Method and device for intelligently manufacturing metal mineral polished section

Abstract

The invention relates to the technical field of abrasive disc processing equipment, in particular to a method for intelligently manufacturing a metal mineral polished section, which comprises the following steps: S1, roughly grinding a sample through water and sand adding, surface grinding and plane treatment operations; s2, the sample is subjected to advanced fine grinding treatment through a grinding material; s3, performing high-precision wafer grinding treatment on the sample through timed grinding with grinding powder and polished wafer thickness fine detection operation, and using a thickness sensor and a roughness sensor in combination to ensure that the surface quality of the sample meets a high standard; and S4, under the condition that the thickness reaches the standard, the sample is polished, a roughness sensor is used for detecting the surface smoothness of the sample, the polishing machine stops working after the specified smoothness is achieved, and the metal mineral polished section meeting the requirement is obtained. Detail parameters in the grinding and polishing processes are monitored and adjusted in real time through a sensor system, and high consistency and high standard quality of final products are ensured.

Description

Technical Field

[0001] The invention relates to the technical field of grinding disc processing equipment, and in particular to a method and a device for intelligently manufacturing metal mineral optical discs. Background Art

[0002] In the field of process mineralogy, the production of metal mineral optical sections is a key step in observing, analyzing and studying the microstructure and physical properties of minerals, which is of vital importance to fields such as mineralogical research, materials science and geological exploration. However, the existing optical section production technology mainly relies on manual operation, and this traditional process exposes multiple technical bottlenecks and operational challenges.

[0003] First of all, in the traditional manual production process, the complex operations at each stage, including the initial rough grinding, fine grinding and final polishing steps of the sample, all need to be completed manually by workers. This cumbersome process makes the entire production chain lengthy and time-consuming. The essence of manual operation is that each process and step requires human judgment and execution, which makes the conversion efficiency between stages low and also reduces the overall efficiency of production. In addition, since each step requires manual intervention, the state and skill level of the person will directly affect the speed of production and the quality of the final product.

[0004] At the same time, the control of details in the manual preparation process, such as the judgment of sample thickness and surface smoothness, largely relies on the subjective experience of the operator rather than precise scientific measurement, which inevitably leads to large accuracy errors and inconsistencies. The measurement errors of key parameters such as thickness and surface features directly increase the difficulty of quality control, which in turn affects the standardization and reproducibility of the finished product. Traditional processes also face high labor costs, which are not only reflected in salary expenditures, but also in the low efficiency and high scrap rate caused by manual operation. In addition, long-term repetitive labor is also a challenge for operators, which may lead to excessive labor intensity and may also affect the quality of operation due to factors such as fatigue.

[0005] In order to overcome the above problems, the present invention proposes an intelligent method for producing metal mineral slices, which applies single-chip microcomputer technology, PLC technology, detection sensors, and manipulators to the production process of metal mineral slices, and then combines grinding equipment and polishing equipment to realize the intelligent production of metal mineral slices. The entire process does not require human participation. Summary of the invention

[0006] The purpose of the present invention is to provide a method for intelligent production of metal mineral optical slices, which uses a sensor system to monitor and adjust the detailed parameters of the grinding and polishing process in real time, ensuring the high consistency and high standard quality of the final product. The combined use of thickness and roughness sensors enables each key point in the production process to be monitored and adjusted in real time, greatly reducing the error caused by human judgment.

[0007] In order to achieve the above technical objectives and the above technical effects, the present invention is implemented through the following technical solutions:

[0008] A method for intelligently manufacturing a metal mineral optical sheet comprises the following steps:

[0009] S1: The sample is roughly ground by adding water and sand, surface grinding, and plane processing operations, so that the sample is processed to a state close to the target thickness;

[0010] S2: Perform advanced and detailed grinding of the sample using abrasive materials, use thickness sensors to monitor in real time, and modify the grinding pressure to adapt to different thicknesses;

[0011] S3: The samples are subjected to high-precision grinding through regular grinding with grinding powder and fine detection of optical thickness. Thickness and roughness sensors are used in combination to ensure that the surface quality of the samples meets high standards.

[0012] S4: When the thickness reaches the standard, the sample is polished and the surface smoothness of the sample is detected using a roughness sensor. When the specified smoothness is reached, the polishing machine stops working and a metal mineral slice that meets the requirements is obtained.

[0013] Furthermore, the step S1 specifically includes the following sub-steps:

[0014] S1.1: If the sample surface is in a dry state when it contacts the grinding disc, there may be damage and safety hazards, so it is essential to add a certain amount of water and abrasive during rough grinding. First, fully fit the sample on the grinding disc of the grinding machine, start the grinding machine to start working, and the single-chip computer system controls the addition of a certain amount of water and abrasive. Green silicon carbide is used as the abrasive, and the ratio of sand to water is 3:1; use a thickness sensor to measure the sample thickness T0 in real time, and the target thickness T is set to 3 cm. A nonlinear function is used to describe the relationship between grinding time and thickness in order to more accurately control the grinding process. The formula is:

[0015] Δt=α·(T0-T) β

[0016] Where Δt is the time required for grinding, α represents the basic time constant in the grinding process, which depends on the grinding efficiency of the equipment and is determined by experiments to be in the range of 0.1 to 1.0; β is an exponential parameter that determines the sensitivity of the grinding time to the thickness difference, which is between 1.2 and 2.0 to control the degree of response of time to thickness difference during the grinding process.

