Cleaning device, cleaning method thereof and etching equipment

Abstract

The invention provides a cleaning device and a cleaning method thereof, and etching equipment, and the cleaning device comprises a first cleaning chamber, a first cleaning transmission mechanism which is disposed in the first cleaning chamber and is used for bearing and transmitting a substrate, a first cleaning spraying mechanism which sprays a cleaning solution to the substrate, an ultrasonic cleaning tank, and a lifting mechanism. The ultrasonic cleaning tank comprises a cleaning tank containing cleaning liquid and ultrasonic vibrator sets located on the cleaning tank and the side, away from the first cleaning conveying mechanism, of the cleaning tank, and the lifting mechanism is located on the side, away from the first cleaning conveying mechanism, of the cleaning tank and drives the cleaning tank to be close to or away from the first cleaning conveying mechanism. According to the cleaning device, the cleaning liquid in the cleaning tank is immersed in or separated from the substrate, the etched substrate is cleaned through the first cleaning and spraying mechanism and the ultrasonic cleaning tank at the same time, residual etching liquid and residual material particles on the surface of the substrate can be rapidly and deeply cleaned and replaced, and the washing replacement capacity of the cleaning device is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of display panel manufacturing, and in particular to a cleaning device and a cleaning method thereof, and an etching device. Background Art

[0002] With the development of display technology, self-aligned pixelation technology without metal mask has emerged. This technology realizes pixel patterning through photolithography process, which can effectively improve the pixel density and aperture ratio of display panel. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, CN118660589A record the relevant contents of fine metal mask-free technology and isolation structure (or partition structure or isolation column) for reference.

[0003] However, the manufacturing process related to display panels formed without fine metal mask technology still needs to be optimized. Summary of the invention

[0004] In view of this, the purpose of the present disclosure is to provide a cleaning device and a cleaning method thereof, and an etching device to improve the cleaning ability of a substrate.

[0005] Based on the above objectives, the present disclosure discloses a cleaning device, which includes: a first cleaning chamber; A first cleaning and transporting mechanism, located in the first cleaning chamber, and used for carrying and transporting the substrate to be cleaned; a first cleaning spray mechanism, arranged opposite to the first cleaning transmission mechanism, and configured to spray a cleaning liquid onto the substrate to be cleaned; An ultrasonic cleaning tank is located in the first cleaning chamber and on a side of the first cleaning transmission mechanism away from the first cleaning spray mechanism, the ultrasonic cleaning tank comprises a cleaning tank and an ultrasonic vibrator group, a cleaning liquid is provided in the cleaning tank, the ultrasonic vibrator group is connected to the cleaning tank and is located on a side of the cleaning tank away from the first cleaning transmission mechanism; The lifting mechanism is located at a side of the cleaning tank away from the first cleaning and transporting mechanism, and the lifting mechanism drives the cleaning tank to approach or move away from the first cleaning and transporting mechanism so that the cleaning liquid in the cleaning tank is immersed in or separated from the substrate to be cleaned.

[0006] In one embodiment, the first cleaning conveying mechanism comprises a plurality of first cleaning rollers arranged in parallel along the conveying direction, and adjacent first cleaning rollers are arranged at intervals. The cleaning tank includes a first side plate and a second side plate that are oppositely arranged in the transmission direction. In the transmission direction, the sizes of the first side plate and the second side plate are both smaller than the minimum interval between any two of the first cleaning rollers.

[0007] In one embodiment, when the cleaning liquid in the cleaning tank submerges the substrate to be cleaned, the distance from the liquid level of the cleaning liquid to the upper surface of the substrate to be cleaned carried by the first cleaning transmission mechanism is less than or equal to 3 millimeters.

[0008] In one embodiment, when the cleaning liquid in the cleaning tank submerges the substrate to be cleaned, the distance from the liquid level of the cleaning liquid to the upper surface of the substrate to be cleaned carried by the first cleaning transmission mechanism is between 0.1 - 1 millimeter.

[0009] In one embodiment, the ultrasonic oscillator group includes a plurality of ultrasonic oscillators, and the plurality of ultrasonic oscillators are distributed at the four corners and the center position of the surface of the cleaning tank facing away from the first cleaning transmission mechanism.

[0010] In one embodiment, the bottom wall of the cleaning tank is provided with a liquid inlet communicating with the cleaning tank, and the bottom wall of the first cleaning chamber is provided with a liquid discharge port communicating with the first cleaning chamber.

[0011] In one embodiment, the cleaning device further includes at least one second cleaning chamber located downstream of the first cleaning chamber. Each second cleaning chamber is provided with a second cleaning transmission mechanism and a second cleaning spray mechanism oppositely arranged with the second cleaning transmission mechanism. The first cleaning spray mechanism and the second cleaning spray mechanism both include a spray pipe and a plurality of cleaning spray nozzles arranged on the spray pipe. The plurality of cleaning spray nozzles are arranged at equal intervals, and the cleaning spray nozzles face the substrate.

[0012] In one embodiment, the cleaning spray nozzles are inclined on the spray pipe, and the inclination directions of the cleaning spray nozzles in adjacent cleaning chambers are opposite; Or, the plurality of cleaning spray nozzles in the first cleaning chamber include at least two groups of cleaning spray nozzle groups. Each group of cleaning spray nozzle groups includes at least two of the cleaning spray nozzles. The cleaning spray nozzles are inclined on the spray pipe, and the inclination directions of the cleaning spray nozzles in adjacent cleaning spray nozzle groups are opposite; Or, the plurality of cleaning spray nozzles in each cleaning chamber include at least two groups of cleaning spray nozzle groups. Each group of cleaning spray nozzle groups includes at least two of the cleaning spray nozzles. The cleaning spray nozzles are inclined on the spray pipe and the inclination directions of the cleaning spray nozzles in adjacent cleaning spray nozzle groups are opposite; Alternatively, the multiple cleaning spray nozzles in the first cleaning chamber include at least three groups of cleaning spray nozzle groups, each group of cleaning spray nozzle groups includes at least two of the cleaning spray nozzles, the at least three groups of cleaning spray nozzle groups include a third cleaning spray nozzle group, a fourth cleaning spray nozzle group, and a fifth cleaning spray nozzle group arranged in sequence along the transportation direction, the cleaning spray nozzles in the fourth cleaning spray nozzle group are vertically arranged on the spray pipe, the cleaning spray nozzles in the third cleaning spray nozzle group and the fifth cleaning spray nozzle group are both inclinedly arranged on the spray pipe, and the inclination directions of the cleaning spray nozzles in the third cleaning spray nozzle group and the fifth cleaning spray nozzle group are opposite; Alternatively, the multiple cleaning spray nozzles in each cleaning chamber include at least three groups of cleaning spray nozzle groups, each group of cleaning spray nozzle groups includes at least two of the cleaning spray nozzles, the at least three groups of cleaning spray nozzle groups include a third cleaning spray nozzle group, a fourth cleaning spray nozzle group, and a fifth cleaning spray nozzle group arranged in sequence along the transportation direction, the cleaning spray nozzles in the fourth cleaning spray nozzle group are vertically arranged on the spray pipe, the cleaning spray nozzles in the third cleaning spray nozzle group and the fifth cleaning spray nozzle group are both inclinedly arranged on the spray pipe, and the inclination directions of the cleaning spray nozzles in the third cleaning spray nozzle group and the fifth cleaning spray nozzle group are opposite; The inclination direction includes the upstream or downstream direction towards the corresponding cleaning chamber.

[0013] In one embodiment, the cleaning liquid includes ultrapure water or deionized water.

[0014] Based on the same inventive concept, the present disclosure also provides a cleaning method for a cleaning device, the cleaning method including the following steps: Transfer the substrate to the first cleaning chamber; Immerse the substrate in the cleaning liquid in the cleaning tank, and the distance between the upper surface of the substrate and the liquid level of the cleaning liquid is less than or equal to 3 millimeters; Clean the substrate by simultaneously spraying and flushing with the cleaning liquid and ultrasonic cleaning.

