Electroplating equipment and etching equipment capable of vertically placing, continuously rotating workpiece, dynamically suppressing and supplying power by contact, and respectively applying and sucking electroplating liquid at short distance by using liquid feeding and collecting pipes

By adopting vertical placement, continuous rotating workpieces, dynamic elastic and compressive power supply of contacts and second electrode technology in the electroplating equipment, the problem of insufficient plating and deep plating capabilities in the existing electroplating technology is solved, and efficient electrodeposition of isolated conductive pattern surfaces is achieved.

CN120158803APending Publication Date: 2025-06-17德中(天津)技术发展股份有限公司
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Patent Information

Application Number
CN202510518632.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-23
Publication Date
2025-06-17

AI Technical Summary

Technical Problem

The existing electroplating technology still has shortcomings in improving the uniform and deep plating capabilities, and it is impossible to electrodeposit metal to the isolated conductive pattern surface without connecting the power source.

Method used

A new electroplating equipment is designed, which adopts vertical placement and continuous rotation of workpieces, and dynamically compressed power supply through contacts. It combines the liquid feeding and liquid receiving tubes to apply and suction the electroplating solution at close range to improve the ability of both plating and deep plating. Meanwhile, a second electrode is provided to achieve electrodeposition to the surface of the isolated conductor.

Benefits of technology

The uniformity and depth of the surface plating of the workpiece is significantly improved, and metal can be deposited on the isolated conductive pattern surface without connecting to the power supply, improving the plating efficiency and quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses electroplating equipment which is vertically placed, continuously rotates a workpiece, supplies power through dynamic elastic pressing of a contact and applies and sucks electroplating liquid in a close distance through a liquid conveying pipe and a liquid collecting pipe. The electroplating equipment is composed of a machining bin, a supply bin, a tool for clamping the workpiece and a discharging bin. The machining bin is composed of a circular anode power source, electroplating liquid, an electroplating liquid containing structure, an electroplating liquid spraying main pipe, an elastic cathode power source contact, a driving gear, a liquid feeding and collecting pipe and an elastic pressing contact scanning type electrode. The supply bin comprises an electroplating liquid tank, an electroplating power supply, a motor and a driving device which are used for driving a driving gear and a conveying chain, a pumping device and an integral circulating pumping device which are used for applying and sucking an electroplating liquid, and an integral electric control system of a power supply of an electronic and electric part and a software carrier; the clamping device is provided with a structure for keeping continuous electrification when the workpiece is in a moving state, and is provided with a pictographic power line compensation structure; gas and heat energy are delivered by the gas blowing pipe and the heating pipe; and isolation mechanisms or isolation areas are arranged among the bins.
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Description

Technical Field

[0001] The present invention relates to electroplating equipment and etching equipment for vertically placing and continuously rotating workpieces, dynamically elastically pressing contacts for power supply, and respectively applying and sucking electroplating solution at close range with liquid supply and liquid collection pipes, belonging to the technical field of professional equipment manufacturing. Background Art

[0002] Electroplating is used to electro-deposit metal on the surface of workpieces to form a metal coating. It is a basic processing method with wide applications and is very important for the manufacturing industry.

[0003] There are the following two problems in the existing electroplating technology: throwing power and deep plating power. Throwing power, also known as dispersion ability, refers to the ability to make the coating thickness evenly distributed on the surface of the workpiece; deep plating power, also known as covering ability, refers to the ability to deposit a metal coating in deep recesses or deep holes of the workpiece. In order to improve the throwing power and deep plating power, various attempts have been made in terms of equipment, liquid medicine, and process parameter control in the existing technology. So far, there is still no general solution.

[0004] In addition, there is a requirement that the existing electroplating technology cannot meet, that is: electro-depositing metal on the surface of an isolated conductive pattern without connecting a power source.

[0005] In view of the above deficiencies in the technology, the present invention is committed to designing and manufacturing a new type of electroplating equipment to solve the above three problems. Summary of the Invention

[0006] The equipment of the present invention vertically places and continuously rotates the workpiece during electroplating, supplies power to the rotating workpiece in a dynamically elastically pressing manner by contacts, supplements with applying and sucking electroplating solution at close range with liquid supply and liquid collection pipes, and sets a second electrode, which can improve the throwing power and deep plating power, and can electro-deposit metal on the surface of an isolated conductor.

[0007] 1. Overall Structure of the Equipment

[0008] The equipment consists of a processing chamber, a supply chamber, a fixture for clamping the workpiece, and a loading and unloading chamber. The equipment is provided with a unified operation area, and each chamber is provided with its own operation panel.

[0009] The processing chamber consists of a circular anode power source, electroplating solution and its accommodating structure, electroplating solution injection main pipe, elastic cathode power contact, driving gear, liquid supply and liquid collection pipes, strip-shaped scraping blade elastically pressing contact scanning electrode, etc. The present invention is suitable for processing both sides of the workpiece simultaneously. Each processing device is symmetrically arranged with the workpiece rotation plane as the boundary. Of course, the present invention can also only set each processing head on one side of the workpiece rotation plane to suit the occasion of only processing one side of the workpiece. Similar to the existing technology, the processing chamber is made into a trough body with plastic plates, has a visual observation window, and is also provided with a structure convenient for maintenance and repair.

[0010] The supply bin includes an electroplating solution tank, an electroplating power supply, a motor and its driving device for driving the driving gear and the conveying chain, a pumping device for the close application and suction of the electroplating solution, a pumping device for the overall circulation of the electroplating solution, and an overall electronic control system for the motion control of the equipment, the electronic and electrical components and the power supply of the software carrier, and other components. The supply bin is partitioned, with an electroplating solution tank area, a pumping device area, and an electrical and electronic device area. The supply bin is provided with a visual observation window, a detection and addition device for the liquid medicine, and also structures facilitating maintenance, repair, etc.

[0011] The fixture for clamping the workpiece is provided with a structure that can still maintain continuous power-on when the workpiece is in a moving state, and a pictorial power line compensation structure is provided.

[0012] During the processing, the workpiece is placed vertically and rotates continuously. In addition to the electroplating solution being applied by the injection main pipe, the electroplating solution is also applied and suctioned at close range by the liquid supply pipe and the liquid collection pipe respectively, and high-speed gas and high-density heat energy are also delivered at close range by the air blowing head and the heating head.

[0013] The loading and unloading bins are respectively configured as processing bins for the necessary treatment processes before and after electroplating, which are similar to the structure of the electroplating processing bin. A manipulator can also be provided to clamp the workpiece that has undergone the necessary pre- and post-electroplating treatments.

[0014] An isolation mechanism or isolation area is provided at the interface between each bin to dynamically realize the transportation and connection of objects, current, liquid, and gas.

[0015] 2. Workpiece clamping fixture

[0016] The fixture for clamping the workpiece made of an inner-square and outer-round plate is an important part of the present invention: First, it can be used as a driven wheel to drive the workpiece to always be in a vertical but overall fixed position, and through continuous rotation, achieve the relative motion effect with the processing head; Second, the conductors on both sides of the wheel disc plane are used as balancing copper to supplement the unevenness of the electrical wires; Third, through symmetric multi-point elastic contacts, dynamic conduction during rotation can be achieved.

