Semiconductor manufacturing apparatus, wafer mounting apparatus, dicing apparatus, and semiconductor manufacturing method

Abstract

The present invention relates to a semiconductor manufacturing apparatus, a wafer mounting apparatus, a dicing apparatus and a semiconductor manufacturing method. The purpose of the present invention is to provide a technique capable of suppressing non-uniformity of a force applied to a cutting blade when cutting a positioning edge. The semiconductor manufacturing apparatus includes a stage and a conveyor. At a stage, a semiconductor wafer having a positioning edge and a jig having a shape corresponding to the positioning edge are fixed to each other by a cutting tape, the jig being used for cutting the positioning edge by a cutting blade. The conveyor conveys the clamp in the mode that the clamp is opposite to the positioning edge on the workbench.

Description

Technical Field

[0001] The present invention relates to a semiconductor manufacturing device, a wafer mounting device, a cutting device, and a semiconductor manufacturing method. Background Art

[0002] In the manufacture of semiconductor devices, semiconductor chips cut from semiconductor wafers by a dicing device are usually mounted on semiconductor modules. In addition, usually, when the semiconductor wafer is cut by the dicing device, the semiconductor wafer is attached to a dicing tape in a manner that the semiconductor chip does not move (e.g., Patent Document 1).

[0003] Patent Document 1: International Publication No. 2015 / 056303

[0004] Semiconductor wafers are often provided with a notch, i.e., an orientation flat, for adjusting the position and rotation angle of the semiconductor wafer. Depending on the design of the semiconductor chip, the cutting device sometimes cuts the orientation flat along the straight-line orientation flat. However, in this case, one surface of the plate-shaped cutting tool that cuts the orientation flat receives force from the semiconductor wafer, but the other surface is adjacent to the space and is not subject to force, so the cutting tool receives uneven force. As a result, there is a problem that the cutting tool is easily damaged and the life of the cutting tool is shortened. Summary of the invention

[0005] Therefore, the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a technology capable of suppressing the non-uniformity of the force applied to the cutting blade when cutting the positioning edge.

[0006] The semiconductor manufacturing device according to the present invention comprises: a workbench which fixes a semiconductor wafer and a fixture to each other by a dicing tape, the semiconductor wafer having a positioning edge, the fixture having a shape corresponding to the positioning edge and being used for cutting the positioning edge by a dicing tool;

[0007] and a conveyor for conveying the fixture on the workbench in a manner that the fixture is opposite to the positioning edge.

[0008] Effects of the Invention

[0009] According to the present invention, the jig is conveyed on the table so as to face the positioning edge. According to such a structure, it is possible to suppress the non-uniformity of the force applied to the cutting blade when cutting the positioning edge. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a schematic cross-sectional view showing the structure of the wafer mounting device involved in the first embodiment.

[0011] Figure 2 It is a top view showing an example of a structure to be cut.

[0012] Figure 3 This is a schematic cross-sectional view showing the structure of the cutting device according to the first embodiment. DETAILED DESCRIPTION

[0013] Below, while referring to the attached Figure 1 The embodiments are described in detail below. The features described in the following embodiments are illustrative, and not all features are required. In addition, in the description shown below, in multiple embodiments, the same structural elements are marked with the same or similar reference numerals, and mainly different structural elements are described. In addition, in the description recorded below, specific positions and directions such as "upper", "lower", "left", "right", "front" or "back" are not necessarily consistent with the positions and directions during actual implementation.

[0014] <Implementation method 1>

[0015] Figure 1 It is a schematic cross-sectional view showing the structure of a wafer mounting device having a semiconductor manufacturing device according to the first embodiment. Figure 1 The semiconductor manufacturing apparatus of the wafer mounting device includes a conveyor 2 and a wafer stage 1 as a workbench. Figure 1 The wafer mounting apparatus includes not only a semiconductor manufacturing apparatus but also an adhesive roller 3 as a tape sticking portion.

[0016] The wafer stage 1 is a stage on which a semiconductor wafer 21 and a jig 22 are fixed to each other by a dicing tape 26. In the first embodiment, the semiconductor wafer 21, the jig 22, and the wafer ring 23 are attached to the dicing tape 26 after being mounted on the wafer stage 1. Figure 2 1 is a plan view showing an example of a structure to be cut after the semiconductor wafer 21, the jig 22, and the wafer ring 23 are attached to the dicing tape 26. The semiconductor wafer 21 in the structure to be cut is cut by a dicing device as described later.

[0017] The semiconductor wafer 21 has an orientation flat 21a. A semiconductor chip including at least one of MOSFET (Metal Oxide Semiconductor Field Effect Transistor), IGBT (Insulated Gate Bipolar Transistor), RC-IGBT (Reverse Conducting-IGBT), SBD (Schottky Barrier Diode) and PND (PN junction diode) is provided on the semiconductor wafer 21. In addition, in this specification, for example, at least one of A, B, C, ..., and Z means any one of all combinations of greater than or equal to 1 selected from the group of A, B, C, ..., and Z.

