ESC automatic joint device

Abstract

The invention relates to the technical field of semiconductor manufacturing equipment, and discloses an ESC automatic bonding device, the ESC comprises a chuck main body and a substrate, the chuck main body and the substrate are laminated, the chuck main body and the substrate are provided with positioning holes corresponding in position, and the device comprises a rotating assembly; the base is arranged at the output end of the rotating assembly and used for placing the chuck body, and a positioning pin is arranged on the base; a moving assembly; and the clamping assembly is arranged at the output end of the moving assembly and used for clamping the substrate. The chuck has the beneficial effects that the substrate can be automatically placed on the adhesive layer coated on the chuck main body, the contact surfaces between the chuck main body and the substrate are kept parallel in the placement process of the substrate, air is prevented from entering the adhesive layer to generate bubbles, uniform pressure is applied to the substrate, the thickness distribution of the adhesive layer is uniform, and the production efficiency is improved. The bonding strength between the chuck body and the substrate is improved, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing equipment, and in particular to an ESC automatic joining device. Background Art

[0002] The electrostatic adsorption technology used by the electrostatic chuck (ESC) is an advantageous technology that replaces traditional mechanical support and vacuum adsorption methods. It is widely used in semiconductors, panel displays, optics and other fields.

[0003] In the process of assembling the electrostatic suction cup, it is generally necessary to first coat the adhesive material on the chuck body to form an adhesive layer, and then place the substrate on the adhesive layer to bond the chuck body and the substrate, wherein the end face of the substrate facing away from the chuck body is the working face for adsorbing the product. In the prior art, the substrate is generally placed on the chuck body manually. During the placement process, the contact surface between the substrate and the chuck body is prone to tilt, so some air will enter the adhesive layer to produce bubbles, affecting the bonding strength between the chuck body and the substrate. In addition, it is necessary to manually apply a certain amount of pressure to the substrate to ensure a firm bond between the chuck body and the substrate. Due to the uneven manual application of pressure, the thickness of the adhesive layer between the chuck body and the substrate is unevenly distributed, and the bonding strength is poor. In addition, the manual bonding of the chuck body and the substrate has low production efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide an ESC automatic bonding device, which can automatically place a substrate on the adhesive layer coated on a chuck body. During the placement of the substrate, the contact surfaces between the chuck body and the substrate remain parallel to avoid air entering the adhesive layer to generate bubbles, and uniform pressure is applied to the substrate to make the thickness of the adhesive layer evenly distributed, thereby improving the bonding strength between the chuck body and the substrate and improving production efficiency.

[0005] In order to achieve the above object, the present invention provides an ESC automatic joining device, the ESC comprising a chuck body and a substrate, the chuck body and the substrate are stacked, the chuck body and the substrate are provided with positioning holes corresponding to the positions, including:

[0006] Rotating components;

[0007] A base, arranged at the output end of the rotating assembly, for placing the chuck body, the base being provided with a positioning pin, the positioning pin sequentially passing through the positioning holes on the chuck body and the substrate from bottom to top;

[0008] Mobile components;

[0009] A clamping assembly, disposed at the output end of the moving assembly, for clamping the substrate;

[0010] The positioning hole on the chuck body is aligned with the positioning pin and placed on the base, an adhesive layer is coated on the top surface of the chuck body, the rotating component drives the base to rotate to a specified position, the moving component drives the clamping component to clamp the substrate, the positioning hole on the substrate is aligned with the positioning pin, and the substrate cover is placed on the adhesive layer, so that the chuck body and the substrate are automatically engaged.

[0011] Furthermore, the clamping assembly comprises a connecting frame, a driving motor, a lead screw, two guide rods, a first nut seat, a second nut seat, a first clamping piece, and a second clamping piece. The connecting frame is fixedly connected to the output end of the moving assembly, the driving motor is installed on the connecting frame, one end of the lead screw is connected to the driving motor, and the other end is rotatably connected to the connecting frame, the lead screw is sleeved with the first nut seat and the second nut seat, the first nut seat is connected to the first clamping piece, the second nut seat is connected to the second clamping piece, the first clamping piece and the second clamping piece are spaced and arranged oppositely along the axial direction of the lead screw, the two guide rods are respectively located on both sides of the lead screw and are arranged along the axial direction of the lead screw, and both ends of the two guide rods are fixed to the connecting frame, and are slidably connected to the first clamping piece and the second clamping piece;

[0012] The driving motor drives the lead screw to rotate, so that the first clamping member and the second clamping member move toward or away from each other, so as to clamp or release the substrate.

[0013] Furthermore, the first clamping member includes a connecting seat, a cover plate and a first gasket, the top of the connecting seat is fixed to the first screw seat, the bottom of the connecting seat is detachably connected to the cover plate, the cover plate is provided with an arc-shaped mounting groove, and the first gasket is provided in the arc-shaped mounting groove.