[0017] When the thickness T satisfies T≤3 cm, the sensor signal S(T) triggers the microcontroller to stop the grinding disc; the amount of water and abrasive added is dynamically calculated through time and real-time thickness, and the formula is:

[0018] W(t)=K1·e -λt

[0019] G(t)=K2·(1-e -μT )

[0020] K1 represents the initial amount of water added, which is the basic demand for water at the beginning of the grinding process; K2 represents the initial amount of abrasive added, which affects the cutting ability during the grinding process; λ represents the time attenuation factor of the water volume, which is used to control the water addition rate, and its value is between 0.01 and 0.1; μ is the reaction coefficient of the abrasive addition to the thickness, which affects the addition of abrasive at different thicknesses, and its value is between 0.1 and 0.5; when the thickness reaches the specified standard, the alarm set in the single-chip microcomputer system automatically sounds, and the single-chip microcomputer receives the signal and drives the motor to immediately stop the rotation of the grinding disc.

[0021] S1.2: Since the ore sample will become loose after absorbing too much water, in order to avoid the influence of water on the integrity and hardness of the sample, it is necessary to manually process the metal mineral sample after rough grinding. After step S1.1 is completed, the sample is grabbed by the robot and placed in the oven. After adding glue to the surface of the sample, the temperature is raised and baked for 20 minutes. Then the dryness of the sample is checked. If it is qualified, the next step can be carried out.

[0022] Furthermore, the step S2 specifically includes the following sub-steps:

[0023] S2.1: Select the working mode of the grinding machine to switch it to the fine grinding mode. After receiving the instruction to start the grinding machine, the single-chip microcomputer adds a certain amount of water and sand to the grinding disc. Green silicon carbide continues to be used in the fine grinding stage, and the sand-water ratio is kept the same as that in the coarse grinding stage, that is, 3:1; then the motor is driven to rotate the grinding disc, and the thickness gauge starts working and detects the thickness of the sample in real time; the target thickness is reduced to 2 cm, and the system uses the thickness sensor to monitor in real time and modify the grinding pressure to adapt to different thicknesses. The grinding pressure P is adjusted using a quadratic function relationship:

[0024] P(T)=γ·T 2 +δ·T+ε

[0025] Where γ represents the sensitivity of the square term to control the pressure change, and its value is between 0.01 and 0.05; δ is the linear term coefficient, which reflects the direct effect of thickness change on pressure, and its value is between 0.5 and 2.0; ε is a constant term used to set the base pressure.

[0026] When the thickness T satisfies T>2 cm, the grinding disc continues to operate. Through the sensor signal S(T), when T reaches the target, the microcontroller sends a stop signal.

[0027] S2.2: Use a robot to grab the sample and send it into the oven for planar processing. Bake it for 20 minutes. The difference from step S1.2 is that there is no need to add glue to fix the sample during the planar processing, because the sample will not be loose after processing in step S1.

[0028] Furthermore, the step S3 specifically includes: the grinding machine is converted to a high-precision grinding mode, and the single-chip computer system drives the motor to rotate the grinding disc at a fixed low speed. In order to make the smoothness and thickness of the sample reach high-precision standards, corundum powder is used in the high-precision grinding stage. The material is added in three stages to gradually improve the surface smoothness of the sample. The grinding disc rotates forward and reverse for a fixed time during the interval of adding abrasive powder each time for grinding. While the grinding machine is working, the thickness detector detects the thickness of the metal mineral sample in real time, with the target sample thickness T between 0.9 and 1.2 cm and roughness H ≤ 0.5 mm. The measurement of thickness and roughness during the grinding process is carried out through the functional relationship:

[0029] T=T0·e -ηκ(t)

[0030]

[0031] Where η is the time attenuation coefficient of thickness change, which controls the thickness reduction rate; κ is the time function adjustment coefficient, which is used to control the processing rhythm; ζ is the factor that controls the roughness improvement rate; τ is the control parameter of the influence of time on roughness, which describes the thickness and roughness change trend with the advancement of time t.

[0032] The system sets the logical judgment conditions as: (0.9≤T≤1.2) and H≤0.5. When the conditions are met, the microcontroller stops the grinding operation.

[0033] Furthermore, the step S4 specifically includes: using a manipulator to grab the sample after high-precision grinding and put it into the polishing machine, the single-chip computer system receives the signal and adds polishing lubricant to the polishing machine, and using a roughness sensor to detect the surface smoothness of the sample to ensure that the final roughness reaches or exceeds 0.5 mm.

[0034] The amount of polishing lubricant added at this stage is calculated according to the nonlinear time function to ensure the polishing uniformity and effect:

[0035]

[0036] Among them, L0 is the initial addition amount, ν is the change rate factor of lubricant addition, which controls the initial addition speed of lubricant, and the value is between 0.1 and 0.3; ξ is the exponential parameter of time, which adjusts the change curve of addition rate, and the value is between 1.0 and 1.5; the sensor measures the surface roughness H, and when H = 0.5, the alarm of the microcontroller system is triggered by the signal S (H) to automatically sound the alarm, and the microcontroller receives the stop signal and drives the motor to stop the polishing machine. The staff uses the manipulator to grab the sample and put it in a fixed position to obtain the metal mineral optical slice that meets the requirements of process mineralogy.

[0037] Furthermore, the specific working process of the manipulator includes:

[0038] The manipulator uses forward kinematics to analyze the position and posture of the end of the manipulator when the joint angle is given, and is represented by a homogeneous transformation matrix, which is obtained by multiplying the rotation matrix and displacement matrix of multiple joints. Assuming that the manipulator has n joints, the transformation of each joint includes a rotation matrix and a translation matrix, and the end position P e The specific formula is:

[0039]

[0040] Where T k represents the translation matrix, R represents the rotation matrix, θ i is the angle of each joint.

[0041] Dynamic control ensures that the operation of the manipulator is carried out within the physical constraints. The Lagrangian method is used to model the system. The Lagrangian function L is defined as the difference between kinetic energy K and potential energy V, that is, L = KV;

[0042] Then the joint torque τ is obtained by the Lagrange equation k :

[0043]

[0044] θ' represents the angular velocity, τ k Represents the control torque of the joint.