[0017] After loading the workpiece, the fixture is placed vertically. The outer contour of the fixture is a tooth-shaped circle symmetric on both sides, and together with the side walls sandwiched between the two surfaces, it forms gear teeth, which are used as a driven wheel to mesh with the conveying chain to transport the workpiece in the equipment; the gear formed together with the side walls sandwiched between the two surfaces is also used to mesh with the teeth of the driving wheel to drive the workpiece to rotate continuously.

[0018] The disc plane part of the outer edge of the fixture is a flat conductor, which is dynamically elastically pressed by a contact connected to the negative electrode of the electroplating power supply, used to maintain the same potential as the negative electrode of the electroplating power supply; it is also used for pictorial compensation and balancing the uneven distribution of power lines caused by the difference between the shape and surface area of the workpiece plate and the shape and surface area of the power supply anode plate.

[0019] The other end of the contact connected to the electroplating power supply is a flexible conductive wire body, which is hermetically coated with an insulating, corrosion-resistant and waterproof sheath to connect the contact with the negative electrode of the electroplating power supply in the supply bin; the contact connected to the electroplating power supply is a high-sensitivity, high-elasticity and high-clamping pressure structure arranged in pairs facing each other, so that its elastic structure tightly presses the two surfaces of the outer edge disc plane at the same time, and can maintain a reliable electrical connection with the conductors on the two surfaces of the disc plane under dynamic rotation of the disc plane; the contacts of the contact connected to the electroplating power supply are arranged in groups, and are arranged in pairs in the form of a seesaw in twos or threes on each side of the fixture, ensuring that there are still contact connections even when the surface of the outer edge disc plane is uneven.

[0020] Elastic clips for clamping the circuit board are arranged between the outer frame and the inner frame of the fixture for clamping and fixing the workpiece; the conductive elastic clips between the outer frame and the inner frame of the fixture are electrically connected to the outer edge disc plane to keep the workpiece and the conductor on the outer edge disc plane at the same potential; the conductive elastic clips between the outer frame and the inner frame of the fixture can be connected to the conductor on the inner layer of the disc plane through the holes on the outer edge disc plane of the fixture, and then externally connect the conductive elastic clips through the side wall of the interface between the outer frame and the inner frame.

[0021] 3. Mechanism for driving the workpiece to move

[0022] The equipment of the present invention has the function of rotating the workpiece in place at the processing position, realized by the driving gear; it also has the function of transporting the workpiece between different parts of the equipment, realized by the conveying chain.

[0023] A driving gear for rotary motion is provided, which is used to mesh with the outer edge teeth of the fixture to drive the workpiece fixture and the workpiece to rotate in place; the driving gear is fixedly connected to the transmission shaft, and the transmission shaft penetrates through the processing bin and the supply bin of the equipment through a liquid seal structure; the part of the transmission shaft in the supply bin is driven by a motor in the supply bin to rotate, driving the driving gear in the processing bin to rotate, and then driving the fixture clamping the workpiece to rotate, so as to drive the workpiece to rotate.

[0024] A chain with circular motion is provided at the top of the processing bin and the loading and unloading bin, which is used to convert rotational motion into linear motion and convey the fixture loaded with workpieces to different positions; the structure of the chain matches the tooth shape of the passive gear formed by the workpiece fixture, and its two ends are fixed and meshed by gears driven by a transmission motor, and is controlled by the motion control system of the equipment; the conveying chain is fixedly installed and runs through the processing bin and the loading and unloading bin. At the interface where the conveying chain passes between the bins, a free baffle curtain is provided to reduce the cross-flow of substances between the bins.

[0025] 4. Liquid supply and collection pipes for improving electroplating speed and deep plating ability

[0026] Because the workpiece rotates in place continuously during processing, fresh electroplating liquid can be sprayed onto the surface of the workpiece in a close-range scanning manner, and the spent liquid can also be discharged in a close-range scanning manner, greatly improving the deep plating ability and processing speed.

[0027] Corresponding to the spatial position of the fixture, liquid supply pipes and liquid collection pipes are arranged at a close distance. Among them, the liquid supply pipe is used to apply electroplating liquid to the surface of the workpiece with a certain pressure to press the electroplating liquid to the side walls and surfaces of fine structures such as holes in the workpiece, so as to improve the depth ability of electroplating processing; the liquid collection pipe has a suction effect to withdraw the electroplating liquid on the surface of the workpiece, especially the side walls and surfaces of fine structures such as holes, to form a local negative pressure area, and promote the microscopic exchange speed of the electroplating liquid at the working interface, thereby improving the deep plating ability of electroplating processing.

[0028] The liquid supply pipe and the liquid collection pipe are fixed in the processing bin by a clamping structure with adjustable distance, parallel to the vertically placed workpiece fixture and the loaded workpiece, and point from the plane contour line of the outer edge of the fixture to the center of the plane contour line of the outer edge of the fixture; the clamping structure with adjustable distance consists of two parts. One part is the fixed part, which is fixedly connected to the processing bin and is the support body of the adjustable part, and is in a rod shape; the other part of the clamping structure with adjustable distance is a support pipe sleeve that can adjust its position. The support pipe sleeve is sleeved on the rod-shaped structure; the surface of the rod-shaped structure is smooth and perpendicular to the direction of the workpiece fixture and the workpiece it holds; a release and locking structure is provided between the support pipe sleeve that can adjust its position and the rod-shaped structure to adjust its position on the rod-shaped structure; the inner contour and size of the pipe sleeve part of the support pipe sleeve that can adjust its position match the outer contour and size of the liquid supply pipe and the liquid collection pipe. After the liquid supply pipe and the liquid collection pipe are sleeved and clamped, by releasing and sliding their positions on the rod-shaped structure and then locking, the parallel distance between the liquid supply pipe, the liquid collection pipe and the workpiece is adjusted, and the effects of applying electroplating liquid to the surface of the workpiece and sucking electroplating liquid from the surface of the workpiece are changed.

[0029] The ends of the liquid supply pipe and the liquid collection pipe are transfer liquid pipes, which penetrate between the processing chamber and the supply chamber of the equipment in a liquid-tight installation manner; in the supply chamber, the transfer liquid pipes are respectively connected to the pumping devices for application and suction; after the liquid supply pipe is connected to the liquid application pumping system and the electroplating solution tank through the transfer liquid pipe, it conveys and applies and distributes the electroplating solution to the surface of the workpiece in the processing chamber at a short distance; after the liquid collection pipe is connected to the liquid suction pumping system and the electroplating solution tank through the transfer liquid pipe, it sucks the electroplating solution from the surface of the workpiece in the processing chamber and returns the exhausted electroplating solution that has been used to the electroplating solution tank.

[0030] The lengths of the liquid supply pipe and the liquid collection pipe are greater than the radius of the fixture, and there are slits axially or densely arranged liquid spraying and liquid suction holes; the cross-sections of the slits and holes have various forms, which can be single rectangles or trapezoids, or can be segmented as rectangles connected to trapezoids; different cross-sectional forms of the slits and holes are suitable for different working conditions, realizing the ejection of liquid flows in the form of water jets or fans, or the suction of liquids in the form of direct suction or confluence.

