Single wafer scrubbing and drying device

Abstract

The invention discloses a single wafer scrubbing and drying device which comprises a frame and shell structure, a wafer fixing and rotating structure, a spraying and drying structure and a rolling brush rotating scrubbing structure, and the wafer fixing and rotating structure, the spraying and drying structure and the rolling brush rotating scrubbing structure are all installed in the frame and shell structure. A wafer is placed on the wafer fixing and rotating structure, the wafer is cleaned through the rolling brush rotating and brushing structure, and then the brushed wafer is sprayed and dried through the spraying and drying structure. According to the single wafer scrubbing and drying device, residual water on the surface of the cleaned wafer can be dried in time, and the situation that the performance and quality of the wafer are affected due to corrosion, pollution or water stain formation of the surface of the wafer caused by the residual water is avoided.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor wafer cleaning and drying, and particularly relates to a single-wafer scrubbing and drying device. Background Art

[0002] With the continuous progress of semiconductor technology, the integration of chips is getting higher and higher, the line width is constantly decreasing, and the quality requirements for wafers are becoming more and more stringent. For advanced semiconductor processes, such as nanoscale processes, the cleanliness requirements for the wafer surface are extremely high. Since the contaminants on the wafer surface will have a serious impact on the electrical performance of semiconductor devices. For example, metal impurities will form unnecessary conductive channels in the wafer, increasing the risk of leakage and reducing the insulation performance of the device; organic contaminants may cause changes in the threshold voltage of the device, affecting its switching characteristics. Only through a thorough cleaning process can these impurities be minimized to interfere with the device performance, enabling the chip to work properly according to the design requirements and ensuring the realization of its high-speed, low-power and other performance indicators. Among the many processes in wafer manufacturing, such as oxidation, diffusion, lithography, etching, ion implantation, etc., each step may introduce new impurities or contaminants, which must be removed in time through the cleaning process to ensure the quality and performance of the chip, thereby improving the overall product yield. If the cleaning is improper, it will cause residue of contaminants on the wafer surface, surface damage or change of surface characteristics, which may affect process steps such as photoresist coating and film deposition, and thus affect the manufacturing quality of the entire chip.

[0003] The main wafer cleaning methods are dry cleaning and wet cleaning. Among them, megasonic spraying is an efficient cleaning method for wet cleaning, which combines megasonic wave energy with spray cleaning. Through a specially designed nozzle, the high-frequency sound waves (usually in the megahertz range) generated by the megasonic transducer are transmitted into the sprayed water flow. When the water flow with megasonic wave energy impacts the wafer surface, the combined action of the high-speed flow of the water and the high-frequency vibration of the megasonic wave generates a strong mechanical impact force and a microscopic stirring effect. This action can effectively remove various contaminants on the wafer surface, such as fine particles, organic substances, metal impurities, etc.

[0004] After wafer cleaning, drying is also an indispensable step in the wafer manufacturing process. Many wafer manufacturing processes have strict requirements on the drying degree of the wafer surface. The drying step is an important link to ensure that the wafer meets these process requirements. Since the surface of the cleaned wafer will remain with moisture, if not dried in time, the moisture may cause corrosion, contamination or formation of water stains on the wafer surface, affecting the performance and quality of the wafer. In addition, the drying process can also reduce the humidity on the wafer surface, thereby reducing the possibility of reattachment of contaminants and ensuring the cleanliness of the wafer surface.

[0005] In the current single-wafer spray rinsing and roller brush scrubbing technologies, the roller brush mainly covers half of the wafer surface, and the full-surface scrubbing is achieved by rotating the wafer. It is difficult to ensure the scrubbing uniformity, and the efficiency is lower compared with the full-surface coverage method. In the prior art for the wafer fixed rotation device, it is mostly fixed by clamping jaws, which will result in incomplete cleaning of the contaminants on the edge of the wafer surface. In the roller brush scrubbing device in the prior art, there are two installation methods for the roller brush (the vertical installation is when the central axis of the brush head is perpendicular to the wafer, and the horizontal installation is when the central axis of the brush head is parallel to the wafer). In both methods, the contact pressure between the roller brush and the wafer is mostly indirectly regulated by the distance, and the pressure in contact with the wafer cannot be directly regulated, thus it is impossible to study the influence of different pressures on the scrubbing effect.

[0006] In the existing solution, application number: CN202310432516.2, applicant: Suzhou Zhicheng Semiconductor Technology Co., Ltd., a wafer scrubbing machine is provided, including: a stage, a cavity mechanism configured on the stage and having an opening, a cleaning unit assembled on the stage and formed on the circumferential outer side of the cavity mechanism, and a wafer rotation mechanism passing through the stage and extending axially into the cavity mechanism; the cleaning unit includes: a plurality of swing arms with nozzles, a scrubbing device with a cleaning brush head, and a plurality of intake pipes formed on the outer side of the wafer rotation mechanism along the circumference and extending longitudinally into the cavity mechanism; the cavity mechanism includes: a cavity bottom unit, an upper flow guide cover and a lower flow guide cover sequentially sleeved on the cavity bottom unit radially inward; the wafer scrubbing machine further includes: a lifting mechanism for driving the upper flow guide cover and the lower flow guide cover to perform lifting movement longitudinally. Through this application, multi-step processes such as wafer cleaning, scrubbing, nitrogen drying, and separation and recovery of the cleaning liquid are integrated to improve the processing efficiency. Its disadvantage is that the wafer rotation structure fixes the wafer by clamping jaws, which will result in incomplete cleaning of the contaminants on the edge of the wafer surface. The device only has the spray rinsing function and no roller brush scrubbing, so the removal rate of the contaminants on the wafer surface is relatively low, and the removal efficiency is also relatively low.

[0007] Existing solution, application number: 202410172328.5, applicant: Huahai Qingke Co., Ltd., provides a wafer processing device for vertically brushing a wafer. The wafer includes a first surface carrying circuit elements. The wafer processing device includes a box body; a support assembly vertically supports and drives the wafer to rotate; a roller brush member is horizontally arranged in the box body and can brush the surface of the wafer; a spraying assembly includes a first sprayer and a second sprayer. The first sprayer and the second sprayer are used to spray a cleaning liquid onto the first surface. The second sprayer sprays the cleaning liquid towards the top area of the first surface, and the landing point of the cleaning liquid sprayed by the second sprayer on the wafer is higher than the landing point of the cleaning liquid sprayed by the first sprayer on the wafer. The top area is the area above the area covered by the cleaning liquid sprayed by the first sprayer. According to an embodiment of the present invention, a wafer processing device, the first sprayer can spray the cleaning liquid on the top area of the wafer, so as to ensure that the surface of the wafer is wet and will not adhere to pollutants. Its disadvantage is that the roller brush of the roller brush washing device is horizontally installed and the pressure in contact with the wafer surface cannot be directly adjusted.

