Device for generating differential signal wiring of SMD high-speed connector

Abstract

The invention discloses an SMD (Surface Mount Device) high-speed connector differential signal routing generation device, which is used for obtaining element demand information of a high-speed connector, obtaining via hole demand information of a high-speed signal via hole, dividing a differential signal routing into a plurality of fixed line segments, and setting parameters of each line segment, the parameter, the element demand information and the via hole demand information of each line segment of the differential signal line are substituted into a simulation program, a simulation demand is input, a simulation result is obtained, the parameter, the element demand information and the via hole demand information of each line segment of the differential signal line are analyzed and obtained according to the simulation result, and a functional module of a PCB design program is called. And automatically generating a differential signal line. The invention provides an SMD high-speed connector differential signal routing generation device, which greatly reduces the workload of PCB designers and improves the generation efficiency and the precision of differential signal routing.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB design, and more specifically, to a device for generating differential signal routing of an SMD high-speed connector. Background Art

[0002] SMD (Surface Mount Device) high-speed connectors are components used for fast and efficient data transmission between electronic devices. They are commonly used in computers, communication equipment, and other high-performance electronic systems to achieve high-speed data exchange. The characteristic of SMD connectors is that they can be directly mounted on the surface of the printed circuit board (PCB) instead of the traditional perforation mounting method. This mounting method makes SMD connectors more compact, space-saving, and easy to automate production. SMD high-speed connectors are widely used in various high-speed data transmission interfaces, such as LVDS, IEEE1394, and USB2.0. These interfaces usually require higher data transmission rates and lower bit error rates, and SMD high-speed connectors are the ideal choice to meet these requirements.

[0003] High-speed differential signal is a signal transmitted on two parallel wires, which are called differential pairs. This signal transmission method has the advantages of strong anti-interference ability and good noise immunity, so it is very suitable for high-speed data transmission. In SMD high-speed connectors, differential signal can effectively reduce electromagnetic interference and improve signal integrity and reliability.

[0004] In the prior art, the differential signal routing of high-speed connectors is mostly routed by manual drawing, which results in a large workload for PCB designers. Manual operation is prone to errors, and the accuracy of the drawn differential signal routing is low, resulting in low PCB design efficiency and poor quality. Summary of the invention

[0005] In order to solve the problem that the differential signal routing of the existing high-speed connector is manually drawn, the present invention provides a device for generating the differential signal routing of the SMD high-speed connector, which greatly reduces the workload of PCB designers and improves the generation efficiency and accuracy of the differential signal routing.

[0006] The technical solution of the present invention is as follows:

[0007] A device for generating differential signal routing of an SMD high-speed connector,

[0008] Get component requirements information for high-speed connectors,

[0009] Obtain via requirement information for high-speed signal vias,

[0010] Divide the differential signal routing into a fixed number of segments and set the parameters of each segment.

[0011] Substitute the parameters of each line segment of the differential signal routing, component requirement information, and via requirement information into the simulation program, input the simulation requirements, and obtain the simulation results.

[0012] According to the simulation results, the parameters of each line segment of the differential signal routing, component requirement information, and via requirement information are obtained, and the functional module of the PCB design program is called to automatically generate the differential signal routing.

[0013] In the above-mentioned device for generating differential signal routing of an SMD high-speed connector, the parameters of each line segment of the differential signal routing include line width, arc radius, starting point coordinates, ending point coordinates, and arc direction.

[0014] In the above-mentioned device for generating differential signal routing of an SMD high-speed connector, the simulation program performs simulation based on the equal length and impedance balance within the differential signal routing as simulation requirements.

[0015] The equal length of the differential signal traces means that the lengths of the two differential signal traces in a differential pair should be as equal as possible. Since the differential signal is transmitted through a pair of wires, the signal on one wire is an inverted version of the signal on the other wire. In order to ensure that the two signals can reach the receiving end at the same time and maintain the correct phase relationship with each other, the electrical lengths of the two traces must be the same. If the lengths are inconsistent, it will lead to time delay differences between the signals, which will affect the quality of the signal and produce the so-called "skew" problem, which may cause data errors or reduce the overall performance of the system.

