Assembling tool and main board assembling method

Abstract

The embodiment of the invention discloses an assembling tool and a mainboard assembling method, the assembling tool is used for synchronously welding a first type of device to a first surface and a second surface of a circuit board, pins of the first type of device can penetrate through the circuit board, the assembling tool comprises a base and a positioning structure, the base is provided with a mounting groove, and the positioning structure is arranged in the mounting groove. The mounting groove is used for accommodating a first type of device, the positioning structure is arranged on the base, and the positioning structure is used for counterpoint matching of the circuit board and the base in the normal direction of the circuit board, so that pins of the first type of device accommodated in the mounting groove are arranged on the circuit board in a penetrating manner. The assembling tool can assist in achieving synchronous welding of the first type of devices on the two faces of the circuit board, the assembling is not affected by the lengths of the pins of the first type of devices, the flexibility of model selection of the first type of devices is improved, and the assembling cost of a mainboard is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of motherboard processing, and in particular to an assembly tool and a method for assembling a motherboard. Background Art

[0002] The motherboard includes a circuit board and electronic components assembled on the circuit board. The assembly of electronic components and circuit boards mostly adopts surface mount technology (SMT), which requires that when printing solder paste, the tin printing stencil fits the surface of the circuit board.

[0003] There is a type of electronic device whose pins need to pass through the through holes of the circuit board for soldering when assembled with the circuit board, such as connectors. When such devices are installed on both sides of the circuit board, the pins protruding from one side of the circuit board will interfere with the tin printing stencil and affect the solder paste printing on the other side.

[0004] In actual applications, taking connectors as an example, the pin length of commonly used connectors is generally greater than the thickness of the circuit board, and cannot meet the requirement of not protruding from the surface of the circuit board during welding. It is necessary to shorten the pins before welding the connector, or reselect a connector with shorter pins, or customize a connector with a pin length that meets the requirements. All of these will lead to an increase in the cost of motherboard assembly. Summary of the invention

[0005] An embodiment of the present application provides an assembly tool and an assembly method for a mainboard. The assembly tool can assist in the simultaneous welding of first-type devices on both sides of a circuit board. The first-type devices are devices whose pins pass through the circuit board. During assembly, they are not affected by the length of the pins of the first-type devices, thereby increasing the flexibility of selecting the first-type devices and reducing the assembly cost of the mainboard.

[0006] A first aspect of an embodiment of the present application provides an assembly tool for simultaneously soldering a first type of device to a first surface and a second surface of a circuit board, wherein the pins of the first type of device can be passed through the circuit board, and the assembly tool includes a base and a positioning structure, wherein the base is provided with an installation groove, wherein the installation groove is used to accommodate the first type of device, and the positioning structure is provided on the base, wherein the positioning structure is used for aligning the circuit board and the base in the normal direction of the circuit board, so that the pins of the first type of device accommodated in the installation groove can be passed through the circuit board.

[0007] By adopting the assembly tool, when the first type of device is assembled on both the first and second surfaces of the circuit board, the circuit board can be placed with the second surface facing upward, and solder paste is printed on the second surface. The printing area of ​​the solder paste includes the area on the second surface where the first type of device is arranged and the area on the second surface corresponding to the first type of device on the first surface. After printing the solder paste, the first type of device on the second surface is inserted into the circuit board from the second surface, and the first type of device on the first surface is placed upside down in the mounting groove of the assembly tool. After the circuit board is aligned with the base of the assembly tool through the positioning structure in the normal direction, the position of the circuit board and the base is adjusted so that the pins of the inverted first type of device are inserted from the first surface of the circuit board to the second surface. In this way, the first type of device on the first surface and the first type of device on the second surface are inserted on the circuit board at the same time, so that the first type of device and the second type of device on both sides of the circuit board can be synchronously welded without considering the problem of the length of the pins of the first type of device, which increases the flexibility of the selection of the first type of device and reduces the assembly cost of the mainboard.

[0008] In a possible implementation, the positioning structure includes a positioning pin disposed on the base, and the positioning pin is used to cooperate with a positioning hole of the circuit board. The positioning structure is simple and easy to implement.

[0009] In a possible implementation, the positioning structure includes more than three positioning pins, wherein at least three positioning pins are not collinear. This arrangement can improve the accuracy of the alignment between the base and the circuit board.

[0010] In a possible implementation, the assembly tool further includes a support boss disposed on the base, the support boss having a support surface for supporting the circuit board. This arrangement can ensure the stability of the matching between the circuit board and the base, which is conducive to improving the reliability of the mainboard assembly.

[0011] In a possible implementation, the supporting boss includes at least a portion of the peripheral wall of the mounting groove, which can simplify the structure of the assembly tool and facilitate the arrangement.

[0012] In a possible implementation, more than two mounting grooves are provided on the base, the depth of each mounting groove is consistent with the height of the first type of device that each mounting groove is used to accommodate, the depth of each mounting groove is different, and the top surface of the groove peripheral wall of each mounting groove is in the same plane. This arrangement is conducive to ensuring that the main body of different first type devices on the same surface fits with the circuit board, thereby improving the assembly effect. In a possible implementation, an upwardly extending convex column is provided on the base, and the convex column is used to enclose the base to form a mounting groove, and the convex part is detachably connected to the base. In addition, in some implementations, the positioning structure is detachably connected to the base. With this arrangement, the mounting groove and the positioning structure can change their positions on the base according to the type of the mainboard, thereby improving the applicability of the assembly tooling.

[0013] In a possible implementation, the base is provided with a boss extending away from the base, the boss is used to enclose the base to form a mounting groove, and the boss and the base are integrally formed. In this way, the position accuracy of the mounting groove on the base is good, and during the assembly process, when the circuit board and the base are aligned and matched, it can be ensured that the first type of device accommodated in the mounting groove can be inserted into the circuit board.

