Cleaning device of wafer transmission manipulator

Abstract

The invention provides a cleaning device of a wafer transmission mechanical arm, which comprises a cleaning tank, a cleaning device and a control device, and is characterized in that a cleaning space for accommodating cleaning liquid and the wafer transmission mechanical arm is formed in the cleaning tank; the drying part is arranged in the cleaning tank and is used for drying the wafer transmission manipulator; the cleaning tank is further provided with an outlet, the outlet is located between the drying part and the liquid level of the cleaning liquid, and the outlet is suitable for being connected into an exhaust system. The drying part is arranged in the cleaning tank, the outlet is formed in the cleaning tank, and the exhaust system is connected to the outlet, so that disordered airflow and water vapor generated in the cleaning process are exhausted, and overflow of the airflow and the water vapor is effectively reduced.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing equipment, and in particular to a cleaning device for a wafer transfer robot. Background Art

[0002] The wafer transfer robot (WTR) is used to transfer wafers between different process modules quickly, efficiently and smoothly according to the process. The wafer transfer robot includes a wafer transfer robot for clamping wafers. In the wet process, the wafer transfer robot is prone to cross contamination when transferring wafers between multiple process modules. Therefore, the wafer transfer robot needs to be cleaned after grabbing the wafers processed by the wet process (such as the wet cleaning process).

[0003] like Figure 1 As shown, the existing cleaning device 10 generally includes a cleaning tank 101 storing a cleaning liquid 1011, a liquid spray nozzle 102 and an air nozzle 103. The cleaning tank 101 of the cleaning device 10 includes two open tanks, and the slots 1012 open upward and are respectively installed in an outer tank. The liquid inlet assembly injects the cleaning liquid 1011 into the cleaning tank 101. A liquid spray nozzle 102 for spraying the cleaning liquid 1011 is arranged above the slot 1012, and an air nozzle 103 is arranged above the liquid spray nozzle 102. The air nozzle 103 sprays gas to blow dry the wafer transfer robot 104.

[0004] When cleaning the wafer transfer robot 104, the cleaning liquid 1011 fills the cleaning tank 101, and the liquid inlet assembly continuously injects the cleaning liquid 1011 into the cleaning tank 101, and the liquid spray nozzle 102 sprays the cleaning liquid 1011 to the wafer transfer robot 104. The cleaning liquid 1011 in the cleaning tank 101 continuously flows and continuously overflows from the slot 1012 to the outer tank, and is discharged through the drain port of the outer tank. The wafer transfer robot 104 enters the cleaning tank 101 from the slot 1012, and reciprocates up and down according to a pre-designed motion trajectory. Due to the interference of other components above the cleaning tank 101, the up and down reciprocating range of the wafer transfer robot 104 is limited. The wafer transfer robot 104 is only partially immersed in the cleaning liquid 1011 in the cleaning tank 101 and is effectively cleaned by the cleaning liquid 1011 continuously flowing in the cleaning tank 101; in the process of the up and down reciprocating movement of the wafer transfer robot 104, the part of the wafer transfer robot 104 that is not immersed in the cleaning liquid 1011 will be effectively cleaned by the cleaning liquid 1011 sprayed by the liquid spray nozzle 102. After cleaning the contaminants on the wafer transfer robot 104, the liquid inlet component stops or injects the cleaning liquid 1011 into the cleaning tank 101 at a small flow rate, the liquid spray nozzle 102 stops working, and the air nozzle 103 sprays the gas (for example, nitrogen) used to dry the wafer transfer robot 104. The wafer transfer robot 104 reciprocates up and down above the liquid level of the cleaning liquid 1011 in the cleaning tank 101. After the wafer transfer robot 104 is dry, one cleaning is completed.

[0005] The air nozzle 103 generates chaotic airflow and water vapor when using a large flow of gas to dry the wafer transfer robot 104. However, the cleaning tank 101 of the existing cleaning device 10 is an open tank, and the liquid spray nozzle 102 and the air nozzle 103 are arranged above the slot 1012. Figure 1 As shown by the middle arrow 200, the chaotic airflow and water vapor will overflow from the slot 1012 of the cleaning tank 101. On the one hand, the chaotic gas overflow will cause the wafer W in the waiting area to shake; on the other hand, the brought-out water vapor will cause water stains on the surface of the wafer W in the waiting area. In addition, the chaotic airflow and water vapor overflowing from the slot 1012 may also have adverse effects on other process modules in the process equipment. Summary of the invention

[0006] In view of the shortcomings of the prior art mentioned above, the object of the present invention is to provide a cleaning device for a wafer transfer robot, which is used to solve the technical problem that when the cleaning device of the wafer transfer robot in the prior art uses a large-flow gas to dry the wafer transfer robot, the gas overflow is disorderly and easily brings out water vapor, affecting the wafers in the waiting area, causing the wafers in the waiting area to shake and water stains to appear on the surface of the wafer, and may have adverse effects on other process modules in the process equipment.

