosed in an embodiment of the present application;

[0017] Fig. 9 This is a schematic diagram of the structure of the mounting flange in the semiconductor process equipment disclosed in the embodiment of the present application;

[0018] Fig.10 This is a schematic diagram of the air intake of the semiconductor process equipment disclosed in the embodiment of the present application.

[0019] Reference numerals:

[0020] 1-upper cover, 2-temperature measuring part, 3-cover plate, 4-bearing part, 5-part to be processed, 6-base, 7-connecting shaft, 8-pressing part, 9-center shaft, 10-support part, 11-inlet flange, 12-cavity, 13-slip ring, 14-mounting flange, 15-speed measuring part, 16-driving motor, 17-fixing sleeve, 18-linear driving part, 19-inductor coil, 20-inlet interface, 21-delivery channel, 22-locating pin, 23-driving airway, 24-detection through hole, 25-groove, 26-arc through hole, 27-connecting channel. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0023] like Figure 1-Figure 10 As shown, an embodiment of the present application discloses a semiconductor process equipment, which includes a cavity 12, a base 6, a carrier 4 and a speed measuring component 15. Of course, the semiconductor process equipment may also include other components such as an inductor 19 and an upper cover 1. Considering the simplicity of the text, a detailed introduction is not given here.

[0024] Among them, the cavity 12 is the external structure of the semiconductor process equipment, which is used to provide a process space and an installation foundation. The base 6 is used to provide a bearing function for the wafer, and it is rotatably installed in the cavity 12. Specifically, the semiconductor process equipment may include a rotating shaft, so that the base 6 can be rotatably installed in the cavity 12 through the rotating shaft, so that the base 6 can drive the wafer to rotate around the axis of the rotating shaft, which is the revolution. The rotating shaft is connected to a rotating drive device such as a drive motor 16, so that the base 6 can be driven to rotate relative to the cavity 12. Optionally, the rotating shaft and the drive motor 16 can be installed in the cavity 12. In order to prevent the drive motor 16 and other devices from having an adverse effect on the process environment in the cavity 12, and in order to increase the service life of the drive motor 16, the rotating shaft can be extended outside the cavity 12, and the drive motor 16 can be installed outside the cavity 12.

[0025] The carrier 4 is rotatably mounted on the base 6. Specifically, a connecting shaft 7 may be provided at the bottom of the carrier 4 so that the carrier 4 can form a rotational fit relationship with the base 6 through the connecting shaft 7. The carrier 4 is used to carry the workpiece 5 to be processed, and the number of the carrier 4 may be one. In order to improve the processing efficiency of the wafer, in the semiconductor process equipment disclosed in the embodiment of the present application, the number of the carriers 4 is multiple, and the multiple carriers 4 are all rotatably mounted on the base 6. Accordingly, the multiple carriers 4 can be spaced and distributed on the base 6 to ensure that the carriers 4 do not interfere with each other.

[0026] In addition, in order to ensure that the base 6 can drive each wafer to rotate relative to the cavity 12 along the axial direction around the rotation axis, as shown in FIG. Figure 3 As shown, each carrier 4 is located outside the rotation center of the base 6. More specifically, when there are multiple carriers 4, the multiple carriers 4 can be evenly and spacedly distributed on the base 6 along the direction around the rotation axis. Of course, when there are multiple carriers 4, the number of speed measuring components 15 and detection through holes 24 are also multiple, and they correspond one to one, ensuring that the rotation speed of the wafer carried by each carrier 4 can be monitored by the corresponding speed measuring component 15.

[0027] In order to ensure that the wafer can still rotate relative to the base 6 during the processing, Figure 3 As shown, a driving air channel 23 is provided in the area corresponding to the carrier 4 on the base 6, and the driving air channel 23 is connected to the gas source to drive the carrier 4 to rotate relative to the base 6. Specifically, in order to ensure that the airflow can drive the carrier 4 to rotate relative to the base 6, the driving air channel 23 may include a spiral air channel, and in order to improve the driven stability of the carrier 4, the number of spiral air channels may be multiple, and the multiple spiral air channels are evenly and entangledly distributed, so that under the action of the gas source, the carrier 4 is driven to rotate relative to the base 6, which is the self-rotation of the wafer.