[0014] Exemplarily, the bosses have the same or different heights to form mounting grooves with the same or different depths, so as to accommodate first type devices with the same or different heights.

[0015] Exemplarily, the surface of the base in the area enclosed by the boss to form the mounting groove is recessed downward to form mounting grooves of different depths.

[0016] A second aspect of an embodiment of the present application provides a method for assembling a mainboard, the mainboard comprising a circuit board and a first type device, the circuit board having a first surface and a second surface opposite to each other, the pins of the first type device being able to pass through the circuit board, the first type device comprising a first device assembled on the first surface and a second device assembled on the second surface; the assembly method is implemented by using the assembly tool of the first aspect, comprising:

[0017] Print solder paste in a first area and a second area of ​​the second surface, wherein the first area corresponds to a position on the first surface for assembling a first device, and the second area is a position on the second surface for assembling a second device;

[0018] Inserting the second device on the circuit board from the second area of ​​the second surface after the solder paste is printed, so that the pins of the second device pass through the first surface;

[0019] Placing the first device in the mounting groove so that the pins of the first device face away from the base; and

[0020] In the normal direction of the circuit board, the circuit board after printing solder paste is aligned with the base through the positioning structure with the second surface facing away from the base, and the position of the aligned circuit board is adjusted so that the pins of the first device are passed through the second surface.

[0021] The mainboard assembly method utilizes assembly tooling to achieve synchronous welding of first-type components on the first and second surfaces of the circuit board, thereby avoiding the adverse effect of the pin length of the first-type components on the mainboard assembly, making the selection of the first-type components more flexible, and helping to reduce the mainboard assembly cost.

[0022] In one possible implementation, the mainboard also includes a second type of device that is different from the first type of device, and the second type of device includes a third device assembled on the first surface; the assembly method also includes: assembling the third device on the first surface of the circuit board before printing solder paste in the first area and the second area of ​​the second surface.

[0023] In a possible implementation, the second type device includes a fourth device assembled on the second surface, and welding of the fourth device to the circuit board and welding of the first type device to the circuit board are performed simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of the structure of a mainboard provided in one embodiment of the present application;

[0025] Figure 2 A schematic diagram of the structure of an assembly tool provided in one embodiment of the present application;

[0026] Figure 3 for Figure 1 A schematic diagram of the structure of the first type device in an inverted state;

[0027] Figure 4 A schematic diagram of the structure of an assembly tool provided in another embodiment of the present application;

[0028] Figure 5 for Figure 1 A flowchart of a method for assembling a motherboard is shown;

[0029] Figure 6 for Figure 1 Schematic diagram of the assembly process of the main board shown;

[0030] Figure 7 A schematic diagram of the structure of a mainboard provided in another embodiment of the present application;

[0031] Figure 8 for Figure 7 A flowchart of a method for assembling a motherboard is shown;

[0032] Fig. 9 for Figure 7 Schematic diagram of the assembly process of the main board shown. DETAILED DESCRIPTION

[0033] An embodiment of the present application provides an assembly tool and an assembly method for a mainboard. The assembly tool is used to assist in realizing the simultaneous soldering of a first type of device on both sides of a circuit board. When the assembly tool is used for assembly, there is no need to consider the pin length of the first type of device. The pin length of the first type of device does not affect the double-sided assembly of the first type of device on the circuit board, thereby increasing the flexibility of the selection of the first type of device and reducing the assembly cost of the mainboard.

[0034] Through-hole reflow soldering technology is to first print solder paste in the through-holes of the circuit board, then insert the pins of the device into the through-holes of the circuit board filled with solder paste, and finally use the reflow soldering process to complete the soldering of the pins of the device and the circuit board. Reflow soldering refers to the process of connecting the device to the pad of the circuit board with solder paste, and then heating to melt the solder to achieve permanent bonding. Soldering can be performed using different heating methods such as reflow ovens, infrared heating lamps or hot air guns.

[0035] The first type of device is a device whose pins need to pass through the circuit board, such as a connector. Through-hole reflow technology can be used when assembling the first type of device with the circuit board. The second type of device is different from the first type of device. The second type of device is a device without pins, or a device whose pins do not need to pass through the circuit board, such as a capacitor or a resistor; the second type of device can be directly mounted on the surface of the circuit board. The difference between the first type of device and the second type of device refers to the different assembly methods with the circuit board, which is reflected in whether there are pins passing through the circuit board, and has nothing to do with the type of device. For example, although capacitors and resistors are different types of devices, both belong to the second type of device.

[0036] For ease of understanding and concise description, the following article describes the assembly method of the assembly tool and the mainboard together.

[0037] Please refer to Figures 1 to 3 , Figure 1 A schematic diagram of the structure of a main board is shown. Figure 2 A schematic structural diagram of an assembly tool according to an embodiment is shown. Figure 3 for Figure 1 Schematic diagram of the structure of the first device in an inverted state.

[0038] like Figure 1 As shown, the main board 10 includes a circuit board 11 and electronic devices disposed on the circuit board 11. The circuit board 11 has a first surface 11a and a second surface 11b opposite to each other. In practical applications, electronic devices can be disposed on both the first surface 11a and the second surface 11b of the circuit board 11.

[0039] The mainboard 10 is also called the host board, system board or motherboard. The circuit board 11 of the mainboard 10 is installed with the main circuit system of the electronic device, which generally includes BIOS (basic input output system) chip, I / O control chip, indicator light connector, expansion slot, DC power supply connector of the mainboard and plug-in card, etc. The circuit board 11 is also called a printed circuit board. By printing circuit patterns and installing components on the surface of insulating materials, the circuits are connected together to realize the functions of the electronic device. The electronic device can be a server, or it can be an edge device including the mainboard 10, such as a router, switch, etc. The electronic device can also be a personal computer.