[0045] Combined with force feedback control, the accuracy and safety of grasping can be improved. The force sensor is installed at the end of the manipulator to detect the actual force F during grasping. actual In order to maintain a stable grasp, the control system needs to actual With the set gripping force F set For comparison, ΔF is used as the adjustment condition:

[0046] |F actual -Fset |≤ΔF

[0047] If the allowable error ΔF is exceeded, the torque output is adjusted through PD or PID control:

[0048]

[0049] Make the control process have good dynamic response.

[0050] In the positioning and visual recognition process, the camera and image processing technology are combined to achieve real-time recognition and calibration of the sample position and posture. The sample recognition steps include image acquisition, preprocessing, edge detection (using the Canny algorithm), and finding the exact position of the sample through template matching.

[0051] When performing grasping and placing tasks, the robot needs to perform actions accurately according to the calculated path and torque. During the sample grasping process, the robot first determines the grasping point through vision, calculates the grasping posture using inverse kinematics, and approaches the sample at a low speed to ensure stability. During the movement to the target equipment such as an oven or polishing machine, the path needs to be continuously monitored and dynamically adjusted based on sensor feedback. In the final placement stage, the robot needs to slowly reduce the speed V to near zero to reduce impact and ensure that the sample is safely, securely and accurately placed in place.

[0052] The entire process of these links is coordinated and monitored by the integrated PLC system, which describes the control logic through the state machine, sets different states and transfer conditions, and adjusts the tasks and parameter settings of each submodule in real time. Through continuous sensor data feedback, the system can respond quickly in abnormal situations and make adjustments to speed, direction and torque to ensure the reliability and safety of operation.

[0053] On the other hand, the present invention proposes an apparatus for implementing the above method, including a grinding device and a polishing device, wherein the grinding device includes a grinding disc assembly, a drive motor, a grinding pressure regulating mechanism, and an automatic water and sand adding system; the grinding disc assembly specifically includes a grinding disc made of a high-strength alloy, and its surface is covered with a wear-resistant coating to extend its service life. The grinding disc is connected to the drive motor through a connecting shaft, and the drive motor controls its rotation speed to adapt to different grinding requirements; the grinding pressure regulating mechanism uses hydraulic or mechanical devices to apply precise downward pressure to the grinding disc through a mechanical connection between a lever and the grinding disc. The automatic water and sand adding system includes a stainless steel water tank, an aluminum grinding silo, a transmission pipeline made of corrosion-resistant plastic material, and an electronic valve controlled by a single-chip microcomputer. These components are fixed to the frame of the grinding device through precision fittings and sealing connectors, and are connected to the central control system by a control cable to achieve precise distribution of grinding media.

[0054] The polishing equipment includes a polishing disc, a lubricating liquid adding system and a polishing drive system; the polishing disc is connected to the brushless motor of the polishing drive system through a wear-resistant gear, and the brushless motor provides a constant and stable torque; the lubricating liquid adding system consists of a stainless steel liquid storage tank, a metering pump, a rubber pipe and a precision nozzle. The nozzle is installed in a matrix form above the polishing disc, and the flow rate and distribution of the lubricating liquid are controlled by an electromagnetic valve to ensure the uniformity of the polishing stage.

[0055] The single-chip control system integrates a multi-layer circuit board, an ARM processor, a data acquisition module, and a communication interface module; the embedded software runs on the microcontroller of the single-chip computer, which is responsible for processing sensor input, executing control algorithms, and forming a closed-loop feedback to adjust mechanical operations.

[0056] The thickness detection equipment uses a laser source and a receiver. The laser emits a beam to the sample surface, and the reflected light is captured by the receiver. The reflection time difference is measured through an optical lens and a high-precision CCD sensor to calculate the precise thickness of the sample. The signal line of the thickness sensor is connected to the microcontroller control system through a shielded cable to ensure that data transmission is not affected by external electromagnetic interference. The roughness sensor uses a surface contact needle and a high-sensitivity position sensor to move along the sample surface, and calculates the roughness through changes in micro-displacement. The change is converted into a digital signal by an analog signal converter and transmitted to the control system.

[0057] The robot system consists of a number of servo motor-driven mechanical arms, with high-precision force sensors and industrial cameras at the end. The joints of the robot are adjusted in real time by motor drivers and microcontrollers, and connected to the PLC system via cables. The force sensor transmits the force signal to the control system through an analog-to-digital converter to ensure the stability and safety of the grasping. The camera has a CMOS sensor, which combines with an image processor to analyze the real-time image and confirm the exact position of the sample.

[0058] Beneficial effects of the present invention:

[0059] This technical solution greatly improves production efficiency by introducing a number of automation technologies. First, the entire production process is automatically controlled by a single-chip microcomputer and a PLC system, reducing the lengthy manual operation time. The single-chip microcomputer receives sensor data (such as thickness sensors and roughness sensors) in real time, dynamically adjusts the grinding and polishing pressure, and ensures the optimization of the time and quality of each production step. The use of a manipulator further shortens the sample transfer time, and the automated mechanical control not only speeds up the operation, but also achieves seamless connection between processes. Such a system design allows each process step to be processed almost in parallel, greatly reducing the waiting time between operations and improving overall production efficiency.

[0060] By integrating high-precision thickness and roughness sensors, the solution achieves precise control of the machining process. The real-time data feedback mechanism allows the system to dynamically adjust machining parameters, such as grinding disc speed, pressure, and lubricant volume, based on the actual measured sample thickness and roughness. This type of control down to every second ensures that the thickness and surface quality of each optical sheet can meet strict standards, eliminating the subjective errors that may be caused by traditional manual processing. In addition, the multi-layer sensor feedback and PLC closed-loop control system work together to capture extremely small quality deviations and make adjustments immediately, improving product quality consistency.