[0018] The semiconductor wafer 21 may be made of ordinary silicon (Si) or a wide bandgap semiconductor such as silicon carbide (SiC), gallium nitride (GaN), diamond, etc. When the semiconductor wafer 21 is made of a wide bandgap semiconductor, stable operation of the semiconductor device at high temperature and high voltage and high switching speed can be achieved.

[0019] exist Figure 1 The wafer stage 1 is provided with a recess 1a, and the semiconductor wafer 21 is mounted on the wafer stage 1 manually, by the conveyor 2 or by another conveyor in a manner that only the outer periphery of the semiconductor wafer 21 is supported by the wafer stage 1. The recess 1a suppresses contact between the surface structure of the semiconductor chip provided on the semiconductor wafer 21 and the wafer stage 1.

[0020] Figure 2 The fixture 22 has a shape corresponding to the positioning edge 21a and is used when the positioning edge 21a is cut by a cutting tool. Figure 2 In the example of , the right side portion of the clamp 22 has a straight line shape corresponding to the straight line shape of the positioning edge 21a as a shape corresponding to the positioning edge 21a. Figure 2 In the example of FIG. 2 , the jig 22 as a whole has an arcuate shape that complements the circular shape of the semiconductor wafer 21. However, the jig 22 only needs to have a shape corresponding to the positioning edge 21a, and the shape of the jig 22 is not limited to Figure 2 shape.

[0021] The conveyor 2 conveys the chuck 22 so that the straight line shape of the chuck 22 faces the straight line shape of the positioning side 21a on the wafer stage 1. Thus, the chuck 22 is mounted on the wafer stage 1.

[0022] The wafer ring 23 is placed on the wafer stage 1 manually, by the conveyor 2 or by another conveyor, so as to surround the semiconductor wafer 21 and the chuck 22 in a plan view. The material of the wafer ring 23 is, for example, stainless steel.

[0023] The adhesive roller 3 adheres the semiconductor wafer 21 mounted on the wafer stage 1, the clamp 22 opposite to the positioning edge 21a, and the wafer ring 23 surrounding the semiconductor wafer 21 and the clamp 22 to the dicing tape 26. Specifically, the adhesive roller 3 adheres the dicing tape 26 by pressing the dicing tape 26 drawn out by an undrawing machine onto the semiconductor wafer 21, the clamp 22, and the wafer ring 23. Thus, a dicing tape 26 is formed. Figure 2 In addition, the material of the adhesive roller 3 is, for example, Si rubber, and the material of the cutting tape 26 is, for example, UV curing polyolefin.

[0024] Will Figure 2 The semiconductor wafer 21 of the cut structure is composed of the following Figure 3 The semiconductor chip is cut out from the semiconductor wafer 21 by cutting with the same cutting tool as the cutting tool 8. When cutting the positioning edge 21a, the cutting tool cuts the positioning edge 21a along the straight line shape of the positioning edge 21a while contacting the jig 22.

[0025] <Summary of Implementation Method 1>

[0026] According to the semiconductor manufacturing apparatus of the first embodiment as described above, the conveyor 2 conveys the clamp 22 in such a manner that the straight line shape of the clamp 22 faces the straight line shape of the positioning edge 21a on the wafer stage 1. Figure 2 In such a state where the fixture 22 and the positioning edge 21a are opposite to each other, a structure to be cut is formed in which the semiconductor wafer 21 and the fixture 22 are fixed to each other. Thus, when cutting the positioning edge 21a, one surface of the cutting tool that cuts the positioning edge 21a receives force from the semiconductor wafer 21, and the other surface receives force from the fixture 22, so that the non-uniformity of the force applied to the cutting tool can be suppressed. As a result, the damage of the cutting tool can be suppressed.

[0027] <Implementation method 2>

[0028] Figure 3 This is a schematic cross-sectional view showing the structure of a dicing device included in a semiconductor manufacturing device according to the second embodiment. Figure 3 The semiconductor manufacturing device of the cutting device has a conveyor 2 and a cutting table 6 as a workbench. Figure 3 The cutting device includes not only the semiconductor manufacturing device but also a ring holding portion 7 and a cutting blade 8 .

[0029] The dicing table 6 is a work table that fixes the semiconductor wafer 21 and the jig 22 to each other via a dicing tape 26. In the second embodiment, the dicing tape 26 to which the semiconductor wafer 21 and the wafer ring 23 surrounding the semiconductor wafer 21 are attached is mounted on the dicing table 6 manually, by the conveyor 2 or by another conveyor. In addition, a porous body that can adsorb air to the semiconductor wafer 21 via the dicing tape 26 may be provided at the portion of the dicing table 6 where the semiconductor wafer 21 is mounted.

