Diaphragm direct welding equipment and method for moving coil and flat plate combined earphone

Abstract

The invention relates to vibrating diaphragm direct welding equipment and a vibrating diaphragm direct welding method for a moving coil and flat plate combined earphone. The equipment comprises a solder smearing mechanism, an image positioning mechanism, a laser source, a galvanometer mechanism, a spraying mechanism, a displacement mechanism, a controller and other key components. In the welding process, the device accurately recognizes the position of the metal ring through the image positioning mechanism, laser welding of a welding hole in the metal ring and laser cutting of a vibrating diaphragm base material outside the metal ring are achieved at the same time in one-circle scanning through the laser source and the galvanometer mechanism, and the size of the cut metal ring is equal to that of the vibrating diaphragm base material; complex steps and errors caused by independent positioning of the vibrating diaphragm in the prior art are avoided. The high-precision processing capability of the equipment ensures the precision and consistency of diaphragm manufacturing, and the production efficiency and the product quality are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of welding equipment, and in particular to a diaphragm direct welding device and method for a dynamic flat-panel combination earphone. Background Art

[0002] Dynamic-planar combination headphones combine the advantages of dynamic headphones and planar headphones to provide a new audio experience. Dynamic headphones dominate the market with their mature technology and wide applicability, while planar headphones, with their flat diaphragm design, can provide less distortion and smoother frequency response. However, there are some problems with the traditional diaphragm preparation and assembly process, especially in dynamic-planar combination headphones, the positioning and assembly of the diaphragm is particularly critical, which has a great impact on the sound field coordination of the dynamic and planar speakers.

[0003] In existing technologies, the diaphragm is usually prepared first and then assembled with other parts such as metal rings by welding or pasting. This method has some obvious defects. First, the alignment of the diaphragm becomes a problem because the size and shape of the diaphragm need to be precisely matched with parts such as metal rings, and traditional assembly processes cannot guarantee such precision. Secondly, the diaphragm is usually thin and easy to move during the bonding or welding process, resulting in inaccurate positioning and even possible damage to the diaphragm. These problems not only affect the sound quality of the headphones, but also limit the improvement of production efficiency and product quality.

[0004] In order to solve these problems, the present invention proposes a diaphragm direct welding device for dynamic flat-panel combination headphones. The device performs welding operations directly on the diaphragm, avoiding multiple assembly and positioning steps in traditional processes, and greatly improving the connection accuracy and stability between the diaphragm and the metal ring. Summary of the invention

[0005] In order to solve the above problems, the present invention provides a diaphragm direct welding device for a dynamic flat-panel combination earphone, which is used for directly welding the flat earphone diaphragm of the dynamic flat-panel combination earphone, wherein the earphone diaphragm includes a diaphragm substrate and a metal ring, and a welding hole for welding is provided on the metal ring, including: A solder applying mechanism, used for applying solder to the welding hole on the metal ring; An image positioning mechanism, used to locate the position of the metal ring; A laser source and a galvanometer mechanism, wherein the laser emitted by the laser source is adjusted by the galvanometer mechanism to realize laser welding of the welding hole on the metal ring and laser cutting of the position outside the metal ring; The spraying mechanism includes a metal wire spray head, which is used to spray the metal wire on the diaphragm after the welding is completed, so as to complete the processing of the metal layer on the diaphragm; The displacement mechanism is used to drive the metal ring to move in the horizontal direction; A controller, used to control the coordinated work of various mechanisms; Before welding, the size of the diaphragm substrate is larger than that of the metal ring. During welding, the controller controls the laser source and the galvanometer mechanism to perform laser scanning on the metal ring and the position outside the metal ring. Welding and laser cutting are performed simultaneously in one circle of scanning. The size of the metal ring after cutting is equal to that of the diaphragm substrate.

