PCB circuit board with overclocking characteristic
By designing obliquely arranged differential lines and chain-shaped daisy-shaped RAM gold fingers connected to the BGA array on the PCB circuit board, the problem of signal interference and time delay difference during overclocking is solved, the reflow and heat dissipation ability of the PCB are improved, and overclocking failure is avoided.
Patent Information
- Application Number
- CN202411763966.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2025-03-18
AI Technical Summary
During the overclocking process, the PCB circuit board is prone to increased working temperature, interference between the lower lines of high-frequency signals, increased signal transmission delay difference between differential line pairs, and increased radiation caused by discontinuous points of link impedance, resulting in a time difference between the input signal and the output signal, which leads to an overclocking failure.
A PCB circuit board with overclocking characteristics is designed. By setting differential lines, BGA arrays, graphics card gold fingers and RAM gold fingers on the bare board, and connecting them with the BGA array with obliquely arranged differential lines and chain-shaped daisy structure RAM gold fingers to reduce crosstalk and glass fiber skew effect.
This design can improve the reflow and heat dissipation capability of the PCB, reduce crosstalk and skew effects, avoid overclocking failure, and ensure stable signal transmission under overclocking conditions.
Smart Images
Figure CN119653583A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of PCB design, and in particular to a PCB circuit board with overclocking characteristics. Background Art
[0002] With the rapid development of electronic games, more and more online enthusiasts are pursuing computer speed and often overclocking computer hardware in order to maximize the performance of their computers. Some users will buy low-end devices and overclock their performance to the level of high-end devices. However, more people will buy high-configuration computers and use advanced cooling systems to assist in overclocking.
[0003] Overclocking is a method of increasing the clock speed of an electronic component to a higher speed than the manufacturer's specified speed, thereby improving performance. However, this may cause the stability and life of the component to decrease. Overclocking is actually a customized computer debugging method that adjusts the various system values of the CPU, graphics card, memory and motherboard, such as power, voltage, frequency, etc., to obtain better computer performance (such as increasing component processing speed, accelerating game progress, etc.). In addition to speeding up your computer hardware, some players also regard overclocking as an exciting game. For example, if the computer cannot run stably after overclocking, the overclocker uses different methods such as adding voltage and adjusting the CL (Column Address Strobelatency) value of DRAM to make it run stably. When the overclocking is successfully exceeded and runs stably, the overclocking player will have an abnormal joy.
[0004] With the need for overclocking, the usual practice is to test the connections between the CPU, graphics card, memory and motherboard, especially the interconnection between the CPU and the inner layer (RAM) through the DDR channel on the motherboard; the interconnection between the CPU and the graphics card through the PCLE channel on the motherboard. Generally, DDR is a single-ended impedance transmission line, and PCLE is a differential pair impedance transmission line. In overclocking tests, the voltage and operating frequency are generally increased, that is, the number of pulses per unit time of the signal. Generally, overclocking will cause several problems: 1. The operating temperature rises; 2. The lines interfere with each other under high-frequency signals; 3. The signal transmission delay difference of the differential line pair increases; 4. The radiation caused by the discontinuous point of the link impedance increases, which leads to a time difference between the input signal and the output signal, resulting in overclocking failure. Summary of the invention
[0005] The purpose of the present invention is to overcome the deficiencies of the above prior art and provide a PCB circuit board with overclocking characteristics.
[0006] The purpose of the present invention is achieved through the following technical solutions: A PCB circuit board with overclocking characteristics includes a bare board, a BGA array, a graphics card gold finger, a differential line and a RAM gold finger, wherein the differential line is arranged on the upper surface of the bare board, the BGA array, the graphics card gold finger and the RAM gold finger are all installed on the top of the bare board, the RAM gold finger is connected to the BGA array through a single-sided board, the BGA array is connected to the graphics card gold finger through the differential line, the differential line is arranged obliquely relative to the BGA array, and the differential lines are parallel to each other; the BGA array is used to connect the CPU; the graphics card gold finger complies with the high-speed communication protocol and is used to connect the graphics card; the RAM gold finger is used to connect the memory stick. This PCB circuit board can reduce crosstalk and reduce the skew effect of glass fiber.