[0030] After the cutting tape 26 is placed on the cutting table 6, the conveyor 2 conveys the jig 22 on the cutting table 6 so that the straight line of the jig 22 faces the straight line of the positioning edge 21a, thereby attaching the jig 22 to the cutting tape 26. Figure 2 The cut structure.

[0031] Will Figure 2 The semiconductor wafer 21 of the structure to be cut is cut by the cutting tool 8, so that the semiconductor chip is cut out from the semiconductor wafer 21. When cutting the positioning edge 21a, the cutting tool 8 cuts the positioning edge 21a along the straight line shape of the positioning edge 21a while contacting the clamp 22. The cutting tool 8 is a tool in which abrasive grains are fixed by an adhesive material. The ring holding part 7 fixes the semiconductor wafer 21 by holding the wafer ring 23 while the cutting tool 8 is cutting.

[0032] <Summary of Implementation Method 2>

[0033] According to the semiconductor manufacturing apparatus of the second embodiment as described above, the conveyor 2 conveys the clamp 22 in such a manner that the straight line shape of the clamp 22 and the straight line shape of the positioning edge 21a are opposite to each other on the wafer stage 1. Figure 2 In such a state where the fixture 22 and the positioning edge 21a are opposite to each other, a structure to be cut is formed in which the semiconductor wafer 21 and the fixture 22 are fixed to each other. Thus, when cutting the positioning edge 21a, one surface of the cutting tool that cuts the positioning edge 21a receives force from the semiconductor wafer 21, and the other surface receives force from the fixture 22, so that the non-uniformity of the force applied to the cutting tool can be suppressed. As a result, the damage of the cutting tool can be suppressed.

[0034] <Modification>

[0035] In the description of Embodiments 1 and 2, the jig 22 is conveyed by the conveyor 2. However, the present invention is not limited thereto, and the jig 22 may be conveyed manually so that the straight line shape of the jig 22 faces the straight line shape of the positioning edge 21a.

[0036] In the first embodiment, the semiconductor wafer 21 and the like are attached to the dicing tape 26 after being mounted on the wafer stage 1, and in the second embodiment, the jig 22 is attached to the dicing tape 26 after the dicing tape 26 and the like are mounted on the dicing table 6. However, the operation of the first embodiment and the operation of the second embodiment may be replaced. That is, in the first embodiment, the jig 22 may be attached to the dicing tape 26 after the dicing tape 26 and the like are mounted on the wafer stage 1, and in the second embodiment, the semiconductor wafer 21 and the like may be attached to the dicing tape 26 after being mounted on the dicing table 6.

[0037] <Implementation method 3>

[0038] In the third embodiment, the material of the jig 22 is the same as that of the semiconductor wafer 21 in the first and second embodiments. According to such a structure, when the dicing blade 8 contacts the positioning edge 21a, the non-uniformity of the force applied to the dicing blade can be further suppressed, compared with a structure in which the semiconductor wafer 21 and the jig 22 are made of different materials.

[0039] <Implementation method 4>

[0040] In the present fourth embodiment, the thickness of the jig 22 is the same as the thickness of the semiconductor wafer 21 in the first and second embodiments. In addition, the thickness of the jig 22 being the same as the thickness of the semiconductor wafer 21 includes that the difference between the thickness of the jig 22 and the thickness of the semiconductor wafer 21 falls within 5% of the larger thickness of the jig 22 and the thickness of the semiconductor wafer 21. According to such a structure, compared with a structure in which the thickness of the semiconductor wafer 21 and the jig 22 are different, the non-uniformity of the force applied to the dicing blade when the dicing blade 8 contacts the positioning edge 21a can be further suppressed.

[0041] <Modification>

[0042] The structure of the third embodiment and the structure of the fourth embodiment may be combined. That is, in the first and second embodiments, the material of the jig 22 may be the same as that of the semiconductor wafer 21, and the thickness of the jig 22 may be the same as that of the semiconductor wafer 21. According to such a structure, compared with a structure in which the thicknesses of the semiconductor wafer 21 and the jig 22 are different, the non-uniformity of the force applied to the dicing blade when the dicing blade 8 contacts the positioning edge 21a can be further suppressed.

[0043] <Implementation method 5>

[0044] In the present embodiment 5, in the embodiments 1 and 2, the conveyor 2 conveys the clamp 22 in a manner that there is a gap between the clamp 22 and the positioning edge 21a. According to such a structure, the wear of the cutting tool 8 can be suppressed, and thus the life of the cutting tool 8 can be expected to be extended. In addition, the present embodiment 5 can also be combined with at least any one of the structure of the embodiment 3 and the structure of the embodiment 4.

