PVA (Polyvinyl Alcohol) protective glue for metal laser cutting and etching processes and preparation method of PVA protective glue

By using special PVA protective glue in metal laser cutting and etching processes, the problem of difficulty in bonding with existing protective films and excessive viscosity is solved, and effective protection of the board and improvement of yield is achieved.

CN119391238APending Publication Date: 2025-02-07ZHONGKEWEI NEW MATERIALS (SHENZHEN) CO LTD
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Patent Information

Application Number
CN202411723420.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-27
Publication Date
2025-02-07

AI Technical Summary

Technical Problem

In metal laser cutting and etching processes, the existing protective film is difficult to fit smoothly, has too high viscosity and is difficult to peel off, resulting in material surface contamination and reduced yield.

Method used

A PVA protective glue used for metal laser cutting and etching processes is used, and its components include PVA stock solution, water, viscosity enhancer, leveling agent and antibacterial agent. The low viscosity is prepared by specific proportions and preparation methods. Protective glue that is easy to spray.

Benefits of technology

The protective glue is well spreadable on the surface of the board, and after curing and forming a film, it is closely attached to the board, and is not easy to fall off. It can effectively protect the board from being contaminated by gasified smoke and molten flyslag, and has good water rehydration after laser cutting, making it easy to clean , avoid residues of gelatinous substances.

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Abstract

The invention provides PVA (Polyvinyl Alcohol) protective glue for a metal laser cutting and etching process. The PVA protective glue is prepared from the following components in parts by mass: 50 to 60 parts of PVA stock solution, 90 to 100 parts of water, 0.4 to 0.8 part of tackifier, 1.5 to 2.2 parts of flatting agent and 0.75 to 1 part of antibacterial agent, the PVA stock solution is a mixture of vinyl acetate-ethylene copolymer emulsion, a polyvinyl alcohol solution and water; the tackifier is one or more of sodium polyacrylate, sodium carboxymethyl cellulose, polyacrylamide, gelatin and water-soluble chitosan; and the corrosion inhibitor is one of triethanolamine, imidazoline and methyl benzotriazole. The protective glue prepared by the scheme has low viscosity, is convenient to spray, has spreadability on the surface of a plate, can protect the plate from being damaged in the laser cutting process, can be re-dissolved in water, is convenient to clean after laser cutting and etching, and enables the surface of a base material to be free of gelatinous substance residues.
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Description

Technical Field

[0001] The present application relates to the field of chemical technology, and in particular to a PVA protective adhesive for metal laser cutting and etching processes and a preparation method thereof. Background Art

[0002] Laser cutting and etching processes have the characteristics of high automation, high processing precision, high processing efficiency, simple and convenient operation, etc., and have been promoted and popularized in various industries at an astonishing speed. However, during the laser cutting and etching process, the gasification smoke and molten flying slag generated will seriously pollute the surface of the material and are difficult to remove, reducing the product yield. By applying a film on the surface of the substrate to be cut and etched, the plate can be effectively protected from being contaminated by gasification smoke and molten flying slag. However, the film is difficult to adhere to the surface of the substrate smoothly, has high viscosity, and is difficult to peel off. Summary of the invention

[0003] In view of the above problems, the present application is proposed to provide a PVA protective glue for metal laser cutting and etching processes and a preparation method thereof that overcomes the above problems or at least partially solves the above problems, including:

[0004] A PVA protective glue for metal laser cutting and etching processes, wherein the PVA protective glue comprises, by weight ratio: 50-60 parts of PVA stock solution, 90-100 parts of water, 0.4-0.8 parts of tackifier, 1.5-2.2 parts of leveling agent and 0.75-1 part of antibacterial agent;

[0005] The PVA stock solution is a mixture of vinyl acetate-ethylene copolymer emulsion, polyvinyl alcohol solution and water; the viscosity enhancer is one or more of sodium polyacrylate, sodium carboxymethyl cellulose, polyacrylamide, gelatin and water-soluble chitosan; and the corrosion inhibitor is one of triethanolamine, imidazoline and methylbenzotriazole.

[0006] Furthermore, the proportions of the components in the PVA stock solution are, by mass, 6% to 10% of vinyl acetate-ethylene copolymer emulsion, 2% to 6% of polyvinyl alcohol solution, and 81% to 85% of water.

[0007] Furthermore, the leveling agent is glycol polyether.

[0008] Furthermore, it also includes 0-5 parts of water-based color paste.

[0009] Furthermore, it also includes 0.5-1 part of corrosion inhibitor.

[0010] Furthermore, it also includes 0.03-0.06 parts of defoaming agent.