[0006] The displacement mechanism includes an XY axis moving platform and a metal ring fixture, and the metal ring fixture is used to fix the metal ring and maintain the stability of the metal ring during the welding process; The image positioning mechanism includes a camera and a marking point, the camera is arranged above the XY axis moving platform, and the marking point is arranged on the outer ring of the metal ring fixture; The marker points can be captured by the camera and used to provide position marks when performing positioning calculations; A backlight is also provided on the XY axis moving platform and is disposed at the center of the metal ring fixture to provide light that can pass through the diaphragm substrate when positioning the upper metal ring, so as to achieve positioning of the upper metal ring.

[0007] The laser source is an infrared laser source, the laser is a continuous laser, the emission wavelength is 1064 nm or 10.6 μm, the maximum laser power is 10 kW to 50 kW, and the laser spot area is 30-500 mm 2 .

[0008] The solder coating mechanism comprises a coating head and a scraper. The coating head is used to evenly coat the solder on the welding hole on the metal ring, and the scraper is used to perform flattening to ensure the uniformity of the solder layer.

[0009] The positioning of the image positioning mechanism is specifically as follows: Use a camera to capture the marking points on the metal ring fixture and the welding holes on the metal ring, obtain their coordinate positions in the image, and determine the accurate position coordinates of the welding holes by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system; The specific calculation method is: Assume the coordinates of the marker point in the image coordinate system are (x m ,y m ), the coordinates of the welding hole in the image coordinate system are (x h ,y h ), then the exact position coordinates of the welding hole (X h ,Y h ) is calculated by the following formula: , ; Among them, (X m ,Y m) is the known coordinate of the marker point in the real space, and S is the scaling factor between the image coordinate system and the real space coordinate system.

[0010] The welding hole of the metal ring requires a higher power density to achieve the melting of the solder and the welding of the metal ring, while the paper material of the diaphragm substrate requires a lower power density to achieve ablation; therefore, the laser source performs power density shaping after emitting the laser, so that the energy distribution center of the laser is offset; After the laser spot is reflected by the galvanometer, the energy of the inner ring is greater than that of the outer ring during laser welding, that is, the laser energy density irradiated to the metal ring is greater than the laser energy density irradiated to the diaphragm substrate from the outside of the metal ring during laser welding. The laser power density irradiated to the metal ring is 10 4 Up to 10 6 W / cm² range, and the solder has good heat absorption rate and thermal conductivity, and can quickly absorb heat and melt the solder under laser irradiation. The solder has better absorption rate and thermal conductivity than the diaphragm substrate. By utilizing the difference in heat absorption characteristics of the two materials, a good molten weld can be formed by adjusting the laser parameters.

[0011] The spraying mechanism includes a metal wire spray head, which is used to spray metal wire on the diaphragm after welding. Specifically: According to the size of the diaphragm and the spraying requirements of the metal wire, the working parameters of the spraying mechanism are set, and the working parameters include spraying speed, spraying distance, spraying angle and spraying flow rate; Driven by the controller, the wire nozzle moves along a preset reciprocating serpentine route to evenly spray the wire on the welded diaphragm surface; the spacing and width of the serpentine route are set according to the size of the diaphragm and the requirements for spraying the wire to ensure that the entire diaphragm surface is evenly covered; during the spraying process, the moving speed and spraying flow of the wire nozzle remain stable to ensure the uniform distribution and adhesion quality of the wire.

[0012] A method for welding a diaphragm using a diaphragm direct welding device for a dynamic flat panel combination earphone comprises: Preparation stage: Place the lower metal ring on the metal ring jig of the welding equipment, and align the welding hole on the lower metal ring roughly with the positioning point on the jig; First positioning: Use the camera of the image positioning mechanism to shoot the marking points on the metal ring fixture and the welding holes on the lower metal ring to obtain their coordinate positions in the image; determine the accurate position coordinates of the welding holes by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system; First solder coating: Start the solder coating mechanism, and the coating head evenly coats the solder on the welding holes on the lower metal ring, and then the scraper flattens it to ensure the uniformity of the solder layer; Second positioning: Place the diaphragm substrate on the metal ring, ensure that the size of the diaphragm substrate is larger than that of the metal ring, and place the upper metal ring on the diaphragm substrate; determine whether the upper metal ring and the lower metal ring are aligned, and adjust the position; Second solder coating: Start the solder coating mechanism, and the coating head evenly coats the solder on the welding holes on the upper metal ring, and then the scraper flattens it to ensure the uniformity of the solder layer; Laser welding and cutting: The controller adjusts the laser source and the galvanometer mechanism according to the positioning results, and performs welding and laser cutting simultaneously in one circle scanning, so that the size of the metal ring is equal to that of the diaphragm substrate; Spraying metal wire: After welding is completed, start the spraying mechanism. Driven by the controller, the metal wire nozzle moves along a preset reciprocating serpentine route to evenly spray the metal wire on the welded diaphragm surface.

