GaN integrated device

Abstract

The invention discloses a GaN integrated device, and relates to the technical field of integrated devices, the GaN integrated device comprises a circuit board, an integrated device body is installed on the circuit board, the GaN integrated device further comprises a heat dissipation unit installed at the top of the integrated device body, and the heat dissipation unit is used for dissipating heat generated during operation of the integrated device body. A mounting assembly is arranged on the circuit board, and the mounting assembly provides a mounting position requirement for the heat dissipation unit; the positioning assembly is arranged on the heat dissipation unit, the positioning assembly is matched with the mounting assembly, and the positioning assembly is used for mounting the heat dissipation unit on the integrated device body; by combining natural and forced convection heat dissipation, the heat dissipation problem of the integrated device can be effectively solved, and the method not only meets the heat dissipation requirement in a low-frequency working mode, but also guarantees the heat dissipation effect in a high-frequency or full-load state, so that the heat dissipation requirement can be met regardless of the load, and the heat dissipation mode can avoid performance reduction and other adverse effects.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated devices, in particular to a GaN integrated device. Background Art

[0002] GaN integrated devices refer to integrated circuit devices made of gallium nitride (GaN) materials. GaN integrated devices generate a lot of heat when working at high power and high frequency. For example, in application scenarios such as power amplifiers and high-power switches, the power loss inside GaN integrated devices will be converted into heat energy. If this heat cannot be dissipated in a timely and effective manner, the junction temperature of the device will increase. Excessive junction temperature will have many adverse effects on GaN integrated devices, such as reducing electron mobility and causing the electrical performance of the device to deteriorate, including increased on-resistance and reduced gain. It may also reduce the reliability of the device, shorten the service life of the device, and even cause failure phenomena such as thermal breakdown. Chinese patent document announcement number (CN113036480A) "discloses an integrated device, including two circuit board assemblies arranged at intervals, a connector is arranged between the two circuit board assemblies, the connector includes an insulator, a plurality of first conductors are arranged on the side of the insulator close to the circuit board assembly, and a side of the circuit board assembly close to the connector is provided with pads corresponding to the number and position of the first conductors, the first conductors abut against the pads to achieve electrical conduction, and the two first conductors on the opposite sides of the insulator are electrically conductive through a first conductive medium; a hot melt column is protruding from the insulator, and a through hole is penetrated through the circuit board assembly for the hot melt column to pass through, and the end of the hot melt column passes through the through hole and then is hot-melted to form a limiting portion, and the limiting portion abuts against a side of the circuit board assembly away from the connector. The integrated device of the present invention is detachable, has low maintenance cost, and has good conductivity." Although the above patent document can meet the disassembly requirements of the integrated device, it cannot meet the heat dissipation requirements generated during the operation of the integrated device. For this reason, we propose a GaN integrated device. Summary of the invention

[0003] The object of the present invention is to provide a GaN integrated device to solve the problem in the above background technology that it is difficult to meet the heat dissipation requirements of the integrated device under different working conditions.

[0004] To achieve the above object, the present invention provides the following technical solution: a GaN integrated device, comprising: A circuit board, on which an integrated device body is mounted, further comprising: A heat dissipation unit installed on the top of the integrated device body, the heat dissipation unit is used to dissipate heat generated when the integrated device body is running, and a mounting component is provided on the circuit board, the mounting component provides a mounting position requirement for the heat dissipation unit, and; A positioning component is arranged on the heat dissipation unit, and the positioning component is matched with the mounting component, and the positioning component is used to mount the heat dissipation unit on the integrated device body.

