A fully automated semiconductor test probe device

Abstract

This invention discloses a fully automated semiconductor testing probe device, including a support stage, a transport component, a rotating component, a telescopic component, and a driving component. The rotating component is located in the middle of the support stage, the transport component is located behind the rotating component, a test stage is located to the right of the rotating component, and an output stage is located in front of the rotating component. Stacked wafers to be tested are arranged inside the transport component, and the telescopic component is located inside the rotating component. When the output end of the rotating component rotates to the bottom of the transport component, the telescopic component reciprocates and drives the wafer at the bottom of the transport component to slide out of the transport component. The rotating component continues to rotate to the top of the test stage, and the telescopic component drives the wafer to slide to the top of the test stage. After the test is completed, the rotating component and the telescopic component drive the wafer to slide to the top of the output stage.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and in particular to a fully automated semiconductor testing probe device. Background Technology

[0002] A fully automated test probe device is an instrument used to measure the resistance characteristics of semiconductor materials. It typically consists of four probes, and the movement and measurement of the probes are controlled by a computer. It can automatically complete the measurement of the resistance characteristics of the material under test. Fully automated test probe devices are widely used in semiconductor, electronics, new energy and other fields, especially in the measurement and quality control of the resistance characteristics of materials such as solar cells and semiconductor devices.

[0003] However, although existing fully automated semiconductor test probe equipment does not require manual operation during the testing process, testers still need to manually place the wafers on the test table before and after each test, and also manually remove the tested wafers. When there are many wafers to be tested, this results in a high workload for the testers and affects the testing efficiency of the wafers.

[0004] Therefore, a fully automated semiconductor test probe device is proposed that automatically outputs the wafer to be tested. Summary of the Invention

[0005] The purpose of this invention is to provide a fully automated semiconductor test probe device to solve the technical problem that existing test devices cannot automatically input and output wafers.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A fully automated semiconductor testing probe device includes a support stage, a transport component, a rotating component, a telescopic component, and a drive component. The rotating component is located in the middle of the support stage, the transport component is located behind the rotating component, a test stage is located to the right of the rotating component, and an output stage is located in front of the rotating component. Stacked wafers to be tested are arranged inside the transport component, and the telescopic component is located inside the rotating component. When the output end of the rotating component rotates to the bottom of the transport component, the telescopic component reciprocates and drives the wafer at the bottom of the transport component to slide out of the transport component. The rotating component continues to rotate to the top of the test stage, and the telescopic component drives the wafer to slide to the top of the test stage. After the test is completed, the rotating component and the telescopic component drive the wafer to slide to the top of the output stage.

[0008] Further, the transport assembly includes a housing, transport shafts, transport gears, and chain units; the housing is connected to the top of the support platform, and two sets of transport shafts are rotatably mounted on the front and rear walls of the housing. Two vertically mounted transport shafts form one set. Transport gears are fixedly sleeved on the outer sides of each transport shaft, and chain units are wound around the outer sides of each transport gear at both ends. The chain units mesh with the transport gears via gear engagement, and a wafer is positioned between the chain units on both sides. Each chain unit includes a blocking plate, an outer support plate, an inner support plate, a connecting shaft, and a transport roller. The end of the outer support plate corresponds to the beginning of the inner support plate and is rotatably connected to the transport roller via the connecting shaft. The inner and outer support plates are arranged alternately. The two adjacent transport rollers of the transport gear mesh with the teeth of the transport gear. Multiple outer support plates and inner support plates together form a vertical chain unit and mesh with the transport gear. The outer support plates and inner support plates are fixedly connected to the blocking plates on the side away from the corresponding transport gear. The blocking plates are arranged perpendicularly to the corresponding outer support plates or inner support plates. The wafers are stacked sequentially on the tops of the blocking plates at both ends near the middle of the wafer. The chain units at both ends rotate in opposite directions. When the transport shaft drives the transport gear to rotate, the transport gear drives the blocking plates and outer support plates to slide down through the transport rollers, thereby realizing the automatic downward movement of the wafer.

[0009] Furthermore, the rotating assembly includes a rotating cavity, a rotating sleeve, and a rotating gear; the rotating cavity is provided on the top of the support platform, the rotating sleeve is fixedly connected to the bottom of the rotating cavity, the bottom of the rotating sleeve extends into the interior of the support platform and is fixedly connected to the rotating gear, and the driving assembly realizes the intermittent rotation of the rotating cavity by ninety degrees through the rotating gear.

