Preparation method of inductor with high and excellent conductivity

By winding the wire into a hollow shape in the inductor preparation, peeling off the insulating layer and molding the magnetic core, the short circuit and electroplating layer disconnection problems caused by hot pressing in the existing inductor preparation methods are solved, and the preparation of high-quality conductive inductors is achieved, ensuring high flatness of the lead and electrode surface and low AC impedance.

CN119943568APending Publication Date: 2025-05-06COILTEC TECH (SUZHOU) CO LTD
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Patent Information

Application Number
CN202510019849.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-07
Publication Date
2025-05-06

AI Technical Summary

Technical Problem

The existing inductor preparation methods are prone to puncture and short-circuit failure during the hot pressing process, and the laser peeling is discontinuous after the paint film is added, resulting in disconnection of the electroplating layer and large AC impedance, which will cause bad problems such as burning the plate in severe cases.

Method used

By winding the wire covering the insulating layer into a hollow shape, peeling off the insulating layer of the lead part, molding the magnetic core and leaking the lead end, pre-peeling the paint film at the lead position of the coil in advance, and then performing hot pressing molding to ensure that the surface of the lead and electrode are high, the AC impedance is small, and the electroplating layer is continuous.

Benefits of technology

The continuity between the lead and the electrode surface electroplating layer is achieved, the AC impedance is reduced, and the short circuit and plate burning problems are avoided. The design is not limited to the thickness of the paint film, and the paint film can be designed very thickly, reducing the risk of bad short circuit to 0ppm.

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Abstract

The invention relates to the technical field of inductor manufacturing methods, in particular to a preparation method of an inductor with high and excellent conductivity, which comprises the following steps: S1, winding a coil, namely winding a wire coated with an insulating layer into a hollow shape, and arranging lead parts at two ends of the coil; s2, stripping an insulating layer: stripping the insulating layer of the lead part; and S3, carrying out mold pressing on the magnetic core, carrying out mold pressing on a mixture of a magnetic material around the coil, and exposing a lead end for connecting an external terminal. A wire coated with an insulating layer is wound into a hollow shape, the two ends of a coil are extended to be lead ends, then the insulating layer of the lead part is stripped, a paint film at the lead position of the coil is pre-stripped in advance, and then hot press molding is performed, so that the surface flatness of the lead and an electrode is high, the alternating current impedance is small, and an electroplated layer on the surface of the lead and the electrode is continuous; and the design is not limited to the thickness of the paint film, so that the paint film can be designed to be very thick, and the short circuit defect can reach 0 ppm.
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Description

Technical Field

[0001] The invention belongs to the technical field of inductor manufacturing methods, and in particular relates to a method for preparing an inductor with high-quality conductivity. Background Art

[0002] Existing integrated inductor technology generally forms electrodes through hot pressing, laser paint stripping, and electroplating. This method has the problem of puncturing the copper wire during the hot pressing process, causing the risk of short circuit failure. The industry often solves this problem by increasing the paint film.

[0003] However, after the paint film increases, laser paint stripping at the electrode position cannot remove the paint film between the lead and the iron powder, resulting in discontinuity of the electroplating layer. There is a risk of disconnection between the lead electroplating layer and the iron powder electroplating layer.

[0004] At the same time, due to the problem of paint film thickness, after laser paint stripping, the lead will be lower than the electrode plane by a paint film thickness, which will cause the AC impedance to be too large during application. In severe cases, it will cause defects such as burning the board. Therefore, a method for preparing a high-quality conductivity inductor is needed to solve the above problems. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a method for preparing an inductor with high conductivity to solve the problems in the existing market raised in the above background technology.

[0006] To achieve the above object, the technical solution of the present invention is as follows:

[0007] A method for preparing an inductor with high conductivity comprises the following steps:

[0008] S1. Winding a coil, winding the wire covered with an insulating layer into a hollow shape, and providing lead wire portions at both ends of the coil;

[0009] S2, stripping off the insulation layer, stripping off the insulation layer of the lead part;

[0010] S3, molded core, a mixture of magnetic materials is molded around the coil, and the lead ends are exposed for connecting external terminals.

[0011] Through the above technical scheme, the wire with the coated insulating layer is wound into a hollow shape, and the two ends of the coil are extended as lead ends, and then the insulating layer of the lead part is stripped off, and the paint film at the lead position of the coil is pre-stripped in advance, and then hot pressing is performed. The lead and the electrode surface have high flatness and small AC impedance. The electroplating layer on the lead and the electrode surface is continuous, and the design is not limited to the thickness of the paint film. The paint film can be designed to be very thick, and the short circuit defect can be achieved at 0ppm.