[0007] To achieve the above-mentioned purpose and other related purposes, the present invention provides a cleaning device for a wafer transfer robot, comprising: a cleaning tank, the interior of which is formed with a cleaning space for accommodating a cleaning liquid and the wafer transfer robot; a drying part, arranged inside the cleaning tank, for drying the wafer transfer robot; the cleaning tank is further provided with an outlet, the outlet is located between the drying part and the liquid level of the cleaning liquid, and the outlet is suitable for connecting to an exhaust system.

[0008] Preferably, the exhaust system is a factory exhaust system.

[0009] Preferably, the notch of the cleaning tank is provided with a baffle plate covering the notch, and the baffle plate is provided with a notch for the wafer transfer robot to enter and exit the cleaning tank.

[0010] Preferably, the cleaning tank is provided with an overflow port for limiting the liquid level of the cleaning liquid inside the cleaning tank, and the cleaning liquid overflows out of the cleaning tank from the overflow port.

[0011] Preferably, at least one tank wall of the cleaning tank is lower than the outlet, and the overflow port is formed above the tank wall.

[0012] In other possible embodiments, the overflow port is opened on at least one tank wall of the cleaning tank.

[0013] Preferably, the wafer transfer robot comprises two mechanical grippers, and the cleaning tank comprises two tank bodies corresponding to the two mechanical grippers, and cleaning spaces for accommodating the cleaning liquid and one of the mechanical grippers are respectively formed inside the two tank bodies.

[0014] Preferably, the drying part is an air jet pipe, a plurality of air jet nozzles are arranged on the air jet pipe, and the air jet pipe is distributed on one side of each of the tank bodies or correspondingly distributed on both sides of each of the tank bodies.

[0015] Preferably, one outlet is respectively provided on both sides of each of the trough bodies.

[0016] Preferably, the device further comprises a liquid spraying unit, which is arranged inside the cleaning tank and is used to spray the cleaning liquid to the wafer transfer robot.

[0017] As described above, the present invention provides a cleaning device for a wafer transfer robot, which has the following beneficial effects:

[0018] 1) The drying part is arranged inside the cleaning tank, and an outlet is arranged in the cleaning tank, and the outlet is connected to an exhaust system to discharge the chaotic airflow and water vapor generated during the cleaning process, thereby effectively reducing the overflow of airflow and water vapor from the top of the slot;

[0019] 2) A baffle is provided at the notch of the cleaning tank, and a notch is provided on the baffle for the wafer transfer robot to enter and exit, which can not only block the overflow of airflow and water vapor, but also assist in optimizing the discharge effect of the outlet, further reducing the overflow of airflow and water vapor;

[0020] 3) The outlet is connected to the plant exhaust system, and the plant exhaust system is used as the exhaust system. There is no need to set up an additional exhaust system, which effectively reduces the transformation cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Shown is a schematic structural diagram of a cleaning device for a wafer transfer robot in the prior art;

[0022] Figure 2 A schematic structural diagram showing a cleaning device for a wafer transfer robot according to an exemplary embodiment of the present invention;

[0023] Figure 3 Display as Figure 2 A schematic diagram of the structure of the baffle notch of the cleaning device;

[0024] Figure 4 Display as Figure 2 Schematic diagram of the structure of the wafer transfer robot;

[0025] Figure 5 A perspective schematic diagram showing a cleaning device of a wafer transfer robot according to an exemplary embodiment of the present invention; and

[0026] Figure 6 Shown is a three-dimensional schematic diagram of a cleaning device for a wafer transfer robot according to another possible embodiment of the present invention. DETAILED DESCRIPTION

[0027] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0028] It should be noted that the illustrations provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner. Although the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation, the form, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the component layout may also be more complicated.