[0013] Before welding, the energy distribution center of the laser spot is offset to ensure that during laser welding, the laser energy density irradiated to the metal ring is greater than the laser energy density irradiated from the outside of the metal ring to the diaphragm substrate; the laser source emits a continuous laser with a wavelength of 1064 nm or 10.6 μm, a power between 10 kW and 50 kW, and a spot area of ​​30-500 mm².

[0014] Determine whether the upper metal ring and the lower metal ring are aligned and adjust their positions, specifically: Turn on the backlight on the metal ring fixture, use the camera of the image positioning mechanism to shoot the marking points on the upper metal ring fixture and the welding holes on the metal ring, and obtain their coordinate positions in the image; determine the accurate position coordinates of the welding hole by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system; The alignment of the upper metal ring and the lower metal ring is determined based on the image after being illuminated by the backlight. At the same time, the coordinates of the upper metal ring and the lower metal ring are compared based on the coordinate calculation results to see if they coincide. If they do not align or coincide, the position of the upper metal ring is adjusted until they are aligned and the welding holes coincide.

[0015] The beneficial effects of the present invention are: The traditional production process requires cutting first and then welding. These two steps often require different equipment and multiple positioning, which increases production time and cost. The present invention simultaneously performs welding and laser cutting in one circle scanning, combines welding and cutting into one step, avoids the diaphragm positioning process, reduces the time of equipment switching and repeated positioning, and thus significantly improves production quality and efficiency.

[0016] In the traditional production process, the positioning of the diaphragm needs to be very precise, otherwise the sound quality and performance of the headphones will be affected. The size of the cut metal ring of the present invention is equal to the size of the diaphragm substrate, avoiding the requirement of individually positioning the diaphragm in the prior art. By ensuring that the size of the metal ring and the diaphragm substrate are consistent, the complex steps of individually positioning the diaphragm and possible positioning errors are avoided, the production process is simplified, and the production difficulty is reduced.

[0017] The laser source and galvanometer mechanism in the equipment can accurately control the power, spot size and scanning path of the laser to ensure the accuracy of welding and cutting. At the same time, the image positioning mechanism can accurately locate the position of the metal ring and provide accurate coordinate information for welding and cutting. This high-precision production method can meet the strict requirements of dynamic flat-panel combination headphones on the size, shape and connection quality of the diaphragm and metal ring, and improve the quality and performance of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] Attached Figure 1 It is a framework diagram of the device of the present invention; Attached Figure 2 It is a schematic diagram of the structure of the earphone of the present invention; Attached Figure 3 is a schematic diagram of the structure of the diaphragm of the present invention; Attached Figure 4 is a schematic diagram of the processing process of the diaphragm of the present invention; Attached Figure 5 This is a working principle diagram of the backlight lamp of the present invention; Attached Figure 6 This is the energy distribution diagram of the laser spot of the present invention, wherein the left side is the low energy area and the right side is the high energy area.