[0010] Further, the sliding assembly includes an extension rod, a sliding ring, a fixing key, a rotating disk, and a sliding groove; the rotating disk is rotatably connected inside the rotating cavity, the fixing key is fixedly installed on the top of the rotating disk, the sliding ring is slidably disposed on the top of the rotating disk, the fixing key is slidably disposed inside the sliding ring, the extension rod is fixedly connected to the sliding ring, the rotating cavity has the sliding groove corresponding to the extension rod, the end of the extension rod away from the sliding ring extends out of the rotating cavity through the sliding groove, and the output end of the extension rod has a semi-circular groove, the diameter of the semi-circular groove being equal to the diameter of the test stage and the output stage, the top of the extension rod being used to transport the wafer; the driving assembly drives the extension rod to reciprocate and slide inside the sliding groove through the rotation of the rotating disk.

[0011] Furthermore, the driving assembly includes a driving gear, a driving shaft, and a motor; the motor is fixedly mounted on the bottom of the wafer, the output end of the motor is fixedly connected to the driving shaft, the driving gear is sleeved on the outside of the driving shaft, the driving gear is set as a quarter gear, the rotating gear is set as a full gear, and the rotating gear and the driving gear are connected by gear meshing.

[0012] Furthermore, the drive assembly also includes a sliding gear, a driven gear, and a driven shaft; the driven shaft is rotatably connected inside the wafer, the driven gear is sleeved on the outer side of the bottom of the driven shaft, the drive shaft is provided with a sliding gear corresponding to the driven gear, the sliding gear is a complete gear, the driven gear is a three-quarter gear, the sliding gear and the driven gear are connected by gear meshing; the top of the driven shaft passes through the rotating cavity and is fixedly connected to the rotating disk, and the rotating sleeve is rotatably installed on the outer side of the middle part of the driven shaft.

[0013] Furthermore, the motor drives the drive gear to rotate 90 degrees clockwise via the drive shaft. The rotating gear drives the rotating gear and the driven shaft to rotate 90 degrees via the rotating sleeve. At this time, the drive gear and the rotating gear disengage, and the driven shaft and the sliding gear begin to mesh. The motor continues to rotate 270 degrees, and the driven shaft drives the extension rod to slide back and forth. The motor rotates one revolution, realizing the transportation of the wafer at the bottom.

[0014] Furthermore, the transport assembly also includes a transport motor, a first gear, and a synchronous gear; the two side chain units are respectively fixedly connected to the first gear and the synchronous gear through the transport shaft, the rear side of the first gear is connected to the transport motor through the transport shaft, the first gear and the synchronous gear mesh, the transport motor drives the first gear to rotate, the first gear drives the synchronous gear to rotate counterclockwise, and the first gear and the synchronous gear respectively drive the two end chain units to move.

[0015] Furthermore, the transport assembly also includes a connecting shaft, a belt, a belt shaft, a drive bevel gear, a driven bevel gear, a transmission gear, and a connecting gear; the connecting shaft is fixedly connected to the top of the rotating cavity, the belt shaft is connected via a belt, the drive bevel gear is fixedly sleeved on the outside of the belt shaft, the drive bevel gear is meshed with the driven bevel gear, the driven bevel gear is connected to the transmission gear via the transport shaft on one side, the transmission gear meshes with the connecting gear, and the connecting gear is fixedly sleeved with the transport shaft on the other side; the gear ratio between the drive bevel gear and the driven bevel gear is set to one-quarter rotation of the drive bevel gear, and the rotation angle of the driven bevel gear is equal to the angle of rotation of one tooth of the transport gear; the belt shaft is disposed on the top of the drive shaft and rotatably connected to the drive shaft.

[0016] The beneficial effects of this invention are:

[0017] 1. The present invention, through the structural arrangement of the transport shaft, transport gear and chain unit, realizes that when the transport shaft drives the transport gear to rotate at a fixed angle, the transport gear drives the blocking plate and the outer support plate to slide down through the transport roller, thereby realizing the automatic downward movement of the bottom wafer; then through the transmission of the transport component, the wafer is automatically transported to the bottom, realizing automatic transport in the wafer testing process.