[0029] See also Figure 2 , Figure 5 and Figure 6, Figure 2 A schematic structural diagram of a cleaning device 1 according to an exemplary embodiment of the present invention is shown. Figure 5 A schematic perspective view of a cleaning device 1 according to an exemplary embodiment of the present invention is shown. Figure 6 A three-dimensional schematic diagram of a cleaning device 1 according to another possible embodiment of the present invention is shown. The cleaning device 1 includes a cleaning tank 11 and a drying part 13. The cleaning tank 11 has a cleaning space for accommodating a cleaning liquid 110 and a wafer transfer robot 14 formed therein. The drying part 13 is disposed inside the cleaning tank 11 and completely falls into the notch of the cleaning tank 11, and is used to dry the wafer transfer robot 14. The cleaning tank 11 is further provided with an outlet 113, which is located between the drying part 13 and the liquid level of the cleaning liquid 110, and is suitable for connecting to an exhaust system.

[0030] Preferably, in this embodiment, the exhaust system is a factory exhaust system, that is, the outlet 113 is connected to the factory exhaust system, and there is no need to set up an additional exhaust system.

[0031] Preferably, in this embodiment, the cleaning tank 11 is provided with an overflow port 114 for limiting the liquid level of the cleaning liquid 110 inside the cleaning tank 11, and the cleaning liquid 110 overflows out of the cleaning tank 11 from the overflow port 114. When cleaning the wafer transfer robot 14, in order to improve the cleaning effect, the cleaning liquid 110 is continuously injected into the cleaning tank 11 through a liquid inlet assembly. Since there is a certain space between the notch of the cleaning tank 11 and the liquid level of the cleaning liquid 110 in the cleaning tank 11, the space is used to install the drying part 13 and set the outlet 113, and the liquid level of the cleaning liquid 110 should be lower than the outlet 113, otherwise the cleaning liquid 110 will directly enter the exhaust system from the outlet 113, which will damage the exhaust system. Therefore, an overflow port 114 is provided on the cleaning tank 11, and the overflow port 114 should be lower than the outlet 113. When the liquid level of the cleaning liquid 110 reaches the overflow port 114 , the cleaning liquid 110 may overflow from the overflow port 114 , thereby achieving the renewal and flow of the cleaning liquid 110 in the cleaning tank 11 .

[0032] In this embodiment, the overflow port 114 can be Figure 5 At least one wall 115 of the cleaning tank 11 is lower than the outlet 113, thereby forming an overflow port 114 above the lower wall 115. When the liquid level of the cleaning liquid 110 reaches the overflow port 114, the cleaning liquid 110 Figure 5 As shown by the arrow in the middle, the water overflows the cleaning tank 11 from the overflow port 114.

[0033] In some possible embodiments, the overflow port 114 may be Figure 6The form shown is set, where the dotted line indicates the liquid level of the cleaning liquid 110. At least one overflow port 114 is opened on the tank wall of the cleaning tank 11. When the liquid level of the cleaning liquid 110 reaches the overflow port 114, the cleaning liquid 110 overflows the cleaning tank 11 from the overflow port 114. It should be understood that the shape, number and size of the overflow port 114 can be adaptively designed according to the actual overflow requirements of the cleaning tank 11.

[0034] When cleaning the wafer transfer robot 14, the cleaning liquid 110 is continuously injected into the cleaning tank 11 through the liquid inlet assembly, and the cleaning liquid 110 in the cleaning tank 11 continuously flows and continuously overflows from the overflow port 114. The wafer transfer robot 14 enters the cleaning tank 11 from the notch of the cleaning tank 11, and reciprocates up and down according to a pre-set motion trajectory. Due to the interference of other components above the cleaning tank 11, the stroke of the up and down reciprocating motion of the wafer transfer robot 14 is limited, and the wafer transfer robot 14 is only partially immersed in the cleaning liquid 110 in the cleaning tank 11, and is effectively cleaned by the cleaning liquid 110 that continuously flows in the cleaning tank 11.

[0035] Therefore, preferably, the present embodiment further comprises a liquid spraying unit 12, which is disposed inside the cleaning tank 11 and is used to spray the cleaning liquid 110 to the wafer transfer robot 14. Figure 2 The liquid spraying part 12 is arranged between the outlet 113 and the drying part 13. When cleaning the wafer transfer robot 14, during the up and down reciprocating movement of the wafer transfer robot 14, the part of the wafer transfer robot 14 that is not immersed in the cleaning liquid 110 will be effectively cleaned by the cleaning liquid 110 sprayed by the liquid spraying part 12.

[0036] After cleaning the contaminants on the wafer transfer robot 14, the liquid inlet component stops or injects the cleaning liquid 110 into the cleaning tank 11 at a small flow rate, the liquid spraying part 12 stops working, and the drying part 13 sprays the gas (for example, nitrogen) used to dry the wafer transfer robot 14. The wafer transfer robot 14 reciprocates up and down above the liquid level of the cleaning liquid 110 in the cleaning tank 11. After the wafer transfer robot 14 is dry, one cleaning is completed.