[0015] In one embodiment, the distance between the upper surface of the substrate and the liquid level of the cleaning liquid is between 0.1 - 1 millimeter.

[0016] In one embodiment, after the step of simultaneously cleaning the substrate by spraying and flushing with the cleaning liquid and ultrasonic cleaning, the method further includes: Separate the substrate from the cleaning liquid in the cleaning tank and transfer the substrate to at least one second cleaning chamber; Rinse the substrate by inclinedly spraying the cleaning liquid, and the directions of spraying the cleaning liquid in adjacent cleaning chambers are opposite; Alternatively, in the first cleaning chamber, the cleaning liquid is sprayed obliquely to rinse the substrate, and the cleaning liquid spraying directions of adjacent cleaning spray nozzle groups in the first cleaning chamber are opposite; Alternatively, in each of the cleaning chambers, the cleaning liquid is sprayed obliquely to rinse the substrate, and the cleaning liquid spraying directions of adjacent cleaning spray nozzle groups in each cleaning chamber are opposite; Alternatively, in the first cleaning chamber, the substrate is rinsed by spraying the cleaning liquid vertically and by spraying the cleaning liquid obliquely at the same time, and the oblique spraying of the cleaning liquid includes spraying the cleaning liquid by using two groups of the cleaning spray nozzles with opposite oblique directions; Alternatively, in each of the cleaning chambers, the substrate is rinsed simultaneously by vertically spraying the cleaning liquid and obliquely spraying the cleaning liquid, and the obliquely spraying the cleaning liquid includes spraying the cleaning liquid by using two groups of cleaning spray nozzles with opposite oblique directions.

[0017] Based on the same inventive concept, the present disclosure also provides an etching device, which includes: The etching device comprises a plurality of etching chambers, each of which is provided with an etching transmission mechanism and an etching spray mechanism arranged opposite to the etching transmission mechanism; As described above, the cleaning device is located upstream of the etching device.

[0018] In one embodiment, the etching device further comprises: A conveying device, wherein the conveying device is arranged upstream of the etching device and is located above the etching device; A lifting device, the lifting device is connected to the conveying device and the etching device; The conveying device includes a conveying chamber, in which a conveying mechanism and an organic matter processing mechanism arranged opposite to the conveying mechanism are arranged. The organic matter processing mechanism is arranged at one end of the conveying chamber close to the lifting device, and the organic matter processing mechanism includes a plurality of ultraviolet lamp tubes.

[0019] In one embodiment, the etching device further comprises: An air-drying device, wherein the air-drying device is located downstream of the cleaning device, and the air-drying device includes an air-drying chamber, wherein an air-drying transmission mechanism and an air knife are arranged in the air-drying chamber, wherein the air-drying transmission mechanism is used to carry and transmit the substrate, and the air knife is located on the side of the substrate away from the air-drying transmission mechanism and / or the air knife is located on the side of the air-drying transmission mechanism away from the substrate.

[0020] Compared with the prior art, the cleaning device, its cleaning method, and the etching equipment provided by the present disclosure can quickly replace a large amount of etching solution and residual material particles on the substrate surface by setting a cleaning tank to submerge the cleaning solution in the cleaning tank. At the same time, ultrasonic oscillators are arranged at the bottom of the cleaning tank, which can drive the cleaning solution in the cleaning tank to vibrate ultrasonically, so as to clean the tiny liquid medicine residues and material particle residues in the special structure of the product; therefore, by simultaneously cleaning the etched substrate with the first cleaning spray mechanism and the ultrasonic cleaning tank, the residual etching solution and residual material particles on the substrate surface can be quickly and deeply cleaned and replaced, avoiding the continuous etching of the film layer, and further improving the water washing and replacement ability of the cleaning device in the etching equipment, meeting the requirements of high-quality product etching. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the present disclosure or related technologies, the following will briefly introduce the drawings required for use in the embodiments or related technology descriptions. Obviously, the drawings described below are only the embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 is a sectional view of the cleaning device in the prior art; Figure 2 is a sectional view of the first cleaning chamber provided by the embodiment of the present application Figure 1 ; Figure 3 is a sectional view of the first cleaning chamber provided by the embodiment of the present application Figure 2 ; Figure 4 is a partial sectional view of the cleaning device provided by the embodiment of the present application Figure 1 ; Figure 5 is a partial sectional view of the cleaning device provided by the embodiment of the present application Figure 2 ; Figure 6 is a sectional view of the cleaning device provided by the embodiment of the present application; Figure 7 is a schematic structural diagram of the etching equipment provided by the embodiment of the present application; Figure 8 is a sectional view of the conveying device provided by the embodiment of the present application; Figure 9 is a sectional view of the etching device provided by the embodiment of the present application; Figure 10 is a sectional view of the air drying chamber provided by the embodiment of the present application; Figure 11 is a schematic flow diagram of the cleaning method provided by the embodiment of the present application; Figure 12Partial cross-sectional schematic diagram of the display panel provided by the embodiment of the present application.

[0023] Reference numerals: 10, Feeding device; 20, Conveying device; 21, Conveying chamber; 22, Conveying and transmission mechanism; 23, Organic matter treatment mechanism; 30, Lifting device; 40, Etching device; 41, Etching chamber; 41a, First etching chamber; 41b, Second etching chamber; 41c, Third etching chamber; 42, Etching and transmission mechanism; 43, Etching spray mechanism; 44, Air curtain blowing mechanism; 45, First buffer chamber; 50, Cleaning device; 51a, First cleaning chamber; 51b, Second cleaning chamber; 51c, Third cleaning chamber; 51d, Fourth cleaning chamber; 511, Drain port; 52a, First cleaning and transmission mechanism; 521a, First cleaning roller; 52b, Second cleaning and transmission mechanism; 521b, Second cleaning roller; 53a, First cleaning spray mechanism; 53b, Second cleaning spray mechanism; 531, Spray pipe; 532, Spray nozzle; 5321, Cleaning spray nozzle group; 5321a, First cleaning spray nozzle group; 5321b, Second cleaning spray nozzle group; 5321c, Third cleaning spray nozzle group; 5321d, Fourth cleaning spray nozzle group; 5321e, Fifth cleaning spray nozzle group; 54, Ultrasonic cleaning tank; 541, Cleaning tank; 5411, First side plate; 5412, Second side plate; 5413, Liquid inlet; 542, Ultrasonic oscillator group; 5421, Ultrasonic oscillator; 55, Lifting mechanism; 60, Drying device; 61, Air drying chamber; 62, Air drying and transmission mechanism; 63, Air knife; 64, Second buffer chamber; 70, Discharging device; 80, Substrate; 110, Array substrate; 120, Pixel definition layer; 130, Isolation structure; 140, Light-emitting unit; 150, First encapsulation layer; 160, Second encapsulation layer; 170, Third encapsulation layer; 131, Shielding portion; 132, Second support portion; 133, First support portion; 141, First electrode; 142, Light-emitting functional layer; 143, Second electrode. Detailed implementation manners

[0024] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings to prove that the present invention can be implemented. The embodiments of the present invention can fully introduce the present invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and the protection scope of the present invention is not limited to the embodiments mentioned in the text.

[0025] In the drawings, components with the same structure are denoted by the same numeral labels, and components with similar structures or functions everywhere are denoted by similar numeral labels. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of some components in the drawings is appropriately exaggerated.

[0026] In addition, the following description of the embodiments of the present invention refers to the attached drawings to illustrate specific embodiments in which the present invention can be implemented. The directional terms mentioned in the present invention, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0027] When some components are described as "on" another component, the component can be directly placed on the other component; there can also be an intermediate component, the component is placed on the intermediate component, and the intermediate component is placed on another component. When a component is described as "mounted to" or "connected to" another component, the two can be understood as directly "mounted" or "connected", or a component is indirectly "mounted to" or "connected to" another component through an intermediate component.

