Method for improving comprehensive performance of copper material based on multi-light-field compounding and application of method

Abstract

The invention relates to the technical field of laser modification, in particular to a method for improving the comprehensive performance of a copper material based on multi-light-field compounding and application of the method. The method for improving the comprehensive performance of the copper material based on multi-light-field compounding comprises the following steps that laser irradiation surface treatment is conducted on the copper material, and laser adopted in the laser irradiation surface treatment is continuous / pulse compound laser; the copper material comprises at least one of metal copper and copper alloy. According to the method, the comprehensive performance, such as hardness and tensile property, of the copper material can be remarkably improved. Moreover, according to the method, the original base material is directly strengthened, and compared with electroplating, vapor deposition and laser cladding surface treatment technologies, cladding materials do not need to be added, and the bonding strength of an electroplating coating or a deposition layer and the base material does not need to be considered.

Description

Technical Field

[0001] The present invention relates to the field of laser modification technology, and in particular to a method for improving the comprehensive performance of copper materials based on multi-light field composite and an application thereof. Background Art

[0002] Copper and copper alloy materials have good mechanical, electrical and thermal conductivity properties, and are widely used in aerospace, rail transportation, energy and electricity, microelectronics, and even the defense industry.

[0003] However, with the rapid advancement of industrial technology, copper and its alloy materials are facing increasingly severe service environment requirements. In particular, in the field of ships and marine engineering, as core components, copper materials must withstand the stronger erosion and corrosion challenges brought about by the increasing load-bearing capacity and sailing speed of ships. In addition, in high-speed railway systems, electrical energy is converted into driving power through pantographs located on the top of the carriages. With the continuous breakthroughs in the operating speed of high-speed railways, higher conductivity, excellent flexibility and outstanding strength requirements are put forward for the wire materials used for power transmission. Based on the above application requirements, a large number of exploratory works on the modification of high-performance copper and its alloys have emerged.

[0004] Surface treatment technology is an advanced process, and common processes include electroplating, vapor deposition, laser cladding, etc. This technology can maintain the inherent properties of the base material while achieving performance optimization, and achieve the purpose of improving the overall performance of the material, effectively extending its service life or broadening its application field.

[0005] However, electroplating coatings often have poor bonding strength with the substrate and may peel off under special service conditions. Vapor deposition technology also faces problems such as low bonding strength and limited deposition thickness. When laser cladding is used on copper-based materials, there are often fewer cladding materials to choose from due to the low wettability of the material. At the same time, copper's absorption rate for lasers is not high, making it difficult to remelt.

[0006] In view of this, the present invention is proposed. Summary of the invention

[0007] The first purpose of the present invention is to provide a method for improving the comprehensive performance of copper materials based on multi-light field composite, which can significantly improve the comprehensive performance of copper materials, such as hardness and tensile properties. In addition, this method directly strengthens the original substrate, and compared with electroplating, vapor deposition and laser cladding surface treatment technologies, there is no need to add cladding materials, and there is no need to consider the bonding strength between the electroplating coating or the deposited layer and the substrate.

[0008] The second object of the present invention is to provide a method for improving the comprehensive performance of copper materials based on multi-light field combination and its application in the preparation of copper products.

[0009] In order to achieve the above-mentioned purpose of the present invention, the following technical solutions are particularly adopted: The present invention first provides a method for improving the comprehensive performance of copper materials based on multi-light field synthesis, comprising the following steps: performing laser irradiation surface treatment on the copper material, wherein the laser used for the laser irradiation surface treatment is a continuous / pulse composite laser; wherein the copper material includes at least one of metallic copper and a copper alloy.

[0010] Furthermore, the wavelength of the continuous laser in the continuous / pulse composite laser is 1080 nm.

[0011] Furthermore, the power of the continuous laser in the continuous / pulse composite laser is 1500-3000W.

[0012] Furthermore, the wavelength of the pulse laser in the continuous / pulse composite laser is 1064 nm.

[0013] Furthermore, the power of the pulse laser in the continuous / pulse composite laser is 250-500W.

[0014] Furthermore, the focus of the continuous laser and the pulse laser in the continuous / pulse composite laser are kept concentric.

