Tracker module

Abstract

A tracker module (1A) is provided with a module substrate (90), and an integrated circuit (80) disposed on the module substrate (90), the integrated circuit (80) having at least one switch included in a preregulator circuit (10), at least one switch included in a switched capacitor circuit (20), at least one switch included in an output switching circuit (30), and a digital control circuit (60), and the digital control circuit (60) is configured so that, in a plan view of the module substrate (90), the digital control circuit (60) is configured so that the digital control circuit (60) is switched between the preregulator circuit (10) and the switched capacitor circuit (20). At least one of the at least one switch included in the output switching circuit (30) and the digital control circuit (60) is disposed between the at least one switch included in the preregulator circuit (10) and the at least one switch included in the switched capacitor circuit (20).

Description

Technical Field

[0001] The present invention relates to a tracker module. Background Art

[0002] A power supply modulation circuit (tracker circuit) that supplies a power supply voltage to a power amplifier circuit based on an envelope signal is disclosed in Patent Document 1. The power supply modulation circuit includes a magnetic conversion circuit (Magnetic Regulation Stage: pre-regulator circuit) that converts a voltage, a switched-capacitor circuit (Switched-Capacitor Voltage Balancer Stage) that generates a plurality of voltages having different voltage levels based on the voltage, and an output switching circuit (Output Switching Stage) that selects and outputs at least one of the plurality of voltages. The magnetic conversion circuit includes a switch and a power inductor, the switched-capacitor circuit includes a switch and a capacitor, and the output switching circuit includes a switch.

[0003] Patent Document 1: U.S. Patent No. 9,755,672 Specification

[0004] However, in the structure of the tracker circuit of Patent Document 1, since the switched-capacitor circuit generates a plurality of discrete voltages based on the voltage output from the pre-regulator circuit, there is a case where the efficiency of the tracker circuit deteriorates due to heat generation. Summary of the Invention

[0005] Accordingly, the present invention provides a tracker module that suppresses efficiency deterioration caused by heat generation.

[0006] A tracker module according to an aspect of the present invention includes a module substrate and an integrated circuit disposed on the module substrate. The integrated circuit includes at least one switch included in a converter circuit configured to convert an input voltage into a first voltage; at least one switch included in a switched-capacitor circuit configured to generate a plurality of discrete second voltages based on the first voltage; at least one switch included in an output switching circuit configured to selectively output at least one of the plurality of discrete second voltages generated by the switched-capacitor circuit; and a digital control circuit configured to control the output switching circuit to selectively output at least one of the plurality of discrete second voltages based on a digital control signal corresponding to an envelope signal. When viewed from above the module substrate, at least one of the at least one switch included in the output switching circuit and the digital control circuit is disposed between the at least one switch included in the converter circuit and the at least one switch included in the switched-capacitor circuit.

[0007] In addition, a tracker module according to one embodiment of the present invention includes: a module substrate; a first integrated circuit disposed on the module substrate and having at least one switch included in a converter circuit configured to convert an input voltage into a first voltage; a second integrated circuit disposed on the module substrate and having at least one switch included in a switched-capacitor circuit configured to generate a plurality of discrete second voltages based on the first voltage; a third integrated circuit disposed on the module substrate and having at least one switch included in an output switch circuit configured to selectively output at least one of the plurality of discrete second voltages generated by the switched-capacitor circuit; and a digital control circuit that controls the output switch circuit to selectively output at least one of the plurality of discrete second voltages based on a digital control signal corresponding to an envelope signal. When viewed from above the module substrate, at least one of the at least one switch included in the output switch circuit and the digital control circuit is disposed between the at least one switch included in the converter circuit and the at least one switch included in the switched-capacitor circuit.

[0008] In addition, a tracker module according to one embodiment of the present invention includes a module substrate and an integrated circuit disposed on the module substrate. The integrated circuit includes: a first switch, a second switch, a third switch, a fourth switch, a fifth switch, a sixth switch, a seventh switch, and an eighth switch, which are included in a switched-capacitor circuit; a ninth switch and a tenth switch, which are included in an output switch circuit connected to the switched-capacitor circuit; an eleventh switch and a twelfth switch, which are included in a converter circuit connected to the switched-capacitor circuit; and a digital control circuit that controls the first to twelfth switches. The switched-capacitor circuit includes: a first capacitor having a first electrode and a second electrode; a second capacitor having a third electrode and a fourth electrode; and the first to eighth switches. One end of the first switch and one end of the third switch are connected to the first electrode, one end of the second switch and one end of the fourth switch are connected to the second electrode, one end of the fifth switch and one end of the seventh switch are connected to the third electrode, one end of the sixth switch and one end of the eighth switch are connected to the fourth electrode. The other ends of the first switch, the second switch, the fifth switch, and the sixth switch are connected to each other, the other end of the third switch is connected to the other end of the seventh switch, and the other end of the fourth switch is connected to the other end of the eighth switch. The output switch circuit includes: a first output terminal; a ninth switch connected between the other ends of the first switch, the second switch, the fifth switch, and the sixth switch and the first output terminal; and a tenth switch connected between the other ends of the third switch and the seventh switch and the first output terminal. The converter circuit includes: an input terminal; an eleventh switch connected between the input terminal and one end of a power inductor; and a twelfth switch connected between one end of the power inductor and a ground line. The other end of the power inductor is connected to the other ends of the first switch, the second switch, the fifth switch, and the sixth switch. When viewed from above the module substrate, at least one of the ninth switch, the tenth switch, and the digital control circuit is disposed between the eleventh switch and the twelfth switch and the first to eighth switches.

[0009] According to a tracker module of one embodiment of the present invention, a tracker module that suppresses deterioration in efficiency caused by heat generation can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1A is a diagram showing an example of the transition of the power supply voltage in the average power tracking (APT) mode.

[0011] Figure 1B is a diagram showing an example of the transition of the power supply voltage in the analog ET mode.

[0012] Figure 1C It is a diagram showing an example of the transition of the power supply voltage in the digital ET mode.

[0013] Figure 2 It is a circuit structure diagram of the tracker circuit and the communication device of the embodiment.

[0014] Figure 3 It is a circuit structure diagram of the pre-regulator circuit, the switched-capacitor circuit, the output switch circuit, and the filter circuit of the embodiment.

[0015] Figure 4 It is a circuit structure diagram of the digital control circuit of the embodiment.

[0016] Figure 5A It is a top view of the tracker module of the embodiment.

[0017] Figure 5B It is a top view of the tracker module of the embodiment.

[0018] Figure 5C It is a cross-sectional view of the tracker module of the embodiment.

[0019] Figure 5D It is a top view showing a part of the integrated circuit of the embodiment.

[0020] Figure 6A It is a top view of the tracker module of Modification 1.

[0021] Figure 6B It is a cross-sectional view of the tracker module of Modification 1.

[0022] Figure 7 It is a top view of the tracker module of Modification 2.

[0023] Figure 8 It is a top view of the tracker module of Modification 3.

[0024] Figure 9A It is a top view of the tracker module of Modification 4.

[0025] Figure 9B It is a cross-sectional view of the tracker module of Modification 4.

[0026] Figure 10 It is a top view of the tracker module of Modification 5.

[0027] Figure 11A It is a top view of the tracker module of Modification 6.

[0028] Figure 11B It is a top view of the tracker module of Modification 6.

[0029] Figure 11CIt is a cross-sectional view of the tracker module of Modification 6. Detailed Implementation Manner

[0030] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The embodiments described below all show general or specific examples. The numerical values, shapes, materials, constituent elements, arrangements of constituent elements, connection manners, etc. shown in the following embodiments are examples and do not limit the present invention.

[0031] In addition, each drawing is a schematic diagram that is appropriately emphasized, omitted, or adjusted in ratio for the purpose of showing the present invention, and is not necessarily strictly illustrated. There are cases where it is different from the actual shape, positional relationship, and ratio. In each drawing, substantially the same structure may be given the same reference numeral, and repeated descriptions may be omitted or simplified.

[0032] In the following drawings, the x-axis and the y-axis are axes orthogonal to each other in a plane parallel to the main surface of the module substrate. Specifically, when the module substrate has a rectangular shape in plan view, the x-axis is parallel to the first side of the module substrate, and the y-axis is parallel to the second side of the module substrate orthogonal to the first side. In addition, the z-axis is an axis perpendicular to the main surface of the module substrate, and its positive direction represents the upward direction, and its negative direction represents the downward direction.

[0033] In the circuit structure of the present invention, "connection" includes not only the case of direct connection through connection terminals and / or wiring conductors, but also the case of electrical connection via other circuit elements. "Connected between A and B" means connected to both A and B between A and B.

[0034] In the component arrangement of the present invention, "a component is arranged on a substrate" includes the case where the component is arranged on the main surface of the substrate and the case where the component is arranged inside the substrate. "A component is arranged on the main surface of the substrate" includes not only the case where the component is arranged in contact with the main surface of the substrate, but also the case where the component is arranged above the main surface without contacting the main surface (for example, the component is stacked on another component arranged in contact with the main surface). In addition, "a component is arranged on the main surface of the substrate" may also include the case where the component is arranged in a recess formed in the main surface. "A component is arranged inside the substrate" includes not only the case where the component is encapsulated inside the module substrate, but also the case where although the entire component is arranged between the two main surfaces of the substrate, a part of the component is not covered by the substrate, and the case where only a part of the component is arranged inside the substrate.

[0035] In addition, in the component configuration of the present invention, "top view of the module substrate" means observing the object by orthographically projecting it onto the xy plane from the positive side of the z axis. "A overlaps B in top view" means that at least a part of the region of A orthographically projected onto the xy plane overlaps at least a part of the region of B orthographically projected onto the xy plane. In addition, "A is disposed between B and C" means that at least one of a plurality of line segments connecting any point in B and any point in C passes through A.

[0036] In addition, in the component configuration of the present invention, "A and B are adjacently disposed" means that A and B are disposed close to each other. Specifically, it means that there are no other circuit components in the space where A and B face each other. In other words, "A and B are adjacently disposed" means that any of the plurality of line segments reaching B from any point on the surface of A facing B along the normal direction of the surface does not pass through circuit components other than A and B. Here, a circuit component means a component including an active element and / or a passive element. In other words, circuit components include active components including transistors or diodes, etc., and passive components including inductors, transformers, capacitors, or resistors, etc., and do not include electromechanical components including terminals, connectors, or wirings.

[0037] In the present invention, a "terminal" means a point where a conductor in an element ends. In addition, when the resistance of the conductor between elements is sufficiently low, the terminal can be interpreted not only as a single point but also as any point on the conductor between elements or the entire conductor.

[0038] In addition, statements indicating the relationship between elements such as "parallel" and "perpendicular", statements indicating the shape of elements such as "rectangle", and numerical ranges do not only represent strict meanings but also include substantially equivalent ranges, such as an error of about several percent.

[0039] First, as a technique for efficiently amplifying high-frequency signals, a tracking mode in which a power supply voltage dynamically adjusted according to the passage of time based on a high-frequency signal is supplied to a power amplifier will be described. The tracking mode is a mode in which the power supply voltage applied to the power amplification circuit is dynamically adjusted. There are several types of tracking modes. However, here, refer to Figures 1A - 1C the average power tracking (APT) mode and the ET (envelope tracking) mode (including the analog ET mode and the digital ET mode) will be described. In Figures 1A - 1C it, the horizontal axis represents time and the vertical axis represents voltage. In addition, the thick solid line represents the power supply voltage and the thin solid line (waveform) represents the modulation wave.

[0040] Figure 1AIt is a diagram showing an example of the change in the power supply voltage in the APT mode. In the APT mode, based on the average power, the power supply voltage is changed to multiple discrete voltage levels in units of one frame. As a result, the power supply voltage signal forms a rectangular wave.

[0041] A frame refers to the unit that constitutes a high-frequency signal (modulated wave). For example, in 5G NR (5th Generation New Radio) and LTE (Long Term Evolution), a frame contains ten sub-frames, each sub-frame contains multiple time slots, and each time slot is composed of multiple symbols. The sub-frame length is 1 ms, and the frame length is 10 ms.

[0042] In addition, the mode in which the voltage level is changed in units of one frame or a unit larger than one frame based on the average power is called the APT mode, which is distinguished from the mode in which the voltage level is changed in a unit smaller than one frame (such as a sub-frame, a time slot, or a symbol). For example, the mode in which the voltage level is changed in units of symbols is called the Symbol Power Tracking (SPT) mode, which is distinguished from the APT mode.

[0043] Figure 1B It is a diagram showing an example of the change in the power supply voltage in the analog ET mode. In the analog ET mode, the envelope of the modulated wave is tracked by continuously changing the power supply voltage based on the envelope signal.

[0044] The envelope signal is a signal representing the envelope of the modulated wave. The envelope value is represented, for example, by the square root of (I 2 +Q 2 ). Here, (I, Q) represents a constellation point. A constellation point refers to a point representing a signal modulated by digital modulation on a constellation diagram. For example, (I, Q) is determined based on transmission information, such as through a Baseband Integrated Circuit (BBIC).

[0045] Figure 1C It is a diagram showing an example of the change in the power supply voltage in the digital ET mode. In the digital ET mode, the envelope of the modulated wave is tracked by changing the power supply voltage to multiple discrete voltage levels within one frame based on the envelope signal. As a result, the power supply voltage signal forms a rectangular wave.

[0046] (Embodiment)

[0047] The communication device 6 of the present embodiment corresponds to a user terminal (UE: User Equipment) in a cellular network. Typically, it is a mobile phone, a smart phone, a tablet computer, a wearable device, etc. In addition, the communication device 6 may also be an IoT (Internet of Things) sensor device, a medical / healthcare device, a vehicle, an unmanned aerial vehicle (UAV) (so-called drone), or an automated guided vehicle (AGV). Additionally, the communication device 6 may also function as a BS (Base Station) in a cellular network.

