Surface-mounted phase change cooling system and control method thereof

Abstract

The invention relates to the technical field of heat dissipation, particularly provides a surface-mounted phase change cooling system and a control method thereof, and aims to solve the problems of how to improve the cooling efficiency of a power equipment cooling system and how to reduce energy consumption. In order to achieve the purpose, the phase change cooling system comprises a radiator, a first liquid inlet pipeline and an exhaust pipeline. A first circulation loop is formed among the radiator, the exhaust pipeline, the first liquid inlet pipeline and the condenser; cooling liquid is contained in the liquid storage container, and a refrigerating device is arranged on the liquid storage container; one ends of the second liquid inlet pipeline and the liquid outlet pipeline are communicated with the liquid storage container, the other ends of the second liquid inlet pipeline and the liquid outlet pipeline are connected to the condenser, and a second circulation loop is formed among the liquid storage container, the second liquid inlet pipeline, the liquid outlet pipeline and the condenser; and the pump device is arranged on the second liquid inlet pipeline in a communicating mode and used for providing circulating power for the cooling liquid. The power utilization cost can be saved, and the cooling efficiency of the cooling system can be improved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and specifically provides a surface-mounted phase change cooling system and a control method thereof. Background Art

[0002] Power equipment is the foundation of the operation of modern society and plays an irreplaceable role in various fields. With the advent of the digital economy era, data centers, as important basic power facilities for information, communication and computing, play an increasingly important role in social and economic development.

[0003] Heat dissipation during the operation of data centers has always been a highly concerned issue in the industry. Timely discharge of heat generated during the operation of data centers is not only beneficial to the stability and safety of power grid operation, but also of great significance to the economic and efficient operation of data centers. In the early days of the industry, data center cooling technologies included room-level air conditioners, row-level air conditioners, backplane air conditioners, etc., and later gradually developed to air cooling and forced water cooling circulation. However, no matter which of the above methods is used, there are problems of low cooling efficiency and high PUE value (energy efficiency evaluation index), resulting in energy waste, which is not in line with the current development concept of energy saving and cost reduction.

[0004] Accordingly, the art needs a new technical solution to solve the above problems. Summary of the invention

[0005] The present application aims to solve the above technical problem, that is, to solve the problem of how to improve the cooling efficiency of the cooling system of the power equipment while reducing energy consumption.

[0006] In a first aspect, the present application provides a surface-mount phase change cooling system, comprising:

[0007] A plurality of heat sinks, each containing a phase-change medium, the heat sink being used to fit a heat source;

[0008] a first liquid inlet pipeline and an exhaust pipeline, wherein the radiator is respectively connected to the first liquid inlet pipeline and the exhaust pipeline;

[0009] A condenser, which is located above the radiator, the first liquid inlet pipeline and the exhaust pipeline are both connected to the condenser, and a first circulation loop is formed between the radiator, the exhaust pipeline, the first liquid inlet pipeline and the condenser;

[0010] A liquid storage container, wherein a coolant is contained in the liquid storage container, and a refrigeration device for cooling the coolant is provided on the liquid storage container;

[0011] a second liquid inlet pipeline and a liquid discharge pipeline, wherein one end of the second liquid inlet pipeline and the liquid discharge pipeline is connected to the liquid storage container, and the other end is connected to the condenser, and a second circulation loop is formed between the liquid storage container, the second liquid inlet pipeline, the liquid discharge pipeline and the condenser;

[0012] A pump device is connected to the second liquid inlet pipeline and is used to provide circulation power for the coolant.

[0013] In a technical solution of the above phase change cooling system, the phase change cooling system further includes:

[0014] A controller is connected to the pump device for communication, and the controller controls the operation state of the pump device according to the operation state of the equipment to be cooled.

[0015] In a technical solution of the above-mentioned phase change cooling system, the refrigeration device is a semiconductor refrigeration device, and the cold end of the semiconductor refrigeration device is in contact with the surface of the liquid storage container.