[0008] Existing solution, application number: CN202310176268.X, applicant: Huahai Qingke Co., Ltd., discloses a wafer brushing device, including a swing arm, a lifting drive mechanism, an elastic support mechanism, a rotating shaft, a rotation drive mechanism and a brush body; the lifting drive mechanism, the elastic support mechanism and the rotation drive mechanism are all located above the swing arm. The lifting drive mechanism, the elastic support mechanism and the rotating shaft are distributed vertically from top to bottom. The lifting drive mechanism and the rotation drive mechanism are adjacent to each other in the horizontal direction; the lifting drive mechanism is connected to the rotating shaft through the elastic support mechanism. The upper end of the rotating shaft is rotatably connected to the elastic support mechanism. The lower end of the rotating shaft passes through the swing arm and is connected to the brush body located below the swing arm. The rotation drive mechanism is connected to the rotating shaft and drives the brush body to rotate through the rotating shaft; a force sensor is arranged between the lifting drive mechanism and the elastic support mechanism to detect and feedback-adjust the pressure applied by the lifting drive mechanism. Its disadvantage is that the roller brush is vertically installed. Although the pressure in contact with the wafer surface can be adjusted, the brush head cannot rotate and is only suitable for small-sized (1-2 inch) wafers. When brushing large-sized wafers (4-12 inches), there is a problem of uneven force distribution, resulting in uneven brushing. Summary of the Invention

[0009] The object of the present invention is to solve the above problems and provide a single-wafer brushing and drying device with high efficiency, clean and uniform cleaning.

[0010] To solve the above technical problems, the technical solution of the present invention is: a single-wafer scrubbing and drying device, including a frame and a housing structure, a wafer fixing and rotating structure, a spraying and drying structure, and a rotary brush scrubbing structure. The wafer fixing and rotating structure, the spraying and drying structure, and the rotary brush scrubbing structure are all installed inside the frame and the housing structure. The wafer is placed on the wafer fixing and rotating structure, and the wafer is cleaned by the rotary brush scrubbing structure, and then the sprayed and dried wafer is sprayed and dried by the spraying and drying structure.

[0011] Preferably, the frame and the housing structure include a machine body frame, on which a cleaning cavity, an upper exhaust window, an observation window, a splash guard, an internal mounting plate, a fixed side plate, a movable side plate, and an opening and closing door plate are respectively installed. The cleaning cavity, the upper exhaust window, the observation window, the internal mounting plate, and the fixed side plate are respectively connected and fixed to the machine body frame through T-shaped nuts. The observation window is connected and fixed to the machine body frame through screws and nuts. The movable side plate is connected to the machine body frame through a magnetic attraction device, and the opening and closing door plate is connected to the machine body frame through a hinge structure.

[0012] Preferably, the cleaning cavity is provided with a wafer fixing and rotating structure mounting hole, a spraying and drying structure mounting hole, and a rotary brush scrubbing structure mounting hole. The wafer fixing and rotating structure is installed on the wafer fixing and rotating structure mounting hole, the spraying and drying structure is installed on the spraying and drying structure mounting hole, and the rotary brush scrubbing structure is installed on the rotary brush scrubbing structure mounting hole.

[0013] Preferably, the wafer fixing and rotating structure includes a rotating suction cup, a cross turntable, a rotating main shaft, a lifting turntable, wafer support claws, lifting turntable support columns, linear bearings, telescopic electric cylinders, upper mounting plates, lower mounting plates, wafer fixing and rotating side plates, bearings, sealing rings, synchronous belt pulleys, synchronous belts, motors, ventilation devices, silicon carbide, quick connectors and silicon carbide sealing rings. The rotating suction cup is fixedly connected to the cross turntable by screws, the cross turntable is fixedly connected to the rotating main shaft by screws, the rotating main shaft is connected to the wafer fixing and rotating bearing by shaft-hole fit, the wafer fixing and rotating bearing is connected to the upper mounting plate and the lower mounting plate by shaft-hole fit, the sealing ring is connected to the upper mounting plate by shaft-hole fit, the wafer support claws are fixedly connected to the lifting turntable by screws, the lifting turntable is fixedly connected to the lifting turntable support columns by screws, the lifting turntable support columns are in shaft-hole fit with the linear bearings, the linear bearings are fixedly connected to the upper mounting plate by screws, the lifting turntable support columns are threadedly connected to the telescopic electric cylinders, the telescopic electric cylinders are fixedly connected to the lower mounting plate by screws, the ventilation device is fixedly connected to the lower mounting plate by screws, the ventilation device and the silicon carbide are hermetically connected through the silicon carbide sealing ring, the ventilation device is threadedly connected to the quick connector, the silicon carbide is connected to the rotating main shaft by shaft-hole fit, the upper mounting plate, the lower mounting plate and the wafer fixing and rotating side plates are fixedly connected by screws, and the upper mounting plate and the cleaning cavity are positioned through the wafer fixing and rotating structure mounting holes and fixedly connected by screws.

[0014] Preferably, the synchronous belt pulley includes a motor synchronous belt pulley and a rotating main shaft synchronous belt pulley. The rotating main shaft is connected to the rotating main shaft synchronous belt pulley by key connection and interference fit. The rotating main shaft synchronous belt pulley is connected to the motor synchronous belt pulley by a synchronous belt. The motor synchronous belt pulley is connected to the motor by key connection and interference fit. The motor is fixedly connected to the lower mounting plate by screws.

[0015] Preferably, the spraying and drying structure includes a spray head upper cover, a spray head lower cover, a cleaning liquid spray head, a T-shaped joint, a quick connector, a connector, a rotating shaft, a bearing seat, a reducer seat, a base, a motor, a reducer, a coupling, a spray side plate, a liquid inlet pipe, and a nitrogen gas pipe. The spray head upper cover and the spray head lower cover are fixedly connected by side screws. The spray head lower cover and the connector are positioned by steps and fixedly connected by screws. The spray head lower cover and the T-shaped joint are positioned by steps and fixedly connected by screws. The spray head lower cover and the cleaning liquid spray head are connected by threads. The T-shaped joint and the quick connector are connected by threads. The rotating shaft and the connector are fitted through a shaft hole and fixedly connected by a pin. The rotating shaft and the bearing are fitted through a shaft hole. The bearing and the bearing seat are fitted through a shaft hole. The rotating shaft and the reducer are connected by a coupling. The reducer and the motor are fitted through a shaft hole and tightened and fixed by side screws. The bearing seat, the reducer seat, the base, and the spray side plate are fixedly connected by screws. The reducer and the reducer seat are fixedly connected by screws. The rotating shaft is provided with a rotating shaft center hole along the axial direction. The liquid inlet pipe is connected to the cleaning liquid spray head, and the other end of the liquid inlet pipe passes through the rotating shaft center hole and is connected to a water pump. The nitrogen gas pipe is connected to the quick connector, and the other end of the nitrogen gas pipe passes through the rotating shaft center hole and is connected to a nitrogen gas source device.

[0016] Preferably, the bearing seat includes an upper bearing seat and a lower bearing seat. The upper bearing seat and the cleaning cavity are positioned by fitting through the installation holes of the spraying and drying structure and fixedly connected by screws.