[0048] Refer to Figure 2 The circuit structures of the communication device 6 and the tracker circuit 1 of the present embodiment will be described. Figure 2 It is a circuit structure diagram of the tracker circuit 1 and the communication device 6 of the embodiment.

[0049] In addition, Figure 2 It is an exemplary circuit structure, and the communication device 6 and the tracker circuit 1 can be installed using any one of a variety of circuit installations and circuit technologies. Therefore, the descriptions of the communication device 6 and the tracker circuit 1 provided below should not be interpreted restrictively.

[0050] [1 Circuit Structure of Communication Device 6]

[0051] First, refer to Figure 2 The communication device 6 of the embodiment will be described. The communication device 6 includes a tracker circuit 1, a power amplifier 2, a filter 3, an RFIC (Radio Frequency Integrated Circuit) 5, and an antenna 4.

[0052] The tracker circuit 1 can supply a plurality of discrete voltages V to the power amplifier 2 based on a tracking mode A . As the tracking mode, a digital ET mode or an SPT mode can be used, but it is not limited thereto. As Figure 2 shown, the tracker circuit 1 includes a pre-regulator circuit 10, a switched-capacitor circuit 20, an output switch circuit 30, a filter circuit 40, a DC power supply 50, and a digital control circuit 60.

[0053] The pre-regulator circuit 10 is an example of a converter circuit and includes a power inductor and a switch. The power inductor is an inductor for boosting and / or bucking a direct current (DC) voltage. The power inductor is connected in series in a DC path. In addition, the power inductor may also be connected (parallel configuration) between the DC path and the ground. The pre-regulator circuit 10 can convert an input voltage into a first voltage using the power inductor. Such a pre-regulator circuit 10 is also sometimes referred to as a magnetic regulator or a DC / DC converter.

[0054] The switched-capacitor circuit 20 includes a plurality of capacitors and a plurality of switches, and can generate a plurality of second voltages having a plurality of discrete voltage levels respectively as a plurality of discrete voltages based on the first voltage from the pre-regulator circuit 10. The switched-capacitor circuit 20 is also sometimes referred to as a Switched-Capacitor Voltage Balancer.

[0055] The output switch circuit 30 is configured to selectively output at least one of the plurality of second voltages generated by the switched-capacitor circuit 20 to the power amplifier 2. The output switch circuit 30 is controlled based on a digital control signal.

[0056] The filter circuit 40 can attenuate noise from the plurality of discrete voltages supplied to the power amplifier 2. The filter circuit 40 is also sometimes referred to as a pulse shaping filter or a transition shaping filter.

[0057] The DC power supply 50 can supply a DC voltage to the pre-regulator circuit 10. As the DC power supply 50, for example, a rechargeable battery can be used, but it is not limited thereto.

[0058] The digital control circuit 60 can control the pre-regulator circuit 10, the switched-capacitor circuit 20, the output switch circuit 30, and the filter circuit 40 based on a digital control signal from the RFIC 5. More specifically, the digital control circuit 60 can control the output switch circuit 30 to selectively output at least one of the plurality of discrete second voltages based on a digital control signal corresponding to an envelope signal.

[0059] In addition, the tracker circuit 1 may not include at least one of the filter circuit 40 and the DC power supply 50. For example, the tracker circuit 1 may not include the DC power supply 50. Additionally, any combination of the pre-regulator circuit 10, the switched-capacitor circuit 20, the output switch circuit 30, and the filter circuit 40 may be integrated into a single circuit. Further, the tracker circuit 1 may include a plurality of voltage supply circuits instead of the pre-regulator circuit 10 and the switched-capacitor circuit 20. In this case, the output switch circuit 30 may be configured to select at least one of the plurality of voltage supply circuits.

[0060] The power amplifier 2 is connected between the RFIC 5 and the filter 3. Also, the power amplifier 2 is connected to the tracker circuit 1. The power amplifier 2 can use a plurality of discrete voltages V received from the tracker circuit 1 A to amplify the high-frequency signal RF in the frequency band A received from the RFIC 5 A .

[0061] The filter 3 is connected between the power amplifier 2 and the antenna 4. The filter 3 is a band-pass filter having a passband including the frequency band A.

[0062] The frequency band A is a frequency band for a communication system constructed using a radio access technology (RAT), and is predefined by a standardization organization or the like (e.g., 3GPP (registered trademark) (3rd Generation Partnership Project), IEEE (Institute of Electrical and Electronics Engineers), etc.). Examples of the communication system include a 5GNR (5th Generation New Radio) system, an LTE (Long Term Evolution) system, and a WLAN (Wireless Local Area Network) system.

[0063] The RFIC 5 is an example of a signal processing circuit that processes high-frequency signals. Specifically, the RFIC 5 performs signal processing on an input transmission signal through upconversion or the like, and supplies the high-frequency transmission signal generated by this signal processing to the power amplifier 2. Additionally, the RFIC 5 has a control unit that controls the tracker circuit 1. Further, a part or all of the functions of the control unit of the RFIC 5 may be installed outside the RFIC 5.

[0064] The antenna 4 outputs the transmission signal in frequency band A input from the power amplifier 2 via the filter 3. Additionally, the antenna 4 may not be included in the communication device 6.

[0065] In addition, Figure 2 taking the circuit structure of the illustrated communication device 6 as an example, it is not limited thereto. For example, the communication device 6 may also include a baseband signal processing circuit that performs signal processing using an intermediate frequency band lower than the high-frequency signal RF A for signal processing.

[0066] [Circuit Structure of Tracker Circuit 1]

[0067] Next, with reference to Figure 3 and Figure 4 the circuit structures of the pre-regulator circuit 10, the switched-capacitor circuit 20, the output switch circuit 30, the filter circuit 40, and the digital control circuit 60 included in the tracker circuit 1 will be described. Figure 3 is the circuit structure diagram of the pre-regulator circuit 10, the switched-capacitor circuit 20, the output switch circuit 30, and the filter circuit 40 of the embodiment. Figure 4 is the circuit structure diagram of the digital control circuit 60 of the embodiment.

[0068] In addition, Figure 3 and Figure 4 are exemplary circuit structures, and the pre-regulator circuit 10, the switched-capacitor circuit 20, the output switch circuit 30, the filter circuit 40, and the digital control circuit 60 can be implemented using any one of a variety of circuit arrangements and circuit technologies. Therefore, the descriptions of the respective circuits provided below should not be construed in a limiting manner.

[0069] [2.1 Circuit Structure of Switched-Capacitor Circuit 20]

[0070] First, with reference to Figure 3 , the circuit structure of the switched-capacitor circuit 20 will be described. First, the circuit structure of the switched-capacitor circuit 20 will be described. As Figure 3 shown, the switched-capacitor circuit 20 includes capacitors C11 to C16, capacitors C10, C20, C30, and C40, switches S11 to S14, S21 to S24, S31 to S34, and S41 to S44. Energy and charge are input from the pre-regulator circuit 10 to the switched-capacitor circuit 20 at nodes N1 to N4, and are led out from the switched-capacitor circuit 20 to the output switch circuit 30 at nodes N1 to N4.

[0071] Capacitors C11 to C16 each function as a flying capacitor (there are also cases where it is called a bypass capacitor). In other words, each of the capacitors C11 to C16 is used to boost or step down the first voltage supplied from the pre-regulator circuit 10. More specifically, capacitors C11 to C16 cause charge to move between capacitors C11 to C16 and nodes N1 to N4 to maintain voltages V1 to V4 (voltages relative to the ground potential) at the four nodes N1 to N4 that satisfy V1:V2:V3:V4 = 1:2:3:4. These voltages V1 to V4 correspond to a plurality of second voltages each having a plurality of discrete voltage levels.

[0072] Capacitor C11 is an example of a first capacitor and has two electrodes. One of the two electrodes of capacitor C11 is an example of a first electrode and is connected to one end of switch S11 and one end of switch S12. The other of the two electrodes of capacitor C11 is an example of a second electrode and is connected to one end of switch S21 and one end of switch S22.

[0073] Capacitor C12 has two electrodes. One of the two electrodes of capacitor C12 is connected to one end of switch S21 and one end of switch S22. The other of the two electrodes of capacitor C12 is connected to one end of switch S31 and one end of switch S32.

[0074] Capacitor C13 has two electrodes. One of the two electrodes of capacitor C13 is connected to one end of switch S31 and one end of switch S32. The other of the two electrodes of capacitor C13 is connected to one end of switch S41 and one end of switch S42.

[0075] Capacitor C14 is an example of a second capacitor and has two electrodes. One of the two electrodes of capacitor C14 is an example of a third electrode and is connected to one end of switch S13 and one end of switch S14. The other of the two electrodes of capacitor C14 is an example of a fourth electrode and is connected to one end of switch S23 and one end of switch S24.

[0076] Capacitor C15 has two electrodes. One of the two electrodes of capacitor C15 is connected to one end of switch S23 and one end of switch S24. The other of the two electrodes of capacitor C15 is connected to one end of switch S33 and one end of switch S34.

[0077] Capacitor C16 has two electrodes. One of the two electrodes of capacitor C16 is connected to one end of switch S33 and one end of switch S34. The other of the two electrodes of capacitor C16 is connected to one end of switch S43 and one end of switch S44.

[0078] The groups of capacitors C11 and C14, the groups of capacitors C12 and C15, and the groups of capacitors C13 and C16 can be charged and discharged complementarily by repeating the first stage and the second stage, respectively.

[0079] Specifically, in the first stage, switches S12, S13, S22, S23, S32, S33, S42, and S43 are turned on. As a result, for example, one of the two electrodes of capacitor C12 is connected to node N3, the other of the two electrodes of capacitor C12 and one of the two electrodes of capacitor C15 are connected to node N2, and the other of the two electrodes of capacitor C15 is connected to node N1.

[0080] On the other hand, in the second stage, switches S11, S14, S21, S24, S31, S34, S41, and S44 are turned on. As a result, for example, one of the two electrodes of capacitor C15 is connected to node N3, the other of the two electrodes of capacitor C15 and one of the two electrodes of capacitor C12 are connected to node N2, and the other of the two electrodes of capacitor C12 is connected to node N1.

[0081] By repeating such first and second stages, for example, when one of capacitors C12 and C15 is charged by node N2, the other of capacitors C12 and C15 can be discharged to capacitor C30. In other words, capacitors C12 and C15 can be charged and discharged complementarily.

[0082] The groups of capacitors C11 and C14 and the groups of capacitors C13 and C16 can also be charged and discharged complementarily in the same manner as the group of capacitors C12 and C15 by repeating the first stage and the second stage, respectively.

[0083] Capacitors C10, C20, C30, and C40 function as smoothing capacitors, respectively. In other words, capacitors C10, C20, C30, and C40 are used for holding and smoothing the voltages V1 to V4 at nodes N1 to N4, respectively.

[0084] Capacitor C10 is connected between node N1 and the ground. Specifically, one of the two electrodes of capacitor C10 is connected to node N1. On the other hand, the other of the two electrodes of capacitor C10 is connected to the ground.

[0085] Capacitor C20 is connected between node N2 and N1. Specifically, one of the two electrodes of capacitor C20 is connected to node N2. On the other hand, the other of the two electrodes of capacitor C20 is connected to node N1.

[0086] The capacitor C30 is connected between the nodes N3 and N2. Specifically, one of the two electrodes of the capacitor C30 is connected to the node N3. On the other hand, the other of the two electrodes of the capacitor C30 is connected to the node N2.

[0087] The capacitor C40 is connected between the nodes N4 and N3. Specifically, one of the two electrodes of the capacitor C40 is connected to the node N4. On the other hand, the other of the two electrodes of the capacitor C40 is connected to the node N3.

[0088] The switch S11 is an example of the first switch and is connected between one of the two electrodes of the capacitor C11 and the node N3. Specifically, one end of the switch S11 is connected to one of the two electrodes of the capacitor C11. On the other hand, the other end of the switch S11 is connected to the node N3.

[0089] The switch S12 is an example of the third switch and is connected between one of the two electrodes of the capacitor C11 and the node N4. Specifically, one end of the switch S12 is connected to one of the two electrodes of the capacitor C11. On the other hand, the other end of the switch S12 is connected to the node N4.

[0090] The switch S21 is an example of the fourth switch and is connected between one of the two electrodes of the capacitor C12 and the node N2. Specifically, one end of the switch S21 is connected to one of the two electrodes of the capacitor C12 and the other of the two electrodes of the capacitor C11. On the other hand, the other end of the switch S21 is connected to the node N2.

[0091] The switch S22 is an example of the second switch and is connected between one of the two electrodes of the capacitor C12 and the node N3. Specifically, one end of the switch S22 is connected to one of the two electrodes of the capacitor C12 and the other of the two electrodes of the capacitor C11. On the other hand, the other end of the switch S22 is connected to the node N3.

[0092] The switch S31 is connected between the other of the two electrodes of the capacitor C12 and the node N1. Specifically, one end of the switch S31 is connected to the other of the two electrodes of the capacitor C12 and one of the two electrodes of the capacitor C13. On the other hand, the other end of the switch S31 is connected to the node N1.

[0093] The switch S32 is connected between the other of the two electrodes of the capacitor C12 and the node N2. Specifically, one end of the switch S32 is connected to the other of the two electrodes of the capacitor C12 and one of the two electrodes of the capacitor C13. On the other hand, the other end of the switch S32 is connected to the node N2. In other words, the other end of the switch S32 is connected to the other end of the switch S21.