[0015] Furthermore, the pulse laser repetition frequency of the continuous / pulse composite laser is 20-50 kHz.

[0016] Furthermore, the distance between the laser head of the laser device used for the laser irradiation surface treatment and the surface of the copper material is 15-20 mm, and the deflection angle relative to the surface of the copper material is 1°-10°.

[0017] Furthermore, the line scanning speed of the continuous / pulse composite laser along the X-axis is 5000-10000 mm / s, and the movement speed along the Y-axis is 0.001-0.02 m / s.

[0018] Furthermore, the laser irradiation surface treatment is performed under an argon protective atmosphere.

[0019] Furthermore, the flow rate of the argon gas is 10-20 L / min.

[0020] Furthermore, before the laser irradiation surface treatment, the copper material is subjected to a surface cleaning treatment.

[0021] Furthermore, the surface cleaning method includes: polishing the surface of the copper material with sandpaper, then cleaning it with water and ethanol in sequence, and then drying it.

[0022] The present invention further provides the application of the method for improving the comprehensive performance of copper materials based on multi-light field combination in the preparation of copper products.

[0023] Compared with the prior art, the present invention has the following beneficial effects: (1) The method provided by the present invention for improving the comprehensive performance of copper materials based on multi-light field composite can significantly improve the comprehensive performance of copper materials, such as hardness and tensile properties. In addition, the method is directly strengthened on the original substrate. Compared with electroplating, vapor deposition and laser cladding surface treatment technologies, there is no need to add cladding materials, nor is there any need to consider the bonding strength between the electroplating coating or deposition layer and the substrate.

[0024] (2) The method for improving the comprehensive performance of copper materials based on multi-light field composite provided by the present invention is green, safe and environmentally friendly compared with traditional vapor deposition technology and electroplating coating.

[0025] (3) The method for improving the comprehensive performance of copper materials based on multi-light field composite provided by the present invention adopts multi-light field laser strengthening technology, is easy to operate, is not limited by part size, has obvious grain refinement and performance improvement, and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A schematic diagram of the structure of the laser device provided by the present invention; Figure 2 The metallographic image of the metal copper after multi-light field laser strengthening provided in Example 1 of the present invention; Figure 3 A metallographic image of the metal copper after multi-light field laser strengthening in Example 2 provided by the present invention; Figure 4 This is a metallographic image of the metal copper after multi-light field laser strengthening in Example 3 provided by the present invention; Figure 5 This is an electron scanning microscope image of the metallic copper after multi-light field laser strengthening in Example 3 provided by the present invention; Figure 6 The statistical results of the grain size of the metallic copper after multi-field laser strengthening in Example 1 provided by the present invention; Figure 7 The statistical result of the grain size of the metal copper of the comparative example provided by the present invention; Figure 8A schematic structural diagram of the equipment used for laser irradiation surface treatment provided by the present invention. DETAILED DESCRIPTION

[0028] The technical scheme of the present invention will be clearly and completely described below in conjunction with the accompanying drawings and specific embodiments, but it will be understood by those skilled in the art that the following described embodiments are part of embodiments of the present invention, rather than all embodiments, and are only used to illustrate the present invention, and should not be considered as limiting the scope of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative work are within the scope of protection of the present invention. If specific conditions are not specified in the embodiments, they are carried out according to normal conditions or conditions recommended by the manufacturer. If the manufacturer is not specified in the reagents or instruments used, they are all conventional products that can be purchased commercially.

[0029] If there is no special explanation, in the present invention, "the first aspect", "the second aspect", "the third aspect", "the fourth aspect", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or quantity, nor can they be understood as implicitly indicating the importance or quantity of the indicated technical features. Moreover, "the first", "the second", "the third", "the fourth", etc. only serve the purpose of non-exhaustive enumeration and description, and it should be understood that they do not constitute a closed limitation on quantity.

[0030] If there is no special explanation, the "include" and "comprising" mentioned in the present invention represent open-ended or closed-ended expressions. For example, the "include" and "comprising" may represent that other components not listed may also be included or only the listed components may be included or only the listed components may be included.