[0037] The drying part 13 generates chaotic airflow and water vapor during the process of spraying gas to dry the wafer transfer robot 14. In the cleaning device 1 provided by the present invention, the drying part 13 and the liquid spraying part 12 are both arranged inside the cleaning tank 11, which can reduce the chaotic airflow and water vapor from overflowing from the top of the slot of the cleaning tank 11. In addition, the chaotic airflow and water vapor can be discharged from the cleaning tank 11 from the outlet 113 connected to the exhaust system, thereby further reducing the chaotic gas and water vapor from overflowing from the top of the slot out of the cleaning tank 11, and reducing the adverse effects of the chaotic gas overflow and water vapor overflow on the wafers in the waiting area and other process modules in the process equipment.

[0038] Furthermore, in order to better reduce or even eliminate the adverse effects caused by the overflow of chaotic gas and water vapor, a baffle 112 for covering the notch is configured at the notch of the cleaning tank 11 in this embodiment. Figure 3 , Figure 3 Display as Figure 2 Schematic diagram of the structure of the baffle notch of the cleaning device in FIG. The baffle 112 is provided with a notch 1121 for the wafer transfer robot 14 to enter and exit the cleaning tank. On the one hand, the baffle 112 can block the overflow of disorderly gas and water vapor; on the other hand, the baffle 112 can also play a certain sealing role, which helps the disorderly gas and water vapor to be discharged from the outlet 113.

[0039] For further information, see Figure 4 , Figure 4 Display as Figure 2 Schematic diagram of the structure of the wafer transfer robot in FIG. In this embodiment, the wafer transfer robot 14 includes two mechanical clamps 141, the upper ends of the mechanical clamps 141 are connected to the mechanical head 142, and the lower ends of the mechanical clamps 141 are provided with a wafer clamping portion 1411. When grabbing and transferring the wafer, the wafer clamping portion 1411 is in direct contact with the wafer, and the wafer is clamped by the mutual engagement of the two mechanical clamps 141. Figure 2 The cleaning tank 11 includes two tank bodies corresponding to the two mechanical clamps 14 , and a cleaning space for accommodating a cleaning liquid 110 and a mechanical clamp 141 is formed inside the two tank bodies respectively.

[0040] It should be understood that, in some possible embodiments, the cleaning tank 11 may have only one tank body, and the present invention does not specifically limit this.

[0041] Continue reading Figure 2 and Figure 4 The mechanical gripper 141 includes a lower portion 143 and an upper portion 144. Since the moving stroke of the wafer transfer robot 14 is limited, during the cleaning process of the wafer transfer robot 14, only the lower portion 143 of the mechanical gripper 141 enters and exits the cleaning tank 11 through the notch 1121 on the baffle 112, and only the wafer clamping portion 1411 and a portion of the mechanical gripper 141 near the wafer clamping portion 1411 can be immersed in the cleaning liquid 110. Since the upper portion 144 of the mechanical gripper 141 does not directly contact the wafer, when the moving stroke of the wafer transfer robot 14 is limited, the upper portion 144 of the mechanical gripper 141 does not enter the cleaning tank 11 for cleaning.

[0042] It should be understood that in order to allow the lower portion 143 of the mechanical clamp 141 to smoothly enter and exit the cleaning tank 11, the width of the notch 1121 of the baffle 112 should be slightly larger than the width of the lower portion 143 of the mechanical clamp 141. However, if the notch 1121 is too wide, resulting in a too large gap between the notch 1121 and the lower portion 143 of the mechanical clamp 141 during the cleaning process, the blocking and sealing effect of the baffle 112 will be weakened. Preferably, the lateral gap between the two sides of the lower portion 143 of the mechanical clamp 141 and the edge of the notch 1121 is 1 to 3 mm. More preferably, the lateral gap between the two sides of the lower portion 143 of the mechanical clamp 141 and the edge of the notch 1121 is 1 to 2 mm.

[0043] It should be understood that the wafer transfer robot 14 in this embodiment is only exemplary. In the prior art, there are many types of wafer transfer robots that can realize the functions of grabbing and transferring wafers, and the present invention does not elaborate on or specifically limit this. In addition, for the cleaning area of ​​the wafer transfer robot, ordinary technicians in this field can make adaptive adjustments according to actual needs.