[0007] More preferably, the oblique angle of the differential line relative to the BGA array ranges from 30 to 60 degrees. The arrangement of the differential line and the BGA array can achieve oblique intersection of the wiring and the material in the longitude and latitude directions, thereby reducing the skew effect.
[0008] A better choice is that the bare board includes a single-sided board, a single-layer ground board, a shielding insulation board and a PCLE channel layer, the single-sided board is connected to both sides of the single-layer ground board through the shielding insulation board to form an inner board, the two sides of the inner board are connected to the PCLE channel layer to form a bare board, the BGA array, the graphics card gold finger and the RAM gold finger are all installed on the PCLE channel layer at the top of the bare board, and the differential line is arranged in the PCLE channel layer. The structure of this bare board can shield signals and avoid mutual interference between signal layers.
[0009] A more preferred option is that the single-sided board includes a core layer, a ground layer and a DDR layer, the two sides of the core layer are respectively connected to the ground layer and the DDR layer, the ground layer is connected to one shielding insulating board, and the DDR layer is connected to another shielding insulating board.
[0010] More preferably, the controlled impedance of the single-ended impedance line of the DDR layer is 50 ohm.
[0011] More preferably, the DDR layer is a chain structure with unequal lengths.
[0012] More preferably, the ground layer and the DDR layer are symmetrical structures.
[0013] As a better choice, the ground layer and the DDR layer board are made of flat cloth, and the thickness of the flat cloth ranges from 6 to 8 mils.
[0014] A better choice is that the shielding insulation plate is made of PP.
[0015] A more preferred option is that the RAM gold fingers and the BGA array are arranged in a chain-like daisy structure.
[0016] More preferably, the controlled impedance of the differential line is 85 ohm.
[0017] A better choice is that the copper thickness of the DDR layer is 1 oz, the copper thickness of the ground layer is 2 oz, and the DDR layer and the ground layer are arranged in a staggered manner. After the copper thickness of the DDR layer and the ground layer is increased, not only the current carrying capacity can be increased, but also the heat dissipation effect can be improved.
[0018] A better choice is that the diameter of the pad of the bare board is compensated, and the diameter of the pad after compensation is 100um. This design can reduce the time difference between the input signal and the output signal.
[0019] The present invention has the following advantages and beneficial effects compared with the prior art:
[0020] A PCB circuit board with overclocking characteristics can improve the PCB reflow capacity and heat dissipation capacity, reduce crosstalk, reduce the skew effect of glass fiber, reduce the parasitic capacitance and inductance of the via stump, reduce the time difference, and avoid overclocking failure. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a schematic diagram of the horizontal and vertical trend layout of the existing PCB motherboard;
[0022] Figure 2 It is a schematic diagram of a layout optimization process of a PCB circuit board with overclocking characteristics of the present invention (the left figure is a conventional design, and the right figure is an optimized design);
[0023] Figure 3 It is a schematic diagram of a via optimization process of a PCB circuit board with overclocking characteristics of the present invention (the left figure is a conventional design, and the right figure is an optimized design);
[0024] Figure 4 It is a schematic diagram of a bare board stack of a PCB circuit board with overclocking characteristics according to the present invention; DETAILED DESCRIPTION
[0025] The purpose of the present invention is further described in detail below with reference to the accompanying drawings and specific examples. The examples cannot be described one by one here, but the implementation methods of the present invention are not therefore limited to the following examples.
[0026] Example 1
[0027] The existing PCB (Process Control Block) motherboard design generally adopts a regular horizontal and vertical trend layout. Due to the different densities and gaps in the warp and weft directions of the glass fiber cloth of the copper clad laminate, one of the existing differential lines is distributed on the glass cloth and the other is distributed in the gap position. Because the Dk of the glass cloth and resin of the copper clad laminate is different, according to the transmission speed of electromagnetic waves Where c is the speed of light, is the dielectric constant, v is the output speed, l is the cable length. Figure 1 As shown in the figure, when the distribution position of the differential line (differential line) is different, it is easy to cause the delay difference of the signal transmission on the differential pair. In order to further reduce the gap effect of the glass cloth, flat cloth control is used to ensure the consistency of the material's Dk (dielectric constant) without delay.