[0040] For example, the assembly of the electronic device and the circuit board 11 can be performed by welding, and the welding of the electronic device on the circuit board 11 can be performed by surface mount technology (SMT), which means first printing solder paste on the welding position of the circuit board 11, then mounting the electronic device on the welding position, and finally welding with welding equipment. The printing of solder paste on the circuit board 11 is achieved by bonding a stencil to the circuit board 11, and the solder paste is printed on the required position on the circuit board 11 using the mesh of the stencil.

[0041] According to the matching mode of the electronic device and the circuit board 11 during welding, the electronic device includes a first type device 12. When the first type device 12 is welded to the circuit board 11, a through hole matching the pin of the first type device 12 is provided at a corresponding position of the circuit board 11, and the pin of the first type device 12 is located in the through hole of the circuit board 11 and welded with the solder paste filled in the through hole.

[0042] like Figure 1 As shown, the first side 11a and the second side 11b of the circuit board 11 of the mainboard 10 are both welded with first type devices 12. For the purpose of distinction, the first type device 12 welded on the first side 11a is referred to as the first device 121, and the first type device 12 welded on the second side 11b is referred to as the second device 122.

[0043] In the case where the first type device 12 is welded on both the first side 11a and the second side 11b of the circuit board 11, in the related art, if the first device 121 on the first side 11a is welded first, after the welding is completed, the pins of the first device 121 pass through the circuit board 11 and protrude from the second side 11b of the circuit board 11. At this time, when the second device 122 on the second side 11b is welded, the protruding pins of the first device 121 will affect the fit between the stencil and the second side 11b of the circuit board 11, thereby affecting the printing of solder paste on the second side 11b. Conversely, if the second device 122 on the second side 11b is welded first, the printing of solder paste on the first side 11a will also be affected.

[0044] To solve the aforementioned problem, an embodiment of the present application provides an assembly tool 20 , which is mainly used to simultaneously solder the first type device 12 to the first surface 11 a and the second surface 11 b of the circuit board 11 .

[0045] like Figure 2As shown, the assembly tool 20 includes a base 21 and a positioning structure 23. The base 21 is provided with a mounting groove 22, and the mounting groove 22 is used to accommodate the inverted first type device 12. The positioning structure 23 is provided on the base 21. The positioning structure 23 is used for the alignment of the circuit board 11 and the base 21 in the normal direction of the circuit board 11, so that the pins of the first type device 12 accommodated in the mounting groove 22 are inserted into the circuit board 11. In other words, after the circuit board 11 and the base 21 are aligned, the position of the mounting groove 22 is aligned with the position of the first type device 12 to be plugged on the circuit board 11. The normal direction of the circuit board 11 is a direction perpendicular to the first surface 11a or the second surface 11b.

[0046] like Figure 3 As shown, the first type device 12 includes a body 1201 and pins 1202, the body 1201 has a first surface 1201a and a second surface 1201b opposite to each other, and the pins 1202 extend from the second surface 1201b of the body 1201 in a direction away from the first surface 1201a. When the first type device 12 is assembled with the circuit board 11, the pins 1202 are inserted into the through holes of the circuit board 11, and the second surface 1201b of the first type device 12 is attached to the circuit board 11. It is defined herein that when the first type device 12 is in an upright state, the pins 1202 of the first type device 12 extend downward, and when the first type device 12 is assembled with the circuit board 11, the pins 1202 pass through the circuit board 11 from top to bottom; accordingly, when the first type device 12 is in an inverted state, the pins 1202 extend upward, and at this time the body 1201 is located below the pins 1202. Figure 3 The state shown is that the first type device 12 is in an inverted state.

[0047] The mounting groove 22 is used to accommodate the inverted first type device 12, that is, the body 1201 of the first type device 12 is located in the mounting groove 22, the pins 1202 of the first type device 12 extend out of the mounting groove 22, and the opening of the mounting groove 22 is set in a direction away from the base 21.

[0048] In one feasible solution, the positioning structure 23 of the assembly tool 20 may include a positioning pin, which is disposed on the base 21. The circuit board 11 is provided with a positioning hole 111. In some embodiments, the positioning hole 111 may be an ITC (in-circuit tester) test hole. When the circuit board 11 and the base 21 are aligned, the positioning pin can be inserted into the positioning hole 111 to achieve the alignment of the circuit board 11 and the base 21, so as to ensure that the position of the mounting slot 22 is aligned with the position of the first device 121 to be plugged into the circuit board 11 (i.e., Figure 6 The first area A1 as shown is aligned with the first area A1, thereby ensuring that the first type device 12 placed upside down in the mounting groove 22 can be plugged into the through hole of the circuit board 11 in the first area A1.

[0049] In some examples, there may be more than three positioning pins on the base 21, and at least three positioning pins are not collinear. In this way, the three non-collinear positioning pins can determine a plane, which can better achieve the alignment of the circuit board 11 and the base 21, and is conducive to controlling the position deviation between the first device 121 to be plugged and the circuit board 11 within a reasonable range, so as to meet the positioning accuracy requirements of the pins of the first device 121 and the through holes of the circuit board 11.

[0050] In application, the positioning pins on the base 21 are arranged as close to the edge of the base 21 as possible to avoid affecting the alignment between the mounting slots 22 on the base 21 and the circuit board 11 .

[0051] In an achievable solution, the assembly tool 20 further includes a support boss 24 disposed on the base 21, and the support boss 24 has a support surface 24a for supporting the circuit board 11. In this way, after the circuit board 11 and the base 21 are aligned by the positioning structure 23, the circuit board 11 can be supported by the support boss 24 on the base 21, so that the relative position between the circuit board 11 and the base 21 can be maintained.

[0052] In order to realize the assembly of the first device 121 and the circuit board 11 after alignment, the structural setting of the support surface 24a of the support boss 24 and the installation groove 22 meets the following conditions: when the circuit board 11 is supported by the support surface 24a, the pin of the first device 121 arranged in the installation groove 22 is in a state of passing through the through hole of the circuit board 11.

