Electromagnetic interference and / or radio frequency attenuation infrastructure insulation

Abstract

An electromagnetic insulation device includes a body material, a conductive EMI attenuation layer, and a plurality of conductive elements. The host material is substantially planar and flexible. The EMI attenuation layer is positioned inside the host material. A plurality of conductive elements are positioned in the host material. The EMI attenuation layer and the plurality of conductive elements are configured to be electrically connected to an external ground connection.

Description

Background Art

[0001] Electronic devices, such as computing devices, power supplies, and data storage devices, are susceptible to electromagnetic interference (EMI) and radiated radio frequency (RF) emissions, which can be detected by other electronic devices, including an antenna or another communication device near the electronic device. When using some electronic devices, privacy and safety issues may require EMI and RF shielding. Summary of the invention

[0002] In some embodiments, an electromagnetic insulation device includes a main body material, a conductive EMI attenuation layer, and a plurality of conductive elements. The main body material is substantially planar and flexible. The EMI attenuation layer is located inside the main body material. The plurality of conductive elements are located in the main body material. The EMI attenuation layer and the plurality of conductive elements are configured to be electrically connected to an external ground connection.

[0003] In some embodiments, a system for electromagnetic attenuation includes a first electromagnetic insulation device (including a first EMI attenuation layer), a second electromagnetic insulation device (including a second EMI attenuation layer), and a connection device that electrically connects the first EMI attenuation layer to the second EMI attenuation layer.

[0004] In some embodiments, the electromagnetic insulation device includes a main body material, a first conductive EMI attenuation layer, a second conductive EMI attenuation layer, and a plurality of conductive elements. The main body material is substantially planar and flexible. The first EMI attenuation layer is located inside the main body material. The second EMI attenuation layer is located inside the main body material. A plurality of conductive elements are located in the main body material. The first EMI attenuation layer, the second EMI attenuation layer, and the plurality of conductive elements are configured to be electrically connected to an external ground connector.

[0005] This summary is provided to introduce a series of concepts in a simplified form, which are further described in the detailed description below. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

[0006] Additional features and advantages will be set forth in the following description, and some features and advantages will be apparent from the description, or may be learned by practice of the teachings herein. The features and advantages of the present disclosure may be realized and obtained by the instruments and combinations particularly pointed out in the appended claims. Features of the present disclosure will become more apparent from the following description and the appended claims, or may be learned by practice of the present disclosure as described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to describe the manner in which the above and other features of the present disclosure can be obtained, a more specific description will be provided with reference to the specific embodiments shown in the accompanying drawings. For better understanding, similar elements are designated by similar reference numbers in the various drawings. Although some of the drawings may be schematic or exaggerated representations of concepts, at least some of the drawings may be drawn to scale. It is understood that the drawings depict some example embodiments, which will be described and explained with additional specificity and detail through the use of the accompanying drawings, in which:

[0008] Figure 1 is an example of a data center with electromagnetic radiation according to at least one embodiment of the present disclosure;

[0009] Figure 2 is a top view of an electromagnetic insulation device according to at least one embodiment of the present disclosure;

[0010] Figure 3 is a cross-sectional side view of an electromagnetic insulation device according to at least one embodiment of the present disclosure;

[0011] Figure 4-1 is a top view of a guide anchoring device according to at least one embodiment of the present disclosure;

[0012] Figure 4-2 yes Figure 4-1 A side view of a guide anchoring device;

[0013] Figure 5 is a cross-sectional side view of a guide connection device securing a first electromagnetic insulation device to a second electromagnetic insulation device according to at least one embodiment of the present disclosure; and

[0014] Figure 6 is a cross-sectional side view of a guide connection device for securing a first electromagnetic insulation device and a second electromagnetic insulation device to a wall according to at least one embodiment of the present disclosure. DETAILED DESCRIPTION

[0015] The present disclosure generally relates to systems and methods for electromagnetic interference (EMI) and / or radio frequency (RF) shielding. More specifically, the electromagnetic insulation devices described herein are configured to provide EMI or RF shielding for a computing device or another electronic device inside a structure, such as a data center, an office building, a residence, a research facility, etc. In some embodiments, the electromagnetic insulation devices according to the present disclosure are configured to provide insulation from water or other environments in addition to EMI and / or RF shielding.

[0016] Figure 11 is an embodiment of a data center 100 that includes server racks 102 containing electronic equipment, such as computing devices 104, power supplies 106, communication equipment 108 (such as network switches), and other electronic equipment. In some embodiments, the data center 100 includes other electronic equipment in other server racks or stand-alone equipment. The data center 100 includes walls 110, floors 112, ceilings / roofs 114, and other structural components to enclose and protect the server racks 102 and / or other electronic equipment from environmental influences, such as precipitation, temperature, wind, dust, debris, and other adverse environmental influences that can adversely affect the performance and / or operational life of the electronic equipment. In some embodiments, the walls 110, floors 112, ceilings / roofs 114, and other structural components of the data center 100 further attenuate EM radiation that would otherwise enter or exit the data center through the walls 110, floors 112, ceilings / roofs 114, and other structural components.

[0017] Although combined Figure 1 A data center is described, but in other embodiments, embodiments of the electromagnetic isolation apparatus described herein are applicable to other structures, including office buildings, residences, research facilities, and the like.

[0018] Electronic devices of data center 100 may be susceptible to EMI 116. Electromagnetic isolation device 120 may attenuate EMI 116 and / or prevent EMI 116 from passing through electromagnetic isolation device 120 and affecting the electronic devices. Electronic devices of data center 100 may generate RF signals 118.

[0019] In some embodiments, the electromagnetic insulation device 120 is located in or on the walls 110, floor 112, ceiling / roof 114, and other structural components of the data center 100 (e.g., on the exterior surface or the interior surface) to attenuate EM radiation through the walls 110, floor 112, ceiling / roof 114, and other structural components and at least partially insulate the electronic equipment of the data center 100 from the external environment.