[0018] 2. This invention utilizes the cooperation of a drive component with a rotating component and a sliding component. The motor drives the drive gear to rotate 90 degrees clockwise via the drive shaft. The rotating gear drives the rotating gear and the driven shaft to rotate 90 degrees via a rotating sleeve. At this point, the drive gear and the rotating gear disengage, and the driven shaft and the sliding gear begin to mesh. The motor continues to rotate 270 degrees, and the driven shaft drives the extension rod to slide back and forth. One rotation of the motor achieves the transport of the bottom wafer. Then, the drive component continues to rotate to achieve the testing and output of the bottom wafer. During the movement of the rotating component, no manual operation is required to achieve wafer transport, testing, output, and reset of the rotating mechanism. The device is highly adaptable and has good performance.

[0019] 3. The present invention, through the structural cooperation of the connecting shaft, driving bevel gear, driven bevel gear, transmission gear and connecting gear, enables the driven bevel gear to rotate four times (i.e. after the bottom wafer has been transported, tested, output and reset), the rotation angle of the driven bevel gear is equal to the rotation angle of the transport gear by one tooth, and the blocking plate corresponding to the bottom wafer rotates by one tooth, so that the next wafer automatically moves down to the output position, realizing the linkage setting of the transport component and the rotation component, without manual operation, and with a high degree of automation. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0021] Figure 2 This is a schematic diagram of the structure between the transport component and the rotating component of the present invention;

[0022] Figure 3 This is a schematic diagram of the structure between the wafer and the transport component of the present invention;

[0023] Figure 4 This is a schematic diagram of the structure between the blocking plate and the transport gear of the present invention;

[0024] Figure 5 This is a schematic diagram of the internal structure of the rotating shell of the present invention;

[0025] Figure 6 This is a schematic diagram of the structure between the drive component and the telescopic component of the present invention;

[0026] Figure 7 This is a schematic diagram of the structure between the drive component and the rotation component of the present invention;

[0027] Figure 8 This is a top view of the transport component in Embodiment 2 of the present invention;

[0028] Figure 9 This is a top view of the transport component in Embodiment 3 of the present invention.

[0029] Explanation of the reference numerals in the figure:

[0030] 11. Support platform; 12. Housing; 13. Test platform; 14. Output platform; 21. Wafer; 22. Blocking plate; 23. Outer support plate; 24. Inner support plate; 25. Connecting shaft; 26. Transport roller; 27. Transport shaft; 28. Transport gear; 31. Rotating cavity; 32. Rotating sleeve; 33. Rotating gear; 34. Drive gear; 35. Drive shaft; 36. Motor; 41. Extending rod; 42. Sliding ring; 43. Fixing key; 44. Rotating disk; 45. Sliding groove; 51. Sliding gear; 52. Driven gear; 53. Driven shaft; 61. Transport motor; 62. First gear; 63. Synchronizing gear; 71. Connecting shaft; 72. Belt; 73. Belt shaft; 74. Drive bevel gear; 75. Driven bevel gear; 76. Transmission gear; 77. Connecting gear. Detailed Implementation

[0031] Example 1:

[0032] Please refer to 1-4;

[0033] A fully automated semiconductor testing probe device includes a support stage 11, a transport component, a rotating component, a telescopic component, and a driving component. The rotating component is located in the middle of the support stage 11, the transport component is located behind the rotating component, a test stage 13 is located to the right of the rotating component, and an output stage 14 is located in front of the rotating component. Stacked wafers 21 to be tested are arranged inside the transport component, and the telescopic component is arranged inside the rotating component. When the output end of the rotating component rotates to the bottom of the transport component, the telescopic component reciprocates and drives the wafer 21 at the bottom of the transport component to slide out of the transport component. The rotating component continues to rotate to the top of the test stage 13, and the telescopic component drives the wafer 21 to slide to the top of the test stage 13. After the test is completed, the rotating component and the telescopic component drive the wafer 21 to slide to the top of the output stage 14.