[0016] In a technical solution of the above-mentioned phase change cooling system, a heat conductive layer is provided between the cold end of the semiconductor refrigeration device and the surface of the liquid storage container.

[0017] In a technical solution of the above phase change cooling system, a fan is provided at the hot end of the semiconductor refrigeration device.

[0018] In a technical solution of the above phase change cooling system, the inner wall of the heat sink is provided with a porous structure or a micro groove structure or a wire mesh structure; and / or

[0019] The inner wall of the condenser is provided with a porous structure, a micro-groove structure or a wire mesh structure.

[0020] In a second aspect, the present application provides a control method for a surface-mounted phase-change cooling system, wherein the phase-change cooling system is used to cool power equipment, and the phase-change cooling system comprises:

[0021] A plurality of heat sinks, each containing a phase-change medium, the heat sink being used to fit a heat source;

[0022] a first liquid inlet pipeline and an exhaust pipeline, wherein the radiator is respectively connected to the first liquid inlet pipeline and the exhaust pipeline;

[0023] A condenser, which is located above the radiator, the first liquid inlet pipeline and the exhaust pipeline are both connected to the condenser, and a first circulation loop is formed between the radiator, the exhaust pipeline, the first liquid inlet pipeline and the condenser;

[0024] A liquid storage container, wherein a coolant is contained in the liquid storage container, and a refrigeration device for cooling the coolant is provided on the liquid storage container;

[0025] a second liquid inlet pipeline and a liquid discharge pipeline, wherein one end of the second liquid inlet pipeline and the liquid discharge pipeline is connected to the liquid storage container, and the other end is connected to the condenser, and a second circulation loop is formed between the liquid storage container, the second liquid inlet pipeline, the liquid discharge pipeline and the condenser;

[0026] A pump device, which is connected to the second liquid inlet pipeline and is used to provide circulation power for the coolant;

[0027] a controller in communication with the pump device;

[0028] The control method comprises:

[0029] When the electric power equipment is running, controlling the operation of the refrigeration device and obtaining the power consumption status of the electric power equipment;

[0030] The operating state of the pump device is adjusted according to the power consumption state.

[0031] In a technical solution of the above control method, obtaining the power usage status of the power equipment includes:

[0032] Determine the peak power consumption period and the off-peak power consumption period of the electric power equipment;

[0033] The step of adjusting the operating state of the pump device according to the power consumption state comprises:

[0034] When the power equipment enters a low-power consumption period, controlling the pump device to shut down;

[0035] When the electric power equipment enters the peak period of electricity consumption, the pump device is controlled to start, so that the coolant flows along the second circulation loop.

[0036] In a technical solution of the above control method, determining the peak power consumption period and the valley power consumption period of the electric power equipment includes:

[0037] The peak power consumption period and the low power consumption period of the electric equipment are determined according to the power load curve.

[0038] In one technical solution of the above control method, the power equipment is a data center.

[0039] As mentioned above, the phase change cooling system of the present application includes a "main cooling system" composed of a first circulation loop and a "secondary cooling system" composed of a second circulation loop. The main cooling system provides a circulation pressure head based on the pressure difference formed during the phase change process of the phase change working fluid to promote the reciprocating flow of the phase change working fluid in the first circulation loop. The secondary cooling system uses a pump device to provide circulation power for the coolant to flow in the second circulation loop, so that the coolant performs "secondary heat exchange" on the main cooling system in the process of flowing through the condenser to further improve the cooling effect.