[0016] Impedance balance of differential signal traces means that the two differential signal traces in a differential pair need to have the same characteristic impedance. Characteristic impedance is a parameter related to the signal transmission line, which determines the ratio of voltage to current when the signal propagates along the line. Unbalanced impedance can cause signal reflection and increase signal distortion, thus affecting signal quality. In addition, unbalanced impedance may also lead to an increase in common-mode to differential-mode noise, further affecting signal integrity. In order to achieve impedance balance, PCB designers usually use specific layout rules, such as controlling trace width, spacing, and distance from the reference plane.

[0017] The above-mentioned device for generating differential signal routing of an SMD high-speed connector presets the segment shape and structure of the differential signal routing, so that the parameters of only one segment of the differential signal routing and the position-related parameters of the remaining segments of the differential signal routing are in an undetermined state.

[0018] In this way, when the simulation program is running, its simulation content only includes the position of the differential signal routing and the parameters of a section of the differential signal routing segment, and the segment of the differential signal routing segment is subject to the fixed parameters of the remaining differential signal routing segments (such as line width, arc radius, and arc direction determination), so that the parameter variation range of the differential signal routing segment in an uncertain state is limited, which reduces the simulation workload, speeds up the simulation speed, and improves the efficiency of PCB design.

[0019] Since there are preset line segments of differential signal routing, the relevant parameter data of the preset line segments of differential signal routing form a fixed data packet. In the process of generating the differential signal routing, the generating device calls the content of the fixed data packet, replaces the data in the fixed data packet in an undetermined state with the simulation result data, calls the preset function module of the PCB design program, and generates the differential signal routing according to the content of the newly formed data packet.

[0020] In the above-mentioned device for generating differential signal routing of an SMD high-speed connector, the component requirement information includes the location information and model information of the high-speed connector.

[0021] In the above-mentioned device for generating differential signal routing of an SMD high-speed connector, the via requirement information includes the position information of the high-speed signal via.

[0022] The above-mentioned device for generating differential signal traces of an SMD high-speed connector comprises two parallel PCB traces.

[0023] The differential signal routing is divided into six segments, including the differential routing zero segment, the differential routing first segment, the differential routing second segment, the differential routing third segment, the differential routing fourth segment, and the differential routing fifth segment. The ends of the two segments in any differential routing segment are flush.

[0024] The zeroth line segment of the differential routing, the first line segment of the differential routing, the second line segment of the differential routing, the third line segment of the differential routing, the fourth line segment of the differential routing, and the fifth line segment of the differential routing are connected in the above order.

[0025] The endpoint of the zeroth line segment of the differential trace is connected to the high-speed signal via, and the endpoint of the fifth line segment of the differential trace is connected to the high-speed signal pad of the high-speed connector.

[0026] Furthermore, one of the ground vias of the ground pad of the high-speed connector is located on an axially symmetrical line between two differential signal traces.

[0027] Furthermore, the connection point between the fourth line segment of the differential trace and the fifth line segment of the differential trace and the ground via of the ground pad of the high-speed connector are all located on the same straight line.

[0028] Furthermore, the fifth line segment of the differential trace is a straight line segment connecting the high-speed signal pad.

[0029] The fourth line segment of the differential trace connects the fifth line segment of the differential trace and tends to converge.

[0030] The third line segment of the differential routing is a transition line segment between the fourth line segment of the differential routing and the second line segment of the differential routing.

[0031] The second line segment of the differential routing is a changing line segment, and the second line segment of the differential routing is affected by the simulation results.

[0032] The zeroth line segment of the differential trace is the lead-out line segment from the high-speed signal via.

[0033] The first line segment of the differential line is a transition line segment between the second line segment of the differential line and the zeroth line segment of the differential line.

[0034] Furthermore, four ground vias are arranged around the high-speed signal via, and the ground vias are distributed in a quadrilateral vertex structure.

[0035] Furthermore, the ground pad of the high-speed connector is arranged side by side with the high-speed signal pad of the high-speed connector, and a ground via is arranged at one end of the ground pad close to the high-speed signal pad.

[0036] Furthermore, a ground via is provided on the central axis between the ground pads of the high-speed connector, and the ground via and a connection point between the fourth line segment of the differential trace and the fifth line segment of the differential trace are located on the same straight line.

[0037] Furthermore, the high-speed connector is an axisymmetric structure.

[0038] Furthermore, the differential signal routing is an axisymmetric structure.