[0028] As mentioned above, since the wafer is rotated by the airflow, the rotation speed of the wafer cannot be accurately controlled. Based on this, in the embodiment of the present application, in order to obtain the rotation speed of the wafer, a detection through hole 24 is also provided in the area corresponding to the carrier 4 on the base 6. As mentioned above, the semiconductor process equipment disclosed in the embodiment of the present application includes a speed measuring component 15, and the speed measuring component 15 is relatively fixed to the base 6. The speed measuring component 15 can be specifically installed in the cavity 12 and connected to the rotating shaft, so that the speed measuring component 15 can form a relatively fixed relationship with the base 6 and has the ability to detect the rotation speed of the corresponding carrier 4.

[0029] As described above, the base 6 is provided with a detection through hole 24. Based on this, in order not to hinder the normal processing of the wafer, the speed measuring component 15 can be set below the base 6, and the speed measuring component 15 is set opposite to the detection through hole 24, so as to use the speed measuring component 15 to detect the rotation speed of the carrier 4 relative to the base 6. Specifically, the speed measuring component 15 can be a pulse transmitter and receiver, and by designing two or more marking points on the surface of the carrier 4 facing the speed measuring component 15, the different reflection conditions of the pulse at the marking points and other areas of the carrier 4 are utilized, and the interval time between two adjacent marking points is detected in combination with parameters such as the position of the marking points to obtain the rotation speed of the carrier 4. Then, according to the actual rotation speed of the carrier 4, by changing the flow rate of the gas from the gas source into the driving gas channel 23, etc., the purpose of controlling the rotation speed of the carrier 4 can be achieved, and the rotation speed of the carrier 4 can be ensured to be basically maintained at the set speed.

[0030] An embodiment of the present application discloses a semiconductor process equipment, wherein a base 6 is rotatably mounted within a cavity 12, and a carrier 4 is rotatably mounted on the base 6, and a driving air channel 23 is provided on the base 6 in an area corresponding to the carrier 4, and the driving air channel 23 is connected to an air source, so that a workpiece 5 carried on the carrier 4 can rotate relative to the base 6 along with the carrier 4, and the workpiece 5 can rotate relative to the cavity 12 along with the base 6.

[0031] At the same time, a detection through hole 24 is also provided in the area corresponding to the carrier 4 on the base 6. The speed measuring component 15 is relatively fixed to the base 6, and the speed measuring component 15 and the detection through hole 24 are arranged relative to each other, so that the speed measuring component 15 can use the detection through hole 24 to obtain the rotation status of the carrier 4, and then detect the rotation speed of the carrier 4 relative to the base 6. When there is a difference or a large difference between the detection result and the set speed, the purpose of adjusting the rotation speed of the carrier 4 is achieved by controlling the corresponding driving airway, thereby preventing the rotation speed of the carrier 4 from being too fast and having an adverse effect on parameters such as the thickness uniformity and doping uniformity of the workpiece 5 to be processed.

[0032] In order to prevent the speed measuring component 15 from having an adverse effect on the process environment in the cavity 12 and to prevent the service life of the speed measuring component 15 from being shortened by the process environment, the speed measuring component 15 is further arranged outside the cavity 12 and can be fixedly connected to the rotating shaft, thereby ensuring that the speed measuring component 15 can form a relatively fixed relationship with the base 6.

[0033] At the same time, in order to ensure that the speed measuring member 15 can still perform the detection work normally, an arc-shaped through hole 26 is provided at the bottom of the cavity 12, and the circumference of the arc-shaped through hole 26 coincides with the circumference of the speed measuring member 15 in the axial direction of the cavity 12, so as to ensure that the speed measuring member 15 can detect the rotation speed of the carrier 4 through the arc-shaped through hole 26. Of course, since the arc-shaped through hole 26 is not a complete circular structure, in the process of the speed measuring member 15 rotating with the rotating shaft, the speed measuring member 15 can be periodically arranged relative to the arc-shaped through hole 26, and during the time period when the speed measuring member 15 and the arc-shaped through hole 26 are arranged relative to each other, the speed measuring member 15 can detect the rotation speed of the carrier 4.