[0028] Currently, in the process of manufacturing a display panel, cleaning is required in many steps to remove residual material particles and residual etching liquid, etc. from the previous steps. Refer to Figure 1 , in order to improve the cleaning efficiency, multiple cleaning chambers may be provided. Each cleaning chamber is provided with a cleaning spray nozzle 100, and the substrate 800 is cleaned by spraying a cleaning liquid. Since the relative distance between the cleaning spray nozzle and the substrate 800 is relatively far, the water washing pressure and flow rate are relatively low when washing onto the substrate 800, and the ability to quickly clean the residual etching liquid and residual material particles on the surface of the substrate 800 is poor. If there is residual etching liquid or residual material particles, etc. on the substrate 800, over-etching or dark spots caused by residual material particles will occur in this area on the substrate 800, etc.

[0029] For the above reasons, embodiments of the present application provide a cleaning device 50, a cleaning method thereof, and an etching device. The cleaning device 50 includes a first cleaning chamber 51a, and a first cleaning transfer mechanism 52a, a first cleaning spraying mechanism 53a, an ultrasonic cleaning tank 54, and a lifting mechanism 55 disposed in the first cleaning chamber 51a. The first cleaning transfer mechanism 52a is used to carry and transfer a substrate 80 to be cleaned. The first cleaning spraying mechanism 53a is disposed opposite to the first cleaning transfer mechanism 52a, and the first cleaning spraying mechanism 53a is used to spray a cleaning liquid onto the substrate 80 to be cleaned and rinse the substrate 80 to be cleaned. The ultrasonic cleaning tank 54 is located on a side of the first cleaning transfer mechanism 52a away from the first cleaning spraying mechanism 53a. The ultrasonic cleaning tank 54 includes a cleaning tank 541 and an ultrasonic oscillator group 542. A cleaning liquid is disposed in the cleaning tank 541. The ultrasonic oscillator group 542 is connected to the cleaning tank 541 and is located on a side of the cleaning tank 541 facing away from the first cleaning transfer mechanism 52a. The lifting mechanism is located on a side of the cleaning tank 541 away from the first cleaning transfer mechanism 52a. The lifting mechanism 55 drives the cleaning tank 541 to approach or move away from the first cleaning transfer mechanism 52a, so that the cleaning liquid in the cleaning tank 541 submerges or separates from the substrate 80 to be cleaned. In the present application, by providing the cleaning tank 541, the residual etching liquid and residual material particles on the surface of the substrate 80 can be quickly replaced by a large amount of cleaning liquid. At the same time, an ultrasonic oscillator group is disposed at the bottom of the cleaning tank 541, which can drive the cleaning liquid in the cleaning tank 541 to perform ultrasonic vibration, so as to clean the tiny liquid medicine residues and material particle residues in the special structure of the product. Therefore, by simultaneously cleaning the etched substrate through the first cleaning spraying mechanism 53a and the ultrasonic cleaning tank 54, the residual etching liquid and residual material particles on the surface of the substrate 80 can be quickly and deeply cleaned and replaced, avoiding continuous etching of the film layer, and further improving the water washing and replacement ability of the cleaning device 50 in the etching device, meeting the requirements for high-quality product etching.

[0030] Next, in combination with Figures 2 - 6 the cleaning device 50 provided by the embodiments of the present application will be described. The cleaning device 50 is the cleaning device 50 in the etching device, and is used to clean the etched substrate 80 to remove the residual etching liquid and residual material particles on the surface of the substrate 80.

[0031] Refer to Figure 4 and Figure 5, the cleaning device 50 includes a plurality of cleaning chambers, and the plurality of cleaning chambers may include a first cleaning chamber 51a and at least one second cleaning chamber. At least one second cleaning chamber is located downstream of the first cleaning chamber 51a. It can also be understood that the etched substrate 80 first enters the first cleaning chamber 51a for cleaning and then enters at least one second cleaning chamber for cleaning. Since the etched liquid and material particles remain on the etched substrate 80, if the first cleaning chamber 51a does not quickly and deeply displace the etched liquid and residual material particles remaining on the surface of the substrate 80, continuous etching of the film layer of the substrate 80 will occur, resulting in local product abnormalities and affecting product quality. Therefore, in this application, the first cleaning chamber 51a of the cleaning device 50 is optimized, so that the etched liquid and residual material particles remaining on the surface of the substrate 80 can be quickly and deeply displaced in the first cleaning chamber 51a, avoiding continued etching of the film layer.

[0032] In this application, for the sake of clear description, the direction along the movement of the substrate is defined as the downstream, and the direction against the movement of the substrate is defined as the upstream.

[0033] Reference Figures 2 - 5 , a first cleaning transfer mechanism 52a, a first cleaning spraying mechanism 53a, an ultrasonic cleaning tank 54, and a lifting mechanism 55 are arranged in the first cleaning chamber 51a of the cleaning device 50. The first cleaning transfer mechanism 52a is used to carry and transfer the substrate 80 to be cleaned; the first cleaning spraying mechanism 53a is arranged opposite to the first cleaning transfer mechanism 52a, and the first cleaning spraying mechanism 53a is used to spray cleaning liquid onto the substrate 80 to be cleaned to wash the substrate 80 to be cleaned. The ultrasonic cleaning tank 54 is located on the side of the first cleaning transfer mechanism 52a away from the first cleaning spraying mechanism 53a. The ultrasonic cleaning tank 54 includes a cleaning tank 541 and an ultrasonic oscillator group 542 located on the side of the cleaning tank 541 facing away from the first cleaning transfer mechanism 52a. A cleaning liquid is arranged in the cleaning tank 541; the lifting mechanism is located on the side of the cleaning tank 541 away from the first cleaning transfer mechanism 52a, and the lifting mechanism drives the cleaning tank 541 to approach or move away from the first cleaning transfer mechanism 52a, so that the cleaning liquid in the cleaning tank 541 submerges or separates from the substrate 80 to be cleaned. In this embodiment, by arranging the cleaning tank 541, the etched liquid and residual material particles remaining on the surface of the substrate 80 can be quickly displaced by a large amount of cleaning liquid. At the same time, an ultrasonic oscillator group is arranged at the bottom of the cleaning tank 541, which can drive the cleaning liquid in the cleaning tank 541 to perform ultrasonic vibration, so as to clean the tiny liquid medicine residues and material particle residues in the special structure of the product.

[0034] Reference Figure 2, in one embodiment, when the cleaning liquid in the cleaning tank 54 submerges the substrate to be cleaned, the distance d from the liquid level of the cleaning liquid to the upper surface of the substrate to be cleaned carried by the first cleaning transfer mechanism is less than or equal to 3 millimeters (such as 3 millimeters, 2.5 millimeters, 2 millimeters, 1.5 millimeters, 1 millimeter, 0.5 millimeter, 0.1 millimeter). Such a design can ensure that the cleaning liquid in the first cleaning spray mechanism can be rinsed onto the surface of the substrate to be cleaned. Further, when the cleaning liquid in the cleaning tank 54 submerges the substrate to be cleaned, the distance d from the liquid level of the cleaning liquid to the upper surface of the substrate to be cleaned carried by the first cleaning transfer mechanism is between 0.1 - 1 millimeter (such as 1 millimeter, 0.9 millimeter, 0.8 millimeter, 0.7 millimeter, 0.6 millimeter, 0.5 millimeter, 0.4 millimeter, 0.3 millimeter, 0.2 millimeter, 0.1 millimeter). Such a design can not only ensure that the cleaning liquid in the cleaning tank submerges the substrate to be cleaned, but also is beneficial to improving the rinsing effect of the first cleaning spray mechanism, thereby improving the cleaning ability of the substrate.