[0031] In order to achieve better processing effects, in addition to the liquid supply pipe and the liquid collection pipe, the present invention can also be provided with a blowing head and a heating head at a short distance corresponding to the spatial position of the fixture as needed. Among them, the blowing head is used to deliver a high-speed gas flow along the surface of the workpiece, forming a long strip-shaped air knife, generating negative pressure, so as to achieve the effect of taking the liquid away from the surface of the workpiece, thereby improving the liquid drainage effect without spatial dead corners in concave and convex parts of the workpiece; the heating head is used to deliver high-density heat energy perpendicular to the surface of the workpiece, forming a long strip-shaped hot knife, and having a thermal interaction with the material to heat, vaporize and dry the material on the surface of the workpiece, thereby improving the cleaning and drying treatment ability of the workpiece.

[0032] Similar to the working principles of the liquid supply pipe and the liquid collection pipe, a scanning relative motion is generated between the blowing head and the heating head in the present invention and the workpiece that rotates in place without stopping. By applying the blowing head and the heating head that are fixedly stationary as a whole, the surface of the workpiece can be scanned and traversed, and the surface of the workpiece can be acted on in a short-distance focusing manner to more thoroughly take away and remove the electroplating solution and moisture on the surface of the workpiece. Moreover, a laser light source can be used to provide heat for heating. Laser processing belongs to anisotropic energy transfer, which can avoid the loss of other isotropic energy transfer; the blowing head can be designed according to the Venturi effect and has the function of discharging and sucking air with an increased air volume, all of which are energy-saving and efficient processing.

[0033] 5. The second electrode

[0034] In order to deposit metal on the surface of a conductor in an electrically isolated area by electroplating, the present invention provides a second electrode.

[0035] Corresponding to the spatial position of the fixture, a strip-shaped scraping blade elastic pressure contact scanning electrode is provided as the second electrode of the device. The second electrode is strip-shaped, with one side being a scraping blade linear structure and the other side connected with a wire. In the working state, the blade dynamically elastically presses against the surface of the workpiece, contacts the surface of the workpiece linearly, and connects the isolated conductive pattern on the surface of the workpiece in contact with it to the power supply to form a circuit loop, enabling the metal ions in the liquid on the surface of the isolated conductive pattern to obtain electrons and deposit on the surface of the isolated conductive pattern. As the workpiece rotates, the blade line contact traverses the entire surface of the workpiece to complete the electroplating of the isolated / separated / discrete conductive patterns on the entire plate.

[0036] The strip-shaped scraping blade elastic pressure contact scanning electrode is fixed in the processing chamber by a clamping structure and is parallel to the workpiece fixture placed vertically and the workpiece clamped thereon; the clamping structure consists of two parts. One part is the fixed part, which is fixedly connected to the processing chamber and is the support body of the locking and releasing mechanism; the other part is the locking and releasing mechanism. In the locked state, the blade of the electrode elastically contacts the surface of the workpiece and is in the working state.

[0037] At the other end of the strip-shaped scraping blade elastic pressure contact scanning electrode, a flexible wire body is connected. The wire body is hermetically coated with an insulating, corrosion-resistant, and waterproof sheath and is connected to the negative electrode of the electroplating power supply in the supply chamber.

[0038] 6. Shape of the circular anode and material selection of other conductors

[0039] Because during the electroplating process, the workpiece fixture rotates continuously together with the workpiece, and a conductor is supplemented on the outer edge wheel plane to form a circular cathode, the anode of the present invention is set as circular.

[0040] A circular anode is installed in the processing chamber and is parallel to the workpiece fixture and the workpiece clamped thereon. Its spatial position, shape, and size match those of the workpiece fixture and the workpiece clamped thereon; one end of the anode is electrically connected to the flexible wire body through a contact. The wire body is hermetically coated with an insulating, corrosion-resistant, and waterproof sheath and is connected to the positive electrode of the electroplating power supply in the supply chamber.

[0041] To maintain the consistency and stability of processing, for the flat conductive surface of the outer circular disc part of the fixture for clamping the workpiece, the contact surface that contacts the flat conductive body of the disc plane part at the outer edge of the fixture and is connected to the negative electrode of the electroplating power supply, the contact surface of the long strip-shaped scraping blade spring pressing contact scanning electrode, and the circular anode surface in the processing chamber, materials with high surface chemical inertness that are conductive, such as graphite, conductive ceramics, etc., are selected and then surface-treated; or conductive metal materials that have been passivated and hydrophobized are selected; to maintain the consistency and stability of processing, except for the above-mentioned surface-treated conductors and the surfaces of the workpiece that need to be electroplated and electrolytically removed, the parts of the conductors in the processing chamber that do not need to contact the workpiece need to be coated with insulating anti-metal deposition materials.

[0042] 7. Structure for improving efficiency and supporting simultaneous processing of multiple workpieces and multiple processing units in large quantities

[0043] The present invention not only supports loading one workpiece with one workpiece clamping fixture, but the workpiece fixture can also load sub-workpiece fixtures to load more workpieces simultaneously.

[0044] Take the fixture loading the workpiece as the main fixture, match or change the functions, inner structure, and inner dimensions of the main fixture, and set a fixture that is smaller in outer shape than the main fixture but can load multiple workpieces simultaneously as the sub-fixture to load multiple discrete workpieces for simultaneous processing. In this way, the large-format tool or large-format layout processing requirements can be met with the main fixture; the requirements for simultaneous processing of multiple discrete workpieces of small-format workpieces or small-format layouts can be met with the sub-fixture.

[0045] The present invention not only supports a single-unit processing structure of loading one workpiece or sub-workpiece fixtures with one workpiece clamping fixture to load more workpieces simultaneously, but also can select a structure of simultaneous processing of multiple processing units with a single chamber, multiple chambers, or a mixture of a single chamber and multiple chambers, supporting large-scale production.

[0046] Multiple processing and supply units are arranged in the processing chamber and the supply chamber. With a structure of multiple units in one chamber, it can accommodate and support multiple workpieces clamping fixtures for simultaneous processing, improving the production efficiency of the equipment; connect several single-unit processing chambers, supply chambers, and workpieces clamping fixtures together. With a structure of interconnected multiple single-unit chambers, it can accommodate and support multiple workpieces clamping fixtures for simultaneous processing, improving the production efficiency of the equipment; connect several structures of multiple units in one chamber and the structure of interconnected multiple single-unit chambers together to accommodate and support multiple workpieces clamping fixtures for simultaneous processing, improving the production efficiency of the equipment.

[0047] Advantages and effects of the present invention

[0048] 1. The workpiece is placed vertically, and the processing effects on both sides of the workpiece are the same;

[0049] 2. The workpiece rotates continuously, and the machining effects on the top, bottom, left, and right of the workpiece are symmetrical.

[0050] 3. For the circular anode, balance conductors are arranged on the plane of the outer rim disk. The workpiece rotates continuously, enhancing the throwing power.

[0051] 4. There are liquid supply pipes and liquid collection pipes, applying and sucking liquid at a short distance, enhancing the deep plating ability and improving the electroplating efficiency.

[0052] 5. A second scraper scanning electrode is provided, with a linear contact, scanning across the entire plate to achieve electroplating in electrically isolated areas. Description of the Drawings

[0053] The embodiments of the present application will be described in more detail by combining the accompanying drawings. The above and other objects, features, and advantages of the present application will become more obvious. The drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation to the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0054] Figure 1 Shown is the front view of the electroplating equipment according to an embodiment of the present application.

[0055] Figure 2 Shown as Figure 1 The schematic diagram of the electroplating process principle of the electroplating equipment shown.