[0011] A method for preparing a PVA protective glue for metal laser cutting and etching processes, characterized in that the method is used to prepare the protective glue as described in any one of the above items, comprising the steps of:

[0012] Weigh distilled water according to the preset ratio and heat it to 70-90℃;

[0013] Add viscosity enhancer and stir until dissolved;

[0014] Add PVA stock solution and other auxiliary raw materials, stir for 30-40 minutes, cool to room temperature, and let stand for 12-24 hours to obtain a protective glue.

[0015] This application has the following advantages:

[0016] In the embodiments of the present application, in view of the shortcomings of the prior art that smoke generated by laser cutting and other processes will pollute the material, and the film to prevent smoke is difficult to fit flat and difficult to peel off, the present application provides a PVA protective glue for metal laser cutting and etching processes, and the PVA protective glue includes, by mass ratio: 50-60 parts of PVA stock solution, 90-100 parts of water, 0.4-0.8 parts of thickener, 1.5-2.2 parts of leveling agent and 0.75-1 part of antibacterial agent; the PVA stock solution is a mixture of vinyl acetate-ethylene copolymer emulsion, polyvinyl alcohol solution and water; the thickener is one or more of sodium polyacrylate, sodium carboxymethyl cellulose, polyacrylamide, gelatin, and water-soluble chitosan; the corrosion inhibitor is one of triethanolamine, imidazoline, and methylbenzotriazole. The protective glue prepared by this scheme has a lower viscosity, is easy to spray, and has good spreadability on the surface of the board. After solidifying into a film, it adheres tightly to the plate and is not easy to fall off. It can protect the plate from being damaged by pollutants such as gasified smoke and molten slag during the laser cutting process. The protective film has good rehydration properties and can be re-dissolved in water, which is convenient for cleaning after laser cutting and etching, so that there is no gelatinous residue on the surface of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the description of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0018] Figure 1 This is a flow chart of the steps of a method for preparing a PVA protective glue for metal laser cutting and etching processes provided in one embodiment of the present application. DETAILED DESCRIPTION

[0019] In order to make the objects, features and advantages of the present application more obvious and understandable, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0020] The inventors have found through analysis of the prior art that the prior art protects the substrate by means of a protective film, which is difficult to adhere evenly to the surface of the substrate and has too high viscosity, making it difficult to peel off after processing, thereby increasing processing costs.

[0021] In the embodiments of the present application, in view of the shortcomings of the prior art that smoke generated by laser cutting and other processes will pollute the material, and the film to prevent smoke is difficult to fit flat and difficult to peel off, the present application provides a PVA protective glue for metal laser cutting and etching processes, and the PVA protective glue includes, by mass ratio: 50-60 parts of PVA stock solution, 90-100 parts of water, 0.4-0.8 parts of thickener, 1.5-2.2 parts of leveling agent and 0.75-1 part of antibacterial agent; the PVA stock solution is a mixture of vinyl acetate-ethylene copolymer emulsion, polyvinyl alcohol solution and water; the thickener is one or more of sodium polyacrylate, sodium carboxymethyl cellulose, polyacrylamide, gelatin, and water-soluble chitosan; the corrosion inhibitor is one of triethanolamine, imidazoline, and methylbenzotriazole. The protective glue prepared by this scheme has a lower viscosity, is easy to spray, and has good spreadability on the surface of the board. After solidifying into a film, it adheres tightly to the plate and is not easy to fall off. It can protect the plate from being damaged by pollutants such as gasified smoke and molten slag during the laser cutting process. The protective film has good rehydration properties and can be re-dissolved in water, which is convenient for cleaning after laser cutting and etching, so that there is no gelatinous residue on the surface of the substrate.

[0022] It should be noted that after the PVA protective glue is sprayed on the surface of the substrate, it can be directly cured on the substrate to form a protective film after low-temperature baking or room-temperature drying, without the need for film lamination, so that the protective film and the substrate can be perfectly laminated. In addition, since the viscosity of the PVA protective glue is relatively low, the nozzle will not be blocked after spraying, which is convenient for industrial production.

[0023] The PVA protective glue proposed in this scheme is easy to spray industrially without clogging the nozzle, can be spread smoothly on the board, has good leveling properties, and can form a complete protective coating; it fits tightly to the board, is not easy to fall off, has strong adhesion, and has good rehydration properties, can be washed away by water, and leaves no corrosion or residue on the surface of the product to be cut and etched.

[0024] Next, a PVA protective glue used in metal laser cutting and etching processes in this exemplary embodiment will be further described.

[0025] In one embodiment of the present application, the proportions of the components in the PVA stock solution are, by mass, 6% to 10% of vinyl acetate-ethylene copolymer emulsion, 2% to 6% of polyvinyl alcohol solution, and 81% to 85% of water.

[0026] It should be noted that the PVA stock solution includes the main components of the PVA protective glue. According to the actual material of the substrate and the actual processing plan, the components in the PVA stock solution are proportioned so that the PVA protective glue has different properties and the applicability of the PVA protective glue is improved.

