Thermoelectric semiconductor heat exchange device and side wall heat exchange type cold and warm cup holder

Abstract

The invention relates to a thermoelectric semiconductor heat exchange device and a side wall heat exchange type cold and warm cup holder. The technical problem that in the prior art, design is not reasonable enough is solved. Which comprises a plurality of thermoelectric semiconductor pieces, one side of each thermoelectric semiconductor piece is located on one side of a hot end radiator, and is characterized in that the hot end radiator is installed in a wind scooper assembly, and one end, far away from the hot end radiator, of the wind scooper assembly is provided with a cooling fan corresponding to the hot end radiator; and a sealing structure is arranged between the cooling fan and the wind scooper assembly. The cold and warm cup stand has the advantages that the cup stand is divided into one half of the clamping jaw unfolding mechanism and the other half of the cup stand, the restraining function of the clamping jaw of the cup stand is reserved, the heat preservation layer is arranged on the side wall of the cup stand, the influence of the environment on the performance of the cup stand is reduced, the temperature gradient of the cold and warm cup stand in the heat transfer direction is obviously reduced, and the heat preservation performance of the cold and warm cup stand is effectively improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of inventing vehicle-mounted cooling and heating box equipment, and specifically relates to a thermoelectric semiconductor heat exchange device and a side wall heat exchange type cooling and heating cup holder. Background Art

[0002] There are many types of car cup holders on the market, such as the cold and warm cup holders with claws and thermoelectric semiconductor heat exchange. However, the thermoelectric semiconductor sheet of the claw-type cold and warm cup holder with thermoelectric semiconductor heat exchange device is usually arranged at the bottom of the cup holder, and the claws arranged on the circumferential side wall of the cup holder to restrain the shaking of the cup in the cup holder will make it impossible to effectively arrange the insulation layer around the cold and warm cup holder, which leads to the following disadvantages when the cold and warm cup holder is working: 1. It is greatly affected by the ambient temperature; 2. The cold or heat loss of the cold and warm cup holder in the heat transfer direction is fast, that is, the temperature gradient changes greatly in the height direction; 3. The cold and warm cup holder has poor insulation performance. Summary of the invention

[0003] The object of the present invention is to provide a thermoelectric semiconductor heat exchange device in view of the above problems.

[0004] Another object of the present invention is to provide a side wall heat exchange type cold and warm cup holder in order to solve the above problem.

[0005] To achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a thermoelectric semiconductor heat exchange device, comprising a plurality of thermoelectric semiconductor sheets, one side of the thermoelectric semiconductor sheets is located on the side of a hot-end radiator, characterized in that the hot-end radiator is installed in an air guide cover assembly, and a heat dissipation fan corresponding to the hot-end radiator is installed at one end of the air guide cover assembly away from the hot-end radiator, and a sealing structure is provided between the heat dissipation fan and the air guide cover assembly.

[0006] In the above-mentioned thermoelectric semiconductor heat exchange device, the number of the thermoelectric semiconductor sheets is two and one side of the thermoelectric semiconductor sheets is closely attached to one side of the hot end heat sink.

[0007] In the above-mentioned thermoelectric semiconductor heat exchange device, the air guide hood assembly includes an air guide hood, the hot end radiator is installed on the inner side of one end of the air guide hood and the heat dissipation fan is installed on the inner side of the other end of the air guide hood, and the air guide hood has a heat dissipation fan. Both sides of one end are respectively provided with a first ECU and a second ECU connected to the thermoelectric semiconductor sheets one by one, and the first ECU and the second ECU are connected by an ECU bridge harness.

[0008] In the above-mentioned thermoelectric semiconductor heat exchange device, one end of the air guide cover has a radiator mounting seat, and the radiator mounting seat has a radiator mounting cavity for accommodating a hot-end radiator, and the end surface of the radiator mounting seat away from the heat dissipation fan and both sides of the radiator mounting seat are open and the circumferential outer side of the hot-end radiator is exposed by the opening, the other end of the air guide cover has a fan seat connected to the radiator mounting seat as an integral structure, the first ECU and the second ECU are respectively fixed on both sides of the fan seat, and the end of the radiator mounting seat close to the fan seat has a fan hole corresponding to the hot-end radiator, and the heat dissipation fan is installed on the radiator mounting seat and corresponds to the fan hole.

[0009] In the above-mentioned thermoelectric semiconductor heat exchange device, the sealing structure includes a fan sealing ring arranged on the circumferential inner side of the fan hole, and one side of the fan sealing ring is abutted against the hot end heat sink and the other side is abutted against the heat dissipation fan.