[0005] Preferably, the heat dissipation unit includes a heat dissipation patch arranged on the top surface of the integrated device body, and the heat dissipation patch is in contact with the integrated device body, a plurality of heat dissipation copper tubes are installed on the heat dissipation patch, and at least one mounting bracket is arranged directly above the heat dissipation patch, a plurality of equidistantly distributed heat dissipation fins a are fixed on the mounting bracket, and the heat dissipation copper tube passes through the mounting bracket and the plurality of heat dissipation fins a, a side heat dissipation fan is installed on the heat dissipation fin a through at least one metal hanging rod, and a forced convection heat sink is commonly arranged on the two mounting brackets, and the forced convection heat sink is used to dissipate the heat generated by the plurality of heat dissipation fins a.

[0006] Preferably, the forced convection heat dissipation element includes a heat-conducting bracket fixed on two mounting brackets, a plurality of annularly distributed heat dissipation fins b are fixed on the heat-conducting bracket, and the heat dissipation fins b are abutted against the heat-conducting bracket, a support frame is fixed on the heat-conducting bracket through two annular connecting plates, a micro motor is fixed on the support frame, and a heat dissipation blade is coaxially fixed on the output shaft of the micro motor, and the heat dissipation blade is located directly above the multiple heat dissipation fins b.

[0007] Preferably, the mounting assembly includes a mounting plate arranged at the bottom of the circuit board, the mounting plate is provided with a plurality of channels a distributed in an annular shape, a sliding block is slidably connected to the bottom of the mounting plate, and the sliding block is slidably connected to the inside of the channel a through a threaded tube, a mounting shell is fixed to the mounting plate through a mounting rod, a slave shaft is rotatably connected to the mounting shell, and a turntable is tightly sleeved on the slave shaft, a connecting rod is hinged between the turntable and the sliding block, a sliding groove is provided on the turntable that is slidably connected to the surface of the mounting rod, an outer shell is fixed to the mounting shell, and a main shaft is rotatably connected to the outer shell, a worm is tightly sleeved on the main shaft, and a worm wheel meshing with the worm is tightly sleeved on the slave shaft, a turntable is fixed on the main shaft, and a channel b for the slidable connection of the threaded tube is provided on the circuit board.

[0008] Preferably, the positioning assembly includes a through groove opened on the heat sink patch, a sleeve is slidably connected to the through groove, and the vertical cross-section of the sleeve is arranged in an I-shape, a threaded hole is opened on the sleeve, and a positioning screw is threadedly connected to the threaded hole, the positioning screw is threadedly connected to the threaded tube, two ring bodies are sleeved on the positioning screw, a spring is fixed between the two ring bodies, one of the ring bodies is in contact with the positioning screw, and the other ring body is in contact with the sleeve.

[0009] Preferably, a plurality of guide grooves distributed in an annular shape are fixed to the bottom of the mounting plate, the sliding block is slidably connected to the guide groove, and the length of the guide groove is greater than the opening length of the channel a, the opening shape of the guide groove is set in an arc shape, and both sides of the guide groove are set in a smooth arc surface, and the arc surface of the guide groove is adapted to the mounting rod.

[0010] Preferably, a rubber pad is fixed to a side wall of the mounting plate close to the circuit board, the rubber pad abuts against the circuit board, the outer side of the rubber pad is provided with a chamfered slope, a reserved groove is provided on the heat dissipation patch, and the reserved groove is used for applying heat dissipation silicone grease.

[0011] Preferably, the central section of the heat dissipation blade and the central sections of the two mounting brackets are arranged in the same horizontal plane, and the central axis of the heat dissipation blade and the central axis of the integrated device body are arranged in a colinear manner.

[0012] Preferably, the wind directions of the two side cooling fans are oppositely arranged, the side cooling fans are used to absorb the heat generated by the cooling fins a, and the size of the side cooling fans is consistent with the size of the mounting bracket, the air outlet direction of the cooling blades is downward vertical blowing, and the cooling blades are used to blow air into between the two mounting brackets to accelerate the heat dissipation speed of the cooling fins a.

[0013] Preferably, the opening length value of the slide groove is consistent with the length value of the channel a, the maximum rotation angle of the rotating wheel is about 43°, and the opening length value of the channel a is consistent with the opening length value of the channel b.

