Manufacturing method of PCB (Printed Circuit Board) embedded with chip and PCB

Abstract

The invention provides a manufacturing method of a PCB embedded with a chip and the PCB, and belongs to the technical field of circuit board production. The manufacturing method comprises the following steps: manufacturing a power module; the power module comprises a heat conduction module and a chip, a mounting groove is formed in the heat conduction module, and the chip is sintered in the mounting groove; obtaining a substrate of the PCB, and embedding the power module into the substrate; conducting holes are formed in the substrate where the power module is embedded, the conducting holes are formed in the two opposite sides of the power module, and the conducting holes are connected with the chip and the heat conduction module respectively; and electroplating the via hole to obtain the PCB embedded with the power module. The PCB manufactured through the method is high in heat dissipation capacity, the installation requirement of high-power components can be met, and long-term, efficient and stable operation of products is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production, and in particular to a method for manufacturing a PCB board with embedded chips and the PCB board. Background Art

[0002] With the rapid development of the electronics industry, electronic products are rapidly evolving towards high power, miniaturization, and high-density component concentration. This development trend has led to an increase in the power density of electronic products, while the volume has gradually decreased, which has brought major challenges to the design of the electronics industry. Especially in the field of PCB (printed circuit board), since electronic components generate a lot of heat when working, if effective heat dissipation cannot be achieved, this heat will cause the temperature of the electronic components and PCB to rise significantly, reducing the working stability of the PCB. Studies have shown that when the operating temperature of electronic components is in the range of (70-80)℃, their reliability will decrease by 5% with every 1℃ increase in temperature. Therefore, developing efficient PCB heat dissipation management technology to reduce its operating temperature is of great significance to improving the stability and service life of the PCB and the entire electronic system.

[0003] In traditional methods, in order to solve the heat dissipation problem of high-power devices, it is usually adopted to combine power chips with metal substrates and embed them into PCBs, or to embed components directly into boards. This embedding technology conducts heat to the other side of the PCB or dissipates it through heat dissipation devices through the combination of metal substrates or components with PCBs, thereby reducing the operating temperature of components and PCBs to a certain extent. The existing methods for embedding power chips into PCBs are mainly divided into two categories according to the mounting method: pad connection and via connection. Among them, the pad connection method includes two methods: bare chip bonding and chip mounting. In the bare chip bonding method, heat is only dissipated through the PCB board itself and the chip itself, and this method has limited heat dissipation capacity; while the chip mounting, although the heat generated by the chip is conducted to the outside of the PCB on one side through the solder point, the heat dissipation effect is still insufficient. For the via connection method, although the heat dissipation capacity is improved to a certain extent, since it still mainly relies on single-sided heat dissipation, it is still difficult to meet the demand for efficient heat dissipation when facing the demand for higher power components.

[0004] Therefore, it is necessary to improve the existing embedded chip circuit board to overcome the defects of the prior art. Summary of the invention

[0005] In order to overcome the problems existing in the related art, one of the purposes of the present invention is to provide a method for manufacturing a PCB board with an embedded chip. The PCB board manufactured by this method has a strong heat dissipation capability, can meet the installation requirements of high-power components, and ensure the long-term efficient and stable operation of the product.

[0006] A method for manufacturing a PCB board with embedded chips, comprising:

[0007] Manufacturing a power module; the power module comprises a heat conduction module and a chip, wherein a mounting groove is provided in the heat conduction module, and the chip is sintered in the mounting groove;

[0008] Obtain a substrate of a PCB board and embed the power module into the substrate;

[0009] Making via holes in the substrate in which the power module is embedded, wherein the via holes are arranged on two opposite sides of the power module, and the via holes are respectively connected to the chip and the heat conduction module;

[0010] The through hole is electroplated to obtain a PCB board with a power module embedded therein.

[0011] In a preferred technical solution of the present invention, the thermal conductive module is any one of a copper metal substrate, a copper ceramic substrate or an active metal welded ceramic substrate.

[0012] In a preferred technical solution of the present invention, the chip is sintered in the mounting groove, comprising:

[0013] The chip is sintered in the mounting groove by using any one of sintering materials selected from silver paste, gold paste, platinum paste, copper paste, nano silver paste or polymer-based composite materials.

