An automated detection method for cleaning equipment of front-opening wafer transfer box

Abstract

The present invention relates to the field of semiconductor technology and specifically discloses an automated inspection method for front-loading wafer pod cleaning equipment. The method includes obtaining parameter information, configuring a control information code based on the parameter information, and binding the control information code to a front-loading wafer pod (FOUP) cleaning equipment. When the parameter conditions are met, an automated automated detection (AMA) system grabs the FOUP, binds the control information code to the FOUP, and uses a cleaning device to clean the FOUP. The method then pulls a batch of wafers, measures the wafers to obtain a first measurement value, obtains a data collection plan, and determines whether the wafers are abnormal based on the first measurement value. If abnormal, abnormality processing is performed; otherwise, the wafers are placed in a monitor pod. The method then measures again to obtain a second measurement value, calculates the difference between the second and first measurement values, and determines the inspection result of the cleaning device based on the difference. By configuring the control information code with various parameter information and binding the cleaning device and the front-loading wafer pod through the control information code, the cleaning device can be inspected in multiple dimensions.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an automated detection method for cleaning equipment for a front-opening wafer transfer box. Background Art

[0002] A Front Opening Unified Pod (FOUP) is a container used to protect, transport, and store wafers during the semiconductor manufacturing process. FOUPs primarily serve the purpose of placing and transporting wafers in semiconductor production. To simplify transportation and minimize the risk of contamination, chip manufacturers use FOUPs to handle and store wafers. Semiconductor factories have extremely high requirements for production environments and conditions. Even tiny particles can cause defects in electronic components and circuits. The cleanliness of FOUPs directly impacts semiconductor processing, making FOUP cleaning equipment crucial. The accurate and stable operation of FOUP cleaning equipment directly impacts production quality and efficiency, necessitating regular inspections to promptly detect any abnormalities and make adjustments to ensure proper operation and compliance with production standards and regulations.

[0003] Currently, the FOUP cleaning equipment inspection method involves injecting water into the FOUP after cleaning and taking samples to measure dust, thereby providing feedback on the FOUP cleaning equipment's cleanliness capabilities. This inspection method is inefficient, has a limited number of inspections, and requires human effort. Summary of the Invention

[0004] In order to overcome the above-mentioned technical problems existing in the prior art, an embodiment of the present invention provides an automated detection method for a front-opening wafer transfer box cleaning device, which configures control information coding through a variety of parameter information, and binds the cleaning device and the front-opening wafer transfer box through the control information coding, so that the cleaning device can be detected in multiple dimensions, and the front-opening wafer transfer box is cleaned with the cleaning device under inspection, and then the wafer is placed in the front-opening wafer transfer box. The detection result of the cleaning device is determined by measuring the received value of the wafer, thereby realizing efficient automated detection of the cleaning device.

[0005] In order to achieve the above-mentioned purpose, an embodiment of the present invention provides an automated detection method for a front-opening wafer pod cleaning device, the method specifically comprising: step S1: acquiring parameter information, the parameter information comprising front-opening wafer pod parameters, wafer parameters and a timing monitoring mechanism, configuring a control information code according to the parameter information, and binding the control information code to the cleaning device of the front-opening wafer pod; step S2: when the parameter conditions in the control information code are met, the AMA system grabs the front-opening wafer pod with the earliest cleaning date, binds the control information code to the front-opening wafer pod, uses the cleaning device to clean the front-opening wafer pod, and marks the front-opening wafer pod as a Monitor Foup; step S3: pulling the first batch of wafers, performing a first measurement on the wafers and obtaining a first measurement value, acquiring a data collection plan for the AMA system, and determining whether the wafer has an abnormality based on the first measurement value and the data collection plan, performing abnormality processing if an abnormality exists, and placing the wafer into the Monitor Foup if no abnormality exists; step S4: placing the wafer into the Monitor Foup After Foup, a second measurement is performed on the wafer to obtain a second measurement value, the difference between the second measurement value and the first measurement value is obtained through the data collection plan, the detection result of the cleaning equipment is determined by the difference, and the cleaning equipment is operated according to the detection result.