[0056] Figure 3 Shown as Figure 1 The schematic diagram of the drying process principle of the electroplating equipment shown.

[0057] Figure 4 Shown as Figure 1 The schematic diagram of the power supply process principle of the electroplating equipment shown.

[0058] Figure 5 Shown as Figure 1 The structural schematic diagram of the scanning electrode of the electroplating equipment shown.

[0059] Reference Numerals:

[0060] 1. Fixture; 2. Workpiece; 3. Transmission chain; 4. Sprocket; 5. Fixed block; 6. Support rod; 7. Liquid collection pipe; 8. Sliding support block; 9. Liquid collection hole; 10. Heating head; 11. Blowing head; 12. Circular anode electrode; 13. Liquid supply pipe; 14. Scanning electrode; 15. Electrode contact; 16. Chamber wall; 17. Electroplating solution; 18. Return solution; 19. Workpiece through hole; 20. Gas; 21. Thermal energy; 23. Spring mechanism; 24. Pattern; 25. Through hole; 26. Scanning electrode contact. Detailed Embodiments

[0061] The present invention will be further described below in conjunction with implementation examples. The following implementation examples are illustrative and not restrictive, and the protection scope of the present invention cannot be limited by the following implementation examples.

[0062] Figure 1 The front view of an electroplating device according to an embodiment of the present application is shown. Figure 2 As shown Figure 1 The schematic diagram of the electroplating process principle of the electroplating device shown. Figure 3 As shown Figure 1 The schematic diagram of the drying process principle of the electroplating device shown. Figure 4 As shown Figure 1 The schematic diagram of the power supply process principle of the electroplating device shown. Figure 5 As shown Figure 1 The schematic diagram of the structure of the scanning electrode of the electroplating device shown

[0063] Such as Figures 1 to 5 As shown, an electroplating device that vertically places and continuously rotates a workpiece, dynamically elastically presses the contact for power supply, and respectively applies and aspirates electroplating solution at close range with a liquid supply pipe and a liquid collection pipe, consists of a processing chamber, a supply chamber, a fixture 1 for clamping the workpiece 2, and a loading and unloading chamber; the processing chamber consists of a circular anode electrode 12, an electroplating solution 17 and its accommodating structure, an electroplating solution injection main pipe, an elastic cathode power supply contact, a driving gear, a liquid supply and collection pipe 7, a strip-shaped scraping blade elastically pressed and contacted scanning electrode, etc.; the supply chamber includes an electroplating solution tank, an electroplating power supply, a motor and its driving device for driving the driving gear and the conveying chain, a pumping device for applying and aspirating the electroplating solution 17 at close range, a pumping device for the overall circulation of the electroplating solution 17, and an overall electronic control system for the movement control, electronic and electrical components and software carrier, and power supply of other components of the device; the fixture 1 for clamping the workpiece 2 is provided with a structure that can still maintain continuous power supply when the workpiece 2 is in a moving state, and is provided with a pictorial power line compensation structure; during the processing, the workpiece 2 is vertically placed and continuously rotated. In addition to the injection main pipe applying the electroplating solution 17, the electroplating solution 17 is also respectively applied and aspirated at close range by the liquid supply pipe 13 and the liquid collection pipe 7, and high-speed gas 20 and high-density heat energy 21 are also delivered at close range by a blowing pipe and a heating pipe; the loading and unloading chambers are respectively configured as processing chambers for necessary pre- and post-electroplating treatment processes similar to the electroplating processing chamber structure, and a manipulator can also be provided to load and unload the workpiece 2 that has undergone necessary pre- and post-electroplating treatment; an isolation mechanism or isolation area is provided at the interface between each chamber to dynamically realize the transportation and connection of objects, current, liquid, and gas 20.

[0064] There is a fixture 1 for clamping the workpiece 2 made of a plate with an inner square and an outer circle. After loading the workpiece 2, it is placed vertically. The outer contour of the fixture 1 is a tooth-shaped circle symmetric about two sides, and together with the side walls sandwiched between the two surfaces, it forms gear teeth, serving as a passive gear for meshing with the conveying chain to transfer the workpiece 2 inside the equipment. The gear formed together with the side walls sandwiched between the two surfaces is also used to mesh with the teeth of the driving gear to drive the workpiece 2 to rotate continuously.

[0065] The disk plane part of the outer edge of the fixture is a flat conductor, which is dynamically elastically pressed (for example, through the spring mechanism 23) by the electrode contact 15 connected to the negative electrode of the electroplating power supply, used to maintain the same potential as the negative electrode of the electroplating power supply; it is also used for pictorial compensation and balancing of the uneven distribution of power lines caused by the difference between the plate shape and surface area of the workpiece 2 and the shape and surface area of the power supply anode plate.

[0066] The other end of the electrode contact 15 connected to the electroplating power supply is a flexible wire body, which is hermetically coated with an insulating, corrosion-resistant, and waterproof sheath, connecting the electrode contact 15 to the negative electrode of the electroplating power supply in the supply bin; the electrode contact 15 connected to the electroplating power supply is a structure with high sensitivity, high elasticity, and high clamping pressure arranged in pairs facing each other, so that its elastic structure tightly presses against the two surfaces of the outer edge disk plane at the same time, and can maintain a reliable electrical connection with the conductors on the two surfaces of the disk plane under the dynamic rotation of the disk plane; the contacts of the electrode contact 15 connected to the electroplating power supply are arranged in groups, and are arranged in pairs in the form of a seesaw in twos or threes on each side of the fixture, ensuring that there are still contact connections even when the surface of the outer edge disk plane is uneven.

[0067] Elastic clips for clamping the circuit board are arranged between the outer frame and the inner frame of the fixture, used for clamping and fixing the workpiece 2; the conductive elastic clips between the outer frame and the inner frame of the fixture are electrically connected to the outer edge disk plane to keep the workpiece 2 and the conductor on the outer edge disk plane at the same potential; the conductive elastic clips between the outer frame and the inner frame of the fixture can be connected to the conductor in the inner layer of the disk plane through the holes on the outer edge disk plane of the fixture, and then externally connect the conductive elastic clips through the side walls of the interface between the outer frame and the inner frame.

[0068] There is a driving gear that makes a rotational motion, used for meshing with the outer edge gear teeth of the fixture to drive the workpiece 2 fixture and the workpiece 2 to rotate in place; the driving gear is fixedly connected to the transmission shaft, and the transmission shaft penetrates through the processing bin and the supply bin of the equipment through a liquid seal structure; the part of the transmission shaft in the supply bin is driven by a motor in the supply bin to make a rotational motion, driving the driving gear in the processing bin to rotate, and then driving the fixture clamping the workpiece 2 to rotate, thereby driving the workpiece 2 to rotate.

[0069] Corresponding to the spatial position of the fixture, the liquid supply pipe 13 and the liquid collection pipe 7 are arranged closely. Among them, the liquid supply pipe 13 is used to apply the electroplating solution 17 to the surface of the workpiece 2 with a certain pressure, so as to press the electroplating solution 17 into the side walls and surfaces of the fine structures such as the holes of the workpiece 2, thereby improving the depth ability of electroplating processing; the liquid collection pipe 7 has a suction effect, which is used to withdraw the electroplating solution 17 on the surface of the workpiece 2, especially the side walls and surfaces of the fine structures such as the holes, to form a local negative pressure area, promote the microscopic exchange speed of the electroplating solution 17 at the working interface, and take away the reflux medicine liquid 18, thereby improving the deep plating ability of electroplating processing.