[0034] As a further embodiment, the transport assembly includes a housing 12, transport shafts 27, transport gears 28, and chain units. The housing 12 is connected to the top of the support platform 11. Two sets of transport shafts 27 are rotatably mounted on the front and rear walls of the housing 12. Two vertically mounted transport shafts 27 form one set. Transport gears 28 are fixedly sleeved on the outer side of each transport shaft 27. Chain units are wound around the outer side of each of the two transport gears 28. The chain units mesh with the transport gears 28 via gears. A wafer 21 is disposed between the chain units on both sides. The chain unit includes a blocking plate 22, an outer support plate 23, an inner support plate 24, a connecting shaft 25, and a transport roller 26. The ends of the outer support plate 23 and the inner support plate 24 are connected. The first end of the wafer is rotatably connected to the transport roller 26 via the connecting shaft 25. The inner support plate 24 and the outer support plate 23 are arranged alternately. Two adjacent transport rollers 26 that contact the transport gear 28 mesh with the teeth of the transport gear 28. Multiple outer support plates 23 and inner support plates 24 together form a vertical chain unit and mesh with the transport gear 28. The outer support plate 23 and the inner support plate 24 are fixedly connected to the blocking plate 22 on the side away from the corresponding transport gear 28. The blocking plate 22 is arranged perpendicularly to the corresponding outer support plate 23 or inner support plate 24. The wafers 21 are stacked sequentially on the top of the blocking plates 22 at both ends near the middle of the wafers 21.

[0035] Preferably, the chain units at both ends rotate in opposite directions;

[0036] In this embodiment, when the transport shaft 27 drives the transport gear 28 to rotate, the transport gear 28 drives the blocking plate 22 and the outer support plate 23 to slide down through the transport roller 26, thereby realizing the automatic downward movement of the wafer 21.

[0037] Example 2;

[0038] Please see Figure 5-8

[0039] In Embodiment 1, structural design for the rotating component, driving component, and sliding component is lacking.

[0040] As a further embodiment, the rotating assembly includes a rotating cavity 31, a rotating sleeve 32, and a rotating gear 33. The rotating cavity 31 is provided on the top of the support platform 11, and the rotating sleeve 32 is fixedly connected to the bottom of the rotating cavity 31. The bottom of the rotating sleeve 32 extends into the support platform 11 and is fixedly connected to the rotating gear 33. The driving assembly realizes the intermittent rotation of the rotating cavity 31 by ninety degrees through the rotating gear 33.

[0041] As a further embodiment, the sliding assembly includes an extension rod 41, a sliding ring 42, a fixing key 43, a rotating disk 44, and a sliding groove 45. The rotating disk 44 is rotatably connected inside the rotating cavity 31. The fixing key 43 is fixedly installed on the top of the rotating disk 44. The sliding ring 42 is slidably disposed on the top of the rotating disk 44. The fixing key 43 is slidably disposed inside the sliding ring 42. The extension rod 41 is fixedly connected to the sliding ring 42. The rotating cavity 31 has the sliding groove 45 corresponding to the extension rod 41. One end of the extension rod 41 away from the sliding ring 42 extends out of the rotating cavity 31 through the sliding groove 45. The output end of the extension rod 41 has a semi-circular groove. The diameter of the semi-circular groove is equal to the diameter of the test stage 13 and the output stage 14. The top of the extension rod 41 is used to transport the wafer 21. The driving assembly drives the extension rod 41 to reciprocate and slide inside the sliding groove 45 by rotating the rotating disk 44.

[0042] As a further embodiment, the driving assembly includes a driving gear 34, a driving shaft 35, and a motor 36; the motor 36 is fixedly mounted on the bottom of the wafer 21, the output end of the motor 36 is fixedly connected to the driving shaft 35, the driving gear 34 is sleeved on the outside of the driving shaft 35, the driving gear 34 is set as a quarter gear, the rotating gear 33 is set as a full gear, and the rotating gear 33 and the driving gear 34 are connected by gear meshing.

[0043] As a further embodiment, the driving assembly further includes a sliding gear 51, a driven gear 52, and a driven shaft 53; the driven shaft 53 is rotatably connected inside the wafer 21, the driven gear 52 is sleeved on the outer side of the bottom of the driven shaft 53, the driving shaft 35 is provided with a sliding gear 51 corresponding to the driven gear 52, the sliding gear 51 is a complete gear, the driven gear 52 is a three-quarter gear, and the sliding gear 51 and the driven gear 52 are connected by gear meshing; the top of the driven shaft 53 passes through the rotating cavity 31 and is fixedly connected to the rotating disk 44, and the rotating sleeve 32 is rotatably installed on the outer side of the middle part of the driven shaft 53.

[0044] In this embodiment, the motor 36 drives the drive gear 34 to rotate 90 degrees clockwise via the drive shaft 35. The rotating gear 33 drives the rotating gear 33 and the driven shaft 53 to rotate 90 degrees via the rotating sleeve 32. At this time, the drive gear 34 and the rotating gear 33 disengage, and the driven shaft 53 and the sliding gear 51 begin to mesh. The motor 36 continues to rotate 270 degrees, and the driven shaft 53 drives the extension rod 41 to slide back and forth. When the motor 36 rotates one revolution, the bottom wafer 21 is transported.