[0017] Preferably, the rotary brush rotating and scrubbing structure includes a rotary platform motor, a rotary platform, a sealing ring, a bottom plate, an upper plate, side plates, a linear module, a module motor, a module mounting plate, a beam mounting plate, a beam, a beam protective cover, a rib plate, a brush motor, a brush motor mounting seat, a rear pressure sensor, a rear pressure sensor mounting seat, a micro module, a brush motor shaft, a brush motor coupling, a brush, a brush connecting shaft, bearings, bearing seats, bearing covers, a front pressure sensor, a front pressure sensor mounting seat, a waterproof window, a waterproof cover, a water baffle, a water spray pipe, a water spray pipe mounting seat and a nozzle. The rotary platform motor is in shaft hole fit with the rotary platform and is fixed tightly by side screws. The rotary platform is positioned by a pin and fixed by screw connection with the bottom plate. The bottom plate, the upper plate and the side plates are fixed by screw connection. The linear module is respectively fixed by screw connection with the side plates and the module mounting plate. The module mounting plate is fixed by screw connection with the beam mounting plate. The rib plate is fixed by screw connection with the module mounting plate and the beam mounting plate. The beam mounting plate is fixed by screw connection with the beam. The beam protective cover is fixed by screw connection with the beam. The micro module includes a front micro module and a rear micro module. The brush motor is fixed by screw connection with the brush motor mounting seat. The left and right outer sides of the brush motor mounting seat are fixed by screw connection with the rear micro module. The upper side of the brush motor mounting seat is positioned by a pin and fixed by screw connection with the rear pressure sensor. The rear pressure sensor is positioned by a pin and fixed by screw connection with the rear pressure sensor mounting seat. The rear pressure sensor mounting seat is positioned by a step and fixed by screw connection with the beam mounting plate. The rear micro module is positioned by a step on the left and right inner sides with the rear pressure sensor mounting seat and fixed by screw connection. The brush motor is connected by a key and fixed by a pin with the brush motor shaft. The brush motor shaft is connected and fixed with the brush through a brush motor coupling. The brush is connected by a square hole fit with the brush connecting shaft. The brush connecting shaft is connected by an interference fit of shaft hole with the bearing. The bearing is connected by shaft hole fit with the bearing seat. The bearing seat is fixed by screw connection with the bearing cover. The left and right outer sides of the bearing seat are fixed by screw connection with the front micro module. The upper side of the bearing seat is positioned by a pin and fixed by screw connection with the front pressure sensor. The front pressure sensor is positioned by a pin and fixed by screw connection with the front pressure sensor mounting seat. The front pressure sensor mounting seat is positioned by a pin and fixed by screw connection with nuts with the beam. The front micro module is positioned by a step on the left and right inner sides with the front pressure sensor mounting seat and fixed by screw connection. The front side plate is positioned by a groove with the waterproof window and the water spray pipe mounting seat and fixed by screw connection. The water baffle is placed in the waterproof window and fixed by screw connection with the beam. The upper and lower sides of the water baffle are fixed by screw connection with the waterproof cover. The waterproof cover is fixed by screw connection with the upper and lower sides of the waterproof window. The water spray pipe is fixed by screw connection with the water spray pipe mounting seat. The water spray pipe is connected by thread with the nozzle. The water pipe is connected with the water spray pipe and passes through the central hole of the rotary platform to be connected with the water pump below;The lower part of the rotating platform is fixedly connected to the internal mounting plate by screws and nuts, and the upper part is hermetically fitted with the cleaning cavity through a sealing ring and the mounting holes of the rotary brush scrubbing structure; the waste liquid outlet pipe is connected to the liquid outlet hole of the cleaning cavity to finally discharge the waste liquid.

[0018] Preferably, the side plates include a left side plate, a right side plate, a front side plate and a rear side plate. The left side plate, the right side plate, the front side plate and the rear side plate are connected and the cross-section is rectangular. The linear module is fixedly connected to the left side plate and the module mounting plate by screws.

[0019] The beneficial effects of the present invention are:

[0020] 1. The single-wafer scrubbing and drying device provided by the present invention can timely dry the residual moisture on the surface of the wafer after cleaning, avoiding the corrosion, contamination or formation of water stains on the wafer surface caused by the residual moisture, which affects the performance and quality of the wafer.

[0021] 2. The drying process of the present invention can reduce the humidity on the surface of the wafer, thereby reducing the possibility of reattachment of pollutants and ensuring the cleanliness of the wafer surface.

[0022] 3. The present invention uses a rotary brush to cover the entire surface of the wafer and realizes full-surface scrubbing by rotating the wafer. The scrubbing is uniform and the efficiency is high. By using a rotary suction cup to adsorb the wafer, compared with the existing equipment using clamping jaws for fixation, the situation that the pollutants on the edge of the wafer surface are not thoroughly cleaned is avoided.

[0023] 4. The present invention can directly regulate the pressure of the rotary brush in contact with the wafer through the front pressure sensor and the rear pressure sensor, so as to study the influence of different pressures on the scrubbing effect. Description of the Drawings

[0024] Figure 1 is a schematic structural diagram of a single-wafer scrubbing and drying device of the present invention;

[0025] Figure 2 is a right view of the present invention;

[0026] Figure 3 is a comparison schematic diagram of the front view and the right view of the body frame of the present invention;

[0027] Figure 4 is a comparison schematic diagram of the left view and the rear view of the body frame of the present invention;

[0028] Figure 5 is a schematic diagram of the internal structure of the body frame of the present invention;

[0029] Figure 6 is a schematic diagram of the cleaning cavity structure of the present invention;

[0030] Figure 7Schematic diagram of the wafer fixing and rotating structure of the present invention;

[0031] Figure 8 Schematic diagram of the comparison between the lateral structure and the half-section of the wafer fixing and rotating structure of the present invention;

[0032] Figure 9 Schematic diagram of the connection between the ventilation device and the rotating main shaft of the wafer fixing and rotating structure of the present invention;

[0033] Figure 10 Schematic diagram of the installation principle of silicon carbide of the present invention;

[0034] Figure 11 Schematic diagram of the connection structure between the rotating main shaft and the vacuum chuck of the present invention;

[0035] Figure 12 Schematic diagram of the structure of the spraying and drying structure of the present invention;

[0036] Figure 13 Right view of the spraying and drying structure of the present invention;

[0037] Figure 14 Partial schematic diagram of the spraying and drying structure of the present invention;

[0038] Figure 15 Schematic diagram of the structure of the rotary brush scrubbing structure of the present invention;

[0039] Figure 16 Internal structure schematic diagram of the rotary brush scrubbing structure of the present invention;

[0040] Figure 17 Schematic diagram of the three-dimensional structure of the rotary brush of the present invention;

[0041] Figure 18 Of the present invention Figure 17 Schematic diagram of the comparison of the front view, left view and right view structures;

[0042] Figure 19 Of the present invention Figure 18 Schematic diagram of the sectional structure of B-B in;

[0043] Description of reference numerals in the drawings: 101, body frame; 102, cleaning cavity; 103, upper exhaust window; 104, observation window; 105, splash guard; 106, internal mounting plate; 107, fixed side plate; 108, movable side plate; 109, opening and closing door panel; 201, rotating suction cup; 202, cross turntable; 203, rotating main shaft; 204, lifting turntable; 205, wafer support claw; 206, lifting turntable support column; 207, linear bearing; 208, telescopic electric cylinder; 209, upper mounting plate; 210, lower mounting plate; 211, wafer fixed rotating side plate; 212, wafer fixed rotating bearing; 213, sealing ring; 214, synchronous pulley; 215, synchronous belt; 216, motor; 217, ventilation device; 218, silicon carbide; 219, quick connector; 221, silicon carbide sealing ring; 222, suction cup sealing ring; 223, rotating main shaft sealing ring; 301, upper cover of spray head; 302, lower cover of spray head; 303, cleaning liquid spray head; 306, T-shaped joint; 307, quick connector; 308, connector; 309, rotating shaft; 310, bearing seat; 311, reducer seat; 312, base; 313, motor; 314, reducer; 315, coupling; 316, spray side plate; 401, rotating platform motor; 402, rotating platform; 403, sealing ring; 404, bottom plate; 405, upper plate; 406, side plate; 407, linear module; 408, module motor; 409, module mounting plate; 410, beam mounting plate; 411, beam; 412, beam protective cover; 413, rib plate; 414, brush motor; 415, brush motor mounting seat; 416, rear pressure sensor; 417, rear pressure sensor mounting seat; 418, micro module; 419, brush motor shaft; 420, brush motor coupling; 421, brush; 422, brush connecting shaft; 423, bearing; 424, bearing seat; 425, bearing cover; 426, front pressure sensor; 427, front pressure sensor mounting seat; 428, waterproof window; 429, waterproof cover; 430, water baffle; 431, water spray pipe; 432, water spray pipe mounting seat; 433, spray head; 1021, wafer fixed rotating structure mounting hole; 1022, spray and drying structure mounting hole; 1023, brush rotating and scrubbing structure mounting hole; 1041, front observation window 1041; 1042, right observation window; 2141, motor synchronous pulley; 2142, rotating main shaft synchronous pulley; 3101, upper bearing seat; 3102, lower bearing seat; 4061, left side plate; 4062, right side plate; 4063, front side plate; 4064, rear side plate; 4181, front micro module; 4182, rear micro module. Detailed implementation manners