[0020] By electromagnetically insulating a data center or other structure, in at least one embodiment described herein, electronic devices therein are protected from external interference, and RF signals generated by the electronic devices are contained so that external electronic devices cannot receive and / or interpret the RF signals. Conventional EM insulation includes conductive materials that can be rigid, heavy, fragile, or easily corroded, such as copper or aluminum plates. Conventional EM insulation can be difficult to install, modify, and remove, which limits the adaptability of the data center 100 as the needs and equipment of the data center 100 change over time. In addition, conventional EM insulation can be difficult to retrofit on existing structures. Conventional EM insulation can also be difficult to maintain because the EM radiation attenuation performance can degrade as the EM insulation corrodes.

[0021] In some embodiments, electromagnetic insulation devices 120 according to the present disclosure include modular, flexible, durable panels configured to provide both EM and environmental insulation. In some embodiments, electromagnetic insulation devices 120 include connectors that electrically couple a series of electromagnetic insulation devices 110 to each other to cover or partially cover walls 110, floors 112, ceilings / roofs 114, and other structural components (whether indoors or outdoors) of a data center 100 to attenuate EM radiation through walls 110, floors 112, ceilings / roofs 114, and other structural components, and at least partially insulate electronic equipment of the data center 100 from the external environment.

[0022] Figure 2 is a top view of an embodiment of an electromagnetic isolation device 220 that can be used in a data center or other structure, such as in conjunction with Figure 1 As described. In some embodiments, the electromagnetic insulation device 220 is substantially rectangular. In some embodiments, the electromagnetic insulation device 220 has a perimeter shape in a plan view that allows the electromagnetic insulation device 200 to be tiled. For example, the electromagnetic insulation device 220 can be triangular, hexagonal, or other shapes that allow the electromagnetic insulation device 210 to be tiled in a substantially continuous plane along the edge 222 of the electromagnetic insulation device 200 without gaps therebetween. In some embodiments, the electromagnetic insulation device 220 is configured to overlap so that the electromagnetic insulation device 200 provides a substantially continuous plane. For example, the electromagnetic insulation device 220 can be circular, and when overlapped in a hexagonal arrangement, the circular electromagnetic insulation device 200 creates a substantially continuous plane.

[0023] In some embodiments, the electromagnetic insulation device 220 includes a plurality of connectors 224. The connectors 224 can facilitate the tiling of the electromagnetic insulation device 220 by connecting to the wall, floor, ceiling / roof, or other structural components or other structures of the data center. For example, the connectors can be arranged and / or positioned so that the connectors are aligned with one or more features of the structure in which the electromagnetic insulation device 220 is installed. In some examples, the connectors 224 can be positioned at a gap of no more than 18 inches to simplify installation in the wall of the building. In some embodiments, the connectors 224 provide electrical coupling from a conductive layer in or on the electromagnetic insulation device 220 to an external ground connection (such as a ground or ground wire). The electromagnetic insulation device 220 includes at least one conductive layer or conductive material in the electromagnetic insulation device 220 that allows conductivity through the plane of the electromagnetic insulation device 220. In some embodiments, the electromagnetic insulation device 220 allows conductivity along a first direction 226 in the plane of the electromagnetic insulation device 220. In some embodiments, the electromagnetic insulation device 220 allows conductivity along a second direction 228 orthogonal to the first direction in the plane of the electromagnetic insulation device 220. In some embodiments, electromagnetic insulation device 220 allows electrical conductivity in a first direction 226 and a second direction 228 orthogonal to the first direction in the plane of electromagnetic insulation device 220 .

[0024] Figure 3 is a cross-sectional side view of an embodiment of an electromagnetic insulation device 320. The electromagnetic insulation device 320 includes a body material 330. The body material 330 can be planar and / or flexible.

[0025] In some embodiments, body material 330 is waterproof, which prevents water from flowing from first side 332 of electromagnetic insulation device 320 to second side 334 of electromagnetic insulation device 320. Waterproof body material 330 can allow electromagnetic insulation device 320 to be exposed to ambient humidity and / or precipitation while forming a moisture barrier for the structure in which electromagnetic insulation device 320 is installed. In some embodiments, waterproof body material 330 can cover and / or encapsulate conductive EMI attenuation layers 336-1, 336-2 and limit or prevent corrosion of the conductive materials of EMI attenuation layers 336-1, 336-2.

[0026] In some embodiments, body material 330 is hermetic, which prevents air or at least some gases from flowing from first side 332 of electromagnetic insulation device 320 to second side 334 of electromagnetic insulation device 320. Waterproof body material 330 can allow electromagnetic insulation device 320 to be exposed to ambient humidity and / or precipitation while forming a moisture barrier for the structure in which electromagnetic insulation device 320 is installed. In some embodiments, water-resistant body material 330 can cover and / or encapsulate conductive EMI attenuation layers 336-1, 336-2 and limit or prevent corrosion of the conductive materials of EMI attenuation layers 336-1, 336-2.

[0027] In some embodiments, the main body material 330 is or includes an electrically insulating material. For example, the main body material 330 is or includes a vinyl material, a rubber material (natural or synthetic), a polymer material, or other flexible non-conductive material. In some embodiments, the main body material 330 is located and / or adhered to each EMI attenuation layer 336-1, 336-2. For example, the EMI attenuation layers 336-1, 336-2 can be a continuous foil or sheet without channels or holes. The main body material 330 can include multiple layers separated by (multiple) EMI attenuation layers 336-1, 336-2. In some embodiments, the main body material 330 is a single piece of material with channels or holes through the mesh of the EMI attenuation layers 336-1, 336-2. For example, the main body material 330 can be continuous from a first side of the mesh EMI attenuation layers 336-1, 336-2 to a second side of the EMI attenuation layers 336-1, 336-2.

[0028] In some embodiments, the EMI attenuation layers 336-1, 336-2 are connected to the connector (such as a combination Figure 2 In some embodiments, the resistance of the EMI attenuation layers 336-1, 336-2 to the connector does not exceed 10 ohms. In some embodiments, the resistance of the EMI attenuation layers 336-1, 336-2 to the connector does not exceed 15 ohms.

[0029] In some embodiments, the conductive EMI attenuation layers 336-1, 336-2 of the electromagnetic insulation device 320 are a grid including a plurality of holes or channels extending from a first side to a second side. In some embodiments, the holes or channels through the conductive EMI attenuation layers 336-1, 336-2 according to the present disclosure have a cross-section (i.e., shape) of a square, a rectangle, a triangle, other regular polygons, irregular polygons, a circle, an ellipse, other regular curved shapes, irregular curved shapes, or a combination thereof. The maximum lateral dimension of the hole or channel is the maximum lateral dimension regardless of the rotational direction relative to the vertical direction perpendicular to the plane of the conductive EMI attenuation layers 336-1, 336-2.