[0031] If there is no special explanation, in the present invention, "one or more" or "at least one" refers to any one, any two or more of the listed items. Among them, "several" refers to any two or more of the listed items.

[0032] In the first aspect, the present invention provides a method for improving the comprehensive performance of copper materials based on multi-light field composite, or a method for using multi-light field composite to irradiate copper materials to improve the comprehensive strength and toughness of copper materials, comprising the following steps: performing laser irradiation surface treatment on the copper material, wherein the laser used for the laser irradiation surface treatment is a continuous / pulse composite laser to achieve surface strengthening of the copper material and improvement of the comprehensive performance.

[0033] That is, a continuous / pulse composite laser is used to irradiate the surface of the copper material so that the grains on the surface of the copper material are refined, forming a microscopic morphology with grain size gradient structural characteristics, thereby achieving surface strengthening of the copper material and improving the comprehensive performance.

[0034] The copper material includes at least one of metallic copper and copper alloys. The copper alloys include any type of copper-containing alloys, such as copper alloys commonly used in various fields, or copper alloys disclosed in the prior art, which are not limited in the present invention.

[0035] The method for improving the comprehensive performance of copper materials based on multi-light field combination provided by the present invention can significantly improve the comprehensive performance of copper materials, such as hardness and tensile properties.

[0036] This method directly strengthens the original substrate. Compared with traditional vapor deposition technology, electroplating coating and laser cladding, it does not require the addition of cladding materials, nor does it need to consider the bonding strength between the electroplating coating or deposition layer and the substrate. It is green, safe and environmentally friendly.

[0037] The method for improving the comprehensive performance of copper materials based on multi-light field composite provided by the present invention adopts multi-light field laser strengthening technology, that is, continuous / pulse composite laser, which can refine the grains. Specifically, since the copper material has a low absorption rate for lasers of all wavelengths, the multi-light field modification technology developed by the present invention first uses a high-energy continuous laser to melt the copper material. The molten copper material is more likely to absorb laser energy. Then, a high-repetition-rate laser acts on the molten pool, causing a cavitation effect of the melt and playing a role in stirring the molten pool. In the above phenomenon, high temperature and high pressure will be generated in the molten pool, thereby achieving the purpose of grain refinement.

[0038] In addition, the present invention adopts multi-light field laser strengthening technology, which is easy to operate, not limited by part size, has obvious grain refinement and performance improvement, and has a wide range of applications.

[0039] In order to refine the copper material grains and further improve the copper material's hardness, tensile strength and other properties, the present invention optimizes the parameters of the laser irradiation surface treatment as follows.

[0040] In some specific embodiments, the wavelength of the continuous laser in the continuous / pulsed composite laser is 1080 nm. Copper has a higher absorption characteristic at the blue wavelength and a weaker absorption capacity for light of other wavelengths. Therefore, an inappropriate wavelength will cause most of the laser energy to be reflected and unable to act on the surface of the copper material.

[0041] In some specific embodiments, in order to ensure that the surface of the copper material melts during laser irradiation to form a micro-molten pool so that the pulsed laser stirs the molten pool, the power of the continuous laser in the continuous / pulsed composite laser is 1500W~3000W, including but not limited to any one of 1500W, 1800W, 2000W, 2300W, 2500W, 2700W, and 3000W or a range between any two of them.

[0042] In some specific embodiments, the wavelength of the pulse laser in the continuous / pulse composite laser is 1064 nm.

[0043] In some specific embodiments, in order to ensure grain refinement on the surface of the copper material, thereby improving its surface hardness and comprehensive performance, the power of the pulse laser in the continuous / pulse composite laser is 250W~500W, including but not limited to any point value of 250W, 300W, 350W, 400W, 450W, 500W or a range value between any two of them.

[0044] In some specific implementations, in order to ensure that the continuous laser and the pulse laser act on the surface of the copper material at the same time, the focus of the continuous laser and the pulse laser in the continuous / pulse composite laser are kept concentric.

[0045] In some specific implementations, in order to ensure grain refinement on the surface of the copper material, thereby improving its surface hardness and comprehensive performance, the pulse laser repetition frequency of the continuous / pulsed composite laser is 20-50kHz, including but not limited to any point value of 20kHz, 25kHz, 30kHz, 35kHz, 40kHz, 45kHz, 50kHz or any range value between two thereof. The pulse laser repetition frequency refers to the number of pulses output by the laser per unit time.