[0053] In some examples, the support boss 24 may further include at least a portion of the groove peripheral wall 221 of the mounting groove 22. Figure 2 As shown, the side (top surface) of at least part of the groove peripheral wall 221 away from the base 21 is the support surface 24 a , which is helpful to simplify the structure of the assembly tool 20 .

[0054] Specifically, the depth of the mounting groove 22 may be consistent with the height of the first type device 12 . The height of the first type device 12 is defined here as the height of its body 1201 , that is, the height of the first type device 12 does not include the length of the pins 1202 .

[0055] Specifically, the size of the mounting groove 22 matches the size of the body 1201 of the first type device 12 , and the size of the mounting groove 22 just accommodates the body 1201 , thereby preventing the first type device 12 from moving in the mounting groove 22 and affecting the assembly with the circuit board 11 .

[0056] In other examples, one side of the entire groove peripheral wall 221 of the installation groove 22 away from the base 21 can be used as the support surface 24 a to facilitate the processing of the installation groove 22 .

[0057] When the depth of the mounting groove 22 is consistent with the height of the first device 121, after the circuit board 11 and the base 21 are aligned by the positioning structure 23, the circuit board 11 is moved toward the base 21, so that the pins of the first device 121 accommodated in the mounting groove 22 can be inserted into the circuit board 11. After that, the circuit board 11 moves to the position supported by the support surface 24a (that is, the position where the surface of the circuit board 11 facing the base 21 contacts the support surface 24a). At this time, since the depth of the mounting groove 22 is consistent with the height of the body of the first device 121, the surface of the body of the first device 121 facing away from the base 21 is flush with the top surface of the groove peripheral wall 221 of the mounting groove 22, so that the surface of the body of the first device 121 facing away from the base 21 is in contact with the surface of the circuit board 11 facing the base 21, so that the assembly effect of the first device 121 and the circuit board 11 can be ensured.

[0058] In one achievable manner, the base 21 is provided with a boss extending upward, and the boss and the upper surface of the base 21 can enclose a mounting groove 22. The boss and the base 21 can be integrally formed. In some examples, the bosses provided on the base 21 can have the same or different heights to form mounting grooves 22 of the same or different depths, so as to accommodate first type devices 12 of different heights; in this case, the groove wall of the mounting groove 22 is a boss. In other examples, the upper surface of the base 21 in the area enclosed by the boss to form the mounting groove 22 can also be recessed downward to form mounting grooves 22 of different depths; in this case, the groove wall of the mounting groove 22 includes a wall portion formed by the boss and the base 21 being recessed downward. In some other examples, part of the supporting boss 24 can be used as a boss for enclosing the mounting groove 22. In another achievable manner, the mounting groove 22 can be formed by an inward depression of the base 21. In this case, the groove peripheral wall of the mounting groove 22 is a wall portion formed by the depression of the base 21, and the supporting boss 24 does not include the groove peripheral wall of the mounting groove 22, that is, the supporting boss 24 and the mounting groove 22 are relatively independent.

[0059] In other achievable ways, the boss of the assembly tool 20 for enclosing and forming the mounting groove 22 can be detachably connected to the base 21. In this case, the boss is formed independently and can be detachably connected to the base 21 by fasteners such as bolts. In this way, the position of the mounting groove 22 on the base 21 can be changed according to the different mainboards 10, so that the assembly tool 20 can be applied to different types of mainboards 10. In this case, the positioning structure 23 is also detachably connected to the base 21 to adapt to the alignment and cooperation of different types of circuit boards 10 and bases 21.

[0060] Please refer to Figure 4 , Figure 4 A schematic structural diagram of an assembly tool 20 in another embodiment is shown.

[0061] Figure 4 The assembly tool 20 shown and Figure 2 The structure of the assembly tool 20 shown is basically similar, except that: Figure 4 In the assembly tool 20 shown, two mounting grooves are provided on the base 21, which are referred to as the first mounting groove 22A and the second mounting groove 22B. The first mounting groove 22A and the second mounting groove 22B can respectively match the two first type devices 12 on the first surface 11a or the second surface 11b of the circuit board 11.

[0062] In actual applications, when there are more than two first-type devices 12 on the same side of the circuit board 11, the two first-type devices 12 may be two first-type devices of different types or two first-type devices of the same type but different sizes. In this case, the two first-type devices 12 have different heights. In specific settings, the depth of the first mounting groove 22A is consistent with the height of the first-type device 12 accommodated in the first mounting groove 22A, and the depth of the second mounting groove 22B is consistent with the height of the first-type device 12 accommodated in the second mounting groove 22B.

[0063] When the depth of the first mounting groove 22A and the depth of the second mounting groove 22B are different, the top surface 221A of the first groove peripheral wall of the first mounting groove 22A and the top surface 221B of the second groove peripheral wall of the second mounting groove 22B are in the same plane, so that the upward surface of the body of the inverted first type device 12 in the first mounting groove 22A and the upward surface of the body of the inverted first type device 12 in the second mounting groove 22B are in the same plane. When the assembly tool 20 is matched with the circuit board 11, the upward surfaces of the bodies of the two first type devices 12 can be attached to the surface of the circuit board 11 to ensure the assembly effect.

[0064] Figure 4 In the example shown, the depth of the first mounting groove 22A is less than that of the second mounting groove 22B, and on the basis that the top surfaces of the groove walls of both grooves are in the same horizontal plane, the groove bottom surface of the first mounting groove 22A is higher than the groove bottom surface of the second mounting groove 22B.

[0065] Here, the height of the first type device 12 refers to the height of the body of the first type device 12 , excluding the length of the pins.

[0066] Figure 4 Taking the base 21 having two mounting grooves as an example, three, four or more mounting grooves may be provided on the base 21 according to application requirements.