[0070] The liquid supply pipe 13 and the liquid collection pipe 7 are fixed in the processing chamber by an adjustable-distance clamping structure, parallel to the fixture of the workpiece 2 placed vertically and the clamped workpiece 2, and point from the plane contour line of the outer edge of the fixture to the center of the plane contour line of the outer edge; the adjustable-distance clamping structure consists of two parts. One part is the fixed part, which is fixedly connected to the processing chamber (or the chamber wall 16) and is the support body of the adjustable part, and is a rod-shaped structure; the other part of the adjustable-distance clamping structure is a support pipe sleeve whose position can be adjusted. The support pipe sleeve is sleeved on the rod-shaped structure. For example, the support rod 6, one end of the support rod 6 is connected to the fixed block 5 arranged on the side wall of the processing chamber B; the surface of the rod-shaped structure is smooth and perpendicular to the direction of the fixture of the workpiece 2 and the workpiece 2 clamped thereon; a release and locking structure is provided between the support pipe sleeve whose position can be adjusted and the rod-shaped structure to adjust its position on the rod-shaped structure; the inner contour and size of the pipe sleeve part of the support pipe sleeve whose position can be adjusted match the outer contour and size of the liquid supply pipe 13 and the liquid collection pipe 7. After sleeving and clamping the liquid supply pipe 13 and the liquid collection pipe 7, by releasing and sliding its position on the rod-shaped structure and then locking, the parallel distance between the liquid supply pipe 13 and the liquid collection pipe 7 and the workpiece 2 is adjusted, and the effects of applying the electroplating solution 17 to the surface of the workpiece 2 and sucking the electroplating solution 17 from the surface of the workpiece 2 are changed. A sliding support block 8 is arranged on the support rod 6 to connect and fix the liquid supply pipe or the liquid collection pipe.

[0071] The ends of the liquid supply pipe 13 and the liquid collection pipe 7 are transmission liquid pipes, which penetrate between the processing chamber and the supply chamber of the equipment in a liquid-tight installation manner; in the supply chamber, the transmission liquid pipes are respectively connected to the pumping devices for application and suction; after the liquid supply pipe 13 is connected to the liquid application pumping system and the electroplating solution tank through the transmission liquid pipe, it conveys and closely applies and distributes the electroplating solution 17 to the surface of the workpiece 2 in the processing chamber; after the liquid collection pipe 7 is connected to the liquid suction pumping system and the electroplating solution tank through the transmission liquid pipe, it sucks the electroplating solution 17 from the surface of the workpiece 2 in the processing chamber and returns the used and exhausted electroplating solution 17 to the electroplating solution tank.

[0072] The lengths of the liquid delivery pipe 13 and the liquid collection pipe 7 are greater than the radius of the fixture, and are axially provided with slits or closely arranged liquid spraying and liquid suction holes; the cross-sections of the slits and holes have various forms, which can be a single rectangle or trapezoid, or can be segmented as a rectangle connected to a trapezoid; different forms of the cross-sections of the slits and holes are suitable for different working conditions, so as to realize spraying liquid flows in a water jet or fan-shaped manner, or sucking liquids in a direct suction or confluence manner.

[0073] Corresponding to the spatial position of the fixture, a blowing head and a heating head 10 are arranged at a short distance. Among them, the blowing head is used to deliver a high-speed gas 20 flow along the surface of the workpiece 2 to form a strip-shaped air knife, generating a negative pressure to achieve taking the liquid away from the surface of the workpiece 2, so as to improve the liquid drainage effect without spatial dead corners at the concave and convex parts of the workpiece 2; the heating head 10 is used to deliver high-density heat energy 21 perpendicular to the surface of the workpiece 2 to form a strip-shaped thermal knife, and thermally interact with the material to heat, vaporize and dry the material on the surface of the workpiece 2, so as to improve the cleaning and drying treatment ability of the workpiece 2.

[0074] Corresponding to the spatial position of the fixture, a strip-shaped scraping blade elastic contact scanning electrode is arranged as the second electrode of the equipment. The second electrode (i.e., the scanning electrode contact 26) is strip-shaped, with one side being a scraping blade linear structure and the other side being connected with a wire. In the working state, the blade dynamically elastically presses the surface of the workpiece 2, contacts the surface of the workpiece 2 linearly, and connects the isolated conductive pattern 24 (and the through hole 25) on the surface of the workpiece 2 in contact with it to the power supply to form an electric circuit loop, so that the metal ions in the liquid on the surface of the isolated conductive pattern obtain electrons and are deposited on the surface of the isolated conductive pattern. As the workpiece 2 rotates, the blade line contact traverses and scans the entire surface of the workpiece 2 to complete the electroplating of the isolated / separated / discrete conductive patterns on the whole plate.

[0075] The strip-shaped scraping blade elastic contact scanning electrode is fixed in the processing chamber by a clamping structure, parallel to the workpiece 2 fixture placed vertically and the clamped workpiece 2; the clamping structure consists of two parts. One part is the fixed part, which is fixedly connected to the processing chamber and is the support body of the locking and releasing mechanism; the other part is the locking and releasing mechanism. In the locked state, the blade of the electrode elastically contacts the surface of the workpiece 2 and is in the working state.

[0076] A flexible wire body is connected to the other end of the strip-shaped scraping blade elastic contact scanning electrode, and the wire body is hermetically coated with an insulating, corrosion-resistant and waterproof sheath, connecting the contact electrode to the negative pole of the electroplating power supply in the supply chamber.

[0077] A transmission chain 3 that moves in a cycle is provided at the top of the processing bin and the loading and unloading bins. Sprockets 4 are provided at both ends to convert rotational motion into linear motion and convey the fixture holding the workpiece 2 to different positions. The structure of the chain matches the tooth profile of the passive gear formed by the fixture of the workpiece 2. Both ends of the chain are fixed and engaged by gears driven by a transmission motor and are controlled by the motion control system of the equipment. The conveying chain is fixedly installed and runs through the processing bin and the loading and unloading bins. At the interface where the conveying chain passes between the bins, free baffle curtains are provided to reduce the cross-flow of substances between the bins.

[0078] A circular anode is provided inside the processing bin, parallel to the fixture of the workpiece 2 and the workpiece 2 held by it. Its shape and size match the fixture of the workpiece 2 and the workpiece 2 held by it. One end of the anode is electrically connected to a flexible wire body through a contact. The wire body is hermetically coated with an insulating, corrosion-resistant, and waterproof sheath and is connected to the positive pole of the electroplating power supply in the supply bin.

[0079] To maintain the consistency and stability of processing, the flat conductive surface of the outer disc plane part of the fixture for holding the workpiece 2, the contact surface that contacts the flat conductive body of the disc plane part of the outer edge of the fixture and is connected to the negative pole of the electroplating power supply, the contact surface of the long strip-shaped scraping knife elastic pressing contact scanning electrode, and the surface of the circular anode inside the processing bin are selected from materials that are conductive but have a relatively high surface chemical inertness and are then surface-treated, such as graphite, conductive ceramics, etc.; or conductive metal materials that have been passivated and hydrophobized are selected. To maintain the consistency and stability of processing, except for the above-mentioned surface-treated conductors and the surfaces of the workpiece 2 that need to be electroplated and deposited and electrolytically removed, the parts of the conductors inside the processing bin that do not need to contact the workpiece 2 need to be coated with insulating anti-metal deposition materials.