[0010] A side wall heat exchange type cold and warm cup holder is provided with the above-mentioned thermoelectric semiconductor heat exchange device, comprising a cup holder sub-assembly and a claw mechanism assembly cooperating with the cup holder sub-assembly, characterized in that an air guide cover assembly is installed on one side of the cup holder sub-assembly, and two thermoelectric semiconductor sheets are provided between the hot end radiator in the air guide cover assembly and one side of the cup holder sub-assembly, and the thermoelectric semiconductor sheets are connected to the control switch assembly.

[0011] In the above-mentioned side wall heat exchange type cold and warm cup holder, the cup holder sub-assembly includes a cup holder mounting bracket, the cup holder mounting bracket is provided with two cup holder mounting positions, the cup holder mounting positions are respectively provided with a first cup holder and a second cup holder, the side walls of the first cup holder and the second cup holder are respectively provided with temperature sensors connected to a first ECU and a second ECU, and a filling insulation layer is provided between the first cup holder and the second cup holder and the cup holder mounting bracket.

[0012] In the above-mentioned side wall heat exchange type hot and cold cup holder, the cup holder mounting position is arc-shaped and the opening faces different directions, the shapes of the first cup holder and the second cup holder are adapted to the cup holder mounting position and the first cup holder and the second cup holder are respectively fixed to the cup holder mounting bracket by mounting screws.

[0013] In the above-mentioned side wall heat exchange type heating and cooling cup holder, the cup holder mounting bracket is provided with two semiconductor sheet mounting holes for inserting one side of the thermoelectric semiconductor sheet, the first cup holder and the second cup holder have heat conduction planes corresponding to one side of the thermoelectric semiconductor sheet respectively on their sides, and the thermoelectric semiconductor sheet is arranged between the first cup holder, the second cup holder and the hot end heat sink, and one side of the thermoelectric semiconductor sheet is provided with a thermoelectric semiconductor sheet sealing pad located outside the semiconductor sheet mounting hole.

[0014] In the above-mentioned side wall heat exchange type heating and cooling cup holder, the control switch assembly has two independently arranged buttons, and the control switch assembly is connected to the first ECU and the second ECU respectively.

[0015] Compared with the prior art, the advantages of the present invention are:

[0016] 1. Forced heat exchange is achieved through the cooling fan. At the same time, the sealing structure between the cooling fan and the air guide cover assembly can prevent the wind generated by the cooling fan from leaking to other places before reaching the hot end radiator, thereby weakening the cooling fan's ability to force heat exchange.

[0017] 2. Compared with the conventional claw-type cup holder, the present invention splits the cup holder into one half as the claw deployment mechanism and the other half as the cup holder, which not only retains the restraining function of the cup holder claw, but also arranges a heat preservation layer on the side wall of the cup holder, thereby reducing the impact of the environment on the performance of the cup holder, significantly reducing the temperature gradient of the hot and cold cup holder in the heat transfer direction, and effectively improving the heat preservation performance of the hot and cold cup holder.

[0018] 3. The thermoelectric semiconductor heat exchange device and the side wall heat exchange type hot and cold cup holder equipped with the heat exchange device designed by the present invention have novel structures, and the deployable claw structure is very rare in the market, which can effectively widen the product design gap with competitors and improve product selling points. It can be modularly integrated in the drawer as an optional solution for automobile interior decoration to expand the product's audience range. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural explosion diagram of the side wall heat exchange type cold and warm cup holder of the present invention.

[0020] Figure 2 It is an assembly diagram of the side wall heat exchange type cold and warm cup holder of the present invention.

[0021] Figure 3 It is a structural exploded view of the cup holder sub-assembly in the present invention.

[0022] Figure 4 It is a structural explosion diagram of the air guide cover assembly in the present invention.

[0023] Figure 5 It is a cross-sectional view of the sealing structure in the present invention.

[0024] In the figure: thermoelectric semiconductor chip 1, hot end radiator 2, air guide cover assembly 3, heat dissipation fan 31, air guide cover 32, radiator mounting seat 321, fan seat 322, fan hole 323, first ECU 33, second ECU 34, ECU bridge harness 35, sealing structure 4, fan sealing ring 41, cup holder sub-assembly 5, cup holder mounting bracket 51, cup holder mounting position 511, first cup holder 52, second cup holder 53, temperature sensor 54, filling insulation layer 55, semiconductor chip mounting hole 56, heat conduction plane 57, thermoelectric semiconductor chip sealing pad 58, claw mechanism assembly 6, claw seat 61, claw body 611, control switch assembly 7, button 71. DETAILED DESCRIPTION