[0035] Reference Figures 2 - 6 , the cleaning device 50 is provided with at least one second cleaning chamber. By providing multiple second cleaning chambers, the cleaning speed of the cleaning device 50 can be improved. Exemplarily, in this embodiment, three second cleaning chambers are provided downstream of the first cleaning chamber 51a. Of course, two, four, or five second cleaning chambers can also be provided. The number of second cleaning chambers can be determined according to the actual production needs and will not be specifically limited here. In this embodiment, three second cleaning chambers are taken as an example for illustration. Among them, the three second cleaning chambers can be the second cleaning chamber 51b (which can be understood as the first second cleaning chamber), the third cleaning chamber 51c (which can be understood as the second second cleaning chamber), and the fourth cleaning chamber 51d (which can be understood as the third second cleaning chamber). In this embodiment, each second cleaning chamber is provided with a second cleaning transfer mechanism 52b and a second cleaning spray mechanism 53b disposed opposite to the second cleaning transfer mechanism 52b. The second cleaning spray mechanism 53b is used to spray cleaning liquid on the surface of the substrate 80.

[0036] Reference Figures 2 - 4 , in one embodiment, both the first cleaning transfer mechanism 52a and the second cleaning transfer mechanism 52b include a plurality of cleaning rollers arranged side by side along the transfer direction, and adjacent cleaning rollers are spaced apart. The substrate 80 is conveyed by the rotation of the cleaning rollers.

[0037] Exemplarily, the first cleaning transport mechanism 52a includes a plurality of first cleaning rollers 521a arranged side by side in the transport direction, with adjacent first cleaning rollers 521a spaced apart. The second cleaning transport mechanism 52b includes a plurality of second cleaning rollers 521b arranged side by side in the transport direction, with adjacent second cleaning rollers 521b spaced apart. It should be noted that in this embodiment, the first cleaning rollers 521a and the second cleaning rollers 521b have the same structure, but are located in different cleaning chambers.

[0038] Reference Figure 2 , in one embodiment, the cleaning tank 541 includes a first side plate 5411 and a second side plate 5412 that are oppositely arranged in the transport direction. In the transport direction (the direction indicated by the arrow in the figure), the sizes of the first side plate 5411 and the second side plate 5412 may or may not be equal, and there are no excessive requirements here. However, in the transport direction, the sizes of both the first side plate 5411 and the second side plate 5412 are smaller than the minimum interval between any two first cleaning rollers 521a, that is, the size of the first side plate 5411 is smaller than the minimum interval between any two first cleaning rollers 521a, and at the same time, the size of the second side plate 5412 is also smaller than the minimum interval between any two first cleaning rollers 521a. Such a design enables the first side plate 5411 and the second side plate 5412 of the cleaning tank 541 to pass through the gap between adjacent first cleaning rollers 521a when the lifting mechanism drives the cleaning tank 541 to rise, so that the cleaning liquid in the cleaning tank 541 can submerge the substrate 80.

[0039] As Figure 2 shown, the first side plate 5411 and the second side plate 5412 of the cleaning tank 541 can pass through the gap between adjacent first cleaning rollers 521a, so that the cleaning liquid in the cleaning tank 541 can submerge the substrate 80. At this time, the ultrasonic cleaning tank is in the open state. As Figure 3 shown, the cleaning tank 541 is located on the side of the first cleaning transport mechanism 52a away from the substrate, and at this time, the ultrasonic cleaning tank is in the closed state.

[0040] Reference Figure 2 and Figure 3 , in one embodiment, the ultrasonic oscillator group 542 includes a plurality of ultrasonic oscillators 5421. The plurality of ultrasonic oscillators 5421 are distributed at the four corners and the center position of the surface of the cleaning tank 541 on the side away from the first cleaning transport mechanism 52a. The ultrasonic oscillator 5421 is electrically connected to the ultrasonic generator and is used to cause ultrasonic vibration of the cleaning liquid in the cleaning tank 541, which can clean the tiny liquid medicine residues and material particle residues in the special structure of the product, and enhance the cleaning depth of the cleaning liquid.

[0041] Reference Figure 2, in one embodiment, a liquid inlet 5413 communicating with the cleaning tank 541 is provided on the bottom wall of the cleaning tank 541. The liquid inlet 5413 is connected to an external water source to continuously supplement the cleaning liquid into the cleaning tank 541. Since the accommodation space of the cleaning tank 541 is limited, while supplementing the cleaning liquid, a corresponding amount of cleaning liquid will overflow from the top of the cleaning tank 541, thereby realizing the replacement of the cleaning liquid in the cleaning tank 541. Further, a drain port 511 communicating with the first cleaning chamber 51a is provided on the bottom wall of the first cleaning chamber 51a. The cleaning liquid overflowing from the top of the cleaning tank 541 and the cleaning liquid sprayed by the spraying mechanism are discharged from the first cleaning chamber 51a through the drain port 511.

[0042] Exemplarily, the cleaning liquid in this embodiment can be a substrate 80 detergent, which can specifically include ultrapure water or deionized water.

[0043] Reference Figures 2 - 5 , in one embodiment, both the first cleaning spraying mechanism 53a and the second cleaning spraying mechanism 53b include a spraying pipe 531 and a plurality of spraying nozzles 532 provided on the spraying pipe 531. The plurality of spraying nozzles 532 are arranged at equal intervals, and the spraying nozzles 532 are arranged facing the substrate 80. The spraying pipe 531 is connected to a cleaning liquid source outside the cleaning chamber, and the cleaning liquid is sprayed onto the surface of the substrate 80 through the spraying nozzles 532 to realize the cleaning of the surface of the substrate 80.

[0044] Reference Figure 6 , in an alternative embodiment, the cleaning spraying nozzles 532 are inclined on the spraying pipe 531, and the inclination directions of the cleaning spraying nozzles 532 in adjacent cleaning chambers are opposite. For example, in this embodiment, the cleaning spraying nozzles 532 in each cleaning chamber are inclined on the spraying pipe 531. Among them, the cleaning spraying nozzles 532 in the first cleaning chamber 51a and the third cleaning chamber 51c are inclined on the spraying pipe 531 along the inclination direction, and the cleaning spraying nozzles 532 in the second cleaning chamber 51b and the fourth cleaning chamber 51d are inclined on the spraying pipe 531 along the direction opposite to the inclination direction. Such a design can enable the plurality of cleaning spraying nozzles to wash the substrate from two angles, improving the cleaning power of the substrate washing.

[0045] Reference Figure 2, in an alternative embodiment, the multiple cleaning spray nozzles 532 in the first cleaning chamber 51a include at least two groups of cleaning spray nozzle groups 5321. Each group of cleaning spray nozzle groups 5321 includes at least two cleaning spray nozzles 532. The cleaning spray nozzles 532 are inclinedly arranged on the spray pipe 531, and the inclination directions of the cleaning spray nozzles 532 in adjacent cleaning spray nozzle groups 5321 are opposite. In this embodiment, at least two groups of cleaning spray nozzle groups 5321 include a first cleaning spray nozzle group 5321a and a second cleaning spray nozzle group 5321b arranged in sequence along the transport direction. The cleaning spray nozzles 532 in the first cleaning spray nozzle group 5321a are arranged on the spray pipe 531 along the inclination direction, and the cleaning spray nozzles 532 in the second cleaning spray nozzle group 5321b are inclinedly arranged on the spray pipe 531 along the direction opposite to the inclination direction. Such a design enables the multiple spray nozzles in the first cleaning chamber to wash the substrate from two angles, further improving the cleaning power of the first cleaning spray mechanism in the first cleaning chamber on the substrate.

[0046] Reference Figure 4 , in an alternative embodiment, the multiple cleaning spray nozzles in each cleaning chamber include at least two groups of cleaning spray nozzle groups 5321. Each group of cleaning spray nozzle groups 5321 includes at least two cleaning spray nozzles 532. The cleaning spray nozzles are inclinedly arranged on the spray pipe, and the inclination directions of the cleaning spray nozzles 532 in adjacent cleaning spray nozzle groups 5321 are opposite. In this embodiment, at least two groups of cleaning spray nozzle groups 5321 include a first cleaning spray nozzle group 5321a and a second cleaning spray nozzle group 5321b arranged in sequence along the transport direction. The cleaning spray nozzles 532 in the first cleaning spray nozzle group 5321a are arranged on the spray pipe 531 along the inclination direction, and the cleaning spray nozzles 532 in the second cleaning spray nozzle group 5321b are inclinedly arranged on the spray pipe along the direction opposite to the inclination direction. In this embodiment, the multiple cleaning spray nozzles in each cleaning chamber wash the substrate from two angles, further improving the cleaning power on the substrate.