[0014] Compared with the prior art, the present invention has the following beneficial effects: (1) The present invention can effectively dissipate heat for integrated devices by combining natural convection heat dissipation and forced convection heat dissipation. This method can not only ensure that the heat dissipation requirements of the integrated devices are met in the low-frequency working mode, but also ensure the heat dissipation effect in the high-frequency operation or full-load working state. Therefore, whether it is a low-load or high-load working condition, it can ensure that the heat dissipation requirements are fully met. In addition, this heat dissipation combination method can also effectively avoid the performance degradation of the equipment or other adverse effects caused by the failure to meet the heat dissipation requirements, thereby improving the stability and reliability of the equipment.

[0015] (2) The present invention can realize synchronous adjustment of the positions of the four diagonal threaded tubes through the design of the mounting assembly to adapt to installation requirements of various sizes. In this way, it can be ensured that it can be installed on circuit boards with different hole sizes. In addition, this design can also meet the requirements of loading and heat dissipation of integrated devices of different sizes, effectively solving the cumbersome problem of individually adjusting each mounting hole in the traditional installation method. Moreover, the position of the threaded tube after adjustment is relatively stable, which provides strong reliability for the entire system. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a bottom view structural schematic diagram of the present invention; Figure 3 It is a schematic diagram of the local structure of the heat dissipation unit of the present invention; Figure 4 This is a schematic diagram of the structure of the forced convection heat sink of the present invention; Figure 5 A schematic diagram of wind direction of the heat dissipation unit and the forced convection heat dissipation element of the present invention; Figure 6 It is a schematic diagram of the structure of the heat dissipation patch of the present invention; Figure 7 for Figure 6 A schematic diagram of the enlarged structure of the middle A area; Figure 8 This is a schematic diagram of the structure of the heat dissipation patch of the present invention when viewed from above; Fig. 9 This is a schematic diagram of the top structure of the mounting plate of the present invention; Fig.10 This is a schematic diagram of the structure of the installation assembly of the present invention; Fig.11 This is a schematic diagram of the explosion structure of the installation shell and the runner of the present invention; Fig.12 This is a schematic diagram of the structure of the runner of the present invention; Fig.13 It is a schematic diagram of the explosion structure at the heat dissipation patch of the present invention.