[0014] In a preferred technical solution of the present invention, embedding the power module in the PCB board includes:

[0015] Open windows on the substrate of the PCB board;

[0016] Place the power module into the window position of the PCB substrate, and use a glue filling process to fill the gap between the power module and the PCB board;

[0017] Press the glue-filled power module and PCB board together.

[0018] In a preferred technical solution of the present invention, the process of placing the power module into the window opening position of the substrate of the PCB includes:

[0019] A jig is arranged on the PCB board, wherein the jig is provided with a window position corresponding to the PCB board;

[0020] A plurality of guide bosses are arranged at the edge of the window opening, and the guide bosses protrude from the edge of the window opening toward the center, and the protruding height of the guide bosses is 0.1 mm-0.15 mm, and the width of the guide bosses is 2 mm-4 mm.

[0021] In a preferred technical solution of the present invention, the step of making a via hole in a substrate in which a power module is embedded comprises:

[0022] Blind hole opening: opening a window at a predetermined position of the substrate, where the window opening position is on two opposite sides of the power module;

[0023] Laser drilling: Use laser to process via holes at the window opening position;

[0024] Plasma cleaning: plasma cleaning of via holes;

[0025] The electroplating of the via hole comprises:

[0026] Copper plating and board electricity: enhance the conductivity of the hole wall and the surface copper of the substrate;

[0027] VCP hole filling: realize electrical conduction between chip and PCB layer.

[0028] In a preferred technical solution of the present invention, after making the via hole in the substrate in which the power module is embedded, the method further includes:

[0029] Outer layer graphics production: complete the circuit graphics production on the outer layer of the PCB board;

[0030] Secondary lamination: Lamination of the outer layer to the substrate;

[0031] Outer layer via hole production: Drill via holes in the outer layer and perform copper electroplating on the via holes to achieve multi-layer circuit connection.

[0032] The second object of the present invention is to provide a PCB board, which is produced by using the manufacturing method of the PCB board with embedded chip as described above;

[0033] The PCB board comprises a substrate body, in which a power module is embedded.

[0034] In a preferred technical solution of the present invention, a guide layer is provided on the PCB board, and the pattern copper thickness of the guide layer is ≥3oz.

[0035] The beneficial effects of the present invention are:

[0036] The present invention provides a method for making a PCB board with embedded chips, the method comprising: the method comprising: making a power module; the power module comprises a heat conduction module and a chip, the heat conduction module is provided with a mounting groove, and the chip is sintered in the mounting groove; obtaining a substrate of the PCB board, and embedding the power module in the substrate; making a via hole in the substrate with the power module embedded, the via hole is arranged on two opposite sides of the power module, and the via hole is respectively connected with the chip and the heat conduction module; electroplating the via hole, and obtaining a PCB board with the power module embedded. The method effectively improves the heat dissipation efficiency of the chip by setting a mounting groove in the heat conduction module and embedding the chip therein using a sintering technology. At the same time, the via holes are made on two opposite sides of the power module, and the connection between the chip and the high heat conduction module and other parts of the PCB board is realized by electroplating, so as to realize double-sided heat dissipation and significantly improve the heat dissipation capacity of the entire PCB board. By optimizing the heat dissipation structure and improving the thermal conductivity, the PCB board can carry higher power components and meet the market demand for high-power and high-density electronic products.

[0037] The present application also provides a PCB board manufactured by the above-mentioned method for manufacturing a PCB board with embedded chips, in which a power module integrating a heat conduction module and a chip is embedded, and the highly integrated design helps to reduce the connection distance between components, reduces the loss of signal transmission, and makes the layout of the entire system more compact, which is conducive to the miniaturization and integration of electronic products. The design of the double-sided through holes on both sides of the power module makes the PCB board have excellent heat dissipation performance, which can meet the needs of modern electronic products for high power and high density integration. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Reference numerals:

[0039] 1. Chip; 2. Sintering material; 3. Thermal conductive module; 31. Mounting groove; 4. Substrate; 5. Through hole; 6. Outer layer; 10. Fixture; 11. Window position; 12. Guide boss. Description of the drawings:

[0041] Figure 1 It is a flow chart of a method for manufacturing a PCB board with embedded chips provided by an embodiment of the present invention;

