Semiconductor clamp welding equipment for brushing solder paste on surface of chip

Abstract

The invention belongs to the technical field of semiconductor clamping welding, and particularly relates to semiconductor clamping welding equipment for brushing solder paste on the surface of a chip, which comprises a rack, a track chip passing mechanism, a solder paste brushing mechanism, a die punching mechanism, a bonding head mechanism, an upper visual mechanism, an unwinding mechanism and a lower visual mechanism, the unwinding mechanism is arranged on one side wall of the rack, the rail sheet passing mechanism is arranged at the top of the rack, the solder paste brushing mechanism and the upper vision mechanism are both arranged on one side of the rail sheet passing mechanism, the head bonding mechanism is arranged at one end of the rail sheet passing mechanism, and the lower vision mechanism is arranged at the other end of the rail sheet passing mechanism. After being connected with the lead frame through an inlet of the track chip passing mechanism, the lead frame enters equipment, and in the process that the lead frame is continuously clamped by a clamping jaw in a track of the track chip passing mechanism, tin paste brushing, Clip die punching, Clip mounting to the lead frame and visual detection are sequentially completed; and the position precision of the solder paste on the surface of the chip is improved, and the consistency precision of the size of the solder paste is also improved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor clamping, and in particular relates to a semiconductor clamping device for brushing solder paste on the surface of a chip. Background Art

[0002] Currently, the clamp welding equipment on the market only has the function of dispensing glue (dispensing solder paste). After the chip is installed on the lead frame (Leadframe) of the semiconductor device, solder paste (or silver paste) needs to be applied on the surface of the chip, and then the Clip is mounted on the surface of the chip.

[0003] Since the semiconductor device frame is generally an integrated design, hundreds of products are arrayed on a frame. The dispensing function module can only dispense glue to 1~2 products at a time, which means that each frame needs dozens or even hundreds of times to complete all the dispensing actions. As a result, the clamping equipment on the market currently has the following shortcomings: 1. Each frame is glued hundreds of times, which will make the glue dispensing module the bottleneck of the UPH of the entire clamp welding equipment, making it difficult to meet customers' increasingly high UPH requirements; 2. Each frame needs to be glued dozens to hundreds of times, and the position accuracy and size consistency of the glue dots must be checked. Summary of the invention

[0004] In view of the above problems, the present invention provides a semiconductor soldering device for brushing solder paste on the surface of a chip, comprising a frame, a track film feeding mechanism, a solder paste brushing mechanism, a die mechanism, a header mechanism, an upper visual mechanism, a reeling mechanism and a lower visual mechanism; the reeling mechanism is arranged on a side wall of the frame, the track film feeding mechanism is arranged on the top of the frame, the solder paste brushing mechanism and the upper visual mechanism are both arranged on one side of the track film feeding mechanism, the header mechanism is arranged at one end of the track film feeding mechanism, the die mechanism is arranged on a side of the track film feeding mechanism away from the upper visual mechanism, and the lower visual mechanism is embedded and installed on the top of the frame.

[0005] The entrance of the track film feeding mechanism is connected to the lead frame and then enters the equipment. In the process of being continuously clamped by the clamping claws in the track of the track film feeding mechanism, the solder paste is applied, the mold punches the Clip, the Clip is mounted on the lead frame and visual inspection is completed in sequence.

[0006] Furthermore, the track film-advancing mechanism comprises a track film-advancing rear rail and a track film-advancing front rail; the track film-advancing rear rail and the track film-advancing front rail are arranged at the same level, and both ends of the track film-advancing rear rail and the track film-advancing front rail overlap.

[0007] Furthermore, a first base is provided at the bottom of the track film-passing rear rail and the track film-passing front rail and close to the central axis, and a second base is provided at one end of the bottom of the track film-passing rear rail and the track film-passing front rail.

[0008] Furthermore, a linear slide rail is arranged on the top of the track after the track is passed, a first cover plate bracket and a second cover plate bracket are arranged on the top of the linear slide rail, a first linear motor stator is arranged on the top of the first cover plate bracket, and a plurality of groups of second linear motor stators are arranged at the same level on one side of the first linear motor stator.