[0040] Based on the above scheme, in the specific application process, the operating state of the pump device is adjusted according to the power consumption state of the power equipment to be cooled, so that when the power consumption is low, the power consumed by the phase change cooling system is reduced by controlling the pump device to stop running, and at the same time, cold storage is performed through the semiconductor refrigeration device. During peak power consumption, the pump device is controlled to start, and the cold storage capacity accumulated during the low power consumption stage is used to achieve rapid cooling and improve cooling efficiency. At the same time, on this basis, the operating power of the pump device can also be reduced, thereby further saving electricity. In this way, the phase change cooling system of the present application cooperates with the coordinated regulation of the power grid supply side and the power equipment demand side, which not only plays a role of "peak shaving and valley filling" on the energy consumption side, which is beneficial to the stability of the power grid, but also performs "flexible energy use" in the phase change cooling system, reduces electricity costs, and improves the operating economy of the entire power system. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The preferred embodiments of the present application are described below in conjunction with the accompanying drawings, in which:

[0042] Figure 1 is a schematic diagram of a surface-mount phase change cooling system according to an embodiment of the present application;

[0043] Figure 2 It is a flow chart of the main steps of a control method of a surface-mounted phase change cooling system according to an embodiment of the present application.

[0044] In the figures, the reference numerals refer to the following:

[0045] 1. Radiator; 2. Condenser; 3. First liquid inlet pipeline; 4. Exhaust pipeline; 5. Liquid storage container; 6. Refrigeration device; 61. Fan; 7. Second liquid inlet pipeline; 8. Exhaust pipeline; 9. Pump device. DETAILED DESCRIPTION

[0046] The preferred embodiments of the present application are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present application and are not used to limit the scope of protection of the present application. Those skilled in the art can make adjustments to them as needed to adapt to specific application scenarios.

[0047] It should be noted that in the description of this application, the terms "upper", "lower", "left", "right", "inner", "outer", etc., which indicate directions or positional relationships, are based on the directions or positional relationships shown in the drawings. This is only for the convenience of description, and does not indicate or imply that the relevant devices or components must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on this application. In addition, the ordinal numbers "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0048] In addition, it should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0049] Reference Figure 1 , is a surface-mounted phase change cooling system according to an embodiment of the present application, which includes a radiator 1, a condenser 2, and a first liquid inlet pipeline 3 and an exhaust pipeline 4 connected between the radiator 1 and the condenser 2. The condenser 2 is located above the radiator 1, and the radiator 1 is connected to the condenser 2 through the first liquid inlet pipeline 3 and the exhaust pipeline 4, so that a first circulation loop is formed among the radiator 1, the exhaust pipeline 4, the condenser 2 and the first liquid inlet pipeline 3.

[0050] There are multiple radiators 1, and multiple radiators 1 can be connected in series or in parallel. In short, it is necessary to ensure that one end of the pipeline network formed by connecting multiple radiators 1 is connected to the first liquid inlet pipeline 3, and the other end is connected to the exhaust pipeline 4. Each radiator 1 contains a liquid phase change medium. Optionally, the phase change medium can be a fluorocarbon compound with a boiling point of 40°C-60°C. The specific boiling point can be determined according to the optimal operating temperature of the heating device to be cooled. This application does not limit this. Of course, the phase change medium can also be made of other materials with high insulation performance and low boiling point.

[0051] Reference Figure 1 The phase change cooling system also includes a liquid storage container 5, a refrigeration device 6 arranged on the liquid storage container 5, and a second liquid inlet pipeline 7 and a liquid discharge pipeline 8 connected between the liquid storage container 5 and the condenser 2. The liquid storage container 5 is connected to the condenser 2 through the second liquid inlet pipeline 7 and the liquid discharge pipeline 8, so that the liquid storage container 5, the second liquid inlet pipeline 7, the condenser 2 and the liquid discharge pipeline 8 form a second circulation loop.