[0020] in, Housing 1, dynamic speaker 2, interface 3, flat speaker 4, flat speaker pad 5, earmuffs 6, head beam assembly 7, diaphragm substrate 41, upper metal ring 42, metal wire 43, lower metal ring 44, welding hole 421, metal wire nozzle 8, camera 9, backlight 91, laser source 10. DETAILED DESCRIPTION

[0021] Embodiment 1: See also Figures 1 to 6The present invention provides a diaphragm direct welding device for a dynamic flat panel combination earphone, which is used for directly welding the flat panel earphone diaphragm of the dynamic flat panel combination earphone. The earphone diaphragm includes a diaphragm substrate and a metal ring, and the metal ring is provided with a welding hole for welding, including: A solder applying mechanism, used for applying solder to the welding hole on the metal ring; An image positioning mechanism, used to locate the position of the metal ring; A laser source and a galvanometer mechanism, wherein the laser emitted by the laser source is adjusted by the galvanometer mechanism to realize laser welding of the welding hole on the metal ring and laser cutting of the position outside the metal ring; The spraying mechanism includes a metal wire spray head, which is used to spray the metal wire on the diaphragm after the welding is completed, so as to complete the processing of the metal layer on the diaphragm; The displacement mechanism is used to drive the metal ring to move in the horizontal direction; A controller, used to control the coordinated work of various mechanisms; Before welding, the size of the diaphragm substrate is larger than that of the metal ring. During welding, the controller controls the laser source and the galvanometer mechanism to perform laser scanning on the metal ring and the position outside the metal ring. Welding and laser cutting are performed simultaneously in one circle of scanning. The size of the metal ring after cutting is equal to that of the diaphragm substrate.

[0022] The displacement mechanism includes an XY axis moving platform and a metal ring fixture, and the metal ring fixture is used to fix the metal ring and maintain the stability of the metal ring during the welding process; The image positioning mechanism includes a camera and a marking point, the camera is arranged above the XY axis moving platform, and the marking point is arranged on the outer ring of the metal ring fixture; The marker points can be captured by the camera and used to provide position marks when performing positioning calculations; A backlight is also provided on the XY axis moving platform and is disposed at the center of the metal ring fixture to provide light that can pass through the diaphragm substrate when positioning the upper metal ring, so as to achieve positioning of the upper metal ring.

[0023] The laser source is an infrared laser source, the laser is a continuous laser, the emission wavelength is 1064 nm or 10.6 μm, the maximum laser power is 10 kW to 50 kW, and the laser spot area is 30-500 mm 2 .

[0024] The solder coating mechanism comprises a coating head and a scraper. The coating head is used to evenly coat the solder on the welding hole on the metal ring, and the scraper is used to perform flattening to ensure the uniformity of the solder layer.

[0025] The positioning of the image positioning mechanism is specifically as follows: Use a camera to capture the marking points on the metal ring fixture and the welding holes on the metal ring, obtain their coordinate positions in the image, and determine the accurate position coordinates of the welding holes by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system; The specific calculation method is: Assume the coordinates of the marker point in the image coordinate system are (x m ,y m ), the coordinates of the welding hole in the image coordinate system are (x h ,y h ), then the exact position coordinates of the welding hole (X h ,Y h ) is calculated by the following formula: , ; Among them, (X m ,Y m ) is the known coordinate of the marker point in the real space, and S is the scaling factor between the image coordinate system and the real space coordinate system.

[0026] The welding hole of the metal ring requires a higher power density to achieve the melting of the solder and the welding of the metal ring, while the paper material of the diaphragm substrate requires a lower power density to achieve ablation; therefore, the laser source performs power density shaping after emitting the laser, so that the energy distribution center of the laser is offset; After the laser spot is reflected by the galvanometer, the energy of the inner ring is greater than that of the outer ring during laser welding, that is, the laser energy density irradiated to the metal ring is greater than the laser energy density irradiated to the diaphragm substrate from the outside of the metal ring during laser welding. The laser power density irradiated to the metal ring is 10 4 Up to 10 6 W / cm² range, and the solder has good heat absorption rate and thermal conductivity, and can quickly absorb heat and melt the solder under laser irradiation. The solder has better absorption rate and thermal conductivity than the diaphragm substrate. By utilizing the difference in heat absorption characteristics of the two materials, a good molten weld can be formed by adjusting the laser parameters.

