Light leakage prevention plated part, preparation method thereof and kitchen and bath appliance

Abstract

The invention relates to the technical field of light leakage prevention surface treatment, in particular to a light leakage prevention plated part, a preparation method of the light leakage prevention plated part and a kitchen and bath utensil, a plating layer of a light leakage prevention layer on the surface of the light leakage prevention plated part is uniform, the bonding performance of the plating layer and a substrate is good, and the defects of light leakage, pocking marks and the like can be reduced. The light leakage prevention plating piece comprises a to-be-plated substrate and a light leakage prevention layer arranged on the surface of the to-be-plated substrate, the light leakage prevention layer is pervious to light, and the light leakage prevention layer comprises a bottoming layer, a metal plating layer and a protective layer which are sequentially stacked in the direction gradually away from the to-be-plated substrate; the base layer is prepared from the following materials: silicon dioxide.

Description

Technical Field

[0001] The present application relates to the technical field of anti-light leakage surface treatment, and in particular to an anti-light leakage plated part and a preparation method thereof, and kitchen and bathroom appliances. Background Art

[0002] With the development of science and technology and the progress of human society, more and more daily and business products pay more and more attention to the metallic luster and texture of the product surface to increase the commercial value of the product and enhance the performance of the product itself.

[0003] At present, a light-transmitting layer is usually formed on the surface of a product substrate, which protects the surface of the product substrate and makes the product present the metallic luster and texture of the substrate itself. For example, in the field of kitchen and bathroom technology, a light-transmitting layer is usually formed on the surface of kitchen and bathroom appliances to present the metallic texture appearance of the kitchen and bathroom substrate itself; for another example, in the field of automobile lamp technology, a light-transmitting layer is usually formed on the surface of the lamp to enhance the lighting performance of the lamp itself.

[0004] However, in the related art, when the substrate surface of the product is a polymer substrate material, there are usually problems such as poor bonding performance between the light-transmitting layer and the substrate surface of the product and poor uniformity of the coating thickness in the light-transmitting layer, which easily leads to defects such as light leakage and pitting, which is not conducive to uniform light transmission of the product and seriously affects the commercial value of the product and its performance. Summary of the invention

[0005] Based on this, some embodiments of the present application provide a light leakage prevention coating, the coating of the light leakage prevention layer on the surface of the light leakage prevention coating is relatively uniform, and the bonding performance with the substrate is good, which can reduce defects such as light leakage and pitting. Other embodiments of the present application also provide a method for preparing the light leakage prevention coating, and kitchen and bathroom appliances including the light leakage prevention coating.

[0006] In a first aspect, a light leakage prevention plated component is provided, comprising:

[0007] A substrate to be plated;

[0008] An anti-light leakage layer, which is disposed on the surface of the substrate to be plated and is light-transmissive;

[0009] The anti-light leakage layer comprises: a primer layer, a metal plating layer and a protective layer stacked in sequence in a direction gradually away from the substrate to be plated; the material for preparing the primer layer comprises: silicon dioxide.

[0010] Optionally, the anti-light leakage plating element satisfies at least one of the following conditions:

[0011] (1) The thickness of the metal coating is 40nm~50nm;

[0012] (2) The material for preparing the metal coating includes: metal aluminum;

[0013] (3) The thickness of the primer layer is 2 μm to 5 μm;

[0014] (4) The material for preparing the protective layer includes: at least one of silicon dioxide, silicon nitride, zirconium oxide and titanium oxide;

[0015] (5) The thickness of the protective layer is 0.2 μm to 0.8 μm;

[0016] (6) The material used to prepare the surface of the substrate to be plated is a polymer substrate material; optionally, the polymer substrate material includes at least one of PC and PMMA.

[0017] In a second aspect, a method for preparing an anti-light leakage plated part is provided, comprising:

[0018] S21), providing a substrate to be plated;

[0019] S22), forming a stacked base layer, a metal plating layer and a protective layer in sequence on the surface of the substrate to be plated to form a light leakage prevention layer on the surface of the substrate to be plated, the light leakage prevention layer is light-transmissive, and the material for preparing the base layer includes: silicon dioxide.

