High-density packaging chip and packaging structure

Abstract

The invention relates to the technical field of high-density packaged chips, in particular to a high-density packaged chip and a packaging structure, the high-density packaged chip comprises a mounting shell, a cover plate, a positioning mechanism and a circuit connecting mechanism, a substrate is arranged in the mounting shell, a mounting groove is formed in the substrate, and a chip is placed in the mounting groove; the cover plate is arranged at the top of the mounting shell; a silver paste bonding layer is arranged in the mounting groove and is used for fixing the chip; a heat-conducting plate is arranged at the top of the chip; the positioning mechanism comprises a positioning plate, a positioning bolt and a clamping block; the positioning plate is arranged above the heat conducting plate, the clamping blocks are arranged at the two ends of the positioning plate, and the inner walls of the ends, extending out of the mounting shell, of the clamping blocks are clamped with the outer side wall of the mounting shell; a positioning hole is formed in the base plate; a positioning bolt is arranged at the bottom of the positioning plate; a plurality of welding spots are arranged on the two sides of the top of the heat conducting plate and connected with the circuit connecting mechanism. The packaging structure provided by the invention has good thermal conductivity, and provides enough space for integration of other elements while ensuring stable installation of the chip.

Description

Technical Field

[0001] The invention relates to the technical field of high-density packaged chips, in particular to a package structure of high-density packaged chips. Background Art

[0002] With the rapid development of electronic technology, chips, as the core components of electronic devices, have higher and higher integration and performance requirements. High-density packaged chips are integrated circuit chips that use advanced packaging technology. This technology can integrate more chips in a smaller package, thereby improving the integration and performance of the device. The main advantages of this packaging technology include higher integration, smaller size, higher performance, and lower energy consumption.

[0003] Traditional chip packaging technology mostly uses through-hole insertion or surface mounting. With the continuous advancement of chip manufacturing technology, the size of chips continues to shrink, while the functions are becoming more and more powerful. The traditional chip packaging structure has gradually become difficult to meet the needs of current high-performance chips in terms of integration, heat dissipation performance and stability. For example, the heat dissipation design in the traditional packaging structure is often not ideal, which can easily cause the chip to overheat and affect its performance and stability; at the same time, the traditional packaging method is also difficult to achieve a higher level of integration, which limits the further improvement of chip performance. Summary of the invention

[0004] The purpose of this application is to provide a packaging structure for high-density packaged chips, which has good thermal conductivity and achieves higher integration by optimizing the layout of the mounting shell and the substrate. The support block and the substrate structure ensure stable installation of the chip, while providing sufficient space for the integration of other components.

[0005] To achieve the above-mentioned purpose, the present application provides a packaging structure for a high-density packaged chip, comprising a mounting shell, a cover plate, a positioning mechanism and a line connection mechanism, wherein the mounting shell is provided with support blocks at the four corners of the bottom, the support blocks are provided with a substrate, the substrate is provided with a mounting groove, and the chip is placed in the mounting groove; the cover plate is arranged on the top of the mounting shell to form a closed space with the mounting shell; a silver paste adhesive layer is arranged in the mounting groove, and the silver paste adhesive layer is used to fix the chip; a heat conducting plate is arranged on the top of the chip, and the bottom of the heat conducting plate is arranged on the top of the substrate; the positioning mechanism comprises a positioning plate, a positioning pin and a clamping block; the The side walls on both sides of the mounting shell are provided with mounting openings, the positioning plate is provided above the heat conducting plate, the clamping blocks are provided at both ends of the positioning plate, and the size of the clamping blocks is adapted to the mounting openings, the inner wall of the clamping block extending out of one end of the mounting shell is clamped with the outer wall of the mounting shell; positioning holes are provided on both sides of the substrate close to the mounting openings, a positioning block is provided at the bottom of the positioning plate, a positioning pin is provided at the bottom of the positioning block, and the positioning pin is adapted to the positioning hole; a plurality of soldering points are provided on both sides of the top of the heat conducting plate, and the soldering points are connected to the line connecting mechanism; the line connecting mechanism is used to realize the connection between the chip and the external circuit.

[0006] As a further solution of the present invention: the support block is provided with a support groove, the side wall of the substrate abuts against the side wall of the support groove, and the bottom of the substrate is installed on the support groove.

[0007] As a further solution of the present invention: anti-overflow grooves are arranged on both sides of the bottom of the installation groove.

[0008] As a further solution of the present invention: a plurality of heat dissipation openings are arranged on the positioning plate.

[0009] As a further solution of the present invention: a card slot is provided on the inner wall of the installation shell, the installation block is provided on the cover plate, the installation block is installed in the card slot, and the installation block abuts against the clamping block.

[0010] As a further solution of the present invention: an epoxy resin sealing colloid is arranged between the installation block and the card slot.