[0030] For example, EM shielding of Faraday-style shielding is based on wavelength and the attenuation required for that wavelength. For example, the higher the frequency, the shorter the wavelength of the EM radiation. The shorter the wavelength, the smaller the hole or channel opening required to attenuate the EM radiation.

[0031] A Faraday shield operates by balancing the electric field on both sides of the shield. A substantially continuous Faraday shield allows charge to conduct freely within the walls of the Faraday shield and become a hollow conductor. Introducing an aperture in the Faraday shield allows leakage of EM radiation through the aperture. In order for the Faraday cage to operate in this way, the aperture size must be smaller than the wavelength of interest. By stacking the conductive EMI attenuation layers 336-1, 336-2 in the body of the electromagnetic insulation device, the apertures or channels of the conductive layers of the conductive EMI attenuation layers 336-1 and 336-2 may not be aligned, thereby further reducing the effective size of the channel through the electromagnetic insulation device.

[0032] In some embodiments, the EMI attenuation of the electromagnetic insulation device 320 can be further increased by a conductive element 338 in the body material 330 between or around the conductive EMI attenuation layers 336-1, 336-2. In some embodiments, the conductive element 338 is embedded in the body material 330 and allows for electrical conduction in the plane of the electromagnetic insulation device 320. In some embodiments, the conductive element 338 is embedded in the body material 330 and contacts one or more of the conductive EMI attenuation layers 336-1, 336-2. In at least one embodiment, the conductive element 338 is embedded in the body material 330 and contacts at least two of the conductive EMI attenuation layers 336-1, 336-2 to allow for electrical conductivity between the conductive EMI attenuation layers 336-1 and 336-2.

[0033] In some embodiments, the conductive element 338 comprises conductive fibers. In some embodiments, the conductive element 338 comprises conductive rods. In some embodiments, the conductive element 338 comprises conductive wires.

[0034] In some embodiments, as the number of conductive EMI attenuation layers 336-1, 336-2 increases, the electromagnetic isolation device 320 provides additional attenuation for EM radiation wavelengths that are smaller than the channel size because the EM radiation must pass through each aligned or unaligned channel in the grid(s) to leak out of the electromagnetic isolation device 320. For example, the attenuation may be controlled by grounding of the electromagnetic isolation device 320, the distance and / or location of the electronic device(s) relative to the electromagnetic isolation device 320, the electromagnetic isolation device configuration, the maximum lateral and longitudinal dimensions of the channels, the number of channels, the frequency, other factors, or a combination thereof.

[0035] In some embodiments, the electromagnetic insulation device 320 provides at least -60 dB attenuation from 100 MHz to 18 GHz. In some embodiments, the electromagnetic insulation device 320 according to the present disclosure attenuates EMI in a frequency range of 2.2 GHz to 2.6 GHz. In other embodiments, the electromagnetic insulation device 320 attenuates EMI in a frequency range of 800 MHz to 900 MHz. In further embodiments, the electromagnetic insulation device 320 attenuates EMI in a frequency range of 1.8 GHz to 2.0 GHz. In further embodiments, the electromagnetic insulation device 320 attenuates EMI in a frequency range of 5.0 GHz to 6.0 GHz.

[0036] In some embodiments, the conductive EMI attenuation layers 336-1, 336-2 provide at least -60 dB RF attenuation from 9 kHz to 18 GHz. In some embodiments, the conductive EMI attenuation layers 336-1, 336-2 according to the present disclosure attenuate EMI in a frequency range of 2.2 GHz to 2.6 GHz. In other embodiments, the conductive EMI attenuation layers 336-1, 336-2 attenuate EMI in a frequency range of 800 MHz to 900 MHz. In further embodiments, the conductive EMI attenuation layers 336-1, 336-2 attenuate EMI in a frequency range of 1.8 GHz to 2.0 GHz. In further embodiments, the conductive EMI attenuation layers 336-1, 336-2 attenuate EMI in a frequency range of 5.0 GHz to 6.0 GHz.

[0037] In some embodiments, the electromagnetic insulation device 320 according to the present disclosure attenuates EMI in the frequency range by at least 20 dB over the entire frequency range. In other embodiments, the electromagnetic insulation device 320 attenuates EMI in the frequency range by at least 30 dB over the entire frequency range. In other embodiments, the electromagnetic insulation device 320 attenuates EMI in the frequency range by at least 60 dB over the entire frequency range.

[0038] In some embodiments, the electromagnetic insulation device 320 according to the present disclosure attenuates EMI in the frequency range by at least 20 dB on average in the frequency range. In other embodiments, the electromagnetic insulation device 320 attenuates EMI in the frequency range by at least 30 dB on average in the frequency range. In other embodiments, the electromagnetic insulation device 320 attenuates EMI in the frequency range by at least 60 dB on average in the frequency range.

[0039] In some embodiments, the conductive EMI attenuation layer(s) 336-1, 336-2 include a conductive material. Examples of suitable materials include, but are not limited to, copper, aluminum, iron, tin, magnesium, ferrite, or alloys thereof; graphite; and conductive polymers.

[0040] In at least one embodiment, electromagnetic insulation device 320 includes copper to provide conductivity and flexibility. In another embodiment, electromagnetic insulation device 320 includes aluminum to provide conductivity and flexibility. In another embodiment, electromagnetic insulation device 320 includes a combination of copper in the first portion and aluminum in the second portion to provide different conductive properties in different portions.

[0041] In some embodiments, the first EMI attenuation layer 336-1 and the second EMI attenuation layer 336-2 are identical. In some embodiments, the first EMI attenuation layer 336-1 and the second EMI attenuation layer 336-2 are different. For example, the first EMI attenuation layer 336-1 and the second EMI attenuation layer 336-2 may include or be made of different materials. In another example, the first EMI attenuation layer 336-1 and the second EMI attenuation layer 336-2 may have different porosities, such as the first EMI attenuation layer 336-1 is meshed and the second EMI attenuation layer 336-2 is a substantially continuous sheet. In another example, the first EMI attenuation layer 336-1 and the second EMI attenuation layer 336-2 may have different channel or hole geometries, such as different sizes, shapes, aspect ratios, etc.