[0006] Preferably, in step S1, the front-opening wafer transport box parameters include the slot information and type information of the front-opening wafer transport box, and the slot information and the type information are both information characterizing the status of the front-opening wafer transport box; the wafer parameters include the number of wafers, and the timing monitoring mechanism includes advance cleaning time and reminder time, and the advance cleaning time and the reminder time are both monitoring times allocated according to the factory working hours; the cleaning equipment is configured with no less than 2 control information codes.

[0007] Preferably, the step S2 includes: when the parameter condition is the time parameter of the timing monitoring mechanism, when the time parameter is reached, the AMA system scans and extracts the cleaning date of the front-opening wafer transport box; and grabs the front-opening wafer transport box one by one in the order of arrival of the cleaning date.

[0008] Preferably, step S3 includes: the data collection plan configures a calculation formula, a standard value range, a difference range and an exception handling method according to the production plan and personalized needs; when there is an abnormality in the wafer, the AMA system performs an exception handling operation on the wafer according to the exception handling method.

[0009] Preferably, step S4 includes: after placing the Monitor Foup, performing a second measurement on the wafer and obtaining a second measurement value, obtaining the calculation formula and the difference range, and obtaining the difference between the second measurement value and the first measurement value according to the calculation formula; judging the detection result according to whether the difference is within the difference range: if so, determining that the detection result is normal, and the cleaning equipment continues to perform the cleaning operation; if not, determining that the detection result is abnormal, and performing control operations on the cleaning equipment.

[0010] Preferably, the control operation is performed on the cleaning equipment, including: after controlling the cleaning equipment, pulling a second batch of wafers to re-test the cleaning equipment according to steps S1 to S4, and obtaining a new test result; if the new test result is normal, the cleaning equipment continues to perform the cleaning operation; if the new test result is abnormal, performing a maintenance operation on the cleaning equipment.

[0011] Preferably, the method also includes: when the detection result is normal, extracting the number of times the wafer is used to determine whether the wafer can continue to be used; if it can be used, continuing to perform the operation of step S3 on the wafer; if it cannot be used, performing a cleaning operation on the wafer, and performing a third measurement on the wafer after cleaning to obtain a third measurement value; determining whether the wafer has an abnormality based on the third measurement value and the second measurement value and using the calculation formula; if there is an abnormality, performing a cleaning operation on the wafer again; if there is no abnormality, continuing to perform the operation of step S3 on the wafer; when the number of times the wafer is used and the number of times it is cleaned both reach the upper limit, performing a downgrade operation on the wafer.

[0012] The technical solution provided by the present invention has at least the following technical effects:

[0013] By configuring the control information code according to parameter information such as the front-opening wafer transfer box (FOUP) parameters, wafer parameters, and a timing monitoring mechanism, the FOUP's cleaning equipment is bound to the control information code. The cleaning equipment will perform inspections on the process flow according to the parameter information set in the control information code. When a certain parameter condition in the control information code is reached, the FOUP is selected and bound to the control information code. Thus, the cleaning equipment and the FOUP achieve a binding relationship through the control information code. The FOUP is placed in the cleaning equipment set in the equipment control code for cleaning. Whether the inspection results of the cleaning equipment are normal is determined based on the wafer measurement values ​​and the data collection plan. By configuring different parameter information in the control information code, the cleaning equipment can be inspected more finely, and the cleaning equipment can be inspected in multiple dimensions, thereby achieving highly efficient and automated inspection of the cleaning equipment, and the inspection method does not consume manpower. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the embodiments of the present invention and constitute a part of the specification. Together with the following detailed description, they are used to explain the embodiments of the present invention, but do not constitute a limitation of the embodiments of the present invention. In the accompanying drawings:

[0015] Figure 1 This is a flow chart of an automated detection method for a front-opening wafer FOUP cleaning device provided by an embodiment of the present invention;

[0016] Figure 2 This is a flow chart of an implementation of step S4 in the detection method provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0017] The following describes the specific implementation of the embodiment of the present invention in detail with reference to the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the embodiment of the present invention and is not used to limit the embodiment of the present invention.