[0046] In some specific implementations, in order to ensure grain refinement on the surface of the copper material, thereby improving its surface hardness and comprehensive performance, the distance between the laser head of the laser device used for the laser irradiation surface treatment and the surface of the copper material is 15~20mm, including but not limited to any point value of 15mm, 16mm, 17mm, 18mm, 19mm, 20mm or any range value between two of them; the deflection angle relative to the surface of the copper material is 1°~10°, including but not limited to any point value of 1°, 2°, 3°, 4°, 5°, 6°, 7°, 8°, 9°, 10° or any range value between two of them. Among them, the deflection angle relative to the surface of the copper material refers to the angle between the laser beam and the surface of the copper material. The copper material is a highly reflective material, so the copper material needs to be deflected at a certain angle from the laser beam to ensure that the laser will not be reflected back into the laser head.

[0047] In some specific embodiments, in order to ensure that the copper material melts on the surface during laser irradiation to form a micro molten pool, so that the pulsed laser stirs the molten pool, the linear scanning speed of the continuous / pulse composite laser along the X-axis is 5000-10000 mm / s, including but not limited to any point value of 5000 mm / s, 6000 mm / s, 7000 mm / s, 8000 mm / s, 9000 mm / s, 10000 mm / s or any range value between two thereof; the continuous / pulse composite laser is preferably used for the purpose of stirring the molten pool. The combined laser movement speed along the Y axis is 0.001~0.02m / s, including but not limited to any point value of 0.001m / s, 0.002m / s, 0.003m / s, 0.004m / s, 0.005m / s, 0.006m / s, 0.007m / s, 0.008m / s, 0.01m / s, 0.012m / s, 0.013m / s, 0.015m / s, 0.018m / s, 0.02m / s or the range between any two of them. Figure 8 As shown, the equipment consists of a robot, a laser processing head, and a workbench. Line laser can be output through the movement of the galvanometer inside the laser processing head. It is loaded on the robot to achieve more complex specific movements. The X-axis is the scanning direction of the laser processing head galvanometer, and the Y-axis is the moving direction of the robot.

[0048] In some specific implementations, in order to ensure that the copper material is not oxidized during the laser surface treatment, the laser irradiation surface treatment is performed under an argon protective atmosphere.

[0049] In some specific embodiments, the flow rate of argon gas is 10-20 L / min, including but not limited to any point value of 10 L / min, 12 L / min, 13 L / min, 15 L / min, 18 L / min, 20 L / min or a range value between any two of them.

[0050] In some specific implementations, the copper material is subjected to a surface cleaning treatment before the laser irradiation surface treatment.

[0051] In some specific embodiments, the surface cleaning method includes: using sandpaper to polish the surface of the copper material to remove stains such as oxide film and oil on the surface of the copper material, then using deionized water for a first cleaning to remove abrasive particles left on the surface of the copper material by the sandpaper, and then using anhydrous ethanol for a second cleaning to facilitate subsequent drying of the copper material surface to prevent oxidation of the copper material; and then drying to remove the ethanol on the surface of the copper material.

[0052] In some specific embodiments, the drying temperature may be 60-80° C. (eg, 60° C., 70° C., or 80° C.), and the drying time may be 30-60 min (eg, 30 min, 40 min, 50 min, or 60 min), but is not limited thereto.

[0053] In some specific implementations, the sandpaper includes 320-mesh sandpaper, 600-mesh sandpaper and 1200-mesh sandpaper, that is, 320-mesh sandpaper, 600-mesh sandpaper and 1200-mesh sandpaper are used in sequence to polish the surface of the copper material.