[0012] As a preferred embodiment of the present invention, the inductor preparation method further comprises the following steps:

[0013] S4, forming a protective layer, and rolling-spraying the protective layer on the surface of the inductor;

[0014] S5, secondary paint stripping, peeling off the protective layer of the exposed lead end, and modifying the electrode area;

[0015] S6, electroplating electrodes: electroplating the electrode region in step S5 to form metal electrodes.

[0016] Through the above technical solution, a protective layer is sprayed on the surface of the inductor, which is convenient for further protection of the inductor and is also beneficial for avoiding problems such as rust and breakage of the inductor and extending the life of the inductor. The protective layer is partially peeled off by laser to expose the electrode area, and the electrode area is electroplated to facilitate subsequent welding and installation.

[0017] As a preferred embodiment of the present invention, step S1 further comprises the following steps:

[0018] S11, winding the metal wire into a winding portion having a hollow cylindrical shape and lead portions provided at both ends of the winding portion, wherein lead ends are provided at both ends of the lead portion;

[0019] S12, bend the lead portion downward to the lower end surface of the inductor, and then bend it upward to the side surface of the inductor;

[0020] S13. A section of the lead portion close to the side of the inductor is sloped.

[0021] Through the above technical solution, the lead part is bent downward and then obliquely upward, which is convenient for increasing the exposed area of ​​the lead, is beneficial to avoiding the risk of disconnection and short circuit of the wire inside the inductor, and improves the continuity between the lead and the electrode surface.

[0022] As a preferred embodiment of the present invention, at least one side surface of the lead portion is exposed from the magnetic core and connected to an external terminal.

[0023] As a preferred solution of the present invention, step S3 also includes:

[0024] S31, manufacturing a T-core, molding the magnetic material into a T-core;

[0025] S32, manufacturing a U-core, molding the magnetic core material into a U-core;

[0026] S33, placing the coil on the T-core;

[0027] S34, pressing and molding, pressing the T-core and U-core into one piece.

[0028] Through the above technical solution, T-core and U-core are adapted.

[0029] As a preferred solution of the present invention, a middle column is provided on the T-core in step S31, and the middle column is adapted to the coil.

[0030] As a preferred embodiment of the present invention, the pressing method in step S34 is hot pressing and / or cold pressing.

[0031] As a preferred solution of the present invention, the stripping of the insulating layer in step S2 is laser stripping.

[0032] A high-quality conductivity inductor is prepared by a preparation method of the high-quality conductivity inductor.

[0033] Compared with the prior art, the present invention has the following beneficial effects:

[0034] The wire with the insulating layer is wound into a hollow shape, and the two ends of the coil are extended as lead ends. The insulating layer of the lead is then stripped off, and the paint film at the lead position of the coil is pre-stripped in advance, and then hot pressing is performed. The lead and electrode surfaces have high flatness and low AC impedance. The electroplating layer on the lead and electrode surfaces is continuous, and the design is not limited to the thickness of the paint film. The paint film can be designed to be very thick, and the short circuit failure can be achieved at 0ppm. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present invention;

[0037] Figure 2 This is a schematic diagram of the structure of Embodiment 2 of the present invention;

[0038] Figure 3 For the present invention Figure 1 Side view of the .

[0039] 1. Coil; 13. Lead end; 12. Winding part; 11. Lead part; 2. Molded magnetic core; 21. T-core; 23. U-core; 22. Center column. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] The present invention provides the following embodiments:

[0042] A method for preparing an inductor with high conductivity comprises the following steps:

[0043] S1, winding the coil 1, winding the wire covered with the insulating layer into a hollow shape, with lead parts 11 provided at both ends of the coil 1, preferably the wire is made of copper, and preferably the wire is any one of round wire and flat wire;

[0044] Step S1 also includes the following steps:

[0045] S11, winding the metal wire into a winding portion 12 having a hollow cylindrical shape and lead portions 11 provided at both ends of the winding portion 12, wherein lead ends 13 are provided at both ends of the lead portion 11;

[0046] S12, bend the lead portion 11 downward to the lower end surface of the inductor, and then bend it upward to the side surface of the inductor;

[0047] S13, a section of the lead portion 11 close to the side surface of the inductor is sloped.

[0048] The lead portion 11 is first bent downward and then obliquely upward, so as to increase the exposed area of ​​the lead, which is beneficial to avoiding the risk of disconnection and short circuit of the wire inside the inductor and improving the continuity between the lead and the electrode surface.

[0049] S2, stripping off the insulation layer, stripping off the insulation layer on the outer peripheral surface of the lead end 13;

[0050] S3, molded magnetic core 2, a mixture of magnetic materials is molded around coil 1, and lead terminals 13 are exposed for connecting external terminals.