[0094] The switch S41 is connected between the other side of the two electrodes of the capacitor C13 and the ground wire. Specifically, one end of the switch S41 is connected to the other side of the two electrodes of the capacitor C13. On the other hand, the other end of the switch S41 is connected to the ground wire.

[0095] The switch S42 is connected between the other side of the two electrodes of the capacitor C13 and the node N1. Specifically, one end of the switch S42 is connected to the other side of the two electrodes of the capacitor C13. On the other hand, the other end of the switch S42 is connected to the node N1. In other words, the other end of the switch S42 is connected to the other end of the switch S31.

[0096] The switch S13 is an example of the fifth switch and is connected between one side of the two electrodes of the capacitor C14 and the node N3. Specifically, one end of the switch S13 is connected to one side of the two electrodes of the capacitor C14. On the other hand, the other end of the switch S13 is connected to the node N3. In other words, the other end of the switch S13 is connected to the other end of the switch S11 and the other end of the switch S22.

[0097] The switch S14 is an example of the seventh switch and is connected between one side of the two electrodes of the capacitor C14 and the node N4. Specifically, one end of the switch S14 is connected to one side of the two electrodes of the capacitor C14. On the other hand, the other end of the switch S14 is connected to the node N4. In other words, the other end of the switch S14 is connected to the other end of the switch S12.

[0098] The switch S23 is an example of the eighth switch and is connected between one side of the two electrodes of the capacitor C15 and the node N2. Specifically, one end of the switch S23 is connected to one side of the two electrodes of the capacitor C15 and the other side of the two electrodes of the capacitor C14. On the other hand, the other end of the switch S23 is connected to the node N2. In other words, the other end of the switch S23 is connected to the other end of the switch S21 and the other end of the switch S32.

[0099] The switch S24 is an example of the sixth switch and is connected between one side of the two electrodes of the capacitor C15 and the node N3. Specifically, one end of the switch S24 is connected to one side of the two electrodes of the capacitor C15 and the other side of the two electrodes of the capacitor C14. On the other hand, the other end of the switch S24 is connected to the node N3. In other words, the other end of the switch S24 is connected to the other end of the switch S11, the other end of the switch S22, and the other end of the switch S13.

[0100] The switch S33 is connected between the other side of the two electrodes of the capacitor C15 and the node N1. Specifically, one end of the switch S33 is connected to the other side of the two electrodes of the capacitor C15 and one side of the two electrodes of the capacitor C16. On the other hand, the other end of the switch S33 is connected to the node N1. In other words, the other end of the switch S33 is connected to the other end of the switch S31 and the other end of the switch S42.

[0101] The switch S34 is connected between the other side of the two electrodes of the capacitor C15 and the node N2. Specifically, one end of the switch S34 is connected to the other side of the two electrodes of the capacitor C15 and one side of the two electrodes of the capacitor C16. On the other hand, the other end of the switch S34 is connected to the node N2. In other words, the other end of the switch S34 is connected to the other end of the switch S21, the other end of the switch S32, and the other end of the switch S23.

[0102] The switch S43 is connected between the other side of the two electrodes of the capacitor C16 and the ground wire. Specifically, one end of the switch S43 is connected to the other side of the two electrodes of the capacitor C16. On the other hand, the other end of the switch S43 is connected to the ground wire.

[0103] The switch S44 is connected between the other side of the two electrodes of the capacitor C16 and the node N1. Specifically, one end of the switch S44 is connected to the other side of the two electrodes of the capacitor C16. On the other hand, the other end of the switch S44 is connected to the node N1. In other words, the other end of the switch S44 is connected to the other end of the switch S31, the other end of the switch S42, and the other end of the switch S33.

[0104] The switches S11, S12, S13, S14, S21, S22, S23, S24 are at least one switch included in the switched-capacitor circuit 20.

[0105] The switches of the first group including the switches S12, S13, S22, S23, S32, S33, S42, and S43, and the switches of the second group including the switches S11, S14, S21, S24, S31, S34, S41, and S44 are switched on and off complementarily based on the control signal S2. Specifically, in the first stage, the switches of the first group are turned on and the switches of the second group are turned off. On the contrary, in the second stage, the switches of the first group are turned off and the switches of the second group are turned on.

[0106] For example, in one of the first stage and the second stage, charging of capacitors C10 to C40 is performed from capacitors C11 to C13, and in the other of the first stage and the second stage, charging of capacitors C10 to C40 is performed from capacitors C14 to C16. In other words, charging of capacitors C10 to C40 is always performed from capacitors C11 to C13 or capacitors C14 to C16. Therefore, even if current flows at high speed from nodes N1 to N4 to the output switch circuit 30, charge can be replenished to nodes N1 to N4 at high speed, and thus potential fluctuations of nodes N1 to N4 can be suppressed.

[0107] By operating in this manner, the switched-capacitor circuit 20 can maintain substantially equal voltages across capacitors C10, C20, C30, and C40 respectively. Specifically, at the four nodes labeled V1 to V4, voltages V1 to V4 (voltages with respect to the ground potential) that satisfy V1:V2:V3:V4 = 1:2:3:4 are maintained. The voltage levels of voltages V1 to V4 correspond to a plurality of discrete voltage levels that can be supplied to the output switch circuit 30 by the switched-capacitor circuit 20.

[0108] In addition, the voltage ratio (V1:V2:V3:V4) is not limited to (1:2:3:4). For example, the voltage ratio (V1:V2:V3:V4) can also be (1:2:4:8).

[0109] In addition, Figure 3 The structure of the illustrated switched-capacitor circuit 20 is an example and is not limited thereto. In Figure 3 the switched-capacitor circuit 20 is configured to be able to supply voltages of four discrete voltage levels, but is not limited thereto. The switched-capacitor circuit 20 can also be configured to be able to supply voltages of any number of two or more discrete voltage levels. For example, in the case of supplying voltages of two discrete voltage levels, the switched-capacitor circuit 20 only needs to include at least capacitors C12 and C15, and switches S21 to S24 and S31 to S34.

[0110] [2.2 Circuit Structure of Output Switch Circuit 30]

[0111] Next, with reference to Figure 3 , the circuit structure of the output switch circuit 30 will be described. The output switch circuit 30 is connected to the digital control circuit 60. As Figure 3 shown, the output switch circuit 30 includes input terminals 131 to 134, switches S51 to S54, and an output terminal 130.

[0112] The output terminal 130 is connected to the input terminal 140 of the filter circuit 40. The output terminal 130 is a terminal for supplying the power supply voltage selected from the voltages V1 to V4 to the power amplifier 2 via the filter circuit 40.

[0113] The input terminals 131 to 134 are respectively connected to the nodes N4 to N1 of the switched-capacitor circuit 20. The input terminals 131 to 134 are terminals for receiving the voltages V4 to V1 from the switched-capacitor circuit 20.

[0114] The switch S51 is an example of the tenth switch and is connected between the input terminal 131 and the output terminal 130. Specifically, the switch S51 has a terminal connected to the input terminal 131 and a terminal connected to the output terminal 130. In this connection structure, the switch S51 can switch the connection and non-connection between the input terminal 131 and the output terminal 130 by switching on and off according to the control signal S3.

[0115] The switch S52 is an example of the ninth switch and is connected between the input terminal 132 and the output terminal 130. Specifically, the switch S52 has a terminal connected to the input terminal 132 and a terminal connected to the output terminal 130. In this connection structure, the switch S52 can switch the connection and non-connection between the input terminal 132 and the output terminal 130 by switching on and off according to the control signal S3.

[0116] The switch S53 is connected between the input terminal 133 and the output terminal 130. Specifically, the switch S53 has a terminal connected to the input terminal 133 and a terminal connected to the output terminal 130. In this connection structure, the switch S53 can switch the connection and non-connection between the input terminal 133 and the output terminal 130 by switching on and off according to the control signal S3.

[0117] The switch S54 is connected between the input terminal 134 and the output terminal 130. Specifically, the switch S54 has a terminal connected to the input terminal 134 and a terminal connected to the output terminal 130. In this connection structure, the switch S54 can switch the connection and non-connection between the input terminal 134 and the output terminal 130 by switching on and off according to the control signal S3.

[0118] The switches S51 and S52 are at least one switch included in the output switch circuit 30.

[0119] These switches S51 to S54 are controlled to be exclusively turned on. In other words, only any one of the switches S51 to S54 is turned on, and the remaining switches of S51 to S54 are turned off. Thus, the output switch circuit 30 can output one voltage selected from the voltages V1 to V4.

[0120] In addition, Figure 3 The structure of the output switching circuit 30 shown is an example and is not limited thereto. In particular, as long as the switches S51 to S54 can select at least one of the four input terminals 131 to 134 to be connected to the output terminal 130, any structure can be used. For example, the electrical output switching circuit 30 may also include switches connected between the switches S51 to S53 and the switch S54 and the output terminal 130. Additionally, for example, the output switching circuit 30 may also include switches connected between the switches S51 and S52 and the switches S53 and S54 and the output terminal 130.

[0121] In addition, when supplying voltages of two discrete voltage levels from the switched-capacitor circuit 20, the output switching circuit 30 only needs to include at least two of the switches S51 to S54.

[0122] [2.3 Circuit Structure of the Preregulator Circuit 10]

[0123] Next, with reference to Figure 3 , the structure of the preregulator circuit 10 will be described. As Figure 3 shown, the preregulator circuit 10 includes an input terminal 110, output terminals 111 to 114, inductor connection terminals 115 and 116, switches S61 to S63, S71 and S72, a power inductor L71, and capacitors C61 to C64.

[0124] The input terminal 110 is an input terminal for a DC voltage. In other words, the input terminal 110 is a terminal for receiving an input voltage from the DC power supply 50.

[0125] The output terminal 111 is an output terminal for the voltage V4. In other words, the output terminal 111 is a terminal for supplying the voltage V4 to the switched-capacitor circuit 20. The output terminal 111 is connected to the node N4 of the switched-capacitor circuit 20.

[0126] The output terminal 112 is an output terminal for the voltage V3. In other words, the output terminal 112 is a terminal for supplying the voltage V3 to the switched-capacitor circuit 20. The output terminal 112 is connected to the node N3 of the switched-capacitor circuit 20.

[0127] The output terminal 113 is an output terminal for the voltage V2. In other words, the output terminal 113 is a terminal for supplying the voltage V2 to the switched-capacitor circuit 20. The output terminal 113 is connected to the node N2 of the switched-capacitor circuit 20.

[0128] The output terminal 114 is the output terminal of the voltage V1. In other words, the output terminal 114 is a terminal for supplying the voltage V1 to the switched-capacitor circuit 20. The output terminal 114 is connected to the node N1 of the switched-capacitor circuit 20.

[0129] The inductor connection terminal 115 is connected to one end of the power inductor L71. The inductor connection terminal 116 is connected to the other end of the power inductor L71.

[0130] The switch S71 is an example of the eleventh switch and is connected between the input terminal 110 and one end of the power inductor L71. Specifically, the switch S71 has a terminal connected to the input terminal 110 and a terminal connected to one end of the power inductor L71 via the inductor connection terminal 115. In this connection structure, the switch S71 can switch the connection and non-connection between the input terminal 110 and one end of the power inductor L71 by switching on and off based on the control signal S1.

[0131] The switch S72 is an example of the twelfth switch and is connected between one end of the power inductor L71 and the ground. Specifically, the switch S72 has a terminal connected to one end of the power inductor L71 via the inductor connection terminal 115 and a terminal connected to the ground. In this connection structure, the switch S72 can switch the connection and non-connection between one end of the power inductor L71 and the ground by switching on and off based on the control signal S1.

[0132] The switch S61 is connected between the other end of the power inductor L71 and the output terminal 111. Specifically, the switch S61 has a terminal connected to the other end of the power inductor L71 via the inductor connection terminal 116 and a terminal connected to the output terminal 111. In this connection structure, the switch S61 can switch the connection and non-connection between the other end of the power inductor L71 and the output terminal 111 by switching on and off based on the control signal S1.

[0133] The switch S62 is connected between the other end of the power inductor L71 and the output terminal 112. Specifically, the switch S62 has a terminal connected to the other end of the power inductor L71 via the inductor connection terminal 116 and a terminal connected to the output terminal 112. In this connection structure, the switch S62 can switch the connection and non-connection between the other end of the power inductor L71 and the output terminal 112 by switching on and off based on the control signal S1.

[0134] The switch S63 is connected between the other end of the power inductor L71 and the output terminal 113. Specifically, the switch S63 has a terminal connected to the other end of the power inductor L71 via the inductor connection terminal 116, and a terminal connected to the output terminal 113. In this connection structure, the switch S63 can switch the connection and non-connection between the other end of the power inductor L71 and the output terminal 113 by switching on / off based on the control signal S1.

[0135] The switches S71 and S72 are at least one switch included in the pre-regulator circuit 10.

[0136] One of the two electrodes of the capacitor C61 is connected to the switch S61 and the output terminal 111. The other of the two electrodes of the capacitor C61 is connected to the switch S62, the output terminal 112, and one of the two electrodes of the capacitor C62. The capacitor C61 functions as a smoothing capacitor.

[0137] One of the two electrodes of the capacitor C62 is connected to the switch S62, the output terminal 112, and the other of the two electrodes of the capacitor C61, and the other of the two electrodes of the capacitor C62 is connected to the path connecting the switch S63, the output terminal 113, and one of the two electrodes of the capacitor C63.

[0138] One of the two electrodes of the capacitor C63 is connected to the switch S63, the output terminal 113, and the other of the two electrodes of the capacitor C62. The other of the two electrodes of the capacitor C63 is connected to the output terminal 114 and one of the two electrodes of the capacitor C64.

