Stamping state monitoring method, electronic equipment and storage medium

Abstract

The invention relates to the field of data processing, in particular to a stamping state monitoring method, electronic equipment and a storage medium, and the stamping state monitoring method comprises the steps that in response to received current stamping parameters, a stamping machine is controlled to conduct stamping operation on a to-be-stamped part according to the current stamping parameters, and a corresponding stamping forming part is obtained and serves as a current stamping forming part; state parameters and defect information of the current punch forming part are obtained, and a state vector of the current punch forming part is obtained based on the obtained state parameters and defect information; obtaining a current stamping state determination method based on the defect information; and the current punching state of the punching machine is determined through a current punching state determining method, and pressure parameter adjusting prompt information is determined based on the obtained punching state. According to the method, the stamping state can be monitored in real time based on the state vector of the stamping forming part, the corresponding prompt information is output, and certain reference information can be provided for performance optimization of the stamping forming part in a practical application scene.

Description

Technical Field

[0001] The present invention relates to the field of data processing, and in particular to a stamping state monitoring method, electronic equipment and storage medium. Background Art

[0002] In the field of stamping, there is a strong coupling between the press parameters (such as stamping speed, pressure, and temperature) and the performance of the stamped parts (such as dimensional accuracy, crack tendency, and mechanical strength). Therefore, it is necessary to monitor the stamping state of the press in real time and output corresponding prompt information based on the monitored status to provide reference information for optimizing the performance of stamped parts. Summary of the Invention

[0003] In view of the above technical problems, the technical solution adopted by the present invention is: According to a first aspect of the present invention, a stamping state monitoring method is provided, the method comprising the following steps: In response to receiving the current stamping parameters, the stamping machine is controlled to perform a stamping operation on the part to be stamped using the current stamping parameters to obtain a corresponding stamped part as the current stamped part.

[0004] The state parameters and defect information of the current stamped part are obtained, and the state vector of the current stamped part is obtained based on the obtained state parameters and defect information; the state parameters include stress, strain rate and stamping instantaneous temperature change.

[0005] If the defect information indicates that there are defects in the current stamped part, based on the stamping parameter adjustment prompt information within a preset historical time period, a stamping state determination method for obtaining the stamping state value is determined as the current stamping state determination method; wherein the stamping state determination method includes a first stamping state determination method and a second stamping state determination method, the first stamping state determination method determines the stamping state value based on the state vector of the current stamped part, and the second stamping state determination method determines the stamping state value based on the defect information of the current stamped part.

[0006] If the defect information indicates that there is no defect in the current stamping part, the first stamping state determination method is used as the current stamping state determination method.

[0007] The current stamping state of the stamping machine is determined using the current stamping state determination method. If the current stamping state determined is the first stamping state, the output indicates that the first stamping parameter adjustment prompt information does not need to be adjusted for the current stamping parameters. If the current stamping state determined is the second stamping state, the output indicates that the second stamping parameter adjustment prompt information needs to be adjusted for the current stamping parameters.

[0008] According to a second aspect of the present invention, an electronic device is provided, comprising a processor and a memory; the processor is configured to execute the steps of the method according to the first aspect of the present invention by calling a program or instruction stored in the memory.

[0009] According to a third aspect of the present invention, there is provided a computer-readable storage medium storing a program or instructions, wherein the program or instructions enable a computer to execute the steps of the method according to the first aspect of the present invention.

[0010] The present invention has at least the following beneficial effects: A stamping state monitoring method provided by an embodiment of the present invention includes: in response to receiving current stamping parameters, controlling the stamping machine to perform a stamping operation on a stamped part with the current stamping parameters, obtaining a corresponding stamped part as the current stamped part; obtaining state parameters and defect information of the current stamped part, and obtaining a state vector of the current stamped part based on the obtained state parameters and defect information; obtaining a current stamping state determination method based on the defect information; determining the current stamping state of the stamping machine using the current stamping state determination method, if the current stamping state determined is a first stamping state, outputting first stamping parameter adjustment prompt information indicating that the current stamping parameters do not need to be adjusted, if the current stamping state determined is a second stamping state, outputting second stamping parameter adjustment prompt information indicating that the current stamping parameters need to be adjusted. The present invention can monitor the stamping state in real time based on the state vector of the stamped part and output corresponding prompt information. In actual application scenarios, it can provide certain reference information for performance optimization of the stamped part.

[0011] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0013] Figure 1 The present invention provides a flowchart of a method for monitoring stamping status. DETAILED DESCRIPTION

[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0015] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0016] It should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowcharts describe the steps as sequential processes, many of the steps can be performed in parallel, concurrently, or simultaneously. In addition, the order of the steps can be rearranged. A process can be terminated when its operation is completed, but can also have additional steps not included in the accompanying drawings. A process can correspond to a method, function, procedure, subroutine, subprogram, etc.