[0028] PCB compensation means: from the customer's original CAD (computer-aided design) design to the PCB company's CAM (computer-aided manufacturing) compensation optimization, for example: a hole is 0.25mm; the pad is 0.1mm larger than the hole on one side, so the pad size is 0.45mm; and in PCB manufacturing, the exposure data according to the 0.45mm graphic design will cause the actual size to become smaller, because the liquid etching, such as 35um thick copper foil, reacts from top to bottom, and also reacts to the side, that is, the edge covered by the dry film will also react, resulting in side etching. In order to ensure that the finished product still has 0.45mm, the pad is generally compensated, that is, the exposure data is designed to be 0.5mm, and the finished product becomes 0.45mm after etching.
[0029] To improve the heat dissipation effect during overclocking, existing PCB motherboards generally choose a copper thickness of 0.5oz or 1oz. To ensure the heat dissipation effect and the impedance control of the signal line at the same time, the copper thickness of the DDR layer and the ground layer can be increased. Increasing the copper thickness of the DDR layer and the ground layer from 0.5oz or 1oz to 2oz can not only increase the current carrying capacity, but also improve the heat dissipation effect.
[0030] like Figure 2As shown, a PCB circuit board with overclocking characteristics includes a bare board, a BGA array, a graphics card gold finger, multiple differential lines and two RAM gold fingers. Multiple differential lines are arranged on the upper surface of the bare board (that is, the upper surface of the PCLE channel layer). The pads of the BGA array, the pads of the graphics card gold finger and the pads of the two RAM gold fingers are all arranged on the upper surface of the bare board. The pads of the RAM gold finger are connected to the DDR layer of the single-sided board of the bare board through the short lines and vias of the PCLE channel layer on the surface of the bare board in turn, and then the DDR layer is connected to the BGA array. The structure of the two RAM gold fingers and the BGA array is a chain daisy structure. The BGA array is connected to the graphics card gold finger through multiple differential lines, and the multiple differential lines are arranged obliquely relative to the BGA array. The oblique angle of the multiple differential lines relative to the BGA array is 30°. The multiple differential lines are parallel to each other, so that the wiring and the material are obliquely crossed in the longitude and latitude directions, reducing the skew effect (the glass fiber weaving effect causes signal jitter and delay difference).
[0031] The bare board is an eight-layer circuit board, which includes L1 to L8 in order. Among them, L1 and L8 (i.e., PCLE channel layers) are used for wiring layout connected to the graphics card gold finger; L3 and L6 are DDR layers, which are used for the layout of single-ended signal lines of the DDR layer; L2, L4, L5 and L7 are all ground layers; the bare board is used to connect and support electronic components, increase assembly density and reduce volume, optimize signal transmission, enhance heat dissipation and shielding effects, and improve reliability and durability. The BGA array is used to connect the CPU. The graphics card gold finger complies with the high-speed communication protocol PCLE4.0. The controlled impedance of the differential line is 85ohm, which is used to connect the BGA array and the graphics card gold finger. The RAM gold finger is used to connect the memory stick.