[0042] Figure 2 It is a flow chart of embedding a power module in a PCB board provided by an embodiment of the present invention;

[0043] Figure 3 It is a flow chart of making a via hole in a substrate with a power module embedded therein provided by an embodiment of the present invention;

[0044] Figure 4 is a flow chart of electroplating the via hole provided by an embodiment of the present invention;

[0045] Figure 5 is a schematic structural diagram of a power module provided by an embodiment of the present invention;

[0046] Figure 6 It is a schematic diagram of the structure of a PCB substrate with a power module embedded therein provided by an embodiment of the present invention;

[0047] Figure 7 It is a schematic diagram of the structure of a PCB substrate including an outer layer with a power module embedded therein, provided by an embodiment of the present invention;

[0048] Figure 8 is a schematic diagram of the structure of a fixture provided by an embodiment of the present invention;

[0049] Fig. 9 It is a schematic structural diagram of a heat conduction module provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0050] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0051] In the prior art, in order to solve the heat dissipation problem of high-power devices, it is usually adopted to combine power chips with metal bases and embed them into PCBs, or to embed components directly into boards. This embedding technology conducts heat to the other side of the PCB or dissipates it through heat dissipation devices through the combination of metal bases or components with PCBs, thereby reducing the operating temperature of components and PCBs to a certain extent. The existing manufacturing methods of embedding power chips into PCBs are mainly divided into two categories according to the mounting method: pad connection and via 5 connection. Among them, the pad connection method includes two methods: bare chip bonding and chip installation. In the bare chip bonding method, heat is only dissipated through the PCB board itself and the chip itself, and this method has limited heat dissipation capacity; and although the chip installation conducts the heat generated by the chip to the outside of the PCB on one side through the solder point, the heat dissipation effect is still insufficient. For the via 5 connection method, although the heat dissipation capacity is improved to a certain extent, since it still mainly relies on single-sided heat dissipation, it is still difficult to meet the demand for efficient heat dissipation when facing the demand for higher power components.

[0052] Based on this, the present application provides a method for manufacturing a PCB board with embedded chips.

[0053] Example 1

[0054] like Figure 1-Figure 9As shown, the present embodiment provides a method for manufacturing a PCB board with embedded chips, comprising:

[0055] S100, manufacturing a power module; the power module comprises a heat conduction module and a chip, the heat conduction module is provided with a mounting groove, and the chip is sintered in the mounting groove;

[0056] Specifically, the thermal conductive module of the present application can be any one of a copper metal substrate, a copper ceramic substrate or an active metal welded ceramic substrate. It should be emphasized that the thermal conductive module needs to have excellent heat dissipation capabilities. During the operation of the chip, the heat generated can be dissipated to the outside world through the conduction of the thermal conductive module to reduce the temperature rise of the chip, thereby ensuring the working stability of the chip. In addition, in addition to the above three types, the thermal conductive module of the present application can also be made of other materials with high thermal conductivity. The chip of the present application can be a power chip, for example, it can be a MOSFET, an IGBT. In a more specific embodiment, multiple chips can be provided on the thermal conductive module of the present application to meet the needs of different products.

[0057] S200, obtaining a substrate of a PCB board, and embedding a power module in the substrate;

[0058] In the process of obtaining the substrate of the PCB board, the PCB board can be designed according to the requirements, such as designing various structures such as the number of layers and circuit patterns of the PCB board. When the power module is embedded in the substrate, a window needs to be opened at the corresponding position of the substrate to accommodate the power module.

[0059] S300, making a via 5 in the substrate in which the power module is embedded, the via 5 is arranged on two opposite sides of the power module, and the via 5 is respectively connected to the chip and the thermal conductive module; the via 5 is a hole passing through the substrate, which is arranged on two opposite sides of the power module, i.e., above the chip and on the other side of the thermal conductive module. The via 5 is respectively connected to the contact surface of the chip and the thermal conductive module to achieve electrical connection and heat conduction. The electroplating process includes depositing a layer of metal, usually copper, on the inner wall of the via 5 to achieve electrical connection between the chip and other circuit layers on the PCB board. The electroplated via 5 improves the reliability and conductivity of the connection.

[0060] S400 , electroplating the through hole 5 to obtain a PCB board with a power module embedded therein.