[0047] Reference Figure 4, in an alternative embodiment, the multiple cleaning spray nozzles in the first cleaning chamber 51a include at least three groups of cleaning spray nozzle groups 5321. Each group of cleaning spray nozzle groups 5321 includes at least two cleaning spray nozzles. The at least three groups of cleaning spray nozzle groups 5321 include a third cleaning spray nozzle group 5321c, a fourth cleaning spray nozzle group 5321d, and a fifth cleaning spray nozzle group 5321e arranged in sequence along the transport direction. The cleaning spray nozzles 532 in the fourth cleaning spray nozzle group 5321d are vertically arranged on the spray pipe 531. The cleaning spray nozzles 532 in the third cleaning spray nozzle group 5321c and the fifth cleaning spray nozzle group 5321e are both inclinedly arranged on the spray pipe 531, and the inclination directions of the cleaning spray nozzles in the third cleaning spray nozzle group 5321c and the fifth cleaning spray nozzle group 5321e are opposite. In this embodiment, the cleaning spray nozzles in the fourth cleaning spray nozzle group 5321d are vertically arranged on the spray pipe, the cleaning spray nozzles in the third cleaning spray nozzle group 5321c are arranged on the spray pipe along the inclined direction, and the cleaning spray nozzles in the fifth cleaning spray nozzle group 5321e are inclinedly arranged on the spray pipe along the direction opposite to the inclined direction. Such a design enables the multiple spray nozzles in the first cleaning chamber to wash the substrate from three angles, further improving the cleaning power of the first cleaning spray mechanism in the first cleaning chamber for the substrate.

[0048] Reference Figure 5 , in an alternative embodiment, the multiple cleaning spray nozzles in each cleaning chamber include at least three groups of cleaning spray nozzle groups 5321. Each group of cleaning spray nozzle groups 5321 includes at least two cleaning spray nozzles 532. The at least three groups of cleaning spray nozzle groups 5321 include a third cleaning spray nozzle group 5321c, a fourth cleaning spray nozzle group 5321d, and a fifth cleaning spray nozzle group 5321e arranged in sequence along the transport direction. The cleaning spray nozzles 532 in the fourth cleaning spray nozzle group 5321d are vertically arranged on the spray pipe. The cleaning spray nozzles 532 in the third cleaning spray nozzle group 5321c and the fifth cleaning spray nozzle group 5321e are both inclinedly arranged on the spray pipe 531, and the inclination directions of the cleaning spray nozzles in the third cleaning spray nozzle group 5321c and the fifth cleaning spray nozzle group 5321e are opposite. In this embodiment, the cleaning spray nozzles 53 in the fourth cleaning spray nozzle group 5321d are vertically arranged on the spray pipe, the cleaning spray nozzles in the third cleaning spray nozzle group 5321c are arranged on the spray pipe along the inclined direction, and the cleaning spray nozzles in the fifth cleaning spray nozzle group 5321e are inclinedly arranged on the spray pipe along the direction opposite to the inclined direction. Such a design enables the multiple spray nozzles in each cleaning chamber to wash the substrate from three angles, further improving the cleaning power for the substrate.

[0049] It should be noted that the inclination direction in the above-mentioned multiple alternative embodiments is towards the upstream direction of the corresponding cleaning chamber or towards the downstream direction of the corresponding cleaning chamber. If the inclination direction is towards the upstream direction of the corresponding cleaning chamber, then the direction opposite to the inclination direction is towards the downstream direction of the corresponding cleaning chamber; if the inclination direction is towards the downstream direction of the corresponding cleaning chamber, then the direction opposite to the inclination direction is towards the upstream direction of the corresponding cleaning chamber. That is to say, the opposite inclination directions only mean that the two inclination directions are opposite, rather than the orientations of the spray nozzle groups being opposite. It should be noted that the transmission speed of each conveying mechanism in this embodiment is adjustable, so that the transmission speed can be designed more flexibly. For example, the substrate 80 enters the first cleaning chamber 51a at a high speed, that is, quickly enters the cleaning spray area, and moves at a low speed in the cleaning spray area. After the cleaning is completed, it accelerates and exits the first cleaning chamber 51a.

[0050] Based on the same inventive concept, the present disclosure also provides a cleaning method for the cleaning device 50. The flowchart of this method is shown in FIG. 11. The cleaning method in this embodiment is mainly a cleaning method for the substrate 80 after etching. The cleaning method includes the following steps: Transfer the substrate 80 into the first cleaning chamber 51a; In this step, when the substrate 80 enters the first cleaning chamber 51a through the first cleaning transmission mechanism 52a, the cleaning spray mechanism continuously sprays the cleaning liquid onto the surface of the substrate 80. That is, when the substrate 80 just enters, it is rinsed by spraying the cleaning liquid on the substrate 80.

[0051] Immerse the substrate 80 in the cleaning liquid in the cleaning tank 541, and the distance between the upper surface of the substrate and the liquid level of the cleaning liquid is less than or equal to 3 mm; At the same time, clean the substrate by spraying the cleaning liquid for rinsing and ultrasonic cleaning.

[0052] In this step, after the substrate 80 enters the first cleaning chamber 51a, the lifting mechanism drives the cleaning tank 541 to approach the first cleaning transmission mechanism 52a, so that the first side plate 5411 and the second side plate 5412 of the cleaning tank 541 pass through the gap between the adjacent first cleaning rollers 521a in the first cleaning transmission mechanism 52a, so that the cleaning liquid in the cleaning tank 541 can immerse the substrate 80, where the distance d between the upper surface of the substrate and the liquid level of the cleaning liquid is less than or equal to 3 mm. Such a design can ensure that the cleaning liquid in the first cleaning spray mechanism can be rinsed onto the surface of the substrate to be cleaned, and the ultrasonic vibrator at the bottom of the cleaning tank 541 performs ultrasonic vibration on the cleaning liquid in the cleaning tank 541, thereby realizing ultrasonic cleaning of the substrate 80.

[0053] In a preferred embodiment, the substrate 80 is immersed in the cleaning liquid in the cleaning tank 541, and the distance d between the upper surface of the substrate and the liquid level of the cleaning liquid is between 0.1 and 1 mm. Such a design can not only ensure that the cleaning liquid in the cleaning tank immerses the substrate to be cleaned, but also is conducive to improving the flushing effect of the first cleaning spraying mechanism, thereby improving the cleaning ability of the substrate.

[0054] The substrate 80 is removed from the cleaning liquid in the cleaning tank 541, and the substrate 80 is transferred to at least one second cleaning chamber 51 (such as sequentially transferred to the second cleaning chamber 51b, the third cleaning chamber 51c, and the fourth cleaning chamber 51d).

[0055] In this step, after the substrate 80 is cleaned, the lifting mechanism drives the cleaning tank 541 away from the first cleaning transfer mechanism 52a, so that the first side plate 5411 and the second side plate 5412 of the cleaning tank 541 are located below the first cleaning transfer mechanism 52a. The first cleaning transfer mechanism 52a and the second cleaning transfer mechanism 52b cooperate to transfer the substrate 80 to at least one second cleaning chamber 52a for secondary cleaning of the substrate 80. Here, the secondary cleaning can only spray the cleaning liquid on the surface of the substrate 80 for cleaning.

[0056] In this embodiment, the etched substrate 80 is cleaned by spraying cleaning, immersion cleaning, and ultrasonic cleaning at the same time, which can quickly and deeply clean and replace the etched liquid and residual material particles on the surface of the substrate 80, avoid the film layer from being continuously etched, and further improve the water washing and replacement ability of the cleaning device 50 in the etching equipment, meeting the requirements of high-quality product etching.