[0054] The multi-field laser surface strengthening process of copper materials generally needs to be carried out under the above parameters. If the focus of the continuous laser and the pulsed laser are not kept concentric, the pulsed laser will not be able to act on the molten pool, and thus the grain refinement of the surface of the copper material cannot be achieved; if the continuous laser power is too low or the scanning speed is too fast, the continuous laser energy will be insufficient, and a micro-molten pool cannot be formed on the surface of copper and copper alloys, thereby affecting the pulsed laser's effect on the grain refinement of the surface of copper and copper alloys; if the pulsed laser energy is too low or the frequency is too low, the grain refinement effect on the surface of copper and copper alloys will be unclear or non-existent, and thus the surface hardness and comprehensive performance of copper and copper alloys cannot be improved. Therefore, the selection of the above-mentioned continuous / pulse composite laser test parameters for surface irradiation treatment of copper materials is conducive to achieving surface grain refinement and realizing a microscopic morphology with grain size gradient structural characteristics, thereby further improving the surface hardness, tensile strength and other comprehensive properties of copper materials.

[0055] The laser device used in the laser irradiation surface treatment of the present invention can adopt an existing device, such as Figure 1 The figure shows the result of the laser device. The continuous laser and pulsed laser pass through their respective beam expanders, are reflected by the reflector, and then converge into the laser head, and then output the movement through the galvanometer inside the laser head. A visual camera and a blowing system are installed on the side axis of the laser head, which are used to monitor the movement of the workpiece in real time and blow away impurities respectively.

[0056] In a second aspect, the present invention provides an application of the method for improving the comprehensive performance of copper materials based on multi-light field combination in the preparation of copper products.

[0057] The method for improving the comprehensive performance of copper materials based on multi-light field combination provided by the present invention can significantly improve the comprehensive performance of copper materials such as surface hardness and tensile strength, which is conducive to the promotion and use of copper and its alloys. The method for improving the comprehensive performance of copper materials based on multi-light field combination has broad application prospects.

[0058] Among them, copper products include but are not limited to materials, components, parts, devices, apparatus or equipment containing copper and its alloys.

[0059] The embodiments of the present invention will be described in detail below in conjunction with the examples, but it will be appreciated by those skilled in the art that the following examples are only used to illustrate the present invention and should not be considered as limiting the scope of the present invention. If no specific conditions are specified in the examples, the conditions are carried out according to normal conditions or the conditions recommended by the manufacturer. If the manufacturer of the reagents or instruments used is not specified, they are all conventional products that can be obtained commercially.

[0060] Example 1 The method for improving the comprehensive performance of copper materials based on multi-light field combination provided in this embodiment includes the following steps: (1) Surface cleaning of copper (T2 pure copper): First, the surface of the copper was polished with 320-mesh, 600-mesh and 1200-mesh sandpapers in turn. After polishing, it was washed with deionized water for the first time, and then washed with anhydrous ethanol for the second time. The copper was then placed in a vacuum oven and dried at 70°C for 50 minutes.

[0061] (2) Place the cleaned copper on the processing table for laser irradiation surface treatment. Before laser irradiation, adjust the distance between the laser head of the laser device and the copper and copper to 18 mm, and the deflection angle relative to the copper surface to 5°; and turn on the argon protective gas, with the argon flow rate of 10 L / min.

[0062] The cleaned copper surface was irradiated with continuous / pulse composite laser to refine the surface grains and obtain a microscopic morphology with grain size gradient structural characteristics. The focus of the continuous laser and the pulse laser in the continuous / pulse composite laser was kept concentric; the power of the continuous laser in the continuous / pulse composite laser was 2500W; the power of the pulse laser in the continuous / pulse composite laser was 350W; the wavelength of the continuous laser in the continuous / pulse composite laser was 1080nm; the wavelength of the pulse laser in the continuous / pulse composite laser was 1064nm; the pulse laser repetition frequency of the continuous / pulse composite laser was 40kHz; the line scanning speed of the continuous / pulse composite laser along the X-axis was 8000mm / s, and the movement speed of the laser head along the Y-axis was 0.02m / s.

[0063] Example 2 The method for improving the comprehensive performance of copper materials based on multi-light field combination provided in this embodiment is basically the same as that in Embodiment 1, except that the pulse laser power in the continuous / pulse composite laser is replaced with 500W.

[0064] Example 3 The method for improving the comprehensive performance of copper materials based on multi-light field combination provided in this embodiment is basically the same as that in Embodiment 1, except that the pulse laser power in the continuous / pulse composite laser is replaced with 250W.