[0027] In one embodiment of the present application, the leveling agent is glycol polyether (surfynol465).

[0028] It should be noted that, by adding the leveling agent surfynol 465, the PVA protective glue can be smoothly spread on the board after spraying, has good leveling properties, and can form a complete protective coating.

[0029] In one embodiment of the present application, 0-5 parts of water-based color paste are also included.

[0030] It should be noted that the addition of water-based color paste makes it easier to observe the integrity of the PVA protective glue after film formation and ensure the yield rate of laser cutting and etching products.

[0031] In one embodiment of the present application, 0.5-1 part of corrosion inhibitor is also included.

[0032] It should be noted that the addition of the corrosion inhibitor can ensure the pH stability of the PVA protective glue, prevent the PVA protective glue from generating acid due to oxidation, and avoid corrosion to the metal substrate.

[0033] In one embodiment of the present application, 0.03-0.06 parts of defoaming agent is also included.

[0034] It should be noted that the addition of a defoaming agent can reduce the generation of bubbles during storage or transportation of the PVA protective glue, so that bubbles will not appear during spraying to interfere with film formation, and no defects will be generated after film formation due to bubbles.

[0035] In one embodiment of the present application, a method for preparing a PVA protective glue for metal laser cutting and etching processes is also provided. The method is used to prepare any of the protective glues described above, comprising the steps of:

[0036] Weigh distilled water according to the preset ratio and heat it to 70-90℃;

[0037] Add viscosity enhancer and stir until dissolved;

[0038] Add PVA stock solution and other auxiliary raw materials, stir for 30-40 minutes, cool to room temperature, and let stand for 12-24 hours to obtain a protective glue.

[0039] Embodiment 1:

[0040] Each raw material component:

[0041] Distilled water: 90g;

[0042] PVA stock solution: 60g;

[0043] Sodium polyacrylate: 0.6 g;

[0044] Leveling agent: 2.2g;

[0045] Triethanolamine: 0.75 g;

[0046] Antimicrobial agent: 0.75 g;

[0047] Defoaming agent: 0.06g;

[0048] The selected leveling agent is surfynol465.

[0049] The preparation method is as follows:

[0050] Heat 90g of distilled water to 70°C, add 0.6g of sodium polyacrylate in batches several times, maintain the temperature, stir until there are no obvious particles, and stop heating.

[0051] Add 2.2g of leveling agent, 60g of PVA stock solution, 0.06g of defoaming agent, 0.75g of triethanolamine and 0.75g of antibacterial agent into the reactor, stir for 30min until the system is completely uniform, cool to room temperature, and leave at room temperature overnight to completely hydrate the product to obtain a colorless PVA protective adhesive.

[0052] Embodiment 2:

[0053] Each raw material component:

[0054] Distilled water: 90g;

[0055] PVA stock solution: 60g;

[0056] Water-based color paste: 5g;

[0057] Sodium polyacrylate: 0.6 g;

[0058] Leveling agent: 1.5g;

[0059] Triethanolamine: 0.75 g;

[0060] Antimicrobial agent: 0.75 g;

[0061] Defoaming agent: 0.1g;

[0062] The selected leveling agent is surfynol465.

[0063] The preparation method is as follows:

[0064] Heat 90g of distilled water to 70°C, add 0.6g of sodium polyacrylate in batches several times, maintain the temperature, stir until there are no obvious particles, and stop heating.

[0065] Add 1.5g of leveling agent, 60g of PVA stock solution, 5g of water-based color paste, 0.1g of defoaming agent, 0.75g of triethanolamine, and 0.75g of antibacterial agent into the reactor, stir for 30 minutes until the system is completely uniform, cool to room temperature, and leave it at room temperature overnight to completely hydrate the product to obtain a colored PVA protective glue.

[0066] Embodiment 3:

[0067] Each raw material component:

[0068] Distilled water: 90g;

[0069] PVA stock solution: 60g;

[0070] Sodium carboxymethyl cellulose: 0.8g;

[0071] Leveling agent: 2.2g;

[0072] Triethanolamine: 0.75 g;

[0073] Antimicrobial agent: 0.75 g;

[0074] Defoaming agent: 0.06g;

[0075] The selected leveling agent is surfynol465.

[0076] The preparation method is as follows:

[0077] Heat 90g of distilled water to 70°C, add 0.8g of sodium carboxymethyl cellulose in batches several times, maintain the temperature, stir until there are no obvious particles, and stop heating.

[0078] Add 2.2g of leveling agent, 60g of PVA stock solution, 0.06g of defoaming agent, 0.75g of triethanolamine and 0.75g of antibacterial agent into the reactor, stir for 30min until the system is completely uniform, cool to room temperature, and leave at room temperature overnight to completely hydrate the product to obtain a colorless PVA protective adhesive.