[0034] Specifically, the angle actually spanned by the arc-shaped through hole 26 can be determined according to actual parameters such as the rotation speed of the base 6, which is not limited here. Of course, in order to ensure that a closed process environment can still be formed in the cavity 12, a transparent cover plate can be provided at the arc-shaped through hole 26. The transparent cover plate can be formed of a high-temperature resistant and transparent material such as quartz. In addition, as mentioned above, the semiconductor process equipment includes an inductor 19, which is usually provided between the bottom of the cavity 12 and the base 6. For this purpose, Figure 8 As shown, in the process of laying out the speed measuring component 15 and the arc-shaped through hole 26, coordination with the inductor 19 is required so that the gap between the arc-shaped through hole 26 and the cable of the inductor 19 corresponds to each other, thereby ensuring that the speed measuring component 15 can work normally.

[0035] As described above, characteristic points can be set on the carrier 4 so that the speed measuring element 15 can detect the rotation speed of the carrier 4 by distinguishing the characteristic points from the area on the carrier 4 where no characteristic points are set, and detecting the rotation interval time between adjacent interval points.

[0036] In a specific embodiment of the present application, Figure 4 and Figure 5As shown, a plurality of grooves 25 are provided on the side of the bearing member 4 facing the speed measuring member 15, and the plurality of grooves 25 are evenly and spacedly distributed along the axial direction of the bearing member 4. The speed measuring member 15 can detect the number of grooves 25 that pass over the speed measuring member 15 in the time period relative to the arc-shaped through hole 26, and determine the rotation speed of the bearing member 4 by combining the time period relative to the arc-shaped through hole 26 and the total number of even grooves 25 on the bearing member 4. In the case of adopting the above technical solution, since the plurality of grooves 25 are evenly distributed on the surface of the side of the bearing member 4 facing the speed measuring member 15, the airflow force acting on each groove 25 is basically the same, thereby preventing the arrangement of the grooves 25 from having an adverse effect on the rotation stability of the bearing member 4; at the same time, the detection accuracy of the above detection method is relatively high.

[0037] Specifically, the groove 25 can be a circular blind hole, and the diameter and depth of each groove 25 can be made the same, so as to further prevent the setting of the groove 25 from having an adverse effect on the rotation stability of the carrier 4. More specifically, the depth of the groove 25 can be 1 mm, in which case the groove 25 has the ability to be detected by the speed measuring element 15, and its depth is relatively small, so that it will not have a significant impact on the normal rotation of the carrier 4. At the same time, in the process of arranging multiple grooves 25, the center of the speed measuring element 15 can be arranged relative to the center of each groove, so as to further improve the detection accuracy of the speed measuring element 15.

[0038] As described above, the speed measuring member 15 can be installed on the rotating shaft and rotate with the rotating shaft. In order to prevent the power cables of the speed measuring member 15 from being entangled on the rotating shaft during the rotation of the rotating shaft, thereby hindering the normal operation of the rotating shaft, such as Figure 1 and Figure 2 As shown, the semiconductor process equipment disclosed in the embodiment of the present application also includes a slip ring 13, a mounting flange 14, a first electrical connector and a second electrical connector, wherein the slip ring 13 and the mounting flange 14 are both sleeved and installed outside the rotating shaft, the stator of the slip ring 13 is fixedly and sealedly connected to the cavity 12, the rotor of the slip ring 13 is fixedly connected to the mounting flange 14, and the speed measuring component 15 is installed on the mounting flange 14, so that under the drive of the rotating shaft, the rotor of the slip ring 13, the mounting flange 14 and the speed measuring component 15 can all rotate with the rotating shaft relative to the cavity 12.

[0039] Based on the above structure, the first electrical connector is installed on the stator of the slip ring 13 and is electrically connected to the power supply. The second electrical connector is installed on the rotor of the slip ring 13 and is electrically connected to the speed measuring component 15. By making the first electrical connector and the second electrical connector contact and electrically connected to each other, the power supply can supply power to the speed measuring component 15 and the power cable of the speed measuring component 15 can be prevented from being wrapped around the rotating shaft.

[0040] When the speed measuring component 15 is installed through the above-mentioned slip ring 13 and the mounting flange 14, the position of the speed measuring component 15 on the mounting flange 14 can be determined accordingly according to the position of the detection through hole 24 set on the base 6 to ensure that the speed measuring component 15 can be opposite to the detection through hole 24.