[0032] like Figure 4 As shown, the bare board includes two single-sided boards, a single-layer ground board, four shielded insulating boards and two PCLE channel layers. Each single-sided board includes a core layer, a ground board and a DDR layer. The two sides of the core layer are respectively connected to the ground board and the DDR layer, and the DDR layer and the ground board present a symmetrical structure. The single-layer ground board includes a core layer and two ground layers, and the upper and lower sides of the core layer are respectively connected to the two ground layers. The upper and lower sides of the single-layer ground board are respectively connected to the two single-sided boards through shielded insulating boards, and the two single-sided boards are arranged in a mirror-symmetrical manner, that is, the DDR layers of the two single-sided boards are close to one side of the single-layer ground board. Two single-sided boards, a single-layer ground board and four shielded insulating boards constitute an inner layer board. The upper and lower sides of the inner layer board are respectively connected to the two PCLE channel layers to form a bare board. As shown Figure 3As shown in the figure, there is a pad on the PCLE channel layer on the upper side of the bare board. After compensation, the pad of the RAM gold finger has a diameter of 100um; there is no pad on the PCLE channel layer on the lower side of the bare board, which is achieved by tinning to protect the hole wall and alkaline etching, and can reduce the radiation effect of the signal. This design can reduce the parasitic capacitance and inductance of the via stump; parasitic capacitance will prolong the rise time of the signal and reduce the speed of the circuit. By reducing parasitic capacitance, the rise time of the signal can be shortened and the working speed of the circuit can be increased. Parasitic capacitance and inductance will cause signal attenuation and affect the quality of the signal. By reducing parasitic parameters, signal attenuation can be reduced to ensure the integrity and accuracy of the signal. The bare board adopts a staggered layout with a copper thickness of 1oz (1oz=35μm) and a copper thickness of 2oz, in which the copper thickness of the PCLE channel layer and the DDR layer is 1oz, and the copper thickness of the ground layer is 2oz. The DDR layer and the ground layer are symmetrical.
[0033] The main function of the single-layer board is to provide wiring, circuit connection and signal transmission. The main function of the single-layer ground plane is to reduce electromagnetic interference, improve heat dissipation, improve signal integrity, and enhance the reliability of the circuit board. The shielding insulation board is made of PP, which plays the role of signal shielding and insulation. The PCLE channel layer is made of flat cloth, and the copper thickness of the PCLE channel layer is 1oz, which provides high-speed data transmission and signal integrity protection. The core layer serves as a substrate and plays a supporting role. The ground layer is made of flat cloth, and its copper thickness is 2oz, which is used for grounding. The controlled impedance of the single-ended impedance line of the DDR layer is 50ohm. The DDR layer is made of flat cloth, and its copper thickness is 1oz. The DDR layer is a chain structure of non-equal length, signal transmission and impedance control, ensuring the stable transmission of high-speed signals. The specification of the above-mentioned flat cloth is 1078, and the thickness of the flat cloth is 6mil. The interlayer spacing of the flat cloth ensures that the line impedance and line width of the DDR layer are 4mil, and the line spacing between different pins is greater than 12mil, reducing the signal interference between DDR single-ended signal lines and DDR single-ended signal lines.
[0034] A PCB circuit board with overclocking characteristics optimizes the link design of the transmission lines of the DDR layer and the PCLE channel layer on the computer motherboard, including optimizing the topological structure of the DDR channel between the chip and the RAM, reducing the signal radiation of the interconnection channel and the crosstalk between the cables, and reducing the delay difference of the differential line through the consistency design of the differential pair wiring of the PCLE channel layer, thereby meeting the stable transmission of the signal under overclocking.
[0035] Example 2
[0036] like Figure 2As shown, a PCB circuit board with overclocking characteristics in this embodiment includes a bare board, a BGA array, a graphics card gold finger, multiple differential lines and two RAM gold fingers. Multiple differential lines are arranged on the upper surface of the bare board (that is, the upper surface of the PCLE channel layer). The pads of the BGA array, the pads of the graphics card gold finger and the pads of the two RAM gold fingers are all arranged on the upper surface of the bare board. The pads of the RAM gold finger are connected to the DDR layer of the single-sided board of the bare board through the short lines and vias of the PCLE channel layer on the surface of the bare board in turn, and then the DDR layer is connected to the BGA array. The structure of the two RAM gold fingers and the BGA array is a chain daisy structure. The BGA array is connected to the graphics card gold finger through multiple differential lines, and the multiple differential lines are arranged obliquely relative to the BGA array. The oblique angle of the multiple differential lines relative to the BGA array is 60°, and the multiple differential lines are parallel to each other, so as to realize the oblique intersection of the wiring and the material in the longitude and latitude directions, and reduce the skew effect (the glass fiber weaving effect causes signal jitter and delay difference).