[0044] See also Figure 2 and Figure 5 In this embodiment, the drying part 13 is an air jet pipe 13, and the air jet pipe 13 is correspondingly distributed on both sides of the interior of the cleaning tank 11, and a plurality of air jet nozzles 131 are arranged on the air jet pipe 13. Figure 2 As shown, arrow 3 indicates the effect of the gas jetted by the air jet pipe 13 for drying the wafer transfer robot 14. During the drying process, the air jets 131 on both sides simultaneously jet gas to the cleaning area of ​​the wafer transfer robot 14, which can effectively improve the drying effect. It should be understood that, in order to simplify the structure and reduce costs, in other embodiments, the air jet pipe may be provided only on one side of the interior of the cleaning tank 11.

[0045] See also Figure 2 and Figure 5 Preferably, in this embodiment, an outlet 113 is provided on both sides of the tank body of the cleaning tank 11. It should be understood that in other embodiments, according to the actual space size of the tank body of the cleaning tank 11 and the actual need for discharge, only one outlet 113 can be provided on one side of the tank body of the cleaning tank 11.

[0046] Preferably, the cleaning liquid 110 in this embodiment is deionized water, and carbon dioxide is dissolved in the deionized water, which can have a destaticizing effect during the cleaning process.

[0047] When the cleaning device 1 provided in this embodiment is used to clean the wafer transfer robot 14, the liquid spraying part 12 and the drying part 13 are arranged inside the cleaning tank 11, and an outlet 113 is arranged in the cleaning tank 11. The outlet 113 is connected to the exhaust system to discharge the chaotic airflow and water vapor generated during the cleaning process, effectively reducing the airflow and water vapor from overflowing from above the notch of the cleaning tank 11; and a baffle 112 is arranged at the notch of the cleaning tank 11, and a notch 1121 for the wafer transfer robot 14 to enter and exit is arranged on the baffle 112, which can not only block the overflow of airflow and water vapor, but also assist in optimizing the exhaust effect of the outlet 113, further reducing the overflow of airflow and water vapor. The outlet 113 is connected to the factory exhaust system, and there is no need to set up an additional exhaust system, which effectively reduces the transformation cost.

[0048] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A cleaning device for a wafer transfer robot, characterized in that: include: A cleaning tank, wherein a cleaning space for accommodating a cleaning liquid and the wafer transfer robot is formed inside the cleaning tank; A drying part, disposed inside the cleaning tank, for drying the wafer transfer robot; The cleaning tank is further provided with an outlet, the outlet is located between the drying part and the liquid level of the cleaning liquid, and the outlet is suitable for connecting to an exhaust system.

2. The cleaning device for the wafer transfer robot according to claim 1, characterized in that: The exhaust system is a factory exhaust system.

3. The cleaning device for a wafer transfer robot according to claim 1, characterized in that: The notch of the cleaning tank is provided with a baffle plate covering the notch, and the baffle plate is provided with a notch for the wafer transfer robot to enter and exit the cleaning tank.

4. The cleaning device for a wafer transfer robot according to claim 1, characterized in that: The cleaning tank is provided with an overflow port for limiting the liquid level of the cleaning liquid inside the cleaning tank, and the cleaning liquid overflows out of the cleaning tank from the overflow port.

5. The cleaning device for the wafer transfer robot according to claim 4, characterized in that: At least one tank wall of the cleaning tank is lower than the outlet, and the overflow port is formed above the tank wall.

6. The cleaning device for the wafer transfer robot according to claim 4, characterized in that: The overflow port is provided on at least one tank wall of the cleaning tank.

7. The cleaning device for a wafer transfer robot according to claim 1, characterized in that: The wafer transfer robot comprises two mechanical grippers, and the cleaning tank comprises two tank bodies corresponding to the two mechanical grippers. Cleaning spaces for accommodating the cleaning liquid and one of the mechanical grippers are respectively formed inside the two tank bodies.

8. The cleaning device for the wafer transfer robot according to claim 7, characterized in that: The drying part is an air jet pipe, and a plurality of air jet nozzles are arranged on the air jet pipe. The air jet pipe is distributed on one side of each of the tank bodies or on both sides of each of the tank bodies.

9. The cleaning device for a wafer transfer robot according to claim 7, characterized in that: An outlet is respectively arranged on both sides of each trough body.

10. The cleaning device for a wafer transfer robot according to any one of claims 1 to 9, characterized in that: It further includes a liquid spraying part, which is arranged inside the cleaning tank and is used to spray the cleaning liquid to the wafer transfer robot.

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