[0051] S4, forming a protective layer, and rolling-spraying the protective layer on the surface of the inductor;

[0052] S5, secondary paint stripping, peeling off the protective layer of the exposed lead terminal 13, and modifying the electrode area;

[0053] S6, electroplating electrodes: electroplating the electrode region in step S5 to form metal electrodes.

[0054] Roll-spraying a protective layer on the surface of the inductor can further protect the inductor and prevent problems such as rust and breakage of the inductor, thereby extending the life of the inductor. The protective layer is partially removed by laser to expose the electrode area, and the electrode area is electroplated for subsequent welding and installation.

[0055] As a further improvement of the present invention, at least one side surface of the lead portion 11 is exposed outside the magnetic core and connected to an external terminal.

[0056] As a further improvement of the present invention, the pressing method in step S34 is hot pressing and / or cold pressing.

[0057] As a further improvement of the present invention, the stripping of the insulating layer in step S2 is laser stripping.

[0058] Embodiment 2: Step S3 further includes:

[0059] S31 , manufacturing T-core 21 , molding magnetic material into T-core 21 , on which a middle column 22 is provided, and the middle column 22 is adapted to the coil 1 .

[0060] S32, manufacturing U-core 23, molding the magnetic core material into U-core 23;

[0061] S33, placing coil 1 on T-core 21;

[0062] S34, pressing and molding, pressing T-core 21 and U-core 23 into one piece, so that T-core 21 and U-core 23 are compatible.

[0063] Embodiment 3:

[0064] A high-quality conductivity inductor is prepared by a preparation method of the high-quality conductivity inductor.

[0065] The wire with the coated insulating layer is wound into a hollow shape, and the two ends of the coil 1 are extended into the lead ends 13, and then the insulating layer of the lead part 11 is stripped, and the paint film at the lead position of the coil 1 is pre-stripped in advance, and then hot pressing is performed. The lead and the electrode surface have high flatness, small AC impedance, and the lead and the electrode surface plating layer are continuous. The design is not limited to the thickness of the paint film, and the paint film can be designed to be very thick, and the short circuit failure can be 0ppm. This method has high safety factor and reliability, reduces complex production processes and processes, and can better serve and develop the market.

[0066] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for preparing an inductor with high conductivity, characterized in that , including the following steps: S1. Winding a coil, winding the wire covered with an insulating layer into a hollow shape, with lead wires provided at both ends of the coil; S2, stripping off the insulation layer, stripping off the insulation layer of the lead part; S3, molded core, a mixture of magnetic materials is molded around the coil, and the lead ends are exposed for connecting external terminals.

2. The method for preparing an inductor with high conductivity according to claim 1, characterized in that: The inductor preparation method also includes the following steps: S4, forming a protective layer, and rolling-spraying the protective layer on the surface of the inductor; S5, secondary paint stripping, peeling off the protective layer of the exposed lead end, and modifying the electrode area; S6, electroplating electrodes: electroplating the electrode region in step S5 to form metal electrodes.

3. The method for preparing an inductor with high conductivity according to claim 1, characterized in that: Step S1 also includes the following steps: S11, winding the metal wire into a winding portion having a hollow cylindrical shape and lead portions provided at both ends of the winding portion, wherein lead ends are provided at both ends of the lead portion; S12, bend the lead portion downward to the lower end surface of the inductor, and then bend it upward to the side surface of the inductor; S13. A section of the lead portion close to the side of the inductor is sloped.

4. The method for preparing an inductor with high conductivity according to claim 1, characterized in that: At least one side surface of the lead portion is exposed from the magnetic core and connected to an external terminal.

5. The method for preparing an inductor with high conductivity according to claim 1, characterized in that: Step S3 also includes: S31, manufacturing a T-core, molding the magnetic material into a T-core; S32, manufacturing a U-core, molding the magnetic core material into a U-core; S33, placing the coil on the T-core; S34, pressing and molding, pressing the T-core and U-core into one piece.

6. The method for preparing an inductor with high conductivity according to claim 5, characterized in that: The T-core in step S31 is provided with a middle column, which is matched with the coil.

7. The method for preparing an inductor with high conductivity according to claim 6, characterized in that: The pressing method in step S34 is hot pressing and / or cold pressing.

8. The method for preparing an inductor with high conductivity according to claim 1, characterized in that: In step S2, the insulating layer is stripped by laser.

9. A high-quality conductivity inductor, characterized in that: The inductor is prepared by the preparation method of the inductor with high conductivity as described in any one of claims 1 to 8.

Citation Information

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