[0052] The liquid storage container 5 contains a coolant, which can be a liquid with a high specific heat capacity such as water. The refrigeration device 6 is used to cool the coolant in the liquid storage container 5. In one embodiment of the present application, the refrigeration device 6 is a semiconductor refrigeration device, which is a refrigeration device based on the thermoelectric effect, and has a cold end and a hot end. The cold end of the semiconductor refrigeration device is attached to the outer surface of the liquid storage container 5. When the semiconductor refrigeration device is powered on and running, electrons flow in the semiconductor material inside it, and heat absorption and heat release phenomena are generated at the contact point through the Peltier effect. Heat is absorbed from the cold end of the semiconductor refrigeration device and transferred to the hot end through the semiconductor material. Then, the heat is released to the external environment at the hot end of the semiconductor refrigeration device, thereby maintaining the low temperature state of the cold end and achieving the cooling of the coolant in the liquid storage container 5. The refrigeration principle of the semiconductor refrigeration device is a well-known technology in the art, and this application will not be described in detail here. The semiconductor refrigeration device can cool the coolant to a state below the ambient temperature, thereby improving the cooling effect.

[0053] In order to reduce the contact thermal resistance between the cold end of the semiconductor refrigeration device and the liquid storage container 5 and improve the heat exchange efficiency, in one implementation, a heat conductive layer can be set between the cold end of the semiconductor refrigeration device and the outer surface of the liquid storage container 5. The heat conductive layer can be a material such as thermal conductive silicone grease, thermal conductive glue, etc., which is filled in the gap formed by the cold end of the semiconductor refrigeration device and the outer surface of the liquid storage container 5 to maximize the heat exchange area, improve the heat transfer efficiency and reduce energy consumption.

[0054] Optionally, the hot end of the semiconductor refrigeration device is also provided with an auxiliary heat dissipation structure. For example, in one implementation of the present application, the auxiliary heat dissipation structure may be a fan 61 fixed to the hot end of the semiconductor refrigeration device, and the fan 61 accelerates the airflow to quickly release the heat at the hot end of the semiconductor refrigeration device to the external environment, thereby improving the refrigeration efficiency of the semiconductor refrigeration device. Of course, the specific form of the auxiliary heat dissipation structure is not limited thereto, and it may also be a structure such as a heat dissipation fin provided at the hot end of the semiconductor refrigeration device.

[0055] The second liquid inlet pipeline 7 is also connected to a pump device 9, which is used to provide circulation power for the coolant.

[0056] It should be noted that the condenser 2 can be any structural form such as shell and tube type, tube-fin type, tube bundle type, etc., but it should be understood that no matter what form the condenser adopts, the condenser 2 has an independent flow channel structure or sandwich structure, so that the liquid storage container 5, the second liquid inlet pipeline 7 and the discharge pipeline 8 form the above-mentioned second circulation loop with the flow channel structure or sandwich structure of the condenser 2, so that the second circulation loop and the above-mentioned first circulation loop operate independently of each other. In this way, the gas-liquid two-phase working medium formed by the phase change working medium in the radiator 1 after the phase change is heated enters the condenser 2 through the exhaust pipeline 4. At the same time, the coolant in the liquid storage container 5 can enter the condenser 2 under the driving force of the pump device 9 to cool the gas phase working medium or the two-phase working medium. The gas phase working medium or the two-phase working medium is re-condensed into a liquid working medium after heat exchange in the condenser 2 and flows back to the radiator 1 through the first liquid inlet pipeline 3, and the coolant also flows back to the liquid storage container 5 through the discharge pipeline.

[0057] In one implementation of the present application, the phase change cooling system further includes a controller (not shown in the figure), which can control the operating state of the pump device 9 according to the working state of the equipment to be cooled.