[0020] Optionally, S22), comprising:

[0021] Performing surface cleaning treatment on the substrate to be plated;

[0022] Using a first sputtering process, a silicon dioxide film is deposited on the surface of the substrate to be plated after the surface cleaning treatment to form the primer layer;

[0023] Using a vacuum evaporation process, a metal film is deposited on the surface of the base layer away from the substrate to be plated to form the metal coating;

[0024] A second sputtering process is adopted to deposit a protective material film on the surface of the metal coating layer away from the substrate to be plated, so as to form the protective layer.

[0025] Optionally, the sputtering target material used in the first sputtering process is a silicon target, the working gas during sputtering is oxygen, the gas pressure in the chamber is 0.5 Pa ~ 1Pa, the sputtering power is 100W ~ 200W, the sputtering time is 20min ~ 30min, and the rotation speed of the substrate to be plated is 15r / min ~ 20r / min.

[0026] Optionally, in the first sputtering process, the flow rate of the working gas is 200 sccm-400 sccm, and the flow rate of the protective gas is 200-300 sccm.

[0027] Optionally, the material of the metal coating includes: metal aluminum;

[0028] In the vacuum evaporation process, the vacuum degree in the chamber is 5×10 -4 Pa ~5×10 -3 Pa, the evaporation rate is 5 Å / s~10 Å / s, the evaporation current is 80 A~100 A, the time is 60~120s, and the rotation speed of the substrate to be plated is 20 r / min~25 r / min.

[0029] Optionally, the sputtering target material used in the second sputtering process includes at least one of silicon, silicon dioxide, silicon nitride, zirconium oxide, titanium and titanium oxide, and when the sputtering target material used in the second sputtering process includes at least one of silicon and titanium, the working gas during sputtering includes oxygen and / or nitrogen, and the vacuum degree in the chamber is 5×10 -3 Pa~9×10 -3 Pa, the sputtering power is 50 W ~ 100 W, and the sputtering time is 5 min ~ 20 min.

[0030] Optionally, the material for preparing the protective layer is silicon dioxide and / or titanium oxide; in the second sputtering process, the sputtering target is a silicon target and / or a titanium target, the working gas is oxygen, the flow rate of the oxygen is 200 sccm ~400 sccm, and the flow rate of the protective gas is 200 sccm ~400 sccm; or

[0031] The material for preparing the protective layer is silicon nitride; in the second sputtering process, the sputtering target is a silicon target, the working gas is nitrogen, the flow rate of the nitrogen is 200 sccm ~400 sccm, and the flow rate of the protective gas is 200 sccm ~400 sccm.

[0032] Optionally, the substrate to be plated is subjected to a surface cleaning treatment, comprising:

[0033] Removing mechanical impurities and oil stains from the surface of the substrate to be plated;

[0034] Glow discharge is used to perform plasma surface cleaning on the substrate to be plated from which mechanical impurities and oil stains have been removed.

[0035] Optionally, when plasma surface cleaning is performed on the substrate to be plated after mechanical impurities and oil stains are removed by glow discharge, the vacuum degree in the chamber is 2×10 -3 Pa ~2.0×10 -2Pa, the discharge voltage is 400 V ~500 V, the working gas introduced is argon, the flow rate of argon is 200 sccm ~300 sccm, the cleaning time is 60s ~120 s, and the rotation speed of the substrate to be plated is 15 r / min ~20 r / min.

[0036] In a third aspect, a kitchen and bathroom appliance is provided, comprising the anti-light leakage coating component as described in the first aspect.