[0044] The following further describes the present invention with reference to the drawings and specific embodiments:

[0045] AsFigures 1 to 19 As shown in the figure, a single-wafer scrubbing and drying device provided by the present invention includes a frame and housing structure, a wafer fixing and rotating structure, a spraying and drying structure, and a rotating brush scrubbing structure. The wafer fixing and rotating structure, the spraying and drying structure, and the rotating brush scrubbing structure are all installed inside the frame and housing structure. The wafer is placed on the wafer fixing and rotating structure, and the wafer is cleaned by the rotating brush scrubbing structure, and then the sprayed and dried wafer is sprayed and dried by the spraying and drying structure.

[0046] The frame and housing structure includes a body frame 101, on which a cleaning cavity 102, an upper exhaust window 103, an observation window 104, a splash guard 105, an internal mounting plate 106, a fixed side plate 107, a movable side plate 108, and an opening and closing door plate 109 are respectively installed. The cleaning cavity 102, the upper exhaust window 103, the observation window 104, the internal mounting plate 106, and the fixed side plate 107 are respectively connected and fixed to the body frame 101 through T-shaped nuts. The observation window 104 is connected and fixed to the body frame 101 through screws and nuts. The movable side plate 108 is connected to the body frame 101 through a magnetic attraction device, and the opening and closing door plate 109 is connected to the body frame 101 through a hinge structure.

[0047] The cleaning cavity 102 is provided with a wafer fixing and rotating structure mounting hole 1021, a spraying and drying structure mounting hole 1022, and a rotating brush scrubbing structure mounting hole 1023. The wafer fixing and rotating structure is installed on the wafer fixing and rotating structure mounting hole 1021. The spraying and drying structure is installed on the spraying and drying structure mounting hole 1022, and the rotating brush scrubbing structure is installed on the rotating brush scrubbing structure mounting hole 1023.

[0048] In this embodiment, the observation window 104 includes a front observation window 1041 and a right observation window 1042. The front observation window 1041 and the right observation window 1042 are symmetrically arranged front and back. Both the front observation window 1041 and the right observation window 1042 are connected to the body frame 101 through hinges.

[0049] The number of splash guards 105 is four, which are respectively located in the front, back, left, and right of the body frame 101. The internal mounting plate 106 includes an upper bearing plate 1061, a middle plate 1062, and a lower bottom plate 1063 arranged in sequence from top to bottom. The upper bearing plate 1061, the middle plate 1062, and the lower bottom plate 1063 are arranged parallel to each other.

[0050] The fixed side plate 107 includes a rear side plate 1071 and a left side plate 1072. The number of both the rear side plate 1071 and the left side plate 1072 is four. The rear side plate 1071 and the left side plate 1072 are distributed on the side of the body frame 101. The four rear side plates 1071 and the four left side plates 1072 are all arranged in sequence from top to bottom.

[0051] The movable side plate 108 includes a middle front plate 1081, a middle right plate 1082 and a lower front lower plate 1083. The middle front plate 1081 and the lower front lower plate 1083 are distributed on the same side of the machine body frame 101, and the middle right plate 1082 is located on the other side of the machine body frame 101, and this side is parallel to the plane where the middle front plate 1081 is located.

[0052] The opening and closing door plate 109 includes a lower front upper plate 1091 and a lower right plate 1092. The lower front upper plate 1091 is connected to the machine body frame 101 through a hinge, the number of the lower right plates 1092 is two and they are connected to the machine body frame 101 through hinges, and the lower front upper plate 1091 and the lower right plate 1092 are arranged parallel to each other.

[0053] In this embodiment, the machine body frame 101 is composed of 40 aluminum profiles spliced together. The cleaning cavity 102, the upper exhaust window 103, the observation window 104, the internal mounting plate 106 and the fixed side plate 107 are connected and fixed to the 101 machine body frame through T-nut bolts. The observation window 104 is connected and fixed to the machine body frame 101 through screws and nuts. The movable side plate 108 is connected to the machine body frame 101 through a magnetic attraction device, and the opening and closing door plate 109 is connected to the machine body frame 101 through a hinge structure. In Figure 3 In A is the front view of the machine body frame 101, and B is the right view of the machine body frame 101. Figure 4 In A is the left view of the machine body frame 101, and B is the rear view of the machine body frame 101.

[0054] Such as Figures 7 to 11As shown in the figure, the wafer fixing and rotating structure includes a rotating suction cup 201, a cross turntable 202, a rotating main shaft 203, a lifting turntable 204, wafer support claws 205, lifting turntable support columns 206, linear bearings 207, telescopic electric cylinders 208, upper mounting plates 209, lower mounting plates 210, wafer fixing and rotating side plates 211, wafer fixing and rotating bearings 212, sealing rings 213, synchronous belt pulleys 214, synchronous belts 215, motors 216, ventilation devices 217, silicon carbide 218, quick connectors 219 and silicon carbide sealing rings 221. The rotating suction cup 201 is fixedly connected to the cross turntable 202 by screws, the cross turntable 202 is fixedly connected to the rotating main shaft 203 by screws, the rotating main shaft 203 is connected to the wafer fixing and rotating bearing 212 by shaft-hole fit, and the wafer fixing and rotating bearing 212 is connected to the upper mounting plate 209 and the lower mounting plate 210 by shaft-hole fit. The sealing ring 213 is connected to the upper mounting plate 209 by shaft-hole fit, and the sealing ring 213 and the bearing 212 are coaxially arranged. The wafer support claws 205 are fixedly connected to the lifting turntable 204 by screws, the lifting turntable 204 is fixedly connected to the lifting turntable support columns 206 by screws, the lifting turntable support columns 206 are connected to the linear bearings 207 by shaft-hole fit, the linear bearings 207 are fixedly connected to the upper mounting plate 209 by screws, the lifting turntable support columns 206 are threadedly connected to the telescopic electric cylinders 208, the telescopic electric cylinders 208 are fixedly connected to the lower mounting plate 210 by screws, the ventilation device 217 is fixedly connected to the lower mounting plate 210 by screws, a sealed connection is achieved between the ventilation device 217 and the silicon carbide 218 through the silicon carbide sealing ring 221, the ventilation device 217 is threadedly connected to the quick connector 219, the silicon carbide 218 is connected to the rotating main shaft 203 by shaft-hole fit, the upper mounting plate 209, the lower mounting plate 210 and the wafer fixing and rotating side plate 211 are fixedly connected by screws, and the upper mounting plate 209 is positioned in cooperation with the cleaning cavity 102 through the wafer fixing and rotating structure mounting hole 1021 and fixedly connected by screws.