[0009] Furthermore, the output ends of several groups of the second linear motor stators are transmission-connected with the first jaw, the second jaw, the third jaw, the fourth jaw and the fifth jaw, and the bottoms of the first jaw, the second jaw, the third jaw, the fourth jaw and the fifth jaw are radially slidably connected along the linear slide rail.

[0010] Furthermore, a first product bracket, a second product bracket, a third product bracket and a fourth product bracket are arranged at the same level on the top of the front track of the track film transfer, and the fourth product bracket is located on a side close to the second base.

[0011] Furthermore, three groups of pressure claw seats are provided on one side wall of the front rail of the track film passing, and the first pressure claw, the second pressure claw and the third pressure claw are sequentially provided in the three groups of pressure claw seats, a rear rail adjustment part is provided between the rear rail of the track film passing and the front rail of the track film passing, and a discharge sensor is embedded and installed on the top of the front rail of the track film passing and on one side close to the second base.

[0012] Furthermore, a feeding sensor is arranged on the top of the front rail of the track and away from the discharge sensor, a feeding port is opened on the outer wall of the front rail of the track and close to the feeding sensor, a feeding positioning part is arranged in the feeding port, and a feeding pusher part is arranged on the feeding positioning part.

[0013] Furthermore, the bungee mechanism includes a bungee air circuit portion and a BH beam; the bungee air circuit portion is clamped on the top of the BH beam, and a first bungee stator is arranged between the BH beam and the bungee air circuit portion, a third cover plate bracket is arranged at one end of the BH beam, and a fourth cover plate bracket is arranged at the other end of the BH beam, and an XY axis portion is fixedly connected to one side of the bottom of the BH beam.

[0014] Furthermore, the output end of the XY axis portion is transmission-connected to the YZ axis portion, and the YZ axis portion is transmission-connected to a small welding head portion, one end of the bottom of the BH beam is fixedly connected to a BH front column, the bottom of the BH beam and one side close to the third cover plate bracket is fixedly connected to a BH front column, the top of the YZ axis portion is provided with a first welding head mover, the bottom of the BH beam and one side close to the fourth cover plate bracket is fixedly connected to a BH rear seat, and the bottom of the BH rear seat is fixedly connected to a rear base.

[0015] The beneficial effects of the present invention are: 1. After being connected to the lead frame at the entrance of the track film feeding mechanism, it enters the equipment. In the process of being continuously clamped by the clamping claws in the track of the track film feeding mechanism, solder paste brushing, die cutting Clip, Clip mounting to the lead frame and visual inspection are completed in sequence, which improves the glue brushing process, improves the position accuracy of the solder paste on the chip surface, and improves the consistency accuracy of the solder paste size; 2. By arranging the unwinding mechanism inside the frame, multiple clamping and welding devices can be used in series. The use of multiple clamping and welding devices in series can improve the efficiency of Clip placement or realize the function of mounting different types of Clips on the lead frame; 3. The upper visual mechanism takes pictures and analyzes the product position. After data processing, the die mechanism punches out the chip. The bonding head mechanism drives the "XY axis", "YZ axis" and "small welding head" to move to the punching die through the program. Then the "bonding head air path" drives the vacuum to adsorb the jumper. After that, the "small welding head" moves upward along the XY axis to the top of the product, and the "small welding head" moves downward to place the jumper on the product, turn off the vacuum, and return to the origin while blowing positive pressure; this reciprocating process improves the adjustment efficiency of the welding head along the XYZ axis, and improves the compatibility with the upper and lower visual mechanisms.

[0016] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 A schematic diagram of an exploded structure of a semiconductor clamp welding device according to an embodiment of the present invention is shown; Figure 2 It shows a schematic exploded view of the structure of the track film feeding mechanism according to an embodiment of the present invention; Figure 3 It shows a schematic diagram of the explosion structure of the bunging mechanism according to an embodiment of the present invention; Figure 4 It shows a schematic diagram of the structure explosion of the XY axis part of an embodiment of the present invention; Figure 5 It shows a schematic diagram of the structure explosion of the YZ axis part of an embodiment of the present invention; Figure 6A schematic exploded view of the structure of a small welding head according to an embodiment of the present invention is shown.