[0058] The phase change cooling system of the present application is applied to the cooling of power equipment. In specific applications, the radiator 1 is attached to the surface of the heat source, so as to exchange heat with the heat source by heat transfer to achieve a cooling effect. As can be seen from the above, the phase change cooling system of the present application includes a "main cooling system" composed of a first circulation loop and a "secondary cooling system" composed of a second circulation loop. The main cooling system provides a circulation pressure head based on the pressure difference formed during the phase change process of the phase change medium to promote the reciprocating flow of the phase change medium in the first circulation loop. The secondary cooling system uses the pump device 9 to provide the circulation power of the coolant flowing in the second circulation loop, so that the coolant performs "secondary heat exchange" on the main cooling system during the process of flowing through the condenser 2 to further improve the cooling effect. However, it should be noted that the calorific value of the power equipment is different under different power consumption states. When the power equipment is in a low power consumption valley, its calorific value is low. When the power equipment is in a peak power consumption valley, its calorific value naturally increases. If the pump device 9 is always controlled to operate during the operation of the power equipment, the cooling capacity will inevitably "overflow" during the low power consumption valley, resulting in a waste of electric energy.

[0059] Therefore, during the operation of the power equipment, the present application adaptively adjusts the operation state of the pump device 9 based on the power consumption state of the power equipment. Specifically, when the power equipment is in the low power consumption valley, the pump device 9 is controlled to be turned off. Since the heat generation of the power equipment is low, the phase change working medium can be condensed by relying on the heat exchange between the structural characteristics of the condenser 2 itself and the external environment (at this time, the cold source of the condenser 2 is the air in the external environment). At this time, the semiconductor refrigeration device is in operation, and the coolant in the liquid storage container 5 is continuously cooled to a relatively low temperature, that is, the "cold storage" of the coolant is achieved, and the cold storage capacity of the liquid storage container 5 is increased. When the power equipment is in the peak power consumption, the pump device 9 is controlled to start, and the low-temperature coolant flows through the condenser 2 for "secondary heat exchange" to take away the heat in the main cooling system, significantly improving the cooling efficiency. It should be emphasized that at this stage, the coolant is in a low temperature state due to the aforementioned "cold storage" process, so the coolant flow required to achieve the same heat exchange is also greatly reduced, thereby also being able to reduce the operating power of the pump device 9.

[0060] As mentioned above, the present application adjusts the operating state of the pump device 9 according to the power consumption state of the power equipment to be cooled, so that when the power consumption is low, the power consumed by the phase change cooling system is reduced by controlling the pump device 9 to stop running, and at the same time, cold storage is performed through a semiconductor refrigeration device. During peak power consumption, the pump device 9 is controlled to start, and the cold storage capacity accumulated during the low power consumption stage is used to achieve rapid cooling and improve cooling efficiency. At the same time, on this basis, the operating power of the pump device 9 can also be reduced, thereby further saving power. In this way, the phase change cooling system of the present application cooperates with the coordinated regulation of the power grid supply side and the power equipment demand side, which not only plays a role of "peak shaving and valley filling" on the energy consumption side, improves the cooling efficiency of the phase change cooling system, and is beneficial to the stability of the power grid, but also "flexible energy use" is performed in the phase change cooling system, which reduces electricity costs and improves the operating economy of the entire power system.

[0061] It should be noted that in the embodiment of the present application, the controller can realize automatic control of the operating state of the pump device 9 according to the power consumption status of the power equipment, wherein the "operating state" of the pump device 9 includes its on / off state, and the size of its operating power (the size of the operating power reflects the circulation flow of the second circulation loop).

[0062] It should be understood that although the present application uses a semiconductor refrigeration device as an example refrigeration device, it does not constitute a limitation to the present application. Those skilled in the art can select other refrigeration devices that can achieve active refrigeration according to actual application requirements.

[0063] In one implementation of the present application, the outside of the liquid storage container 5 is also coated with an insulation layer. During the low-power consumption phase, the refrigeration device 6 cools down the coolant in the liquid storage container 5 to achieve cold storage, but the cold will inevitably exchange heat with the side wall of the liquid storage container 5 and the external environment, resulting in cold loss. Therefore, the provision of an insulation layer can reduce the heat exchange effect between the coolant and the external environment, thereby reducing cold loss and improving cold storage efficiency.