[0055] The synchronous belt pulley 214 includes a motor synchronous belt pulley 2141 and a rotating main shaft synchronous belt pulley 2142. The rotating main shaft 203 is connected to the rotating main shaft synchronous belt pulley 2142 by a key connection and an interference fit. The rotating main shaft synchronous belt pulley 2142 is connected to the motor synchronous belt pulley 2141 by a synchronous belt 215, the motor synchronous belt pulley 2141 is connected to the motor 216 by a key connection and an interference fit, and the motor 216 is fixedly connected to the lower mounting plate 210 by screws. When the motor 216 operates, it drives the rotating main shaft 203 to rotate through the motor synchronous belt pulley 2141, the synchronous belt 215 and the rotating main shaft synchronous belt pulley 2142. The number of the silicon carbide sealing rings 221 is two and they are arranged vertically.

[0056] When the motor 216 works, it drives the rotation of the motor synchronous pulley 2141, and then drives the rotation of the rotary main shaft synchronous pulley 2142 through the synchronous belt 215, thereby causing the rotary main shaft 203 to rotate, and finally causing the rotary suction cup 201 to rotate.

[0057] In this embodiment, the number of wafer support claws 205 is three, and they are evenly distributed on the lifting turntable 204. The number of lifting turntable support columns 206 is three, and they are evenly distributed. The linear bearings 207 are sleeved on the lifting turntable support columns 206, and the number is the same as that of the lifting turntable support columns 206. The number of telescopic electric cylinders 208 is the same as that of the lifting turntable support columns 206. The lifting turntable support columns 206 pass through the mounting plate 209 and the lower mounting plate 210 and are connected to the telescopic electric cylinders 208. When the telescopic electric cylinders 208 work, they drive the movement of the lifting turntable support columns 206, thereby causing the lifting turntable 204 to move up and down synchronously. The telescopic electric cylinders 208 are existing mature technology products.

[0058] The number of wafer fixing and rotating side plates 211 is two, including a left side plate and a right side plate, and they are arranged in parallel. The upper mounting plate 209 and the lower mounting plate 210 are fixed between the wafer fixing and rotating side plates 211 arranged in parallel. The wafer fixing and rotating bearings 212 are respectively installed on the upper mounting plate 209 and the lower mounting plate 210. The sealing ring 213 and the wafer fixing and rotating bearings 212 are both sleeved on the rotary main shaft 203. In this embodiment, the number of bearings 212 is two, and they are respectively connected to the upper mounting plate 209 and the lower mounting plate 210 through shaft-hole fit. The two bearings 212 are respectively embedded in the centers of the upper mounting plate 209 and the lower mounting plate 210 to facilitate the rotation of the rotary main shaft 203.

[0059] The ventilation device 217 is connected to the rotary suction cup 201 through the rotary main shaft 203. The ventilation device 217 is a ventilation connection block with a cylindrical structure. There is a ventilation hole in the middle of the ventilation device 217. There is a central through hole in the middle of the rotary main shaft 203. There is a rotary suction cup hole on the rotary suction cup 201. The ventilation hole of the ventilation device is communicated with the end of the central through hole of the rotary main shaft. The other end of the central through hole of the rotary main shaft is communicated with the rotary suction cup hole. In this embodiment, the silicon carbide 218 is in a ring structure.

[0060] A central through hole is provided in the middle of the cross turntable 202. A rotary chuck center hole is provided on the rotary chuck 201. The rotary chuck hole and the rotary chuck center hole are communicated. The rotary chuck center hole is located in the middle of the rotary chuck 201, and the rotary chuck holes surround the rotary chuck center hole. The other end of the rotary main shaft 203 is connected to the cross turntable 202 by screws, and the other end of the through hole of the rotary main shaft center is connected to the central through hole of the cross turntable 202. A rotary main shaft sealing ring 223 is provided between the two components and sealed by the rotary main shaft sealing ring 223. At the same time, the cross turntable 202 and the rotary chuck 201 are fixedly connected by screws. The central through hole is communicated with the rotary chuck hole of the rotary chuck 201, and a chuck sealing ring 222 is provided between the two components and sealed by the chuck sealing ring 222.

[0061] A quick connector 219 is installed on the air vent device 217. During use, the quick connector 219 is connected to an existing air pump. Through the air suction force generated by the existing air pump, the rotary chuck 201 generates a suction force to fix the wafer. In this embodiment, the quick connector 219 is an existing product, a standard part, with a model of PC8-G02 (the outer diameter of the connecting pipe is 8 mm, and the thread diameter is G1 / 4 external thread).

[0062] The wafer fixing and rotating structure includes a wafer picking, placing and clamping process and a wafer vacuum clamping and rotating process during use. The wafer picking, placing and clamping process is as follows:

[0063] During the use of the present invention, a wafer is placed on the wafer support claw 205 by a human or an existing robotic arm. At this time, the lifting turntable 204 is at the highest position. The telescopic electric cylinder 208 is started, and the wafer descends with the lifting turntable 204 and is finally placed on the rotary chuck 201. The lifting turntable 204 continues to descend to the lowest point, the air pump is started, and the wafer is tightly adsorbed. After waiting for the wafer to be cleaned by an existing cleaning device and the cleaning is completed, the air pump is stopped, the wafer is released, the telescopic electric cylinder 208 is started, the lifting turntable 204 rises, the wafer is lifted on the wafer support claw 205, and the telescopic electric cylinder 208 stops when the lifting turntable 204 reaches the highest position. The wafer is taken away by a human or a robotic arm to complete the whole process.

[0064] The wafer vacuum clamping and rotating process is as follows:

[0065] After the wafer is placed on the rotating chuck 201, the air pump is started, and the wafer is adsorbed, and the rotating chuck 201 starts to rotate. During the cleaning process of the wafer, it is necessary to meet the function that the rotating main shaft 203 rotates at a high speed and the ventilation device 217 and the trachea do not follow the rotation. Silicon carbide 218, a wear-resistant material, is specially selected. The outer ring of the silicon carbide 218 ring is tightly connected to the inner wall of the ventilation device 217 through a silicon carbide seal ring 221. The inner ring of the silicon carbide 218 ring forms a clearance fit with the rotating main shaft 203. When the rotating main shaft 203 rotates, it forms a clearance friction with the inner hole of the silicon carbide 218. The rotating main shaft 203 is a hollow shaft. When the air pump operates, this structure forms a sealed adsorption of the wafer, avoiding the problem that the ventilation device 217 and the trachea follow the rotation.

[0066] As Figures 12 to 14 shown, the spraying and drying structure includes a spraying head upper cover 301, a spraying head lower cover 302, a cleaning liquid spray head 303, a T-shaped joint 306, a quick-connect joint 307, a connecting head 308, a rotating shaft 309, a bearing seat 310, a reducer seat 311, a base 312, a motor 313, a reducer 314, a coupling 315, a spraying side plate 316, a liquid inlet pipe and a nitrogen pipe. The spraying head upper cover 301 and the spraying head lower cover 302 are fixedly connected by side screws. The spraying head lower cover 302 and the connecting head 308 are positioned by steps and fixedly connected by screws. The spraying head lower cover 302 and the T-shaped joint 306 are positioned by steps and fixedly connected by screws. The spraying head lower cover 302 and the cleaning liquid spray head 303 are threadedly connected. The T-shaped joint 306 and the quick-connect joint 307 are threadedly connected. The rotating shaft 309 and the connecting head 308 are fitted through a shaft hole and fixedly connected by a pin. The rotating shaft 309 and the bearing are fitted through a shaft hole, and the bearing and the bearing seat 310 are fitted through a shaft hole. Specifically, the rotating shaft 309 and the bearing are fitted through a shaft hole with the inner ring of the bearing as the reference, and the inner ring of the bearing and the rotating shaft are fitted by the basic hole system; the bearing and the bearing seat 310 are fitted through a shaft hole with the outer ring of the bearing as the reference, and the outer ring of the bearing and the hole on the bearing seat are fitted by the basic shaft system. The rotating shaft 309 is connected to the reducer 314 through a coupling 315; the reducer 314 and the motor 313 are fitted through a shaft hole and fixedly tightened by side screws; the bearing seat 310, the reducer seat 311, and the base 312 and the spraying side plate 316 are fixedly connected by screws. The reducer 314 and the reducer seat 311 are fixedly connected by screws. The rotating shaft 309 is provided with a rotating shaft center hole along the axis direction. The liquid inlet pipe is connected to the cleaning liquid spray head 303, and the other end of the liquid inlet pipe passes through the rotating shaft center hole and is connected to a water pump. The nitrogen pipe is connected to the quick-connect joint 307, and the other end of the nitrogen pipe passes through the rotating shaft center hole and is connected to a nitrogen source device.