[0025] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] like Figure 1 as well as Figure 4-5 As shown, a thermoelectric semiconductor heat exchange device includes two thermoelectric semiconductor sheets 1, one side of the thermoelectric semiconductor sheets 1 is closely attached to one side of a hot end radiator 2, the hot end radiator 2 is installed in an air guide cover assembly 3, and a heat dissipation fan 31 corresponding to the hot end radiator 2 is installed at one end of the air guide cover assembly 3 away from the hot end radiator 2, and a sealing structure 4 is provided between the heat dissipation fan 31 and the air guide cover assembly 3. The thermoelectric semiconductor sheets 1 here are respectively arranged on the outside of the cup holder to heat or cool the outer wall of the cup holder, and heat exchange is forced by the heat dissipation fan 31. At the same time, the sealing structure between the heat dissipation fan and the air guide cover assembly can prevent the wind generated by the heat dissipation fan from leaking to other places before reaching the hot end radiator, thereby weakening the ability of the heat dissipation fan to force heat exchange.

[0027] The air guide cover assembly 3 includes an air guide cover 32, the hot end radiator 2 is installed on the inner side of one end of the air guide cover 32, and the heat dissipation fan 31 is installed on the inner side of the other end of the air guide cover 32. The air guide cover 32 has a heat dissipation fan 31. Both sides of one end are provided with a first ECU 33 and a second ECU 34 connected to the thermoelectric semiconductor sheet 1 one by one, and the first ECU 33 and the second ECU 34 are connected through an ECU bridge harness 35. The first ECU 33 and the second ECU 34 are connected and conducted by the ECU bridge harness 35 to realize communication between the two ECUs.

[0028] The heat dissipation fan 31 is installed on the radiator 321 and the heat dissipation fan 31 is installed on the radiator 321. The heat dissipation fan 31 is installed on the radiator 321 and the heat dissipation fan 31 is installed on the radiator 321. The heat dissipation fan 31 is installed on the radiator 321 and the heat dissipation fan 31 is installed on the radiator 321. The heat dissipation fan 31 is installed on the radiator 321 and the heat dissipation fan 31 is installed on the radiator 321. The heat dissipation fan 31 is installed on the radiator 321 and the heat dissipation fan 31 is installed on the radiator 321. The heat dissipation fan 31 is installed on the radiator 321. The heat dissipation fan 31 is installed on the radiator 321. The heat dissipation fan 31 is installed on the radiator 321. The heat dissipation fan 31 is installed on the radiator 321. The heat dissipation fan 31 is installed on the radiator 321. The heat dissipation fan 31 is installed on the radiator 321. The heat dissipation fan 31 The fan sealing ring 41 prevents the wind generated by the heat dissipation fan 31 from leaking to other places before reaching the hot end radiator 2, thereby reducing the forced heat exchange capability of the heat dissipation fan 31.

[0029] like Figure 1-Figure 4 As shown, a side wall heat exchange type cold and warm cup holder in this embodiment includes a cup holder sub-assembly 5 and a claw mechanism assembly 6 matched with the cup holder sub-assembly 5, an air guide cover assembly 3 is installed on one side of the cup holder sub-assembly 5 by screws, and two thermoelectric semiconductor sheets 1 are arranged between the hot end heat sink 2 in the air guide cover assembly 3 and one side of the cup holder sub-assembly 5, and the thermoelectric semiconductor sheets 1 are connected to the control switch assembly 7. The outer wall of the cup holder sub-assembly 5 is heated or cooled by arranging the thermoelectric semiconductor sheets 1 on the outer side of the cup holder sub-assembly 5.

[0030] The cup holder sub-assembly 5 includes a cup holder mounting bracket 51, on which two cup holder mounting positions 511 are provided, in which the first cup holder 52 and the second cup holder 53 are respectively installed, and the side walls of the first cup holder 52 and the second cup holder 53 are respectively installed with temperature sensors 54 connected to the first ECU 33 and the second ECU 34, and a filling insulation layer 55 is provided between the first cup holder 52 and the second cup holder 53 and the cup holder mounting bracket 51.

[0031] Furthermore, the temperature sensor 54 is arranged on the side wall of the first cup holder 52 and the second cup holder 53 to monitor their temperature and feed back to the ECU, and then the ECU adjusts the cooling or heating power of the thermoelectric semiconductor chip 1 so that the temperature of the first cup holder 52 and the second cup holder 53 can fluctuate within a small range.