[0061] The above-mentioned method for manufacturing a PCB board with embedded chips effectively improves the heat dissipation efficiency of the chip by setting a mounting groove in the heat conduction module and embedding the chip therein using sintering technology. At the same time, through holes 5 are made on the opposite sides of the power module, and the chip is connected to the high heat conduction module and other parts of the PCB board by electroplating, so as to achieve double-sided heat dissipation and significantly improve the heat dissipation capacity of the entire PCB board. By optimizing the heat dissipation structure and improving the thermal conductivity, the PCB board can carry higher power components and meet the market demand for high-power and high-density electronic products.

[0062] Furthermore, the chip is sintered in the mounting groove, comprising:

[0063] The chip is sintered in the mounting groove by using any one of sintering materials selected from silver paste, gold paste, platinum paste, copper paste, nano silver paste or polymer-based composite materials.

[0064] The present application can further improve the heat conduction efficiency between the chip and the heat conduction module by using silver paste, gold paste, platinum paste, copper paste, nano silver paste or polymer-based composite materials as sintering materials. These materials have excellent thermal conductivity, which helps to quickly transfer the heat generated by the chip to the heat conduction module, thereby more effectively reducing the operating temperature of the chip. Sintering materials such as silver paste and gold paste have good wettability and adhesion, and can form a stable sintering connection between the chip and the mounting slot. This stable connection not only helps heat conduction, but also ensures the mechanical stability of the chip under high-power working conditions.

[0065] Among them, silver paste has very high conductivity and is the best conductive material among all sintering materials. It is suitable for applications that require high current transmission. In addition, silver also has high thermal conductivity, which helps to quickly dissipate the heat generated by the chip. Silver paste can wet the metal surface well during the sintering process to form a high-quality sintered connection. Therefore, in the method claimed in the present application, silver paste material can be used to sinter the chip in a thermal conductive module.

[0066] Furthermore, embedding the power module into the PCB board includes:

[0067] S201, opening a window on a substrate of a PCB board; the substrate of the PCB board of the present application may be an optical core board.

[0068] One or more windows are made at predetermined positions of the substrate of the PCB board. The positions and sizes of these windows are designed according to the size and shape of the power module to ensure that the power module can be accurately placed at the window opening position.

[0069] S202, place the power module in the window position of the PCB substrate, and use the glue filling process to fill the gap between the power module and the PCB board; place the manufactured power module in the window position of the PCB board, and ensure that the electrical connection point of the power module is aligned with the corresponding conductive layer on the PCB board. Use a specific glue filling material, such as thermosetting resin or a specific conductive glue, to fill the gap between the power module and the PCB board automatically or manually. The glue filling material needs to have good fluidity and filling properties to ensure that all gaps can be evenly filled and provide good mechanical and electrical properties after curing.

[0070] S203, pressing the glue-filled power module and the PCB board. After pressing, the subsequent processing flow can be carried out.

[0071] The PCB board filled with filler material is placed in a press machine and pressed under a certain temperature and pressure to solidify the filler material and form a stable connection. The pressing process ensures the electrical and thermal connection between the power module and the PCB board, while improving the mechanical strength of the overall structure.

[0072] Specifically, through the glue filling process and the lamination step, the connection between the power module and the PCB board is more stable, which improves the structural stability and durability of the entire PCB board. In addition, the glue filling material can have thermal conductivity, which helps to transfer the heat generated by the power module to the PCB board or other heat dissipation structures, thereby improving the thermal management efficiency. The glue filling process can provide an additional layer of protection for the power module to prevent physical damage and environmental factors such as moisture, dust and chemicals.

[0073] In a more preferred embodiment, the process of placing the power module into the window opening position of the substrate of the PCB includes:

[0074] A jig is arranged on the PCB board, wherein the jig is provided with a window position corresponding to the PCB board;

[0075] In actual applications, in order to ensure that the power module can be accurately placed at the window position of the PCB board, a special jig is designed and set up. The jig is customized according to the size and window position of the PCB board to ensure that the power module can be accurately aligned. The jig is provided with window positions corresponding to the PCB board. Windows that match the window positions of the PCB board are made on the jig. The size and shape of these windows are exactly the same as the window positions on the PCB board, ensuring that the power module can be correctly placed at the window position.