[0041] In order to minimize the size of the mounting flange 14 and thereby reduce the installation space occupied by the mounting flange 14, as shown in FIG. Figure 7 As shown, the center of the detection hole 24 is located on the line between the rotation center of the base 6 and the rotation center of the carrier 4. In this case, the distance between the detection hole 24 and the rotation center of the base 6 can be made relatively small, so that the diameter of the mounting flange 14 can also be relatively small, thereby reducing the installation space occupied by the mounting flange 14.

[0042] As described above, the bearing member 4 can be rotatably mounted on the base 6 via the connecting shaft 7. In order to improve the installation stability of the bearing member 4 and prevent the bearing member 4 from deviating or tipping over during the rotation relative to the base 6, as shown in FIG. Figure 3 As shown, the semiconductor process equipment disclosed in the embodiment of the present application also includes a cover plate 3, which is arranged on the bearing side of the base 6. A positioning pin 22 is provided on the side of the cover plate 3 facing the base 6, and a corresponding positioning hole can be provided on the base 6, so that the cover plate 3 can be relatively fixed to the base 6 in the radial direction of the base 6 through the positioning pin 22, so that the cover plate 3 and the base 6 form a relatively stable fixed relationship.

[0043] At the same time, avoidance holes are provided on the cover plate 3, and the avoidance holes are arranged one by one corresponding to the support members 4, and the support members 4 are embedded in the avoidance holes, so that the cover plate 3 is used to provide a circumferential limiting effect for the support members 4, thereby improving the position stability of the support members 4; in addition, when the cover plate 3 is provided, the cover plate 3 can also be used to provide a certain protection for the base 6 to prevent materials from being deposited on the base 6. On the one hand, it prevents the sediment from clogging the driving airway 23, and on the other hand, it can prevent corrosion of the base 6, thereby improving the service life of the base 6.

[0044] As described above, the semiconductor process equipment disclosed in the embodiment of the present application may include an upper cover 1. Based on this, the semiconductor process equipment disclosed in the embodiment of the present application may also include a temperature measuring component 2 and a controller, and the temperature measuring component 2 is installed on the side of the upper cover 1 facing the base 6. The temperature measuring component 2 is used to measure the temperature of the workpiece 5 to be processed carried on the carrier 4, and the temperature measuring component 2 is connected to the controller, so that the temperature measuring component 2 can feed back the measured temperature value to the controller, thereby enabling the controller to control the increase of the airflow of the driving airway 23 corresponding to the carrier 4 when the actual temperature of the workpiece 5 to be processed is greater than the preset temperature, so that the temperature of the workpiece 5 to be processed carried by the carrier 4 is reduced, so that the temperature of the workpiece 5 to be processed meets the preset temperature, and the processing effect of the workpiece 5 to be processed is further improved. Of course, in the actual application process, it is necessary to take into account the actual temperature and actual rotation speed of the workpiece 5 to be processed on the carrier to improve the processing accuracy of the workpiece 5 to be processed as a whole.

[0045] As described above, the number of the carriers 4 can be multiple. In the case of multiple carriers 4, separate temperature measuring components 2 can be set at corresponding positions of the upper cover 1 according to the positions of the multiple carriers 4. In the case of multiple carriers 4, the number of temperature measuring components 2 can be one, and the temperature measuring component 2 is used to detect the temperature of the workpieces 5 carried by the multiple carriers 4, so as to reduce the number of devices in the semiconductor process equipment, which can reduce the cost on the one hand and reduce the control difficulty on the other hand. At the same time, Fig.10 As shown, the driving air channels 23 corresponding to the multiple carriers 4 can be connected to the controller, and when the temperature of one or more workpieces 5 to be processed is greater than the preset temperature, the controller can increase the air flow corresponding to the carrier 4 by controlling the air source (or branch pipeline) connected to the corresponding driving air channel 23, thereby reducing the temperature of the workpiece 5 to be processed supported by the carrier 4.

