LED display screen, preparation method thereof and display equipment

Abstract

The invention discloses an LED display screen, and belongs to the technical field of display. The display screen comprises a substrate and at least one LED pixel module arranged on the substrate, each LED pixel module comprises an LED driving chip and an LED lamp bead which are electrically connected, and the LED driving chip and the LED lamp bead are packaged into a whole. The invention further discloses a method for preparing the LED display screen and display equipment with the LED display screen. The LED lamp beads and the LED driving chips are packaged into a whole to form the LED pixel module, the LED pixel module can be attached to base materials of various forms, and the application range is widened.

Description

Technical Field

[0001] The present invention relates to the field of display technology, in particular to an LED display screen, a method for preparing the LED display screen, and a display device having the LED display screen. Background Art

[0002] LED display screens can be used to display various information such as text, images, and videos, and are widely used. At present, LED display screens are usually made based on glass substrates. When making LED display screens based on glass substrates, it is necessary to make TFT circuits on the glass substrates to drive the LEDs to emit light. When making TFT circuits on glass substrates, high-precision equipment and high-standard preparation processes are required, such as ensuring that the glass substrate has good flatness and ensuring that the line width accuracy meets the requirements. However, when making LED display screens based on glass substrates, since the glass substrates cannot be bent, the applicable scenarios are greatly limited, such as being unable to be used in scenes such as curved surfaces.

[0003] In addition, in order to apply LED displays to curved scenes, some people use flexible screen technology to prepare LED displays. However, this requires the use of special materials and processes, which leads to high costs and is difficult to popularize in the low-end market.

[0004] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the invention and should not be regarded as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art. Summary of the invention

[0005] The object of the present invention is to provide an LED display screen having the advantage of a wider application range.

[0006] The present invention also aims to provide a method for preparing an LED display screen, and the prepared LED display screen has the advantage of a wider range of applications.

[0007] The object of the present invention is to provide a display device having the above-mentioned LED display screen, which has a wider range of applications.

[0008] To achieve the above object, an embodiment of the present invention provides an LED display screen, comprising:

[0009] A substrate, configured with a signal line;

[0010] At least one LED pixel module is disposed on the substrate and electrically connected to the signal line, and each of the LED pixel modules includes

[0011] An LED driver chip is electrically connected to the signal line;

[0012] The LED lamp bead is electrically connected to the LED driver chip and is packaged integrally with the LED driver chip.

[0013] In one or more embodiments of the present invention, the LED driver chip is electrically connected to the LED lamp bead through a semiconductor trace.

[0014] In one or more embodiments of the present invention, the LED driver chip includes a data input pin, and the LED driver chip is connected to the signal line via the data input pin.

[0015] In one or more embodiments of the present invention, a plurality of LED pixel modules are included, and the plurality of LED pixel modules are arranged in an array.

[0016] In one or more embodiments of the present invention, comprising

[0017] The timing controller is connected to each LED pixel module through a signal line and is configured to control the corresponding LED pixel module to emit light based on display data.

[0018] In one or more embodiments of the present invention, each of the LED pixel modules is configured with an address, the timing controller sends display data including the address to each of the LED pixel modules, and each of the LED pixel modules receives the display data when the address matches.

[0019] In one or more embodiments of the present invention, the signal line is a bus, and the plurality of LED pixel modules form a parallel structure through the bus.

[0020] In one or more embodiments of the present invention, the LED lamp bead channel is flip-chip packaged together with the LED driver chip.

[0021] An embodiment of the present invention provides a method for preparing an LED display screen, comprising the following steps:

[0022] S100, manufacturing bare chips corresponding to multiple LED driver chips on the wafer;

[0023] S200, placing a bare chip corresponding to the LED driver chip on a substrate carrying LED lamp beads, and electrically connecting the bare chip and the LED lamp beads through a conductive circuit of a semiconductor process to form a light-emitting module including the LED lamp beads, or connecting the LED lamp beads to the corresponding bare chip through an invisible frame to form a light-emitting module including the LED lamp beads;

[0024] S300, plastic-sealing and cutting the light-emitting module including the LED lamp beads to form a plurality of LED pixel module particles;

[0025] S400, placing a plurality of LED pixel modules on a substrate and electrically connecting them to signal lines on the substrate to form an LED display screen.

[0026] An embodiment of the present invention further provides a display device, comprising any one of the LED display screens described above.

[0027] Compared with the prior art, (1) the present invention packages the LED driver chip and the LED lamp bead into one to form an LED pixel module. The LED pixel module can be assembled on a variety of substrates, such as flexible substrates, and has a wider range of applications.