[0042] The positioning of the EMI attenuation layers 336-1, 336-2 can have equal spacing within the electromagnetic insulation device 320 between the first side 332 and the second side 334. In some embodiments, a total thickness 340 of the electromagnetic insulation device 320 of at least 8 millimeters (mm) allows for sufficient electrical spacing between the first EMI attenuation layer 336-1 and the second EMI attenuation layer 336-2. In some embodiments, the electromagnetic insulation device 320 has a total thickness 340 of at least 10 mm. In some embodiments, the electromagnetic insulation device 320 has a total thickness 340 of at least 12.7 mm.

[0043] In some embodiments, the EMI attenuation layers 336-1, 336-2 have an EMI attenuation layer thickness 342-1, 342-2 of at least 0.015 mm. For example, the EMI attenuation layers 336-1 and 336-2 may be a mesh having a wire diameter of 0.015 mm. In a single layer of the EMI attenuation layers 336-1, 336-2, the mesh has an EMI attenuation layer thickness 342-1, 342-2 of 0.015 mm. In other embodiments, the EMI attenuation layers 336-1, 336-2 have an EMI attenuation layer thickness 342-1, 342-2 of at least 0.10 mm. In some examples, increasing the EMI attenuation layer thickness 342-1, 342-2 may provide the EMI attenuation layers 336-1, 336-2 with greater conductivity, but less flexibility of the EMI attenuation layer thickness 342-1, 342-2.

[0044] In some embodiments, the body layer thickness 344-1, 344-2, 344-3 of the body material 330 between or around the (multiple) EMI attenuation layers 336-1, 336-2 allows for flexibility of the electromagnetic insulation device 320. A second body layer thickness 344-2 between EMI attenuation layers, such as between a first EMI attenuation layer 336-1 and a second EMI attenuation layer 336-2, provides spacing between the EMI attenuation layers to further aid in EMI attenuation. In some embodiments, the body layer thickness 344-1, 344-2, 344-3 is at least 2.5 mm. In some embodiments, at least the second body layer thickness 344-2 is not less than 2.5 mm to provide a 2.5 mm spacing between the first EMI attenuation layer 336-1 and the second EMI attenuation layer 336-2.

[0045] In some embodiments, one or more of the EMI attenuation layers 336 - 1 , 336 - 2 may be substantially parallel to a plane of the body material 330 (eg, by a major dimension).

[0046] Figure 4-1 and Figure 4-2 446. The top view and side view of the connection device 446 are respectively. The connection device 446 can allow the electromagnetic insulation device (such as any embodiment described herein) to be connected to a structural element of the structure (e.g., a wall, floor, ceiling, roof, etc.) and / or another electromagnetic insulation device. For example, the connection device 446 includes a conductive fastener 448, which provides a conductive path from the EMI attenuation layer of the electromagnetic insulation device to an external electrical ground connection. In some embodiments, the external electrical ground connection is provided by a wire that provides a conductive path from the connection device to the ground. In some embodiments, the external electrical ground connection is provided by a second electromagnetic insulation device coupled to a ground or other electrical ground connection.

[0047] In some embodiments, the connection device 446 includes brackets 450-1, 450-2. In some embodiments, the brackets 450-1, 450-2 distribute the compressive force from the conductive fastener 448 over at least a portion of the electromagnetic insulation device to prevent and / or limit damage to the electromagnetic insulation device compressed by the brackets 450-1, 450-2. In some embodiments, the first bracket 450-1 and the second bracket 450-2 compress one or more electromagnetic insulation devices between the brackets 450-1, 450-2. In some embodiments, the connection device 446 includes a first bracket 450-1 to press the electromagnetic insulation device against a structural element (such as a bolt) or against a concrete wall of a structure.

[0048] In some embodiments, the conductive fastener 448 includes a penetrating tip 452 that allows the conductive fastener 448 to penetrate into a structural element of the structure or into the second bracket 450-2. In some embodiments, the threaded connection 454 of the conductive fastener 448 allows torque on the conductive fastener to apply a compressive force to the bracket(s) 450-1, 450-2 by compressing the first bracket 450-1 toward the second bracket 450-2 or pressing the first bracket 450-1 against the structural element.

[0049] Figure 5 5 is a cross-sectional side view of another embodiment of a connection device 546 having a non-penetrating tip. In some embodiments, the connection device 546 includes external brackets 550-1, 550-2 located on either side of the electromagnetic insulation devices 520-1, 520-2 to connect the electromagnetic insulation devices 520-1, 520-2 to each other. As described herein, the conductive fasteners 548 of the connection device 546 can allow for electrical conduction between the (multiple) EMI attenuation layers 536 of the first electromagnetic insulation device 520-1 and the (multiple) EMI attenuation layers 536 of the second electromagnetic insulation device 520-2. In some embodiments, the (multiple) brackets 550-1, 550-2 are conductive to provide a conductive path between the first conductive fastener 548-1 coupled to the first electromagnetic insulation device 520-1 and the second conductive fastener 548-2 coupled to the second electromagnetic insulation device 520-2.

[0050] Figure 6 is a cross-sectional side view of another embodiment of a connection device 646. In some embodiments, the connection device 646 includes a bracket 650 that provides a conductive path between a first conductive fastener 648-1 connected to the first electromagnetic isolation device 620-1 and a second conductive fastener 648-2 connected to the second electromagnetic isolation device 620. In some embodiments, the conductive fasteners 648-1, 648-2 press the bracket 650 (and the electromagnetic isolation devices 620-1, 620-2) against a structural element, such as a wall 610.

[0051] In some embodiments, electromagnetic isolation devices according to the present disclosure may allow for electromagnetic isolation of buildings such as data centers from EMI and RF communications using a modular system, thereby making more sites available and making modification of existing sites simpler.