[0019] In the figure: 1, frame; 2, track film feeding mechanism; 21, first clamp; 22, second clamp; 23, third clamp; 24, fourth clamp; 25, fifth clamp; 26, first linear motor stator; 27, second linear motor stator; 28, linear guide rail; 29, first cover plate bracket; 210, second cover plate bracket; 211, first product bracket; 212, second product bracket; 213, third product bracket; 214, fourth product bracket; 215, track film feeding rear rail; 216, track film feeding Front rail; 217, feeding sensor; 218, feeding positioning part; 219, first pressing claw; 220, second pressing claw; 221, third pressing claw; 222, first base; 223, second base; 224, feeding leveling machine; 225, discharging sensor; 226, rear rail adjustment part; 3, solder paste brushing mechanism; 4, die mechanism; 5, bunding mechanism; 51, bunding air path; 52, first bunding stator; 53, third cover plate bracket; 54, BH beam; 55, XY axis; 551, slide rail bottom plate ; 552, X-axis slide rail; 553, Y-axis reader; 554, second Bang head stator; 555, first Y-axis slide rail; 556, motor seat; 557, second Bang head mover; 56, BH front column; 57, fourth cover plate bracket; 58, first Bang head mover; 59, BH rear seat; 510, YZ axis; 5101, Z moving plate; 5102, Z-axis reader; 5103, second Y-axis slide rail; 5104, Z stator bottom plate; 5105, X-axis reader; 511, small welding head; 5111, first Motor; 5112, T-axis origin induction plate; 5113, first synchronous wheel; 5114, Y-axis adjustment plate; 5115, Z-axis guide rail mounting plate; 5116, Z-axis guide rail seat; 5117, second motor; 5118, second synchronous wheel; 5119, Z-axis cross roller guide; 51110, nozzle mounting plate; 51111, photoelectric sensor; 51112, nozzle; 51113, pick and place head origin; 512, rear base; 6, upper visual mechanism; 7, unwinding mechanism; 8, lower visual mechanism. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] The embodiment of the present invention provides a semiconductor clamping device for brushing solder paste on the chip surface, comprising a frame 1, a track film feeding mechanism 2, a solder paste brushing mechanism 3, a die mechanism 4, a header mechanism 5, an upper visual mechanism 6, a reeling mechanism 7 and a lower visual mechanism 8; illustratively, as Figure 1 shown.

[0022] The unwinding mechanism 7 is arranged on a side wall of the frame 1, the track film feeding mechanism 2 is arranged on the top of the frame 1, the solder paste brushing mechanism 3 and the upper visual mechanism 6 are both arranged on one side of the track film feeding mechanism 2, the bunding mechanism 5 is arranged at one end of the track film feeding mechanism 2, the die mechanism 4 is arranged on the side of the track film feeding mechanism 2 away from the upper visual mechanism 6, the lower visual mechanism 8 is embedded and installed on the top of the frame 1, and the lower visual mechanism 8 is vertically arranged with the upper visual mechanism 6.

[0023] Specifically, the entrance of the track film feeding mechanism 2 is connected to the lead frame and then enters the equipment. In the process of being continuously clamped by the clamping claws in the track of the track film feeding mechanism 2, the solder paste brushing, the mold punching Clip, the Clip mounting to the lead frame and the visual inspection are completed in sequence. After completing the process, the lead frame is pushed out of the track and enters the reflow furnace.

[0024] The track film feeding mechanism 2 includes a track film feeding rear track 215 and a track film feeding front track 216; illustratively, as Figure 2 shown.