[0139] One of the two electrodes of the capacitor C64 is connected to the output terminal 114 and the other of the two electrodes of the capacitor C63. The other of the two electrodes of the capacitor C64 is connected to the ground wire.

[0140] The switches S61 to S63 are controlled to be exclusively turned on. In other words, only any one of the switches S61 to S63 is turned on, while the remaining switches of S61 to S63 are turned off. By only turning on any one of the switches S61 to S63, the pre-regulator circuit 10 can change the voltage supplied to the switched-capacitor circuit 20 to the voltage levels of V2 to V4.

[0141] The pre-regulator circuit 10 configured in this way can supply charge to the switched-capacitor circuit 20 via at least one of the output terminals 111 to 113.

[0142] In addition, when the input voltage is converted to a first voltage, the pre-regulator circuit 10 only needs to include at least the switches S71 and S72, and the power inductor L71.

[0143] [Circuit Structure of Filter Circuit 40]

[0144] Next, with reference to Figure 3 , the circuit structure of filter circuit 40 will be described. As Figure 4 shown, filter circuit 40 includes inductors L1 and L2, capacitor C1, switch SW1, input terminal 140, and output terminal 141.

[0145] Input terminal 140 is connected to output terminal 130 of output switch circuit 30. Input terminal 140 is a terminal for receiving the voltage selected from multiple discrete voltages by output switch circuit 30.

[0146] Output terminal 141 is an external connection terminal of tracker circuit 1 and is connected to power amplifier 2 outside tracker circuit 1. Output terminal 141 is a terminal for supplying multiple discrete voltages V A that have passed through filter circuit 40 to power amplifier 2.

[0147] Inductor L1 is connected between input terminal 140 and output terminal 141. In other words, inductor L1 is serially arranged on the path connecting input terminal 140 and output terminal 141. Specifically, one end of inductor L1 is connected to input terminal 140, and the other end of inductor L1 is connected to output terminal 141.

[0148] Inductor L2 is connected between the path connecting inductor L1 and output terminal 141 and the ground line. In other words, inductor L2 is shunt-connected to the path connecting input terminal 140 and output terminal 141. Specifically, one end of inductor L2 is connected to node N42 on the path connecting inductor L1 and output terminal 141, and the other end of inductor L2 is connected to the ground line via capacitor C1. Additionally, inductor L2 can also be connected between capacitor C1 and the ground line or may not be included in filter circuit 40.

[0149] Capacitor C1 is connected between inductor L2 and the ground line. In other words, capacitor C1 is shunt-connected to the path connecting input terminal 140 and output terminal 141. Specifically, one end of capacitor C1 is connected to inductor L2, and the other end of capacitor C1 is connected to the ground line.

[0150] The switch SW1 is connected between the input terminal 140 and the output terminal 141 without passing through the inductor L1. In other words, the switch SW1 is serially arranged on the path that bypasses the inductor L1 between the input terminal 140 and the output terminal 141. Specifically, one end of the switch SW1 is connected to the node N41 on the path connecting the input terminal 140 and the inductor L1, and the other end of the switch SW1 is connected to the node N43 on the path connecting the inductor L1 and the output terminal 141.

[0151] In addition, although in Figure 3 , the switch SW1 and the inductor L1 are connected in parallel, other circuit elements may also be inserted in the path of the switch SW1 and / or the path of the inductor L1. For example, inductors may also be connected between the switch SW1 and the node N43 and / or between the switch SW1 and the node N41.

[0152] In addition, although in Figure 3 , the node N43 connecting the other end of the switch SW1 is located between the node N42 connecting the inductor L2 and the output terminal 141, the positional relationship between the nodes N42 and N43 is not limited thereto. For example, the node N42 may also be located between the node N43 and the output terminal 141. Additionally, for example, the position of the node N42 may be the same as the position of the node N43.

[0153] The switch SW1 connected in this way is switched between on and off based on the control signal S4. Thereby, the filter circuit 40 can switch the on and off of the band-stop filter for removing noise from multiple discrete voltages.

[0154] For example, it is possible to control the on and off of such a band-stop filter based on the channel bandwidth (i.e., modulation bandwidth) of the high-frequency signal RF A . In addition, when the power amplifier 2 can amplify transmission signals in multiple frequency bands, it is also possible to control the on and off of the switch SW1 based on the frequency band of the transmission signal amplified by the power amplifier 2. Furthermore, the control of the band-stop filter is not limited to the above.

[0155] [2.5 Circuit Structure of the Digital Control Circuit 60]

[0156] Next, the circuit structure of the digital control circuit 60 will be described. As Figure 4 shown, the digital control circuit 60 includes a first controller 61, a second controller 62, capacitors C81 and C82, and control terminals 601 to 604.

[0157] The first controller 61 can process the source-synchronous digital control signals received from the RFIC 5 via the control terminals 601 and 602 to generate the control signals S1, S2, and S4. The control signal S1 is a signal for controlling the on / off of the switches S61 - S63, S71, and S72 included in the pre-regulator circuit 10. The control signal S2 is a signal for controlling the on / off of the switches S11 - S14, S21 - S24, S31 - S34, and S41 - S44 included in the switched-capacitor circuit 20. The control signal S4 is a signal for controlling the on / off of the switch SW1 included in the filter circuit 40.

[0158] In addition, the digital control signals processed in the first controller 61 are not limited to the source-synchronous digital control signals. For example, the first controller 61 can also process the clock-embedded digital control signals. Additionally, the first controller 61 can also generate a control signal for controlling the output switch circuit 30.

[0159] Also, although in this embodiment, a set of clock signals and data signals are used as the digital control signals for the pre-regulator circuit 10, the switched-capacitor circuit 20, and the filter circuit 40, it is not limited thereto. For example, the groups of clock signals and data signals can be used separately as the digital control signals for the pre-regulator circuit 10, the switched-capacitor circuit 20, and the filter circuit 40.

[0160] The second controller 62 processes the digital control logic (DCL: Digital Control Logic / Line) signals (DCL1, DCL2) received from the RFIC 5 via the control terminals 603 and 604 to generate the control signal S3. The DCL signals (DCL1, DCL2) are generated based on the envelope signal of the high-frequency signal, etc., by the RFIC 5. The control signal S3 is a signal for controlling the on / off of the switches S51 - S54 included in the output switch circuit 30.

[0161] The DCL signals (DCL1, DCL2) are respectively one-bit signals. The voltages V1 - V4 are represented by the combination of two one-bit signals respectively. For example, V1, V2, V3, and V4 are represented by "00", "01", "10", and "11" respectively. The voltage level can also be expressed using the Gray code.

[0162] The capacitor C81 is connected between the first controller 61 and the ground wire. For example, the capacitor C81 is connected between the power supply line supplying power to the first controller 61 and the ground wire, acting as a bypass capacitor. The capacitor C82 is connected between the second controller 62 and the ground wire.

[0163] In addition, although two digital control logic signals are used for the control of the output switch circuit 30 in the present embodiment, the number of digital control logic signals is not limited to this. For example, one or any number of three or more digital control logic signals may be used according to the number of voltage levels that each output switch circuit 30 can select. In addition, the digital control signal for the control of the output switch circuit 30 is not limited to the digital control logic signal.

[0164] [Installation Example of Tracker Module 1A of 3 Embodiment]

[0165] Next, as an installation example of the tracker circuit 1 configured as described above, reference is made to Figures 5A - 5C and the tracker module 1A of the embodiment is described.

[0166] In addition, although the power inductor L71 included in the pre-regulator circuit 10 is not arranged on the module substrate 90 in the present embodiment and the modification example described later, it is not limited to this. In other words, the power inductor L71 may also be arranged on the module substrate 90.

[0167] Figure 5A is a top view of the tracker module 1A of the embodiment. Figure 5B is a top view of the tracker module 1A of the embodiment. Figure 5A is a view of observing the main surface 90a side of the module substrate 90 from the positive side of the z-axis, Figure 5B is a view of perspective from the positive side of the z-axis of the main surface 90b side of the module substrate 90. Figure 5C is a cross-sectional view of the tracker module 1A of the embodiment. Figure 5C The cross-sections of the tracker module 1A in Figure 5A and Figure 5B are cross-sections on the VC-VC line.

[0168] In addition, in Figures 5A - 5C , a part of the wiring connecting a plurality of circuit components arranged on the module substrate 90 is omitted from the illustration. In Figures 5A - 5C , the resin member 91 covering a plurality of circuit components and the shielding electrode layer covering the surface of the resin member 91 are omitted from the illustration. In addition, the resin member 91 and the shielding electrode layer may not be provided. In addition, in Figure 5A , the shaded blocks indicate arbitrary circuit components that are not necessary in the present invention.

[0169] As Figure 5A shown, the tracker module 1A includes a module substrate 90 and an integrated circuit 80.

[0170] The module substrate 90 has main surfaces 90a and 90b that face each other. A ground electrode layer and the like are formed in the module substrate 90 and on the main surface 90a. In addition, inFigure 5A and Figure 5B In Figure 5B , the module substrate 90 has a rectangular shape when viewed from above, but the shape of the module substrate 90 is not limited to this.

[0171] As the module substrate 90, for example, a low-temperature co-fired ceramic (LTCC: Low Temperature Co-fired Ceramics) substrate or a high-temperature co-fired ceramic (HTCC: High Temperature Co-fired Ceramics) substrate having a stacked structure with a plurality of dielectric layers, a component-embedded substrate, a substrate having a redistribution layer (RDL: Redistribution Layer), or a printed circuit board, etc. can be used, but it is not limited to these substrates.

[0172] The integrated circuit 80 is disposed on the main surface 90a of the module substrate 90 and has a PR switch unit 10A, an SC switch unit 20A, an OS switch unit 30A, an FL switch unit 40A, and a digital control unit 60A. The PR switch unit 10A includes switches S61 to S63, S71, and S72 of the pre-regulator circuit 10. The SC switch unit 20A includes switches S11 to S14, S21 to S24, S31 to S34, and S41 to S44 of the switched-capacitor circuit 20. The OS switch unit 30A includes switches S51 to S54 of the output switch circuit 30. The FL switch unit 40A includes a switch SW1 of the filter circuit 40. The digital control unit 60A includes a digital control circuit 60.

[0173] In addition, in Figure 5A Figure 5A , the integrated circuit 80 has a rectangular shape when viewed from above the module substrate 90, but the shape of the integrated circuit 80 is not limited to this.

[0174] The integrated circuit 80 can be formed of, for example, CMOS (Complementary Metal Oxide Semiconductor) and is specifically manufactured by an SOI (Silicon on Insulator) process. In addition, the integrated circuit 80 is not limited to CMOS.

[0175] Here, as Figure 5A and Figure 5C shown in Figure 5C , when the module substrate 90 is viewed from above (when viewed from the z-axis direction), the digital control unit 60A is disposed between the PR switch unit 10A and the SC switch unit 20A. In other words, when the module substrate 90 is viewed from above, the digital control circuit 60 is disposed between the plurality of switches included in the pre-regulator circuit 10 and the plurality of switches included in the switched-capacitor circuit 20.

[0176] Accordingly, by disposing the digital control circuit 60 with a relatively small calorific value between the PR switch section 10A that becomes a heat source and the SC switch section 20A, it is possible to dissipate the heat generated by the PR switch section 10A and the SC switch section 20A dispersively. Thereby, highly efficient heat dissipation with suppressed local temperature rise is achieved, so that the power consumption of the tracker module 1A can be reduced, and the efficiency degradation of the tracker module 1A can be suppressed.

[0177] In addition, since the distances of the PR switch section 10A and the SC switch section 20A where switching operations are performed can be ensured, noise interference caused by switching can be suppressed.

[0178] Furthermore, in the present embodiment, the switch constituting each switch section includes at least two terminals and one or more semiconductor elements connected between the two terminals. The one or more semiconductor elements are arranged in series (stacked) on the path connecting the two terminals and are connected in series with each other. In addition, when the one or more semiconductor elements are in a series connection circuit, a plurality of series connection circuits may be connected in parallel between the two terminals. The one or more semiconductor elements are, for example, FETs (Field Effect Transistors) each composed of a source electrode, a drain electrode, and a gate electrode. In addition, the one or more semiconductor elements may be bipolar transistors or diodes, etc., respectively.

[0179] Figure 5D It is a top view of a part of the integrated circuit 80 showing an embodiment. Figure 5D It is a view of the integrated circuit 80 observed from the positive side of the z-axis. As shown in this figure, the switches constituting each switch section respectively stack one or more semiconductor elements connected in series in a direction parallel to the xy plane, and a plurality of series connection circuits having one or more semiconductor elements are arranged in parallel in a direction parallel to the xy plane. In addition, the switches constituting each switch section may also stack one or more semiconductor elements connected in series in the z-axis direction, and a plurality of series connection circuits having one or more semiconductor elements are arranged in parallel in a direction parallel to the xy plane.

[0180] Furthermore, in the present embodiment, "circuit A or component A is disposed between the plurality of first switches and the plurality of second switches" means that at least one of the plurality of line segments connecting an arbitrary point in one of the plurality of first switches and an arbitrary point in one of the plurality of second switches passes through circuit A or component A.

[0181] If according to Figure 5DTo illustrate, "a circuit A or a component A is arranged between a plurality of first switches and a plurality of second switches" means, for example, that a digital control unit 60A (any one of configurations a, b, c, and d) is arranged between the switches S61, S62, and S63 (a plurality of first switches) of the PR switch unit 10A and the switches S11 to S14, S21 to S24, S31 to S34, and S41 to S44 (a plurality of second switches) of the SC switch unit 20A.