[0039] Furthermore, the spacing between the two PCB traces of the second line segment of the differential trace is smaller than the spacing between the line segments of all other differential signal traces.

[0040] The present invention according to the above scheme has the beneficial effect that:

[0041] 1. Simplify the design content of differential signal routing. The routing of differential signal routing can be automatically completed according to the input or completed PCB design in the previous steps, which greatly reduces the workload of designers, improves the efficiency of PCB design, and reduces errors.

[0042] 2. The differential signal routing is combined with simulation, so that the simulation results can be directly used as the design requirement information of the differential signal routing, and the differential signal routing is automatically generated according to the preset differential signal routing design structure, simplifying the PCB design.

[0043] 3. The preset differential signal routing structure makes the structure of the differential signal routing standardized and normalized, which is convenient for identification and subsequent inspection and confirmation. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0045] Figure 1 Schematic diagram of the differential signal routing structure of the present invention Figure 1 .

[0046] Figure 2 Schematic diagram of the differential signal routing structure of the present invention Figure 2 .

[0047] Figure 3 Schematic diagram of the differential signal routing structure of the present invention Figure 3 .

[0048] Among them, the reference numerals in the figure are:

[0049] 01. First endpoint; 02. Second endpoint; 03. Third endpoint; 04. Fourth endpoint; 05. Fifth endpoint; 06. Sixth endpoint; 07. Seventh endpoint; 08. Eighth endpoint; 09. Ninth endpoint;

[0050] 10. The zeroth line segment of the first differential signal routing; 11. The first line segment of the first differential signal routing; 12. The second line segment of the first differential signal routing; 13. The third line segment of the first differential signal routing; 14. The fourth line segment of the first differential signal routing; 15. The fifth line segment of the first differential signal routing;

[0051] 20. The zeroth line segment of the second differential signal routing; 21. The first line segment of the second differential signal routing; 22. The second line segment of the second differential signal routing; 23. The third line segment of the second differential signal routing; 24. The fourth line segment of the second differential signal routing; 25. The fifth line segment of the second differential signal routing;

[0052] 31. Ground pad; 32. High-speed signal pad. DETAILED DESCRIPTION

[0053] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0054] A device for generating differential signal routing of an SMD high-speed connector obtains component requirement information of a high-speed connector, obtains via requirement information of a high-speed signal via, divides the differential signal routing into a fixed number of segment lines, sets parameters of each segment, substitutes the parameters of each segment of the differential signal routing, component requirement information, and via requirement information into a simulation program, inputs simulation requirements, obtains simulation results, obtains parameters of each segment of the differential signal routing, component requirement information, and via requirement information according to analysis of the simulation results, calls a functional module of a PCB design program, and automatically generates differential signal routing.

[0055] The present invention performs graphic analysis on high-speed differential signal wiring design graphics, converts the differential signal routing into an analytical formula that can be calculated, the analytical formula contains parameters of each line segment, and through simulation and calculation, the parameters in the analytical formula are determined. According to the determined parameters of the analytical formula, the function module of the called PCB design program automatically generates the differential signal routing.

[0056] The generated differential signal traces are as follows Figure 1 As shown, the present invention divides the differential signal routing into six line segments. For two pairs of differential signal routing, there are six groups of differential line segments in total, and the ends of each group of line segments are flush.

[0057] The first differential signal trace is Figure 1 The first differential signal routing includes the first differential signal routing first segment 11, the first differential signal routing second segment 12, the first differential signal routing third segment 13, the first differential signal routing fourth segment 14, the first differential signal routing fifth segment 15, and the first differential signal routing zero segment 10. The first differential signal routing zero segment 10 is connected to the first differential signal routing first segment 11 and the connection point between the two is the first connection point of the differential signal routing. The first differential signal routing first segment 11 is connected to the first differential signal routing second segment 12. The connection point between the two is the second connection point of the first differential signal routing, the second line segment 12 of the first differential signal routing is connected to the third line segment 13 of the first differential signal routing and the connection point between the two is the third connection point of the first differential signal routing, the third line segment 13 of the first differential signal routing is connected to the fourth line segment 14 of the first differential signal routing and the connection point between the two is the fourth connection point of the first differential signal routing, the fourth line segment 14 of the first differential signal routing is connected to the fifth line segment 15 of the first differential signal routing and the connection point between the two is the fifth connection point of the first differential signal routing.