[0061] The use of automated devices greatly reduces the reliance on highly skilled workers and eliminates human errors. The system uses precise mathematical models and functional relationships to control key parameters such as grinding time, pressure, and the amount of lubricant added, completely replacing the empirical judgment in manual operations through programming presets and real-time data adjustments. At the same time, this automated operation reduces the direct demand for labor and reduces training and manpower management costs. Combined with technologies such as force sensors, the fluctuations caused by manual operations are further reduced, thereby improving the stability and operational efficiency of the equipment.

[0062] Automation not only improves efficiency and quality, but also significantly improves operational safety. The use of manipulators reduces the chances of direct contact between personnel and equipment. By installing high-precision force sensors and industrial cameras on them, the on-site situation can be monitored in real time to avoid safety accidents caused by misoperation. The PLC system uses state machine control logic to ensure the reliable operation of the equipment under various operating conditions, and further ensures safety through abnormal detection and emergency stop functions. At the same time, intelligent parameter adjustment and closed-loop control enhance the reproducibility of the process, allowing the production line to stably output products that meet industrial standards. By achieving controllable and monitorable dynamic adjustment of each link in the sheet processing, the standardization level and reproducibility of the process are significantly improved.

[0063] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0065] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0066] In the figure: 1. Grinding equipment, 101. Grinding disc assembly, 102. Driving motor, 103. Grinding pressure adjustment mechanism, 104. Automatic water and sand adding system, 2. Polishing equipment, 201. Polishing disc, 202. Lubricating fluid adding system, 203. Polishing drive system, 3. Robot system, 4. Thickness sensor, 5. Roughness sensor. DETAILED DESCRIPTION

[0067] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0068] Example 1

[0069] As described in this embodiment, a method for intelligently manufacturing a metal mineral optical sheet includes the following steps:

[0070] S1: The sample is roughly ground by adding water and sand, surface grinding, and plane processing operations, so that the sample is processed to a state close to the target thickness;

[0071] S2: Perform advanced and detailed grinding of the sample using abrasive materials, use thickness sensors to monitor in real time, and modify the grinding pressure to adapt to different thicknesses;

[0072] S3: The samples are subjected to high-precision grinding through regular grinding with grinding powder and fine detection of optical thickness. Thickness and roughness sensors are used in combination to ensure that the surface quality of the samples meets high standards.

[0073] S4: When the thickness reaches the standard, the sample is polished and the surface smoothness of the sample is detected using a roughness sensor. When the specified smoothness is reached, the polishing machine stops working and a metal mineral slice that meets the requirements is obtained.

[0074] In this embodiment, step S1 specifically includes the following sub-steps:

[0075] S1.1: If the sample surface is in a dry state when it contacts the grinding disc, there may be damage and safety hazards, so it is essential to add a certain amount of water and abrasive during rough grinding. First, fully fit the sample on the grinding disc of the grinding machine, start the grinding machine to start working, and the single-chip computer system controls the addition of a certain amount of water and abrasive. Green silicon carbide is used as the abrasive, and the ratio of sand to water is 3:1; use a thickness sensor to measure the sample thickness T0 in real time, and the target thickness T is set to 3 cm. A nonlinear function is used to describe the relationship between grinding time and thickness in order to more accurately control the grinding process. The formula is:

[0076] Δt=α·(T0-T) β

[0077] Where Δt is the time required for grinding, α represents the basic time constant in the grinding process, which depends on the grinding efficiency of the equipment and is determined by experiments to be in the range of 0.1 to 1.0; β is an exponential parameter that determines the sensitivity of the grinding time to the thickness difference, which is between 1.2 and 2.0 to control the degree of response of time to thickness difference during the grinding process.

[0078] When the thickness T satisfies T≤3 cm, the sensor signal S(T) triggers the microcontroller to stop the grinding disc; the amount of water and abrasive added is dynamically calculated through time and real-time thickness, and the formula is:

[0079] W(t)=K1·e -λt

[0080] G(t)=K2·(1-e -μT )

[0081] K1 represents the initial amount of water added, which is the basic demand for water at the beginning of the grinding process; K2 represents the initial amount of abrasive added, which affects the cutting ability during the grinding process; λ represents the time attenuation factor of the water volume, which is used to control the water addition rate, and its value is between 0.01 and 0.1; μ is the reaction coefficient of the abrasive addition to the thickness, which affects the addition of abrasive at different thicknesses, and its value is between 0.1 and 0.5; when the thickness reaches the specified standard, the alarm set in the single-chip microcomputer system automatically sounds, and the single-chip microcomputer receives the signal and drives the motor to immediately stop the rotation of the grinding disc.

[0082] S1.2: Since the ore sample will become loose after absorbing too much water, in order to avoid the influence of water on the integrity and hardness of the sample, it is necessary to manually process the metal mineral sample after rough grinding. After step S1.1 is completed, the sample is grabbed by the robot and placed in the oven. After adding glue to the surface of the sample, the temperature is raised and baked for 20 minutes. Then the dryness of the sample is checked. If it is qualified, the next step can be carried out.

[0083] In this embodiment, step S2 specifically includes the following sub-steps:

[0084] S2.1: Select the working mode of the grinding machine to switch it to the fine grinding mode. After receiving the instruction to start the grinding machine, the single-chip microcomputer adds a certain amount of water and sand to the grinding disc. Green silicon carbide continues to be used in the fine grinding stage, and the sand-water ratio is kept the same as that in the coarse grinding stage, that is, 3:1; then the motor is driven to rotate the grinding disc, and the thickness gauge starts working and detects the thickness of the sample in real time; the target thickness is reduced to 2 cm, and the system uses the thickness sensor to monitor in real time and modify the grinding pressure to adapt to different thicknesses. The grinding pressure P is adjusted using a quadratic function relationship:

[0085] P(T)=γ·T 2 +δ·T+ε

[0086] Where γ represents the sensitivity of the square term to control the pressure change, and its value is between 0.01 and 0.05; δ is the linear term coefficient, which reflects the direct effect of thickness change on pressure, and its value is between 0.5 and 2.0; ε is a constant term used to set the base pressure.