[0032] Furthermore, the cup holder installation position 511 is arc-shaped and its opening faces different directions, the first cup holder 52 and the second cup holder 53 have shapes that match the cup holder installation position 511, and the first cup holder 52 and the second cup holder 53 are respectively fixed to the cup holder installation bracket 51 by mounting screws. That is, the first cup holder 52 and the second cup holder 53 are fastened to the cup holder installation bracket 51 by screws, and then the insulation layer 55 is filled between the first cup holder 52, the second cup holder 53 and the cup holder installation bracket 51 in the form of integrated foaming to reduce the ineffective loss of cold or heat on the outer surface of the cup holder, thereby improving the insulation performance of the cup holder.

[0033] The cup holder mounting bracket 51 is provided with two semiconductor sheet mounting holes 56 for inserting one side of the thermoelectric semiconductor sheet 1, and the first cup holder 52 and the second cup holder 53 have heat conduction planes 57 corresponding to one side of the thermoelectric semiconductor sheet 1 on their sides, respectively, and the thermoelectric semiconductor sheet 1 is arranged between the first cup holder 52, the second cup holder 53 and the hot end radiator 2, and one side of the thermoelectric semiconductor sheet 1 is provided with a thermoelectric semiconductor sheet sealing pad 58 located outside the semiconductor sheet mounting hole 56. The thermoelectric semiconductor sheet 1 is arranged between the first cup holder 52, the second cup holder 53 and the hot end radiator 2, and the thermoelectric semiconductor sheet sealing pad 58 is used to seal the thermoelectric semiconductor sheet 1, which greatly reduces the ineffective heat exchange between the thermoelectric semiconductor sheet 1 and the external environment.

[0034] The control switch assembly 7 here has two independently arranged buttons 71, and the control switch assembly 7 is respectively connected to the first ECU 33 and the second ECU 34. The two buttons can independently control the cooling and heating of the left and right cup holders. Each cup holder has three states: cooling, heating and standby. When the button is pressed, the three states are switched in sequence to realize the interactive control between the person and the cold and warm cup holders.

[0035] The claw mechanism assembly 6 in this embodiment is fixed under the holder mounting bracket 51. The claw mechanism assembly 6 has two openings that are oppositely arranged and arc-shaped claw seats 61. The claw seats 61 here are respectively arranged in one-to-one correspondence with the first cup holder 52 and the second cup holder 53 to enclose a cylindrical cup placement space, that is, the cup holder is split into half for the claw deployment mechanism and the other half for the cup holder. A claw body 611 is provided in the claw seat 61 to restrain and prevent the cup from shaking.

[0036] The principle of this embodiment is:

[0037] The cup holder is split into one half as a claw mechanism assembly and the other half as a cup holder. Meanwhile, thermoelectric semiconductor sheets 1 are arranged on the outside of the cup holder to heat or cool the outer wall of the cup holder. This not only retains the restraining function of the cup holder claws, but also arranges a heat preservation layer on the side wall of the cup holder to reduce the ineffective loss of cold or heat on the outer surface of the cup holder, thereby improving the heat preservation performance of the cup holder.

[0038] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

[0039] Although the present invention uses more terms such as thermoelectric semiconductor chip 1, hot end heat sink 2, air guide cover assembly 3, heat dissipation fan 31, air guide cover 32, heat sink mounting seat 321, fan seat 322, fan hole 323, first ECU 33, second ECU 34, ECU bridge harness 35, sealing structure 4, fan seal 41, cup holder sub-assembly 5, cup holder mounting bracket 51, cup holder mounting position 511, first cup holder 52, second cup holder 53, temperature sensor 54, filling insulation layer 55, semiconductor chip mounting hole 56, heat conduction plane 57, thermoelectric semiconductor chip sealing pad 58, claw mechanism assembly 6, claw seat 61, claw body 611, control switch assembly 7, button 71, etc., the possibility of using other terms is not excluded. The use of these terms is only for the purpose of more conveniently describing and explaining the essence of the present invention; interpreting them as any additional restrictions is contrary to the spirit of the present invention.

Claims

1. A thermoelectric semiconductor heat exchange device, comprising a plurality of thermoelectric semiconductor sheets (1), one side of the thermoelectric semiconductor sheets (1) being located on the side of a hot end heat sink (2), characterized in that: The hot end radiator (2) is installed in the air guide cover assembly (3), and a heat dissipation fan (31) corresponding to the hot end radiator (2) is installed at one end of the air guide cover assembly (3) away from the hot end radiator (2), and a sealing structure (4) is provided between the heat dissipation fan (31) and the air guide cover assembly (3).