[0182] Specifically, in Figure 5D , for example, the line segment La connecting any point in the switch S61 among the first switches of the PR switch unit 10A and any point in the switch S12 among the second switches of the SC switch unit 20A passes through the digital control unit (configuration a). Additionally, for example, the line segment Lb connecting any point in the switch S62 among the first switches of the PR switch unit 10A and any point in the switch S21 among the second switches of the SC switch unit 20A passes through the digital control unit (configuration b). Additionally, for example, the line segment Lc connecting any point in the switch S63 among the first switches of the PR switch unit 10A and any point in the switch S41 among the second switches of the SC switch unit 20A passes through the digital control unit (configurations c and d).

[0183] In addition, the tracker module 1A, in addition to the module substrate 90 and the integrated circuit 80, further includes the capacitors C61 to C64 included in the pre-regulator circuit 10, the capacitors C11 to C16 and the capacitors C10 to C40 included in the switched-capacitor circuit 20, the inductors L1, L2 and the capacitor C1 included in the filter circuit 40, the resin component 91, and a plurality of external connection terminals 150.

[0184] The integrated circuit 80, the capacitors C61 to C64, the capacitors C11 to C16, the capacitors C10 to C40, the inductors L1, L2 and the capacitor C1, and the resin component 91 are arranged on the main surface 90a.

[0185] A plurality of external connection terminals 150 are arranged on the main surface 90b. At least one of the plurality of external connection terminals 150 is connected to Figure 3 the output terminal 141 shown. The plurality of external connection terminals 150 are electrically connected to a plurality of electronic components arranged on the main surface 90a via through-hole conductors formed in the module substrate 90 and the like. As the plurality of external connection terminals 150, copper electrodes can be used, but it is not limited thereto. For example, solder electrodes can also be used as the plurality of external connection terminals 150.

[0186] The resin component 91 covers the main surface 90a and at least a part of a plurality of electronic components on the main surface 90a. The resin component 91 has a function of ensuring the mechanical strength and reliability such as moisture resistance of the plurality of electronic components on the main surface 90a. In addition, the resin component 91 may not be included in the tracker module 1A.

[0187] The capacitors C61 to C64, the capacitors C11 to C16, and the capacitors C10 to C40 are mounted as chip capacitors respectively. A chip capacitor refers to a surface mount device (SMD: Surface Mount Device) that constitutes a capacitor. In addition, the mounting of the plurality of capacitors is not limited to chip capacitors. For example, a part or all of the plurality of capacitors may be included in an integrated passive device (IPD: Integrated Passive Device), or may be included in the integrated circuit 80.

[0188] The inductors L1 and L2 are mounted as chip inductors. A chip inductor refers to an SMD that constitutes an inductor. In addition, the mounting of the inductors L1 and L2 is not limited to chip inductors. For example, a part or all of the inductors L1 and L2 may be included in an IPD.

[0189] The plurality of capacitors and inductors arranged on the main surface 90a in this way are grouped by each circuit and arranged around the integrated circuit 80.

[0190] Specifically, when looking down at the module substrate 90, the group of the capacitors C61 to C64 included in the pre-regulator circuit 10 is arranged in the region on the main surface 90a sandwiched by the straight line along the left side of the integrated circuit 80 and the straight line along the left side of the module substrate 90. Thus, the group of circuit components included in the pre-regulator circuit 10 is arranged near the PR switch section 10A in the integrated circuit 80.

[0191] When looking down at the module substrate 90, the group of the capacitors C11 to C16 and the capacitors C10 to C40 included in the switched-capacitor circuit 20 is arranged in the region on the main surface 90a sandwiched by the straight line along the upper side of the integrated circuit 80 and the straight line along the upper side of the module substrate 90, and the region on the main surface 90a sandwiched by the straight line along the right side of the integrated circuit 80 and the straight line along the right side of the module substrate 90. Thus, the group of circuit components included in the switched-capacitor circuit 20 is arranged near the SC switch section 20A in the integrated circuit 80. In other words, compared with each of the PR switch section 10A and the OS switch section 30A, the SC switch section 20A is arranged at a position closer to the switched-capacitor circuit 20.

[0192] When viewed from above the module substrate 90, the group of the inductor L1, L2 and capacitor C1 included in the filter circuit 40 is arranged in a region on the main surface 90a sandwiched by a straight line along the lower side of the integrated circuit 80 and a straight line along the lower side of the module substrate 90. Thus, the group of circuit components included in the filter circuit 40 is arranged at a position close to the FL switch section 40A in the integrated circuit 80. In other words, compared with each of the PR switch section 10A and the SC switch section 20A, the FL switch section 40A is arranged at a position closer to the inductor L1, L2 and capacitor C1 of the filter circuit 40.

[0193] In addition, Figures 5A - 5C Taking the structure of the tracker module 1A shown as an example, it is not limited thereto. For example, a part of the capacitor and inductor arranged on the main surface 90a may be formed in the module substrate 90. In addition, a part of the capacitor and inductor arranged on the main surface 90a may not be included in the tracker module 1A and may not be arranged on the module substrate 90.

[0194] [Mounting example of the tracker module 1B of Modification 1]

[0195] Next, with reference to Figure 6A and Figure 6B the tracker module 1B of Modification 1 will be described.

[0196] Figure 6A is a top view of the tracker module 1B of Modification 1. Figure 6A is a view of the main surface 90a side of the module substrate 90 observed from the positive z-axis side. Figure 6B is a cross-sectional view of the tracker module 1B of Modification 1. Figure 6B The cross-section of the tracker module 1B in Figure 6A is the cross-section on the VIB-VIB line of

[0197] As shown in Figure 6A the tracker module 1B includes a module substrate 90, integrated circuits 81B, 82B, 83B, 84B and 86B. Compared with the tracker module 1A of the embodiment, the tracker module 1B of this modification is different in that a plurality of integrated circuits are arranged instead of one integrated circuit. Hereinafter, for the tracker module 1B of this modification, the description of the same structure as that of the tracker module 1A of the embodiment will be omitted, and the description will be centered on the different structure.

[0198] The integrated circuits 81B, 82B, 83B, 84B and 86B are respectively arranged on the main surface 90a of the module substrate 90.

[0199] The integrated circuit 81B is an example of a first integrated circuit and has a PR switch section 10A including switches S61 to S63, S71, and S72. The integrated circuit 82B is an example of a second integrated circuit and has an SC switch section 20A including switches S11 to S14, S21 to S24, S31 to S34, and S41 to S44. The integrated circuit 83B is an example of a third integrated circuit and has an OS switch section 30A including switches S51 to S54. The integrated circuit 84B has an FL switch section 40A including a switch SW1. The integrated circuit 86B includes a digital control circuit 60.

[0200] In addition, although in Figure 6A , the integrated circuits 81B, 82B, 83B, 84B, and 86B each have a rectangular shape when viewed from above on the module substrate 90, the shapes of these integrated circuits are not limited to rectangular shapes.

[0201] The integrated circuits 81B, 82B, 83B, 84B, and 86B are each formed of CMOS, for example, and can be manufactured by an SOI process specifically. In addition, the integrated circuit 80 is not limited to CMOS.

[0202] Here, as Figure 6A and Figure 6B show, when the module substrate 90 is viewed from above (when viewed from the z-axis direction), the integrated circuit 86B is disposed between the integrated circuit 81B and the integrated circuit 82B. In other words, when the module substrate 90 is viewed from above, the digital control circuit 60 is disposed between the plurality of switches included in the pre-regulator circuit 10 and the plurality of switches included in the switched-capacitor circuit 20.

[0203] Accordingly, by disposing the integrated circuit 86B (digital control circuit 60) with a smaller heat generation amount between the integrated circuit 81B (PR switch section) and the integrated circuit 82B (SC switch section) that are heat sources, it is possible to dissipate the heat generated by the PR switch section and the SC switch section dispersively. As a result, highly efficient heat dissipation with suppressed local temperature rise is achieved, so that deterioration of the efficiency of the tracker module 1B can be suppressed.

[0204] In addition, since the distances of the PR switch section and the SC switch section where switching operations are performed can be ensured, noise interference caused by switching can be suppressed.

[0205] In addition, the tracker module 1B further includes capacitors C61 to C64 included in the pre-regulator circuit 10, capacitors C11 to C16 and capacitors C10 to C40 included in the switched-capacitor circuit 20, inductors L1, L2, and capacitor C1 included in the filter circuit 40, a resin member 91, and a plurality of external connection terminals 150, in addition to the module substrate 90 and the integrated circuit 80.

[0206] In addition, Figure 6A and Figure 6B Taking the structure of the tracker module 1B shown as an example, it is not limited thereto. For example, a part of the capacitor and inductor arranged on the main surface 90a may be formed within the module substrate 90. In addition, a part of the capacitor and inductor arranged on the main surface 90a may not be included in the tracker module 1B and may not be arranged on the module substrate 90.

[0207] In addition, the FL switch section may be included in either of the integrated circuits 81B and 82B.

[0208] [Installation example of the tracker module 1C of Modification 2]

[0209] Next, with reference to Figure 7 the tracker module 1C of Modification 2 will be described.

[0210] Figure 7 is a top view of the tracker module 1C of Modification 2. Figure 7 is a view of the main surface 90a side of the module substrate 90 observed from the positive side of the z-axis.

[0211] As Figure 7 shown, the tracker module 1C includes a module substrate 90 and an integrated circuit 80C. Compared with the tracker module 1A of the embodiment, the configuration structure of each switch section in the integrated circuit 80C is different. Hereinafter, for the tracker module 1C of this modification, the description of the same structure as that of the tracker module 1A of the embodiment will be omitted, and the description will focus on the different structure.

[0212] The integrated circuit 80C is arranged on the main surface 90a of the module substrate 90 and has a PR switch section 10A, an SC switch section 20A, an OS switch section 30A, an FL switch section 40A, and a digital control section 60A. The PR switch section 10A includes switches S61 to S63, S71, and S72. The SC switch section 20A includes switches S11 to S14, S21 to S24, S31 to S34, and S41 to S44. The OS switch section 30A includes switches S51 to S54. The FL switch section 40A includes a switch SW1. The digital control section 60A includes a digital control circuit 60.

[0213] In addition, although in Figure 7 the integrated circuit 80C has a rectangular shape when viewed from above the module substrate 90, the shape of the integrated circuit 80C is not limited thereto.

[0214] Here, as Figure 7As shown, when looking down at the module substrate 90 (when observing from the z-axis direction), a digital control unit 60A is disposed between the PR switch unit 10A and the SC switch unit 20A. In other words, when looking down at the module substrate 90, a digital control circuit 60 is disposed between the plurality of switches included in the pre-regulator circuit 10 and the plurality of switches included in the switched-capacitor circuit 20.

[0215] In addition, when looking down at the module substrate 90 (when observing from the z-axis direction), the PR switch unit 10A, the SC switch unit 20A, and the OS switch unit 30A are disposed in the outer peripheral region within the integrated circuit 80C.

[0216] In addition, "circuit A or component A is disposed in the outer peripheral region within the integrated circuit" means that no other circuit components are disposed between one of the outer peripheries of the integrated circuit and circuit A or component A.

[0217] Accordingly, the heat dissipation path from the PR switch unit 10A and the SC switch unit 20A to the external circuit connected to the tracker module 1C can be shortened, so that the heat dissipation performance of the tracker module 1C can be improved.

[0218] In addition, since the connection wirings between the PR switch unit 10A and the capacitors C61 to C64 included in the pre-regulator circuit 10, and the connection wirings between the SC switch unit 20A and the capacitors C11 to C16 and the capacitors C10 to C40 included in the switched-capacitor circuit 20 can be shortened, signal transmission loss can be reduced.

[0219] In addition, when looking down at the module substrate 90 (when observing from the z-axis direction), the digital control unit 60A is disposed closer to the center within the integrated circuit 80C than the PR switch unit 10A, the SC switch unit 20A, and the OS switch unit 30A.

[0220] Accordingly, the distance between the PR switch unit 10A and the SC switch unit 20A, which are heat sources, can be ensured to be relatively large, so that the heat generated by the PR switch unit 10A and the SC switch unit 20A can be dissipated in a dispersed manner.

[0221] In addition, since the control signal wirings connecting the digital control unit 60A to the PR switch unit 10A, the SC switch unit 20A, and the OS switch unit 30A can be shortened, the digital control circuit 60 can control the switching operations of the respective switch units with high precision.

[0222] In addition, the tracker module 1C includes, in addition to the module substrate 90 and the integrated circuit 80C, capacitors C61 to C64 included in the pre-regulator circuit 10, capacitors C11 to C16 and capacitors C10 to C40 included in the switched-capacitor circuit 20, inductors L1 and L2 and capacitor C1 included in the filter circuit 40, a resin component 91, and a plurality of external connection terminals 150.

[0223] In addition, Figure 7 The structure of the illustrated tracker module 1C is an example and is not limited thereto. For example, a part of the capacitors and inductors disposed on the main surface 90a may be formed within the module substrate 90. In addition, a part of the capacitors and inductors disposed on the main surface 90a may not be included in the tracker module 1C and may not be disposed on the module substrate 90.

[0224] [Mounting example of the tracker module 1D of Modification 3]

[0225] Next, with reference to Figure 8 the tracker module 1D of Modification 3 will be described.

[0226] Figure 8 is a top view of the tracker module 1D of Modification 3. Figure 8 is a view of the main surface 90a side of the module substrate 90 observed from the positive side of the z-axis.

[0227] As Figure 8 shown, the tracker module 1D includes a module substrate 90 and an integrated circuit 80D. Compared with the tracker module 1A of the embodiment, the configuration structure of each switch unit in the integrated circuit 80D is different. Hereinafter, for the tracker module 1D of this modification, description of the same structures as those of the tracker module 1A of the embodiment will be omitted, and the description will focus on the different structures.