[0080] Take the fixture holding the workpiece 2 as the main fixture, match or change the function, inner structure, and inner size of the main fixture, and set a fixture that is smaller in outer shape than the main fixture but can hold multiple workpieces 2 at the same time as the sub-fixture to hold multiple discrete workpieces 2 and process them simultaneously.

[0081] Multiple processing and supply units are provided inside the processing bin and the supply bin. In a structure with multiple units in one bin, it can accommodate and support multiple fixtures holding the workpiece 2 and process them simultaneously to improve the production efficiency of the equipment; connect several single-unit processing bins, supply bins, and fixtures holding the workpiece 2 together. In a structure with multiple single-unit bins interconnected, it can accommodate and support multiple fixtures holding the workpiece 2 and process them simultaneously to improve the production efficiency of the equipment; connect several structures with multiple units in one bin and the structure with multiple single-unit bins interconnected together to accommodate and support multiple fixtures holding the workpiece 2 and process them simultaneously to improve the production efficiency of the equipment.

[0082] The technical solution of the present application will be further elaborated below in conjunction with some specific embodiments. It should be noted that these specific embodiments are only for the convenience of those skilled in the art to better understand the technical solution of the present application, and should not be regarded as an inappropriate limitation of the protection scope of the present application.

[0083] Embodiment 1

[0084] The workpiece to be processed in this embodiment is a work-in-progress microwave circuit board made of PTFE sheet that needs to be surface-plated with soft gold. The thickness of this work-in-progress is 2 mm, and it has workpiece through-holes 19 with a diameter of 0.2 mm that are unevenly distributed. The design requirement is that the gold layer thickness is 3 microns. Due to the high cost of gold and the requirements of waveguides, the workpieces have high requirements for the uniformity of the plating layer, + / - 0.3 microns. In addition, due to the presence of vias, the deep plating requirements in the holes are also very high. Therefore, this product is very difficult for ordinary electroplating equipment. In this embodiment, an electroplating gold equipment that vertically places and continuously rotates the workpiece, supplies power with dynamic spring pressing of the contacts, and applies and aspirates the electroplating solution at close range with a liquid supply pipe and a liquid collection pipe respectively (the composition of the plating solution is the same as that of the traditional plating solution, Au+ 4-6 g / l, PH 4.7-5.2, specific gravity 10-20 O Be), and uses the second electrode for electroplating, which can well meet the design requirements and cost requirements. The specific implementation plan is as follows:

[0085] Step 1, according to the traditional processing technology, complete all the processes before gold plating, including drilling, hole metallization, pattern transfer, development, etching, stripping, and other all processes.

[0086] Step 2, fix the work-in-progress at the center of the clamping fixture with an inner square and outer circle, fix it well, and first complete the treatment of workstations such as degreasing, micro-etching, and pickling before gold plating. The clamping fixture reaches the reference position of the gold plating processing chamber vertically through the transmission chain.

[0087] Step 3, the clamping fixture starts to rotate driven by the driving gear, the spraying main pipe starts to spray liquid, the liquid supply pipe and the liquid collection pipe start to supply and aspirate liquid at close range synchronously, the main power supply and the second electrode are automatically turned on, and the electroplating lasts for 6 minutes to complete the electroplating of the surface soft gold.

[0088] Its specific processing parameters are shown in Table 1.

[0089] Table 1

[0090]

[0091]

[0092] Step 4, after the gold plating is completed, the work-in-progress is driven by the clamping fixture and is sequentially transported to the subsequent gold buyback, tap water washing, and DI water washing through the chain, and finally the entire gold plating process is completed after drying.

[0093] Example 2

[0094] This example is a case of simultaneous processing of multiple workpieces in multiple processing chambers to improve efficiency. It is also the reverse process of electroplating, namely the electrolysis process. That is, after reversing the positive and negative poles of the power supply, the metal ions on the workpiece are decomposed and removed. There are two workpieces in this example. The first processing chamber processes the SMT stainless steel template, and the task is selective electrolytic thinning. The second processing chamber processes the microwave high-frequency circuit board to be etched with circuits, and the task is to perform fine etching using the electrolytic etching process. Due to different solder printing amounts of different components on the SMT stainless steel template, some areas need to be thinned. Electrolytic thinning has the advantages of fineness, smoothness, and easy demolding. In this example, electrolytic etching is used for processing, and the thinning thickness is 30 microns. The electrolyte uses a neutral salt system (10% NaCl + 6% NaNO3). The pattern 24 of the microwave high-frequency circuit board is the waveguide channel, and its dimensional accuracy, edge roughness, and relationships with the power loss and propagation speed of microwave signals are very significant. In this example, pattern making is carried out by the electrolytic etching method. To ensure that the large-area dielectric region is etched clean, in this example, a second electrode is added to completely remove the residual copper caused by uneven thickness or the central isolated residual copper remaining after edge removal. The total etching thickness is 45 microns, and the electrolyte uses an acidic copper sulfate system (10% H2SO4, 7% CuSO4). The specific implementation plan is as follows:

[0095] Step 1, complete all the processes before the electrolytic etching of workpiece 1 stainless steel plate according to the traditional process, including all processes such as stretching the screen, laser drilling, film pasting, exposure, and development; complete all the processes before the electrolytic etching of workpiece 2 according to the traditional process, including all processes such as drilling, hole metallization, film pasting, exposure, and development.

[0096] Step 2, fix workpiece 1 at the center of the clamping fixture for feeding into processing chamber 1, fix it well, transfer it to processing chamber 1 through the chain, reverse the current, set the current density to 0.3 ASD, start rotation, spray the main pipe to spray liquid, and the liquid supply pipe and liquid collection pipe start to supply liquid and pump liquid at a short distance simultaneously to start the selective thinning of the stainless steel template; at the same time, fix workpiece 2 at the center of the clamping fixture for feeding into processing chamber 2, fix it well, transfer it to processing chamber 2 through the chain, reverse the current, set the main circuit density to 0.5 ASD, and the second electrode current density to 0.4 ASD. The specific processing parameters are as follows:

[0097] Processing chamber 1:

[0098] Linear velocity of the edge of the jig rotation 0.5 m / min Pressure of the main injection pipe 2.5 kg / cm2 Pressure of the liquid supply pipe 2.5 kg / cm2 Negative pressure of the liquid collection pipe -0.5 kg / cm2 Current density 0.2 ASD Electrolysis time 12 minutes

[0099] Processing chamber 2:

[0100] Linear velocity of the edge of the jig rotation 0.5 m / min Pressure of the main injection pipe 2.5 kg / cm2 Pressure of the liquid supply pipe 2.5 kg / cm2 Negative pressure of the liquid collection pipe -0.5 kg / cm2 Current density of the main power supply 0.5 ASD Current density of the second electrode 0.4 ASD Electrolysis time 12 minutes

[0101] Step 3: After the workpiece 1 and the workpiece 2 are simultaneously completed with electrolytic machining, they are successively driven by the clamping fixture and transported to subsequent workstations such as water washing and drying via a chain to complete the processing of the entire electrolytic process.