[0018] The terms "system" and "network" in the embodiments of the present invention can be used interchangeably. "Multiple" refers to two or more. In view of this, "multiple" can also be understood as "at least two" in the embodiments of the present invention. "And / or" describes the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / ", unless otherwise specified, generally indicates that the previous and next associated objects are in an "or" relationship. In addition, it should be understood that in the description of the embodiments of the present invention, words such as "first" and "second" are only used to distinguish the purpose of description, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying order.

[0019] See Figure 1 An embodiment of the present invention provides an automated detection method for a front-opening wafer pod cleaning device, the method specifically comprising the following steps:

[0020] Step S1: Acquire parameter information, the parameter information including front-loading pod parameters, wafer parameters, and a timing monitoring mechanism, configure a control information code according to the parameter information, and bind the control information code to a cleaning device of the front-loading pod;

[0021] Step S2: When the parameter conditions in the control information code are met, the AMA system grabs the front-loading pod with the earliest cleaning date, binds the control information code to the front-loading pod, cleans the front-loading pod using the cleaning equipment, and marks the front-loading pod as a Monitor Pod;

[0022] Step S3: Pulling the first batch of wafers, performing a first measurement on the wafers and obtaining a first measurement value, obtaining a data collection plan of the AMA system, and determining whether the wafers have an abnormality based on the first measurement value and the data collection plan. If an abnormality is present, performing abnormality processing; if not, placing the wafers into the MonitorFoup;

[0023] Step S4: After placing the Monitor Foup, perform a second measurement on the wafer and obtain a second measurement value. Obtain the difference between the second measurement value and the first measurement value through the data collection plan, determine the inspection result of the cleaning equipment through the difference, and perform operations on the cleaning equipment according to the inspection result.

[0024] In an embodiment of the present invention, a front-opening unified pod (FOUP) is an indispensable container in the semiconductor production process. The cleanliness of the FOUP directly affects the processing of semiconductors, so the cleaning equipment of the FOUP is very important. In the actual production process, there are differences in the types of FOUPs, the number of wafers is also inconsistent, and the production plans of each factory are inconsistent. Therefore, in order to adapt to the production plans and different FOUP types of different factories, for the detection of the FOUP cleaning equipment of a certain factory, the parameter information such as wafer parameters, FOUP parameters and timing monitoring mechanism involved in the production plan of the factory is first obtained, and a control information code (abbreviated as Control Information Code) is configured based on this parameter information. The AMA system uses a control information code to identify the FOUP and bind it to the cleaning device. The control information code is configured with a corresponding parameter condition. When the parameter condition is met, the AMA system begins to scan FOUPs and obtains the cleaning dates of all FOUPs. The AMA system then grabs the FOUP with the earliest cleaning date. After grabbing the FOUP, the control information code is also bound to the FOUP. That is, the FOUP and the cleaning device are bound to the same control information code. Therefore, the FOUP can only be cleaned by the cleaning device bound to the control information code. The cleaning device is used to clean the FOUP, and the cleaned parameter of the FOUP is set to T, indicating that the FOUP has been cleaned. The FOUP is also marked as a Monitor FOUP, indicating that the FOUP has been cleaned and is used to detect the cleaning device.