[0052] Industrial Applicability

[0053] The present disclosure generally relates to systems and methods for electromagnetic interference (EMI) or radio frequency (RF) shielding. More specifically, the electromagnetic insulation devices described herein are configured to provide EMI or RF shielding for a computing device or another electronic device inside a structure, such as a data center, an office building, a residence, a research facility, etc. In some embodiments, the electromagnetic insulation devices according to the present disclosure are configured to provide insulation from water or other environments in addition to EMI and RF shielding.

[0054] In some embodiments, the data center includes server racks containing electronic equipment, such as computing equipment, power supplies, communication equipment (such as network switches), and other electronic equipment. In some embodiments, the data center includes other electronic equipment in other server racks or stand-alone equipment. The data center includes walls, floors, ceilings / roofs, and other structural components to enclose and protect the server racks and / or other electronic equipment from environmental influences, such as precipitation, temperature, wind, dust, debris, and other adverse environmental influences that may adversely affect the performance and / or operational life of the electronic equipment. In some embodiments, the walls, floors, ceilings / roofs, and other structural components of the data center further attenuate EM radiation that would otherwise enter or leave the data center through the walls, floors, ceilings / roofs, and other structural components.

[0055] Although a data center is described herein, in other embodiments, embodiments of the electromagnetic isolation apparatus described herein are applicable to other structures, including office buildings, residences, research facilities, and the like.

[0056] Electronic equipment in a data center may be susceptible to EMI. Electromagnetic isolation equipment may attenuate EMI and / or prevent EMI from passing through the electromagnetic isolation equipment and affecting the electronic equipment. Electronic equipment in a data center may generate RF signals.

[0057] In some embodiments, electromagnetic insulation equipment is located in or on the walls, floors, ceilings / roofs, and other structural components of the data center to attenuate EM radiation passing through the walls, floors, ceilings / roofs, and other structural components and to at least partially insulate the electronic equipment of the data center from the external environment.

[0058] By electromagnetically insulating a data center or other structure, the electronic equipment therein is protected from external interference, and the RF signals generated by the electronic equipment are contained so that external electronic equipment cannot receive and / or interpret the RF signals. Conventional EM insulation includes conductive materials that can be rigid, heavy, brittle, or easily corroded, such as copper or aluminum plates. Conventional EM insulation can be difficult to install, modify, and remove, which limits the adaptability of a data center as the needs and equipment of a data center change over time. In addition, conventional EM insulation can be difficult to retrofit on existing structures. Conventional EM insulation can also be difficult to maintain because the EM radiation attenuation performance can degrade as the EM insulation corrodes.

[0059] In some embodiments, the electromagnetic insulation device according to the present disclosure includes a modular, flexible, durable panel configured to provide EM and environmental insulation. In some embodiments, the electromagnetic insulation device includes a connector that electrically couples a series of electromagnetic insulation devices to each other to cover or partially cover the walls, floors, ceilings / roofs or other structural components of a data center to attenuate EM radiation passing through the walls, floors, ceilings / roofs, and other structural components, and at least partially insulate the electronic equipment of the data center from the external environment.

[0060] In some embodiments, as described herein, electromagnetic insulation devices are used in data centers or other structures. In some embodiments, the electromagnetic insulation devices are substantially rectangular. In some embodiments, the electromagnetic insulation devices have a perimeter shape in a plan view that allows the electromagnetic insulation devices to be tiled. For example, the electromagnetic insulation devices can be triangular, hexagonal, or other shapes that allow the electromagnetic insulation devices to be tiled in a substantially continuous plane along the edge of the electromagnetic insulation devices without gaps therebetween. In some embodiments, the electromagnetic insulation devices are configured to overlap so that the electromagnetic insulation devices provide a substantially continuous plane. For example, the electromagnetic insulation devices can be circular, and when overlapped in a hexagonal arrangement, the circular electromagnetic insulation devices create a substantially continuous plane.

[0061] In some embodiments, the electromagnetic insulation device includes a plurality of connectors. The connector can facilitate the tiling of the electromagnetic insulation device by connecting to a wall, floor, ceiling / roof, or other structural components of a data center or other structure. For example, the connector can be arranged and / or positioned so that the connector is aligned with one or more features of the structure on which the electromagnetic insulation device is installed. In some examples, the connector can be positioned at intervals of no more than 18 inches to simplify installation in the wall of a building. In some embodiments, the connector provides electrical coupling from a conductive layer in or on the electromagnetic insulation device to an external ground connection (such as a ground or ground wire). The electromagnetic insulation device includes at least one conductive layer or conductive material in the electromagnetic insulation device that allows conductivity through the plane of the electromagnetic insulation device. In some embodiments, the electromagnetic insulation device allows conductivity in a first direction in the plane of the electromagnetic insulation device. In some embodiments, the electromagnetic insulation device allows conductivity in a second direction orthogonal to the first direction in the plane of the electromagnetic insulation device. In some embodiments, the electromagnetic insulation device allows conductivity in a first direction and a second direction orthogonal to the first direction in the plane of the electromagnetic insulation device.

[0062] In some embodiments, the electromagnetic insulation device includes a flexible body material. In some embodiments, the body material is waterproof, which prevents water from flowing from a first side of the electromagnetic insulation device to a second side of the electromagnetic insulation device 320. The waterproof body material can allow the electromagnetic insulation device to be exposed to ambient humidity and / or precipitation while forming a moisture barrier for the structure to which the electromagnetic insulation device is installed. In some embodiments, the waterproof body material can cover and / or encapsulate the conductive EMI attenuation layer and limit or prevent corrosion of the conductive material of the EMI attenuation layer.

[0063] In some embodiments, the body material is hermetic, which prevents air or at least some gases from flowing from a first side of the electromagnetic insulation device to a second side of the electromagnetic insulation device. The water-resistant body material can allow the electromagnetic insulation device to be exposed to ambient humidity and / or precipitation while forming a moisture barrier for the structure to which the electromagnetic insulation device is mounted. In some embodiments, the water-resistant body material can cover and / or encapsulate the conductive EMI attenuation layer and limit or prevent corrosion of the conductive material of the EMI attenuation layer.