[0014] Furthermore, the first gasket and the arc-shaped mounting groove are bonded and fixed by adhesive.

[0015] Furthermore, a second gasket is provided on the base, and a diameter of the second gasket is larger than a diameter of the chuck body.

[0016] Furthermore, the rotating assembly includes a support plate and a rotating unit, the rotating unit is fixed to the support plate, and the output end passes through the support plate and is connected to the base.

[0017] Furthermore, the moving component is a mechanical arm, and the top of the connecting frame is provided with a limiting groove and a mounting hole connected to the output end of the mechanical arm.

[0018] Furthermore, the base is evenly distributed with limiting pillars in a circumferential ring direction, and the gap between the side wall of the limiting pillar and the side wall of the chuck body is less than 0.1 mm.

[0019] Compared with the prior art, the ESC automatic joining device of the embodiment of the present invention has the following beneficial effects: a rotating assembly is provided to drive the chuck body to rotate, so as to facilitate the adjustment of the position between the substrate and the chuck body when the substrate is placed. The clamping assembly is driven by the moving assembly to automatically clamp the substrate, and the substrate is placed on the chuck body to maintain the stability of the substrate when placed. At the same time, positioning pins are provided on the base to position the substrate when it is joined with the chuck body, so as to ensure that the contact surface between the substrate and the chuck body is always parallel, and air is prevented from entering the adhesive layer to generate bubbles. Moreover, the substrate is pressed down by the moving assembly, and the substrate is subjected to uniform force, so that the thickness of the adhesive layer is evenly distributed, thereby improving the joining strength between the chuck body and the substrate and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 : is a structural principle diagram of an ESC automatic engagement device according to an embodiment of the present invention;

[0021] Figure 2 It is a structural schematic diagram of the ESC automatic bonding device chuck body and the substrate bonding in an embodiment of the present invention;

[0022] Figure 3 is an axonometric view of an ESC automatic engagement device according to an embodiment of the present invention;

[0023] Figure 4 is a cross-sectional view of an ESC automatic engagement device according to an embodiment of the present invention;

[0024] Figure 5 2 is a schematic structural diagram of a first clamping member of an ESC automatic joining device according to an embodiment of the present invention;

[0025] Figure 6 It is a schematic diagram of the structure of the clamping assembly of the ESC automatic joining device according to an embodiment of the present invention.

[0026] In the figure, 1. rotating assembly; 11. supporting plate; 12. rotating unit; 2. base; 21. positioning pin; 3. moving assembly; 4. clamping assembly; 41. connecting frame; 411. limiting groove; 412. mounting hole; 42. driving motor; 43. lead screw; 44. guide rod; 45. first nut seat; 46. second nut seat; 47. first clamping member; 471. connecting seat; 472. cover plate; 473. first gasket; 48. second clamping member; 5. second gasket; 6. limiting column; a. chuck body; b. substrate. DETAILED DESCRIPTION

[0027] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0028] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "inside", "outside", etc. used in the present invention to indicate the orientation or positional relationship are based on the positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred devices and elements must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0029] In the description of the present invention, it should be understood that the present invention uses the terms "first", "second", etc. to describe various information, but these information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information.

[0030] like Figures 1 to 6 As shown, the ESC includes a chuck body a and a substrate b, and the chuck body a and the substrate b are stacked, and corresponding positioning holes are provided on the chuck body a and the substrate b for positioning during installation. An ESC automatic joining device according to a preferred embodiment of the present invention includes a rotating component 1, a base 2, a moving component 3, and a clamping component 4, wherein the base 2 is arranged at the output end of the rotating component 1, and is used to place the chuck body. In order to facilitate the installation and positioning of the base 2 and the chuck body, a positioning pin 21 is provided on the base 2. When the chuck body is placed, the positioning pin 21 passes through the positioning hole on the chuck body. When the substrate is placed, the positioning pin 21 passes through the positioning holes on the chuck body and the substrate in sequence from bottom to top, and can be used for positioning the substrate and the chuck body when they are placed. The clamping component 4 is arranged at the output end of the moving component 3, and is used to clamp the substrate.

[0031] See also Figures 1 to 4When the chuck body and the substrate are engaged, first align the positioning hole on the chuck body with the positioning pin 21 and place it on the base 2, apply an adhesive layer on the top surface of the chuck body, and the rotating component 1 drives the base 2 to rotate to the specified position, and the moving component 3 drives the clamping component 4 to clamp the substrate, and the positioning hole on the substrate is aligned with the positioning pin 21, so that the substrate cover is set on the adhesive layer, and the moving component 3 drives the clamping component 4 to press down a certain distance, so that the chuck body and the substrate are automatically engaged. In this process, due to the presence of the positioning pin 21, when the substrate is placed on the chuck body, the bottom surface of the substrate and the top surface of the chuck body are always kept parallel, avoiding air from entering the adhesive layer to generate bubbles, and by pressing the substrate down by the moving component 3, the substrate is evenly stressed, so that the thickness of the adhesive layer is evenly distributed, thereby improving the bonding strength between the chuck body and the substrate and improving production efficiency.