[0067] The present application also provides an assembly method for the mainboard 10. The assembly method can be implemented by using the assembly tool 20. Figure 1 The mainboard 10 shown is taken as an example for explanation.

[0068] Please refer to Figure 5 and Figure 6 , Figure 5 for Figure 1 A flowchart of a method for assembling a motherboard is shown; Figure 6 for Figure 1 Schematic diagram of the assembly process of the main board shown.

[0069] The assembly of the mainboard 10 includes the assembly of the first type device 12 and the circuit board 11. The assembly of the first type device 12 and the circuit board 11 is realized by using an assembly tool 20. Figure 1 Taking the illustrated mainboard 10 as an example, the assembly of the first type device 12 with the circuit board 11 includes the assembly of the first device 121 and the second device 122 with the circuit board 11 .

[0070] The assembly in this article refers to fixing the device and the circuit board 11 together. The specific method of fixing can be welding. The assembly includes the welding step and the preparation steps required before the welding step, such as printing solder paste, etc.; the "synchronous welding" and "simultaneous welding" mentioned in this article refer to the simultaneous welding process, for example, the welding step of a device and the circuit board 11 is carried out at the same time as the welding step of another device and the circuit board 11, and the order of the preparation steps before the welding step is not limited.

[0071] The assembly method of the mainboard 10 includes:

[0072] S11 , printing solder paste on the first area A1 and the second area A2 of the second surface 11 b of the circuit board 11 .

[0073] This step can be combined with Figure 6 (a) and Figure 6 (b) Understand, Figure 6 As shown in (a), the solder paste 32 is printed on the second surface 11b of the circuit board 11. Specifically, the circuit board 11 can be placed with the second surface 11b facing away from the base 21 (that is, the second surface 11b faces upward), so as to facilitate printing of the solder paste 32. When printing the solder paste 32, a stencil 31 can be placed on the second surface 11b of the circuit board 11, and the stencil 31 is attached to the second surface 11b. The solder paste 32 can be printed on the second surface 11b at the position for connecting the device through the stencil 31 using a scraper 33.

[0074] like Figure 6 As shown in (b), the first area A1 corresponds to the position on the first surface 11a of the circuit board 11 for assembling the first device 121, and the second area A2 is the position on the second surface 11b of the circuit board 11 for assembling the second device 122.

[0075] The circuit board 11 has through holes in the first area A1 that match the pins of the first device 121, and the number, size and arrangement of the through holes in the first area A1 match the number, size and arrangement of the pins of the first device 121 to facilitate the plugging of the first device 121 with the circuit board 11; the circuit board 11 has through holes in the second area A2 that match the pins of the second device 122, and the number, size and arrangement of the through holes in the second area A2 match the number, size and arrangement of the pins of the second device 122 to facilitate the plugging of the second device 122 with the circuit board 11.

[0076] A first stencil through hole is provided at a position corresponding to the first area A1 on the stencil 31, and the number, size and arrangement of the first stencil through holes match the number, size and arrangement of the through holes of the circuit board 11 at the first area A1, so as to facilitate the solder paste 32 to be printed in each through hole in the first area A1 through the first stencil through holes of the stencil 31; a second stencil through hole is provided at a position corresponding to the second area A2 on the stencil 31, and the number, size and arrangement of the second stencil through holes match the number, size and arrangement of the through holes of the circuit board 11 at the second area A2, so as to facilitate the solder paste 32 to be printed in each through hole in the second area A2 through the second stencil through holes of the stencil 31.

[0077] After printing, Figure 6 As shown in (b), each through hole in the first area A1 of the circuit board 11 is filled with solder paste 32, and each through hole in the second area A2 of the circuit board 11 is also filled with solder paste 32.

[0078] S12, plugging the second device 122 onto the circuit board 11 from the second area A2 of the second surface 11b after printing the solder paste 32, so that the pins of the second device 122 pass through the first surface 11a.

[0079] This step can be combined with Figure 6 (c) Understanding, e.g. Figure 6 As shown in (c), the second device 122 is plugged into the circuit board 11 from the second surface 11b of the circuit board 11 after printing the solder paste 32. After plugging, the pins of the second device 122 are located in the corresponding through holes in the second area A2 of the circuit board 11.

[0080] S13 , placing the first device 121 in the mounting groove 22 , so that the pins of the first device 121 face away from the base 21 .

[0081] S14. In the normal direction of the circuit board 11, the circuit board 11 after printing the solder paste is aligned with the base 21 through the positioning structure 23 in a way that the second surface 11b faces away from the base 21, and the position of the aligned circuit board 11 is adjusted so that the pins of the first device 121 are passed through the second surface 11b.

[0082] Step S13 and step S14 can be combined Figure 6 (d) and Figure 6 (e) Understand, Figure 6 As shown in (d), the first device 121 is placed upside down in the mounting groove 22 of the assembly tool 20, with the pins of the first device 121 facing upward, the circuit board 11 plugged with the second device 122 and the base 21 of the assembly tool 20 are aligned through the positioning structure 23, and the position of the aligned circuit board 11 is adjusted so that the pins of the first device 121 pass through the corresponding through holes of the circuit board 11 at the first area A1 from the first surface 11a of the circuit board 11. The state after the insertion is as shown in FIG. Figure 6 (e) as shown.

[0083] In addition, the assembly method of the mainboard 10 further includes S15, sending the assembly tool 20 and the circuit board 11 supported by the assembly tool 20 into the welding equipment for welding.

[0084] like Figure 6 As shown in (e), after the circuit board 11 and the first device 121 and the second device 122 are plugged into each other using the assembly tool 20, the circuit board 11 supported by the assembly tool 20 and the first device 121 and the second device 122 plugged into the circuit board 11 are sent to a welding device (such as a reflow furnace) for welding. After the welding is completed, the assembled mainboard 10 is obtained. Figure 6 (f) Figure 6 (f) shows the main board 10 removed from the assembly tool 20. Figure 6 The main board 10 shown in (f) is turned 180° to obtain Figure 1 The motherboard 10 in the state.