[0028] (2) The present invention packages the LED driver chip and the LED lamp bead into one to form an LED pixel module. On the one hand, it simplifies the production and installation process of the LED display device, improves production efficiency and reduces manufacturing costs. On the other hand, it can reduce the occupied area of ​​the light-emitting module, making the LED display screen more compact and saving space.

[0029] (3) The present invention packages LED lamp beads and corresponding LED driver chips into one to form an LED pixel module, so that each LED pixel module can be controlled independently. Therefore, the LED pixel module can be individually tested before being assembled to the substrate, which can avoid damage and replacement after assembly.

[0030] (4) The present invention packages the LED driver chip and the LED lamp bead into one to form an LED pixel module, thereby avoiding the need to manufacture a TFT circuit on a substrate, thereby reducing the number of signal lines and improving the light transmittance of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a schematic structural diagram of an LED display screen according to an embodiment of the present invention;

[0032] Figure 2 is a schematic cross-sectional view of an LED display screen according to an embodiment of the present invention;

[0033] Figure 3 is a schematic diagram of a data format according to an embodiment of the present invention;

[0034] Figure 4 is a schematic diagram of data transmission according to an embodiment of the present invention.

[0035] Description of main reference numerals:

[0036] 10-substrate, 20-LED pixel module, 21-LED driver chip, 22-LED lamp bead. DETAILED DESCRIPTION

[0037] The specific implementation modes of the present invention are described in detail below in conjunction with the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific implementation modes.

[0038] Unless explicitly stated otherwise, throughout the specification and claims, the term “comprise” or variations such as “include” or “comprising”, etc., will be understood to include the stated elements or components but not to exclude other elements or components.

[0039] like Figure 1 to Figure 2 As shown, according to a preferred embodiment of the present invention, an LED display screen is formed by packaging an LED driver chip and an LED lamp bead into one body to form an LED pixel module, and the LED pixel module can be assembled on a variety of substrates, so that it can be attached to various curved surfaces and various shapes, and has a wider range of applications, such as being suitable for information display on car windows, suitable for spherical displays, etc. Of course, in addition to being suitable for various curved surfaces and various shapes, the LED display screen is also suitable for traditional planes and can be set according to actual application scenarios.

[0040] Specifically, Figure 1 As shown, the LED display screen includes a substrate 10 and at least one LED pixel module 20. The substrate 10 is preferably a flexible substrate, and its shape can be changed, such as bending, etc., and a signal line (not shown) for signal transmission is constructed thereon. The signal here includes but is not limited to a data signal and a control signal.

[0041] The LED pixel module 20 is disposed on the substrate 10 and connected to the signal line to determine how to emit light, such as whether to emit light, etc., according to the received signal. Figure 2 As shown, the LED pixel module 20 includes an LED driver chip 21 and an LED lamp bead 22, where the LED lamp bead 22 is selected from one or more combinations of emitting red, green, and blue light. The LED driver chip 21 is electrically connected to the signal line, and the LED driver chip 21 is also electrically connected to the LED lamp bead 22. The LED driver chip 21 can control how the LED lamp bead 22 emits light based on the received signal.

[0042] In the present invention, the LED driver chip 21 and the LED lamp bead 22 in the LED pixel module 20 are packaged together, that is, the LED driver chip 21 and the LED lamp bead 22 are packaged together using a corresponding packaging process. Figure 2As shown, a sapphire substrate can be used as a substrate to carry the LED driver chip 21 and the LED lamp bead 22. A high-density conductive circuit is further formed on the sapphire substrate through a semiconductor etching process to electrically connect the LED driver chip 21 with the LED lamp bead 22. MIP (Micro LED in Package) packaging is further performed on the sapphire substrate to protect the internal connection structure of the LED lamp bead and the LED driver chip 21, ensuring its wear resistance and reliability in practical applications. After packaging, the entire LED pixel module can be placed on a PCB (printed circuit board) by welding, and the signal end and power end of the LED driver chip 21 are led out through solder joints to achieve reliable connection with the external circuit. This method can reduce the spacing to 100um.

[0043] By providing a corresponding LED driver chip 21 for each LED lamp bead 22 and packaging each LED lamp bead 22 and the corresponding LED driver chip 21 together, each LED lamp bead 22 can be independently controlled. Therefore, an individual test can be performed before the LED pixel module is assembled to the substrate 10, thereby avoiding damage replacement after assembly.