[0011] As a further solution of the present invention: the line connection mechanism includes pins and gold wires; a plurality of the pins are arranged on both sides of the outer wall of the mounting shell, one end of the pin inserted into the mounting shell is connected to one end of the gold wire, and the other end of the gold wire is connected to the soldering point.

[0012] A high-density packaged chip comprises the above-mentioned packaging structure of the high-density packaged chip.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. The present invention fixes the heat conducting plate by setting a positioning plate, so that the chip is more stable in the mounting groove under the contact of the heat conducting plate, the cooperation of the positioning pin and the positioning hole ensures the installation position of the positioning plate, further limits the position of the heat conducting plate and the chip, ensures the accurate positioning of the chip on the substrate, and the clamping of the clamping block and the mounting port further enhances the stability of the entire packaging structure.

[0015] 2. The present invention can ensure the stability of the substrate in the horizontal direction by providing the support groove, and prevent it from moving or shaking during the packaging process. Such stable support provides a more reliable installation environment for the chip.

[0016] 3. The present invention can effectively prevent the silver paste adhesive layer from overflowing the installation groove due to excessive or improper operation when installing the chip by providing an anti-overflow groove. The anti-overflow groove can accommodate the overflowed silver paste, maintain the neatness and functionality of the packaging structure, and will not affect the fixed position and stability of the chip due to overflow. This helps to improve the accuracy and reliability of the packaging.

[0017] 4. The present invention allows heat to be transferred from the chip and the heat conducting plate to the positioning plate by setting the heat dissipation port, and then further dissipated to the outside of the packaging structure through the heat dissipation port. The heat conduction path is increased, the heat dissipation performance is effectively improved, and it helps to keep the working temperature of the chip stable and avoid performance degradation or damage caused by overheating.

[0018] 5. The present invention can fill the tiny gap between the mounting block and the card slot by arranging an epoxy resin sealant between the mounting block and the card slot, forming an effective barrier to prevent external moisture, dust or other pollutants from entering the interior of the packaging structure. At the same time, the epoxy resin sealant has high strength and adhesion after curing, which can enhance the connection stability between the mounting block and the card slot. This helps to reduce the vibration and looseness of the packaging structure during use, thereby improving the reliability and durability of the entire packaging body.

[0019] 6. The present invention can be conveniently connected to the external circuit by setting the pins as the interface of the external circuit. The gold wire is used as the internal connection medium to connect the pins with the solder joints, thereby realizing the signal transmission between the chip and the external circuit. This design makes the connection between the chip and the external circuit more efficient and stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the prior art and the drawings required for use in the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 The figure is a three-dimensional structural schematic diagram of a packaging structure of a high-density packaged chip.

[0022] Figure 2 This is a schematic diagram of the installation shell and cover plate.

[0023] Figure 3 Schematic diagram of the internal structure of the installation shell.

[0024] Figure 4 It is a schematic diagram of the three-dimensional structure of the positioning mechanism.

[0025] Figure 5 This is a schematic diagram of the base plate installation.

[0026] The reference numerals in the figure are: 1. mounting shell; 11. mounting port; 12. card slot; 2. cover plate; 21. mounting block; 3. support block; 31. support slot; 4. substrate; 41. mounting slot; 411. anti-overflow slot; 42. positioning hole; 5. chip; 6. heat conducting plate; 61. solder joint; 7. positioning plate; 71. card block; 72. positioning block; 721. positioning pin; 73. heat dissipation port; 8. pin; 81. gold wire. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0028] like Figures 1 to 5 As shown, a packaging structure of a high-density packaged chip includes a mounting shell 1, a cover plate 2, a positioning mechanism and a line connection mechanism. Support blocks 3 are arranged at the four corners of the bottom of the mounting shell 1, and a substrate 4 is arranged on the support block 3. The substrate 4 is supported and positioned by the support block 3 to improve the stability of the installation of the substrate 4.

[0029] The substrate 4 is provided with a mounting groove 41, in which a chip 5 is placed; the cover plate 2 is arranged on the top of the mounting shell 1, and forms a closed space with the mounting shell 1; a silver paste adhesive layer is arranged in the mounting groove 41, and the silver paste adhesive layer is used to fix the chip 5; a heat conducting plate 6 is arranged on the top of the chip 5, and the bottom of the heat conducting plate 6 is arranged on the top of the substrate 4;

[0030] The heat conduction plate 6 can effectively conduct heat away, thereby improving the heat dissipation performance of the chip 5. This can effectively prevent the chip 5 from overheating and maintain its stable operation.

