Circuit board, preparation method of circuit board and electronic equipment
By forming a solder resist layer with grooves on the circuit board substrate and setting up a reinforcement layer, the problem of insufficient flatness of the circuit board is solved, and a low-cost high flatness effect is achieved, and it is suitable for electronic equipment such as multi-function cameras.
CN120264574APending Publication Date: 2025-07-04WUXI SHENNAN CIRCUITS CO LTD
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Patent Information
- Application Number
- CN202510258802.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-04
- Publication Date
- 2025-07-04
AI Technical Summary
Technical Problem
The prior art cannot meet the flatness requirements when preparing circuit boards, especially in multi-function cameras, and the dry film type soldering resistance process is too high.
Method used
A solder resist layer with grooves is formed on the substrate of the circuit board, and a rubber layer with a reinforcement layer is provided in the groove to prevent the rubber layer from overflowing through the grooves. At the same time, the reinforcement layer is supported by the edge area of the solder resist layer to ensure flatness.
Benefits of technology
It effectively improves the flatness of the circuit board, especially the installation stability of devices such as lenses in the camera, and reduces costs.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention provides a circuit board, a preparation method of the circuit board and electronic equipment. The circuit board comprises a substrate; the solder mask layer is arranged on the end face of at least one side of the substrate, and a groove is formed in the end face of the side, away from the substrate, of the solder mask layer; and the reinforcing layer is connected with the side, where the groove is formed, of the solder mask layer, and an adhesive layer is arranged on the reinforcing layer and located in the groove. Through the mode, the adhesive layer can be placed in the groove, so that the adhesive layer is prevented from overflowing from the solder mask layer through the groove, and the edge area, forming the groove, of the solder mask layer is connected with the reinforcing layer, so that the edge area of the reinforcing layer can support the reinforcing layer, and the flatness of the surface of the reinforcing layer is effectively ensured.
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