[0044] In addition, by packaging the LED driver chip 21 and the LED lamp bead 22 together to form the LED pixel module 20, on the one hand, the production and installation process of the LED display screen is relatively simplified, the production efficiency is improved, and the manufacturing cost is reduced. On the other hand, the occupied area of ​​the light-emitting module can be reduced, making the LED display screen more compact and space-saving.

[0045] Furthermore, in order to realize the electrical connection between the LED driver chip 21 and the LED lamp bead 22, the LED driver chip 21 includes a conductive contact (PAD), and the LED driver chip 21 is electrically connected to the LED lamp bead 22 through a part of the conductive contacts to control it, and the other conductive contacts of the LED driver chip 21 can be led outward as the pins of the entire LED pixel module to input corresponding signals, etc. When the LED driver chip 21 is electrically connected to the LED lamp bead 22 using the conductive contacts, the LED pixel module 20 can be packaged and obtained in the following manner:

[0046] First, a plurality of bare chips (dies) corresponding to the LED driver chips 21 are manufactured on a wafer;

[0047] Secondly, the bare chip corresponding to the LED driver chip is placed on the substrate carrying the LED lamp beads, and the bare chip and the LED lamp beads are electrically connected through the conductive circuit of the semiconductor process (that is, the conductive contacts on the bare chip corresponding to the LED driver chip 21 are electrically connected to the LED lamp beads through the wire circuit of the semiconductor process) to form a light-emitting module including the LED lamp beads, or the LED lamp beads are connected to the corresponding bare chip through an invisible frame to form a light-emitting module including the LED lamp beads;

[0048] Finally, the wafer is plastic-sealed and cut to form a plurality of LED pixel modules 20 particles.

[0049] like Figure 1 As shown, when a plurality of LED pixel modules 20 are provided on the substrate 10, the plurality of LED pixel modules 20 are arranged in a matrix, such as arranged in M ​​rows, N columns, etc., where M and N are integers greater than 0. Of course, they can also be arranged in a desired shape, etc. according to actual needs. Each LED pixel module 20 is connected to a signal line to receive data, etc.

[0050] Furthermore, each LED pixel module 20 includes a data transmission pin, and the LED pixel module 20 can be connected to a signal line through the data transmission pin to receive data. In this embodiment, the signal line is preferably a bus, such as I 2 C bus, etc. Using bus structure for signal transmission can reduce the number of signal lines, improve the light transmittance of LED display, and make the whole LED display fit on various curved surfaces and shapes.

[0051] Furthermore, when the bus is used for signal transmission, in order for each LED pixel module 20 to receive the correct data, each LED pixel module 20 is also configured with an address, and cooperates with the timing controller to ensure that the data can be received correctly. Specifically, when the timing controller sends data through the bus, it encapsulates the address of the LED pixel module 20 to be sent in the data. Each LED pixel module 20 identifies the received data to determine whether it is the data received by itself. During implementation, the LED pixel module 20 parses the data to obtain the address information, further matches the address with the address configured by itself, and determines that the data is the data received by itself when it matches, and determines that the data is not the data received by itself when it does not match, and can be discarded.

[0052] Of course, in other embodiments, the following may also be used: Figure 3The data frame format shown is used for data transmission. Specifically, the data frame includes a synchronization bit, a mode bit, a data bit, and a color bit, wherein the synchronization bit is used to indicate the starting point of the data stream, so that the LED pixel module can identify the first bit in the data stream; the mode bit is used to control the selection of different modes, such as different color modes, brightness control modes, dynamic effect modes, etc.; the data bit is used to store some auxiliary information, such as color change steps, special effect parameters, etc.; the color bit includes 8-bit green data, 8-bit red data, and 8-bit blue data, and is transmitted in the following order when transmitting data: green data, red data, blue data.

[0053] Furthermore, combined with Figure 4 As shown, when transmitting data, the controller sends the data stream (including the RGB data of all LED pixel modules) in serial mode to the first LED pixel module in the LED chain, and the first LED pixel module starts to receive the data stream and extracts the first 24 bits of data (representing the RGB data of the first LED pixel module) from the data stream; the first LED pixel module stores the processed data, such as in its internal register, and passes the remaining data stream (including the data of the next LED pixel module) to the next LED pixel module, and so on, until all LED pixel modules in the LED chain receive the corresponding data.

[0054] Furthermore, when a bus is used for signal transmission, multiple LED pixel modules 20 connected to the bus are in parallel. This connection method can avoid the voltage drop caused by series connection, so that in actual applications, when there are too many LED pixel modules 20, the subsequent LED pixel modules 20 cannot work normally.