[0032] In some embodiments, in order to facilitate the design of the clamping assembly 4, refer to Figure 5 , Figure 6 The clamping assembly 4 includes a connecting frame 41, a driving motor 42, a lead screw 43, two guide rods 44, a first nut seat 45, a second nut seat 46, a first clamping member 47, and a second clamping member 48, wherein the connecting frame 41 is fixedly connected to the output end of the moving assembly 3, the driving motor 42 is installed on the connecting frame 41, one end of the lead screw 43 is connected to the driving motor 42, and the other end is rotatably connected to the connecting frame 41, and the lead screw 43 is sleeved with a first nut seat 45 and a second nut seat 46, and the first nut seat 45 is connected to the first The first clamping member 47 is connected to the second nut seat 46, and the second clamping member 48 is connected. The first clamping member 47 and the second clamping member 48 are spaced and arranged oppositely along the axial direction of the lead screw 43. The two guide rods 44 are respectively located on both sides of the lead screw 43 and arranged along the axial direction of the lead screw 43. Both ends of the two guide rods 44 are fixed to the connecting frame 41, and are slidably connected to the first clamping member 47 and the second clamping member 48. In this embodiment, the guide rods 44 are slidably connected to the first clamping member 47 and the second clamping member 48 through guide bearings. When it is necessary to clamp and feed the substrate, the drive motor 42 drives the lead screw 43 to rotate so that the first clamping member 47 and the second clamping member 48 move toward each other to clamp the substrate. When the chuck body is engaged with the substrate, the drive motor 42 drives the lead screw 43 to rotate so that the first clamping member 47 and the second clamping member 48 move in opposite directions to release the substrate.

[0033] Further, in order to simplify the structures of the first clamping member 47 and the second clamping member 48 and reduce the production cost, the structures of the first clamping member 47 and the second clamping member 48 are the same, so only the structure of the first clamping member 47 is described. Specifically, the first clamping member 47 includes a connecting seat 471, a cover plate 472 and a first gasket 473, wherein the top of the connecting seat 471 is fixed to the first screw 43 seat, and the bottom of the connecting seat 471 is detachably connected to the cover plate 472. In order to facilitate the clamping of the substrate, the cover plate 472 is provided with an arc-shaped mounting groove. In order to prevent the side wall of the arc-shaped mounting groove from scratching the surface of the substrate, a first gasket 473 is provided in the arc-shaped mounting groove. The first gasket 473 can be made of soft materials such as rubber or silicone. In order to facilitate the connection with the arc-shaped mounting groove, the first gasket 473 is bonded and fixed to the arc-shaped mounting groove by an adhesive, which is easy to replace.

[0034] In some embodiments, in order to adapt to the joining of chuck bodies and substrates of various specifications, the position of the positioning pin 21, as well as the size of the cover plate 472 and the first gasket 473 can be synchronously adjusted according to the specifications of the chuck body and the substrate. A metal insert can be provided at the bottom of the positioning pin 21 for connection and positioning with the base 2. A threaded connection or a pin hole connection can be adopted. The base 2 is provided with positioning pin connection holes corresponding to chuck bodies and substrates of different specifications. By replacing the cover plate 472, the first gasket 473, and the positioning pin 21, the joining of chuck bodies and substrates of various specifications can be adapted, which has strong versatility and reduces production costs.

[0035] Furthermore, since a positioning pin 21 is provided on the base 2, when the chuck body slides axially along the positioning pin 21, in order to avoid collision between the chuck body and the base 2, which may cause damage to the internal structure or surface of the chuck body, a second pad 5 is provided on the base 2. The diameter of the second pad 5 is larger than the diameter of the chuck body, thereby protecting the chuck body. The second pad 5 and the first pad 473 are made of the same material and can be fixed by adhesive.

[0036] Furthermore, the rotating assembly 1 includes a support plate 11 and a rotating unit 12, wherein the rotating unit 12 is fixed to the support plate 11, and an output end passes through the support plate 11 and is connected to the base 2. The rotating unit 12 can be a motor or a dividing plate turntable.

[0037] Furthermore, in order to facilitate the movement of the clamping component 4 and move the substrate to a specified position, in the present embodiment, the moving component 3 is a robotic arm, and the top of the connecting frame 41 is provided with a limit groove 411 and a mounting hole 412 connected to the output end of the robotic arm, so as to meet the requirements of precise adjustment of the position of the substrate within the spatial range.