[0058] Assume the second differential signal routing is Figure 1The second differential signal routing on the right side of the middle includes the first line segment 21 of the second differential signal routing, the second line segment 22 of the second differential signal routing, the third line segment 23 of the second differential signal routing, the fourth line segment 24 of the second differential signal routing, the fifth line segment 25 of the second differential signal routing, and the zeroth line segment 20 of the second differential signal routing. The zeroth line segment 20 of the second differential signal routing is connected to the first line segment 21 of the second differential signal routing, and the connection point between the two is the first connection point of the differential signal routing. The first line segment 21 of the second differential signal routing is connected to the second line segment 22 of the second differential signal routing. The connection point between the two is the second connection point of the second differential signal routing, the second differential signal routing second line segment 22 is connected to the second differential signal routing third line segment 23 and the connection point between the two is the second differential signal routing third connection point, the second differential signal routing third line segment 23 is connected to the second differential signal routing fourth line segment 24 and the connection point between the two is the second differential signal routing fourth connection point, the second differential signal routing fourth line segment 24 is connected to the second differential signal routing fifth line segment 25 and the connection point between the two is the second differential signal routing fifth connection point.

[0059] Assume that the position of the high-speed connector is fixed. For the high-speed connector, its own ground pad 31 and high-speed signal pad 32 are fixed. The high-speed signal pad 32 is connected to the fifth line segment of the differential signal routing, that is, the fifth line segment 15 of the first differential signal routing is connected to the high-speed signal pad 32 on the left side of the high-speed connector, and the fifth line segment 25 of the second differential signal routing is connected to the high-speed signal pad 32 on the right side of the high-speed connector. On the other hand, the top endpoints of the ground pad 31 of the high-speed connector, that is, the first ground via and the second ground via of the high-speed connector, and the midpoint of the line connecting the first ground via and the second ground via are provided with a third ground via. Assume that the first ground via is the fifth endpoint 05, the third ground via is the sixth endpoint 06, and the second ground via is the seventh endpoint 07. For the high-speed connector, its position is fixed, so that the position of the ground pad 31 and the high-speed signal pad 32 is fixed. In the actual design process, the pad size and dimension of the high-speed connector are also fixed values, that is, the position of the first ground via, the second ground via, and the third ground via are fixed (meaning that the coordinate values ​​X and Y are fixed), which also means that the position and coordinate values ​​of the fifth endpoint 05, the sixth endpoint 06, and the seventh endpoint 07 are fixed. When designing, the position and model of the high-speed connector are input to obtain the coordinate values ​​of the fifth endpoint 05, the sixth endpoint 06, and the seventh endpoint 07 (if only the position of the high-speed connector is determined, that is, only the X values ​​of the fifth endpoint 05, the sixth endpoint 06, and the seventh endpoint 07 are determined, and the Y value is affected by the model and size of the high-speed connector and is not determined, wherein the X coordinate of the sixth endpoint 06 is the X coordinate of the midpoint of the high-speed connector).

[0060] The high-speed connector is connected to the high-speed signal via through a differential signal trace, and the two high-speed signal vias are connected to the high-speed signal pad 32 of the high-speed connector through the first differential signal trace and the second differential signal trace respectively. Four ground vias with quadrilateral vertex distribution are arranged around the two high-speed signal vias. Let the high-speed signal via on the left be the eighth terminal 08, and the high-speed signal via on the right be the ninth terminal 09. The four ground vias are respectively the first terminal 01, the second terminal 02, the third terminal 03, and the fourth terminal 04. The first terminal 01 is located at the upper left, the second terminal 02 is located at the upper right, the third terminal 03 is located at the lower left, and the fourth terminal 04 is located at the lower right. According to the PCB design requirements, the setting positions of the high-speed signal via and the ground vias around it depend on the PCB design drawing, which means that when determining the differential signal trace, the positions of the high-speed information via and the ground vias around it are fixed and belong to known conditions.

[0061] According to the above structural features, for each graphic, the coordinate and parameter information in the PCB design software is as follows.

[0062] For each line segment of the differential signal routing, the parameters include line width, arc radius (a straight line is formed when the arc radius is zero), starting point coordinates, ending point coordinates, and arc direction (i.e., the clockwise direction is the positive direction).