[0064] In some embodiments, the main body material is or includes an electrically insulating material. For example, the main body material is or includes a vinyl material, a rubber material (natural or synthetic), a polymer material, or other flexible non-conductive material. In some embodiments, the main body material is located on and / or adhered to each EMI attenuation layer. For example, the EMI attenuation layer can be a continuous foil or sheet without channels or holes. The main body material can include multiple layers separated by (multiple) EMI attenuation layers. In some embodiments, the main body material is a single piece of material through the channels or holes of the mesh of the EMI attenuation layer. For example, the main body material can be continuous from a first side of the mesh EMI attenuation layer to a second side of the EMI attenuation layer.

[0065] In some embodiments, the EMI attenuation layer has a resistance to a connector (such as the connector described herein) of no more than 5 ohms. In some embodiments, the EMI attenuation layer has a resistance to the connector of no more than 10 ohms. In some embodiments, the EMI attenuation layer has a resistance to the connector of no more than 15 ohms.

[0066] In some embodiments, the conductive EMI attenuation layer of the electromagnetic insulation device is a grid comprising a plurality of holes or channels extending from a first side to a second side. In some embodiments, the holes or channels through the conductive EMI attenuation layer according to the present disclosure have a cross-section (i.e., shape) of a square, a rectangle, a triangle, other regular polygons, irregular polygons, a circle, an ellipse, other regular curved shapes, irregular curved shapes, or a combination thereof. The maximum lateral dimension of the hole or channel is the maximum lateral dimension regardless of the rotational direction relative to the vertical direction perpendicular to the plane of the conductive EMI attenuation layer.

[0067] EM shielding, such as a Faraday shield, is based on the wavelength and the attenuation required for that wavelength. For example, the higher the frequency, the shorter the wavelength of the EM radiation. The shorter the wavelength, the smaller the hole or channel opening required to attenuate the EM radiation.

[0068] A Faraday shield operates by balancing the electric field on both sides of the shield. A substantially continuous Faraday shield allows charge to conduct freely within the walls of the Faraday shield and become a hollow conductor. The introduction of an aperture in a Faraday shield allows leakage of EM radiation through the aperture. In order for a Faraday cage to operate in this way, the aperture size must be smaller than the wavelength of interest. By laminating conductive EMI attenuation layers in the body of an electromagnetic insulation device, the apertures or channels of the conductive layers of the conductive EMI attenuation layers may not be aligned, thereby further reducing the effective size of the channel through the electromagnetic insulation device.

[0069] In some embodiments, the EMI attenuation of the electromagnetic insulation device can be further increased by conductive elements in the body material between or around the conductive EMI attenuation layers. In some embodiments, the conductive elements are embedded in the body material and allow for conduction in the plane of the electromagnetic insulation device. In some embodiments, the conductive elements are embedded in the body material and contact one or more of the conductive EMI attenuation layers. In at least one embodiment, the conductive elements are embedded in the body material and contact at least two of the conductive EMI attenuation layers to allow for conductivity between the conductive EMI attenuation layers.

[0070] In some embodiments, the conductive element comprises conductive fibers. In some embodiments, the conductive element comprises conductive rods. In some embodiments, the conductive element comprises conductive wires.

[0071] In some embodiments, as the number of conductive EMI attenuation layers increases, the electromagnetic isolation device provides additional attenuation for EM radiation wavelengths that are smaller than the channel size because the EM radiation must pass through each aligned or unaligned channel in the grid(s) to leak out of the electromagnetic isolation device. For example, the attenuation can be controlled by grounding of the electromagnetic isolation device, the distance and / or position of the electronic device(s) relative to the electromagnetic isolation device, the electromagnetic isolation device configuration, the maximum lateral and longitudinal dimensions of the channel, the number of channels, the frequency, other factors, or a combination thereof.

[0072] In some embodiments, the electromagnetic insulation device provides at least -60 dB attenuation from 9 kHz to 18 GHz. In some embodiments, the electromagnetic insulation device according to the present disclosure attenuates EMI in a frequency range of 2.2 GHz to 2.6 GHz. In other embodiments, the electromagnetic insulation device attenuates EMI in a frequency range of 800 MHz to 900 MHz. In further embodiments, the electromagnetic insulation device attenuates EMI in a frequency range of 1.8 GHz to 2.0 GHz. In further embodiments, the electromagnetic insulation device attenuates EMI in a frequency range of 5.0 GHz to 6.0 GHz.

[0073] In some embodiments, the conductive EMI attenuation layer provides at least -60 dB attenuation from 9 kHz to 18 GHz. In some embodiments, the conductive EMI attenuation layer according to the present disclosure attenuates EMI in a frequency range of 2.2 GHz to 2.6 GHz. In other embodiments, the conductive EMI attenuation layer attenuates EMI in a frequency range of 800 MHz to 900 MHz. In further embodiments, the conductive EMI attenuation layer attenuates EMI in a frequency range of 1.8 GHz to 2.0 GHz. In further embodiments, the conductive EMI attenuation layer attenuates EMI in a frequency range of 5.0 GHz to 6.0 GHz.

[0074] In some embodiments, the electromagnetic insulation device according to the present disclosure attenuates EMI in the frequency range by at least 20 dB over the entire frequency range. In other embodiments, the electromagnetic insulation device attenuates EMI in the frequency range by at least 30 dB over the entire frequency range. In other embodiments, the electromagnetic insulation device attenuates EMI in the frequency range by at least 60 dB over the entire frequency range.

[0075] In some embodiments, the electromagnetic insulation device according to the present disclosure attenuates EMI in the frequency range by at least 20 dB on average in the frequency range. In other embodiments, the electromagnetic insulation device attenuates EMI in the frequency range by at least 30 dB on average in the frequency range. In other embodiments, the electromagnetic insulation device attenuates EMI in the frequency range by at least 60 dB on average in the frequency range.

[0076] In some embodiments, the conductive EMI attenuation layer(s) include a conductive material. Examples of suitable materials include, but are not limited to, copper, aluminum, iron, tin, magnesium, ferrite, or alloys thereof; graphite; and conductive polymers.

[0077] In at least one embodiment, the electromagnetic insulation device includes copper to provide conductivity and flexibility. In another embodiment, the electromagnetic insulation device includes aluminum to provide conductivity and flexibility. In another embodiment, the electromagnetic insulation device includes a combination of copper in the first portion and aluminum in the second portion to provide different conductive properties in different portions.