[0064] In order to improve the heat exchange efficiency of the radiator 1 and the condenser 2, in some embodiments, an enhanced heat exchange structure can be set on the inner wall of the radiator 1 and the condenser 2. The enhanced heat exchange structure includes but is not limited to a porous structure, a micro-groove structure or a wire mesh structure, as long as it can increase the specific surface area of ​​the heat exchange surface.

[0065] The phase change cooling system of the present application includes but is not limited to being applied to data centers, converter valves or other power equipment. When the phase change cooling system is applied to a data center, the radiator 1 is respectively attached to the corresponding power modules (i.e., heat sources) of the data center. The control method of the phase change cooling system applied to a data center is introduced below as an example.

[0066] Reference Figure 2 , is a flow chart of the main steps of a control method for a surface-mount phase change cooling system according to an embodiment of the present application, which includes:

[0067] S101: When the data center is running, control the operation of the refrigeration device and obtain the power consumption status of the data center.

[0068] In step S101, the power consumption status of the data center can be reflected by the peak power consumption period and the valley power consumption period, that is, the peak power consumption period indicates that the data center is at the peak power consumption, at this time the data center is in a high computing power operation state, the power consumption is high, and therefore the system heat generation is also high. Correspondingly, the valley power consumption period indicates that the data center is in the valley power consumption, at this time the data center is in a low computing power operation state, the power consumption is low, and therefore the system heat generation is also low.

[0069] Specifically, the data center can divide the 24 hours of a day into different time periods, each of which corresponds to different power demand and load conditions. The peak power consumption period is usually during the day, especially during the working hours of weekdays, and the low power consumption period is usually at night. Of course, the specific range of the above peak power consumption period and low power consumption period is also affected by seasonal factors, regional factors, sudden application needs, etc. Therefore, the peak power consumption period and low power consumption period can be comprehensively determined in combination with the power load curve of the data center, that is, summarized by the alternating change pattern of peaks and troughs presented by the power load curve of the data center.

[0070] S102: Adjust the operating state of the pump device according to the power consumption state.

[0071] In one embodiment of the present application, step S102 may specifically include:

[0072] S1021: When the data center enters the off-peak period of electricity consumption, the pump device is controlled to shut down.

[0073] Based on step S1021, the data center is in a period of low electricity consumption and its system heat generation is relatively low. At this time, the pump device is turned off and the second circulation loop is disconnected. The heat dissipation needs of the data center can be met only by the circulation of the phase change working fluid in the first circulation loop. In this way, the power loss caused by the operation of the pump device can be avoided.

[0074] S1022: When the data center enters the peak power consumption period, the pump device is controlled to start, so that the cooling liquid flows along the second circulation loop.

[0075] Based on step S1022, the data center is in the peak period of electricity consumption, and the system generates a large amount of heat. At this time, the pump device is running to remove the heat in the first circulation loop through the circulation of the coolant. On the other hand, since the pump device is turned off in step S1021, the temperature of the coolant in the liquid storage container continues to drop, and "cold storage" is performed. Therefore, in step S1022, the cooling efficiency of the data center is also greatly improved.

[0076] From the above, it can be seen that the surface-mounted phase change cooling system and its control method of the present application can not only reduce power consumption while meeting the heat dissipation needs of power equipment, but also through the "cold storage" process during the low-power consumption period, it can also cool the data center more efficiently during the peak power consumption period, which is beneficial to improving the stability of the power equipment and the entire power grid system.

[0077] So far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present application is obviously not limited to these specific embodiments. Without departing from the principles of the present application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present application.