Claims

1. An electroplating device that vertically places and continuously rotates a workpiece, dynamically presses a contact to supply power, and uses a liquid delivery and liquid collection pipe to apply and suck the electroplating liquid at a close distance, characterized in that: It is composed of a processing chamber, a supply chamber, a fixture for clamping workpieces, and upper and lower material chambers; the processing chamber is composed of a circular anode power supply, electroplating liquid and its containing structure, an electroplating liquid injection main pipe, an elastic cathode power supply contact, a driving gear, a liquid delivery and receiving pipe, and a long scraper blade spring-pressed contact scanning electrode; the supply chamber includes an electroplating liquid tank, an electroplating power supply, a motor and a driving device for driving the driving gear and the conveying chain, a pumping device for applying and sucking the electroplating liquid, a pumping device for the overall circulation of the electroplating liquid, and an overall electronic control system for the motion control of the equipment, the power supply of electronic and electrical components and the software carrier; the fixture for clamping the workpiece is provided with an integrated electronic control system for the workpiece; The structure can keep the workpiece continuously energized when it is in motion, and is equipped with a pictographic power line compensation structure; during the processing, the workpiece is placed vertically and rotates continuously. In addition to the injection main pipe applying the plating liquid, the liquid delivery pipe and the liquid collection pipe are used to apply and suck the plating liquid respectively, and the air blowing pipe and the heating pipe are used to deliver gas and heat energy; the upper and lower material bins are respectively configured to be similar to the electroplating processing bin structure, and the electroplating pre- and post-processing bin is equipped with a robot to clamp the workpiece that has undergone the necessary pre- and post-processing of electroplating; the interface between each bin is provided with an isolation mechanism or isolation area to dynamically realize the transportation and connection of objects, current, liquid and gas.

2. The electroplating equipment according to claim 1, wherein the workpiece is placed vertically and rotates continuously, the contact is dynamically pressed to supply power, and the electroplating liquid is applied and sucked at a close distance by a liquid delivery pipe and a liquid receiving pipe, respectively, characterized in that: A fixture for clamping workpieces is provided, which is made of a plate with a square inner and a round outer surface. The workpiece is placed vertically after being loaded. The contour of the outer circle of the fixture is a toothed circle that is symmetrical on both sides, and together with the side walls sandwiched between the two surfaces, it forms gear teeth, which serve as a passive wheel and are used to mesh with the conveyor chain to transmit the workpiece in the equipment. The gear formed by the side walls sandwiched between the two surfaces is also used to mesh with the gear teeth of the driving wheel to drive the workpiece to rotate continuously.

3. The electroplating equipment according to claim 1, wherein the workpiece is placed vertically and rotates continuously, the contact is dynamically pressed to supply power, and the electroplating liquid is applied and sucked at a close distance by the liquid delivery and collection pipes, respectively, characterized in that: The flat part of the wheel disc on the outer edge of the fixture is a flat conductor, which is dynamically pressed by the contact connected to the negative electrode of the electroplating power supply to maintain the same potential as the negative electrode of the electroplating power supply; it is also used to pictorially compensate and balance the uneven distribution of electric lines caused by the difference between the shape and surface area of ​​the workpiece plate and the shape and surface area of ​​the power supply anode plate; Preferably, the other end of the contact connected to the electroplating power supply is a flexible conductive wire body, which is sealed with an insulating, corrosion-resistant and waterproof sheath to connect the contact to the negative electrode of the electroplating power supply in the supply bin; the contact connected to the electroplating power supply is a highly sensitive, highly elastic and highly clamping pressure structure arranged in pairs facing each other, so that its elastic structure tightly contacts and presses the two surfaces of the outer edge wheel plane at the same time, and can maintain reliable electrical connection with the conductors on the two surfaces of the wheel plane under the dynamic rotation of the wheel plane; the contact points of the contact connected to the electroplating power supply are arranged in groups, and are arranged in pairs of two or three in the form of a seesaw on each side of the fixture, ensuring that there is still contact connection even if the surface of the outer edge wheel plane is uneven; Preferably, elastic clips for clamping circuit boards are provided between the outer frame and the inner frame of the fixture, and are used to clamp and fix the workpiece; the conductive elastic clips between the outer frame and the inner frame of the fixture are electrically connected to the outer edge wheel disc plane to keep the workpiece and the conductor on the outer edge wheel disc plane at the same potential; the conductive elastic clips between the outer frame and the inner frame of the fixture can be connected to the conductor on the inner layer of the wheel disc plane through the holes on the outer edge wheel disc plane of the fixture, and then connected to the outside through the side wall of the interface between the outer frame and the inner frame.

4. The electroplating equipment according to claim 1, wherein the workpiece is placed vertically and rotates continuously, the contact is dynamically pressed to supply power, and the electroplating liquid is applied and sucked at a close distance by the liquid delivery and collection pipes, respectively, characterized in that: A driving gear that performs rotational motion is provided, which is used to mesh with the gear teeth on the outer edge of the fixture to drive the workpiece fixture and the workpiece to rotate in situ; the driving gear is fixedly connected to the transmission shaft, and the transmission shaft passes through the processing chamber and the supply chamber of the equipment through a liquid seal structure; the part of the transmission shaft in the supply chamber is driven by the motor in the supply chamber to perform rotational motion, driving the driving gear in the processing chamber to rotate, and then driving the fixture holding the workpiece to rotate, thereby driving the workpiece to rotate; Preferably, a liquid delivery pipe and a liquid collection pipe are arranged in close proximity to the spatial position of the fixture, wherein the liquid delivery pipe is used to apply the electroplating liquid to the surface of the workpiece at a certain pressure, so as to pressurize the electroplating liquid to the side walls and surfaces of the microstructures such as the holes of the workpiece, thereby improving the depth capability of the electroplating process; the liquid collection pipe has a suction function, which is used to withdraw the electroplating liquid on the surface of the workpiece, especially the side walls and surfaces of the microstructures such as the holes, to form a local negative pressure area, promote the microscopic exchange speed of the electroplating liquid at the working interface, thereby improving the deep plating capability of the electroplating process; Preferably, the liquid delivery pipe and the liquid collection pipe are fixed in the processing chamber by a clamping structure with an adjustable distance, parallel to the vertically placed workpiece fixture and the clamped workpiece, and point from the plane contour line of the outer edge wheel disk of the fixture to the center of the circle of the plane contour line of the outer edge wheel disk; the clamping structure with an adjustable distance is composed of two parts, one part is a fixed part, which is fixedly connected to the processing chamber and is the support body of the adjustable part, which is a rod-shaped structure; the other part of the clamping structure with an adjustable distance is an adjustable position support sleeve, which is sleeved on the rod-shaped structure; the surface of the rod-shaped structure is smooth, The support sleeve is perpendicular to the workpiece fixture and the workpiece clamped therein; a release and locking structure is provided between the adjustable support sleeve and the rod-shaped structure to adjust its position on the rod-shaped structure; the inner contour and size of the sleeve part of the adjustable support sleeve match the outer contour and size of the liquid delivery pipe and the liquid collection pipe, and after the liquid delivery pipe and the liquid collection pipe are mounted and clamped, the position of the support sleeve on the rod-shaped structure is released and slid and then locked to adjust the parallel distance between the liquid delivery pipe, the liquid collection pipe and the workpiece, thereby changing the effect of applying the plating liquid to the workpiece surface and sucking the plating liquid from the workpiece surface; Preferably, the ends of the liquid delivery pipe and the liquid collection pipe are liquid transmission pipes, which are installed in a liquid-tight manner between the processing chamber and the supply chamber of the equipment; in the supply chamber, the liquid transmission pipe is respectively connected to the pumping device for applying and sucking; after the liquid delivery pipe is connected to the pumping system for applying liquid and the electroplating liquid tank through the liquid transmission pipe, the electroplating liquid is transported to the workpiece surface of the processing chamber and applied and distributed at a close distance; after the liquid collection pipe is connected to the pumping system for sucking liquid and the electroplating liquid tank through the liquid transmission pipe, the electroplating liquid is sucked from the workpiece surface of the processing chamber, and the exhausted electroplating liquid that has been acted on is returned to the electroplating liquid tank; Preferably, the length of the liquid delivery pipe and the liquid receiving pipe is greater than the radius of the fixture, and a slit is opened axially, or liquid spraying and liquid suction holes are closely arranged; the cross-section of the slit and the hole is rectangular or trapezoidal, and can be segmented into rectangular and trapezoidal sections; the different forms of the slit and hole cross-sections are suitable for different working conditions, so as to realize the spraying of liquid flow in a water knife or fan-shaped manner, or the suction of liquid in a direct suction or converging manner.