[0057] In an alternative embodiment, the substrate is rinsed by spraying the cleaning liquid obliquely, and the directions of spraying the cleaning liquid in adjacent cleaning chambers are opposite. Specifically, it can be understood that the cleaning spray nozzles 532 in each cleaning chamber spray the cleaning liquid obliquely to rinse the substrate. Among them, the cleaning spray nozzles in the first cleaning chamber 51a and the third cleaning chamber 51c spray the cleaning liquid along the inclined direction, and the cleaning spray nozzles in the second cleaning chamber 51b and the fourth cleaning chamber 51d spray the cleaning liquid obliquely along the direction opposite to the inclined direction. Such a design can rinse the substrate from two angles and improve the cleaning power of the substrate.

[0058] In an alternative embodiment, in the first cleaning chamber, the substrate is rinsed by spraying the cleaning liquid obliquely, and the directions of spraying the cleaning liquid by adjacent cleaning spray nozzle groups in the first cleaning chamber are opposite. Specifically, it can be understood that the cleaning spray nozzles in the first cleaning spray nozzle group in the first cleaning chamber spray the cleaning liquid along an inclined direction, and the cleaning spray nozzles in the second cleaning spray nozzle group spray the cleaning liquid obliquely along a direction opposite to the inclined direction. Such a design enables multiple spray nozzles in the first cleaning chamber to rinse the substrate from two angles, further improving the rinsing and cleaning power of the first cleaning spray mechanism in the first cleaning chamber on the substrate.

[0059] In an alternative embodiment, in the cleaning chamber, the substrate is rinsed by spraying the cleaning liquid obliquely, and the directions of spraying the cleaning liquid by adjacent cleaning spray nozzle groups in the cleaning chamber are opposite; specifically, it can be understood that the cleaning spray nozzles in the first cleaning spray nozzle group in each cleaning chamber spray the cleaning liquid along an inclined direction, and the cleaning spray nozzles in the second cleaning spray nozzle group spray the cleaning liquid obliquely along a direction opposite to the inclined direction. Such a design enables multiple spray nozzles in each cleaning chamber to rinse the substrate from two angles, further improving the rinsing and cleaning power on the substrate.

[0060] In an alternative embodiment, in the first cleaning chamber, the substrate is rinsed by simultaneously spraying the cleaning liquid vertically and obliquely, and the obliquely spraying of the cleaning liquid includes spraying the cleaning liquid by two cleaning spray nozzle groups with opposite inclined directions; specifically, it can be understood that the cleaning spray nozzles in the fourth cleaning spray nozzle group in the first cleaning chamber spray the cleaning liquid vertically, the cleaning spray nozzles in the third cleaning spray nozzle group spray the cleaning liquid along an inclined direction, and the cleaning spray nozzles in the fifth cleaning spray nozzle group spray the cleaning liquid obliquely along a direction opposite to the inclined direction. Such a design enables multiple spray nozzles in the first cleaning chamber to rinse the substrate from three angles, further improving the rinsing and cleaning power of the first cleaning spray mechanism in the first cleaning chamber on the substrate.

[0061] In an alternative embodiment, in each of the cleaning chambers, the substrate is rinsed by simultaneously spraying the cleaning liquid vertically and obliquely, and the obliquely spraying of the cleaning liquid includes spraying the cleaning liquid by two cleaning spray nozzle groups with opposite inclined directions; specifically, it can be understood that the cleaning spray nozzles in the fourth cleaning spray nozzle group in each cleaning chamber spray the cleaning liquid vertically, the cleaning spray nozzles in the third cleaning spray nozzle group spray the cleaning liquid along an inclined direction, and the cleaning spray nozzles in the fifth cleaning spray nozzle group spray the cleaning liquid obliquely along a direction opposite to the inclined direction. Such a design enables multiple spray nozzles in each cleaning chamber to rinse the substrate from three angles, further improving the rinsing and cleaning power on the substrate.

[0062] It should be noted that the inclination direction in the above multiple alternative embodiments is towards the upstream direction of the corresponding cleaning chamber or towards the downstream direction of the corresponding cleaning chamber. If the inclination direction is towards the upstream direction of the corresponding cleaning chamber, then the direction opposite to the inclination direction is towards the downstream direction of the corresponding cleaning chamber; if the inclination direction is towards the downstream direction of the corresponding cleaning chamber, then the direction opposite to the inclination direction is towards the upstream direction of the corresponding cleaning chamber.

[0063] Reference Figure 7 , based on the same inventive concept, the embodiment of the present application further provides an etching apparatus. The etching apparatus includes a first layer and a second layer. The first layer and the second layer are arranged in parallel, and the first layer is located on the side of the second layer close to the ground. The lifting device 30 communicates with the first layer and the second layer. The first layer includes a feeding device 10 (Entrance conveyor) and a conveying device 20 (conveyor). The second layer is provided with an etching device 40 (Etch), a cleaning device 50 (Rinse), a drying device 60 (AK), and a discharging device 70 (Exit conveyor). A transmission mechanism is provided in each device, and adjacent transmission mechanisms form a continuous transmission line through docking. In this embodiment, the transmission directions of the transmission mechanisms in the feeding device 10 and the lifting device 30 (Elevator) in the first layer are the same. The conveying directions of the transmission mechanisms in the etching device 40, the cleaning device 50, the drying device 60, and the discharging device 70 in the second layer are the same. The transmission direction of the first layer is opposite to that of the second layer. In this embodiment, connecting the first layer and the second layer through the conveying device 20 can further reduce the floor area of the entire etching apparatus.

[0064] Reference Figure 12, the etching equipment of the present application is used for the preparation of a display panel, the display panel includes a substrate, the substrate includes an array substrate 110 with an isolation structure 130 and a light-emitting unit 140. Specifically, the substrate includes the array substrate 110, and a pixel definition layer 120 and an isolation structure 130 arranged on one side of the array substrate 110. The pixel definition layer 120 includes a plurality of pixel openings. The isolation structure 130 encloses to form a plurality of isolation openings communicating with the pixel openings. At least part of the light-emitting unit 140 is accommodated in the isolation openings, so that adjacent light-emitting units 140 are separated by the isolation structure 130. The isolation structure 130 includes a first support portion 133, a second support portion 132, and a shielding portion 131. The second support portion 132 is located on the side of the first support away from the array substrate 110. The shielding portion 131 is located on the side of the second support portion 132 away from the array substrate 110. The orthographic projection of the first support portion 133 on the array substrate 110 is located within the orthographic projection of the shielding portion 131 on the array substrate 110. The orthographic projection of the second support portion 132 on the array substrate 110 is located within the orthographic projection of the shielding portion 131 on the array substrate 110. The orthographic projection of the second support portion 132 on the array substrate 110 is located within the orthographic projection of the first support portion 133 on the array substrate 110. A first encapsulation layer 150 is arranged on the side of the light-emitting unit 140 facing away from the array substrate 110. A second encapsulation layer 160 and a third encapsulation layer 170 are arranged on the side of the first encapsulation layer 150 facing away from the substrate. Among them, the light-emitting unit 140 may include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit for emitting light of different colors. Each light-emitting unit 140 includes a first electrode 141, a light-emitting functional layer 142, and a second electrode 143 which are sequentially stacked. The light-emitting functional layer 142 is located on the side of the first electrode 141 away from the array substrate 110. The second electrode 143 is located on the side of the light-emitting functional layer 142 away from the array substrate 110 and is electrically connected to the first support portion 133 and / or the second support portion 132. Among them, the first electrode 141 is an anode, and the second electrode 143 is a cathode.

[0065] During the process of preparing the isolation structure 130 and the light-emitting unit 140 of the above display panel, it is necessary to etch the film layer on the surface of the array substrate 110.

[0066] In this embodiment, the substrate 80 is loaded from the feeding device 10, and after being transferred by the transfer device 20 and the lifting device 30, it enters the etching device 40, the cleaning device 50, and the drying device 60 in sequence for etching, water washing, and air drying, and finally exits from the discharging device 70.

[0067] The feeding device 10 includes a feeding chamber, and a feeding transmission mechanism is arranged in the feeding chamber. Reference Figure 8, The transfer device 20 is located downstream of the feeding device 10. The transfer device 20 includes a transfer chamber 21, and a transfer transmission mechanism 22 is arranged in the transfer chamber 21.