[0067] The bearing housing 310 includes an upper bearing housing 3101 and a lower bearing housing 3102. The upper bearing housing 3101 is positioned in cooperation with the cleaning cavity 102 through the spray and drying structure mounting hole 1022 and is fixed by screw connection.

[0068] In this embodiment, the number of cleaning liquid nozzles 303 is two, and there are two quick connectors 307 in total. The spray side plates 316 include a spray left side plate and a spray right side plate arranged in parallel. The bottoms of the spray left side plate and the spray right side plate are connected by a base 312, and the upper bearing housing 3101 is located at the tops of the spray left side plate and the spray right side plate.

[0069] The motor 313 is connected to the rotating shaft 309 through a speed reducer 314 and a coupling 315. When the motor 313 operates, it drives the rotating shaft 309 to rotate, and then drives the lower cover 302 of the spray head to rotate, so that the cleaning liquid nozzle 303 moves.

[0070] The working process of the spray and drying structure is as follows:

[0071] After the wafer is brushed, the rotating shaft 309 drives the lower cover 302 of the spray head to rotate above the wafer. The cleaning liquid is ejected from the cleaning liquid nozzle 303 to spray and wash the surface of the wafer. At this time, the wafer rotates at a low speed to ensure spraying on the entire surface of the wafer. After the spraying is completed, nitrogen passes through the nitrogen pipe and acts on the surface of the wafer through the T-shaped joint 306 and the quick connector 307. At the same time, the wafer rotates at a high speed to cooperate with the nitrogen to dry the wafer.

[0072] As Figures 15 to 19As shown in the figure, the rotary brush scrubbing structure includes a rotary platform motor 401, a rotary platform 402, a sealing ring 403, a bottom plate 404, an upper plate 405, a side plate 406, a linear module 407, a module motor 408, a module mounting plate 409, a beam mounting plate 410, a beam 411, a beam protective cover 412, a rib plate 413, a rotary brush motor 414, a rotary brush motor mounting seat 415, a rear pressure sensor 416, a rear pressure sensor mounting seat 417, a micro module 418, a rotary brush motor shaft 419, a rotary brush motor coupling 420, a rotary brush 421, a rotary brush connecting shaft 422, a bearing 423, a bearing seat 424, a bearing cover 425, a front pressure sensor 426, a front pressure sensor mounting seat 427, a waterproof window 428, a waterproof cover 429, a water baffle 430, a water spray pipe 431, a water spray pipe mounting seat 432 and a nozzle 433. The rotary platform motor 401 is in shaft hole fit with the rotary platform 402 and is tightened and fixed by side screws. The rotary platform 402 is positioned by a pin with the bottom plate 404 and is connected and fixed by screws. The bottom plate 404, the upper plate 405 and the side plate 406 are connected and fixed by screws. The linear module 407 is respectively connected and fixed with the side plate 406 and the module mounting plate 409 by screws. The module mounting plate 409 is connected and fixed with the beam mounting plate 410 by screws. The rib plate 413 is connected and fixed with the module mounting plate 409 and the beam mounting plate 410 by screws; the beam mounting plate 410 is connected and fixed with the beam 411 by screws. The beam protective cover 412 is connected and fixed with the beam 411 by screws. The micro module 418 includes a front micro module 4181 and a rear micro module 4182. The rotary brush motor 414 is connected and fixed with the rotary brush motor mounting seat 415 by screws. The left and right outer sides of the rotary brush motor mounting seat 415 are connected and fixed with the rear micro module 4182 by screws. The upper side of the rotary brush motor mounting seat 415 is positioned by a pin with the rear pressure sensor 416 and is connected and fixed by screws; the rear pressure sensor 416 is positioned by a pin with the rear pressure sensor mounting seat 417 and is connected and fixed by screws. The rear pressure sensor mounting seat 417 is positioned by a step with the beam mounting plate 410 and is connected and fixed by screws; the left and right inner sides of the rear micro module 4182 are positioned by a step with the rear pressure sensor mounting seat 417 and are connected and fixed by screws. The rotary brush motor 414 is connected by a key with the rotary brush motor shaft 419 and is fixed by a pin. The rotary brush motor shaft 419 is connected and fixed with the rotary brush 421 by the rotary brush motor coupling 420. The rotary brush 421 is connected by a square hole fit with the rotary brush connecting shaft 422. The rotary brush connecting shaft 422 is connected by an interference fit of shaft hole with the bearing 423; the bearing 423 is installed in the bearing seat 424, and the bearing 423 is connected with the bearing seat 424 by shaft hole fit. The bearing seat 424 is connected and fixed with the bearing cover 425 by screws. The left and right outer sides of the bearing seat 424 are connected and fixed with the front micro module 4181 by screws; the upper side of the bearing seat 424 is positioned by a pin with the front pressure sensor 426 and is connected and fixed by screws.The front pressure sensor 426 and the front pressure sensor mounting seat 427 are positioned by pins and fixed by screw connection; the front pressure sensor mounting seat 427 and the beam 411 are positioned by pins and fixed by screw and nut connection; the front micro module 4181 and the left and right inner sides of the front pressure sensor mounting seat 427 are positioned by steps and fixed by screw connection; the front side plate 4063, the waterproof window 428, and the water spray pipe mounting seat 432 are positioned by slots and fixed by screw connection; the water baffle 430 is placed inside the waterproof window 428 and fixed to the beam 411 by screw connection. The upper and lower sides of the water baffle 430 are fixed to the waterproof cover 429 by screw connection; the upper and lower sides of the waterproof cover 429 are fixed to the waterproof window 428 by screw connection; the water spray pipe 431 is fixed to the water spray pipe mounting seat 432 by screw connection; the water spray pipe 431 is fixed to the nozzle 433 by threaded connection. The water pipe is connected to the water spray pipe 431, passes through the central hole of the 401 rotating platform, and is connected to the water pump below. The water pump is an existing mature technical device and provides cleaning liquid for the nozzle 433. The lower part of the rotating platform 402 is fixed to the internal mounting plate 106 by screw and nut connection, and the upper part is hermetically fitted with the cleaning cavity 102 through the brush rotating and brushing structure mounting hole 1023 of the cleaning cavity 102 through the sealing ring 403; a waste liquid outlet pipe is installed on the cleaning cavity 102, and the waste liquid outlet pipe is connected to the liquid outlet hole of the cleaning cavity 102, and finally the waste liquid is discharged.

[0073] In this embodiment, the micro module 418 is an existing mature technical product, which is a micro linear module with a model of TGN5H-25 (the guide rail width is 5 mm, and the guide rail length is 25 mm).

