Ultrasonic cleaning mechanism for large-size wafer

Abstract

The utility model provides a large-size wafer ultrasonic cleaning mechanism which comprises a shell, a spraying assembly, a clamping piece and an ultrasonic system, the clamping piece is located in the shell, and the clamping piece is configured to support a wafer so that the wafer can be kept stable in the first direction; the spraying assembly is located above the wafer, the spraying assembly comprises two liquid spraying pipes arranged in the first direction, the liquid spraying pipes are configured to convey cleaning liquid, the liquid spraying pipes are provided with a plurality of nozzles facing the wafer in the first direction, and the two liquid spraying pipes are horizontally arranged in parallel in the second direction; the ultrasonic systems are located on the two sides of the wafer and configured to apply ultrasonic vibration to the cleaning fluid on the surface of the wafer. After the wafer is fixed through the clamping piece, the spraying assembly sprays the cleaning liquid to the surface of the wafer, and the ultrasonic system conducts ultrasonic vibration on the cleaning liquid on the front face and the back face of the wafer at the same time, so that impurities on the surface of the wafer are effectively removed, the cleaning efficiency and cleanliness are improved, and the potential pollution risk caused by manual overturning is avoided.

Description

Technical Field

[0001] The utility model relates to a wafer cleaning technology in the field of semiconductor manufacturing, and particularly to an ultrasonic cleaning mechanism for large-size wafers. Background Art

[0002] With the continuous development of science and technology, the wafer manufacturing industry has also developed rapidly. Wafer specifications are gradually moving towards large volume and high precision. However, in the traditional wafer cleaning process, especially when using the tank immersion cleaning process, there are certain limitations in cleaning large-size wafers. Moreover, immersion cleaning cannot clean both sides simultaneously. During the immersion cleaning process, it is necessary to manually flip the wafer to ensure that both sides are cleaned, which not only reduces the cleaning efficiency but also easily causes secondary contamination of the wafer surface. Summary of the Utility Model

[0003] The purpose of this application is to provide an ultrasonic cleaning mechanism for large-size wafers to solve the problems of troublesome cleaning process and low efficiency in the prior art for cleaning large-size wafers.

[0004] To achieve this purpose, the following technical solutions are adopted in this application:

[0005] This application provides an ultrasonic cleaning mechanism for large-size wafers, which includes a housing, a spraying component, a clamping component, and an ultrasonic system, where:

[0006] The clamping component is located inside the housing and is configured to support the wafer to keep it stable along the first direction;

[0007] The spraying component is located above the wafer. The spraying component includes two liquid spraying pipes arranged along the first direction. The liquid spraying pipes are configured to convey the cleaning liquid. A plurality of nozzles are arranged along the first direction on the liquid spraying pipes facing the wafer. The nozzles are configured to spray the cleaning liquid onto the wafer. The two liquid spraying pipes are horizontally arranged side by side along the second direction;

[0008] The ultrasonic system is located on both sides of the wafer and is configured to apply ultrasonic vibration to the cleaning liquid on the wafer surface to achieve efficient cleaning.

[0009] Optionally, the first ends of the liquid spraying pipes are connected by a first connecting pipe, and the first connecting pipe is simultaneously connected to an external liquid supply component. The liquid supply component is configured to provide the cleaning liquid to the liquid spraying pipes through the first connecting pipe.

[0010] Optionally, the first connecting pipe and the first ends of the liquid spraying pipes are connected by a rotary joint, and the liquid spraying pipes can freely rotate on the rotary joint.

[0011] Optionally, a vane rotary cylinder is arranged at the second ends of the liquid spraying pipes, and the vane rotary cylinder is configured to drive the liquid spraying pipes to rotate by plus or minus 30°.

[0012] Optionally, the blade rotating cylinder is connected to the liquid spraying pipe through a second connecting pipe. The blade rotating cylinder is arranged outside the housing, and the blade rotating cylinder drives the second connecting pipe to rotate, and then drives the liquid spraying pipe to rotate.

[0013] Optionally, the ultrasonic system includes two mirror vibration plates. The two mirror vibration plates are embedded on both sides of the housing. The mirror vibration plates are arranged on both the front and back sides of the wafer along the first direction. A plurality of mirror transducers are installed behind each mirror vibration plate. The mirror transducers are configured to apply ultrasonic vibration to the cleaning liquid on the surface of the wafer.