[0063] For the paired differential signal traces, the axis lines thereof both pass through the sixth endpoint 06 .

[0064] According to the graphic features, the two ends of the third segment of the differential signal routing are tangent to the second segment of the differential signal routing and the fourth segment of the differential signal routing, respectively, and the first segment of the differential signal routing is tangent to the zeroth segment of the differential signal routing and the second segment of the differential signal routing, respectively. In other words, one end of the third segment 13 of the first differential signal routing is tangent to the fourth segment 14 of the first differential signal routing, the other end of the third segment 13 of the first differential signal routing is tangent to the second segment 12 of the first differential signal routing, and one end of the first segment 11 of the first differential signal routing is tangent to the fourth segment 14 of the first differential signal routing. One end of the third line segment 23 of the second differential signal line is tangent to the second line segment 24 of the second differential signal line, the other end of the third line segment 23 of the second differential signal line is tangent to the second line segment 22 of the second differential signal line, one end of the first line segment 21 of the second differential signal line is tangent to the second line segment 22 of the second differential signal line, and the second differential signal line is tangent to the zeroth line segment 20 of the second differential signal line.

[0065] In addition, the fifth section of the differential signal routing should be connected to the high-speed signal pad 32 of the high-speed connector, and the other parts of the differential signal routing should be arranged above the ground pad 31 of the high-speed connector. Therefore, the connection point between the fourth section of the differential signal routing and the fifth section of the differential signal routing should be flush with the ground via of the high-speed connector, that is, the Y coordinate value of the connection point between the fourth line segment 14 of the first differential signal routing and the fifth line segment 15 of the first differential signal routing is equal to the Y coordinate value of the connection point between the fourth line segment 24 of the second differential signal routing and the fifth line segment 25 of the second differential signal routing, and are all equal to the Y coordinate values ​​of the fifth endpoint 05, the sixth endpoint 06, and the seventh endpoint 07.

[0066] When the position and model of the high-speed connector are determined, the coordinates of the fifth endpoint 05, the sixth endpoint 06, and the seventh endpoint 07 are determined (X value is determined, Y value is determined); when the position and model of the high-speed connector are determined, the X coordinates of the fifth endpoint 05, the sixth endpoint 06, and the seventh endpoint 07 are determined, and the Y coordinates are not determined. The Y coordinate values ​​of the fifth endpoint 05, the sixth endpoint 06, and the seventh endpoint 07 are all equal.

[0067] The high-speed signal via and the ground vias around it are manually set or required by PCB design, that is, when it is necessary to determine the differential signal routing, the position of the high-speed signal via and the ground vias around it is determined (X value determined, Y value determined). In the present invention, the structure and position information of the high-speed signal via and the ground vias around it can be obtained through the simulation results of the PCB design requirements or manually set.

[0068] The positions of each endpoint, such as the first endpoint 01, the second endpoint 02, the third endpoint 03, the fourth endpoint 04, the fifth endpoint 05, the sixth endpoint 06, the seventh endpoint 07, the eighth endpoint 08 and the ninth endpoint 09, can be determined by design requirements (such as manually set positions or the positions and models of high-speed connectors based on PCB design requirements) or simulation results of other PCB design contents (such as simulation results of high-speed signal via positions obtained by simulating other demand factors).

[0069] For each line segment of the differential signal routing, the endpoint of the zeroth line segment of the differential signal routing coincides with the high-speed signal via, and the endpoint of the fifth line segment of the differential signal routing is also connected to the high-speed signal pad 32 of the high-speed connector. According to the connection rules, when the position and model of the high-speed connector are determined, the endpoint position of the fifth line segment of the differential signal routing is also determined.

[0070] Based on the above known content, the parameters of each line segment of the differential signal routing are substituted into the simulation running program, with equal length and impedance balance as the simulation requirements, and the parameters of each line segment of the differential signal routing are determined, including line width, arc radius, starting point coordinates, ending point coordinates, and arc direction.