[0037] The beneficial effects of the above-mentioned light leakage-proof plated part, its preparation method and kitchen and bathroom appliances are as follows:

[0038] Since the surface of the substrate to be plated is a polymer substrate material, a silica coating layer is provided between the metal coating and the substrate to be plated, so that the silica coating layer can improve the bonding performance between the metal coating and the substrate to be plated. At the same time, the silica coating layer itself has good thickness uniformity, so that the metal coating thereon also has good thickness uniformity, and the defects such as light leakage and pitting in the coating in the anti-light leakage layer are reduced, and the technical problems of poor bonding performance between the coating and the substrate in the light-transmitting layer and poor thickness uniformity of the coating in the light-transmitting layer in the related art are solved, which easily leads to defects such as light leakage and pitting, and the commercial value of the product can be improved and the performance of the product itself can be enhanced. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A schematic cross-sectional structure diagram of an anti-light leakage plating component provided in an embodiment of the present application;

[0040] Figure 2 A schematic flow chart of a method for preparing a light leakage-proof plated part provided in an embodiment of the present application. DETAILED DESCRIPTION

[0041] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0042] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "exemplarily" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0043] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0044] In this document, "for example", "such as", "example", "for example", etc. are used for descriptive purposes, indicating that the previous and subsequent different technical solutions are related in terms of the content covered, but should not be understood as limiting the previous technical solution, nor can they be understood as limiting the scope of protection of this document. In this document, unless otherwise specified, A (such as B) means that B is a non-limiting example of A, and it can be understood that A is not limited to B.

[0045] In this article, "optionally", "optional", and "optional" mean optional, that is, any one of the two parallel options of "yes" or "no". If there are multiple "options" in a technical solution, unless otherwise specified and there is no contradiction or mutual restriction, each "option" is independent.

[0046] Herein, descriptions such as "optionally contain", "optionally include", etc., mean "contain or not contain". "Optional component X" means component X exists or does not exist, or means containing or not containing the component X.

[0047] In this document, the terms "first", "second", etc. in "the first aspect", "the second aspect", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or quantity, nor can they be understood as implicitly indicating the importance or quantity of the indicated technical features.

[0048] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0050] In this article, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features.

[0051] In this document, "at least one" means more than one, such as one, two and more than two. "Multiple" or "several" means at least two, such as two, three, etc.

[0052] Herein, when it comes to a numerical interval (i.e., a numerical range), unless otherwise specified, the distribution of the optional numerical values ​​within the numerical interval is considered to be continuous and includes the two numerical endpoints (i.e., the minimum and maximum values) of the numerical interval, and each numerical value between the two numerical endpoints. Unless otherwise specified, when a numerical interval only refers to integers within the numerical interval, including the two endpoint integers of the numerical range, and each integer between the two endpoints, is equivalent to directly listing each integer. When multiple numerical ranges are provided to describe features or characteristics, these numerical ranges can be combined. In other words, unless otherwise specified, the numerical ranges disclosed herein should be understood to include any and all sub-ranges included therein. The "numerical value" in the numerical interval can be any quantitative value, such as a number, a percentage, a ratio, etc. "Numerical interval" allows broadly including numerical interval types such as percentage intervals, ratio intervals, and ratio intervals.

[0053] In this article, when it comes to percentage concentration, unless otherwise specified, it refers to the final concentration. The final concentration refers to the proportion of the added component in the system after the addition of the component.

[0054] In this article, if there are multiple steps involved in the method flow, unless there is a clear different description in this article, there is no strict order restriction for the execution of these steps, and they can be executed in other orders than described. Moreover, any step can include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn, alternating or simultaneously with other steps or parts of sub-steps or stages of other steps.

[0055] In view of the technical problems in the related art that the light-transmitting layer has poor bonding performance between the coating and the substrate and poor thickness uniformity of the coating in the light-transmitting layer, which easily leads to defects such as light leakage and pitting, the specific implementation methods of the present application are described as follows:

[0056] In a first aspect, some embodiments of the present application provide a light leakage prevention plated part, such as Figure 1 As shown, the anti-light leakage plating part includes: a substrate to be plated 11, and an anti-light leakage layer 12 arranged on the surface of the substrate to be plated 11, wherein the anti-light leakage layer 12 is light-transmissive, and the anti-light leakage layer 12 includes: a base layer 121, a metal plating layer 122 and a protective layer 123 stacked in sequence in a direction gradually away from the substrate to be plated 11; the material for preparing the base layer 121 includes: silicon dioxide.