[0228] The integrated circuit 80D is disposed on the main surface 90a of the module substrate 90 and has a PR switch unit 10A, an SC switch unit 20A, an OS switch unit 30A, an FL switch unit 40A, and a digital control unit 60A. The PR switch unit 10A includes switches S61 to S63, S71, and S72. The SC switch unit 20A includes switches S11 to S14, S21 to S24, S31 to S34, and S41 to S44. The OS switch unit 30A includes switches S51 to S54. The FL switch unit 40A includes a switch SW1. The digital control unit 60A includes a digital control circuit 60.

[0229] In addition, although in Figure 8 the integrated circuit 80D has a rectangular shape when viewed from above the module substrate 90, the shape of the integrated circuit 80D is not limited thereto.

[0230] Here, as Figure 8 shown, when looking down at the module substrate 90 (when observing in the z-axis direction), the SC switch section 20A is formed in a region along two mutually crossing long-side directions (x-axis direction and y-axis direction), and these two long-side directions are arranged along two outer peripheries of the integrated circuit 80D (the right side and the upper side of the integrated circuit 80D). In other words, the SC switch section 20A is formed in an L-shaped region along two mutually crossing long-side directions (x-axis direction and y-axis direction), and is arranged in the outer peripheral region within the integrated circuit 80D.

[0231] Accordingly, the connection wirings between the SC switch section 20A and the capacitors C11 to C16 and the capacitors C10 to C40 included in the switched-capacitor circuit 20 can be shortened, so the heat generation in the switched-capacitor circuit 20 can be reduced, and in addition, the signal transmission loss can be reduced.

[0232] In addition, the tracker module 1D further includes capacitors C61 to C64 included in the pre-regulator circuit 10, capacitors C11 to C16 and capacitors C10 to C40 included in the switched-capacitor circuit 20, inductors L1, L2 and capacitor C1 included in the filter circuit 40, a resin member 91, and a plurality of external connection terminals 150, in addition to the module substrate 90 and the integrated circuit 80D.

[0233] In addition, in the tracker module 1D, at least one capacitor included in the switched-capacitor circuit 20 may be arranged adjacent to the integrated circuit 80D.

[0234] Accordingly, the connection wirings between the SC switch section 20A and the capacitors C11 to C16 and the capacitors C10 to C40 included in the switched-capacitor circuit 20 can be further shortened, so the heat generation in the switched-capacitor circuit 20 can be reduced, and in addition, the signal transmission loss can be reduced.

[0235] In addition, Figure 8 the structure of the tracker module 1D shown is an example and is not limited thereto. For example, a part of the capacitors and inductors arranged on the main surface 90a may be formed within the module substrate 90. In addition, a part of the capacitors and inductors arranged on the main surface 90a may not be included in the tracker module 1D and may not be arranged on the module substrate 90.

[0236] [Mounting example of the tracker module 1E of Modification 4]

[0237] Next, with reference to Figure 9A and Figure 9B the tracker module 1E of Modification 4 will be described.

[0238] Figure 9AIt is a top view of the tracker module 1E of Modification Example 4. Figure 9A It is a view of the main surface 90a side of the module substrate 90 as viewed from the positive side of the z-axis. Figure 9B It is a cross-sectional view of the tracker module 1E of Modification Example 4. Figure 9B The cross-section of the tracker module 1E in Figure 9A is the cross-section on the IXB - IXB line of

[0239] As Figure 9A shown, the tracker module 1E includes a module substrate 90 and an integrated circuit 80E. Compared with the tracker module 1D of Modification Example 3, the configuration structures of the OS switch section 30A and the digital control section 60A are different. Hereinafter, for the tracker module 1E of this modification example, the description of the same structures as those of the tracker module 1D of Modification Example 3 will be omitted, and the description will focus on the different structures.

[0240] The integrated circuit 80E is arranged on the main surface 90a of the module substrate 90 and has a PR switch section 10A, an SC switch section 20A, an OS switch section 30A, an FL switch section 40A, and a digital control section 60A. The PR switch section 10A includes switches S61 to S63, S71, and S72. The SC switch section 20A includes switches S11 to S14, S21 to S24, S31 to S34, and S41 to S44. The OS switch section 30A includes switches S51 to S54. The FL switch section 40A includes a switch SW1. The digital control section 60A includes a digital control circuit 60.

[0241] Here, as Figure 9A and Figure 9B shown, when the module substrate 90 is viewed from above (when viewed from the z-axis direction), the digital control section 60A and the OS switch section 30A are arranged between the PR switch section 10A and the SC switch section 20A. In other words, when the module substrate 90 is viewed from above, the digital control circuit 60 and the multiple switches included in the output switch circuit 30 are arranged between the multiple switches included in the pre-regulator circuit 10 and the multiple switches included in the switched-capacitor circuit 20.

[0242] Accordingly, by arranging the digital control circuit 60 and the OS switch section 30A with less heat generation between the PR switch section 10A, which is a heat source, and the SC switch section 20A, it is possible to dissipate the heat generated by the PR switch section 10A and the SC switch section 20A dispersively. Thereby, high-efficiency heat dissipation with local temperature rise suppressed is achieved, so that the efficiency degradation of the tracker module 1E can be further suppressed.

[0243] In addition, since the distances of the PR switch section 10A and the SC switch section 20A, which can ensure a relatively high switching speed compared to the OS switch section 30A to a large extent, can be increased, noise interference caused by switching can be further suppressed.

[0244] In addition, the SC switch section 20A is arranged adjacent to the OS switch section 30A. In other words, a plurality of switches included in the switched capacitor circuit 20 are arranged adjacent to a plurality of switches included in the output switching circuit 30.

[0245] Accordingly, the SC switch section 20A and the OS switch section 30A can be connected by a low-impedance wiring, so the transient response performance during the rise and fall of voltage fluctuations is improved. In addition, power consumption can be reduced by making the above-mentioned wiring, which is a power line, have a low impedance.

[0246] In addition, in the present embodiment, "a plurality of first switches are arranged adjacent to a plurality of second switches" means that no circuit components are arranged between any one of the plurality of first switches and any one of the plurality of second switches.

[0247] In addition, as Figure 9B shown, the PR switch section 10A and the SC switch section 20A are connected via conductor wirings 96 and 97 formed on the module substrate 90. In other words, a plurality of switches included in the switched capacitor circuit 20 and a plurality of switches included in the pre-regulator circuit 10 are connected via conductive components formed on the module substrate 90.

[0248] Accordingly, a wiring connecting the PR switch section 10A and the SC switch section 20A can be formed on the module substrate 90, so the degree of freedom in the layout of this wiring is increased and a low impedance can be achieved. Thereby, the signal transmission loss between the PR switch section 10A and the SC switch section 20A can be reduced.

[0249] In addition, in addition to the module substrate 90 and the integrated circuit 80E, the tracker module 1E further includes capacitors C61 to C64 included in the pre-regulator circuit 10, capacitors C11 to C16 and capacitors C10 to C40 included in the switched capacitor circuit 20, inductors L1, L2 and capacitor C1 included in the filter circuit 40, a resin component 91, and a plurality of external connection terminals 150.

[0250] In addition, in the tracker module 1E, at least one capacitor included in the switched capacitor circuit 20 may be arranged adjacent to the integrated circuit 80E.

[0251] Accordingly, wirings connecting the PR switch section 10A and the SC switch section 20A can be formed on the module substrate 90, so that the degree of freedom in the layout of these wirings is increased and low impedance can be achieved. As a result, signal transmission loss between the pre-regulator circuit 10 and the switched-capacitor circuit 20 can be reduced.

[0252] In addition, Figure 9A and Figure 9B taking the structure of the tracker module 1E shown as an example, it is not limited thereto. For example, a part of the capacitor and inductor arranged on the main surface 90a may be formed within the module substrate 90. Further, a part of the capacitor and inductor arranged on the main surface 90a may not be included in the tracker module 1E and may not be arranged on the module substrate 90.

[0253] [Mounting example of the tracker module 1F of Modification 5]

[0254] Next, the tracker module 1F of Modification 5 will be described with reference to Figure 10 FIGs.

[0255] Figure 10 is a top view of the tracker module 1F of Modification 5. Figure 10 is a view of the main surface 90a side of the module substrate 90 as viewed from the positive side of the z-axis.

[0256] As Figure 10 shown, the tracker module 1F includes a module substrate 90 and an integrated circuit 80F. Compared with the tracker module 1A of the embodiment, the configuration structure of each switch section in the integrated circuit 80F is different. Hereinafter, for the tracker module 1F of this modification, description of the same structure as that of the tracker module 1A of the embodiment will be omitted, and the description will focus on the different structure.

[0257] The integrated circuit 80F is arranged on the main surface 90a of the module substrate 90 and has a PR switch section 10A, an SC switch section 20A, an OS switch section 30A, an FL switch section 40A, and a digital control section 60A. The PR switch section 10A includes switches S61 to S63, S71, and S72. The SC switch section 20A includes switches S11 to S14, S21 to S24, S31 to S34, and S41 to S44. The OS switch section 30A includes switches S51 to S54. The FL switch section 40A includes a switch SW1. The digital control section 60A includes a digital control circuit 60.

[0258] Here, as Figure 10 shown, the SC switch section 20A is separately arranged in two mutually separated regions. In other words, a plurality of switches included in the switched-capacitor circuit 20 are formed separately in the first region and the second region which are mutually separated.

[0259] Accordingly, since the SC switch section 20A that is a heat source is divided and formed in two regions, heat dissipation of the heat generated by the SC switch section 20A can be dispersed.

[0260] In addition, when the module substrate 90 is viewed from above (when viewed in the z-axis direction), the digital control section 60A is disposed between the two SC switch sections 20A that are disposed separately.

[0261] Accordingly, by disposing the digital control circuit 60 with a smaller amount of heat generation between the two SC switch sections 20A that are heat sources, heat dissipation of the heat generated by the SC switch section 20A can be dispersed. Thus, highly efficient heat dissipation with suppressed local temperature rise is achieved, and therefore deterioration of the efficiency of the tracker module 1F can be further suppressed.

[0262] In addition, the tracker module 1F further includes capacitors C61 to C64 included in the pre-regulator circuit 10, capacitors C11 to C16 and capacitors C10 to C40 included in the switched capacitor circuit 20, inductors L1 and L2 and capacitor C1 included in the filter circuit 40, a resin member 91, and a plurality of external connection terminals 150, in addition to the module substrate 90 and the integrated circuit 80F.

[0263] In addition, Figure 10 The structure of the illustrated tracker module 1F is an example and is not limited thereto. For example, a part of the capacitors and inductors disposed on the main surface 90a may be formed within the module substrate 90. In addition, a part of the capacitors and inductors disposed on the main surface 90a may not be included in the tracker module 1F and may not be disposed on the module substrate 90.

[0264] [Mounting example of the tracker module 1G of Modification 6]

[0265] Next, refer to Figures 11A - 11C The tracker module 1G of Modification 6 will be described.

[0266] Figure 11A is a top view of the tracker module 1G of Modification 6. Figure 11B is a top view of the tracker module 1G of Modification 6. Figure 11A is a view of the main surface 90a side of the module substrate 90 as viewed from the positive side of the z-axis, Figure 11B is a view of the main surface 90b side of the module substrate 90 as seen through from the positive side of the z-axis. Figure 11C is a cross-sectional view of the tracker module 1G of Modification 6. Figure 11C The cross-sections of the tracker module 1G in Figure 11A and Figure 11B are cross-sections on the XIC-XIC line of

[0267] As Figure 11A and Figure 11B shown, the tracker module 1G includes a module substrate 90, and integrated circuits 81G, 82G, 83G, 84G, and 86G. Compared with the tracker module 1A of the embodiment, the tracker module 1G of this modified example is different in that a plurality of integrated circuits are distributively arranged on the main surfaces 90a and 90b of the module substrate 90. Hereinafter, for the tracker module 1G of this modified example, the description of the same structure as that of the tracker module 1A of the embodiment will be omitted, and the description will focus on the different structures.

[0268] The integrated circuits 83G, 84G, and 86G are respectively arranged on the main surface 90a of the module substrate 90. The integrated circuits 81G, 82G, and 86G are respectively arranged on the main surface 90b of the module substrate 90.

[0269] The integrated circuit 81G is an example of a first integrated circuit and has a PR switch section 10A, including switches S61 to S63, S71, and S72. The integrated circuit 82G is an example of a second integrated circuit and has an SC switch section 20A, including switches S11 to S14, S21 to S24, S31 to S34, and S41 to S44. The integrated circuit 83G is an example of a third integrated circuit and has an OS switch section 30A, including switches S51 to S54. The integrated circuit 84G has an FL switch section 40A, including a switch SW1. The integrated circuit 86G includes a digital control circuit 60.

[0270] In addition, although in Figure 11A and Figure 11B , the integrated circuits 81G, 82G, 83G, 84G, and 86G respectively have a rectangular shape when viewed from above the module substrate 90, the shapes of these integrated circuits are not limited to the rectangular shape.

[0271] Furthermore, in addition to the module substrate 90 and the above-mentioned plurality of integrated circuits, the tracker module 1G further includes capacitors C61 to C64 included in the pre-regulator circuit 10, capacitors C11 to C16 and capacitors C10 to C40 included in the switched-capacitor circuit 20, inductors L1, L2, and capacitor C1 included in the filter circuit 40, resin members 91 and 92, and a plurality of external connection terminals 150.

[0272] On the main surface 90a, in addition to the integrated circuits 83G, 84G, and 86G, capacitors C61 and C62, capacitors C11, C12, C14, and C15, capacitors C10 and C20, inductors L1, L2, and capacitor C1, and the resin member 91 are also arranged.