2. A thermoelectric semiconductor heat exchange device according to claim 1, characterized in that: The number of the thermoelectric semiconductor sheets (1) is two, and one side of each of the thermoelectric semiconductor sheets (1) is closely attached to one side of the hot end heat sink (2).

3. The thermoelectric semiconductor heat exchange device according to claim 1, characterized in that: The air guide cover assembly (3) comprises an air guide cover (32), the hot end radiator (2) is installed on the inner side of one end of the air guide cover (32), and the heat dissipation fan (31) is installed on the inner side of the other end of the air guide cover (32), the air guide cover (32) has a first ECU (33) and a second ECU (34) connected to the thermoelectric semiconductor chip (1) on both sides of one end of the heat dissipation fan (31), and the first ECU (33) and the second ECU (34) are connected to each other via an ECU bridge harness (35).

4. A thermoelectric semiconductor heat exchange device according to claim 3, characterized in that: The air guide cover (32) has a radiator mounting seat (321) at one end, and the radiator mounting seat (321) has a radiator mounting cavity for accommodating the hot end radiator (2). The end surface of the radiator mounting seat (321) away from the heat dissipation fan (31) and both sides of the radiator mounting seat (321) are open, and the circumferential outer side of the hot end radiator (2) is exposed by the opening. The other end of the air guide cover (32) has a fan seat (322) connected to the radiator mounting seat (321) as an integrated structure. The first ECU (33) and the second ECU (34) are respectively fixed on both sides of the fan seat (322). The end of the radiator mounting seat (321) close to the fan seat (322) has a fan hole (323) corresponding to the hot end radiator (2). The heat dissipation fan (31) is installed on the radiator mounting seat (321) and corresponds to the fan hole (323).

5. A thermoelectric semiconductor heat exchange device according to claim 4, characterized in that: The sealing structure (4) comprises a fan sealing ring (41) arranged on the inner side of the fan hole (323) in the circumferential direction, and one side of the fan sealing ring (41) is arranged against the hot end heat sink (2) and the other side is arranged against the heat dissipation fan (31).

6. A side wall heat exchange type cold and warm cup holder equipped with a thermoelectric semiconductor heat exchange device as claimed in any one of claims 1 to 5, comprising a cup holder sub-assembly (5) and a claw mechanism assembly (6) cooperating with the cup holder sub-assembly (5), characterized in that: An air guide cover assembly (3) is installed on one side of the cup holder sub-assembly (5), and two thermoelectric semiconductor sheets (1) are arranged between the hot end heat sink (2) in the air guide cover assembly (3) and one side of the cup holder sub-assembly (5), and the thermoelectric semiconductor sheets (1) are connected to the control switch assembly (7).

7. The side wall heat exchange type cold and warm cup holder according to claim 6, characterized in that: The cup holder sub-assembly (5) comprises a cup holder mounting bracket (51), the cup holder mounting bracket (51) is provided with two cup holder mounting positions (511), a first cup holder (52) and a second cup holder (53) are respectively installed in the cup holder mounting positions (511), side walls of the first cup holder (52) and the second cup holder (53) are respectively provided with temperature sensors (54) connected to a first ECU (33) and a second ECU (34), and a filling insulation layer (55) is provided between the first cup holder (52) and the second cup holder (53) and the cup holder mounting bracket (51).

8. The side wall heat exchange type cold and warm cup holder according to claim 7, characterized in that: The cup holder mounting position (511) is arc-shaped and its opening faces different directions; the shapes of the first cup holder (52) and the second cup holder (53) are adapted to the cup holder mounting position (511); and the first cup holder (52) and the second cup holder (53) are respectively fixed to the cup holder mounting bracket (51) by mounting screws.

9. The side wall heat exchange type cold and warm cup holder according to claim 7, characterized in that: The cup holder mounting bracket (51) is provided with two semiconductor chip mounting holes (56) for inserting one side of the thermoelectric semiconductor chip (1); the sides of the first cup holder (52) and the second cup holder (53) are respectively provided with heat conduction planes (57) corresponding to one side of the thermoelectric semiconductor chip (1); the thermoelectric semiconductor chip (1) is arranged between the first cup holder (52), the second cup holder (53) and the hot end heat sink (2); and one side of the thermoelectric semiconductor chip (1) is provided with a thermoelectric semiconductor chip sealing pad (58) located outside the semiconductor chip mounting hole (56).

10. The side wall heat exchange type cold and warm cup holder according to claim 6, characterized in that: The control switch assembly (7) has two independently arranged buttons (71), and the control switch assembly (7) is connected to the first ECU (33) and the second ECU (34) respectively.

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