[0027] The spraying mechanism includes a metal wire spray head, which is used to spray metal wire on the diaphragm after welding. Specifically: According to the size of the diaphragm and the spraying requirements of the metal wire, the working parameters of the spraying mechanism are set, and the working parameters include spraying speed, spraying distance, spraying angle and spraying flow rate; Driven by the controller, the wire nozzle moves along a preset reciprocating serpentine route to evenly spray the wire on the welded diaphragm surface; the spacing and width of the serpentine route are set according to the size of the diaphragm and the requirements for spraying the wire to ensure that the entire diaphragm surface is evenly covered; during the spraying process, the moving speed and spraying flow of the wire nozzle remain stable to ensure the uniform distribution and adhesion quality of the wire.

[0028] Embodiment 2: See also Figures 4 to 6 , a method for welding a diaphragm using a diaphragm direct welding device for a dynamic flat panel combination earphone, comprising: Preparation stage: Place the lower metal ring on the metal ring jig of the welding equipment, and align the welding hole on the lower metal ring roughly with the positioning point on the jig; First positioning: Use the camera of the image positioning mechanism to shoot the marking points on the metal ring fixture and the welding holes on the lower metal ring to obtain their coordinate positions in the image; determine the accurate position coordinates of the welding holes by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system; First solder coating: Start the solder coating mechanism, and the coating head evenly coats the solder on the welding holes on the lower metal ring, and then the scraper flattens it to ensure the uniformity of the solder layer; Second positioning: Place the diaphragm substrate on the metal ring, ensure that the size of the diaphragm substrate is larger than that of the metal ring, and place the upper metal ring on the diaphragm substrate; determine whether the upper metal ring and the lower metal ring are aligned, and adjust the position; Second solder coating: Start the solder coating mechanism, and the coating head evenly coats the solder on the welding holes on the upper metal ring, and then the scraper flattens it to ensure the uniformity of the solder layer; Laser welding and cutting: The controller adjusts the laser source and the galvanometer mechanism according to the positioning results, and performs welding and laser cutting simultaneously in one circle scanning, so that the size of the metal ring is equal to that of the diaphragm substrate; Spraying metal wire: After welding is completed, start the spraying mechanism. Driven by the controller, the metal wire nozzle moves along a preset reciprocating serpentine route to evenly spray the metal wire on the welded diaphragm surface.

[0029] Before welding, the energy distribution center of the laser spot is offset to ensure that during laser welding, the laser energy density irradiated to the metal ring is greater than the laser energy density irradiated from the outside of the metal ring to the diaphragm substrate; the laser source emits a continuous laser with a wavelength of 1064 nm or 10.6 μm, a power between 10 kW and 50 kW, and a spot area of ​​30-500 mm².

[0030] Determine whether the upper metal ring and the lower metal ring are aligned and adjust their positions, specifically: Turn on the backlight on the metal ring fixture, use the camera of the image positioning mechanism to shoot the marking points on the upper metal ring fixture and the welding holes on the metal ring, and obtain their coordinate positions in the image; determine the accurate position coordinates of the welding hole by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system; The alignment of the upper metal ring and the lower metal ring is determined based on the image after being illuminated by the backlight. At the same time, the coordinates of the upper metal ring and the lower metal ring are compared based on the coordinate calculation results to see if they coincide. If they do not align or coincide, the position of the upper metal ring is adjusted until they are aligned and the welding holes coincide.

[0031] Thus far, the description of the above-described embodiments is provided for the purpose of illustration and description. It is not intended to be exhaustive or to limit the present disclosure. The individual elements or features of a specific embodiment are generally not subject to the limitations of the specific embodiment, but when applicable, they can be interchanged and used for selected embodiments even if not specifically shown or described. In many respects, the same element or feature also can be changed. This variation is not considered to be a departure from the present disclosure, and all such modifications are intended to be included in the scope of the present disclosure.