5. The electroplating equipment according to claim 1, wherein the workpiece is placed vertically and rotates continuously, the contact is dynamically pressed to supply power, and the electroplating liquid is applied and sucked at a close distance by the liquid delivery pipe and the liquid collection pipe, respectively, characterized in that: Corresponding to the spatial position of the fixture, an air blowing head and a heating head are arranged in close proximity. The air blowing head is used to deliver a high-speed gas flow in the forward direction of the workpiece surface to form a long strip air knife, which generates negative pressure to remove the liquid from the workpiece surface, thereby improving the drainage effect of the workpiece without spatial dead corners such as concave and convex obstructions; the heating head is used to deliver high-density thermal energy perpendicularly to the workpiece surface to form a long strip hot knife, which interacts thermally with the material to heat, gasify and dry the material on the workpiece surface, thereby improving the cleaning and drying processing capabilities of the workpiece; Preferably, a long strip scraper blade elastic contact scanning electrode is provided corresponding to the spatial position of the fixture as the second electrode of the device; the second electrode is in the shape of a long strip, one side of which is a scraper blade linear structure, and the other side is connected to a wire. In the working state, the blade dynamically elastically contacts the surface of the workpiece, contacts the surface of the workpiece in a linear manner, and connects the isolated conductive pattern on the surface of the workpiece in contact with it to the power supply to form a circuit loop, so that the metal ions in the liquid on the surface of the isolated conductive pattern obtain electrons and are deposited on the surface of the isolated conductive pattern. As the workpiece rotates, the blade line contact traverses and scans the entire surface of the workpiece to complete the electroplating of the isolated / separated / discrete conductive pattern on the entire plate; Preferably, the long strip scraper blade spring-pressed contact scanning electrode is fixed in the processing chamber by a clamping structure, parallel to the vertically placed workpiece fixture and the clamped workpiece; the clamping structure consists of two parts, one part is a fixed part, which is fixedly connected to the processing chamber and is a support body of the locking and releasing mechanism; the other part is the locking and releasing mechanism, in the locked state, the blade of the electrode is in elastic contact with the surface of the workpiece and is in a working state; Preferably, a flexible conductive wire is connected to the other end of the long scraper blade spring-pressed contact scanning electrode, and the conductive wire is sealed with an insulating, corrosion-resistant and waterproof sheath to connect the contact electrode to the negative pole of the electroplating power supply in the supply bin.

6. The electroplating equipment according to claim 1, wherein the workpiece is placed vertically and rotates continuously, the contact is dynamically pressed to supply power, and the electroplating liquid is applied and sucked at a close distance by the liquid delivery and collection pipes, respectively, characterized in that: Circulating chains are set on the top of the processing bin and the upper and lower bins to convert rotational motion into linear motion and transport the fixture with the workpiece to different positions; the structure of the chain matches the tooth shape of the passive gear composed of the workpiece fixture, and its two ends are fixed and meshed by gears driven by the transmission motor, which is controlled by the motion control system of the equipment; the conveying chain is fixedly installed and runs through the upper and lower bins of the processing bin, and free curtains are set at the interfaces between the bins where the conveying chain passes to reduce the cross-flow of materials between bins.

7. The electroplating equipment according to claim 1, wherein the workpiece is placed vertically and rotates continuously, the contact is dynamically pressed to supply power, and the electroplating liquid is applied and sucked at a close distance by the liquid delivery and collection pipes, respectively, characterized in that: A circular anode is arranged in the processing chamber, parallel to the workpiece fixture and the workpiece clamped therein, and its shape and size match those of the workpiece fixture and the workpiece clamped therein; one end of the anode is electrically connected to a flexible conductive wire through a contact, and the conductive wire is sealed with an insulating, corrosion-resistant and waterproof foreskin, and is connected to the positive pole of the electroplating power supply in the chamber.

8. The electroplating equipment according to claim 1, wherein the workpiece is placed vertically and rotates continuously, the contact is dynamically pressed to supply power, and the electroplating liquid is applied and sucked at a close distance by the liquid delivery and collection pipes, respectively, characterized in that: In order to maintain the consistency and stability of the processing, the flat conductive surface of the flat part of the outer circular disc of the fixture for clamping the workpiece, the contact surface that contacts the flat conductive part of the disc of the outer edge of the fixture and is connected to the negative electrode of the electroplating power supply, the contact surface of the long scraper blade that is pressed and contacts the scanning electrode, and the circular anode surface in the processing chamber are selected from conductive materials with high surface chemical inertness and then surface treated. Preferably, the highly inert materials include graphite and conductive ceramics. Alternatively, a conductive metal material that has been passivated and hydrophobized can be selected; in order to maintain the consistency and stability of the processing, in addition to the above-mentioned surface-treated conductors and the surface of the workpiece that needs to be electroplated and removed by electrolysis, the parts of the conductors in the processing chamber that do not need to contact the workpiece need to be coated with insulating anti-metal deposition materials.

9. An etching device for vertically placing and continuously rotating workpieces, having close-range application, suction, blowing, and heating processing functions, characterized in that: The fixture for loading workpieces is used as the main fixture, and the function, internal structure, and internal size of the main fixture are matched or changed. A fixture that is smaller than the main fixture but can load multiple workpieces at the same time is set as a sub-fixture to load multiple discrete workpieces for simultaneous processing.

10. According to claim 9, the etching equipment with close-range application, suction, blowing and heating processing functions for vertically placing and continuously rotating workpieces is characterized in that: a plurality of processing and supply units are arranged in the processing chamber and the supply chamber, and a one-chamber multi-unit structure is used to accommodate and support a plurality of fixtures for clamping the workpiece, and processing is performed simultaneously to improve the production efficiency of the equipment; a plurality of single-unit processing chambers, supply chambers and fixtures for clamping workpieces are connected together, and a multi-single-unit chamber interconnection structure is used to accommodate and support a plurality of fixtures for clamping workpieces, and processing is performed simultaneously to improve the production efficiency of the equipment; a plurality of one-chamber multi-unit structures and multi-single-unit chamber interconnection structures are connected together to accommodate and support a plurality of fixtures for clamping workpieces, and processing is performed simultaneously to improve the production efficiency of the equipment.

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