[0087] When the thickness T satisfies T>2 cm, the grinding disc continues to operate. Through the sensor signal S(T), when T reaches the target, the microcontroller sends a stop signal.

[0088] S2.2: Use a robot to grab the sample and send it into the oven for planar processing. Bake it for 20 minutes. The difference from step S1.2 is that there is no need to add glue to fix the sample during the planar processing, because the sample will not be loose after processing in step S1.

[0089] In this embodiment, step S3 specifically includes: the grinding machine is converted to a high-precision grinding mode, and the single-chip computer system drives the motor to rotate the grinding disc at a fixed low speed. In order to make the smoothness and thickness of the sample reach high-precision standards, corundum powder is used in the high-precision grinding stage. The material is added in three stages to gradually improve the surface smoothness of the sample. The grinding disc rotates forward and reverse for a fixed time during the interval of adding abrasive powder each time for grinding. While the grinding machine is working, the thickness detector detects the thickness of the metal mineral sample in real time, with the target sample thickness T between 0.9 and 1.2 cm and roughness H ≤ 0.5 mm. The measurement of thickness and roughness during the grinding process is carried out through the functional relationship:

[0090] T=T0·e -ηκ(t)

[0091]

[0092] Where η is the time attenuation coefficient of thickness change, which controls the thickness reduction rate; κ is the time function adjustment coefficient, which is used to control the processing rhythm; ζ is the factor that controls the roughness improvement rate; τ is the control parameter of the influence of time on roughness, which describes the thickness and roughness change trend with the advancement of time t.

[0093] The system sets the logical judgment conditions as: (0.9≤T≤1.2) and H≤0.5. When the conditions are met, the microcontroller stops the grinding operation.

[0094] In this embodiment, step S4 specifically includes: using a robot to grab the sample after high-precision grinding and put it into the polishing machine, the single-chip computer system receives the signal and adds polishing lubricant to the polishing machine, and using a roughness sensor to detect the surface smoothness of the sample to ensure that the final roughness reaches or exceeds 0.5 mm.

[0095] The amount of polishing lubricant added at this stage is calculated according to the nonlinear time function to ensure the polishing uniformity and effect:

[0096]

[0097] Among them, L0 is the initial addition amount, ν is the change rate factor of lubricant addition, which controls the initial addition speed of lubricant, and the value is between 0.1 and 0.3; ξ is the exponential parameter of time, which adjusts the change curve of addition rate, and the value is between 1.0 and 1.5; the sensor measures the surface roughness H, and when H = 0.5, the alarm of the microcontroller system is triggered by the signal S (H) to automatically sound the alarm, and the microcontroller receives the stop signal and drives the motor to stop the polishing machine. The staff uses the manipulator to grab the sample and put it in a fixed position to obtain the metal mineral optical slice that meets the requirements of process mineralogy.

[0098] In this embodiment, the specific working process of the manipulator includes:

[0099] The manipulator uses forward kinematics to analyze the position and posture of the end of the manipulator when the joint angle is given, and is represented by a homogeneous transformation matrix, which is obtained by multiplying the rotation matrix and displacement matrix of multiple joints. Assuming that the manipulator has n joints, the transformation of each joint includes a rotation matrix and a translation matrix, and the end position P e The specific formula is:

[0100]

[0101] Where T k represents the translation matrix, R represents the rotation matrix, θ i is the angle of each joint.

[0102] Dynamic control ensures that the operation of the manipulator is carried out within the physical constraints. The Lagrangian method is used to model the system. The Lagrangian function L is defined as the difference between kinetic energy K and potential energy V, that is, L = KV;

[0103] Then the joint torque τ is obtained by the Lagrange equation k :

[0104]

[0105] θ' represents the angular velocity, τ k Represents the control torque of the joint.

[0106] Combined with force feedback control, the accuracy and safety of grasping can be improved. The force sensor is installed at the end of the manipulator to detect the actual force F during grasping. actual In order to maintain a stable grasp, the control system needs to actual With the set gripping force F set For comparison, ΔF is used as the adjustment condition:

[0107] |F actual -F set |≤ΔF

[0108] If the allowable error ΔF is exceeded, the torque output is adjusted through PD or PID control:

[0109]

[0110] Make the control process have good dynamic response.

[0111] In the positioning and visual recognition process, the camera and image processing technology are combined to achieve real-time recognition and calibration of the sample position and posture. The sample recognition steps include image acquisition, preprocessing, edge detection (using the Canny algorithm), and finding the exact position of the sample through template matching.

[0112] When performing grasping and placing tasks, the robot needs to perform actions accurately according to the calculated path and torque. During the sample grasping process, the robot first determines the grasping point through vision, calculates the grasping posture using inverse kinematics, and approaches the sample at a low speed to ensure stability. During the movement to the target equipment such as an oven or polishing machine, the path needs to be continuously monitored and dynamically adjusted based on sensor feedback. In the final placement stage, the robot needs to slowly reduce the speed V to near zero to reduce impact and ensure that the sample is safely, securely and accurately placed in place.

[0113] The entire process of these links is coordinated and monitored by the integrated PLC system, which describes the control logic through the state machine, sets different states and transfer conditions, and adjusts the tasks and parameter settings of each submodule in real time. Through continuous sensor data feedback, the system can respond quickly in abnormal situations and make adjustments to speed, direction and torque to ensure the reliability and safety of operations. The rigorous design and implementation of this system ensures that the robot can operate with high precision and efficiency in complex environments.