[0014] Optionally, a support plate is arranged above the bottom plate of the housing. The support plate is configured to support the clamping member. A plurality of first notches are formed on the support plate. The first notches are configured to allow the waste cleaning liquid to flow to the bottom plate.

[0015] Optionally, a second notch is formed on one side of the housing adjacent to the bottom plate. The second notch is configured to allow the waste cleaning liquid to flow out. The second notch is externally connected to a liquid guiding pipe. The liquid guiding pipe is configured to guide the waste cleaning liquid into a waste liquid recovery device.

[0016] Compared with the prior art, the present application has the following advantages:

[0017] 1) After the wafer is fixed by the clamping member, the spraying assembly sprays the cleaning liquid onto the surface of the wafer. The ultrasonic system simultaneously applies ultrasonic vibration to the cleaning liquid on both the front and back sides of the wafer, thereby effectively removing the impurities on the surface of the wafer, not only improving the cleaning efficiency and cleanliness, but also avoiding the potential pollution risk brought by manual turning of the wafer.

[0018] 2) By driving the liquid spraying pipe to rotate by plus or minus 30° through the blade rotating cylinder, on the one hand, the contact area between the cleaning liquid and the wafer is increased, so that the cleaning liquid can be evenly sprayed on the surface of the wafer, which can ensure that each part of the wafer surface can be fully cleaned, improving the cleaning uniformity and effect. On the other hand, by adjusting the rotation angle of the blade rotating cylinder, the requirements of different cleaning tasks can be adapted, improving the compatibility of the equipment.

[0019] 3) By installing the mirror vibration plates and the mirror transducers on both the front and back sides of the wafer, on the one hand, not only the cleaning of the wafer is realized, but also the usage amount of the cleaning liquid and the cleaning time are reduced, thereby saving energy consumption and improving the cleaning efficiency. On the other hand, the two sides of the wafer are cleaned simultaneously, not only improving the cleaning efficiency and cleanliness, but also avoiding the potential pollution risk brought by manual turning. Description of the Drawings

[0020] To more clearly illustrate and understand the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the background art and embodiment descriptions of the present application. Obviously, the accompanying drawings in the following descriptions are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the content of the embodiments of the present application and these drawings.

[0021] Figure 1 is a schematic three-dimensional structure diagram of an ultrasonic cleaning mechanism for large-sized wafers provided by an embodiment of the present application;

[0022] Figure 2 is Figure 1 an enlarged schematic diagram of part A in

[0023] Figure 3 is a schematic three-dimensional internal structure diagram of an ultrasonic cleaning mechanism for large-sized wafers provided by an embodiment of the present application. Detailed implementation manners

[0024] To facilitate the understanding of the present application, the following will describe the present application more comprehensively with reference to the relevant accompanying drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive. It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there may also be an intermediate component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation manner. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs. The terms used in the description of the present application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0025] Please refer to Figures 1 to 3 as shown, an ultrasonic cleaning mechanism for large-sized wafers provided by an embodiment of the present application includes a housing 10, a spraying assembly 20, a clamping member 30, and an ultrasonic system 40, wherein:

[0026] The clamping member 30 is located inside the housing 10, and the clamping member 30 is configured to support the wafer 50 to keep it stable along the first direction ( Figure 1 the X direction in

[0027] The spraying assembly 20 is located above the wafer 50. The spraying assembly 20 includes two liquid spraying pipes 21 arranged along the first direction. The liquid spraying pipes 21 are configured to convey the cleaning liquid. Along the first direction, a plurality of nozzles 210 are arranged on the liquid spraying pipes 21 facing the wafer 50. The nozzles 210 are configured to spray the cleaning liquid onto the wafer 50. The two liquid spraying pipes 21 are horizontally arranged in parallel along the second direction ( Figure 1 the Y direction in it);

[0028] The ultrasonic system 40 is located on both sides of the wafer 50. The ultrasonic system 40 is configured to apply ultrasonic vibration to the cleaning liquid on the surface of the wafer 50 to achieve efficient cleaning.