[0071] In one embodiment, in a PCB design drawing of the same design requirement, except for the second line segment of the differential signal routing, the rest of the differential signal routing parts can be a fixed structure, whose line width, arc radius and arc direction are all equal. By copying, such differential signal routing is copied to any required position, thereby determining the part except the second line segment of the differential signal routing, and the second line segment of the differential signal routing is obtained by simulation, and it is required that the second line segment of the differential signal routing needs to avoid the existing components in the PCB design drawing, that is, the second line segment 12 of the first differential signal routing and the second differential signal routing. The second line segment 22 of the differential signal routing presents any shape according to the simulation requirements, and the parameters of the other first differential signal routing line segment 11, the third line segment 13, the fourth line segment 14, the fifth line segment 15, the zeroth line segment 10, the first line segment 21, the third line segment 23, the fourth line segment 24, the fifth line segment 25, and the zeroth line segment 20 of the first differential signal routing at different positions and different differential signal routings are the same. Figure 2 , Figure 3 As shown, the second line segment 12 of the first differential signal routing and the second line segment 22 of the second differential signal routing are extended and bent as required to avoid existing electronic components while meeting the conditions of equal length and balanced impedance within the pair.

[0072] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A device for generating differential signal routing of an SMD high-speed connector, characterized in that: Get component requirements information for high-speed connectors, Obtain via requirement information for high-speed signal vias, Divide the differential signal routing into a fixed number of segments and set the parameters of each segment. Substitute the parameters of each line segment of the differential signal routing, component requirement information, and via requirement information into the simulation program, input the simulation requirements, and obtain the simulation results. According to the simulation results, the parameters of each line segment of the differential signal routing, component requirement information, and via requirement information are obtained, and the functional module of the PCB design program is called to automatically generate the differential signal routing.

2. A device for generating differential signal routing of an SMD high-speed connector according to claim 1, characterized in that: The parameters of each line segment of the differential signal routing include line width, arc radius, starting point coordinates, ending point coordinates, and arc direction.

3. A device for generating differential signal routing of an SMD high-speed connector according to claim 1, characterized in that: The simulation program performs simulation based on the equal length and impedance balance within the differential signal routing pair as the simulation requirements.

4. A device for generating differential signal routing of an SMD high-speed connector according to claim 1, characterized in that: The line segment shape and structure of the differential signal routing are preset so that only the parameters of the line segment of one section of the differential signal routing and the position-related parameters of the line segments of the other differential signal routing are in an undetermined state.

5. The device for generating differential signal routing of an SMD high-speed connector according to claim 1, characterized in that: The component requirement information includes the location information and model information of the high-speed connector.

6. A device for generating differential signal routing of an SMD high-speed connector according to claim 1, characterized in that: The via requirement information includes the location information of the high-speed signal vias.

7. The device for generating differential signal routing of an SMD high-speed connector according to claim 1, characterized in that: The differential signal routing is two parallel PCB routing lines. The differential signal routing is divided into six segments, including the differential routing zero segment, the differential routing first segment, the differential routing second segment, the differential routing third segment, the differential routing fourth segment, and the differential routing fifth segment. The ends of the two segments in any differential routing segment are flush. The zeroth line segment of the differential routing, the first line segment of the differential routing, the second line segment of the differential routing, the third line segment of the differential routing, the fourth line segment of the differential routing, and the fifth line segment of the differential routing are connected in the above order. The endpoint of the zeroth line segment of the differential trace is connected to the high-speed signal via, and the endpoint of the fifth line segment of the differential trace is connected to the high-speed signal pad of the high-speed connector.

8. A device for generating differential signal routing of an SMD high-speed connector according to claim 7, characterized in that: One of the ground vias of the ground pad of the high-speed connector is located on the axisymmetric line of the two differential signal traces.

9. A device for generating differential signal routing of an SMD high-speed connector according to claim 7, characterized in that: A connection point between the fourth line segment of the differential trace and the fifth line segment of the differential trace and a ground via of a ground pad of the high-speed connector are all located on the same straight line.

10. The device for generating differential signal routing of an SMD high-speed connector according to claim 7, characterized in that: The fifth line segment of the differential trace is a straight line segment connecting the high-speed signal pad. The fourth line segment of the differential trace connects the fifth line segment of the differential trace and tends to converge. The third line segment of the differential routing is a transition line segment between the fourth line segment of the differential routing and the second line segment of the differential routing. The second line segment of the differential trace is a variable line segment, and the shape of the second line segment of the differential trace is affected by the simulation results. The zeroth line segment of the differential trace is the lead-out line segment from the high-speed signal via. The first line segment of the differential trace is a transition line segment between the second line segment of the differential trace and the first line segment of the differential trace.

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