[0065] Example 4 The method for improving the comprehensive performance of copper materials based on multi-light field combination provided in this embodiment is basically the same as that in Embodiment 1, except that the continuous laser power in the continuous / pulse composite laser is replaced with 1500W.

[0066] Example 5 The method for improving the comprehensive performance of copper materials based on multi-light field combination provided in this embodiment is basically the same as that in Embodiment 1, except that the continuous laser power in the continuous / pulse composite laser is replaced with 3000W.

[0067] Example 6 The method for improving the comprehensive performance of copper materials based on multi-light field combination provided in this embodiment is basically the same as that in Embodiment 1, except that the pulse laser repetition frequency of the continuous / pulse composite laser is set to 20 kHz.

[0068] Example 7 The method for improving the comprehensive performance of copper materials based on multi-light field combination provided in this embodiment is basically the same as that in Embodiment 1, except that the distance between the laser head of the laser device and the copper and the metal copper is adjusted to 15 mm, and the deflection angle relative to the metal copper surface is 10°.

[0069] Example 8 The method for improving the comprehensive performance of copper materials based on multi-light field combination provided in this embodiment is basically the same as that in Embodiment 1, except that the linear scanning speed of the continuous / pulse composite laser along the X-axis is replaced with 5000 mm / s, and the movement speed of the laser head along the Y-axis is 0.001 m / s.

[0070] Example 9 The method for improving the comprehensive performance of copper materials based on multi-light field combination provided in this embodiment is basically the same as that in Embodiment 1, except that the metallic copper is replaced with Cu-Ni-Zn copper alloy.

[0071] Example 10 The method for improving the comprehensive performance of copper materials based on multi-light field combination provided in this embodiment is basically the same as that in Embodiment 1, except that the metallic copper is replaced with H68 copper alloy.

[0072] Comparative Example 1 The method for improving the comprehensive performance of copper materials provided in this comparative example is basically the same as that in Example 1, except that the laser device does not turn on the pulse laser, and only uses continuous laser to perform laser irradiation surface treatment on the surface of the metal copper.

[0073] Comparative Example 2 The method for improving the comprehensive performance of copper materials provided in this comparative example is basically the same as that in Example 1, except that the laser device does not turn on the continuous laser, and only uses pulsed laser to perform laser irradiation surface treatment on the surface of the metal copper.

[0074] Comparative Example 3 The method for improving the comprehensive performance of copper materials based on multi-light field composite provided in this comparative example is basically the same as that in Example 1, except that the continuous laser power in the continuous / pulse composite laser is 500W, and the pulse laser power in the continuous / pulse composite laser is 100W.

[0075] Comparative Example 4 The method for improving the comprehensive performance of copper materials based on multi-light field composite provided in this comparative example is basically the same as that in Example 1, except that the pulse laser repetition frequency of the continuous / pulse composite laser is 70kHz, and the linear scanning speed of the continuous / pulse composite laser along the X-axis is 3000mm / s, and the movement speed of the laser head along the Y-axis is 0.05m / s.

[0076] Experimental example The copper materials after laser irradiation surface treatment in each embodiment and each comparative example were subjected to hardness and tensile tests, and the results are shown in Table 1. The comparative example is metallic copper without laser irradiation surface treatment, i.e., the cleaned metallic copper (T2 pure copper) obtained in step (1) of embodiment 1.

[0077] Table 1 Hardness and tensile strength test results

[0078] It can be seen from Table 1 above that the embodiments of the present invention use multi-light field laser irradiation of copper and copper alloys, which is better than the laser irradiation of any of the above-mentioned modes (Comparative Example 1 and Comparative Example 2), and can significantly improve the comprehensive mechanical properties of copper and copper alloys such as hardness and tensile strength.

[0079] Meanwhile, by comparing Example 1 with Comparative Examples 3 and 4, it can be seen that the use of appropriate parameters of the continuous / pulse composite laser in Example 1 is beneficial to further improve the comprehensive properties of copper and copper alloys.