[0045] As a further embodiment, the transport assembly further includes a transport motor 61, a first gear 62, and a synchronous gear 63; the two side chain units are respectively fixedly connected to the first gear 62 and the synchronous gear 63 via the transport shaft 27, the rear side of the first gear 62 is connected to the transport motor 61 via the transport shaft 27, the first gear 62 and the synchronous gear 63 mesh, the transport motor 61 drives the first gear 62 to rotate, the first gear 62 drives the synchronous gear 63 to rotate counterclockwise, and the first gear 62 and the synchronous gear 63 respectively drive the two end chain units to move.

[0046] Example 3,

[0047] Please see Figure 9

[0048] In Embodiment 2, there is a lack of a structure that links the transport component and the rotating component. Therefore, we further improved the structure by adding a transport component.

[0049] Based on Embodiment 1, the transport assembly further includes a connecting shaft 71, a belt 72, a belt shaft 73, a drive bevel gear 74, a driven bevel gear 75, a transmission gear 76, and a connecting gear 77; the connecting shaft 71 is fixedly connected to the top of the rotating cavity 31, the belt shaft 73 is connected via the belt 72, the drive bevel gear 74 is fixedly sleeved on the outside of the belt shaft 73, the drive bevel gear 74 is connected to the driven bevel gear 75 via gear meshing, the driven bevel gear 75 is connected to the transmission gear 76 via the transport shaft 27 on one side, the transmission gear 76 meshes with the connecting gear 77, and the connecting gear 77 is fixedly sleeved with the transport shaft 27 on the other side;

[0050] In this embodiment, the gear ratio between the driving bevel gear 74 and the driven bevel gear 75 is set to one-quarter rotation of the driving bevel gear 74, and the rotation angle of the driven bevel gear 75 is equal to the angle of rotation of one tooth of the transport gear 28.

[0051] Preferably, the belt shaft 73 is disposed on the top of the drive shaft 35 and is rotatably connected to the drive shaft 35.

Claims

1. A fully automated semiconductor test probe device, comprising a support stage, characterized in that: It also includes a transport component, a rotating component, a telescopic component, and a drive component; the rotating component is located in the middle of the support platform, the transport component is located behind the rotating component, a test platform is located to the right of the rotating component, and an output platform is located in front of the rotating component. Stacked wafers to be tested are arranged inside the transport component, and the telescopic component is arranged inside the rotating component; when the output end of the rotating component rotates to the bottom of the transport component, the telescopic component reciprocates to drive the wafer at the bottom of the transport component to slide out of the transport component; the rotating component continues to rotate to the top of the test platform, and the telescopic component drives the wafer to slide to the top of the test platform; after the test, the rotating component and the telescopic component drive the wafer to slide to the top of the output platform; The transport assembly includes a housing, a transport shaft, transport gears, and a chain unit; The top of the support platform is connected to the housing. Two sets of transport shafts are rotatably arranged on the front and rear walls of the housing. Two vertically arranged transport shafts form a set. Transport gears are fixedly sleeved on the outside of each transport shaft. Chain units are wound around the outside of the transport gears at both ends. The chain units and the transport gears mesh with each other through gears. Wafers are arranged between the chain units on both sides. The chain unit includes a blocking plate, an outer support plate, an inner support plate, a connecting shaft, and a transport roller. The end of the outer support plate and the beginning of the inner support plate correspond to each other and are rotatably connected to the transport roller through the connecting shaft. The inner support plate and the outer support plate are arranged alternately. Two adjacent transport rollers that contact the transport gear mesh with the teeth of the transport gear. Multiple outer support plates and inner support plates together form a vertical chain unit and mesh with the transport gear. The blocking plate is fixedly connected to the side of the outer support plate and the inner support plate away from the corresponding transport gear. The blocking plate is arranged perpendicular to the corresponding outer support plate or inner support plate. The wafers are stacked sequentially on the tops of the blocking plates at both ends near the middle of the wafer. The chain units at both ends rotate in opposite directions; when the transport shaft drives the transport gear to rotate, the transport gear drives the blocking plate and the outer support plate to slide down through the transport roller, thereby realizing the automatic downward movement of the wafer; The rotating assembly includes a rotating cavity, a rotating sleeve, and a rotating gear; The top of the support platform is provided with the rotating cavity, and the bottom of the rotating cavity is fixedly connected to the rotating sleeve. The bottom of the rotating sleeve extends into the support platform and is fixedly connected to the rotating gear. The drive assembly realizes the intermittent rotation of the rotating cavity by ninety degrees through the rotating gear.