[0032] Example embodiments are provided so that the present disclosure will be thorough and the scope will be fully conveyed to those skilled in the art. In order to thoroughly understand the embodiments of the present disclosure, numerous details are set forth, such as examples of specific parts, devices, and methods. Obviously, for those skilled in the art, it is not necessary to use specific details, the example embodiments can be implemented in many different forms, and neither should be construed as limiting the scope of the present disclosure. In certain example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.

[0033] Here, specialized vocabulary is used only for the purpose of describing specific example embodiments, and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "a" and "the" used herein may be intended to include plural forms as well. The terms "including" and "having" are inclusive, and therefore specify the presence of the claimed features, wholes, steps, operations, elements and / or components, but do not exclude the presence or additional presence of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof. Unless the order of execution is clearly indicated, the method steps, processing and operations described herein are not interpreted as necessarily needing to be performed in the specific order discussed and shown. It should also be understood that additional or optional steps may be adopted.

Claims

1. A diaphragm direct welding device for a dynamic flat-panel combination earphone, used for directly welding a flat earphone diaphragm of a dynamic flat-panel combination earphone, the earphone diaphragm comprises a diaphragm substrate and a metal ring, and a welding hole for welding is provided on the metal ring, characterized in that: include: A solder applying mechanism, used for applying solder to the welding hole on the metal ring; An image positioning mechanism, used to locate the position of the metal ring; A laser source and a galvanometer mechanism, wherein the laser emitted by the laser source is adjusted by the galvanometer mechanism to realize laser welding of the welding hole on the metal ring and laser cutting of the position outside the metal ring; The spraying mechanism includes a metal wire spray head, which is used to spray the metal wire on the diaphragm after the welding is completed, so as to complete the processing of the metal layer on the diaphragm; The displacement mechanism is used to drive the metal ring to move in the horizontal direction; A controller, used to control the coordinated work of various mechanisms; Before welding, the size of the diaphragm substrate is larger than that of the metal ring. During welding, the controller controls the laser source and the galvanometer mechanism to perform laser scanning on the metal ring and the position outside the metal ring. Welding and laser cutting are performed simultaneously in one circle of scanning. The size of the metal ring after cutting is equal to that of the diaphragm substrate.

2. The diaphragm direct welding device for dynamic flat-panel combination headphones according to claim 1, characterized in that: The displacement mechanism includes an XY axis moving platform and a metal ring fixture, and the metal ring fixture is used to fix the metal ring and maintain the stability of the metal ring during the welding process; The image positioning mechanism includes a camera and a marking point, the camera is arranged above the XY axis moving platform, and the marking point is arranged on the outer ring of the metal ring fixture; The marker points can be captured by the camera and used to provide position marks when performing positioning calculations; A backlight is also provided on the XY axis moving platform and is disposed at the center of the metal ring fixture to provide light that can pass through the diaphragm substrate when positioning the upper metal ring, so as to achieve positioning of the upper metal ring.

3. The diaphragm direct welding device for dynamic flat-panel combination headphones according to claim 1, characterized in that: The laser source is an infrared laser source, the laser is a continuous laser, the emission wavelength is 1064 nm or 10.6 μm, the maximum laser power is 10 kW to 50 kW, and the laser spot area is 30-500 mm 2 .

4. The diaphragm direct welding device for dynamic flat-panel combination headphones according to claim 2, characterized in that: The solder smearing mechanism comprises a smearing head and a scraper. The smearing head is used for evenly smearing solder on the welding hole on the metal ring, and the scraper is used for flattening the solder.

5. The diaphragm direct welding device for dynamic flat-panel combination headphones according to claim 4, characterized in that: The positioning of the image positioning mechanism is specifically as follows: The camera is used to photograph the marking points on the metal ring fixture and the welding holes on the metal ring, and the accurate position coordinates of the welding holes are determined by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system; The specific calculation method is: Assume the coordinates of the marker point in the image coordinate system are (x m ,y m ), the coordinates of the welding hole in the image coordinate system are (x h ,y h ), then the exact position coordinates of the welding hole (X h ,Y h ) is calculated by the following formula: ， ； Among them, (X m ,Y m ) is the known coordinate of the marker point in the real space, and S is the scaling factor between the image coordinate system and the real space coordinate system.