[0078] In some embodiments, the first EMI attenuation layer and the second EMI attenuation layer are the same. In some embodiments, the first EMI attenuation layer and the second EMI attenuation layer are different. For example, the first EMI attenuation layer and the second EMI attenuation layer can include or be made of different materials. In another example, the first EMI attenuation layer and the second EMI attenuation layer can have different porosities, such as the first EMI attenuation layer is meshed and the second EMI attenuation layer is a substantially continuous sheet. In another example, the first EMI attenuation layer and the second EMI attenuation layer can have different channel or hole geometries, such as different sizes, shapes, aspect ratios, etc.

[0079] The EMI attenuation layers can be positioned with equal spacing within the electromagnetic insulation device between the first side and the second side. In some embodiments, a total thickness of the electromagnetic insulation device of at least 8 millimeters (mm) allows for adequate electrical spacing between the first EMI attenuation layer and the second EMI attenuation layer. In some embodiments, the electromagnetic insulation device has a total thickness of at least 10 mm. In some embodiments, the electromagnetic insulation device has a total thickness of at least 12.7 mm.

[0080] In some embodiments, the EMI attenuation layer has an EMI attenuation layer thickness of at least 0.015 mm. For example, the EMI attenuation layer and can be a mesh with a wire diameter of 0.015 mm. In a single layer in the EMI attenuation layer, the mesh has an EMI attenuation layer thickness of 0.015 mm. In other embodiments, the EMI attenuation layer has an EMI attenuation layer thickness of at least 0.10 mm. In some examples, increasing the EMI attenuation layer thickness can provide greater conductivity for the EMI attenuation layer, but the EMI attenuation layer thickness is less flexible.

[0081] In some embodiments, the thickness of the body layer of the body material between or around the (multiple) EMI attenuation layers allows for flexibility of the electromagnetic insulation device. A second body layer thickness between EMI attenuation layers, such as between a first EMI attenuation layer and a second EMI attenuation layer, provides spacing between the EMI attenuation layers to further assist in EMI attenuation. In some embodiments, the body layer thickness is at least 2.5 mm. In some embodiments, at least the second body layer thickness is not less than 2.5 mm to provide a 2.5 mm spacing between the first EMI attenuation layer and the second EMI attenuation layer.

[0082] In some embodiments, the connection device allows an electromagnetic insulation device (such as any of the embodiments described herein) to be connected to a structural element of a structure (e.g., a wall, floor, ceiling, roof, etc.) and / or another electromagnetic insulation device. For example, the connection device 446 includes a conductive fastener that provides a conductive path from the EMI attenuation layer of the electromagnetic insulation device to an external electrical ground connection. In some embodiments, the external electrical ground connection is provided by a wire that provides a conductive path from the connection device to ground. In some embodiments, the external electrical ground connection is provided by a second electromagnetic insulation device coupled to ground or other electrical ground.

[0083] In some embodiments, the connection device includes a bracket. In some embodiments, the bracket distributes the compressive force from the conductive fastener over at least a portion of the electromagnetic insulation device to prevent and / or limit damage to the electromagnetic insulation device compressed by the bracket. In some embodiments, the first bracket and the second bracket compress one or more electromagnetic insulation devices between the brackets. In some embodiments, the connection device includes a first bracket to press the electromagnetic insulation device against a structural element (such as a bolt) or against a concrete wall of a structure.

[0084] In some embodiments, the conductive fastener includes a penetrating tip that allows the conductive fastener to penetrate into a structural element of the structure or into a second bracket. In some embodiments, the threaded connection of the conductive fastener allows torque on the conductive fastener to apply a compressive force to the bracket (s) by compressing the first bracket toward the second bracket or pressing the first bracket against the structural element.

[0085] In some embodiments, the connection device 546 includes external brackets located on either side of the electromagnetic insulation device to connect the electromagnetic insulation devices to each other. As described herein, the conductive fasteners of the connection device can allow for electrical conduction between the (multiple) EMI attenuation layers of the first electromagnetic insulation device and the (multiple) EMI attenuation layers of the second electromagnetic insulation device. In some embodiments, the (multiple) brackets are conductive to provide a conductive path between a first conductive fastener coupled to the first electromagnetic insulation device and a second conductive fastener coupled to the second electromagnetic insulation device.

[0086] In some embodiments, the connection device includes a bracket that provides a conductive path between a first conductive fastener connected to the first electromagnetic isolation device and a second conductive fastener connected to the second electromagnetic isolation device. In some embodiments, the conductive fasteners press the bracket (and the electromagnetic isolation device) against a structural element, such as a wall.

[0087] In some embodiments, electromagnetic isolation devices according to the present disclosure may allow for electromagnetic isolation of buildings such as data centers from EMI and RF communications using a modular system, thereby making more sites available and making modification of existing sites simpler.

[0088] The present disclosure relates to systems and methods for electromagnetic interference (EMI) or radio frequency (RF) shielding according to at least the examples provided in the following sections:

[0089] [A1] In some embodiments, an electromagnetic insulation device includes a body material, a conductive EMI attenuation layer, and a plurality of conductive elements. The body material is substantially planar and flexible. The EMI attenuation layer is located inside the body material. The plurality of conductive elements are located in the body material. The EMI attenuation layer and the plurality of conductive elements are configured to be electrically connected to an external ground connection.

[0090] [A2] In some embodiments, the EMI attenuation layer of [A1] is substantially parallel to the plane of the host material.

[0091] [A3] In some embodiments, the main material of [A1] or [A2] is waterproof.

[0092] [A4] In some embodiments, the body material of [A1] or [A2] is sealed.

[0093] [A5] In some embodiments, the EMI attenuation layer of any one of [A1] to [A4] is a mesh.

[0094] [A6] In some embodiments, the plurality of conductive elements of any one of [A1] to [A5] includes a plurality of conductive rods.

[0095] [A7] In some embodiments, the plurality of conductive elements of any one of [A1] to [A5] includes a plurality of conductive fibers.

[0096] [A8] In some embodiments, the EMI attenuation layer of any one of [A1] to [A7] has a resistance of no more than 5 ohms.

[0097] [A9] In some embodiments, the electromagnetic insulation device of any one of [A1] to [A8] provides attenuation of at least -60 dB from 9 kHz to 18 GHz.