[0046] As described above, the driving airway 23 is connected to the gas source. Since the driving airway 23 is arranged in the cavity 12, and the gas source is usually arranged outside the cavity 12, and since the driving airway 23 rotates with the base 6 relative to the cavity 12, in order to reduce the difficulty of connecting the gas path and ensure the airtightness of gas delivery, as shown in FIG. Figure 1 and Figure 2 As shown, the semiconductor process equipment also includes a fixed sleeve 17, which is sleeved outside the rotating shaft and is relatively fixed to the cavity 12. The fixed sleeve 17 is provided with a gas supply channel, and an air inlet interface 20 is provided at the outer end of the gas supply channel. The air inlet interface 20 is connected to the gas source, so that the gas connecting pipeline between the two will not be entangled outside the rotating shaft as the rotating shaft rotates, thereby ensuring the stability of the gas delivery process.

[0047] At the same time, the shaft is provided with a connecting channel 27 and a conveying channel 21, the inner end of the air supply channel is connected to the connecting channel 27, and the connecting channel 27 is an annular structure, so that no matter how the connecting channel 27 rotates with the shaft relative to the fixed sleeve 17, it can be ensured that the connecting channel 27 can always be connected to the inner end of the air supply channel and achieve the purpose of gas delivery. Correspondingly, the connecting channel 27 is connected to the driving air channel 23 through the conveying channel 21, so that the gas in the gas source can be conveyed to the driving air channel 23 through the air supply channel, the connecting channel 27 and the conveying channel 21, so as to drive the bearing 4 to rotate.

[0048] In addition, in order to facilitate the formation of the delivery channel 21 and improve the installation stability of the base 6, optionally, the semiconductor process equipment disclosed in the embodiment of the present application further includes a support 10 and an air inlet flange 11, wherein the base 6 is connected to the support 10, and the support 10 is connected to the air inlet flange 11, the air inlet flange 11 is installed at the bottom of the cavity 12, and the air inlet flange 11 can be connected to the rotating shaft, so that the rotating shaft drives the base 6 to rotate through the air inlet flange 11 and the support 10. In this case, a part of the delivery channel 21 can be formed on the rotating shaft, and another part of the delivery channel 21 can be formed on the air inlet flange 11, the support 10 and the base 6, so that the delivery channel 21 can communicate with the connecting channel 27 and the driving air channel 23.

[0049] As described above, the base 6 can be directly mounted on the rotating shaft, or the base 6 can be indirectly mounted on the rotating shaft through the support member 10 and the air inlet flange 11. In another embodiment of the present application, the semiconductor process equipment also includes a clamping member 8 and a linear drive member 18, the clamping member 8 is arranged on the bearing side of the base 6, and the clamping member 8 is connected to the linear drive member 18 through a central shaft 9, the central shaft 9 is arranged inside the rotating shaft, and the central shaft 9 rotates synchronously with the rotating shaft. The linear drive member 18 can drive the clamping member 8 to move along the axial direction of the rotating shaft, thereby fixing the clamping member 8 and the base 6 in the rotation direction of the rotating shaft, so that the clamping member 8 and the base 6 can rotate synchronously. Furthermore, in the embodiment of the present application, the hollow shaft can be directly driven by the rotating shaft, thereby driving the clamping member 8 to rotate, and the clamping member 8 and the base 6 are relatively fixed in the rotation direction of the rotating shaft, thereby driving the base 6 to rotate relative to the cavity 12.

[0050] When adopting the technical solution disclosed in the embodiment of the present application, the base 6 and the clamping member 8 can be separately arranged, so that the components in the cavity 12 are multiple scattered components. When the process environment temperature in the cavity 12 is high, the device can be prevented from expanding and deforming due to heat and affecting the rotation accuracy of the wafer, thereby improving the processing effect of the wafer.

[0051] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0052] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A semiconductor process equipment, characterized in that: The machine comprises a cavity (12), a base (6), a bearing (4) and a speed measuring part (15), wherein the base (6) is rotatably mounted in the cavity (12), there are a plurality of bearings (4), and each of the bearings (4) is rotatably mounted on the base (6), and each of the bearings (4) is used to carry a workpiece (5) to be processed; A driving air passage (23) and a detection through hole (24) are provided on the base (6) in an area corresponding to the supporting member (4); the driving air passage (23) is connected to an air source to drive the supporting member (4) to rotate relative to the base (6); the speed measuring member (15) is fixed relative to the base (6), and the speed measuring member (15) is arranged relative to the detection through hole (24); the speed measuring member (15) is used to detect the rotation speed of the supporting member (4) relative to the base (6).