[0273] On the main surface 90b, in addition to the integrated circuits 81G, 82G, and 86G, capacitors C63 and C64, capacitors C13 and C16, capacitors C30 and C40, and a plurality of external connection terminals 150 are also arranged. At least one of the plurality of external connection terminals 150 is connected to Figure 3 the output terminal 141 shown. The plurality of external connection terminals 150 are electrically connected to a plurality of electronic components arranged on the main surfaces 90a and 90b via through-hole conductors formed in the module substrate 90 and are connected to the electrodes of the mother substrate arranged on the main surface 90b side.

[0274] The resin member 91 covers at least a part of the plurality of electronic components on the main surface 90a. The resin member 91 has a function of ensuring the reliability such as the mechanical strength and moisture resistance of the plurality of electronic components on the main surface 90a. The resin member 92 covers at least a part of the plurality of electronic components on the main surface 90b. The resin member 92 has a function of ensuring the reliability such as the mechanical strength and moisture resistance of the plurality of electronic components on the main surface 90b. In addition, the tracker module 1G may not include the resin members 91 and 92.

[0275] According to the above structure, by arranging the integrated circuit 81G (PR switch section) and the integrated circuit 82G (SC switch section) that become heat sources on the main surface 90b, the heat dissipation path to the mother substrate (external circuit) can be shortened, and in addition, the heat dissipation performance of the integrated circuits 81G and 82G from the back side can be improved. As a result, high-efficiency heat dissipation that suppresses the temperature rise of the tracker module 1G is achieved, so the efficiency deterioration of the tracker module 1G can be suppressed.

[0276] In addition, the integrated circuit 83G is arranged on the main surface 90a. When looking down at the module substrate 90 (when observing from the z-axis direction), the integrated circuit 82G and the integrated circuit 83G at least partially overlap.

[0277] Accordingly, since the SC switch section and the OS switch section can be connected by low-impedance wiring, the transient response performance during the rise and fall of voltage fluctuations is improved. In addition, by reducing the impedance of the above-mentioned wiring as a power line, the power consumption can be reduced.

[0278] In addition, Figures 11A - 11C the structure of the tracker module 1G shown is an example and is not limited thereto. For example, a part of the capacitors and inductors arranged on the main surfaces 90a and 90b may be formed in the module substrate 90. In addition, a part of the capacitors and inductors arranged on the main surfaces 90a and 90b may not be included in the tracker module 1G and may not be arranged on the module substrate 90.

[0279] [10 Effects, etc.]

[0280] As described above, the tracker modules 1A, 1C to 1F of the embodiments and the modified examples include a module substrate 90 and an integrated circuit 80 (or 80C to 80F) disposed on the module substrate 90. The integrated circuit 80 (or 80C to 80F) has at least one switch included in a pre-regulator circuit 10 configured to convert an input voltage into a first voltage, at least one switch included in a switched-capacitor circuit 20 configured to generate a plurality of discrete second voltages based on the first voltage, at least one switch included in an output switch circuit 30 configured to selectively output at least one of the plurality of discrete second voltages generated by the switched-capacitor circuit 20, and a digital control circuit 60 that controls the output switch circuit 30 to selectively output at least one of the plurality of discrete second voltages based on a digital control signal corresponding to an envelope signal. When the module substrate 90 is viewed from above, at least one of the at least one switch included in the output switch circuit 30 and the digital control circuit 60 is disposed between the at least one switch included in the pre-regulator circuit 10 and the at least one switch included in the switched-capacitor circuit 20.

[0281] Accordingly, by disposing at least one of the digital control circuit 60 and the OS switch section 30A, which generate less heat, between the PR switch section 10A and the SC switch section 20A, which are heat sources, it is possible to dissipate the heat generated by the PR switch section 10A and the SC switch section 20A in a dispersed manner. As a result, highly efficient heat dissipation with suppressed local temperature rise is achieved, so that deterioration of the efficiency of the tracker modules 1A, 1C to 1F can be suppressed.

[0282] In addition, the tracker modules 1B and 1G of the modified examples include: a module substrate 90; an integrated circuit 81B (or 81G) disposed on the module substrate 90 and having at least one switch included in a pre-regulator circuit 10 configured to convert an input voltage into a first voltage; an integrated circuit 82B (or 82G) disposed on the module substrate 90 and having at least one switch included in a switched-capacitor circuit 20 configured to generate a plurality of discrete second voltages based on the first voltage; an integrated circuit 83B (or 83G) disposed on the module substrate 90 and having at least one switch included in an output switch circuit 30 configured to selectively output at least one of the plurality of discrete second voltages generated by the switched-capacitor circuit 20; and a digital control circuit 60 that controls the output switch circuit 30 to selectively output at least one of the plurality of discrete second voltages based on a digital control signal corresponding to an envelope signal. When the module substrate 90 is viewed from above, at least one of the at least one switch included in the output switch circuit 30 and the digital control circuit 60 is disposed between the at least one switch included in the pre-regulator circuit 10 and the at least one switch included in the switched-capacitor circuit 20.

[0283] Accordingly, by disposing at least one of the digital control circuit 60 with a relatively small heat generation amount and the OS switch section 30A between the PR switch section 10A and the SC switch section 20A which are heat sources, heat dissipation of the PR switch section 10A and the SC switch section 20A can be dispersed. Thereby, high-efficiency heat dissipation with suppressed local temperature rise is achieved, so that deterioration of the efficiency of the tracker modules 1B and 1G can be suppressed.

[0284] Further, for example, in the tracker module 1G, the module substrate 90 has main surfaces 90a and 90b facing each other, the tracker module 1G further includes external connection terminals 150 disposed on the main surface 90b, and integrated circuits 81G and 82G are disposed on the main surface 90b.

[0285] Accordingly, by disposing the integrated circuit 81G (PR switch section) and the integrated circuit 82G (SC switch section) which are heat sources on the main surface 90b, the heat dissipation path to the mother substrate (external circuit) can be shortened, and further, heat dissipation performance of the integrated circuits 81G and 82G from the back side can be improved. Thereby, high-efficiency heat dissipation with suppressed temperature rise of the tracker module 1G is achieved, so that deterioration of the efficiency of the tracker module 1G can be suppressed.

[0286] Further, for example, in the tracker module 1G, the integrated circuit 83G is disposed on the main surface 90a, and at least a part of the integrated circuit 82G overlaps the integrated circuit 83G when the module substrate 90 is viewed from above.

[0287] Accordingly, since the SC switch section 20A and the OS switch section 30A can be connected by a low-impedance wiring, transient response performance during rise and fall of voltage fluctuations is improved. Further, power consumption can be reduced by making the above-mentioned wiring as a power line have a low impedance.

[0288] Further, for example, in the tracker modules 1E and 1F, at least one switch included in the switching capacitor circuit 20 and at least one switch included in the output switch circuit 30 are adjacently disposed.

[0289] Accordingly, since the SC switch section 20A and the OS switch section 30A can be connected by a low-impedance wiring, transient response performance during rise and fall of voltage fluctuations is improved. Further, power consumption can be reduced by making the above-mentioned wiring as a power line have a low impedance.

[0290] Further, for example, in the tracker modules 1D and 1E, when the module substrate 90 is viewed from above, at least one switch included in the pre-regulator circuit 10 and at least one switch included in the switching capacitor circuit 20 are disposed with at least one switch included in the output switch circuit 30 and the digital control circuit 60 therebetween.

[0291] Accordingly, by disposing the digital control circuit 60 and the OS switch section 30A with relatively small heat generation amounts between the PR switch section 10A and the SC switch section 20A that are heat sources, it is possible to dissipate the heat generated by the PR switch section 10A and the SC switch section 20A dispersively. Thereby, highly efficient heat dissipation with suppressed local temperature rise is achieved, so that the efficiency degradation of the tracker modules 1D and 1E can be further suppressed.

[0292] Further, for example, in the tracker module 1C, when viewed from above the module substrate 90, at least one of the switches included in the pre-regulator circuit 10, at least one of the switches included in the switched capacitor circuit 20, and at least one of the switches included in the output switch circuit 30 are disposed in the outer peripheral region within the integrated circuit 80C.

[0293] Accordingly, since the heat dissipation path from the PR switch section 10A and the SC switch section 20A to the external circuit connected to the tracker module 1C can be shortened, the heat dissipation performance of the tracker module 1C can be improved. Further, since the connection wirings between the PR switch section 10A and the capacitors included in the pre-regulator circuit 10 and between the SC switch section 20A and the capacitors included in the switched capacitor circuit 20 can be shortened, signal transmission loss can be reduced.

[0294] Further, for example, in the tracker module 1C, when viewed from above the module substrate 90, the digital control circuit 60 is disposed on the central side within the integrated circuit 80C as compared with at least one of the switches included in the pre-regulator circuit 10, at least one of the switches included in the switched capacitor circuit 20, and at least one of the switches included in the output switch circuit 30.

[0295] Accordingly, since the distance between the PR switch section 10A and the SC switch section 20A that are heat sources can be ensured, it is possible to dissipate the heat generated by the PR switch section 10A and the SC switch section 20A dispersively. Further, since the control signal wirings connecting the digital control section 60A to the respective PR switch sections 10A, SC switch sections 20A, and OS switch sections 30A can be shortened, the digital control circuit 60 can control the switching operations of the respective switch sections with high precision.

[0296] Further, for example, in the tracker modules 1D and 1E, when viewed from above the module substrate 90, at least one of the switches included in the switched capacitor circuit 20 is formed in a region along two long side directions that intersect each other, and these two long side directions are arranged along two outer peripheries of the integrated circuit 80D (or 80E).

[0297] Accordingly, since the connection wiring between the SC switch section 20A and the capacitors included in the switched capacitor circuit 20 can be shortened, heat generation in the switched capacitor circuit 20 can be reduced, and furthermore, signal transmission loss can be reduced.

[0298] For another example, in the tracker modules 1D and 1E, at least one capacitor included in the switched capacitor circuit 20 is adjacently arranged to the integrated circuit 80D (or 80E).

[0299] Accordingly, the connection wiring between the SC switch section 20A and the capacitors included in the switched capacitor circuit 20 can be further shortened, heat generation in the switched capacitor circuit 20 can be reduced, and furthermore, signal transmission loss can be reduced.

[0300] For another example, in the tracker module 1F, the above-mentioned at least one switch included in the switched capacitor circuit 20 is divided and formed in mutually separated first and second regions.

[0301] Accordingly, since the SC switch section 20A that is a heat source is divided and formed in two regions, heat dissipation of the SC switch section 20A can be performed dispersedly.

[0302] For another example, in the tracker module 1F, when viewed from above the module substrate 90, a digital control circuit 60 is arranged between the first region and the second region.

[0303] Accordingly, by arranging the digital control circuit 60 with a relatively small amount of heat generation between the two SC switch sections 20A that are heat sources, heat dissipation of the SC switch section 20A can be performed dispersedly. Thereby, highly efficient heat dissipation that suppresses local temperature rise is achieved, and thus deterioration of the efficiency of the tracker module 1F can be further suppressed.

[0304] For another example, in the tracker module 1E, the switches included in the switched capacitor circuit 20 and the switches included in the pre-regulator circuit 10 are connected via a conductor wiring 96 formed on the module substrate 90.

[0305] Accordingly, since wiring for connecting the PR switch section 10A and the SC switch section 20A can be formed on the module substrate 90, the degree of freedom in the layout of this wiring is increased and low impedance can be achieved. Thereby, signal transmission loss between the PR switch section 10A and the SC switch section 20A can be reduced.

[0306] For another example, in the tracker module 1E, at least one capacitor included in the switched capacitor circuit 20 is adjacently arranged to the integrated circuit 80D (or 80E).

[0307] Accordingly, wirings for connecting the PR switch section 10A and the SC switch section 20A can be formed on the module substrate 90. Therefore, the degree of freedom in the layout of these wirings is increased, enabling low impedance. As a result, signal transmission loss between the pre-regulator circuit 10 and the switched-capacitor circuit 20 can be reduced.

[0308] In addition, the tracker modules 1A, 1C to 1F of the embodiment and the modified example include a module substrate 90 and an integrated circuit 80 (or 80C to 80F) disposed on the module substrate 90. The integrated circuit 80 (or 80C to 80F) has: a first switch, a second switch, a third switch, a fourth switch, a fifth switch, a sixth switch, a seventh switch, and an eighth switch, which are included in the switched-capacitor circuit 20; a ninth switch and a tenth switch, which are included in an output switch circuit 30 connected to the switched-capacitor circuit 20; an eleventh switch and a twelfth switch, which are included in a pre-regulator circuit 10 connected to the switched-capacitor circuit 20; and a digital control circuit 60 that controls the first switch to the twelfth switch. The switched-capacitor circuit 20 has: a first capacitor having a first electrode and a second electrode; a second capacitor having a third electrode and a fourth electrode; and the first switch to the eighth switch. One end of the first switch and one end of the third switch are connected to the first electrode, one end of the second switch and one end of the fourth switch are connected to the second electrode, one end of the fifth switch and one end of the seventh switch are connected to the third electrode, one end of the sixth switch and one end of the eighth switch are connected to the fourth electrode. The other ends of the first switch, the second switch, the fifth switch, and the sixth switch are connected to each other, the other end of the third switch is connected to the other end of the seventh switch, and the other end of the fourth switch is connected to the other end of the eighth switch. The output switch circuit 30 has: a first output terminal; a ninth switch connected between the other ends of the first switch, the second switch, the fifth switch, and the sixth switch and the first output terminal; and a tenth switch connected between the other ends of the third switch and the seventh switch and the first output terminal. The pre-regulator circuit 10 includes: an input terminal; an eleventh switch connected between the input terminal and one end of a power inductor; and a twelfth switch connected between one end of the power inductor and a ground line. The other end of the power inductor is connected to the other ends of the first switch, the second switch, the fifth switch, and the sixth switch. When viewed from above the module substrate 90, at least one of the ninth switch, the tenth switch, and the digital control circuit 60 is disposed between the eleventh switch and the twelfth switch and the first switch, the second switch, the third switch, the fourth switch, the fifth switch, the sixth switch, the seventh switch, and the eighth switch.