[0057] The light leakage prevention layer 12 is light-transmissive, which means that through the light leakage prevention layer 12 , the light leakage prevention plated part can present the texture and gloss of the surface of the substrate 11 to be plated or the substrate itself.

[0058] The surface of the substrate 11 to be plated can be made of metal material or polymer material.

[0059] In the anti-light leakage plated part provided in the embodiment of the present application, since the surface of the substrate 11 to be plated is a polymer substrate material, a silica coating layer is arranged between the metal coating 122 and the substrate 11 to be plated. The silica coating layer can improve the bonding performance between the metal coating 122 and the substrate 11 to be plated. At the same time, the silica coating layer itself has good thickness uniformity, so that the metal coating 122 thereon also has good thickness uniformity, reducing defects such as light leakage and pitting in the coating in the anti-light leakage layer 12, and solving the technical problems of poor bonding performance between the coating and the substrate in the light-transmitting layer and poor thickness uniformity of the coating in the light-transmitting layer in the related art, which easily leads to defects such as light leakage and pitting, thereby improving the commercial value of the product and enhancing the performance of the product itself.

[0060] In some embodiments, the material used to prepare the substrate surface to be plated is a polymer substrate material.

[0061] In some embodiments, the polymer base material includes at least one of PC and PMMA.

[0062] In some embodiments, the thickness of the metal coating layer 122 is 40 nm to 50 nm.

[0063] In these embodiments, the metal coating layer 122 is relatively thin, which can improve light transmittance.

[0064] In some embodiments, the material used to prepare the metal coating layer 122 includes: metal aluminum.

[0065] In some embodiments, the thickness of the primer layer 121 is 2 μm-5 μm.

[0066] In these embodiments, by controlling the thickness of the base layer 121 to be within the range of 2 μm to 5 μm, the bonding performance between the metal coating 122 and the substrate 11 to be plated can be effectively improved, and the thickness uniformity of the metal coating 122 can be improved at the same time.

[0067] In some embodiments, the material for preparing the protective layer 123 includes: at least one of silicon dioxide, silicon nitride, zirconium oxide and titanium oxide;

[0068] In these embodiments, these materials have relatively good transparency and hardness, and can improve the wear resistance of the anti-light leakage plating part while taking into account the light transmission performance.

[0069] In some embodiments, the thickness of the protection layer 123 is 0.2 μm-0.8 μm.

[0070] In a second aspect, some embodiments of the present application provide a method for preparing a light leakage-proof plated part, such as Figure 2 As shown, the preparation method comprises:

[0071] Step 21), providing a substrate to be plated;

[0072] Step 22), a stacked primer layer, a metal plating layer and a protective layer are sequentially formed on the surface of the substrate to be plated to form a light leakage prevention layer on the surface of the substrate to be plated, and the light leakage prevention layer is light-transmissive. The material for preparing the primer layer includes: silicon dioxide.

[0073] In some embodiments, S22) includes:

[0074] S221), performing surface cleaning treatment on the substrate to be plated;

[0075] S222), using a first sputtering process, depositing a silicon dioxide film on the surface of the substrate to be plated after the surface cleaning treatment to form a base layer;

[0076] S223), using a vacuum evaporation process to deposit a metal film on the surface of the base layer away from the substrate to be plated, to form a metal coating;

[0077] S224), using a second sputtering process, depositing a protective material film on the surface of the metal coating away from the substrate to be plated to form a protective layer.

[0078] In these embodiments, the metal coating has good thickness uniformity and can reduce defects such as light leakage and pitting.

[0079] In some embodiments, in step S222), the sputtering target material used in the first sputtering process is a silicon target, the working gas during sputtering is oxygen, the gas pressure in the chamber is 0.5 Pa ~ 1Pa, the sputtering power is 100W ~ 200W, the sputtering time is 20min ~ 30min, and the rotation speed of the substrate to be plated is 15r / min ~ 20r / min.