[0029] After the wafer 50 is fixed by the clamping member 30, the spraying assembly 20 sprays the cleaning liquid onto the surface of the wafer 50. The ultrasonic system 40 simultaneously applies ultrasonic vibration to the cleaning liquid on both the front and back sides of the wafer 50, thereby effectively removing the impurities on the surface of the wafer 50, not only improving the cleaning efficiency and cleanliness, but also avoiding the potential pollution risk brought by manual turning of the wafer 50.

[0030] In one embodiment, the first ends of the liquid spraying pipes 21 are connected by a first connecting pipe 22. The first connecting pipe 22 is simultaneously connected to an external liquid supply member. The liquid supply member is configured to provide the cleaning liquid to the liquid spraying pipes 21 through the first connecting pipe 22.

[0031] By arranging the first connecting pipe 22 at the first ends of the two liquid spraying pipes 21, the liquid supply member can simultaneously provide the same cleaning liquid to the two liquid spraying pipes 21, which not only improves the working efficiency, but also saves the input cost.

[0032] In one embodiment, the first connecting pipe 22 and the first end of the liquid spraying pipe 21 are connected by a rotary joint 220. The liquid spraying pipe 21 can rotate freely on the rotary joint 220.

[0033] By arranging the rotary joint 220 between the first connecting pipe 22 and the liquid spraying pipe 21, it is ensured that the liquid spraying pipe 21 rotates freely without causing kinking or winding, thereby ensuring the normal operation of the spraying assembly 20.

[0034] In one embodiment, a vane rotary cylinder 23 is arranged at the second end of the liquid spraying pipe 21. The vane rotary cylinder 23 is configured to drive the liquid spraying pipe 21 to rotate by plus or minus 30°.

[0035] The liquid spraying pipe 21 is driven by the blade rotating cylinder 23 to rotate by plus or minus 30°. On the one hand, it increases the contact area between the cleaning liquid and the wafer 50, enabling the cleaning liquid to be evenly sprayed on the surface of the wafer 50. In this way, it can ensure that every part of the surface of the wafer 50 can be thoroughly cleaned, improving the uniformity and effect of the cleaning. On the other hand, by adjusting the rotation angle of the blade rotating cylinder 23, it can meet the requirements of different cleaning tasks, improving the compatibility of the equipment.

[0036] In one embodiment, the blade rotating cylinder 23 is connected to the liquid spraying pipe 21 through the second connecting pipe 230. The blade rotating cylinder 23 is arranged outside the housing 10, and the blade rotating cylinder drives the second connecting pipe 230 to rotate, thereby driving the liquid spraying pipe 21 to rotate.

[0037] By arranging the second connecting pipe 230 between the blade rotating cylinder 23 and the liquid spraying pipe 21, not only can the blade rotating cylinder 23 drive the liquid spraying pipe 21 to rotate, but also the blade rotating cylinder 23 can be arranged outside the housing 10, avoiding the influence of the humid environment inside the housing 10 on the blade rotating cylinder 23 and extending the service life of the blade rotating cylinder 23.

[0038] In one embodiment, the ultrasonic system 40 includes two mirror shock plates 41. The two mirror shock plates 41 are embedded on both sides of the housing 10. The mirror shock plates 41 are arranged on both the front and back sides of the wafer 50 along the first direction. A plurality of mirror transducers 42 are installed behind each mirror shock plate 41, and the mirror transducers 42 are configured to apply ultrasonic vibration to the cleaning liquid on the surface of the wafer 50.

[0039] By installing the mirror shock plates 41 and the mirror transducers 42 on both the front and back sides of the wafer 50, on the one hand, it not only realizes the cleaning of the wafer 50, but also reduces the usage amount of the cleaning liquid and the cleaning time, thereby saving energy consumption and improving the cleaning efficiency. On the other hand, it cleans both sides of the wafer 50 simultaneously, not only improving the cleaning efficiency and cleanliness, but also avoiding the potential pollution risk brought by manual turning over.

[0040] In one embodiment, a support plate 11 is arranged above the bottom plate of the housing 10. The support plate 11 is configured to support the clamping member 30. A plurality of first notches 110 are formed on the support plate 11, and the first notches 110 are configured to allow the waste cleaning liquid to flow to the bottom plate 12.