[0037] The bare board is an eight-layer circuit board, which includes L1 to L8 in order. Among them, L1 and L8 (i.e., PCLE channel layers) are used for wiring connection with the graphics card gold finger; L3 and L6 are DDR layers, which are used for the layout of single-ended signal lines of the DDR layer; L2, L4, L5 and L7 are all ground layers; the bare board is used to connect and support electronic components, increase assembly density and reduce volume, optimize signal transmission, enhance heat dissipation and shielding effects, and improve reliability and durability. The BGA array is used to connect the CPU. The graphics card gold finger complies with the high-speed communication protocol PCLE5.0. The controlled impedance of the differential line is 85ohm, which is used to connect the BGA array and the graphics card gold finger. The RAM gold finger is used to connect the memory stick.
[0038] like Figure 4 As shown, the bare board includes two single-sided boards, a single-layer ground board, four shielded insulating boards and two PCLE channel layers. Each single-sided board includes a core layer, a ground board and a DDR layer. The two sides of the core layer are respectively connected to the ground board and the DDR layer, and the DDR layer and the ground board present a symmetrical structure. The single-layer ground board includes a core layer and two ground layers, and the upper and lower sides of the core layer are respectively connected to the two ground layers. The upper and lower sides of the single-layer ground board are respectively connected to the two single-sided boards through shielded insulating boards, and the two single-sided boards are arranged in a mirror-symmetrical manner, that is, the DDR layers of the two single-sided boards are close to one side of the single-layer ground board. Two single-sided boards, a single-layer ground board and four shielded insulating boards constitute an inner layer board. The upper and lower sides of the inner layer board are respectively connected to the two PCLE channel layers to form a bare board. As shown Figure 3As shown in the figure, there is a pad on the PCLE channel layer on the upper side of the bare board. After compensation, the pad of the RAM gold finger has a diameter of 100um; there is no pad on the PCLE channel layer on the lower side of the bare board, which is achieved by tinning to protect the hole wall and alkaline etching, and can reduce the radiation effect of the signal. This design can reduce the parasitic capacitance and inductance of the via stump; parasitic capacitance will prolong the rise time of the signal and reduce the speed of the circuit. By reducing parasitic capacitance, the rise time of the signal can be shortened and the working speed of the circuit can be increased. Parasitic capacitance and inductance will cause signal attenuation and affect the quality of the signal. By reducing parasitic parameters, signal attenuation can be reduced to ensure the integrity and accuracy of the signal. The bare board adopts a staggered layout with a copper thickness of 1oz (1oz=35μm) and a copper thickness of 2oz, in which the copper thickness of the PCLE channel layer and the DDR layer is 1oz, and the copper thickness of the ground layer is 2oz. The DDR layer and the ground layer are symmetrical.
[0039] The main function of the single-layer board is to provide wiring, circuit connection and signal transmission. The main function of the single-layer ground plane is to reduce electromagnetic interference, improve heat dissipation, improve signal integrity, and enhance the reliability of the circuit board. The shielding insulation board is made of PP, which plays the role of signal shielding and insulation. The PCLE channel layer is made of flat cloth, and the copper thickness of the PCLE channel layer is 1oz, which provides high-speed data transmission and signal integrity protection. The core layer serves as a substrate and plays a supporting role. The ground layer is made of flat cloth, and its copper thickness is 2oz, which is used for grounding. The controlled impedance of the single-ended impedance line of the DDR layer is 50ohm. The DDR layer is made of flat cloth, and its copper thickness is 1oz. The DDR layer is a chain structure of non-equal length, signal transmission and impedance control, ensuring the stable transmission of high-speed signals. The specification of the above-mentioned flat cloth is 1035, and the thickness of the flat cloth is 8mil. The interlayer spacing of the flat cloth ensures that the line impedance and line width of the DDR layer are 4mil, and the line spacing between different pins is greater than 12mil, reducing the signal interference between DDR single-ended signal lines and DDR single-ended signal lines.