[0068] Furthermore, the transfer device 20 further includes an organic matter treatment mechanism 23. The organic matter treatment mechanism 23 is arranged in the transfer chamber 21 and is arranged opposite to the transfer transmission mechanism 22. Further, in this embodiment, the organic matter treatment mechanism 23 is arranged at one end of the transfer chamber 21 away from the feeding chamber, which can also be understood as arranging the organic matter treatment mechanism 23 at the outlet of the transfer chamber 21. By arranging the organic matter treatment mechanism 23, the organic matter on the substrate 80 is removed.

[0069] Exemplarily, the organic matter treatment mechanism 23 includes a plurality of ultraviolet lamps (EUV), and the organic matter on the surface of the substrate 80 is removed by irradiating ultraviolet rays on the surface of the substrate 80.

[0070] The lifting device 30 is arranged downstream of the transfer device 20. The lifting device 30 includes a lifting chamber. A lifter and a lifting transmission mechanism are arranged in the lifting chamber. The lifting transmission mechanism is arranged at the output end of the lifter. It can be understood that the lifter transports the substrate 80 output by the transfer device 20 in the first layer to the etching device 40 in the second layer. In this embodiment, by arranging the lifter, the floor area of the equipment can be saved, and the dry transfer interval and the wet transfer interval are separated.

[0071] Reference Figure 9 , The etching device 40 is located downstream of the lifting device 30. The lifting device 30 communicates with the transfer device 20 and the etching device 40. The etching device 40 is located below the transfer device 20, or it can be said that the transfer device is located above the etching device. The etching device 40 includes a plurality of connected etching chambers 41. An etching transmission mechanism 42 and an etching spraying mechanism 43 are arranged in each etching chamber 41. Among them, the etching transmission mechanism 42 is arranged opposite to the etching spraying mechanism 43. The etching spraying mechanism 43 is used to spray etching liquid on the surface of the substrate 80 to etch the film layer on the surface of the substrate 80.

[0072] Exemplarily, in this embodiment, three etching chambers 41 are arranged in series. The three etching chambers work simultaneously, which can improve the flow rate of the substrate 80 and thus improve the production efficiency. Of course, two, four or five second etching chambers 41b can also be arranged. The number of the etching chambers 41 can be determined according to actual production needs and will not be specifically limited here. If more than two etching chambers are arranged, the production efficiency can be improved.

[0073] The above-mentioned three etching chambers 41 include a first etching chamber 41a, a second etching chamber 41b and a third etching chamber 41c. The second etching chamber 41b is located on the side of the first etching chamber 41a away from the lifting device 30, and the third etching chamber 41c is located on the side of the second etching chamber 41b away from the first etching chamber 41a, wherein an air curtain blowing mechanism 44 is arranged in the third etching chamber 41c. By arranging the air curtain blowing mechanism 44, most of the etching solution and material particles on the substrate 80 can be blown away to avoid etching transition.

[0074] refer to Figure 7 Furthermore, the etching device 40 also includes a first buffer chamber 45 (NT) located upstream of the etching chamber 41, that is, the first buffer chamber 45 located on the side of the etching chamber 41 close to the lifting chamber. The first buffer chamber 45 is a buffer room for the first layer to enter the second layer of the etching equipment, and can also be understood as a buffer room for the dry transfer interval and the wet transfer interval. By setting up the buffer room, it can be used to cache the substrate 80. For example, when the equipment fails or needs to be shut down due to other reasons, the substrate 80 can stay in the first buffer chamber 45 and wait for recovery.

[0075] The first buffer chamber 45 is an optional configuration, and in other implementations, the first buffer chamber 45 may not be provided.

[0076] refer to Figures 2 - 6 , the etching cleaning device 50 is located downstream of the etching device 40, and the cleaning device 50 has multiple cleaning chambers, which include a first cleaning chamber 51a and at least one second cleaning chamber, wherein at least one second cleaning chamber is located downstream of the first cleaning chamber 51a. It can also be understood that the etched substrate 80 first enters the first cleaning chamber 51a for cleaning, and then enters at least one second cleaning chamber for cleaning. Since the etched substrate 80 carries a lot of etching liquid and material particles, if the first cleaning chamber 51a does not quickly and deeply replace the etching liquid and residual material particles remaining on the surface of the substrate 80, it will cause the film layer of the substrate 80 to be continuously etched, causing local product abnormalities and affecting product quality. For this reason, the present application optimizes the first cleaning chamber 51a of the cleaning device 50, so that the etching liquid and residual material particles remaining on the surface of the substrate 80 are quickly and deeply replaced in the first cleaning chamber 51a. The cleaning device in this embodiment has been described in detail in the above embodiment, and no further description is given here.

[0077] refer to Figure 10, a drying device 60, which is located downstream of the cleaning device 50. The drying device 60 includes a drying chamber 61, which is located on the side of at least one second cleaning chamber away from the first cleaning chamber 51a. A drying transmission mechanism and an air knife are provided in the drying chamber, that is, a drying transmission mechanism 62 is provided in the drying chamber 61. The drying transmission mechanism is used to carry and transmit the substrate. Here, the substrate 80 can be the substrate 80 that has been cleaned by at least one second cleaning chamber. A drying air knife 63 for blowing air onto the surface of the substrate 80 is also provided in the drying chamber 61. The air knife is located on the side of the substrate facing away from the drying transmission mechanism and / or the air knife is located on the side of the drying transmission mechanism facing away from the substrate In this embodiment, the drying air knife 63 can be located on the side of the substrate 80 facing away from the drying transmission mechanism 62, or the drying air knife 63 can be located on the side of the drying transmission mechanism 62 facing away from the substrate 80, or the drying air knife 63 is located on both the side of the drying transmission mechanism 62 facing away from the substrate 80 and the side of the substrate 80 facing away from the drying transmission mechanism 62 at the same time. Such a design can dry the upper and lower surfaces of the substrate 80 simultaneously and accelerate the drying speed of the substrate 80.

[0078] Furthermore, the blowing direction of the drying air knife 63 forms an angle with the direction perpendicular to the surface of the substrate 80 (vertical direction).

[0079] Furthermore, the drying device 60 further includes a second buffer chamber 64 (Buffer) located downstream of the drying chamber 61. A second buffer transmission mechanism is provided in the buffer chamber.

[0080] A discharging device 70, which is located downstream of the drying device 60. The discharging device 70 includes a discharging chamber and a discharging transmission mechanism located in the discharging chamber.

[0081] It should be noted that some embodiments of the present disclosure are described above. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in a different order than in the above embodiments and still achieve the desired result. Additionally, the processes depicted in the figures do not necessarily require the particular order or sequential order shown to achieve the desired result. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0082] The embodiments of the present disclosure are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present disclosure shall be included within the protection scope of the present disclosure.

Claims

1. A cleaning device, characterized in that, Comprising: A first cleaning chamber; A first cleaning transfer mechanism, located within the first cleaning chamber, for carrying and transferring a substrate to be cleaned; A first cleaning spraying mechanism, disposed opposite to the first cleaning transfer mechanism, the first cleaning spraying mechanism for spraying a cleaning liquid onto the substrate to be cleaned; An ultrasonic cleaning tank, located within the first cleaning chamber and on a side of the first cleaning transfer mechanism away from the first cleaning spraying mechanism, the ultrasonic cleaning tank comprising a cleaning tank and an ultrasonic oscillator group, a cleaning liquid being provided within the cleaning tank, the ultrasonic oscillator group being connected to the cleaning tank and located on a side of the cleaning tank facing away from the first cleaning transfer mechanism; A lifting mechanism, located on a side of the cleaning tank away from the first cleaning transfer mechanism, the lifting mechanism driving the cleaning tank to approach or move away from the first cleaning transfer mechanism, such that the cleaning liquid within the cleaning tank submerges or disengages from the substrate to be cleaned.