[0074] The brush side plate 406 includes a left side plate 4061, a right side plate 4062, a front side plate 4063, and a rear side plate 4064. The left side plate 4061, the right side plate 4062, the front side plate 4063, and the rear side plate 4064 are connected and the cross-section is rectangular. The linear module 407 is respectively fixed to the left side plate 4061 and the module mounting plate 409 by screw connection.

[0075] The front side plate 4063 is provided with a rectangular front side plate through hole, and the beam 411 passes through the front side plate through hole. During the operation of the linear module 407, the beam 411 moves up and down in the front side plate through hole.

[0076] In this embodiment, there are two water spray pipes 431 and five nozzles 433.

[0077] When in use, the brush rotating and brushing structure includes a brush brushing process and a pressure sensor operation process, and the brush brushing process is as follows:

[0078] During the use of the present invention, after placing the wafer to be cleaned at the existing processing position, the rotating platform 402 drives the rotating brush 421 to rotate above the wafer, and the module motor 408 starts to drive the rotating brush 421 to move downward to contact the wafer. When the rotating brush 421 presses down the wafer, the pressure is feedback to the rear pressure sensor 416 and the front pressure sensor 426. After reaching the preset pressure, the rotating brush 421 stops moving downward. The rotating brush motor 414 drives the rotating brush to rotate. At the same time, the water pump starts, and the spray head 433 sprays the cleaning liquid to brush the surface of the wafer. After the cleaning is completed, the water pump stops, the rotating brush 414 stops rotating, the rotating brush 414 rises to the initial position, and the rotating platform 402 rotates to the initial position, and the cleaning ends.

[0079] When the present invention is in use, the pressure sensors operate as follows:

[0080] In the natural state, the rear pressure sensor 416 and the front pressure sensor 426 are calibrated to zero. When the rotating brush 414 presses down the wafer, the wafer reacts against the rotating brush 414, and the force is transmitted to the rear pressure sensor 416 and the front pressure sensor 426. When the resultant force reaches the preset pressure, the rotating brush 414 stops moving downward and brushes the surface of the wafer at the preset pressure. The micro-module 418 enables the bearing seat 424 and the rotating brush motor mounting seat 415 to only move up and down, restricting their left and right movements and front and rear movements, so that the reaction force acts more accurately on the rear pressure sensor 416 and the front pressure sensor 426.

[0081] The bottom plate 404, the upper plate 405 and the side plate 406 form a box body. During the operation of the rotating platform motor 401, it can drive the rotating platform 402 to rotate, and then drive the bottom plate 404 to move, so that the box body moves, and finally the beam 411 installed on the box body moves synchronously, moving the rotating brush 421 to the dry wafer to be cleaned.

[0082] In this embodiment, the module motor 408 controls the movement of the linear module 407, and the linear module 407 drives the beam mounting plate 410 to move, so that the beam 411 moves.

[0083] Those of ordinary skill in the art will realize that the embodiments described herein are for helping the reader understand the principles of the present invention, and it should be understood that the protection scope of the present invention is not limited to such specific statements and embodiments. Those of ordinary skill in the art can make various other specific deformations and combinations without departing from the essence of the present invention according to the technical revelations disclosed in the present invention, and these deformations and combinations are still within the protection scope of the present invention.

Claims

1. A single-wafer scrubbing and drying device, characterized in that: It includes a frame and housing structure, a wafer fixing and rotating structure, a spraying and drying structure, and a rotating brush scrubbing structure. The wafer fixing and rotating structure, the spraying and drying structure, and the rotating brush scrubbing structure are all installed inside the frame and housing structure. The wafer is placed on the wafer fixing and rotating structure, and the wafer is cleaned by the rotating brush scrubbing structure, and then the sprayed and dried wafer is sprayed and dried by the spraying and drying structure.

2. The single-wafer scrubbing and drying apparatus according to claim 1, wherein: The frame and housing structure includes a machine body frame (101). A cleaning cavity (102), an upper exhaust window (103), an observation window (104), a splash guard (105), an internal mounting plate (106), a fixed side plate (107), a movable side plate (108), and an opening and closing door plate (109) are respectively installed on the machine body frame (101). The cleaning cavity (102), the upper exhaust window (103), the observation window (104), the internal mounting plate (106), and the fixed side plate (107) are respectively connected and fixed to the machine body frame (101) through T-nuts. The observation window (104) is connected and fixed to the machine body frame (101) through screws and nuts. The movable side plate (108) is connected to the machine body frame (101) through a magnetic attraction device. The opening and closing door plate (109) is connected to the machine body frame (101) through a hinge structure.

3. A single-wafer scrubbing and drying device according to claim 1, characterized in that: The cleaning cavity (102) is provided with a wafer fixing and rotating structure mounting hole (1021), a spraying and drying structure mounting hole (1022), and a rotating brush scrubbing structure mounting hole (1023). The wafer fixing and rotating structure is installed on the wafer fixing and rotating structure mounting hole (1021). The spraying and drying structure is installed on the spraying and drying structure mounting hole (1022). The rotating brush scrubbing structure is installed on the rotating brush scrubbing structure mounting hole (1023).

4. A single-wafer scrubbing and drying device according to claim 1, characterized in that: The wafer fixing and rotating structure includes a rotating suction cup (201), a cross turntable (202), a rotating main shaft (203), a lifting turntable (204), wafer support claws (205), lifting turntable support columns (206), linear bearings (207), telescopic electric cylinders (208), upper mounting plates (209), lower mounting plates (210), wafer fixing and rotating side plates (211), wafer fixing and rotating bearings (212), sealing rings (213), synchronous belt pulleys (214), synchronous belts (215), motors (216), air vent devices (217), silicon carbide (218), quick connectors (219) and silicon carbide sealing rings (221). The rotating suction cup (201) is fixedly connected to the cross turntable (202) by screws. The cross turntable (202) is fixedly connected to the rotating main shaft (203) by screws. The rotating main shaft (203) is connected to the wafer fixing and rotating bearing (212) by shaft-hole fit. The wafer fixing and rotating bearing (212) is connected to the upper mounting plate (209) and the lower mounting plate (210) by shaft-hole fit. The sealing ring (213) is connected to the upper mounting plate (209) by shaft-hole fit. The wafer support claws (205) are fixedly connected to the lifting turntable (204) by screws. The lifting turntable (204) is fixedly connected to the lifting turntable support columns (206) by screws. The lifting turntable support columns (206) are connected to the linear bearings (207) by shaft-hole fit. The linear bearings (207) are fixedly connected to the upper mounting plate (209) by screws. The lifting turntable support columns (206) are connected to the telescopic electric cylinders (208) by threads. The telescopic electric cylinders (208) are fixedly connected to the lower mounting plate (210) by screws. The air vent devices (217) are fixedly connected to the lower mounting plate (210) by screws. The air vent devices (217) and the silicon carbide (218) are hermetically connected through the silicon carbide sealing ring (221). The air vent devices (217) are connected to the quick connectors (219) by threads. The silicon carbide (218) is connected to the rotating main shaft (203) by shaft-hole fit. The upper mounting plates (209), the lower mounting plates (210) and the wafer fixing and rotating side plates (211) are fixedly connected by screws. The upper mounting plate (209) is positioned in cooperation with the cleaning cavity (102) through the wafer fixing and rotating structure mounting holes (1021) and fixedly connected by screws.