[0076] The edge of the window opening is provided with a plurality of guide bosses 12, the guide bosses 12 protrude from the edge of the window opening toward the center, and the protruding height of the guide bosses 12 is 0.1mm-0.15mm, and the width of the guide bosses 12 is 2mm-4mm, more preferably, the width of the guide bosses 12 is 3mm. In actual applications, the size of the guide bosses 12 can also be designed as needed.

[0077] In order to further improve the placement accuracy, a plurality of guide bosses 12 are designed on the edge of the window opening on the fixture. These guide bosses 12 protrude from the edge of the window opening toward the center, playing a role in positioning and guiding, and ensuring that the power module will not shift during the placement process. The size design of the guide boss 12 needs to ensure that it is not too high to affect the placement of the power module, nor too low to lose the positioning function. The protruding height range of 0.1mm-0.15mm ensures that the power module can smoothly contact the guide boss 12 when placed, and is accurately aligned to the window opening position through the guidance of the guide boss 12.

[0078] Furthermore, the manufacturing of the via hole 5 in the substrate in which the power module is embedded comprises:

[0079] S301, blind hole windowing: opening a window at a predetermined position of the substrate, wherein the window opening position is located on two opposite sides of the power module;

[0080] In this step, windows are precisely opened at predetermined positions of the substrate, which are located at opposite sides of the power module, to ensure that the subsequent production of the vias 5 can achieve electrical connection between the chip and the PCB layer.

[0081] S302, laser drilling: using laser to process a via hole 5 at the window opening position;

[0082] The via hole 5 is processed at the window opening position by using laser processing technology. Laser drilling has the characteristics of high precision and low heat-affected zone, which can ensure the quality of the via hole 5 and the integrity of the substrate.

[0083] S303, plasma cleaning: plasma cleaning the via hole 5;

[0084] The processed via hole 5 is plasma cleaned to remove residues and impurities on the hole wall, thereby providing a clean surface for the subsequent electroplating process.

[0085] The electroplating of the via hole 5 includes:

[0086] S401, copper plating and board electricity: enhance the conductivity of the hole wall and the surface copper of the substrate;

[0087] Copper deposition is performed in the via hole 5 to enhance the conductivity between the hole wall and the copper surface of the substrate. After copper deposition, board electrical treatment is performed to ensure good electrical connection between the inner wall of the via hole 5 and the copper surface of the substrate.

[0088] S402, VCP filling: realize electrical conduction between chip and PCB layer.

[0089] The present application adopts vertical continuous plating (VCP) technology to fill the via hole 5 to achieve electrical conduction between the chip and the PCB layer. VCP filling can provide a uniform electroplating layer to ensure the conductivity and mechanical strength of the via hole 5.

[0090] Furthermore, after the via hole 5 is made in the substrate in which the power module is embedded, the method further includes:

[0091] Outer layer graphics production: complete the circuit graphics production on the outer layer of the PCB board;

[0092] The circuit pattern is made on the outer layer of the PCB board, which includes forming the required conductive patterns on the outer surface of the PCB board, such as lines, pads, etc.

[0093] Secondary lamination: Lamination of the outer layer to the substrate;

[0094] The outer layer pattern is pressed onto the substrate. This step is usually performed after the inner layer and power module are processed to form a complete multi-layer PCB structure. During the secondary pressing process, the outer layer pattern is accurately aligned with the inner layer circuit to ensure the correct electrical connection.

[0095] Production of outer layer via holes 5: Drilling via holes 5 in the outer layer and performing copper electroplating on the via holes 5 to achieve multi-layer circuit connection.

[0096] Through holes 5 are drilled on the outer layer pattern, and these through holes 5 are used to connect different circuit layers to achieve the connection between multi-layer circuits. After drilling, the through holes 5 are plated with copper to enhance the conductivity and mechanical strength of the hole wall and ensure stable electrical connection.