2. The fully automated semiconductor test probe device according to claim 1, characterized in that: The sliding assembly includes an extension rod, a sliding ring, a fixing key, a rotating disk, and a sliding groove; The rotating cavity is rotatably connected to the rotating disk. The fixing key is fixedly installed on the top of the rotating disk. The sliding ring is slidably disposed on the top of the rotating disk. The fixing key is slidably disposed inside the sliding ring. The sliding ring is fixedly connected to the extension rod. The rotating cavity has a sliding groove corresponding to the extension rod. The end of the extension rod away from the sliding ring extends out of the rotating cavity through the sliding groove. The output end of the extension rod has a semi-circular groove. The diameter of the semi-circular groove is equal to the diameter of the test stage and the output stage. The top of the extension rod is used to transport the wafer. The drive assembly drives the extension rod to reciprocate within the sliding groove by rotating the rotating disk.

3. The fully automated semiconductor test probe device according to claim 2, characterized in that: The drive assembly includes a drive gear, a drive shaft, and a motor; The motor is fixedly mounted on the bottom of the wafer. The output end of the motor is fixedly connected to the drive shaft. The drive gear is sleeved on the outside of the drive shaft. The drive gear is set as a quarter gear, and the rotating gear is set as a full gear. The rotating gear and the drive gear are connected by gear meshing.

4. The fully automated semiconductor test probe device according to claim 3, characterized in that: The drive assembly also includes a sliding gear, a driven gear, and a driven shaft; The driven shaft is rotatably connected inside the wafer. The driven gear is sleeved on the outer side of the bottom of the driven shaft. The drive shaft is provided with a sliding gear corresponding to the driven gear. The sliding gear is a full gear, and the driven gear is a three-quarter gear. The sliding gear and the driven gear are connected by gear meshing. The driven shaft passes through the rotating cavity at the top and is fixedly connected to the rotating disk, and the rotating sleeve is rotatably installed on the outer side of the middle part of the driven shaft.

5. A fully automated semiconductor test probe device according to claim 4, characterized in that: The motor drives the drive gear to rotate 90 degrees clockwise via the drive shaft. The rotating gear drives the rotating gear and the driven shaft to rotate 90 degrees via the rotating sleeve. At this time, the drive gear and the rotating gear disengage, and the driven shaft and the sliding gear begin to mesh. The motor continues to rotate 270 degrees, and the driven shaft drives the extension rod to slide back and forth. The motor rotates one revolution, realizing the transportation of the wafer at the bottom.

6. The fully automated semiconductor test probe device according to claim 1, characterized in that: The transport assembly also includes a transport motor, a first gear, and a synchronizing gear; The two chain units on both sides are fixedly connected to the first gear and the synchronous gear through the transport shaft, respectively. The transport motor is connected to the rear side of the first gear through the transport shaft. The first gear and the synchronous gear mesh with each other. The transport motor drives the first gear to rotate. The first gear drives the synchronous gear to rotate counterclockwise. The first gear and the synchronous gear drive the chain units at both ends to move.

7. A fully automated semiconductor test probe device according to claim 6, characterized in that: The transport assembly also includes a connecting shaft, a belt, a belt shaft, a drive bevel gear, a driven bevel gear, a transmission gear, and a connecting gear; The top of the rotating cavity is fixedly connected to the connecting shaft, the connecting shaft is connected to the belt shaft via a belt, the driving bevel gear is fixedly sleeved on the outside of the belt shaft, the driving bevel gear is connected to the driven bevel gear via gear meshing, the driven bevel gear is connected to the transmission gear via the transport shaft on one side, the transmission gear meshes with the connecting gear, and the connecting gear is fixedly sleeved with the transport shaft on the other side; The gear ratio between the driving bevel gear and the driven bevel gear is set such that when the driving bevel gear rotates four revolutions, the rotation angle of the driven bevel gear is equal to the angle of the transport gear rotating one tooth. The belt shaft is located at the top of the drive shaft and is rotatably connected to the drive shaft.

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