[0041] By arranging the support plate 11, it not only realizes the support of the clamping member 30 and the wafer 50 in the vertical direction, but also forms the first notches 110 on the support plate 11, facilitating the residual cleaning liquid and impurities to flow into the lower bottom plate 12 by gravity and then enter the waste liquid recovery device.

[0042] In one embodiment, a second notch 120 is formed on one side of the housing 10 adjacent to the bottom plate 12. The second notch 120 is configured to allow the waste cleaning liquid to flow out. The second notch 120 is externally connected to a liquid guide pipe 121, and the liquid guide pipe 121 is configured to guide the waste cleaning liquid into the waste liquid recovery device.

[0043] Through the cooperation of the second notch 120 and the liquid guide pipe 121, it is convenient to quickly and accurately collect the waste cleaning liquid and impurities into the waste liquid recovery device, keeping the inside of the housing 10 clean and facilitating the continuation of the cleaning work.

[0044] The above embodiments only illustrate the basic principles and characteristics of the present application. The present application is not limited by the above examples. Without departing from the spirit and scope of the present application, there are various changes and modifications to the present application, and these changes and modifications all fall within the scope of the present application claimed. The scope of protection claimed by the present application is defined by the appended claims and their equivalents.

Claims

1. An ultrasonic cleaning mechanism for large-size wafers, characterized in that: The ultrasonic cleaning mechanism for large-size wafers comprises a housing, a spray assembly, a clamping member and an ultrasonic system, wherein: The clamping member is located inside the housing, and the clamping member is configured to support the wafer so that it remains stable along a first direction; The spray assembly is located above the wafer, the spray assembly includes two spray pipes arranged along the first direction, the spray pipes are configured to transport cleaning liquid, a plurality of nozzles are arranged on the spray pipes along the first direction toward the wafer, the nozzles are configured to spray the cleaning liquid onto the wafer, and the two spray pipes are horizontally arranged in parallel along the second direction; The ultrasonic system is located at both sides of the wafer, and is configured to apply ultrasonic vibration to the cleaning liquid on the surface of the wafer to achieve efficient cleaning.

2. The ultrasonic cleaning mechanism for large-size wafers according to claim 1, characterized in that: The first ends of the liquid spraying pipes are connected via a first connecting pipe, and the first connecting pipe is simultaneously connected to an external liquid supply component, and the liquid supply component is configured to provide cleaning liquid to the liquid spraying pipe via the first connecting pipe.

3. The ultrasonic cleaning mechanism for large-size wafers according to claim 2, characterized in that: The first connecting pipe is connected to the first end of the liquid spraying pipe via a rotating joint, and the liquid spraying pipe can rotate freely on the rotating joint.

4. The ultrasonic cleaning mechanism for large-size wafers according to claim 1, characterized in that: A blade rotating cylinder is disposed at the second end of the liquid spraying pipe, and the blade rotating cylinder is configured to drive the liquid spraying pipe to rotate by plus or minus 30 degrees.

5. The ultrasonic cleaning mechanism for large-size wafers according to claim 4, characterized in that: The blade rotating cylinder is connected to the liquid spraying pipe via a second connecting pipe. The blade rotating cylinder is arranged outside the shell. The blade rotating cylinder drives the second connecting pipe to rotate and then drives the liquid spraying pipe to rotate.

6. The ultrasonic cleaning mechanism for large-size wafers according to claim 1, characterized in that: The ultrasonic system includes two mirror vibration plates, which are embedded in both sides of the shell. The mirror vibration plates are arranged on both sides of the front and back sides of the wafer along the first direction. A number of mirror transducers are installed behind each mirror vibration plate, and the mirror transducers are configured to apply ultrasonic vibrations to the cleaning liquid on the surface of the wafer.

7. The ultrasonic cleaning mechanism for large-size wafers according to claim 1, characterized in that: A support plate is disposed above the bottom plate of the shell, and the support plate is configured to support the clamping member. A plurality of first notches are formed on the support plate, and the first notches are configured to allow waste cleaning liquid to flow toward the bottom plate.

8. The ultrasonic cleaning mechanism for large-size wafers according to claim 7, characterized in that: A second notch is provided on one side of the shell close to the bottom plate, and the second notch is configured to allow waste cleaning liquid to flow out. The second notch is externally connected to a liquid guide tube, and the liquid guide tube is configured to guide the waste cleaning liquid into a waste liquid recovery device.

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