5. A single-wafer brushing and drying device according to claim 1, characterized in that: The synchronous belt pulley (214) includes a motor synchronous belt pulley (2141) and a rotating main shaft synchronous belt pulley (2142). The rotating main shaft (203) is connected to the rotating main shaft synchronous belt pulley (2142) by key connection and interference fit. The rotating main shaft synchronous belt pulley (2142) is connected to the motor synchronous belt pulley (2141) by a synchronous belt (215). The motor synchronous belt pulley (2141) is connected to the motor (216) by key connection and interference fit. The motor (216) is fixedly connected to the lower mounting plate (210) by screws.

6. The monolithic wafer scrubbing and drying apparatus according to claim 1, wherein: The spraying and drying structure includes a spray head upper cover (301), a spray head lower cover (302), a cleaning liquid spray head (303), a T-shaped joint (306), a quick-connect joint (307), a connecting head (308), a rotating shaft (309), a bearing seat (310), a reducer base (311), a base (312), a motor (313), a reducer (314), a coupling (315), a spray side plate (316), a liquid inlet pipe and a nitrogen pipe. The spray head upper cover (301) and the spray head lower cover (302) are fixedly connected by side screws. The spray head lower cover (302) and the connecting head (308) are positioned by steps and fixedly connected by screws. The spray head lower cover (302) and the T-shaped joint (306) are positioned by steps and fixedly connected by screws. The spray head lower cover (302) and the cleaning liquid spray head (303) are threadedly connected. The T-shaped joint (306) and the quick-connect joint (307) are threadedly connected. The rotating shaft (309) and the connecting head (308) are fitted by shaft holes and fixedly connected by pins. The rotating shaft (309) and the bearing are fitted by shaft holes. The bearing and the bearing seat (310) are fitted by shaft holes. The rotating shaft (309) and the reducer (314) are connected by a coupling (315). The reducer (314) and the motor (313) are fitted by shaft holes and tightened and fixed by side screws. The bearing seat (310), the reducer base (311), the base (312) and the spray side plate (316) are fixedly connected by screws. The reducer (314) and the reducer base (311) are fixedly connected by screws. The rotating shaft (309) is provided with a rotating shaft center hole along the axial direction. The liquid inlet pipe is connected to the cleaning liquid spray head (303), and the other end of the liquid inlet pipe passes through the rotating shaft center hole and is connected to a water pump. The nitrogen pipe is connected to the quick-connect joint (307), and the other end of the nitrogen pipe passes through the rotating shaft center hole and is connected to a nitrogen source device.

7. A single-wafer brushing and drying device according to claim 1, characterized in that: The bearing seat (310) includes an upper bearing seat (3101) and a lower bearing seat (3102). The upper bearing seat (3101) and the cleaning cavity (102) are positioned by fitting through the spraying and drying structure mounting holes (1022) and fixedly connected by screws.

8. A single-wafer scrubbing and drying apparatus according to claim 1, wherein: The rotary brush rotating and scrubbing structure includes a rotary platform motor (401), a rotary platform (402), a sealing ring (403), a bottom plate (404), an upper plate (405), a side plate (406), a linear module (407), a module motor (408), a module mounting plate (409), a beam mounting plate (410), a beam (411), a beam protective cover (412), a rib plate (413), a rotary brush motor (414), a rotary brush motor mounting seat (415), a rear pressure sensor (416), a rear pressure sensor mounting seat (417), a micro module (418), a rotary brush motor shaft (419), a rotary brush motor coupling (420), a rotary brush (421), a rotary brush connecting shaft (422), a bearing (423), a bearing seat (424), a bearing cover (425), a front pressure sensor (426), a front pressure sensor mounting seat (427), a waterproof window (428), a waterproof cover (429), a water baffle (430), a water spray pipe (431), a water spray pipe mounting seat (432), and a nozzle (433). The rotary platform motor (401) is in shaft hole fit with the rotary platform (402) and is tightened and fixed by side screws. The rotary platform (402) is positioned by a pin and connected and fixed by screws with the bottom plate (404). The bottom plate (404), the upper plate (405), and the side plate (406) are connected and fixed by screws. The linear module (407) is respectively connected and fixed by screws with the side plate (406) and the module mounting plate (409). The module mounting plate (409) is connected and fixed by screws with the beam mounting plate (410). The rib plate (413) is connected and fixed by screws with the module mounting plate (409) and the beam mounting plate (410). The beam mounting plate (410) is connected and fixed by screws with the beam (411). The beam protective cover (412) is connected and fixed by screws with the beam (411). The micro module (418) includes a front micro module (4181) and a rear micro module (4182). The rotary brush motor (414) is connected and fixed by screws with the rotary brush motor mounting seat (415). The left and right outer sides of the rotary brush motor mounting seat (415) are connected and fixed by screws with the rear micro module (4182). The upper side of the rotary brush motor mounting seat (415) is positioned by a pin and connected and fixed by screws with the rear pressure sensor (416). The rear pressure sensor (416) is positioned by a pin and connected and fixed by screws with the rear pressure sensor mounting seat (417). The rear pressure sensor mounting seat (417) is positioned by a step and connected and fixed by screws with the beam mounting plate (410). The left and right inner sides of the rear micro module (4182) are positioned by a step and connected and fixed by screws with the rear pressure sensor mounting seat (417).The rotary brush motor (414) and the rotary brush motor shaft (419) are connected by a key and fixed by a pin. The rotary brush motor shaft (419) and the rotary brush (421) are connected and fixed by a rotary brush motor coupling (420). The rotary brush (421) and the rotary brush connecting shaft (422) are connected by a square hole fit. The rotary brush connecting shaft (422) and the bearing (423) are connected by an interference fit of the shaft hole. The bearing (423) and the bearing seat (424) are connected by a shaft hole fit. The bearing seat (424) and the bearing cover (425) are fixed by screws. The left and right outer sides of the bearing seat (424) and the front micro-module (4181) are fixed by screws. The upper side of the bearing seat (424) and the front pressure sensor (426) are positioned by a pin and fixed by screws. The front pressure sensor (426) and the front pressure sensor mounting seat (427) are positioned by a pin and fixed by screws. The front pressure sensor mounting seat (427) and the beam (411) are positioned by a pin and fixed by screws and nuts. The left and right inner sides of the front micro-module (4181) and the front pressure sensor mounting seat (426) are positioned by steps and fixed by screws. The front side plate (4063) and the waterproof window (428), the water spray pipe mounting seat (432) are positioned by grooves and fixed by screws. The water baffle (430) is placed inside the waterproof window (428) and fixed to the beam (411) by screws. The upper and lower sides of the water baffle (430) and the waterproof cover (429) are fixed by screws. The waterproof cover (429) and the upper and lower sides of the waterproof window (428) are fixed by screws. The water spray pipe (431) and the water spray pipe mounting seat (432) are fixed by screws. The water spray pipe (431) and the nozzle (433) are fixed by a threaded connection. The water pipe is connected to the water spray pipe (431), passes through the center hole of the rotary platform (401) and is connected to the water pump below. The lower part of the rotary platform (402) and the internal mounting plate (106) are fixed by screws and nuts. The upper part is hermetically fitted with the cleaning cavity (102) through the rotary brush rotating and scrubbing structure mounting hole (1023) by a sealing ring (403). The waste liquid outlet pipe is connected to the liquid outlet hole of the cleaning cavity (102) and finally discharges the waste liquid.

9. The single-wafer scrubbing and drying device according to claim 1, characterized in that: The side plate (406) includes a left side plate (4061), a right side plate (4062), a front side plate (4063) and a rear side plate (4064). The left side plate (4061), the right side plate (4062), the front side plate (4063) and the rear side plate (4064) are connected and the cross-section is rectangular. The linear module (407) is fixedly connected to the left side plate (4061) and the module mounting plate (409) by screws.

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