[0080] In these embodiments, a silicon dioxide bottom layer with a thickness of 2 μm to 5 μm can be prepared, and the silicon dioxide bottom layer has good thickness uniformity.

[0081] The gas pressure in the cavity is determined by the flow rates of the protective gas and the working gas. The protective gas may be an inert gas, such as nitrogen, argon, helium, etc.

[0082] In some embodiments, in the first sputtering process, the flow rate of the working gas is 200 sccm-400 sccm, and the flow rate of the protective gas is 200-300 sccm.

[0083] In some embodiments, the material for preparing the metal coating includes: metal aluminum; in step S223), in the vacuum evaporation process, the vacuum degree in the chamber is 5×10 -4 Pa ~5×10 -3 Pa, the evaporation rate is 5 Å / s~10 Å / s, the evaporation current is 80 A~100 A, the time is 60~120s, and the rotation speed of the substrate to be plated is 20 r / min~25 r / min.

[0084] In these embodiments, an aluminum coating with a thickness of 40 nm to 50 nm can be prepared. The aluminum coating has good thickness uniformity and can reduce defects such as light leakage and pitting.

[0085] In some embodiments, in step S224), the sputtering target material used in the second sputtering process includes at least one of silicon, silicon dioxide, silicon nitride, zirconium oxide, titanium and titanium oxide, and when the sputtering target material used in the second sputtering process includes at least one of silicon and titanium, the working gas during sputtering includes oxygen and / or nitrogen, and the vacuum degree in the chamber is 5×10-3 Pa~9×10 -3 Pa, the sputtering power is 50 W ~ 100 W, and the sputtering time is 5 min ~ 20 min.

[0086] In these embodiments, a protective layer with a thickness of 0.2 μm to 0.8 μm can be prepared. The protective layer has high hardness and transparency, and can improve the wear resistance of the anti-light leakage plated part while taking into account the light transmittance.

[0087] The gas pressure in the cavity is also determined by the flow rates of the protective gas and the working gas. The protective gas may be an inert gas, such as nitrogen, argon, helium, and the like.

[0088] In some embodiments, the material for preparing the protective layer is silicon dioxide and / or titanium oxide; in the second sputtering process, the sputtering target is a silicon target and / or a titanium target, the working gas is oxygen, the flow rate of oxygen is 200 sccm ~400 sccm, and the flow rate of the protective gas is 200 sccm ~400 sccm; or

[0089] The material for preparing the protective layer is silicon nitride; in the second sputtering process, the sputtering target is a silicon target, the working gas is nitrogen, the flow rate of the nitrogen is 200 sccm ~400 sccm, and the flow rate of the protective gas is 200 sccm ~400 sccm.

[0090] In some embodiments, in S221), the surface of the substrate to be plated is cleaned, including:

[0091] Remove mechanical impurities and oil stains from the surface of the substrate to be plated;

[0092] Glow discharge is used to perform plasma surface cleaning on the substrate to be plated to remove mechanical impurities and oil stains.

[0093] In these embodiments, double cleaning can improve the bonding strength between the subsequent anti-light leakage layer and the substrate to be plated.

[0094] In some embodiments, when plasma surface cleaning is performed on the substrate to be plated to remove mechanical impurities and oil stains by glow discharge, the vacuum degree in the chamber is 2×10 -3 Pa ~2.0×10 -2 Pa, the discharge voltage is 400 V ~500 V, the working gas introduced is argon, the flow rate of argon is 200 sccm ~300 sccm, the cleaning time is 60s ~ 120 s, and the rotation speed of the substrate to be plated is 15 r / min ~20 r / min.

[0095] In these embodiments, the surface of the substrate to be plated may be subjected to plasma activation treatment, thereby improving the bonding strength between the substrate to be plated and the light leakage prevention layer.