[0025] Furthermore, the AMA system pulls a batch of wafers. When the batch of wafers is assigned to a machine or site, the system records the machine or site as the InUse Start site, and enters a specific process flow through the site. The specific process flow is that in order to confirm that the batch of wafers has no abnormalities and meets the production standards before entering the Monitor Foup, thereby affecting the subsequent inspection results of the cleaning equipment, the batch of wafers enters the measurement and value collection site (referred to as the Measure site). The AMA system is flexibly configured with a data collection plan (referred to as the EDC Plan) according to the factory's production plan and production standards. The EDC Plan is configured with a formula for calculating the measurement value and a range value that meets the production standard. The first measurement value of the batch of wafers is obtained by measurement at the Measure site. The range value configured in the EDC Plan and the first measurement value are used to determine whether the batch of wafers meets the production standard and whether there are any abnormalities. If there are abnormalities, the AMA system will process the batch of wafers according to the EDC Plan. If there are no abnormalities, the batch of wafers will be placed in the Monitor Foup. After being placed, in order to make the measurement value more accurate, the Monitor Nitrogen is added to the Foup, and the batch of wafers enters the Measure station for measurement again to obtain a second measurement value. The difference between the second measurement value and the first measurement value is calculated according to the EDC Plan. The difference is used to determine the cleaning effect of the cleaning equipment on the Monitor Foup, thereby inferring whether there is any abnormality in the cleaning equipment and obtaining the inspection result of the cleaning equipment.

[0026] Through the automated detection method for Foup cleaning equipment provided in this embodiment, a control information code (Control ID for short) is configured through multiple parameter information, and the binding relationship between the Control ID, the Foup and the cleaning equipment is used, so that the Foup captured by the AMA system according to the capture rules set by the system is bound to the cleaning equipment, that is, the Foup can only be cleaned by this cleaning equipment, and the measurement values ​​of a batch of wafers pulled by the AMA system before and after being placed in the Foup after cleaning and the data collection plan configured by the system are used to determine whether the wafers meet the production standards, thereby determining whether the Foup is cleaned by the cleaning equipment, and thus determining whether the cleaning equipment has any abnormalities. The cleaning equipment can be inspected more finely and the cleaning equipment can be inspected in multiple dimensions, thereby achieving highly efficient automated inspection of the cleaning equipment, and the inspection method does not consume manpower.

[0027] In the actual production process, there are differences in the types of FOUPs in the factory, there are differences in measurement standards, there are also differences in the requirements for testing, and there are differences in the production plans and working hours of the factory. Therefore, the parameter information of the control information encoding can be flexibly configured, and the parameter information can be adjusted according to the production plan and working hours of the factory when configuring. In one embodiment, the FOUP parameters can be selected as the FOUP slot, FOUP type and other information that characterizes the FOUP status, and the wafer parameters can be selected as the number of wafers. The timed monitoring mechanism can be configured according to the working hours of the factory to configure the timed monitoring, such as setting the advance cleaning time, reminder time, interval time or fixed time every day. When configuring the control information code, you can flexibly select parameter information to configure it. The parameter information can be flexibly configured according to the factory's production plan and production requirements. The time can be freely configured. The inspection time can be flexibly adjusted according to the factory's production plan and working hours. It can be readjusted and reconfigured at any time for new production plans. The cleaning equipment is configured with no less than 2 control information codes, which provides greater flexibility in responding to demand fluctuations, thereby achieving more refined detection and multi-dimensional detection of cleaning equipment. It can also be configured in batches to achieve large-scale detection, which can better adapt to the factory's production plan, improve production efficiency, better protect production, improve production quality, and reduce losses.

[0028] In one embodiment, a parameter condition is correspondingly set in the control information code. This parameter condition can be set to the advance cleaning time configured in the arrival control information code, and the parameter condition can also be set to the arrival reminder time. The specific setting of the parameter condition is determined according to the factory's production plan and inspection requirements; when the parameter condition is the advance cleaning time, when the advance cleaning time is arrived, the AMA system starts scanning the FOUP and obtains the cleaning dates of all FOUPs, and then the AMA system will grab the FOUPs one by one in the order of arrival of the cleaning dates, that is, the AMA system only grabs one FOUP each time, and binds the control information code, and then performs subsequent operations. In the whole process, not only the cleaning equipment completes the cleaning of the FOUP whose cleaning date is about to arrive, but also the cleaning ability of the cleaning equipment can be tested by placing the wafer after cleaning, thereby realizing large-scale testing and batch configuration testing, which better adapts to the factory's production plan and improves production efficiency.