[0040] Example 3
[0041] like Figure 2As shown, a PCB circuit board with overclocking characteristics in this embodiment includes a bare board, a BGA array, a graphics card gold finger, multiple differential lines and two RAM gold fingers. Multiple differential lines are arranged on the upper surface of the bare board (that is, the upper surface of the PCLE channel layer). The pads of the BGA array, the pads of the graphics card gold finger and the pads of the two RAM gold fingers are all arranged on the upper surface of the bare board. The pads of the RAM gold finger are connected to the DDR layer of the single-sided board of the bare board through the short lines and vias of the PCLE channel layer on the surface of the bare board in turn, and then the DDR layer is connected to the BGA array. The structure of the two RAM gold fingers and the BGA array is a chain daisy structure. The BGA array is connected to the graphics card gold finger through multiple differential lines, and the multiple differential lines are arranged obliquely relative to the BGA array. The oblique angle of the multiple differential lines relative to the BGA array is 45°, and the multiple differential lines are parallel to each other, so as to realize the oblique intersection of the wiring and the material in the longitude and latitude directions, and reduce the skew effect (the glass fiber weaving effect causes signal jitter and delay difference).
[0042] The bare board is an eight-layer circuit board, which includes L1 to L8 in order. Among them, L1 and L8 (i.e., PCLE channel layers) are used for wiring layout connected to the graphics card gold finger; L3 and L6 are DDR layers, which are used for the layout of single-ended signal lines of the DDR layer; L2, L4, L5 and L7 are all ground layers; the bare board is used to connect and support electronic components, increase assembly density and reduce volume, optimize signal transmission, enhance heat dissipation and shielding effects, and improve reliability and durability. The BGA array is used to connect the CPU. The graphics card gold finger complies with the high-speed communication protocol PCLE4.0. The controlled impedance of the differential line is 85ohm, which is used to connect the BGA array and the graphics card gold finger. The RAM gold finger is used to connect the memory stick.
[0043] like Figure 4 As shown, the bare board includes two single-sided boards, a single-layer ground board, four shielded insulating boards and two PCLE channel layers. Each single-sided board includes a core layer, a ground board and a DDR layer. The two sides of the core layer are respectively connected to the ground board and the DDR layer, and the DDR layer and the ground board present a symmetrical structure. The single-layer ground board includes a core layer and two ground layers. The upper and lower sides of the core layer are respectively connected to the two ground layers. The upper and lower sides of the single-layer ground board are respectively connected to the two single-sided boards through shielded insulating boards. The two single-sided boards are arranged in a mirror-symmetrical manner, that is, the DDR layers of the two single-sided boards are close to one side of the single-layer ground board. Two single-sided boards, a single-layer ground board and four shielded insulating boards constitute an inner layer board. The upper and lower sides of the inner layer board are respectively connected to the two PCLE channel layers to form a bare board. As shown Figure 3As shown in the figure, there is a pad on the PCLE channel layer on the upper side of the bare board. After compensation, the pad of the RAM gold finger has a diameter of 100um; there is no pad on the PCLE channel layer on the lower side of the bare board, which is achieved by tinning to protect the hole wall and alkaline etching, and can reduce the radiation effect of the signal. This design can reduce the parasitic capacitance and inductance of the via stump; parasitic capacitance will prolong the rise time of the signal and reduce the speed of the circuit. By reducing parasitic capacitance, the rise time of the signal can be shortened and the working speed of the circuit can be increased. Parasitic capacitance and inductance will cause signal attenuation and affect the quality of the signal. By reducing parasitic parameters, signal attenuation can be reduced to ensure the integrity and accuracy of the signal. The bare board adopts a staggered layout with a copper thickness of 1oz (1oz=35μm) and a copper thickness of 2oz, in which the copper thickness of the PCLE channel layer and the DDR layer is 1oz, and the copper thickness of the ground layer is 2oz. The DDR layer and the ground layer are symmetrical.