[0025] The track film rear rail 215 and the track film front rail 216 are arranged at the same level, and both ends of the track film rear rail 215 and the track film front rail 216 overlap, and a first base 222 is arranged at the bottom of the track film rear rail 215 and the track film front rail 216 and close to the central axis, and a second base 223 is arranged at one end of the bottom of the track film rear rail 215 and the track film front rail 216; A linear slide 28 is arranged on the top of the track sheet rear rail 215, a first cover plate bracket 29 and a second cover plate bracket 210 are arranged on the top of the linear slide 28, a first linear motor stator 26 is arranged on the top of the first cover plate bracket 29, and a plurality of groups of second linear motor stators 27 are arranged at the same level on one side of the first linear motor stator 26, the output ends of the plurality of groups of the second linear motor stators 27 are all transmission-connected with a first clamp 21, a second clamp 22, a third clamp 23, a fourth clamp 24 and a fifth clamp 25, and the bottoms of the first clamp 21, the second clamp 22, the third clamp 23, the fourth clamp 24 and the fifth clamp 25 are all slidingly and fittingly connected along the radial direction of the linear slide 28; The top of the track front rail 216 is provided with a first product bracket 211, a second product bracket 212, a third product bracket 213 and a fourth product bracket 214 at the same level, and the fourth product bracket 214 is located on a side close to the second base 223. A side wall of the track front rail 216 is provided with three groups of pressure claw seats, and the three groups of pressure claw seats are provided with a first pressure claw 219, a second pressure claw 220 and a third pressure claw 221 in sequence. The track rear rail 215 and the track front rail 216 are provided with a first pressure claw 219, a second pressure claw 220 and a third pressure claw 221 in sequence. A rear rail adjustment portion 226 is arranged in between, a discharge sensor 225 is embedded and installed on the top of the track front rail 216 and on the side close to the second base 223, a feed sensor 217 is arranged on the top of the track front rail 216 and on the side away from the discharge sensor 225, a feed port is opened on the outer wall of the track front rail 216 and on the side close to the feed sensor 217, a feed positioning portion 218 is arranged in the feed port, and a feed leveling machine portion 224 is arranged on the feed positioning portion 218.

[0026] Specifically, the track film rear track 215 is driven by the "rear track adjustment unit 226" to drive the components in the Y axis, so that the track widths of the track film rear track 215 and the track film front track 216 are the same as the product width, and then the product enters the Index mechanism; The product receives a signal through the "feeding sensor 217", and the driving element drives the upper jaw of the "first clamping jaw 21" to close downward and clamp the product frame to move in the X-axis direction. During the movement, the "first product bracket 211" supports the center of the product to prevent the center of gravity of the product from falling; After reaching the dispensing position, i.e. the anvil plate 1 of the tooling mechanism, the vacuum pump is used to firmly adsorb the product frame to the suction hole in the anvil plate 1, and at the same time, the "first pressing claw 219" is driven by the air circuit to press down the fixed frame, and then the left dispensing mechanism starts to operate to dispense glue to the product; After the dispensing is completed, the upper jaw of the "second clamping jaw 22" is driven to close and clamp the product frame, the "first clamping jaw 21" releases the clamping jaw and returns to the origin, and the "second clamping jaw 22" feeds in the X-axis direction and proceeds to the next step of processing. During the process, the "second product bracket 212" supports the center of the product to prevent the center of gravity of the product from falling; After reaching the dispensing position, the second anvil of the tooling mechanism tightly absorbs the product frame through vacuum, and at the same time, the "second pressing claw 220" is driven by the air circuit to press down the fixed frame, and the right dispensing starts to run; After the dispensing is completed, the upper jaw of the "third clamping jaw 23" is driven to close and clamp the product frame, the "second clamping jaw 22" releases the clamping jaw and returns to the origin, and the "third clamping jaw 23" moves in the X-axis direction for the next step of processing. During the process, the "third product bracket 213" supports the center of the product to prevent the center of gravity of the product from falling; When it reaches the chopping board 3 of the tooling mechanism, the "third pressing claw 221" is driven by the air circuit to press down the fixed frame while vacuum adsorption, and the suction nozzle of the bundling mechanism 5 adsorbs the jumper through vacuum adsorption and assembles the jumper with the product; After the assembly is completed, the upper jaw of the "fourth clamping jaw 24" is driven to close and clamp the product frame, the "third clamping jaw 23" releases the clamping jaw and returns to the origin, and the "fifth clamping jaw 25" moves in the X-axis direction. During this process, the "third product bracket 213" supports the center of the product to prevent the center of gravity of the product from falling; After the specified distance, the "fourth clamping jaw 24" returns to the origin; the "fifth clamping jaw 25" takes over the "fourth clamping jaw 24" to clamp the product and push it to the OVEN mechanism for the next step of processing. After the specified distance, the "fifth clamping jaw 25" returns to the origin; the pushing mechanism pushes the product frame through the "discharging sensor 225" into the OVEN mechanism; At this point, the product's processing in the Index mechanism is completed, and this cycle repeats.