[0017] In the figure: 1, circuit board; 2, integrated device body; 3, heat dissipation unit; 4, mounting assembly; 5, positioning assembly; 6, heat dissipation patch; 7, heat dissipation copper pipe; 8, mounting bracket; 9, heat dissipation fin a; 10, metal hanging rod; 11, side heat dissipation fan; 12, forced convection heat dissipation element; 13, heat conduction bracket; 14, heat dissipation fin b; 15, annular connecting plate; 16, support frame; 17, micro motor; 18, heat dissipation blade; 19, mounting plate; 2 0. Channel a; 21. Sliding block; 22. Threaded tube; 23. Mounting rod; 24. Mounting shell; 25. Slave shaft; 26. Turntable; 27. Connecting rod; 28. Slide groove; 29. ​​Shell; 30. Main shaft; 31. Worm; 32. Worm wheel; 33. Rotating wheel; 34. Channel b; 35. Through groove; 36. Sleeve; 37. Threaded hole; 38. Positioning screw; 39. Ring body; 40. Spring; 41. Guide groove; 42. Rubber pad; 43. Reserved groove. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] For example, see Figure 1 - Fig.13 A GaN integrated device shown in the figure includes a circuit board 1, an integrated device body 2 is mounted on the circuit board 1, and a heat dissipation unit 3 mounted on the top of the integrated device body 2, the heat dissipation unit 3 is used to dissipate the heat generated by the integrated device body 2 during operation, and a mounting component 4 is arranged on the circuit board 1, the mounting component 4 provides the heat dissipation unit 3 with a mounting position requirement, and a positioning component 5 is arranged on the heat dissipation unit 3, and the positioning component 5 is adapted to the mounting component 4, and the positioning component 5 is used to mount the heat dissipation unit 3 on the integrated device body 2; It should be noted that the main structure of the integrated device body 2 includes a substrate, active devices, passive devices, interconnection line contact pads, a passivation layer and other functional modules, and has characteristics such as wide bandgap, high electron mobility, and high critical electric field strength. This is a conventional setting in the art, so it will not be described in detail here; Specifically, first use an appropriate cleaning agent to clean the surface of the circuit board 1 to remove impurities such as oil, oxides, etc., ensure that the pads of the circuit board 1 are clean, and prepare for good welding. Use isopropyl alcohol to wipe the circuit board 1, and wait for it to be completely dry before proceeding with subsequent operations. Use appropriate solder paste according to the integrated device body 2, and be able to wet the pins and pads well during the welding process. The above are the requirements for welding and fixing the integrated device body 2 and the circuit board 1; In this solution, the positioning component 5 and the mounting component 4 are used for installation. The installation position of the mounting component 4 is adjusted according to the actual installation requirements, so that it can be suitable for installation requirements of various sizes. The position on the mounting component 4 and the installation position of the mounting component 4 are made to correspond to each other. The positioning component 5 and the mounting component 4 are assembled to achieve a stable and flexible fixation of the heat dissipation unit 3 on the integrated device body 2, so that the heat dissipation unit 3 and the integrated device body 2 are in contact, and the heat dissipation unit 3 dissipates the heat generated during the operation of the integrated device body 2.