[0114] Example 2

[0115] The device for implementing the method described in Example 1 includes a grinding device 1 and a polishing device 2. The grinding device 1 includes a grinding disc assembly 101, a drive motor 102, a grinding pressure regulating mechanism 103 and an automatic water and sand adding system 104; the grinding disc assembly 101 specifically includes a grinding disc made of a high-strength alloy, and its surface is covered with a wear-resistant coating to extend its service life. The grinding disc is connected to the drive motor 102 through a connecting shaft, and the drive motor 102 controls its rotation speed to adapt to different grinding requirements; the grinding pressure regulating mechanism 103 uses hydraulic or mechanical devices to mechanically connect the lever to the grinding disc to apply precise downward pressure to the grinding disc. The automatic water and sand adding system 104 includes a stainless steel water tank, an aluminum sanding silo, a transmission pipeline made of corrosion-resistant plastic material, and an electronic valve controlled by a single-chip microcomputer. These components are fixed to the frame of the grinding device 1 through precision accessories and sealing connectors, and are connected to the central control system by a control cable to achieve precise distribution of grinding media.

[0116] The polishing equipment 2 includes a polishing disc 201, a lubricating liquid adding system 202 and a polishing drive system 203; the polishing disc 201 is connected to a brushless motor provided in the polishing drive system 203 through a wear-resistant gear, and the brushless motor provides a constant and stable torque; the lubricating liquid adding system 202 is composed of a stainless steel liquid storage tank, a metering pump, a rubber pipe and a precision nozzle, and the nozzle is installed in a matrix form above the polishing disc 201, and the flow rate and distribution of the lubricating liquid are controlled by an electromagnetic valve to ensure the uniformity of the polishing stage.

[0117] The single-chip control system integrates a multi-layer circuit board, an ARM processor, a data acquisition module, and a communication interface module; the embedded software runs on the microcontroller of the single-chip computer, which is responsible for processing sensor input, executing control algorithms, and forming a closed-loop feedback to adjust mechanical operations.

[0118] The thickness detection equipment uses a laser source and a receiver. The laser emits a beam to the sample surface, and the reflected light is captured by the receiver. The reflection time difference is measured through an optical lens and a high-precision CCD sensor to calculate the precise thickness of the sample. The signal line of the thickness sensor 4 is connected to the single-chip control system through a shielded cable to ensure that data transmission is not affected by external electromagnetic interference. The roughness sensor 5 uses a surface contact needle and a high-sensitivity position sensor to move along the sample surface, and calculates the roughness through the change of micro-displacement. The change is converted into a digital signal by an analog signal converter and transmitted to the control system.

[0119] The robot system 3 consists of a number of servo motor-driven mechanical arms, with high-precision force sensors and industrial cameras at the end. The joints of the robot are adjusted in real time by motor drivers and microcontrollers, and connected to the PLC system via cables. The force sensor transmits the force signal to the control system through an analog-to-digital converter to ensure the stability and safety of the grasping. The camera has a CMOS sensor, which analyzes the real-time image in combination with an image processor to confirm the exact position of the sample.

[0120] Example 3

[0121] The working steps of the device in Example 2 for executing the intelligent production process of metal mineral optical slices are as follows:

[0122] S1: Rough grinding

[0123] S1.1: Preparation:

[0124] Make sure the sample is prepared and in place.

[0125] Start the grinding device 1 and confirm that the grinding disc assembly 101, the driving motor 102, the grinding pressure adjustment mechanism 103 and the automatic water and sand adding system 104 are working normally.

[0126] S1.2: Initial grinding:

[0127] The single chip microcomputer system controls the sand-water ratio to 3:1, and uses a stainless steel water tank and an aluminum sanding silo to accurately add water and green silicon carbide abrasives. Ensure that the amount added is dynamically adjusted through the set formula.

[0128] S1.3: Grinding process:

[0129] The driving motor 102 is started to drive the grinding disc assembly 101 to start rotating.

[0130] The thickness T0 of the sample was monitored in real time using a thickness sensor, and the target thickness T was set to 3 cm.

[0131] The system adjusts the grinding time Δt and the grinding disc pressure according to the thickness difference.

[0132] S1.4: Termination of grinding:

[0133] When the thickness T≤3 cm, the sensor signal S(T) triggers the microcontroller to stop the grinding disc.

[0134] Drying treatment: grab the sample through the robot 3 and put it into the oven for drying for 20 minutes to ensure that the sample is not loose.

[0135] S2: Advanced and fine grinding

[0136] S2.1: Mode switch:

[0137] Switch the grinding machine to fine grinding mode and continue to use green silicon carbide.

[0138] S2.2: Fine grinding disc:

[0139] Reset target thickness to 2 cm.

[0140] Adjust the grinding plate pressure P, use the quadratic function relationship to optimize the pressure, and adjust the power according to the real-time thickness information.

[0141] S2.3: Plane processing:

[0142] When the thickness reaches the target, robot 3 grabs the sample and puts it into the oven for 20 minutes to dry without using glue.

[0143] S3: High-precision grinding disc processing

[0144] S3.1: High precision grinding disc:

[0145] Switch the grinding machine to high-precision mode and use white corundum micropowder, adding it in three stages.

[0146] The target thickness is between 0.9 and 1.2 cm, and the roughness H is ≤ 0.5 mm.

[0147] S3.2: Fine Adjustment:

[0148] Through thickness and roughness sensors, the grinding strategy is adjusted in real time to ensure that the surface smoothness and thickness of the sample meet high-precision standards.

[0149] S4: Polishing

[0150] S4.1: Polishing preparation:

[0151] The robot puts the sample after high-precision grinding into the polishing machine.

[0152] S4.2: Polishing operation:

[0153] The lubricating liquid adding system 202 is used to control the flow rate and distribution of the lubricating liquid to ensure that the sample surface is smooth.

[0154] The roughness sensor detects the roughness H of the sample. When H=0.5, the system is triggered to stop the polishing operation through the signal S(H).

[0155] S4.3: Finished product processing:

[0156] The robot grabs the polished sample and places it in a fixed position.

[0157] In this embodiment, the robot operation process includes:

[0158] Grasping: Use visual recognition technology to determine the position and posture of the sample.

[0159] Movement: According to the calculated path, the robot moves the sample to the target device (oven or polisher) at low speed and precision.