[0029] In one embodiment, the EDC Plan configured in the AMA system can be flexibly configured according to the factory's production plan and production standards. The EDC Plan can be configured with calculation formulas for measurement values, range values ​​that meet standards, and methods for handling wafer anomalies. All of the above are configured by the factory based on its own production plan and inspection needs to better adapt to the factory's production plan. For example, before the pulled batch of wafers enters the cleaned FOUP, if this batch of wafers does not meet the production standards, it will affect the results of subsequent inspection and cleaning equipment. Therefore, in order to ensure that this batch of wafers meets the production standards, the wafers are measured for the first time at the Measure site and the first measurement value is obtained. The wafers are determined to meet the production standards by judging whether the first measurement value is within the range value that meets the standards. If they are within the standard range value, they meet the production standards, and the batch of wafers can be placed in the Monitor. If the wafer is not within the standard range, it does not meet the production standard. At this time, the wafer is handled according to the exception handling method configured in EDCPlan. For example, the exception handling method configured in a certain factory is to notify the engineer to determine whether to increase the amount of processing. If the wafer does not meet the standard, the engineer will be notified and asked to determine whether to increase the amount of processing. This flexible configuration of EDC Plan can adapt to the personalized needs of the project and each production plan.

[0030] In one embodiment, see Figure 2 For the EDC Plan configuration, the measurement value difference calculation formula and the standard difference range can also be configured according to the factory's production plan. After the batch of wafers pulled by the AMA system are placed in the Monitor Foup, the batch of wafers are measured again by the Measure site to obtain a second measurement value. The difference calculation formula in the EDC Plan configuration is used to calculate the difference between the first and second measurement values. Then, it is determined whether the difference is within the standard difference range configured in the EDC Plan to determine the inspection result of the cleaning equipment. For example, if the calculated difference is within the standard difference range, it means that the Monitor Foup is clean, that is, the cleaning ability of the cleaning equipment is normal, that is, the inspection result of the cleaning equipment is normal, and the cleaning equipment can continue to perform the cleaning operation; if the obtained difference is not within the standard difference range, it means that the Monitor Foup is not clean, and the inspection result of the cleaning equipment is abnormal. The cleaning equipment is controlled and cannot continue to clean the Foup, and the status of the wafer batch is changed from wafer to fail.

[0031] Specifically, when the detection result of the cleaning equipment is abnormal, after the control operation is performed on the cleaning equipment, in one embodiment, in order to more accurately verify the cleaning ability of the cleaning equipment and obtain more accurate detection results, the staff can determine whether additional processing is needed. If additional processing is needed, the addition function is executed through the control information encoding, and the addition flag (Add Monitor) is set to T. At this time, the AMA system re-pulls a new batch of wafers according to the flag and re-executes the detection steps according to steps S1 to S4 to obtain new detection results. If the new detection result indicates that the cleaning equipment is normal, the control of the cleaning equipment can be released to allow it to continue to perform the cleaning operation. If the new detection result indicates that the cleaning equipment is abnormal, the control operation will continue to be performed on the cleaning equipment, and the staff will be notified to perform maintenance on it.