[0098] [A10] In some embodiments, the EMI attenuation layer of any one of [A1] to [A9] provides attenuation of at least -60 dB from 9 kHz to 18 GHz.

[0099] [A11] In some embodiments, the electromagnetic insulation device of any one of [A1] to [A10] includes a first external ground connector and a second external ground connector located no more than 18 inches apart from each other.

[0100] [A12] In some embodiments, the host material of any one of [A1] to [A11] includes vinyl.

[0101] [A13] In some embodiments, the plurality of conductive elements in the body material of any of [A1] to [A12] provide conductivity from the EMI attenuation layer to an external ground connector.

[0102] [A14] In some embodiments, the plurality of conductive elements in the body material of any of [A1] to [A13] provide conductivity between the EMI attenuation layer and the second EMI attenuation layer.

[0103] [B1] In some embodiments, a system for electromagnetic attenuation includes a first electromagnetic insulation device (including a first EMI attenuation layer), a second electromagnetic insulation device (including a second EMI attenuation layer), and a connecting device that electrically connects the first EMI attenuation layer to the second EMI attenuation layer.

[0104] [B2] In some embodiments, the connection device of [B1] includes a first conductive fastener passing through the first EMI attenuation layer and a second conductive fastener passing through the second EMI attenuation layer.

[0105] [B3] In some embodiments, the connection device of [B2] includes a first bracket configured to provide a conductive path from the first conductive fastener to the second conductive fastener.

[0106] [B4] In some embodiments, the connection device of [B3] includes a second bracket configured to provide a conductive path from the first conductive fastener to the second conductive fastener.

[0107] [C1] In some embodiments, an electromagnetic insulation device includes a main body material, a first conductive EMI attenuation layer, a second conductive EMI attenuation layer, and a plurality of conductive elements. The main body material is substantially planar and flexible. The first EMI attenuation layer is located inside the main body material. The second EMI attenuation layer is located inside the main body material. A plurality of conductive elements are located in the main body material. The first EMI attenuation layer, the second EMI attenuation layer, and the plurality of conductive elements are configured to be electrically connected to an external ground connector.

[0108] The articles "one", "an" and "the" are intended to mean that there are one or more elements in the foregoing description. The terms "including", "comprising" and "having" are intended to be inclusive and mean that there may be additional elements in addition to the listed elements. Additionally, it should be understood that the reference to "one embodiment" or "embodiment" of the present disclosure is not intended to be interpreted as excluding the existence of additional embodiments that also contain the features. For example, any element related to the embodiments described herein can be combined with any element of any other embodiment described herein. As will be understood by a technician of ordinary skill in the art covered by the embodiments of the present disclosure, the numerals, percentages, ratios, or other values ​​specified herein are intended to include the value, as well as other values ​​that are "approximately" or "approximate" to the specified value. Therefore, the specified value should be interpreted broadly enough to cover values ​​that are at least close enough to the specified value to perform the desired function or achieve the desired result. The specified value includes at least the expected changes in a suitable manufacturing or production process, and may include values ​​within 5%, within 1%, within 0.1%, or within 0.01% of the specified value.

[0109] Those of ordinary skill in the art will recognize that, in light of the present disclosure, equivalent constructions do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and modifications may be made to the embodiments disclosed herein without departing from the spirit and scope of the present disclosure. Equivalent constructions, including functional "means plus function" clauses, are intended to cover structures described herein that perform the functions described, including structural equivalents that operate in the same manner and equivalent structures that provide the same functions. It is the express intent of the applicant not to invoke means plus function or other functional claims for any claim, except for claims in which the term "means for..." appears together with the associated function. Every addition, deletion, and modification to the embodiments that falls within the meaning and scope of the claims will be encompassed by the claims.

[0110] It should be understood that any directions or reference frames in the foregoing description are merely relative directions or movements. For example, any references to "front" and "back" or "top" and "bottom" or "left" and "right" are merely descriptions of the relative positions or movements of the relevant elements.

[0111] The present disclosure may be embodied in other specific forms without departing from its spirit or characteristics. The described embodiments should be considered illustrative rather than restrictive. Therefore, the scope of the present disclosure is indicated by the appended claims rather than by the above description. Changes within the equivalent meaning and scope of the claims should be included within their scope.

Claims

1. A system for electromagnetic attenuation, the system comprising: a first electromagnetic insulation device including a first EMI attenuation layer; a second electromagnetic insulation device including a second EMI attenuation layer; as well as A connection device electrically connects the first EMI attenuation layer to the second EMI attenuation layer.

2. The system of claim 1, wherein the connection device comprises a first conductive fastener passing through the first EMI attenuation layer and a second conductive fastener passing through the second EMI attenuation layer. 3 . The system of claim 2 , wherein the connection device comprises a first bracket configured to provide a conductive path from the first conductive fastener to the second conductive fastener. 4 . The system of claim 3 , wherein the connection device comprises a second bracket configured to provide a conductive path from the first conductive fastener to the second conductive fastener.

5. The system of any of the preceding claims, wherein the first EMI attenuation layer is substantially parallel to a plane of a body material of the first electromagnetic insulation device.

6. The system of claim 5, wherein the body material is waterproof.

7. The system of claim 5, wherein the body material is sealed.

8. The system of any of the preceding claims, wherein the first EMI attenuation layer is a mesh.

9. The system of any of the preceding claims, wherein the first electromagnetic insulation device comprises a body material and a plurality of conductive elements in the body material, wherein the first EMI attenuation layer and the plurality of conductive elements are configured to be electrically connected to an external ground connector.

10. The system of claim 9, wherein the plurality of conductive elements comprises a plurality of conductive rods.

11. The system of claim 9, wherein the plurality of conductive elements comprises a plurality of conductive fibers.

12. The system of claim 9, wherein the plurality of conductive elements in the body material provide conductivity from the EMI attenuation layer to an external ground connector.

13. The system of claim 9, wherein the plurality of conductive elements in the body material provide conductivity between the EMI attenuation layer and a second EMI attenuation layer.

14. The system of any of the preceding claims, wherein the first EMI attenuation layer has a resistance of no more than 5 Ohms.

15. The system of any of the preceding claims, wherein the first electromagnetic isolation device provides at least -60 dB of attenuation from 9 kHz to 18 GHz.

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