Claims

1. A surface-mount phase change cooling system, characterized in that: include: A plurality of heat sinks, each containing a phase-change medium, the heat sink being used to fit a heat source; a first liquid inlet pipeline and an exhaust pipeline, wherein the radiator is respectively connected to the first liquid inlet pipeline and the exhaust pipeline; A condenser, which is located above the radiator, the first liquid inlet pipeline and the exhaust pipeline are both connected to the condenser, and a first circulation loop is formed between the radiator, the exhaust pipeline, the first liquid inlet pipeline and the condenser; A liquid storage container, wherein a coolant is contained in the liquid storage container, and a refrigeration device for cooling the coolant is provided on the liquid storage container; a second liquid inlet pipeline and a liquid discharge pipeline, wherein one end of the second liquid inlet pipeline and the liquid discharge pipeline is connected to the liquid storage container, and the other end is connected to the condenser, and a second circulation loop is formed between the liquid storage container, the second liquid inlet pipeline, the liquid discharge pipeline and the condenser; A pump device is connected to the second liquid inlet pipeline and is used to provide circulation power for the coolant.

2. The phase change cooling system according to claim 1, characterized in that: The phase change cooling system also includes: A controller is connected to the pump device for communication, and the controller controls the operation state of the pump device according to the operation state of the equipment to be cooled.

3. The phase change cooling system according to claim 1, characterized in that: The refrigeration device is a semiconductor refrigeration device, and the cold end of the semiconductor refrigeration device is in contact with the surface of the liquid storage container.

4. The phase change cooling system according to claim 3, characterized in that: A heat-conducting layer is arranged between the cold end of the semiconductor refrigeration device and the surface of the liquid storage container.

5. The phase change cooling system according to claim 3, characterized in that: The hot end of the semiconductor refrigeration device is provided with a fan.

6. The phase change cooling system according to claim 1, characterized in that: The inner wall of the radiator is provided with a porous structure, a micro-groove structure or a wire mesh structure; and / or The inner wall of the condenser is provided with a porous structure, a micro-groove structure or a wire mesh structure.

7. A control method for a surface mounted phase change cooling system, characterized in that: The phase change cooling system is used to cool the power equipment, and the phase change cooling system comprises: A plurality of heat sinks, each containing a phase-change medium, the heat sink being used to fit a heat source; a first liquid inlet pipeline and an exhaust pipeline, wherein the radiator is respectively connected to the first liquid inlet pipeline and the exhaust pipeline; A condenser, which is located above the radiator, the first liquid inlet pipeline and the exhaust pipeline are both connected to the condenser, and a first circulation loop is formed between the radiator, the exhaust pipeline, the first liquid inlet pipeline and the condenser; A liquid storage container, wherein a coolant is contained in the liquid storage container, and a refrigeration device for cooling the coolant is provided on the liquid storage container; a second liquid inlet pipeline and a liquid discharge pipeline, wherein one end of the second liquid inlet pipeline and the liquid discharge pipeline is connected to the liquid storage container, and the other end is connected to the condenser, and a second circulation loop is formed between the liquid storage container, the second liquid inlet pipeline, the liquid discharge pipeline and the condenser; A pump device, which is connected to the second liquid inlet pipeline and is used to provide circulation power for the coolant; a controller in communication with the pump device; The control method comprises: When the electric power equipment is running, controlling the operation of the refrigeration device and obtaining the power consumption status of the electric power equipment; The operating state of the pump device is adjusted according to the power consumption state.

8. The control method according to claim 7, characterized in that: The obtaining of the power usage status of the power equipment comprises: Determine the peak power consumption period and the off-peak power consumption period of the electric power equipment; The step of adjusting the operating state of the pump device according to the power consumption state comprises: When the power equipment enters a low-power consumption period, controlling the pump device to shut down; When the electric power equipment enters the peak period of electricity consumption, the pump device is controlled to start, so that the coolant flows along the second circulation loop.

9. The control method according to claim 8, characterized in that: Determining the peak power consumption period and the low power consumption period of the electric equipment comprises: The peak power consumption period and the low power consumption period of the electric equipment are determined according to the power load curve.

10. The control method according to any one of claims 7 to 9, characterized in that: The power equipment is a data center.

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