[0020] Further Figure 1 - Figure 5 As shown, it is worth specifically explaining that the heat dissipation unit 3 includes a heat dissipation patch 6 arranged on the top surface of the integrated device body 2, and the heat dissipation patch 6 is in contact with the integrated device body 2, a plurality of heat dissipation copper tubes 7 are installed on the heat dissipation patch 6, and at least one mounting bracket 8 is arranged directly above the heat dissipation patch 6, a plurality of heat dissipation fins a9 distributed at equal intervals are fixed on the mounting bracket 8, and the heat dissipation copper tube 7 runs through the mounting bracket 8 and the plurality of heat dissipation fins a9, a side heat dissipation fan 11 is installed on the heat dissipation fin a9 through at least one metal hanging rod 10, and a forced convection heat dissipation element 12 is commonly arranged on the two mounting brackets 8, and the forced convection heat dissipation element 12 is used to dissipate the heat generated by the plurality of heat dissipation fins a9; Specifically, Figure 1 - Figure 5 As shown, the forced convection heat sink 12 includes a heat-conducting bracket 13 fixed on two mounting brackets 8, a plurality of heat-dissipating fins b14 distributed in an annular shape are fixed on the heat-conducting bracket 13, and the heat-dissipating fins b14 are abutted against the heat-conducting bracket 13, a support frame 16 is fixed on the heat-conducting bracket 13 through two annular connecting plates 15, a micro motor 17 is fixed on the support frame 16, and a heat-dissipating blade 18 is coaxially fixed on the output shaft of the micro motor 17, the heat-dissipating blade 18 is located directly above the plurality of heat-dissipating fins b14, and the central section of the heat-dissipating blade 18 is arranged on the same horizontal plane as the central section of the two mounting brackets 8. By setting the position of the heat-dissipating blade 18, it can be ensured that the hot air generated by the heat-dissipating blade 18 enters more directly between the two mounting brackets 8, providing the heat-dissipating fin a9 with the effect of accelerating the heat dissipation, and the central axis of the heat-dissipating blade 18 is arranged in a colinear manner with the central axis of the integrated device body 2; Among them, in this solution, the mounting bracket 8 is made of copper, which ensures that the mounting bracket 8 has a good thermal conductivity, so that the thermal conductive bracket 13 can receive the heat conducted from the mounting bracket 8, and cooperates with the setting of the heat dissipation fins a9 arranged in parallel in the mounting bracket 8, so that the mounting bracket 8 can share a certain heat dissipation task for the heat dissipation fins a9, further improving the heat dissipation effect of the integrated device body 2; It should be noted that the wind directions of the two side cooling fans 11 are set in opposite directions. The side cooling fans 11 are used to absorb the heat generated by the cooling fins a9, which can accelerate the flow rate of the heat accumulated at the cooling fins a9. The design of the two side cooling fans 11 with opposite wind directions is adopted. The hot air at the cooling fins a9 is sucked into the side cooling fans 11 from two opposite directions, and then discharged from the other two opposite directions. The size value of the side cooling fans 11 is consistent with the size value of the mounting bracket 8. It should also be noted that when the high-power integrated device body 2 needs to be cooled, the wind direction of the heat dissipation blades 18 is set to be downward vertical blowing. The heat dissipation blades 18 are used to blow air into between the two mounting brackets 8 to accelerate the heat dissipation speed of the heat dissipation fins a9, which can effectively enhance the heat dissipation speed of the heat dissipation fins a9 inside the mounting bracket 8, and the coordination with the two side cooling fans 11 can effectively meet the heat dissipation requirements of the high-power integrated device body 2, and effectively solve the problem that the integrated device body 2 generates a large amount of heat when working at high power and high frequency, resulting in reduced electron mobility and electrical performance. The heat dissipation working principle of the heat dissipation unit 3 for the integrated device body 2 is as follows: when the integrated device body 2 works at low power and low frequency, a certain amount of heat is generated, and the heat dissipation patch 6 is used to transfer the heat generated by the integrated device body 2 to the heat dissipation copper tube 7, wherein the heat dissipation copper tube 7 is the main medium for heat conduction, and the copper tube radiator is closely fitted with the integrated device body 2, so as to reduce the thermal resistance, ensure that the heat can be efficiently transferred from the heat source to the heat dissipation copper tube 7, so that the temperature of the heat dissipation fin a9 is increased, and the heat can be effectively propagated inside the heat dissipation fin a9. The setting of multiple equidistantly distributed heat dissipation fins a9 is conducive to uniform distribution of heat. When the temperature of the heat dissipation fin a9 is higher than the ambient air temperature, natural convection heat dissipation will occur, and the density of hot air is less than that of cold air, so the hot air will rise, and the surrounding cold air will be supplemented to form natural convection of air; When the integrated device body 2 is in high-power and high-frequency operation, a large amount of heat will be generated. The operation of the side cooling fan 11 will generate a certain suction force, and then the heat accumulated at the cooling fin a9 will be sucked out, so as to enhance the heat dissipation rate of the cooling fin a9, so that more cold air can quickly flow through the cooling fin a9, so as to take away more heat, and cooperate with the heat-conducting bracket 13 to disperse the heat on the mounting bracket 8, so that the heat can be conducted to the cooling fin b14, so as to further enhance the heat dissipation effect. When the heat dissipation needs to be further enhanced, the micro-motor 17 is driven to make the cooling blades 18 rotate synchronously, so as to generate a strong wind force, which can not only quickly disperse the heat at the cooling fin b14, but also blow the cold air into the position between the two groups of cooling fins a9, so as to meet the heat dissipation needs at higher power and higher frequency operation.