[0032] In one embodiment, when inspecting the cleaning equipment through steps S1-S4, the AMA system will pull a batch of wafers. After the inspection step is completed, the wafers in this batch can be recycled as an inspection step. However, the wafers have a maximum number of uses. If the maximum number of uses is exceeded, the wafers in this batch are still used as the inspection step, which will affect the measurement value and thus affect the inspection result. Therefore, the processing method for the wafers in this batch is that after the inspection is completed, the wafers in this batch leave the machine or station, that is, after the wafers in this batch leave the Measure station, the number of uses of the wafers is extracted. If the number of uses has reached the maximum number of uses, the wafers in this batch enter the cleaning station (clean station) for cleaning, that is, the wafers in this batch are placed in the wafer cleaning machine, and the cleaning operation is performed on the wafers. After cleaning, the wafers are measured again to obtain a third measurement value, and the calculation formula configured by the EDC Plan is used to determine whether the third measurement value is within the standard range. Then, the wafers in this batch enter the Recycle The End site selects the action to be performed. If it is within the range value that meets the standard, it means that the wafers in this batch can still be used in the inspection step after cleaning. The Recycle End site selects the cyclic use inspection operation, that is, they can be pulled by the AMA system and placed in the Monitor Foup. If it is not within the range value that meets the standard, the Recycle End site selects the cleaning action, and the wafers in this batch are returned to the clean site for cleaning operation again. When the number of uses of the wafers in this batch reaches the maximum number of uses and the number of cleanings of the wafers in this batch also reaches the maximum number of cleanings, the Recycle End site selects the demotion action, that is, the AMA system directly performs the demotion operation on the wafers in this batch.

[0033] In an embodiment of the present invention, in order to save measurement resources, during the inspection process, if the staff observes that the measurement data is not good, they can manually cancel the current process, for example, by jumping to a station to end the current process, or they can choose to complete or cancel the current inspection to end the current process; if it is found during the inspection process that the cleaning equipment does not meet the production requirements, or the cleaning equipment fails to complete the inspection within the specified time, the staff can promptly control the cleaning equipment and stop the cleaning equipment from cleaning the Foup to prevent losses to production.

[0034] An automated inspection method for a front-opening wafer transfer box cleaning device provided by an embodiment of the present invention has the following beneficial effects: by configuring different parameters in the device control code, more refined inspection of the FOUP cleaning device can be achieved; multiple device control codes can be configured for the FOUP cleaning device, and the FOUP cleaning device can be inspected in multiple dimensions; the time can be freely configured, and the inspection time can be flexibly configured according to the factory production plan and working hours, and the new production plan can be readjusted and repositioned at any time, providing greater flexibility in responding to demand fluctuations; the wafer condition is measured, and the EDC Plan performs data collection using the measurement equipment to provide feedback on the current cleaning capacity of the FOUP cleaning device; high-speed, continuous and precise production operations can be achieved, and according to the set time, the FOUP for inspection is automatically prepared before inspection, and the FOUP for inspection is cleaned in advance, and the FOUP is automatically grabbed and measured when the inspection time arrives; inspection can be configured in batches to achieve automated inspection, which can better adapt to the factory's production plan, has high inspection efficiency and does not consume manpower, can better protect production and reduce losses.

[0035] The above describes in detail the optional implementation methods of the embodiments of the present invention in conjunction with the accompanying drawings. However, the embodiments of the present invention are not limited to the specific details in the above implementation methods. Within the technical concept of the embodiments of the present invention, various simple modifications can be made to the technical solutions of the embodiments of the present invention, and these simple modifications all fall within the scope of protection of the embodiments of the present invention.

[0036] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any appropriate manner without contradiction. To avoid unnecessary repetition, the embodiments of the present invention will not further describe various possible combinations.

[0037] Those skilled in the art will understand that all or part of the steps in the above-mentioned embodiments can be implemented by instructing the relevant hardware through a program. The program is stored in a storage medium and includes a number of instructions for causing a single-chip microcomputer, chip, or processor to execute all or part of the steps in the methods described in the various embodiments of the present application. The aforementioned storage medium includes various media that can store program code, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0038] In addition, various implementations of the embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the embodiments of the present invention, they should also be regarded as the contents disclosed in the embodiments of the present invention.