2. The cleaning device according to claim 1, wherein the first cleaning transfer mechanism comprises a plurality of first cleaning rollers arranged side by side along a transfer direction, adjacent first cleaning rollers being spaced apart; the cleaning tank comprises a first side plate and a second side plate oppositely arranged in the transfer direction, and in the transfer direction, the dimensions of both the first side plate and the second side plate are smaller than the minimum interval between any two of the first cleaning rollers.

3. The cleaning device according to claim 1, wherein when the cleaning liquid within the cleaning tank submerges the substrate to be cleaned, the distance from the liquid level of the cleaning liquid to the upper surface of the substrate to be cleaned carried by the first cleaning transfer mechanism is less than or equal to 3 millimeters.

4. The cleaning device according to claim 3, wherein when the cleaning liquid within the cleaning tank submerges the substrate to be cleaned, the distance from the liquid level of the cleaning liquid to the upper surface of the substrate to be cleaned carried by the first cleaning transfer mechanism is between 0.1 - 1 millimeter.

5. The cleaning device according to claim 1, wherein the ultrasonic oscillator group comprises a plurality of ultrasonic oscillators, the plurality of ultrasonic oscillators being distributed at four corners and the center position of a surface of the cleaning tank facing away from the first cleaning transfer mechanism.

6. The cleaning device according to claim 1, wherein a liquid inlet communicating with the cleaning tank is provided on the bottom wall of the cleaning tank, and a liquid discharge port communicating with the first cleaning chamber is provided on the bottom wall of the first cleaning chamber.

7. The cleaning device according to claim 1, wherein the cleaning device further comprises at least one second cleaning chamber, the at least one second cleaning chamber being located downstream of the first cleaning chamber, a second cleaning transfer mechanism and a second cleaning spraying mechanism oppositely arranged relative to the second cleaning transfer mechanism being provided within each second cleaning chamber, the first cleaning spraying mechanism and the second cleaning spraying mechanism each comprising a spraying pipe and a plurality of cleaning spray nozzles provided on the spraying pipe, the plurality of cleaning spray nozzles being arranged at equal intervals, and the cleaning spray nozzles facing the substrate.

8. The cleaning device according to claim 7, characterized in that the cleaning spray nozzles are inclined and arranged on the spray pipe, and the inclination directions of the cleaning spray nozzles in adjacent cleaning chambers are opposite; alternatively, the multiple cleaning spray nozzles in the first cleaning chamber include at least two groups of cleaning spray nozzle groups, each group of cleaning spray nozzle groups includes at least two of the cleaning spray nozzles, the cleaning spray nozzles are inclined and arranged on the spray pipe, and the inclination directions of the cleaning spray nozzles in adjacent cleaning spray nozzle groups are opposite; alternatively, the multiple cleaning spray nozzles in each cleaning chamber include at least two groups of cleaning spray nozzle groups, each group of cleaning spray nozzle groups includes at least two of the cleaning spray nozzles, the cleaning spray nozzles are inclined and arranged on the spray pipe, and the inclination directions of the cleaning spray nozzles in adjacent cleaning spray nozzle groups are opposite; alternatively, the multiple cleaning spray nozzles in the first cleaning chamber include at least three groups of cleaning spray nozzle groups, each group of cleaning spray nozzle groups includes at least two of the cleaning spray nozzles, the at least three groups of cleaning spray nozzle groups include a third cleaning spray nozzle group, a fourth cleaning spray nozzle group and a fifth cleaning spray nozzle group arranged in sequence along the transportation direction, the cleaning spray nozzles in the fourth cleaning spray nozzle group are vertically arranged on the spray pipe, the cleaning spray nozzles in the third cleaning spray nozzle group and the fifth cleaning spray nozzle group are both inclined and arranged on the spray pipe, and the inclination directions of the cleaning spray nozzles in the third cleaning spray nozzle group and the fifth cleaning spray nozzle group are opposite; alternatively, the multiple cleaning spray nozzles in each cleaning chamber include at least three groups of cleaning spray nozzle groups, each group of cleaning spray nozzle groups includes at least two of the cleaning spray nozzles, the at least three groups of cleaning spray nozzle groups include a third cleaning spray nozzle group, a fourth cleaning spray nozzle group and a fifth cleaning spray nozzle group arranged in sequence along the transportation direction, the cleaning spray nozzles in the fourth cleaning spray nozzle group are vertically arranged on the spray pipe, the cleaning spray nozzles in the third cleaning spray nozzle group and the fifth cleaning spray nozzle group are both inclined and arranged on the spray pipe, and the inclination directions of the cleaning spray nozzles in the third cleaning spray nozzle group and the fifth cleaning spray nozzle group are opposite.

9. The cleaning device according to claim 1, characterized in that the cleaning liquid includes ultrapure water or deionized water.

10. A cleaning method of a cleaning device, characterized in that, It includes the following steps: transfer the substrate to the first cleaning chamber; immerse the substrate in the cleaning liquid in the cleaning tank, and the distance between the upper surface of the substrate and the liquid level of the cleaning liquid is less than or equal to 3 millimeters; simultaneously clean the substrate by spraying the cleaning liquid for rinsing and ultrasonic cleaning.

11. The cleaning method according to claim 10, characterized in that the distance between the upper surface of the substrate and the liquid level of the cleaning liquid is between 0.1 - 1 millimeter.

12. The cleaning method according to claim 10, characterized in that after the step of simultaneously cleaning the substrate by spraying the cleaning liquid for rinsing and ultrasonic cleaning, it further includes: detach the substrate from the cleaning liquid in the cleaning tank and transfer the substrate to at least one second cleaning chamber; The substrate is rinsed by spraying the cleaning liquid obliquely, and the directions of spraying the cleaning liquid in adjacent cleaning chambers are opposite; Alternatively, in the first cleaning chamber, the cleaning liquid is sprayed obliquely to rinse the substrate, and the cleaning liquids of adjacent cleaning spray nozzle groups in the first cleaning chamber are sprayed in opposite directions; Alternatively, in each of the cleaning chambers, the cleaning liquid is sprayed obliquely to rinse the substrate, and the cleaning liquids are sprayed in opposite directions by adjacent cleaning spray nozzle groups in each cleaning chamber; Alternatively, in the first cleaning chamber, the substrate is rinsed by spraying the cleaning liquid vertically and by spraying the cleaning liquid obliquely at the same time, and the oblique spraying of the cleaning liquid includes spraying the cleaning liquid by using two groups of cleaning spray nozzles with opposite oblique directions; Alternatively, in each of the cleaning chambers, the substrate is rinsed simultaneously by vertically spraying the cleaning liquid and obliquely spraying the cleaning liquid, and the obliquely spraying the cleaning liquid includes spraying the cleaning liquid by two groups of cleaning spray nozzles with opposite oblique directions.

13. An etching device, characterized in that, include: The etching device comprises a plurality of etching chambers, each of which is provided with an etching transmission mechanism and an etching spray mechanism arranged opposite to the etching transmission mechanism; and, The cleaning device according to any one of claims 1 to 9, wherein the cleaning device is located upstream of the etching device.

14. The etching apparatus according to claim 13, wherein The etching equipment also includes: A conveying device, wherein the conveying device is arranged upstream of the etching device and is located above the etching device; A lifting device, the lifting device is connected to the conveying device and the etching device; The conveying device includes a conveying chamber, in which a conveying mechanism and an organic matter processing mechanism arranged opposite to the conveying mechanism are arranged. The organic matter processing mechanism is arranged at one end of the conveying chamber close to the lifting device, and the organic matter processing mechanism includes a plurality of ultraviolet lamps.

15. The etching equipment according to claim 13, wherein The etching equipment also includes: An air-drying device, wherein the air-drying device is located downstream of the cleaning device, and the air-drying device includes an air-drying chamber, wherein an air-drying transmission mechanism and an air knife are arranged in the air-drying chamber, wherein the air-drying transmission mechanism is used to carry and transmit the substrate, and the air knife is located on the side of the substrate away from the air-drying transmission mechanism and / or the air knife is located on the side of the air-drying transmission mechanism away from the substrate.

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