[0021] Embodiment 2, based on embodiment 1, according to Fig. 9 - Fig.12 As shown, it is worth specifically explaining that the mounting assembly 4 includes a mounting plate 19 arranged at the bottom of the circuit board 1, and a plurality of channels a20 distributed in an annular shape are opened on the mounting plate 19, a sliding block 21 is slidably connected to the bottom of the mounting plate 19, and the sliding block 21 is slidably connected to the inside of the channel a20 through a threaded tube 22, a mounting shell 24 is fixed to the mounting plate 19 through a mounting rod 23, a slave shaft 25 is rotatably connected to the mounting shell 24, and a turntable 26 is tightly sleeved on the slave shaft 25, a connecting rod 27 is hinged between the turntable 26 and the sliding block 21, and a slide groove 28 is opened on the turntable 26, which is slidably connected to the surface of the mounting rod 23, slides on the surface of the mounting rod 23 through the slide groove 28, and cooperates with four diagonal The distributed installation rods 23 are set to keep the turntable 26 in a relatively stable state when it rotates. The slide groove 28 is set in an arc shape, and both sides of the slide groove 28 are set in smooth arc surfaces. The arc surface of the slide groove 28 is adapted to the installation rod 23. The arc surface of the slide groove 28 can effectively avoid the situation of the turntable 26 being stuck when it rotates. The installation shell 24 is fixed with a shell 29, and the shell 29 is rotatably connected with a main shaft 30. The main shaft 30 is fastened with a worm 31, and the slave shaft 25 is fastened with a worm wheel 32 meshing with the worm 31. A rotating wheel 33 is fixed on the main shaft 30, and a channel b34 for the threaded tube 22 to be slidably connected is opened on the circuit board 1; Among them, the maximum rotation angle of the rotating wheel 33 is about 43°, and the rotation angle of the rotating wheel 33 is limited by the slide groove 28. The maximum rotation angle of the rotating wheel 33 is the angle of the slide groove 28, and the opening length value of the slide groove 28 is consistent with the length value of the channel a20, ensuring that when rotating to the maximum angle, the sliding block 21 can also drive the threaded tube 22 to reach the dead point position of the channel a20, and the opening length value of the channel a20 is consistent with the opening length value of the channel b34; It should be noted that a plurality of guide grooves 41 distributed in an annular shape are fixed at the bottom of the mounting plate 19, and the sliding block 21 is slidably connected with the guide groove 41. The sliding of the sliding block 21 in the guide groove 41 can not only guide the sliding block 21, but also effectively improve the stability of the sliding block 21 when moving. The length of the guide groove 41 is greater than the opening length of the channel a20. With the length setting of the guide groove 41, it can ensure that the moving trajectory of the sliding block 21 is limited to sliding in the channel a20. The working principle of installing the mounting component 4 on the circuit board 1 is as follows: the mounting position of the mounting component 4 is adjusted according to the specific size of the integrated device body 2, and the main shaft 30 is rotated synchronously by rotating the rotating wheel 33, driving the worm 31 to rotate synchronously, and the meshing transmission effect between the worm 31 and the worm wheel 32 is utilized to make the slave shaft 25 rotate synchronously, and then drive the rotating wheel 33 to rotate synchronously, and utilize the transmission effect of the connecting rod 27 to make the sliding block 21 move along the channel a20 after being subjected to force, so as to achieve the purpose of adjusting the position of the threaded tube 22.

[0022] For further information, see Figure 6 - Figure 8 and Fig.13 The positioning assembly 5 includes a through slot 35 provided on the heat sink 6, a sleeve 36 is slidably connected to the through slot 35, and the vertical section of the sleeve 36 is in an I-shaped shape, a threaded hole 37 is provided on the sleeve 36, and a positioning screw 38 is threadedly connected to the threaded hole 37, the positioning screw 38 is threadedly connected to the threaded tube 22, two ring bodies 39 are sleeved on the positioning screw 38, a spring 40 is fixed between the two ring bodies 39, one of the ring bodies 39 is in contact with the positioning screw 38, and the other ring body 39 is in contact with the sleeve 36; According to the position of the threaded tube 22 after adjustment by the installation component 4, the sleeve 36 is pushed and pushed to the position corresponding to the threaded tube 22, and the positioning screw 38 is rotated by using a tool. First, the threaded transmission effect between the positioning screw 38 and the threaded hole 37 is used to make the positioning screw 38 move downward in a spiral after being subjected to force until a threaded connection is established between the positioning screw 38 and the threaded tube 22. At this time, when the positioning screw 38 rotates, the spring 40 is compressed to achieve a pre-tightening effect, thereby completing the work of installing the heat dissipation unit 3 on the integrated device body 2.