[0096] In a third aspect, some embodiments of the present application provide a kitchen and bathroom appliance, comprising the anti-light leakage coating part as described in the first aspect.

[0097] Among them, the kitchen and bathroom appliances can be any kitchen and bathroom products that present the gloss and texture of their base itself, and the anti-leakage light-plated parts can be the kitchen and bathroom products themselves or a component or part thereof, and the anti-leakage light-plated parts can present the gloss and texture of their base itself.

[0098] For example, the anti-leakage light-plated part can be a toilet, a mirror lamp, a bath mirror, a shower, a shelf, a washbasin, a sink, a faucet, etc.

[0099] In order to objectively evaluate the technical effects of the embodiments of the present application, the present application will be described in detail and exemplarily through the following embodiments and comparative examples.

[0100] In the following examples and comparative examples, all raw materials can be purchased commercially, and in order to maintain the reliability of the experiment, the raw materials used in the following examples and comparative examples have the same physical and chemical parameters or are prepared by the same processing method.

[0101] Example 1

[0102] Embodiment 1 provides a light leakage prevention plated part, and the preparation method thereof is as follows:

[0103] (1) Clean the surface of the translucent PC substrate and remove surface impurities and oil stains;

[0104] (2) Place the cleaned translucent PC substrate in a vacuum coating machine for glow cleaning. The specific parameters are: vacuum degree 5×10 -3 Pa, the discharge voltage was 400 V, the flow rate of argon was 200 sccm, the cleaning time was 60 s, and the rotation speed of the translucent PC substrate was 15 r / min;

[0105] (3) Turn on the RF sputtering power supply to prepare the silicon dioxide base layer. The specific parameters are as follows: the target material is a silicon target; the flow rate of argon is 250 sccm, the flow rate of oxygen is 250 sccm, the pressure in the chamber is 0.8 Pa, the power of RF sputtering is 150 W, the coating time is 30 min, the rotation speed of the translucent PC substrate is 20 r / min, and the film thickness is 4 μm;

[0106] (4) Vacuum evaporation aluminum plating is performed, and the specific parameters are: the heating source is tungsten, the evaporation source is aluminum, and the vacuum degree in the chamber is 8×10 -4pa, the evaporation rate is 8 Å / S, the evaporation current is 80A, the evaporation time is 60 s, the rotation speed of the semi-transparent PC substrate is 20r / min, and the evaporation film thickness is 48nm;

[0107] (5) A transparent silicon nitride protective film is deposited by radio frequency sputtering. The specific parameters are: the target material is a silicon target, and the vacuum degree in the chamber is 6×10 -3 Pa, the flow rate of argon gas is 200 sccm, the flow rate of nitrogen gas is 300 sccm, the sputtering power is 50 W, the coating time is 10 min, the rotation speed of the translucent PC substrate is 20 r / min, and the film thickness is 0.5 μm.

[0108] Example 2

[0109] The method for preparing the light leakage prevention plated component provided in Example 2 is substantially the same as the method for preparing the light leakage prevention plated component provided in Example 1, except that:

[0110] In step (5), a transparent silicon dioxide protective film is deposited by radio frequency sputtering. The specific parameters are: the target material is silicon dioxide target material, and the vacuum degree in the chamber is 6×10 -3 Pa; the flow rate of argon gas is 400 sccm, the sputtering power is 50 W, the coating time is 10 min, the rotation speed of the translucent PC substrate is 15 r / min, and the film thickness is 0.4 μm.

[0111] Example 3

[0112] The method for preparing the light leakage prevention plated component provided in Example 3 is substantially the same as the method for preparing the light leakage prevention plated component provided in Example 1, except that:

[0113] The vacuum aluminum coating process in step (4) is different. The specific parameters are: the heating source is tungsten, the evaporation source is aluminum, and the vacuum degree in the chamber is 8×10 -4 Pa, the evaporation rate is 10 Å / S, the evaporation current is 100 A, the evaporation time is 120 s, the rotation speed of the translucent PC substrate is 20 r / min, and the film thickness is 120 nm.