[0097] Example 2

[0098] A PCB board provided in this embodiment is produced by using the manufacturing method of a PCB board with embedded chip as described above;

[0099] The PCB board includes a substrate body, in which a power module is embedded. Furthermore, a guide layer is provided on the PCB board, and the graphic copper thickness of the guide layer is ≥3oz. The graphic copper thickness of the guide layer is ≥3oz to meet the needs of high current transmission. The guide layer forms blind holes and through holes through laser drilling technology to achieve electrical connection between layers, and electroplating filling technology is used to ensure the reliability of electrical connection. Specifically, in the PCB board requested for protection in the present application, a highly conductive copper material is used as the guide layer, and the graphic copper thickness is ≥3oz, which ensures that the PCB board can withstand the transmission of large currents and meets the needs of high-power electronic products.

[0100] The PCB board provided by the present application has a power module embedded in it that integrates a heat conduction module and a chip. The highly integrated design helps to reduce the connection distance between components, reduces the loss of signal transmission, and makes the layout of the entire system more compact, which is conducive to the miniaturization and integration of electronic products. The design of the double-sided through holes 5 on both sides of the power module enables the PCB board to have excellent heat dissipation performance, which can meet the needs of modern electronic products for high power and high density integration.

[0101] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0102] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for manufacturing a PCB board with embedded chips, characterized in that: include: Manufacturing a power module; the power module comprises a heat conduction module and a chip, wherein a mounting groove is provided in the heat conduction module, and the chip is sintered in the mounting groove; Obtain a substrate of a PCB board and embed the power module into the substrate; Making via holes in the substrate in which the power module is embedded, wherein the via holes are arranged on two opposite sides of the power module, and the via holes are respectively connected to the chip and the heat conduction module; The through hole is electroplated to obtain a PCB board with a power module embedded therein.

2. The method for manufacturing a PCB board with embedded chips according to claim 1, characterized in that: The heat conduction module is any one of a copper metal substrate, a copper ceramic substrate or an active metal welded ceramic substrate.

3. The method for manufacturing a PCB board with embedded chips according to claim 2, characterized in that: The chip is sintered in the mounting groove, comprising: The chip is sintered in the mounting groove by using any one of sintering materials selected from silver paste, gold paste, platinum paste, copper paste, nano silver paste or polymer-based composite materials.

4. The method for manufacturing a PCB board with embedded chips according to any one of claims 1 to 3, characterized in that: The step of embedding the power module in the PCB board comprises: Open windows on the PCB substrate; Place the power module into the window position of the PCB substrate, and use a glue filling process to fill the gap between the power module and the PCB board; Press the glue-filled power module and PCB board together.

5. The method for manufacturing a PCB board with embedded chips according to claim 3, characterized in that: The process of placing the power module into the window opening position of the substrate of the PCB includes: A jig is arranged on the PCB board, wherein the jig is provided with a window position corresponding to the PCB board; A plurality of guide bosses are arranged at the edge of the window opening, and the guide bosses protrude from the edge of the window opening toward the center, and the protruding height of the guide bosses is 0.1 mm-0.15 mm, and the width of the guide bosses is 2 mm-4 mm.

6. The method for manufacturing a PCB board with embedded chips according to any one of claims 1 to 3, characterized in that: The method of making a via hole in a substrate in which a power module is embedded comprises: Blind hole opening: opening a window at a predetermined position of the substrate, where the window opening position is on two opposite sides of the power module; Laser drilling: Use laser to process via holes at the window opening position; Plasma cleaning: plasma cleaning of via holes; The electroplating of the via hole comprises: Copper plating and board electricity: enhance the conductivity of the hole wall and the surface copper of the substrate; VCP hole filling: realize electrical conduction between chip and PCB layer.

7. The method for manufacturing a PCB board with embedded chips according to claim 6, characterized in that: After the via holes are made in the substrate in which the power module is embedded, the method further includes: Outer layer graphics production: complete the circuit graphics production on the outer layer of the PCB board; Secondary lamination: Lamination of the outer layer to the substrate; Outer layer via hole production: Drill via holes in the outer layer and perform copper electroplating on the via holes to achieve multi-layer circuit connection.

8. A PCB board, characterized in that: The method for manufacturing a PCB board with embedded chips as described in any one of claims 1 to 7 is used for production; The PCB board comprises a substrate body, in which a power module is embedded.

9. The method for manufacturing a PCB board with embedded chips according to claim 8, characterized in that: The PCB board is provided with a guide layer, and the pattern copper thickness of the guide layer is ≥3oz.

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