[0055] The LED display screen of the present invention provides a corresponding LED driver chip for each LED lamp bead 22, and packages the LED lamp bead 22 with the corresponding LED driver chip 21, so that each LED pixel module 20 can be controlled individually, which can avoid problems such as poor display effect caused by overall control and improve the display effect. At the same time, by packaging the LED lamp bead 22 and the corresponding LED driver chip 21 in one body, it helps to reduce the occupied area of ​​the light-emitting module, and also helps to simplify the production and installation process, improve production efficiency, and reduce manufacturing costs.

[0056] The present invention also discloses a method for preparing an LED display screen, comprising the following steps:

[0057] First, a plurality of dies corresponding to LED driver chips are manufactured on a wafer;

[0058] Secondly, the bare chip corresponding to the LED driver chip is placed on the substrate carrying the LED lamp beads, and the bare chip and the LED lamp beads are electrically connected through the conductive circuit of the semiconductor process to form a light-emitting module including the LED lamp beads, or the LED lamp beads are connected to the corresponding bare chip through an invisible frame to form a light-emitting module including the LED lamp beads;

[0059] Next, the light-emitting module including the LED lamp beads is plastic-sealed and cut to form a plurality of LED pixel module particles;

[0060] Finally, multiple LED pixel modules are arranged on a substrate (such as a PCB board, etc.) and electrically connected to the signal lines on the substrate to form an LED display screen.

[0061] The LED display screen can be prepared by the above method. The LED display screen is not only suitable for traditional flat display, but also can be used for display on curved or special-shaped surfaces, and has a wider range of applications.

[0062] The present invention also discloses a display device, including the above-mentioned LED display screen. The display device here includes but is not limited to a mobile phone and a computer.

[0063] The foregoing description of specific exemplary embodiments of the present invention is for the purpose of illustration and demonstration. These descriptions are not intended to limit the present invention to the precise form disclosed, and it is clear that many changes and variations can be made based on the above teachings. The purpose of selecting and describing the exemplary embodiments is to explain the specific principles of the present invention and its practical application, so that those skilled in the art can realize and utilize various different exemplary embodiments of the present invention and various different selections and changes. The scope of the present invention is intended to be limited by the claims and their equivalents.

Claims

1. An LED display screen, characterized in that: include: A substrate, configured with a signal line; At least one LED pixel module is disposed on the substrate and electrically connected to the signal line, and each of the LED pixel modules includes LED driver chip; At least one LED lamp bead is electrically connected to the LED driver chip and is packaged integrally with the LED driver chip.

2. The LED display screen according to claim 1, characterized in that: The LED driver chip is electrically connected to the LED lamp bead through a semiconductor wiring.

3. The LED display screen according to claim 1, characterized in that: The LED pixel module comprises a data input pin, and the LED pixel module is connected to the signal line via the data input pin.

4. The LED display screen according to claim 1, characterized in that: It comprises a plurality of LED pixel modules, and the plurality of LED pixel modules are arranged in an array.

5. The LED display screen according to claim 1, characterized in that: include The timing controller is connected to each LED pixel module through a signal line and is configured to control the corresponding LED pixel module to emit light based on display data.

6. The LED display screen according to claim 5, characterized in that: Each of the LED pixel modules is configured with an address, and the timing controller sends display data including the address to each of the LED pixel modules, and each of the LED pixel modules receives the display data when the address matches.

7. The LED display screen according to claim 1, characterized in that: The signal line is a bus, and the plurality of LED pixel modules form a parallel structure through the bus.

8. The LED display screen according to claim 1, characterized in that: The LED lamp beads are packaged together with the LED driver chip by flip-chip or by an invisible frame.

9. A method for preparing the LED display screen according to claim 1, characterized in that: The steps include: S100, manufacturing bare chips corresponding to multiple LED driver chips on the wafer; S200, placing a bare chip corresponding to the LED driver chip on a substrate carrying LED lamp beads, and electrically connecting the bare chip and the LED lamp beads through a conductive circuit of a semiconductor process to form a light-emitting module including the LED lamp beads, or connecting the LED lamp beads to the corresponding bare chip through an invisible frame to form a light-emitting module including the LED lamp beads; S300, plastic-sealing and cutting the light-emitting module including the LED lamp beads to form a plurality of LED pixel module particles; S400, placing a plurality of LED pixel modules on a substrate and electrically connecting them to signal lines on the substrate to form an LED display screen.

10. A display device, characterized in that: The LED display screen comprises any one of claims 1 to 8.

Images