[0027] The bungee mechanism 5 includes a bungee air path portion 51 and a BH beam 54; for example, Figure 3 shown.

[0028] The bang head air path part 51 is clamped on the top of the BH beam 54, and a first bang head stator 52 is arranged between the BH beam 54 and the bang head air path part 51, a third cover plate bracket 53 is arranged at one end of the BH beam 54, and a fourth cover plate bracket 57 is arranged at the other end of the BH beam 54, an XY axis part 55 is fixedly connected to one side of the bottom of the BH beam 54, and the output end of the XY axis part 55 is transmission-connected to the YZ axis part 510, and the YZ axis part 510 The upper transmission is connected with a small welding head 511, one end of the bottom of the BH beam 54 is fixedly connected with a BH front column 56, the bottom of the BH beam 54 and one side close to the third cover plate bracket 53 is fixedly connected with the BH front column 56, the top of the YZ axis portion 510 is provided with a first welding head mover 58, the bottom of the BH beam 54 and one side close to the fourth cover plate bracket 57 is fixedly connected with a BH rear seat 59, and the bottom of the BH rear seat 59 is fixedly connected with a rear base 512.

[0029] Specifically, the product is fed to the chopping board three by the Index mechanism, at which time the upper visual mechanism 6 takes a picture and analyzes the position of the product, and the die mechanism punches out the chip after data processing, and the bonding head mechanism drives the "XY axis part 55", "YZ axis part 510" and "small welding head part 511" to move to the punching die through the program, and then the "bonding head air path part 51" drives the vacuum adsorption jumper, and then the "small welding head part 511" moves upward along the XY axis part 55 to the top of the product, and the "small welding head part 511" feeds downward to place the jumper on the product, turn off the vacuum, and return to the origin while blowing positive pressure; and so on.

[0030] The XY axis portion 55 includes a slide rail base plate 551 and a motor seat 556; illustratively, as Figure 4 shown.

[0031] Two groups of X-axis slide rails 552 are set on one side wall of the slide rail base plate 551, and a Y-axis reader 553 is set on one side of the bottom of the slide rail base plate 551. The motor seat 556 is an open structure, and a second stator 554 is set at the bottom end of the inner wall of the motor seat 556, and first Y-axis slide rails 555 are set on both sides of the second stator 554. The bottom of the slide rail base plate 551 is slidably connected to the top of the two groups of first Y-axis slide rails 555. A second mover 557 is also set at the bottom end of the inner wall of the motor seat 556, and the second mover 557 is located on one side of the first Y-axis slide rail 555.

[0032] The YZ axis portion 510 includes a Z moving plate 5101; illustratively, as Figure 5 shown.

[0033] A Z-direction reader 5102 is provided at one end of the Z-moving plate 5101, and two groups of second Y-axis rails 5103 are slidably connected to the bottom of the Z-moving plate 5101. The bottoms of the two groups of second Y-axis rails 5103 are fixedly connected to a Z-stator base plate 5104, and an X-direction reader 5105 is provided on the outer wall of the Z-stator base plate 5104 and on one side close to the Z-direction reader 5102.

[0034] The small welding head 511 includes a Z-axis guide rail mounting plate 5115 and a suction nozzle 51112; Figure 6 shown.