[0017] The embodiment of the present invention provides a stamping state monitoring method, such as Figure 1 As shown, the method may include the following steps: S10 , in response to receiving the current stamping parameters, controlling the stamping machine to perform a stamping operation on the part to be stamped with the current stamping parameters, and obtaining a corresponding stamped part as the current stamped part.

[0018] In an embodiment of the present invention, the current stamping parameters can be obtained based on the currently received stamping parameter adjustment prompt information. The stamping parameter adjustment prompt information may include first stamping parameter adjustment prompt information indicating that the current stamping parameters do not need to be adjusted and second stamping parameter adjustment prompt information indicating that the current stamping parameters need to be adjusted.

[0019] In an embodiment of the present invention, the current stamped part may be a solar photovoltaic bracket.

[0020] In an exemplary embodiment, the part to be stamped is a substrate made of zinc-magnesium-aluminum material.

[0021] In another exemplary embodiment, the part to be stamped may be a coated substrate. The substrate may be a steel plate, and the coating may be a zinc-magnesium-aluminum material. Preferably, in this embodiment of the present invention, the part to be stamped is a steel plate coated with zinc-magnesium-aluminum material. S20: Obtain state parameters and defect information of the current stamped part, and obtain a state vector of the current stamped part based on the obtained state parameters and defect information.

[0022] In an embodiment of the present invention, the state parameters may include stress, strain rate, and instantaneous temperature change during stamping. The strain rate can be obtained by measuring the deformation at the R angle of the coating bend using a laser speckle strain gauge, and the specific acquisition method may be existing technology. The accuracy of the laser speckle strain gauge may be ±0.01%. Stress can be obtained by embedding a thin film stress sensor on the surface of the stamping mold, and the specific acquisition method may be existing technology. The measuring range of the thin film stress sensor may be 0-300 MPa. The instantaneous temperature change during stamping can be obtained by monitoring with an infrared thermal imager, and the specific monitoring method may be existing technology.

[0023] In an embodiment of the present invention, the state vector of the current stamped part may include thickness, chemical composition, corrected strain rate, corrected stamping instantaneous temperature change, and defect risk index.

[0024] In an embodiment of the present invention, the chemical composition of the stamped part may be the chemical composition of each material constituting the stamped part. When the stamped part is a steel plate coated with zinc-magnesium-aluminum material, the chemical composition of the stamped part may include the zinc content, aluminum content, magnesium content, and other element contents. The other element contents may be the element contents used in the steel plate.

[0025] In the embodiments of the present invention, the corrected strain rate is the strain rate obtained by correcting the strain rate in the state information, and the corrected stamping instantaneous temperature change is the stamping instantaneous temperature change obtained by correcting the stamping instantaneous temperature change in the state information. Those skilled in the art will appreciate that existing correction methods can be used to obtain the corrected strain rate and the corrected stamping instantaneous temperature change.

[0026] In an embodiment of the present invention, defect information of a stamped part can be obtained by scanning a lens. Defects may include cracks, bubbles, and the like.

[0027] In one embodiment of the present invention, the defect risk index of the current stamped part satisfies the following conditions: Rick=1 / (1+e -f（y） ).

[0028] Among them, Rick is the defect risk index, e is a natural constant, f(y) is the preset function expression, f(y)=f1×ε+f2×△T+f3×m.

[0029] Among them, ε is the corrected strain rate of the current stamped part, △T is the corrected stamping instantaneous temperature change of the current stamped part, m is the content of the chemical component that affects the detection performance of the stamped part, f1 is the first coefficient, f2 is the second coefficient, and f3 is the third coefficient.

[0030] In an embodiment of the present invention, the detection performance of the stamped part may include corrosion resistance, and the chemical component that affects the detection performance of the stamped part may be magnesium, that is, m is the magnesium content.

[0031] In another embodiment of the present invention, the defect risk index of the current stamped part satisfies the following conditions: Rick=α×RI+β×∑ t-1 i=1 Rick i ×e -γ（t-i） +λ×SI.

[0032] Among them, RI is the current crack characterization index of the current stamping part, Rick i is the defect risk index of the stamped part obtained by the stamping machine during the i-th press run. i ranges from 1 to t-1, t is the current total number of press runs, SI is the coupling risk index of the current stamped part, α, β, and λ are preset weights, γ is the time decay coefficient, and e is a natural constant. α, β, λ, and γ can be empirical values. In one exemplary embodiment, α = 0.6, β = 0.3, λ = 0.1, and γ = 0.16.

[0033] Furthermore, RI meets the following conditions: TI=k1×L+k2×W+k3×N.

[0034] Where k1 is the first coefficient, k2 is the second coefficient, and k3 is the third coefficient. k1+k2+k3=1. L is the length of the current stamped part, W is the width of the current stamped part, and N is the number of crack branches in the current stamped part. k1, k2, and k3 can be empirical values. In one exemplary embodiment, k1=0.2, k2=0.5, and k3=0.3.

[0035] Furthermore, SI satisfies the following conditions: SI = (σ / σ yeild ) 2 ×(1 / (1+e -（d-0.2） / 0.05 )).