[0309] Accordingly, by disposing at least one of the less heat-generating digital control circuit 60 and the OS switch section 30A between the PR switch section 10A and the SC switch section 20A which are heat sources, heat dissipation of the PR switch section 10A and the SC switch section 20A can be dispersed. Thereby, highly efficient heat dissipation with suppressed local temperature rise is achieved, so that deterioration of the efficiency of the tracker modules 1A, 1C to 1F can be suppressed.

[0310] For another example, in the tracker modules 1E and 1F, the first to eighth switches are disposed adjacent to the ninth to tenth switches.

[0311] Accordingly, since the SC switch section 20A and the OS switch section 30A can be connected by a low-impedance wiring, transient response performance during voltage rise and fall can be improved. In addition, power consumption can be reduced by making the above-mentioned wiring as a power line have low impedance.

[0312] For another example, in the tracker module 1C, when viewed from above the module substrate 90, the first to twelfth switches are disposed in the outer peripheral region within the integrated circuit 80C.

[0313] Accordingly, since the heat dissipation path from the PR switch section 10A and the SC switch section 20A to the external circuit connected to the tracker module 1C can be shortened, heat dissipation of the tracker module 1C can be improved. In addition, since the connection wiring between the PR switch section 10A and the capacitor included in the pre-regulator circuit 10 and the connection wiring between the SC switch section 20A and the capacitor included in the switched capacitor circuit 20 can be shortened, signal transmission loss can be reduced.

[0314] For another example, in the tracker module 1C, when viewed from above the module substrate 90, the digital control circuit 60 is disposed closer to the center side within the integrated circuit 80C than the first to twelfth switches.

[0315] Accordingly, since the distance between the PR switch section 10A and the SC switch section 20A which are heat sources can be ensured, heat dissipation of the PR switch section 10A and the SC switch section 20A can be dispersed. In addition, since the control signal wiring connecting the digital control section 60A to each of the PR switch section 10A, the SC switch section 20A, and the OS switch section 30A can be shortened, the digital control circuit 60 can accurately control the switching operation of each switch section.

[0316] For another example, in the tracker modules 1D and 1E, when viewed from above the module substrate 90, the first to eighth switches are formed in a region along two mutually intersecting long side directions, and these two long side directions are disposed along two outer peripheries of the integrated circuit 80D (or 80E).

[0317] Accordingly, since the connection wiring between the SC switch section 20A and the capacitors included in the switched capacitor circuit 20 can be shortened, heat generation in the switched capacitor circuit 20 can be reduced, and also signal transmission loss can be reduced.

[0318] Further, for example, in the tracker module 1E, at least one of the first to eighth switches and at least one of the eleventh to twelfth switches are connected via a conductor wiring 96 formed on the module substrate 90.

[0319] Accordingly, since a conductor wiring connecting the PR switch section 10A and the SC switch section 20A can be formed on the module substrate 90, the degree of freedom in the layout of the conductor wiring is increased and a low impedance can be achieved. As a result, signal transmission loss between the pre-regulator circuit 10 and the switched capacitor circuit 20 can be reduced.

[0320] (Other embodiments)

[0321] As described above, the tracker module of the present invention has been described based on the embodiments, but the tracker module of the present invention is not limited to the above embodiments. Other embodiments achieved by combining any constituent elements in the above embodiments, modification examples obtained by making various modifications that those skilled in the art can think of to the above embodiments without departing from the gist of the present invention, and various devices incorporating the above tracker module are also included in the present invention.

[0322] For example, in the circuit structures of the various circuits in the above embodiments, other circuit elements and wirings, etc. may be inserted between the paths connecting the respective circuit elements and signal paths disclosed in the drawings. For example, an impedance matching circuit may be inserted between the power amplifier 2 and the filter 3.

[0323] In addition, in the above embodiment, four discrete voltages are supplied to the power amplifier, but the number of discrete voltages is not limited to four. For example, as long as at least the voltage corresponding to the maximum output power and the voltage corresponding to the output power with the highest generation frequency are included in the plurality of discrete voltages, improvement in power added efficiency can be achieved.

[0324] The present invention can be widely used as a tracker module that supplies voltage to a power amplifier in communication devices such as mobile phones.

[0325] Description of reference numerals

[0326] 1... Tracker circuit, 1A, 1B, 1C, 1D, 1E, 1F, 1G... Tracker module, 2... Power amplifier, 3... Filter, 4... Antenna, 5... RFIC, 6... Communication device, 10... Pre-regulator circuit, 10A... PR switch section, 20... Switched-capacitor circuit, 20A... SC switch section, 30... Output switch circuit, 30A... OS switch section, 40... Filter circuit, 40A... FL switch section, 50... DC power supply, 60... Digital control circuit, 60A... Digital control section, 61... First controller, 62... Second controller, 80, 80C, 80D, 80E, 80F, 81B, 81G, 82B, 82G, 83B, 83G, 84B, 84G, 86B, 86G... Integrated circuit, 90... Module substrate, 90a, 90b... Main surfaces, 91, 92... Resin components, 96, 97... Conductor wirings, 110, 131, 132, 133, 134, 140... Input terminals, 111, 112, 113, 114, 130, 141... Output terminals, 150... External connection terminal, 601, 602, 603, 604... Control terminals.

Claims

1. A tracker module, wherein, Comprising: A module substrate; and An integrated circuit disposed on the above-mentioned module substrate, The above-mentioned integrated circuit has: At least one switch included in a converter circuit configured to convert an input voltage into a first voltage; At least one switch included in a switched-capacitor circuit configured to generate a plurality of discrete second voltages based on the above-mentioned first voltage; At least one switch included in an output switch circuit configured to selectively output at least one of the above-mentioned plurality of discrete second voltages generated by the above-mentioned switched-capacitor circuit; and A digital control circuit that controls the above-mentioned output switch circuit to selectively output at least one of the above-mentioned plurality of discrete second voltages based on a digital control signal corresponding to an envelope signal, When looking down on the above-mentioned module substrate, at least one of the above-mentioned at least one switch included in the above-mentioned output switch circuit and the above-mentioned digital control circuit is disposed between the above-mentioned at least one switch included in the above-mentioned converter circuit and the above-mentioned at least one switch included in the above-mentioned switched-capacitor circuit.

2. A tracker module, wherein, Comprising: A module substrate; A first integrated circuit disposed on the above-mentioned module substrate and having at least one switch included in a converter circuit configured to convert an input voltage into a first voltage; A second integrated circuit disposed on the above-mentioned module substrate and having at least one switch included in a switched-capacitor circuit configured to generate a plurality of discrete second voltages based on the above-mentioned first voltage; A third integrated circuit disposed on the above-mentioned module substrate and having at least one switch included in an output switch circuit configured to selectively output at least one of the above-mentioned plurality of discrete second voltages generated by the above-mentioned switched-capacitor circuit; and A digital control circuit that controls the above-mentioned output switch circuit to selectively output at least one of the above-mentioned plurality of discrete second voltages based on a digital control signal corresponding to an envelope signal, When looking down on the above-mentioned module substrate, at least one of the above-mentioned at least one switch included in the above-mentioned output switch circuit and the above-mentioned digital control circuit is disposed between the above-mentioned at least one switch included in the above-mentioned converter circuit and the above-mentioned at least one switch included in the above-mentioned switched-capacitor circuit.

3. The tracker module according to claim 2, wherein The above-mentioned module substrate has a first main surface and a second main surface that face each other, The above-mentioned tracker module further includes external connection terminals disposed on the above-mentioned second main surface, The above-mentioned first integrated circuit and the above-mentioned second integrated circuit are disposed on the above-mentioned second main surface.

4. The tracker module according to claim 3, wherein The above-mentioned third integrated circuit is disposed on the above-mentioned first main surface, When looking down on the above-mentioned module substrate, at least a part of the above-mentioned second integrated circuit overlaps with the above-mentioned third integrated circuit.

5. The tracker module according to claim 1 or 2, wherein The above-mentioned at least one switch included in the above-mentioned switched-capacitor circuit and the above-mentioned at least one switch included in the above-mentioned output switch circuit are adjacently disposed.

6. The tracker module according to any one of claims 1 to 5, wherein When view from above of the module substrate, at least one switch included in the converter circuit and at least one switch included in the switched capacitor circuit are arranged between at least one switch included in the output switch circuit and the digital control circuit.

7. The tracker module according to claim 1, wherein When view from above of the module substrate, at least one switch included in the converter circuit, at least one switch included in the switched capacitor circuit, and at least one switch included in the output switch circuit are arranged in the outer peripheral area within the integrated circuit.

8. The tracker module according to claim 7, wherein When view from above of the module substrate, the digital control circuit is arranged on the central side within the integrated circuit as compared with at least one switch included in the converter circuit, at least one switch included in the switched capacitor circuit, and at least one switch included in the output switch circuit.

9. The tracker module according to claim 1, wherein When view from above of the module substrate, at least one switch included in the switched capacitor circuit is formed in an area along two long side directions that intersect each other, and the two long side directions are arranged along two outer peripheries of the integrated circuit.

10. The tracker module according to claim 9, wherein At least one capacitor included in the switched capacitor circuit is arranged adjacent to the integrated circuit.

11. The tracker module according to claim 7, wherein At least one switch included in the switched capacitor circuit is divided and formed in a first area and a second area that are separated from each other.

12. The tracker module according to claim 11, wherein When view from above of the module substrate, the digital control circuit is arranged between the first area and the second area.

13. The tracker module according to any one of claims 1 to 12, wherein The switch included in the switched capacitor circuit and the switch included in the converter circuit are connected via a conductive component formed on the module substrate.

14. The tracker module according to claim 13, wherein At least one capacitor included in the switched capacitor circuit is arranged adjacent to the integrated circuit.

15. A tracker module, wherein, Comprising: A module substrate; and An integrated circuit arranged on the module substrate, The integrated circuit has: A first switch, a second switch, a third switch, a fourth switch, a fifth switch, a sixth switch, a seventh switch, and an eighth switch, included in the switched capacitor circuit; A ninth switch and a tenth switch, included in an output switch circuit connected to the switched capacitor circuit; An eleventh switch and a twelfth switch, included in a converter circuit connected to the switched capacitor circuit; and A digital control circuit for controlling the first switch to the twelfth switch, The switched capacitor circuit has: A first capacitor having a first electrode and a second electrode; A second capacitor having a third electrode and a fourth electrode; and The first switch to the eighth switch, One end of the first switch and one end of the third switch are connected to the first electrode. One end of the second switch and one end of the fourth switch are connected to the second electrode. One end of the fifth switch and one end of the seventh switch are connected to the third electrode. One end of the sixth switch and one end of the eighth switch are connected to the fourth electrode. The other ends of the first switch, the second switch, the fifth switch, and the sixth switch are connected to each other. The other end of the third switch is connected to the other end of the seventh switch. The other end of the fourth switch is connected to the other end of the eighth switch. The output switch circuit includes: A first output terminal; The ninth switch, connected between the other ends of the first switch, the second switch, the fifth switch, and the sixth switch and the first output terminal; and The tenth switch, connected between the other ends of the third switch and the seventh switch and the first output terminal. The converter circuit includes: An input terminal; The eleventh switch, connected between the input terminal and one end of the power inductor; and The twelfth switch, connected between one end of the power inductor and the ground wire. The other end of the power inductor is connected to the other ends of the first switch, the second switch, the fifth switch, and the sixth switch. When viewed from above the module substrate, at least one of the ninth switch, the tenth switch, and the digital control circuit is disposed between the eleventh switch and the twelfth switch and the first switch, the second switch, the third switch, the fourth switch, the fifth switch, the sixth switch, the seventh switch, and the eighth switch.

16. The tracker module according to claim 15, wherein The first switch, the second switch, the third switch, the fourth switch, the fifth switch, the sixth switch, the seventh switch, and the eighth switch are adjacently disposed to the ninth switch and the tenth switch.

17. The tracker module according to claim 15, wherein When viewed from above the module substrate, the first switch, the second switch, the third switch, the fourth switch, the fifth switch, the sixth switch, the seventh switch, the eighth switch, the ninth switch, the tenth switch, the eleventh switch, and the twelfth switch are disposed in the outer peripheral region within the integrated circuit.

18. The tracker module according to claim 17, wherein When viewed from above the module substrate, the digital control circuit is disposed on the central side within the integrated circuit as compared with the first switch, the second switch, the third switch, the fourth switch, the fifth switch, the sixth switch, the seventh switch, the eighth switch, the ninth switch, the tenth switch, the eleventh switch, and the twelfth switch.

19. The tracker module according to claim 15, wherein when viewed from above the module substrate, the first switch, the second switch, the third switch, the fourth switch, the fifth switch, the sixth switch, the seventh switch, and the eighth switch are formed in a region along two mutually intersecting long-side directions, and the two long-side directions are arranged along two outer peripheries of the integrated circuit.

20. The tracker module according to any one of claims 15 to 19, wherein at least one of the first switch, the second switch, the third switch, the fourth switch, the fifth switch, the sixth switch, the seventh switch, and the eighth switch is connected to at least one of the eleventh switch and the twelfth switch via a conductive member formed on the module substrate.

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