[0114] Example 4

[0115] The method for preparing the light leakage prevention plated component provided in Example 4 is substantially the same as the method for preparing the light leakage prevention plated component provided in Example 1, except that:

[0116] In step (5), a transparent zirconium oxide protective film is deposited by radio frequency sputtering. The specific parameters are: the target material is a zirconium target, the vacuum degree in the chamber is 6×10 -3Pa, the flow rate of argon is 200 sccm, the flow rate of oxygen is 300 sccm, the sputtering power is 80 W, the coating time is 8 min, the rotation speed of the translucent PC substrate is 15 r / min, and the film thickness is 0.3 μm.

[0117] Comparative Example 1

[0118] The preparation method of the light leakage prevention plated member provided in Comparative Example 1 is substantially the same as the preparation method of the light leakage prevention plated member provided in Example 1, except that:

[0119] Remove step (5).

[0120] Comparative Example 2

[0121] The preparation method of the light leakage prevention plated member provided in Comparative Example 2 is substantially the same as the preparation method of the light leakage prevention plated member provided in Example 1, except that:

[0122] Remove step (1).

[0123] Test Case

[0124] The light transmission effect, light transmittance, pencil hardness and corrosion resistance of the anti-light leakage plating parts provided in Examples 1 to 4 and Comparative Examples 1 to 2 were tested, and the test results are shown in Table 1 below.

[0125] Table 1

[0126]

[0127] Among them, the above-mentioned light transmittance effect is obtained by testing according to the determination of light transmittance and haze of transparent plastics (GB / T 2410-2008), and the anti-corrosion performance is obtained by testing according to the salt spray test of artificial atmosphere corrosion test in GB / T 10125-2021.

[0128] It can be seen from Table 1 that the transmittance is mainly determined by the thickness of the aluminum-plated film. By comparing Examples 1 to 4 with Comparative Examples 1 to 2, it can be seen that as the thickness of the aluminum-plated film increases, the transmittance decreases. By comparing Examples 1 to 4 with Comparative Example 2, it can be seen that when no silicon oxide base layer is prepared, there is obvious light leakage, and when a silicon oxide base layer is prepared, the light leakage effect is significantly improved, with almost no obvious light leakage. By comparing Examples 1 to 4 with Comparative Example 1, it can be seen that when no protective film is prepared, the hardness of the surface of the anti-light leakage plated part is low, which is not conducive to resisting wear and corrosion. By comparing Examples 1 to 4 with Comparative Example 1, it can be seen that when no silicon oxide base layer is prepared, even if a protective film is prepared on the surface of the anti-light leakage plated part, its hardness and corrosion resistance are still not as good as when a silicon oxide base layer is prepared. This shows that the silicon oxide base layer can improve the film-base bonding strength, reduce light leakage and pitting, and at the same time can further improve the protection ability of the protective film, and improve the hardness and corrosion resistance of the anti-light leakage plated part.

[0129] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0130] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A light leakage prevention plated part, characterized in that: include: A substrate to be plated; An anti-light leakage layer, which is disposed on the surface of the substrate to be plated and is light-transmissive; The anti-light leakage layer comprises: a primer layer, a metal plating layer and a protective layer stacked in sequence in a direction gradually away from the substrate to be plated; the material for preparing the primer layer comprises: silicon dioxide.

2. The light leakage prevention plated part according to claim 1, characterized in that: The anti-light leakage plating part meets at least one of the following conditions: (1) The thickness of the metal coating is 40nm~50nm; (2) The material for preparing the metal coating includes: metal aluminum; (3) The thickness of the primer layer is 2 μm to 5 μm; (4) The material for preparing the protective layer includes: at least one of silicon dioxide, silicon nitride, zirconium oxide and titanium oxide; (5) The thickness of the protective layer is 0.2 μm to 0.8 μm; (6) The material used to prepare the surface of the substrate to be plated is a polymer substrate material; optionally, the polymer substrate material includes at least one of PC and PMMA.