[0031] The positioning mechanism includes a positioning plate 7, a positioning pin 721 and a clamping block 71; the side walls of the mounting shell 1 are provided with mounting openings 11, the positioning plate 7 is arranged above the heat conducting plate 6, the clamping blocks 71 are arranged at both ends of the positioning plate 7, and the size of the clamping blocks 71 is adapted to the mounting openings 11, the clamping blocks 71 extend out of the inner wall of one end of the mounting shell 1 and are clamped with the outer wall of the mounting shell 1; positioning holes 42 are provided on both sides of the substrate 4 close to the mounting opening 11, a positioning block 72 is provided at the bottom of the positioning plate 7, the positioning pin 721 is provided at the bottom of the positioning block 72, and the positioning pin 721 is adapted to the positioning hole 42; a plurality of solder joints 61 are provided on both sides of the top of the heat conducting plate 6, and the solder joints 61 are connected to the line connection mechanism; the line connection mechanism is used to realize the connection between the chip 5 and the external circuit.

[0032] The heat conducting plate 6 is fixed by setting a positioning plate 7, so that the chip 5 is more stable in the mounting groove 41 under the contact of the heat conducting plate 6, and the cooperation between the positioning pin 721 and the positioning hole 42 ensures the installation position of the positioning plate 7, further limits the position of the heat conducting plate 6 and the chip 5, and ensures the accurate positioning of the chip 5 on the substrate 4, and the clamping of the clamping block 71 and the mounting port 11 further enhances the stability of the entire packaging structure.

[0033] The support block 3 is provided with a support groove 31 , the side wall of the substrate 4 abuts against the side wall of the support groove 31 , and the bottom of the substrate 4 is mounted on the support groove 31 .

[0034] By providing the support groove 31, the stability of the substrate 4 in the horizontal direction can be ensured to prevent it from moving or shaking during the packaging process. Such stable support provides a more reliable installation environment for the chip 5.

[0035] Anti-overflow grooves 411 are provided on both sides of the bottom of the installation groove 41 .

[0036] By providing the anti-overflow groove 411, it is possible to effectively prevent the silver paste adhesive layer from overflowing the mounting groove 41 due to excessive amount or improper operation when mounting the chip 5. The anti-overflow groove 411 can accommodate the overflowed silver paste, maintain the neatness and functionality of the packaging structure, and will not affect the fixed position and stability of the chip 5 due to the overflow. This helps to improve the accuracy and reliability of the packaging.

[0037] The positioning plate 7 is provided with a plurality of heat dissipation openings 73 .

[0038] The heat dissipation opening 73 allows heat to be transferred from the chip 5 and the heat conducting plate 6 to the positioning plate 7, and then further dissipated to the outside of the packaging structure through the heat dissipation opening 73. The heat conduction path is increased, the heat dissipation performance is effectively improved, and it helps to keep the operating temperature of the chip 5 stable, avoiding performance degradation or damage caused by overheating.

[0039] The inner wall of the installation shell 1 is provided with a slot 12 , and the cover plate 2 is provided with the installation block 21 . The installation block 21 is installed in the slot 12 , and the installation block 21 abuts against the clamping block 71 .

[0040] The installation and cooperation between the card slot 12 and the mounting block 21 can ensure that a tightly closed space is formed between the cover plate 2 and the mounting shell 1. This design can effectively prevent harmful substances such as dust and moisture from entering the packaging structure, protecting the chip 5 from damage.

[0041] An epoxy resin sealant is disposed between the mounting block 21 and the slot 12 .

[0042] The epoxy resin sealant has excellent elasticity and water resistance, and can fill the tiny gap between the mounting block 21 and the card slot 12, forming an effective barrier to prevent external moisture, dust or other contaminants from entering the interior of the packaging structure. At the same time, the epoxy resin sealant has high strength and adhesion after curing, which can enhance the connection stability between the mounting block 21 and the card slot 12. This helps to reduce the vibration and looseness of the packaging structure during use, thereby improving the reliability and durability of the entire packaging body.

[0043] The line connection mechanism includes pins 8 and gold wires 81; a plurality of pins 8 are arranged on both sides of the outer wall of the mounting shell 1, one end of the pin 8 inserted into the mounting shell 1 is connected to one end of the gold wire 81, and the other end of the gold wire 81 is connected to the soldering point 61.

[0044] By setting the pin 8 as an interface of the external circuit, it can be conveniently connected to the external circuit. The gold wire 81 is used as an internal connection medium to connect the pin 8 with the solder joint 61, thereby realizing signal transmission between the chip 5 and the external circuit. This design makes the connection between the chip 5 and the external circuit more efficient and stable.

[0045] A high-density packaged chip comprises the above-mentioned packaging structure of the high-density packaged chip.