[0038] Furthermore, the chuck body and the base plate are provided with positioning holes, and the base 2 is provided with positioning pins 21. In order to avoid the inner wall of the positioning hole being worn when the positioning pins 21 pass through the positioning holes, in this embodiment, the positioning pins 21 are made of non-metallic materials such as rubber. In addition, the assembly gap between the positioning pins 21 and the positioning holes can be appropriately increased, and the assembly gap is greater than 0.1 mm. The limiting columns 6 are evenly distributed in the circumferential annular shape of the base 2, and the gap between the side wall of the limiting columns 6 and the side wall of the chuck body is less than 0.1 mm, so as to achieve precise positioning. The limiting columns 6 are made of flexible materials such as rubber.

[0039] In summary, the embodiment of the present invention provides an ESC automatic joining device, which has the following beneficial effects compared with the prior art: a rotating component 1 is provided to drive the chuck body to rotate, so as to facilitate the adjustment of the position between the substrate and the chuck body when the substrate is placed. The clamping component 4 is driven by the moving component 3 to automatically clamp the substrate, and the substrate is placed on the chuck body to maintain the stability of the substrate when placed. At the same time, a positioning pin 21 is provided on the base 2 to position the substrate when it is joined with the chuck body, so as to ensure that the contact surface between the substrate and the chuck body is always parallel, and air is prevented from entering the adhesive layer to generate bubbles. In addition, the substrate is pressed down by the moving component 3, and the substrate is subjected to uniform force, so that the thickness of the adhesive layer is evenly distributed, thereby improving the bonding strength between the chuck body and the substrate and improving production efficiency.

[0040] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. An ESC automatic joining device, the ESC comprising a chuck body and a substrate, the chuck body and the substrate are stacked, the chuck body and the substrate are provided with corresponding positioning holes, characterized in that: include Rotating components; A base, arranged at the output end of the rotating assembly, for placing the chuck body, and provided with a positioning pin corresponding to the positioning hole; Mobile components; A clamping assembly, disposed at the output end of the moving assembly, for clamping the substrate; The positioning hole on the chuck body is aligned with the positioning pin and placed on the base, an adhesive layer is coated on the top surface of the chuck body, the rotating component drives the base to rotate to a specified position, the moving component drives the clamping component to clamp the substrate, the positioning hole on the substrate is aligned with the positioning pin, and the substrate cover is placed on the adhesive layer, so that the chuck body and the substrate are automatically engaged.

2. The ESC automatic engagement device according to claim 1, characterized in that: The clamping assembly comprises a connecting frame, a driving motor, a lead screw, two guide rods, a first nut seat, a second nut seat, a first clamping piece, and a second clamping piece. The connecting frame is fixedly connected to the output end of the moving assembly, the driving motor is installed on the connecting frame, one end of the lead screw is connected to the driving motor, and the other end is rotatably connected to the connecting frame, the lead screw is sleeved with the first nut seat and the second nut seat, the first nut seat is connected to the first clamping piece, the second nut seat is connected to the second clamping piece, the first clamping piece and the second clamping piece are spaced and arranged oppositely along the axial direction of the lead screw, the two guide rods are respectively located on both sides of the lead screw and are arranged along the axial direction of the lead screw, both ends of the two guide rods are fixed to the connecting frame, and are slidably connected to the first clamping piece and the second clamping piece; The driving motor drives the lead screw to rotate, so that the first clamping member and the second clamping member move toward or away from each other, so as to clamp or release the substrate.

3. The ESC automatic engagement device according to claim 2, characterized in that: The first clamping member includes a connecting seat, a cover plate and a first gasket. The top of the connecting seat is fixed to the first screw seat, and the bottom of the connecting seat is detachably connected to the cover plate. The cover plate is provided with an arc-shaped mounting groove, and the first gasket is provided in the arc-shaped mounting groove.

4. The ESC automatic engagement device according to claim 3, characterized in that: The first gasket is bonded and fixed to the arc-shaped mounting groove by adhesive.

5. The ESC automatic joining device according to claim 1, characterized in that: A second liner is disposed on the base, and a diameter of the second liner is larger than a diameter of the chuck body.

6. The ESC automatic engagement device according to claim 1, characterized in that: The rotating assembly comprises a supporting plate and a rotating unit. The rotating unit is fixed to the supporting plate, and an output end penetrates through the supporting plate and is connected to the base.

7. The ESC automatic engagement device according to claim 2, characterized in that: The moving component is a mechanical arm, and the top of the connecting frame is arranged on a limiting groove and a mounting hole connected to the output end of the mechanical arm.

8. The ESC automatic engagement device according to claim 1, characterized in that: The base is evenly distributed with limiting pillars in a circumferential ring shape, and the gap between the side wall of the limiting pillar and the side wall of the chuck body is less than 0.1 mm.

Images