[0085] The arrangement of the supporting bosses 24 on the base 21 can keep the circuit board 11 in a relatively stable state, which is conducive to ensuring the subsequent welding effect in the welding equipment. Therefore, the number and arrangement of the supporting bosses 24 on the base 21 are based on stably supporting the circuit board 11. Figure 2 and Figure 6 For example, the groove wall of the mounting groove 22 can be used as part of the supporting boss 24, and the mounting groove 22 is arranged at the left side of the base 21. On the basis that the groove wall of the mounting groove 22 can be used as part of the supporting boss 24 for supporting the circuit board 11, the remaining supporting boss 24 can be arranged at the right side of the base 21 to stably support the circuit board 11. The position of the supporting boss 24 is set so as not to conflict with the relevant structure on the circuit board 11.

[0086] It can be seen from the assembly process of the above-mentioned mainboard 10 that the assembly tool 20 provided by the present solution can realize the synchronous welding of the first device 121 on the first surface 11a and the second device 122 on the second surface 11b of the mainboard 10. During welding, the solder paste 32 is printed on the area corresponding to the first device 121 and the area corresponding to the second device 122 on the second surface 11b of the circuit board 11, and the pin length of the first device 121 or the pin length of the second device 122 will not affect the printing of the solder paste 32. In this way, when the first type device 12 is welded on the first surface 11a and the second surface 11b of the circuit board 11, there is no need to consider the pin length of the first type device 12. The selection of the first type device 12 is more flexible, and there is no problem of shortening the pin due to protrusion of the surface of the circuit board 11. In general, the assembly cost of the mainboard 10 can be reduced.

[0087] exist Figure 5 The flowchart shown and Figure 6 In the assembly process diagram shown, the second device 122 is first plugged into the circuit board 11, and then the circuit board 11 and the base 21 are aligned and matched, and the first device 121 is plugged into the circuit board 11. In other implementations, after printing the solder paste 32 on the second side 11b of the circuit board 11, the circuit board 11 and the base 21 may be aligned first, and the position may be adjusted so that the first device 121 is plugged into the circuit board 11, and then the second device 122 is plugged into the circuit board 11. In actual applications, the placement of the first device 121, the plugging of the first device 121 and the circuit board 11, and the plugging and matching of the second device 122 and the circuit board 11 can be changed in the order of assembly without interfering with each other, and are not limited to Figure 5 and Figure 6 in the order shown.

[0088] Figure 6In the figure, the example of printing solder paste on the second surface 11b and placing the first device 121 in the mounting groove 22 is used for explanation. In actual application, the mounting groove 22 of the assembly tool 20 can also be used to place the inverted second device 122. The assembly method includes: printing solder paste 32 on the first surface 11a, and the printing area of ​​the solder paste 32 still includes the first area A1 corresponding to the first device 121 and the second area A2 corresponding to the second device 122. The circuit board 11 can be placed with the first surface 11a facing upward; then, the first device 121 is plugged into the circuit board 11 from the first surface 11a, so that the pins of the first device 121 pass through the through holes at the first area A1 from the first surface 11a; the second device 122 is placed upside down in the mounting groove 22, so that the pins of the second device 122 face away from the base 21; after the circuit board 11 and the base 21 are aligned and matched through the positioning structure 23, the position of the circuit board 11 is adjusted so that the pins of the second device 122 pass through the circuit board 11 from the second surface 11b. That is to say, no matter whether the mounting groove 22 of the assembly tool 20 is used to place the first component 121 or the second component 122, the first component 121 and the second component 122 can be simultaneously welded to the circuit board 11, and the assembly method is similar.

[0089] Figures 1 to 3 as well as Figure 5 and Figure 6 In the example shown, a first device 121 is provided on the first side 11a of the circuit board 11, and a second device 122 is provided on the second side 11b of the circuit board 11. In other implementations, the first side 11a of the circuit board 11 may have more than two first devices 121, and the second side 11b of the circuit board 11 may also have more than two second devices 122. Regardless of the number of first-type devices 12 on each surface of the circuit board 11, the method of using the assembly tool 20 to assist the circuit board 11 in assembling the first-type devices 12 on the first side 11a and the second side 11b is similar, and will not be described one by one.

[0090] Please refer to Figure 7 , Figure 7 A schematic diagram of the structure of another mainboard is shown. In this embodiment, the mainboard 10 includes a circuit board 11 and electronic components arranged on the circuit board 11.

[0091] The circuit board 11 has a first surface 11a and a second surface 11b opposite to each other. Both the first surface 11a and the second surface 11b are provided with first type devices 12. For the convenience of distinction, the first type device 12 arranged on the first surface 11a is referred to as a first device 121, and the first type device 12 arranged on the second surface 11b is referred to as a second device 122.

[0092] The first surface 11a and the second surface 11b of the circuit board 11 may also be provided with a second type device 13. The second type device 13 is different from the first type device 12. The second type device 13 refers to a device without pins or the pins do not pass through the circuit board 11. The second type device 13 can be directly mounted on the surface of the circuit board 11.

[0093] Here, the first type device 12 and the second type device 13 are different in the way they are assembled with the circuit board 11 , and there is no distinction between primary and secondary or sequential order.

[0094] Similarly, for the convenience of distinction, the second type device 13 disposed on the first surface 11 a is referred to as a third device 131 , and the second type device 13 disposed on the second surface 11 b is referred to as a fourth device 132 .

[0095] When assembling the mainboard 10 in this embodiment, the first type device 12 and the circuit board 11 can still be assembled by Figure 2 The assembly tool 20 is shown.