[0080] Furthermore, metallographic observations were performed on the copper metal after multi-field laser strengthening in Example 1, Example 2 and Example 3, and the results were as follows: Figure 2 , Figure 3 and Figure 4 As shown. Figure 2 , Figure 3 and Figure 4 It can be seen that with the increase of pulse laser power in the continuous / pulse composite laser, the grain refinement effect becomes gradually obvious.

[0081] also, Figure 5 This is an electron scanning microscope image of the metal copper after multi-field laser strengthening in Example 3 of the present invention. Figure 5 It can be seen that the grain size decreases along the gradient from top to bottom, which may be the refinement caused by the multi-laser composite field.

[0082] The copper alloy strengthened by multi-field laser in Example 1 was subjected to metallographic observation and its surface grain size was measured. Figure 6 The figure shows the grain size statistics of the copper metal after multi-field laser strengthening in Example 1. Figure 7 The following are the statistical results of the grain size of the metallic copper in the control example. Figure 6 and Figure 7 It can be seen that the average grain size of the surface of the metal copper after multi-light field laser strengthening in Example 1 is 2.99 microns, and the average grain size of the surface of the metal copper in the control example is 3.79 microns. It can be seen that the method for improving the comprehensive performance of copper materials based on multi-light field composite provided by the present invention refines the grains.

[0083] Although the present invention has been illustrated and described with specific embodiments, it should be appreciated that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Those skilled in the art should understand that the technical solutions described in the above embodiments may be modified, or some or all of the technical features thereof may be replaced by equivalents without departing from the spirit and scope of the present invention. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention. Therefore, this means that all such replacements and modifications within the scope of the present invention are included in the appended claims.

Claims

1. A method for improving the comprehensive performance of copper materials based on multi-light field composite, characterized in that: The steps include: The copper material is subjected to laser irradiation surface treatment, wherein the laser used in the laser irradiation surface treatment is a continuous / pulse composite laser; The copper material includes at least one of metallic copper and a copper alloy.

2. The method for improving the comprehensive performance of copper materials based on multi-light field combination according to claim 1 is characterized in that: At least one of the following conditions is met: (1) The wavelength of the continuous laser in the continuous / pulse composite laser is 1080 nm; (2) The power of the continuous laser in the continuous / pulse composite laser is 1500~3000W; (3) The wavelength of the pulse laser in the continuous / pulse composite laser is 1064 nm; (4) The power of the pulse laser in the continuous / pulse composite laser is 250~500W; (5) The focal points of the continuous laser and the pulse laser in the continuous / pulse composite laser are kept concentric.

3. The method for improving the comprehensive performance of copper materials based on multi-light field combination according to claim 1 is characterized in that: The pulse laser repetition frequency of the continuous / pulse composite laser is 20-50 kHz.

4. The method for improving the comprehensive performance of copper materials based on multi-light field combination according to claim 1 is characterized in that: The distance between the laser head of the laser device used for the laser irradiation surface treatment and the surface of the copper material is 15-20 mm, and the deflection angle relative to the surface of the copper material is 1°-10°.

5. The method for improving the comprehensive performance of copper materials based on multi-light field combination according to claim 1 is characterized in that: The line scanning speed of the continuous / pulse composite laser along the X-axis is 5000-10000 mm / s, and the movement speed along the Y-axis is 0.001-0.02 m / s.

6. The method for improving the comprehensive performance of copper materials based on multi-light field combination according to claim 1 is characterized in that: The laser irradiation surface treatment is performed under an argon protective atmosphere.

7. The method for improving the comprehensive performance of copper materials based on multi-light field combination according to claim 6 is characterized in that: The argon gas flow rate is 10-20 L / min.

8. The method for improving the comprehensive performance of copper materials based on multi-light field combination according to claim 1 is characterized in that: Before the laser irradiation surface treatment, the copper material is subjected to a surface cleaning treatment.

9. The method for improving the comprehensive performance of copper materials based on multi-light field combination according to claim 8, characterized in that: The surface cleaning method includes: polishing the surface of the copper material with sandpaper, then cleaning it with water and ethanol in sequence, and then drying it.

10. Use of the method for improving the comprehensive performance of copper materials based on multi-light field combination as described in any one of claims 1 to 9 in the preparation of copper products.

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