6. The diaphragm direct welding device for dynamic flat-panel combination headphones according to claim 5, characterized in that: After the laser source emits the laser, power density shaping is performed to shift the energy distribution center of the laser spot to one side, and make the energy of the inner ring greater than that of the outer ring during laser welding; that is, during laser welding, the laser energy density irradiated to the metal ring is greater than the laser energy density irradiated from the outside of the metal ring to the diaphragm substrate; The laser power density irradiated to the metal ring is 10 4 Up to 10 6 W / cm² range.

7. The diaphragm direct welding device for dynamic flat-panel combination headphones according to claim 5, characterized in that: The spraying mechanism includes a metal wire spray head, which is used to spray metal wire on the diaphragm after welding. Specifically: According to the size of the diaphragm and the spraying requirements of the metal wire, the working parameters of the spraying mechanism are set, and the working parameters include spraying speed, spraying distance, spraying angle and spraying flow rate; Driven by the controller, the wire spray head moves along a preset reciprocating serpentine route to evenly spray the wire onto the surface of the welded diaphragm.

8. The method for welding the diaphragm according to any one of claims 1 to 7, characterized in that include: Preparation stage: Place the lower metal ring on the metal ring jig of the welding equipment, and align the welding hole on the lower metal ring roughly with the positioning point on the jig; First positioning: Use the camera of the image positioning mechanism to shoot the marking points on the metal ring fixture and the welding holes on the lower metal ring to obtain their coordinate positions in the image; determine the accurate position coordinates of the welding holes by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system; First solder coating: Start the solder coating mechanism, and the coating head evenly coats the solder on the welding holes on the lower metal ring, and then the scraper flattens it to ensure the uniformity of the solder layer; Second positioning: Place the diaphragm substrate on the metal ring, ensure that the size of the diaphragm substrate is larger than that of the metal ring, and place the upper metal ring on the diaphragm substrate; determine whether the upper metal ring and the lower metal ring are aligned, and adjust the position; Second solder coating: Start the solder coating mechanism, and the coating head evenly coats the solder on the welding holes on the upper metal ring, and then the scraper flattens it to ensure the uniformity of the solder layer; Laser welding and cutting: The controller adjusts the laser source and the galvanometer mechanism according to the positioning results, and performs welding and laser cutting simultaneously in one circle scanning, so that the size of the metal ring is equal to that of the diaphragm substrate; Spraying metal wire: After welding is completed, start the spraying mechanism. Driven by the controller, the metal wire nozzle moves along a preset reciprocating serpentine route to evenly spray the metal wire on the welded diaphragm surface.

9. The diaphragm welding method according to claim 8, characterized in that: Before welding, the energy distribution center of the laser spot is offset to ensure that during laser welding, the laser energy density irradiated to the metal ring is greater than the laser energy density irradiated from the outside of the metal ring to the diaphragm substrate; the laser source emits a continuous laser with a wavelength of 1064nm or 10.6 μm, a power between 10 kW and 50 kW, and a spot area of ​​30-500 mm².

10. The diaphragm welding method according to claim 8, characterized in that: Determine whether the upper metal ring and the lower metal ring are aligned and adjust their positions, specifically: Turn on the backlight on the metal ring fixture, use the camera of the image positioning mechanism to shoot the marking points on the upper metal ring fixture and the welding holes on the metal ring, and determine the accurate position coordinates of the welding holes by calculating the relative position relationship between the marking points and the welding holes in the image coordinate system; The alignment of the upper metal ring and the lower metal ring is determined based on the image after being illuminated by the backlight. At the same time, the coordinates of the upper metal ring and the lower metal ring are compared based on the coordinate calculation results to see if they coincide. If they do not align or coincide, the position of the upper metal ring is adjusted until they are aligned and the welding holes coincide.

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