[0096] Still taking the example of the mounting groove 22 of the assembly tool 20 cooperating with the first device 121 disposed on the first surface 11a, when the first surface 11a of the circuit board 11 is also provided with the third device 131, the assembly of the mainboard 10 includes the assembly of the third device 131 with the circuit board 11 and the assembly of the first type device 12 with the circuit board 11. The assembly of the third device 131 with the circuit board 11 can be performed before the solder paste is printed on the second surface 11b of the circuit board 11, that is, the assembly of the third device 131 with the circuit board 11 is performed before the assembly of the first type device 12 with the circuit board 11, and the assembly of the first type device 12 with the circuit board 11 is realized by using the assembly tool 20.

[0097] When the fourth device 132 is further provided on the second surface 11b of the circuit board 11, the assembly of the mainboard 10 also includes the assembly of the fourth device 132 and the circuit board 11, and the welding of the fourth device 132 and the circuit board 11 and the welding of the first type device 12 and the circuit board 11 are performed simultaneously.

[0098] Combine the following Figure 8 and Fig. 9 To explain in detail Figure 7 The assembly method of the mainboard 10 is shown.

[0099] The assembly method of the mainboard 10 includes:

[0100] S21 , assembling the third device 131 on the first surface 11 a of the circuit board 11 .

[0101] This step can be combined with Fig. 9 (a) to Fig. 9 (d) Understand, e.g. Fig. 9As shown in (a), the solder paste 32 is printed on the first surface 11a of the circuit board 11. Specifically, the circuit board 11 can be placed with the first surface 11a facing upward to facilitate printing of the solder paste 32. When printing the solder paste 32, a first stencil 31A can be placed on the first surface 11a of the circuit board 11, and the first stencil 31A is attached to the first surface 11a. The solder paste 32 can be printed on the first surface 11a at a position for connecting the third device 131 through the first stencil 31A using a scraper 33.

[0102] like Fig. 9 As shown in (b), the printing area of ​​the solder paste 32 is the position on the first surface 11a for assembling the third device 131. Accordingly, the first screen 31A is provided with a through hole corresponding to the assembly position of the third device 131 to facilitate printing the solder paste 32 at the position corresponding to the third device 131.

[0103] like Fig. 9 As shown in (c), after the solder paste 32 is printed on the first surface 11 a, the third device 131 is mounted on the position where the solder paste 32 is printed on the first surface 11 a of the circuit board 11.

[0104] Afterwards, the circuit board 11 mounted with the third device 131 is sent to a welding device for welding, so as to obtain the circuit board 11 with the third device 131 welded on the first surface 11a. Fig. 9 (d) The assembly of the third device 131 and the circuit board 11 is completed.

[0105] S22 , printing solder paste on the first area A1 , the second area A2 , and a position for assembling the fourth device 132 on the second side 11 b of the circuit board 11 .

[0106] This step can be combined with Fig. 9 (e) and Fig. 9 (f) Understanding, e.g. Fig. 9 As shown in (e), Fig. 9 The circuit board 11 with the third device 131 soldered on the first surface 11a shown in (d) is flipped 180 degrees, so that the circuit board 11 is placed with the second surface 11b facing upward, which facilitates the printing of solder paste 32 on the second surface 11b.

[0107] When printing the solder paste 32, a second stencil 31B can be placed on the second surface 11b of the circuit board 11, and the second stencil 31B can be attached to the second surface 11b. The solder paste 32 can also be printed through the second stencil 31B using a scraper 33 at the position on the second surface 11b for assembling the first type device 12 and the fourth device 132.

[0108] like Fig. 9As shown in (f), when the solder paste 32 is printed on the second surface 11b, the printing area of ​​the solder paste 32 includes the first area A1, the second area A2, and the position for assembling the fourth device 132. The first area A1 corresponds to the position on the first surface 11a of the circuit board 11 for assembling the first device 121, and the second area A2 is the position on the second surface 11b of the circuit board 11 for assembling the second device 122. In other words, the solder paste 32 on the second surface 11b is printed not only in the area corresponding to the assembly of the first type device 12 and the second type device 13 on the second surface 11b, but also in the area corresponding to the assembly of the first type device 12 on the first surface 11a.

[0109] After printing, each through hole in the first area A1 of the circuit board 11 is filled with solder paste 32 , each through hole in the second area A2 is also filled with solder paste 32 , and solder paste 32 is also printed at the position on the second surface 11 b for assembling the fourth device 132 .

[0110] S23, inserting the second device 122 into the circuit board 11 from the second area A2 of the second surface 11b after printing the solder paste, so that the pins of the second device 122 pass through the first surface 11a; mounting the fourth device 132 on the second surface 11b of the circuit board 11.

[0111] This step can be combined with Fig. 9 (g) Understand, Fig. 9 As shown in (g), after the solder paste 32 on the second surface 11b is printed, the second device 122 is plugged into the circuit board 11 from the second surface 11b. After plugging, the pins of the second device 122 are located in the corresponding through holes in the second area A2 of the circuit board 11, and the fourth device 132 is mounted at the corresponding position of the second surface 11b.

[0112] S24 , placing the first device 121 in the mounting groove 22 , so that the pins of the first device 121 face away from the base 21 .

[0113] S25. In the normal direction of the circuit board 11, the circuit board 11 after printing the solder paste is aligned with the base 21 through the positioning structure 23 in a way that the second surface 11b faces away from the base 21, and the position of the aligned circuit board 11 is adjusted so that the pins of the first device 121 are passed through the second surface 11b.

[0114] Step S24 and step S25 can be combined Fig. 9 (h) and Fig. 9 (i) Understand, Fig. 9As shown in (h), the first device 121 is placed upside down in the mounting groove 22 of the assembly tool 20, with the pins of the first device 121 facing upward, and the circuit board 11 plugged with the second device 122 and mounted with the fourth device 132 is aligned with the base 21 of the assembly tool 20 through the positioning structure 23, and the position of the aligned circuit board 11 is adjusted so that the pins of the first device 121 pass through the first surface 11a of the circuit board 11 and the corresponding through holes at the first area A1 of the circuit board 11. The state after the penetration is as shown in FIG. Fig. 9 At this time, the circuit board 11 can be supported by the supporting boss 24 on the base 21 .