[0045] In addition, the embodiments and the modifications can be freely combined, or the embodiments and the modifications can be appropriately modified or omitted.

[0046] Hereinafter, each aspect of the present invention will be described collectively as supplementary notes.

[0047] (Note 1)

[0048] A semiconductor manufacturing device comprising:

[0049] a table that fixes a semiconductor wafer having a positioning edge and a jig to each other via a dicing tape, the semiconductor wafer having a positioning edge, the jig having a shape corresponding to the positioning edge and being used for cutting the positioning edge by a dicing tool; and

[0050] A conveyor is provided for conveying the fixture on the workbench in a manner that the fixture is opposite to the positioning edge.

[0051] (Note 2)

[0052] A wafer mounting device comprising:

[0053] The semiconductor manufacturing apparatus described in Appendix 1; and

[0054] The tape sticking unit sticks the semiconductor wafer mounted on the table, the jig facing the positioning edge, and a wafer ring surrounding the semiconductor wafer and the jig to the dicing tape.

[0055] (Note 3)

[0056] A cutting device comprising:

[0057] The semiconductor manufacturing apparatus described in Appendix 1; and

[0058] The cutting tool,

[0059] The conveyor conveys the jig and affixes it to the dicing tape mounted on the workbench, and the dicing tape is affixed with the semiconductor wafer and a wafer ring surrounding the semiconductor wafer.

[0060] The cutting tool cuts the positioning edge along the positioning edge while contacting the clamp.

[0061] (Note 4)

[0062] A semiconductor manufacturing apparatus according to any one of Supplementary Notes 1 to 3, wherein:

[0063] The material of the clamp is the same as that of the semiconductor wafer.

[0064] (Note 5)

[0065] A semiconductor manufacturing apparatus according to any one of Supplementary Notes 1 to 4, wherein:

[0066] The thickness of the jig is the same as the thickness of the semiconductor wafer.

[0067] (Note 6)

[0068] A semiconductor manufacturing apparatus according to any one of Supplementary Notes 1 to 5, wherein:

[0069] The conveyor conveys the jig with a gap between the jig and the positioning edge.

[0070] (Note 7)

[0071] A semiconductor manufacturing method, wherein:

[0072] preparing a semiconductor wafer having a positioning edge and a jig having a shape corresponding to the positioning edge and used for cutting the positioning edge by a cutting tool,

[0073] The jig is conveyed on a table where the semiconductor wafer and the jig are fixed to each other via a dicing tape in such a manner that the jig faces the positioning edge.

[0074] Description of the label

[0075] 1 wafer stage, 2 conveyor, 3 sticking roller, 6 cutting stage, 8 cutting tool, 21 semiconductor wafer, 21a positioning edge, 22 clamp, 23 wafer ring, 26 cutting belt.

Claims

1. A semiconductor manufacturing device comprising: a table that fixes a semiconductor wafer having a positioning edge and a jig to each other via a dicing tape, the semiconductor wafer having a positioning edge, the jig having a shape corresponding to the positioning edge and being used for cutting the positioning edge by a dicing tool; and A conveyor is provided for conveying the fixture on the workbench in a manner that the fixture is opposite to the positioning edge.

2. A wafer mounting device, comprising: The semiconductor manufacturing apparatus according to claim 1; and The tape sticking unit sticks the semiconductor wafer mounted on the table, the jig facing the positioning edge, and a wafer ring surrounding the semiconductor wafer and the jig to the dicing tape.

3. A cutting device, comprising: The semiconductor manufacturing apparatus according to claim 1; and The cutting tool, The conveyor conveys the jig and affixes it to the dicing tape mounted on the workbench, and the dicing tape is affixed with the semiconductor wafer and a wafer ring surrounding the semiconductor wafer. The cutting tool cuts the positioning edge along the positioning edge while contacting the clamp.

4. The semiconductor manufacturing apparatus according to any one of claims 1 to 3, wherein: The material of the clamp is the same as that of the semiconductor wafer.

5. The semiconductor manufacturing apparatus according to any one of claims 1 to 4, wherein: The thickness of the jig is the same as the thickness of the semiconductor wafer.

6. The semiconductor manufacturing apparatus according to any one of claims 1 to 5, wherein: The conveyor conveys the jig with a gap between the jig and the positioning edge.

7. A semiconductor manufacturing method, wherein: preparing a semiconductor wafer having a positioning edge and a jig having a shape corresponding to the positioning edge and used for cutting the positioning edge by a cutting tool, The jig is conveyed on a table where the semiconductor wafer and the jig are fixed to each other by a dicing tape in such a manner that the jig faces the positioning edge.

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