[0023] For example 3, please refer to Figure 8 - Fig. 9 This embodiment further illustrates other embodiments, and the difference lies in that the connection between the integrated device body 2 and the circuit board 1 is optimized.

[0024] Specifically, a rubber pad 42 is fixed to one side wall of the mounting plate 19 close to the circuit board 1, and the rubber pad 42 is in contact with the circuit board 1. The addition of the rubber pad 42 can effectively improve the pre-tightening effect of the mounting plate 19 and the circuit board 1 after installation, and further enhance the stability of the mounting component 4 and the positioning component 5 after assembly. The outer side of the rubber pad 42 is chamfered to avoid damage caused by direct contact. A reserved groove 43 is provided on the heat sink patch 6, and the reserved groove 43 is used to apply heat dissipating silicone grease. By providing the reserved groove 43 on the heat sink patch 6, it is convenient to apply the heat dissipating silicone grease to the specified position, thereby solving the problem of misalignment of the application caused by unclear application position or poor application state affecting heat dissipation.

[0025] The side cooling fan 11 and the micro motor 17 can be purchased from the market and equipped with a separate power supply. They are mature technologies in this field and have been fully disclosed, so they will not be repeated in the specification.

[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A GaN integrated device, comprising: A circuit board (1), wherein an integrated device body (2) is mounted on the circuit board (1); It is characterized by further comprising: A heat dissipation unit (3) mounted on the top of an integrated device body (2), the heat dissipation unit (3) comprising a heat dissipation patch (6) arranged on the top surface of the integrated device body (2), the heat dissipation patch (6) being in contact with the integrated device body (2), a plurality of heat dissipation copper tubes (7) being mounted on the heat dissipation patch (6), at least one mounting bracket (8) being arranged directly above the heat dissipation patch (6), a plurality of heat dissipation fins a (9) being fixed on the mounting bracket (8) and being distributed at equal distances, and the heat dissipation copper tube (7) passing through the mounting bracket (8) and the plurality of heat dissipation fins a ( 9), a side cooling fan (11) is installed on the heat dissipation fin a (9) via at least one metal hanging rod (10), a forced convection heat dissipation element (12) is commonly provided on the two mounting brackets (8), and the forced convection heat dissipation element (12) is used to dissipate heat generated by a plurality of heat dissipation fins a (9), the heat dissipation unit (3) is used to dissipate heat generated during operation of the integrated device body (2), and a mounting assembly (4) is provided on the circuit board (1), and the mounting assembly (4) provides a mounting position requirement for the heat dissipation unit (3), and; A positioning component (5) is arranged on the heat dissipation unit (3), and the positioning component (5) is adapted to the mounting component (4), and the positioning component (5) is used to mount the heat dissipation unit (3) on the integrated device body (2).

2. A GaN integrated device according to claim 1, characterized in that: The forced convection heat sink (12) comprises a heat-conducting bracket (13) fixed on two mounting brackets (8), a plurality of heat-dissipating fins b (14) distributed in an annular shape are fixed on the heat-conducting bracket (13), and the heat-dissipating fins b (14) abut against the heat-conducting bracket (13), a support frame (16) is fixed on the heat-conducting bracket (13) via two annular connecting plates (15), a micro motor (17) is fixed on the support frame (16), and a heat-dissipating blade (18) is coaxially fixed on the output shaft of the micro motor (17), and the heat-dissipating blade (18) is located directly above the plurality of heat-dissipating fins b (14).