[0079] Embodiment 4:

[0080] Each raw material component:

[0081] Distilled water: 90g;

[0082] PVA stock solution: 60g;

[0083] Gelatin: 0.5g;

[0084] Leveling agent: 2.2g;

[0085] Triethanolamine: 0.75 g;

[0086] Antimicrobial agent: 0.75 g;

[0087] Defoaming agent: 0.06g;

[0088] The selected leveling agent is surfynol465.

[0089] The preparation method is as follows:

[0090] Heat 90g of distilled water to 70°C, add 0.5g of gelatin in batches several times, maintain the temperature, stir until there are no obvious particles, and stop heating.

[0091] Add 2.2g of leveling agent, 60g of PVA stock solution, 0.06g of defoaming agent, 0.75g of triethanolamine and 0.75g of antibacterial agent into the reactor, stir for 30min until the system is completely uniform, cool to room temperature, and leave at room temperature overnight to completely hydrate the product to obtain a colorless PVA protective adhesive.

[0092] Embodiment 5:

[0093] Each raw material component:

[0094] Distilled water: 90g;

[0095] PVA stock solution: 60g;

[0096] Water-soluble chitosan: 0.4g;

[0097] Leveling agent: 2.2g;

[0098] Triethanolamine: 0.75 g;

[0099] Antimicrobial agent: 0.75 g;

[0100] Defoaming agent: 0.06g;

[0101] The selected leveling agent is surfynol465.

[0102] The preparation method is as follows:

[0103] Heat 90 g of distilled water to 70° C., add 0.4 g of water-soluble chitosan in batches several times, maintain the temperature, stir until no obvious particles are present, and stop heating.

[0104] Add 2.2g of leveling agent, 60g of PVA stock solution, 0.06g of defoaming agent, 0.75g of triethanolamine and 0.75g of antibacterial agent into the reactor, stir for 30min until the system is completely uniform, cool to room temperature, and leave at room temperature overnight to completely hydrate the product to obtain a colorless PVA protective adhesive.

[0105] The effect of the PVA protective glue prepared by the above method has been tested. The PVA protective glue can flow naturally on the glass rod without hanging, is easy to spray industrially, and does not clog the nozzle; the coating formed by the PVA protective glue has good adhesion, is not easy to fall off or peel, and can improve the yield rate of laser cutting and etching products; the coating formed by the PVA protective glue can be spread on the metal plate, and after drying, it can form a complete and thick protective film to ensure that the protective film is not burned through by the slag and has a lower viscosity; the coating formed by the PVA protective glue can be re-dissolved in water, so that there is no colloid residue on the surface of the substrate.

[0106] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present application.

[0107] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0108] The above is a detailed introduction to the PVA protective glue and preparation method for metal laser cutting and etching processes provided by the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for general technicians in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A PVA protective adhesive for metal laser cutting and etching processes, characterized in that: The PVA protective glue comprises, by weight ratio: 50-60 parts of PVA stock solution, 90-100 parts of water, 0.4-0.8 parts of tackifier, 1.5-2.2 parts of leveling agent and 0.75-1 part of antibacterial agent; The PVA stock solution is a mixture of vinyl acetate-ethylene copolymer emulsion, polyvinyl alcohol solution and water; the viscosity enhancer is one or more of sodium polyacrylate, sodium carboxymethyl cellulose, polyacrylamide, gelatin and water-soluble chitosan; and the corrosion inhibitor is one of triethanolamine, imidazoline and methylbenzotriazole.

2. The protective glue according to claim 1, characterized in that: The proportions of the components in the PVA stock solution are as follows: 6% to 10% of vinyl acetate-ethylene copolymer emulsion, 2% to 6% of polyvinyl alcohol solution and 81% to 85% of water by mass.

3. The protective glue according to claim 1, characterized in that: The leveling agent is glycol polyether.

4. The protective glue according to claim 1, characterized in that: Also includes 0-5 parts of water-based color paste.

5. The protective glue according to claim 1, characterized in that: It also includes 0.5-1 part of corrosion inhibitor.

6. The protective adhesive according to claim 1, characterized in that: It also includes 0.03-0.06 parts of defoaming agent.

7. A method for preparing a PVA protective adhesive for metal laser cutting and etching processes, characterized in that: The method is used to prepare the protective glue according to any one of claims 1 to 5, comprising the steps of: Weigh distilled water according to the preset ratio and heat it to 70-90℃; Add viscosity enhancer and stir until dissolved; Add PVA stock solution and other auxiliary raw materials, stir for 30-40 minutes, cool to room temperature, and let stand for 12-24 hours to obtain a protective glue.

Citation Information

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