[0044] The main function of the single-layer board is to provide wiring, circuit connection and signal transmission. The main function of the single-layer ground plane is to reduce electromagnetic interference, improve heat dissipation, improve signal integrity, and enhance the reliability of the circuit board. The shielding insulation board is made of PP, which plays the role of signal shielding and insulation. The PCLE channel layer is made of flat cloth, and the copper thickness of the PCLE channel layer is 1oz, which provides high-speed data transmission and signal integrity protection. The core layer serves as a substrate and plays a supporting role. The ground layer is made of flat cloth, and its copper thickness is 2oz, which is used for grounding. The controlled impedance of the single-ended impedance line of the DDR layer is 50ohm. The DDR layer is made of flat cloth, and its copper thickness is 1oz. The DDR layer is a chain structure of non-equal length, signal transmission and impedance control, ensuring the stable transmission of high-speed signals. The specification of the above-mentioned flat cloth is 1078, and the thickness of the flat cloth is 7mil. The interlayer spacing of the flat cloth ensures that the line impedance and line width of the DDR layer are 4mil, and the line spacing between different pins is greater than 12mil, reducing the signal interference between DDR single-ended signal lines and DDR single-ended signal lines.
[0045] The above specific implementation modes are preferred embodiments of the present invention and cannot be used to limit the present invention. Any other changes or other equivalent replacement methods that do not deviate from the technical solution of the present invention are included in the protection scope of the present invention.
Claims
1. A PCB circuit board with overclocking characteristics, characterized in that: It includes a bare board, a BGA array, a graphics card gold finger, a differential line and a RAM gold finger, wherein the differential line is arranged on the upper surface of the bare board, the BGA array, the graphics card gold finger and the RAM gold finger are all installed on the top of the bare board, the RAM gold finger is connected to the BGA array through a single-sided board, the BGA array is connected to the graphics card gold finger through the differential line, the differential line is arranged obliquely relative to the BGA array, and the differential lines are parallel to each other; The BGA array is used to connect to the CPU; The graphics card gold finger complies with the high-speed communication protocol and is used to connect to the graphics card; The RAM gold finger is used to connect the memory stick.
2. A PCB circuit board with overclocking characteristics according to claim 1, characterized in that: The oblique angle range of the differential line relative to the BGA array includes 30-60 degrees.
3. A PCB circuit board with overclocking characteristics according to claim 1, characterized in that: The bare board includes a single-sided board, a single-layer ground board, a shielding insulating board and a PCLE channel layer. The single-sided board is connected to both sides of the single-layer ground board through the shielding insulating board to form an inner board. Both sides of the inner board are connected to the PCLE channel layer to form a bare board. The BGA array, the graphics card gold finger and the RAM gold finger are all installed on the PCLE channel layer at the top of the bare board, and the differential line is arranged on the PCLE channel layer.
4. A PCB circuit board with overclocking characteristics according to claim 3, characterized in that: The single-sided board includes a core layer, a ground layer and a DDR layer. The two sides of the core layer are respectively connected to the ground layer and the DDR layer. The ground layer is connected to one shielding insulating board, and the DDR layer is connected to another shielding insulating board.
5. A PCB circuit board with overclocking characteristics according to claim 4, characterized in that: The controlled impedance of the single-ended impedance line of the DDR layer is 50 ohm.
6. A PCB circuit board with overclocking characteristics according to claim 4, characterized in that: The DDR layer is a chain structure of unequal length.
7. A PCB circuit board with overclocking characteristics according to claim 4, characterized in that: The ground layer and the DDR layer are symmetrical structures.
8. A PCB circuit board with overclocking characteristics according to claim 4, characterized in that: The ground layer and the DDR are both made of flat cloth, and the thickness of the flat cloth ranges from 6 to 8 mils.
9. A PCB circuit board with overclocking characteristics according to claim 3, characterized in that: The shielding insulation plate is made of PP.
10. A PCB circuit board with overclocking characteristics according to claim 1, characterized in that: The RAM gold fingers and the BGA array are arranged in a chain-like daisy structure.