[0035] The inner wall of the Z-axis guide rail mounting plate 5115 is provided with a Z-axis guide rail seat 5116, and both side walls of the Z-axis guide rail seat 5116 are provided with Z-axis cross roller guide rails 5119, and two groups of the Z-axis cross roller guide rails 5119 are both fitted and connected to the inner wall of the Z-axis guide rail mounting plate 5115, and the top of the Z-axis guide rail seat 5116 is rotatably connected to the second synchronous wheel 5118, and the top of the Z-axis guide rail mounting plate 5115 and one side thereof horizontally to the second synchronous wheel 5118 is rotatably connected to the first synchronous wheel 5113, and the first synchronous wheel 5113 and the second synchronous wheel 5118 are sleeved with belts, and the top of the first synchronous wheel 5113 is clamped with a T-axis origin sensing sheet 5112, and the Z-axis guide rail mounting plate 5115 A Y-axis adjustment plate 5114 is fixedly connected to one side wall of the Y-axis adjustment plate 5114, and a first motor 5111 is fixedly connected to one side wall of the Y-axis adjustment plate 5114, and the output end of the first motor 5111 is transmission-connected to the top of the first synchronous wheel 5113, a nozzle mounting plate 51110 is provided at the bottom of the Z-axis guide seat 5116, and the nozzle mounting plate 51110 is open-type, and a second motor 5117 is embedded and installed at the nozzle on one side of the nozzle mounting plate 51110, a photoelectric sensor 51111 is provided on one side wall of the nozzle 51112, and a pick-and-place head origin 51113 is provided on the top of the nozzle 51112, and the nozzle 51112 is embedded and installed at the nozzle on the other side of the nozzle mounting plate 51110.

[0036] The semiconductor clamping device for brushing solder paste on the chip surface proposed by the embodiment of the present invention has the following working principle: After passing through the lead frame and entering the sheet track, it is clamped by the first clamping claw 21 and moved to the position of the positioning sensor for positioning; After positioning, the first clamping jaw 21 clamps the lead frame and hands it over to the second clamping jaw 22, and the first clamping jaw 21 retreats to the entrance of the track to wait for the next lead frame. The second clamping jaw 22 holds the lead frame and runs to the glue brushing station. The second clamping jaw 22 retreats to the position where it is connected to the first clamping jaw 21 and waits, while the glue brushing mechanism brushes glue on the lead frame; After the lead frame is glued, the third clamp 23 comes over to clamp the lead frame and moves to the Clip mounting position to wait for Clip mounting; The Clip on the Clip material strip is punched out by the punching die mechanism 4, and the Clip welding head of the bonding head mechanism 5 absorbs the punched out Clip and moves it to the detection position of the lower visual mechanism 8 and the Clip mounting position in turn to complete the Clip detection and Clip mounting work; Before each placement, the upper visual mechanism 6 completes the detection of the position and size of the solder paste dots on the surface of the chip on the lead frame; After mounting, the upper visual mechanism 6 completes the detection of the position and angle of the Clip after mounting; The unwinding mechanism 7 is responsible for supplying the Clip material strip to the punching die mechanism and recovering the interlayer paper of the Clip material roll; During the mounting process, the third clamping jaw 23 and the fourth clamping jaw 24 are connected once, and after the connection, the third clamping jaw 23 returns to the connecting position with the second clamping jaw 22 and waits; The third clamping jaw 23 is responsible for mounting the front half of the Clip on the lead frame, and the fourth clamping jaw 24 is responsible for mounting the rear half of the Clip on the lead frame; After all Clips are mounted on the lead frame, the fourth clamp 24 hands the lead frame to the fifth clamp 25 and then returns to the junction with the third clamp 23 to wait. The fifth clamp 25 holds the lead frame and runs it to the end of the film track. Finally, the push-out mechanism pushes the lead frame out of the film track and into the track of the next machine reflow furnace. That is to say, all the processes of the clamping welding equipment are completed.

[0037] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor clamping device for brushing solder paste on the chip surface, characterized in that: The invention comprises a frame (1), a track film feeding mechanism (2), a solder paste brushing mechanism (3), a die mechanism (4), a header mechanism (5), an upper visual mechanism (6), a reeling mechanism (7) and a lower visual mechanism (8); the reeling mechanism (7) is arranged on a side wall of the frame (1), the track film feeding mechanism (2) is arranged on the top of the frame (1), the solder paste brushing mechanism (3) and the upper visual mechanism (6) are both arranged on one side of the track film feeding mechanism (2), the header mechanism (5) is arranged at one end of the track film feeding mechanism (2), the die mechanism (4) is arranged on a side of the track film feeding mechanism (2) away from the upper visual mechanism (6), and the lower visual mechanism (8) is embedded and installed on the top of the frame (1); The entrance of the track film feeding mechanism (2) is connected to the lead frame and then enters the device. In the process of being continuously clamped by the clamping claws in the track of the track film feeding mechanism (2), solder paste brushing, die cutting Clip, Clip mounting to the lead frame and visual inspection are completed in sequence.

2. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 1, characterized in that: The track film-advancing mechanism (2) comprises a track film-advancing rear rail (215) and a track film-advancing front rail (216); the track film-advancing rear rail (215) and the track film-advancing front rail (216) are arranged at the same level, and both ends of the track film-advancing rear rail (215) and the track film-advancing front rail (216) overlap.

3. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 2, characterized in that: A first base (222) is provided at the bottom of the track film-passing rear rail (215) and the track film-passing front rail (216) and close to the central axis, and a second base (223) is provided at one end of the bottom of the track film-passing rear rail (215) and the track film-passing front rail (216).

4. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 3, characterized in that: A linear slide rail (28) is arranged on the top of the track sheet rear rail (215), a first cover plate bracket (29) and a second cover plate bracket (210) are arranged on the top of the linear slide rail (28), a first linear motor stator (26) is arranged on the top of the first cover plate bracket (29), and a plurality of groups of second linear motor stators (27) are arranged at the same level on one side of the first linear motor stator (26).

5. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 4, characterized in that: The output ends of the plurality of groups of the second linear motor stators (27) are all drivingly connected to the first clamp (21), the second clamp (22), the third clamp (23), the fourth clamp (24) and the fifth clamp (25); the bottoms of the first clamp (21), the second clamp (22), the third clamp (23), the fourth clamp (24) and the fifth clamp (25) are all slidably connected along the radial direction of the linear guide rail (28).

6. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 5, characterized in that: A first product bracket (211), a second product bracket (212), a third product bracket (213) and a fourth product bracket (214) are arranged at the same level on the top of the track film-transferring front rail (216), and the fourth product bracket (214) is located on a side close to the second base (223).

7. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 6, characterized in that: A side wall of the track film front rail (216) is provided with three groups of pressure claw seats, and the three groups of pressure claw seats are provided with a first pressure claw (219), a second pressure claw (220) and a third pressure claw (221) in sequence, a rear rail adjustment portion (226) is provided between the track film rear rail (215) and the track film front rail (216), and a discharge sensor (225) is embedded and installed at the top of the track film front rail (216) and on one side close to the second base (223).

8. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 7, characterized in that: A feeding sensor (217) is arranged at the top of the track film front rail (216) and at a side away from the material discharging sensor (225), and a feeding port is opened on the outer wall of the track film front rail (216) and at a side close to the feeding sensor (217), a feeding positioning part (218) is arranged in the feeding port, and a feeding pusher part (224) is arranged on the feeding positioning part (218).

9. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 1, characterized in that: The bungee mechanism (5) comprises a bungee air path portion (51) and a BH beam (54); the bungee air path portion (51) is clamped on the top of the BH beam (54), and a first bungee stator (52) is arranged between the BH beam (54) and the bungee air path portion (51); a third cover plate bracket (53) is arranged at one end of the BH beam (54), and a fourth cover plate bracket (57) is arranged at the other end of the BH beam (54); and an XY axis portion (55) is fixedly connected to one side of the bottom of the BH beam (54).

10. The semiconductor clamping device for brushing solder paste on the chip surface according to claim 9, characterized in that: The output end of the XY axis portion (55) is transmission-connected to the YZ axis portion (510), and the YZ axis portion (510) is transmission-connected to a small welding head portion (511); one end of the bottom of the BH beam (54) is fixedly connected to a BH front column (56); the bottom of the BH beam (54) and one side close to the third cover plate bracket (53) are fixedly connected to the BH front column (56); the top of the YZ axis portion (510) is provided with a first welding head mover (58); the bottom of the BH beam (54) and one side close to the fourth cover plate bracket (57) are fixedly connected to a BH rear seat (59); the bottom of the BH rear seat (59) is fixedly connected to a rear base (512).

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