[0160] Placement: The robot slowly decelerates near the target position to ensure safe placement of the sample.

[0161] Feedback and adjustment: Real-time feedback from force sensors and vision systems, and dynamic adjustment by the PLC system ensure accurate and effective operations.

[0162] In summary, the present invention proposes a method for intelligent production of metal mineral optical slices, which uses a sensor system to monitor and adjust the detailed parameters of the grinding and polishing process in real time, ensuring the high consistency and high standard quality of the final product. The combined use of thickness and roughness sensors enables every key point in the production process to be monitored and adjusted in real time, greatly reducing the errors caused by human judgment.

[0163] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A method for intelligent grinding of metal mineral optical sheets, characterized in that: The following steps are involved: S1: The sample is roughly ground by adding water and sand, surface grinding, and plane processing operations, so that the sample is processed to a state close to the target thickness; S2: Perform advanced and detailed grinding of the sample using abrasive materials, use thickness sensors to monitor in real time, and modify the grinding pressure to adapt to different thicknesses; S3: The samples are subjected to high-precision grinding through regular grinding with grinding powder and fine detection of optical thickness. Thickness and roughness sensors are used in combination to ensure that the surface quality of the samples meets high standards. S4: When the thickness reaches the standard, the sample is polished and the surface smoothness of the sample is detected using a roughness sensor. When the specified smoothness is reached, the polishing machine stops working and a metal mineral slice that meets the requirements is obtained.

2. The method for intelligently polishing a metal mineral optical sheet as claimed in claim 1, characterized in that: The step S1 specifically includes the following sub-steps: S1.1: If the sample surface is in a dry state when it contacts the grinding disc, there may be damage and safety hazards, so it is essential to add a certain amount of water and abrasive during rough grinding. First, the sample is fully attached to the grinding disc of the grinding machine, and the grinding machine is started to work. The single-chip microcomputer system controls the addition of a certain amount of water and abrasive, and green silicon carbide is used as the abrasive, with a sand-water ratio of 3:

1. The thickness sensor is used to measure the sample thickness T0 in real time, and the target thickness T is set to 3 cm. A nonlinear function is used to describe the relationship between grinding time and thickness to more accurately control the grinding process. The formula is: Δt=α·(T0-T) β Where Δt is the time required for grinding, α is the basic time constant in the grinding process, which depends on the grinding efficiency of the equipment and is determined by experiments to be in the range of 0.1 to 1.0; β is an exponential parameter that determines the sensitivity of the grinding time to the thickness difference, which is between 1.2 and 2.0 to control the degree of response of time to thickness difference during the grinding process; When the thickness T satisfies T≤3 cm, the sensor signal S(T) triggers the microcontroller to stop the grinding disc; the amount of water and abrasive added is dynamically calculated through time and real-time thickness, and the formula is: W(t)=K1 e -λt G(t)=K2·(1-e -μT ) K1 represents the initial amount of water added, which is the basic amount of water required at the beginning of the grinding disc; K2 represents the initial amount of abrasive added, which affects the cutting ability during the grinding process; λ represents the time attenuation factor of the water volume, which is used to control the rate of water addition, and the value is between 0.01 and 0.1; μ is the reaction coefficient of abrasive addition to thickness, which affects the addition of abrasive at different thicknesses, and the value is between 0.1 and 0.5; when the thickness reaches the specified standard, the alarm set in the single-chip microcomputer system automatically sounds, and the single-chip microcomputer receives the signal and drives the motor to immediately stop the rotation of the grinding disc; S1.2: Since ore samples will become loose after absorbing too much water, in order to avoid the influence of water on the integrity and hardness of the samples, it is necessary to manually perform flat processing on the metal mineral samples after rough grinding; when step S1.1 is completed, the sample is grabbed by a robot and placed in the oven, glue is added to the surface of the sample and the temperature is increased and baked for 20 minutes, and then the dryness of the sample is checked. If it passes the test, the next step can be carried out.

3. The method for intelligently polishing a metal mineral optical sheet as claimed in claim 1, characterized in that: The step S2 specifically includes the following sub-steps: S2.1: Select the working mode of the grinding machine to switch it to the fine grinding mode. After receiving the instruction to start the grinding machine, the single chip microcomputer adds a certain amount of water and grinding sand to the grinding disc. Green silicon carbide continues to be used in the fine grinding stage, and the sand-water ratio is kept the same as that in the coarse grinding stage, that is, 3:1; then the motor is driven to rotate the grinding disc, and the thickness gauge starts working and detects the thickness of the sample in real time; the target thickness is reduced to 2 cm, and the system uses the thickness sensor to monitor in real time and modify the grinding pressure to adapt to different thicknesses; the grinding pressure P is adjusted using a quadratic function relationship: P(T)=γ·T 2 +δ·T+ε Where γ represents the sensitivity of the square term to control the pressure change, and its value is between 0.01 and 0.05; δ is the linear term coefficient, which reflects the direct effect of thickness change on pressure, and its value is between 0.5 and 2.0; ε is the constant term used to set the base pressure; When the thickness T satisfies T>2 cm, the grinding disc continues to operate; through the sensor signal S(T), when T reaches the target, the microcontroller sends a stop signal; S2.2: Use a robot to grab the sample and send it into the oven for planar processing. Bake it for 20 minutes. The difference from step S1.2 is that there is no need to add glue to fix the sample during the planar processing, because the sample will not be loose after processing in step S1.