3. A method for preparing a light leakage-proof plated part, characterized in that: include: S21), providing a substrate to be plated; S22), forming a stacked base layer, a metal plating layer and a protective layer in sequence on the surface of the substrate to be plated to form a light leakage prevention layer on the surface of the substrate to be plated, the light leakage prevention layer is light-transmissive, and the material for preparing the base layer includes: silicon dioxide.

4. The preparation method according to claim 3, characterized in that: S22), including: Performing surface cleaning treatment on the substrate to be plated; Using a first sputtering process, a silicon dioxide film is deposited on the surface of the substrate to be plated after the surface cleaning treatment to form the primer layer; Using a vacuum evaporation process, a metal film is deposited on the surface of the base layer away from the substrate to be plated to form the metal coating; A second sputtering process is adopted to deposit a protective material film on the surface of the metal coating layer away from the substrate to be plated, so as to form the protective layer.

5. The preparation method according to claim 4, characterized in that: The sputtering target material used in the first sputtering process is a silicon target, the working gas during sputtering is oxygen, the gas pressure in the chamber is 0.5 Pa ~ 1Pa, the sputtering power is 100W ~ 200W, the sputtering time is 20min ~ 30min, and the rotation speed of the substrate to be plated is 15r / min ~ 20r / min.

6. The preparation method according to claim 5, characterized in that: In the first sputtering process, the flow rate of the working gas is 200 sccm-400 sccm, and the flow rate of the protective gas is 200-300 sccm.

7. The preparation method according to claim 4, characterized in that: The material of the metal coating includes: metal aluminum; In the vacuum evaporation process, the vacuum degree in the chamber is 5×10 -4 Pa ~5×10 -3 Pa, the evaporation rate is 5 Å / s~10 Å / s, the evaporation current is 80 A~100 A, the time is 60~120s, and the rotation speed of the substrate to be plated is 20 r / min~25 r / min.

8. The preparation method according to claim 4, characterized in that: The sputtering target material used in the second sputtering process includes at least one of silicon, silicon dioxide, silicon nitride, zirconium oxide, titanium and titanium oxide. When the sputtering target material used in the second sputtering process includes at least one of silicon and titanium, the working gas during sputtering includes oxygen and / or nitrogen, and the vacuum degree in the chamber is 5×10 -3 Pa~9×10 -3 Pa, the sputtering power is 50 W ~ 100 W, and the sputtering time is 5 min ~ 20 min.

9. The preparation method according to claim 8, characterized in that: The material for preparing the protective layer is silicon dioxide and / or titanium oxide; in the second sputtering process, the sputtering target is a silicon target and / or a titanium target, the working gas is oxygen, the flow rate of the oxygen is 200 sccm ~400 sccm, and the flow rate of the protective gas is 200 sccm ~400 sccm; or The material for preparing the protective layer is silicon nitride; in the second sputtering process, the sputtering target is a silicon target, the working gas is nitrogen, the flow rate of the nitrogen is 200 sccm ~400 sccm, and the flow rate of the protective gas is 200 sccm ~400 sccm.

10. The preparation method according to claim 4, characterized in that: The surface of the substrate to be plated is cleaned, comprising: Removing mechanical impurities and oil stains from the surface of the substrate to be plated; Glow discharge is used to perform plasma surface cleaning on the substrate to be plated from which mechanical impurities and oil stains have been removed.

11. The preparation method according to claim 10, characterized in that: When the surface of the substrate to be plated is cleaned by plasma using glow discharge to remove mechanical impurities and oil stains, the vacuum degree in the chamber is 2×10 -3 Pa ~2.0×10 - 2 Pa, the discharge voltage is 400 V ~500 V, the working gas introduced is argon, the flow rate of argon is 200 sccm ~300 sccm, the cleaning time is 60s ~120 s, and the rotation speed of the substrate to be plated is 15 r / min ~20 r / min.

12. A kitchen and bathroom appliance, characterized in that: It comprises the light leakage prevention plated part as described in any one of claims 1 to 2.

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