2. The semiconductor process equipment according to claim 1, characterized in that: The speed measuring component (15) is arranged outside the cavity (12); the base (6) is rotatably mounted on the cavity (12) via a rotating shaft; the speed measuring component (15) is fixedly connected to the rotating shaft; an arc-shaped through hole (26) is provided at the bottom of the cavity (12); when the speed measuring component (15) rotates with the rotating shaft, the speed measuring component (15) is periodically arranged relative to the arc-shaped through hole (26).

3. The semiconductor process equipment according to claim 2, characterized in that: A plurality of grooves (25) are provided on a side of the carrier (4) facing the speed measuring member (15); the plurality of grooves (25) are evenly and spacedly distributed along the circumference of the carrier (4); and the speed measuring member (15) is used to detect the number of grooves (25) that pass over the speed measuring member (15) within a time period relative to the arc-shaped through hole (26).

4. The semiconductor process equipment according to claim 2, characterized in that: The semiconductor process equipment further comprises a slip ring (13), a mounting flange (14), a first electrical connector and a second electrical connector. The slip ring (13) and the mounting flange (14) are both sleeved and mounted outside the rotating shaft. The stator of the slip ring (13) is fixedly connected to the cavity (12). The rotor of the slip ring (13) is fixedly connected to the mounting flange (14). The speed measuring component (15) is mounted on the mounting flange (14). The first electrical connector is mounted on the stator of the slip ring (13) and is electrically connected to a power source. The second electrical connector is mounted on the rotor of the slip ring (13) and is electrically connected to the speed measuring component (15). The first electrical connector and the second electrical connector are in contact and electrically connected.

5. The semiconductor process equipment according to claim 4, characterized in that: The center of the detection through hole (24) is located on the line between the rotation center of the base (6) and the rotation center of the bearing member (4).

6. The semiconductor process equipment according to claim 1, characterized in that: The semiconductor process equipment further comprises a cover plate (3), wherein the cover plate (3) is arranged on the bearing side of the base (6), a positioning pin (22) is provided on the side of the cover plate (3) facing the base (6), the cover plate (3) and the base (6) are relatively fixed in the radial direction of the base (6) via the positioning pin (22), the cover plate (3) is provided with an avoidance hole, the avoidance hole is arranged in one-to-one correspondence with the bearing member (4), and the bearing member (4) is embedded in the avoidance hole.

7. The semiconductor process equipment according to claim 1, characterized in that: The semiconductor process equipment further comprises an upper cover (1), a temperature measuring element (2) and a controller. The temperature measuring element (2) is installed on a side of the upper cover (1) facing the base (6). The temperature measuring element (2) is used to measure the temperature of a workpiece (5) to be processed supported by the support (4). The temperature measuring element (2) is connected to the controller. The controller is used to control the increase of the airflow in the driving airway (23) corresponding to the support (4) when the actual temperature of the workpiece (5) to be processed is greater than a preset temperature.

8. The semiconductor process equipment according to claim 7, characterized in that: The number of the temperature measuring element (2) is one.

9. The semiconductor process equipment according to claim 1, characterized in that: The semiconductor process equipment further comprises a fixed sleeve (17), the base (6) is rotatably mounted on the cavity (12) via a rotating shaft, the fixed sleeve (17) is sleeved outside the rotating shaft, and the fixed sleeve (17) and the cavity (12) are relatively fixed, the fixed sleeve (17) is provided with an air supply channel, the rotating shaft is provided with a connecting channel (27) and a conveying channel (21), the outer end of the air supply channel is connected to an air source, the inner end of the air supply channel is connected to the connecting channel (27), the connecting channel (27) is an annular structure, and the connecting channel (27) is connected to the driving air channel (23) via the conveying channel (21).

10. The semiconductor process equipment according to claim 1, characterized in that: The semiconductor process equipment also includes a clamping member (8) and a linear drive member (18). The base (6) is rotatably mounted on the cavity (12) via a rotating shaft. The clamping member (8) is arranged on the bearing side of the base (6). The clamping member (8) is connected to the linear drive member (18) via a central axis (9). The central axis (9) is arranged inside the rotating shaft, and the central axis (9) rotates synchronously with the rotating shaft. The linear drive member (18) is used to drive the clamping member (8) to move along the axial direction of the rotating shaft, and fix the clamping member (8) and the base (6) in the rotation direction of the rotating shaft.

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