[0115] In addition, the assembly method of the mainboard 10 further includes S26, sending the assembly tool 20 and the circuit board 11 supported by the assembly tool 20 into the welding equipment for welding.

[0116] The circuit board 11 supported by the assembly tool 20 and the first device 121, the second device 122 and the mounted fourth device 132 are sent to the welding equipment for welding. After the welding is completed, the assembled mainboard 10 is obtained. Fig. 9 (j) as shown, Fig. 9 The main board 10 shown in (j) is removed from the assembly tool 20. Fig. 9 The main board 10 shown in (j) is turned 180° to obtain Figure 7 The motherboard 10 in the state.

[0117] exist Fig. 9 In the assembly process shown, the second device 122 on the second surface 11b is first plugged in, the fourth device 132 is mounted, and then the circuit board 11 and the base 21 are aligned. In other implementations, the circuit board 11 and the base 21 may be aligned first, and the first device 121 may be plugged in, and then the second device 122 and the fourth device 132 may be mounted on the second surface 11b. In practical applications, Fig. 9 Among the steps shown, the order of execution can be changed if two steps do not interfere with or affect each other.

[0118] Fig. 9 The example of placing the first device 121 in the mounting groove 22 is used for explanation. In actual application, the mounting groove 22 of the assembly tool 20 can also be used to place the second device 122. In this case, during assembly, the fourth device 132 other than the second device 122 on the second side 11b of the circuit board 11 is first soldered, and then the second device 122 on the second side 11b and the first device 121 and the third device 131 on the first side 11a are assembled.

[0119] Fig. 9In the example, the first side 11a and the second side 11b of the circuit board 11 are each provided with a first type device 12 and a second type device 13. In practical applications, the first side 11a may have more than two first type devices 12 and more than two second type devices 13, and the second side 11b may also have more than two first type devices 12 and more than two second type devices 13. Regardless of the number of the first type devices 12 or the second type devices 13, the assembly method is similar and will not be described one by one.

[0120] In the aforementioned embodiments, an example is taken in which a first type device 12 is provided on the first side 11a of the circuit board 11, and the assembly tool 20 cooperates with the first side 11a of the circuit board 11. In actual applications, the assembly tool 20 can cooperate with the second side 11b of the circuit board 11, and the number and arrangement of the mounting grooves 22 on the base 21 of the assembly tool 20 match the number and arrangement of the first type devices 12 soldered on the first side 11a or the second side 11b of the circuit board 11.

[0121] Specific examples are used herein to illustrate the principles and implementation methods of the present application, and the description of the above embodiments is only used to help understand the method and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. An assembly tool for simultaneously soldering a first type of device to a first surface and a second surface of a circuit board, wherein the pins of the first type of device can be inserted into the circuit board; characterized in that: The assembly tool comprises: A base, on which a mounting groove is provided, wherein the mounting groove is used to accommodate the first type of device; A positioning structure is arranged on the base, and the positioning structure is used for the alignment of the circuit board and the base in the normal direction of the circuit board, so that the pins of the first type device accommodated in the installation groove are passed through the circuit board.

2. The assembly tool according to claim 1, characterized in that: The positioning structure includes a positioning pin arranged on the base, and the positioning pin is used to cooperate with the positioning hole of the circuit board.

3. The assembly tool according to claim 2, characterized in that: The positioning structure includes more than three positioning pins, wherein at least three positioning pins are not collinear.

4. The assembly tool according to any one of claims 1 to 3, characterized in that: The assembly tool also includes a supporting boss arranged on the base, and the supporting boss has a supporting surface for supporting the circuit board.

5. The assembly tool according to claim 4, characterized in that: The supporting boss includes at least a portion of a peripheral wall of the mounting groove.

6. The assembly tool according to any one of claims 1 to 3, characterized in that: The base is provided with more than two mounting grooves, the depth of each mounting groove is consistent with the height of the first type device accommodated by each mounting groove, the depth of each mounting groove is different, and the top surface of the groove peripheral wall of each mounting groove is in the same plane.

7. The assembly tool according to any one of claims 1 to 3, characterized in that: The base is provided with a convex column extending in a direction away from the base, the convex column is used to enclose with the base to form the installation groove, and the convex column is detachably connected to the base.

8. A method for assembling a mainboard, characterized in that: The mainboard includes a circuit board and a first type of device, the circuit board has a first surface and a second surface opposite to each other, pins of the first type of device can be inserted into the circuit board, and the first type of device includes a first device assembled on the first surface and a second device assembled on the second surface; The assembly method is implemented by using the assembly tool according to any one of claims 1 to 7, comprising: Printing solder paste in a first area and a second area of ​​the second surface, wherein the first area corresponds to a position on the first surface for assembling the first device, and the second area is a position on the second surface for assembling the second device; Inserting the second device onto the circuit board from the second area of ​​the second surface after printing the solder paste, so that the pins of the second device pass through the first surface; placing the first component in the mounting groove so that the pins of the first component face away from the base; and In the normal direction of the circuit board, the circuit board after printing the solder paste is aligned with the base through the positioning structure in a way that the second surface faces away from the base, and the position of the circuit board after alignment is adjusted so that the pins of the first device are passed through the second surface.

9. The method for assembling a mainboard according to claim 8, characterized in that: The mainboard further includes a second type of device different from the first type of device, and the second type of device includes a third device assembled on the first surface; The assembly method further comprises: Before printing solder paste on the first area and the second area of ​​the second area, assembling the third component on the first side of the circuit board.

10. The method for assembling a mainboard according to claim 9, characterized in that: The second type of components includes a fourth component assembled on the second surface, and the welding of the fourth component to the circuit board and the welding of the first type of components to the circuit board are performed simultaneously.

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