Claims

1. An automated detection method for a front-opening wafer pod cleaning device, characterized in that: The method specifically includes: Step S1: Acquire parameter information, the parameter information including front-loading pod parameters, wafer parameters, and a timing monitoring mechanism, configure a control information code according to the parameter information, and bind the control information code to a cleaning device of the front-loading pod; Step S2: When the parameter conditions in the control information code are met, the AMA system grabs the front-loading pod with the earliest cleaning date, binds the control information code to the front-loading pod, cleans the front-loading pod using the cleaning equipment, and marks the front-loading pod as a Monitor Pod; Step S3: The AMA system pulls a batch of wafers, performs a first measurement on the wafers and obtains a first measurement value, obtains a data collection plan, and determines whether the wafers have an abnormality based on the first measurement value and the data collection plan. If an abnormality is found, abnormality processing is performed; if no abnormality is found, the wafers are placed in the Monitor Foup; Step S4: After placing the Monitor Foup, perform a second measurement on the wafer and obtain a second measurement value. Obtain the difference between the second measurement value and the first measurement value through the data collection plan, determine the inspection result of the cleaning equipment through the difference, and perform operations on the cleaning equipment according to the inspection result.

2. The automated detection method for cleaning a front-opening wafer pod according to claim 1, wherein: In the step S1, the front-loading FOUP parameters include slot information and type information of the front-loading FOUP, and the slot information and type information are both information representing the state of the front-loading FOUP; The wafer parameters include the number of wafers, and the timing monitoring mechanism includes an advance cleaning time and a reminder time, wherein the advance cleaning time and the reminder time are monitoring times allocated according to the factory working hours; The cleaning device is configured with no less than 2 control information codes.

3. The automated detection method for cleaning a front-opening wafer pod according to claim 2, wherein: The step S2 includes: when the parameter condition is a time parameter in the timing monitoring mechanism, when the time parameter is reached, the AMA system scans and extracts the cleaning date of the front-opening wafer pod; The front-opening wafer transfer boxes are grabbed one by one in the order of arrival of the cleaning dates.

4. The automated detection method for cleaning a front-opening wafer pod according to claim 1, wherein: Said step S3 comprises: said data collection plan configuring a calculation formula, a standard value range, a difference range and an exception handling method according to the production plan and individual requirements; When an abnormality occurs on a wafer, the AMA system performs an abnormality handling operation on the wafer according to the abnormality handling method.

5. The automated detection method for cleaning a front-opening wafer pod according to claim 4, wherein: The step S4 includes: after placing the Monitor Foup, performing a second measurement on the wafer and obtaining a second measurement value, obtaining the calculation formula and the difference range, and obtaining the difference between the second measurement value and the first measurement value according to the calculation formula; Determine the detection result based on whether the difference is within the difference range: If so, the detection result is determined to be normal, and the cleaning device continues to perform the cleaning operation; If not, the detection result is determined to be abnormal, and a control operation is performed on the cleaning equipment.

6. The automated detection method for cleaning a front-opening wafer pod according to claim 5, characterized in that: Performing control operations on the cleaning equipment includes: After the cleaning equipment is controlled, a new batch of wafers is pulled and the cleaning equipment is tested again according to steps S1 to S4 to obtain new test results; If the new detection result is normal, the cleaning device continues to perform the cleaning operation; If the new detection result is abnormal, a maintenance operation is performed on the cleaning equipment.

7. The automated detection method for cleaning a front-opening wafer pod according to claim 1, wherein: The method further includes: after the detection is completed, extracting the usage count of the wafer to determine whether the wafer can continue to be used; If it is available, continue to perform step S3 on the wafer; If the wafer cannot be used, performing a cleaning operation on the wafer, and performing a third measurement on the wafer after cleaning to obtain a third measurement value; determining whether the wafer has an abnormality according to the third measurement value and the data collection plan; If there is an abnormality, performing a cleaning operation on the wafer again; If there is no abnormality, continue to perform the operation of step S3 on the wafer; When both the number of times the wafer is used and the number of times it is cleaned reach upper limits, a degradation operation is performed on the wafer.

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