4. The method for intelligently polishing a metal mineral optical sheet as claimed in claim 1, characterized in that: The step S3 specifically includes: the grinding machine is switched to a high-precision grinding mode, and the single-chip computer system drives the motor to rotate the grinding disc at a fixed low speed; in order to make the smoothness and thickness of the sample reach high-precision standards, corundum powder is used in the high-precision grinding stage, and the material is added in three stages to gradually improve the surface smoothness of the sample; the grinding disc rotates forward and reverse for a fixed time during the interval of adding abrasive powder each time to grind the sample; while the grinding machine is working, the thickness detector detects the thickness of the metal mineral sample in real time, and the target is that the sample thickness T is between 0.9 and 1.2 cm, and the roughness H is ≤ 0.5 mm; the thickness and roughness are measured during the grinding process through the functional relationship: T=T0·e -ηκ(t) Where η is the time attenuation coefficient of thickness change, which controls the thickness reduction rate; κ is the time function adjustment coefficient, which is used to control the processing rhythm; ζ is the factor that controls the roughness improvement rate; τ is the control parameter of the influence of time on roughness, which describes the thickness and roughness change trend with the advancement of time t; The system sets the logical judgment conditions as: (0.9≤T≤1.2) and H≤0.

5. When the conditions are met, the microcontroller stops the grinding operation.

5. The method for intelligently polishing a metal mineral optical sheet as claimed in claim 1, characterized in that: The step S4 specifically includes: using a manipulator to grab the sample after high-precision grinding and put it into a polishing machine, the single-chip computer system receives the signal and adds polishing lubricant to the polishing machine, and using a roughness sensor to detect the surface smoothness of the sample to ensure that the final roughness reaches or exceeds 0.5 mm; The amount of polishing lubricant added at this stage is calculated according to the nonlinear time function to ensure the polishing uniformity and effect: Among them, L0 is the initial addition amount, ν is the change rate factor of lubricant addition, which controls the initial addition speed of the lubricant and takes a value between 0.1 and 0.3; ξ is the exponential parameter of time, which adjusts the change curve of the addition rate and takes a value between 1.0 and 1.5; the sensor measures the surface roughness H, and when H=0.5, the alarm of the microcontroller system is triggered by the signal S(H) to automatically sound the alarm, and the microcontroller receives the stop signal and drives the motor to stop the polishing machine; the staff uses the robot to grab the sample and put it in a fixed position to obtain a metal mineral optical film that meets the requirements of process mineralogy.

6. The method for intelligently polishing a metal mineral optical sheet as claimed in claim 1, characterized in that: The specific working process of the manipulator includes: The manipulator uses forward kinematics to analyze the position and posture of the end of the manipulator when the joint angle is given, and is represented by a homogeneous transformation matrix, which is obtained by multiplying the rotation matrix and displacement matrix of multiple joints. Assuming that the manipulator has n joints, the transformation of each joint includes a rotation matrix and a translation matrix, and the end position P e The specific formula is: Where T k represents the translation matrix, R represents the rotation matrix, θ i is the angle of each joint; Dynamic control ensures that the operation of the manipulator is carried out within the physical constraints. The Lagrangian method is used to model the system. The Lagrangian function L is defined as the difference between kinetic energy K and potential energy V, that is, L = KV; Then the joint torque τ is obtained by the Lagrange equation k : θ' represents the angular velocity, τ k represents the control torque of the joint; Combined with force feedback control, the accuracy and safety of grasping can be improved. The force sensor is installed at the end of the manipulator to detect the actual force F during grasping. actual ; In order to maintain stable grasping, the control system needs to actual With the set gripping force F set For comparison, ΔF is used as the adjustment condition: F actual -F set |≤ΔF If the allowable error ΔF is exceeded, the torque output is adjusted through PD or PID control: Make the control process have good dynamic response; In the positioning and visual recognition process, the camera and image processing technology are combined to achieve real-time recognition and calibration of the sample's position and posture; the sample recognition steps include image acquisition, preprocessing, edge detection, and finding the precise position of the sample through template matching; When performing grasping and placing tasks, the robot needs to accurately perform actions according to the calculated path and torque; during the sample grasping process, the robot first determines the grasping point through vision, calculates the grasping posture using inverse kinematics, and approaches the sample at a low speed to ensure stability; when moving to the target equipment such as an oven or polishing machine, the path needs to be continuously monitored and dynamically adjusted based on sensor feedback; in the final placement stage, the robot needs to slowly reduce the speed V to near zero to reduce impact and ensure that the sample is placed safely, securely and accurately.

7. A device for implementing the method according to any one of claims 1 to 6, characterized in that: The invention comprises a grinding device (1) and a polishing device (2), wherein the grinding device (1) comprises a grinding disc assembly (101), a driving motor (102), a grinding pressure regulating mechanism (103) and an automatic water and sand adding system (104); the grinding disc assembly (101) specifically comprises a grinding disc made of a high-strength alloy, the surface of which is covered with a wear-resistant coating to extend the service life; the grinding disc is connected to the driving motor (102) via a connecting shaft, and the driving motor (102) controls its rotation speed to adapt to different grinding requirements; the grinding pressure regulating mechanism (103) uses a hydraulic or mechanical device to apply precise downward pressure to the grinding disc through a mechanical connection between a lever and the grinding disc; the automatic water and sand adding system (104) comprises a stainless steel water tank, an aluminum grinding silo, a transmission pipeline made of corrosion-resistant plastic material, and an electronic valve controlled by a single-chip microcomputer, and these components are fixed to the frame of the grinding device (1) through precision fittings and sealing connectors, and are connected to a central control system by a control cable to achieve precise distribution of grinding media.

8. The device according to claim 7, characterized in that: The polishing device (2) comprises a polishing disc (201), a lubricating liquid adding system (202) and a polishing drive system (203); the polishing disc (201) is connected to a brushless motor provided in the polishing drive system (203) via a wear-resistant gear, and the brushless motor provides a constant and stable torque; the lubricating liquid adding system (202) is composed of a stainless steel liquid storage tank, a metering pump, a rubber pipe and a precision nozzle, and the nozzle is installed in a matrix form above the polishing disc (201), and the flow rate and distribution of the lubricating liquid are controlled by an electromagnetic valve to ensure uniformity in the polishing stage.

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