3. A GaN integrated device according to claim 1, characterized in that: The mounting assembly (4) comprises a mounting plate (19) arranged at the bottom of the circuit board (1), the mounting plate (19) being provided with a plurality of channels a (20) distributed in an annular shape, a sliding block (21) being slidably connected to the bottom of the mounting plate (19), and the sliding block (21) being slidably connected to the inside of the channel a (20) via a threaded tube (22), a mounting shell (24) being fixed to the mounting plate (19) via a mounting rod (23), a slave shaft (25) being rotatably connected to the mounting shell (24), and a rotating disk (26) being tightly sleeved on the slave shaft (25), and the rotating disk (26) being connected to the rotating disk (26). A connecting rod (27) is hinged between the sliding blocks (21); a sliding groove (28) is provided on the rotating disk (26) and is slidably connected to the surface of the mounting rod (23); a housing (29) is fixed to the mounting shell (24); a main shaft (30) is rotatably connected to the housing (29); a worm (31) is fixedly sleeved on the main shaft (30); a worm wheel (32) meshingly connected to the worm (31) is fixedly sleeved on the slave shaft (25); a rotating wheel (33) is fixed on the main shaft (30); and a channel b (34) is provided on the circuit board (1) for slidingly connecting the threaded tube (22).

4. A GaN integrated device according to claim 3, characterized in that: The positioning assembly (5) comprises a through groove (35) formed on the heat sink (6), a sleeve (36) being slidably connected to the through groove (35), and the sleeve (36) having an I-shaped vertical cross section, a threaded hole (37) formed on the sleeve (36), and a positioning screw (38) being threadedly connected to the threaded hole (37), the positioning screw (38) being threadedly connected to the threaded tube (22), two ring bodies (39) being sleeved on the positioning screw (38), a spring (40) being fixed between the two ring bodies (39), one of the ring bodies (39) being in contact with the positioning screw (38), and the other of the ring bodies (39) being in contact with the sleeve (36).

5. The GaN integrated device according to claim 3, characterized in that: A plurality of guide grooves (41) distributed in an annular shape are fixed to the bottom of the mounting plate (19); the sliding block (21) is slidably connected to the guide groove (41); the length of the guide groove (41) is greater than the opening length of the channel a (20); the opening shape of the slide groove (28) is arranged in an arc shape; both sides of the slide groove (28) are arranged in a smooth arc surface; the arc surface of the slide groove (28) is adapted to the mounting rod (23).

6. A GaN integrated device according to claim 3, characterized in that: A rubber pad (42) is fixed to a side wall of the mounting plate (19) close to the circuit board (1), the rubber pad (42) abuts against the circuit board (1), the outer side of the rubber pad (42) is provided with a chamfered inclined surface, and a reserved groove (43) is provided on the heat dissipation patch (6), and the reserved groove (43) is used for applying heat dissipation silicone grease.

7. A GaN integrated device according to claim 2, characterized in that: The central section of the heat dissipation blade (18) and the central section of the two mounting brackets (8) are located in the same horizontal plane, and the central axis of the heat dissipation blade (18) and the central axis of the integrated device body (2) are arranged in a colinear manner.

8. The GaN integrated device according to claim 2, characterized in that: The wind directions of the two side cooling fans (11) are oppositely arranged. The side cooling fans (11) are used to absorb the heat generated by the cooling fins a (9). The size of the side cooling fans (11) is consistent with the size of the mounting bracket (8). The wind direction of the cooling blades (18) is vertically downward. The cooling blades (18) are used to blow air into between the two mounting brackets (8) to accelerate the heat dissipation speed of the cooling fins a (9).

9. The GaN integrated device according to claim 3, characterized in that: The opening length of the slide groove (28) is consistent with the length of the channel a (20), the maximum rotation angle of the rotating wheel (33) is approximately 43°, and the opening length of the channel a (20) is consistent with the opening length of the channel b (34).

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