[0046] The working principle of the present invention is as follows: First, the chip 5 is placed in the mounting groove 41 on the substrate 4 and fixed by the silver paste adhesive layer to ensure a stable connection between the chip 5 and the substrate 4. Then, the heat conducting plate 6 is placed on the top of the chip 5 to quickly conduct the heat generated by the chip 5 through the heat conducting plate 6. At the same time, the positioning plate 7 and the positioning pin 721 in the positioning mechanism cooperate with the positioning hole 42 on the substrate 4 to ensure the stable position of the heat conducting plate 6 and the chip 5 in the mounting groove 41. At the same time, the clamping blocks 71 at both ends of the positioning plate 7 extend out of the inner wall of one end of the mounting shell 1 and clamp with the outer wall of the mounting shell 1 to further limit the position of the positioning plate 7.

[0047] On the outside of the packaging structure, the mounting shell 1 cooperates with the mounting block 21 on the cover plate 2 through the card slot 12, and is sealed with epoxy resin sealing colloid to form a closed space, which effectively prevents harmful substances such as dust and moisture from entering the packaging structure and protects the chip 5 from damage. At the same time, the pins 8 set on both sides of the outer wall of the mounting shell 1 are connected to the solder joints 61 through gold wires 81, so as to achieve efficient and stable connection between the chip 5 and the external circuit.

[0048] When the chip 5 is working, the generated heat is conducted to the positioning plate 7 through the heat conducting plate 6 and dissipated to the outside of the packaging structure through the heat dissipation openings 73 on the positioning plate 7, thereby effectively improving the heat dissipation performance of the chip 5 and ensuring the stable operation of the chip 5.

[0049] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A packaging structure for high-density packaged chips, comprising a mounting shell (1), a cover plate (2), a positioning mechanism and a line connection mechanism, wherein the mounting shell (1) is provided with support blocks (3) at four corners of the bottom, a substrate (4) is provided on the support blocks (3), a mounting groove (41) is provided on the substrate (4), and a chip (5) is placed in the mounting groove (41); the cover plate (2) is arranged on the top of the mounting shell (1) to form a closed space with the mounting shell (1); It is characterized in that A silver paste adhesive layer is arranged in the mounting groove (41), and the silver paste adhesive layer is used to fix the chip (5); a heat conducting plate (6) is arranged on the top of the chip (5), and the bottom of the heat conducting plate (6) is arranged on the top of the substrate (4); The positioning mechanism comprises a positioning plate (7), a positioning pin (721) and a clamping block (71); the side walls of both sides of the mounting shell (1) are provided with mounting openings (11); the positioning plate (7) is arranged above the heat conducting plate (6); the clamping blocks (71) are arranged at both ends of the positioning plate (7); the size of the clamping blocks (71) is adapted to the mounting openings (11); the inner wall of one end of the clamping block (71) protrudes from the mounting shell (1) and is clamped with the outer wall of the mounting shell (1); positioning holes (42) are provided on both sides of the base plate (4) near the mounting openings (11); the bottom of the positioning plate (7) is provided with a positioning block (72); the bottom of the positioning block (72) is provided with the positioning pin (721); the positioning pin (721) is adapted to the positioning hole (42); A plurality of soldering points (61) are arranged on both sides of the top of the heat conducting plate (6), and the soldering points (61) are connected to the line connection mechanism; the line connection mechanism is used to realize the connection between the chip (5) and the external circuit.

2. The packaging structure of a high-density packaged chip according to claim 1, characterized in that: The support block (3) is provided with a support groove (31), the side wall of the base plate (4) abuts against the side wall of the support groove (31), and the bottom of the base plate (4) is mounted on the support groove (31).

3. The packaging structure of a high-density packaged chip according to claim 1, characterized in that: Anti-overflow grooves (411) are arranged on both sides of the bottom of the installation groove (41).

4. The packaging structure of a high-density packaged chip according to claim 1, characterized in that: The positioning plate (7) is provided with a plurality of heat dissipation openings (73).

5. The packaging structure of a high-density packaged chip according to claim 1, characterized in that: The inner wall of the mounting shell (1) is provided with a slot (12), the cover plate (2) is provided with the mounting block (21), the mounting block (21) is mounted in the slot (12), and the mounting block (21) abuts against the clamping block (71).

6. The packaging structure of a high-density packaged chip according to claim 5, characterized in that: An epoxy resin sealing colloid is provided between the mounting block (21) and the card slot (12).

7. The packaging structure of a high-density packaged chip according to claim 1, characterized in that: The line connection mechanism comprises pins (8) and gold wires (81); a plurality of the pins (8) are arranged on both sides of the outer wall of the mounting shell (1); one end of the pin (8) inserted into the mounting shell (1) is connected to one end of the gold wire (81); and the other end of the gold wire (81) is connected to the soldering point (61).

8. A high-density packaged chip, characterized in that: The invention comprises a packaging structure of a high-density packaged chip as described in any one of claims 1 to 7 and a chip used for packaging.

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