[0036] Among them, σ is the stress of the current stamping part, σ yeild is the material yield strength of the current stamped part, and d is the shortest distance between the crack and the corresponding edge in the current stamped part. Specifically, the distances between all cracks and the corresponding edges can be obtained, and then the shortest distance is selected as d.

[0037] S30, if the defect information indicates that there are defects in the current stamped part, based on the stamping parameter adjustment prompt information within a preset historical time period, a stamping state determination method for obtaining the stamping state value is determined as the current stamping state determination method.

[0038] In the embodiment of the present invention, the duration of the preset historical time period can be set based on actual conditions, as long as there is a certain number of stamping parameter adjustment prompt information.

[0039] In an embodiment of the present invention, the stamping state determination method includes a first stamping state determination method and a second stamping state determination method. The first stamping state determination method determines the stamping state value based on the state vector of the current stamped part, and the second stamping state determination method determines the stamping state value based on the defect information of the current stamped part.

[0040] Furthermore, if the defect information indicates that there is a defect in the current stamped part, a stamping state determination method for obtaining the stamping state is determined based on the stamping parameter adjustment prompt information within a preset historical time period as the current stamping state determination method, specifically including: If the number of second stamping parameter adjustment prompt messages in the stamping parameter adjustment prompt information within the preset historical time period is less than or equal to the set number, it means that the stamping parameters are relatively stable, and the stamping state value can be determined only based on the defect information, that is, the second stamping state determination method is determined as the current stamping state determination method; otherwise, it means that the stamping parameters are unstable, and the stamping state value needs to be determined based on multiple state parameters of the stamped part, that is, the first stamping state determination method is determined as the current stamping state determination method.

[0041] The stamping state value S1 of the stamping machine determined based on the first stamping state determination method satisfies the following conditions: S1=w1×C1+w2×C2+w3×C3.

[0042] Among them, C1 is the first sub-state value, C2 is the second sub-state value, C3 is the third sub-state value, w1 is the first weight, w2 is the second weight, w3 is the third weight, w1+w2+w3=1.

[0043] Where C1=1-SP, SP is the predicted value of the crack area ratio of the current stamped part. SP satisfies the following conditions: SP=SP0×exp[θ1×(w Al / p1)-θ2×(w Mg / p2) 2 +θ3×ln(ε / ε0)+θ4×(△T / T0)+θ5×Rick-θ6×h / h0].

[0044] Wherein, SP0 is the initial defect area ratio of the current stamped part, which can be obtained based on the acquired defect information, specifically the ratio of the area of all defects to the total area of the stamped part. h is the thickness of the current stamped part. w Al is the aluminum content of the current stamped part, w Mg is the magnesium content of the current stamped part. ε is the corrected strain rate of the current stamped part, and ε0 is the quasi-static strain rate, which can be 10 -3 / s, that is, the strain per second is 0.001. △T is the corrected stamping instantaneous temperature change of the current stamped part, p1 is the first percentage, for example, it can be 5%. p2 is the second percentage, for example, it can be 1.5%. θ1, θ2, θ3, θ4, θ5 and θ6 are all fitting coefficients, which can be empirical values. In an exemplary embodiment, θ1=1.8, θ2=2.5, θ3=0.8, θ4=0.5, θ5=1.2, θ6=0.6. T0 is the preset reference temperature, which can be 100℃. exp() is an exponential function, and h0 is the preset thickness, which can be 1mm.

[0045] Furthermore, C2=1-Δs, where Δs is the dimensional deviation of the current stamped part. Those skilled in the art will appreciate that the dimensional deviation can be obtained based on existing technologies, such as the thickness, chemical composition, strain rate, instantaneous stamping temperature change, and defect risk index of the stamped part.

[0046] In an exemplary embodiment, Δs may satisfy the following conditions: △s=d1×(△h / h inital )+d2×ln(ε / ε0)+d3×△T / T0+d4×(w Mg / p2)+d5×HCl t .

[0047] Among them, △h is the thickness change value of the current stamping part, which is equal to h inital -h,h inital is the initial thickness of the stamped part, d1 is the thickness sensitivity coefficient, d2 is the strain rate sensitivity coefficient, d3 is the thermal expansion coefficient, d4 is the chemical composition sensitivity coefficient, and d5 is the crack index sensitivity coefficient.

[0048] In the embodiment of the present invention, C3 is used to characterize the energy consumption increment of the stamped part, that is, C3 is equal to the energy consumption increment of the stamped part.

[0049] In an embodiment of the present invention, the energy consumption increment of the stamped part can be obtained based on existing methods. In an exemplary embodiment, the energy consumption increment can be equal to the actual power consumption of the stamping machine and the minimum deformation energy of the force calculated based on the material plastic deformation theory. In an exemplary embodiment, the minimum deformation energy Emin The following conditions can be met: E min ≈V×∫0 s（p） σ×ds. Where s represents the total strain of the material, s(p) is the final plastic strain of the material, which is equal to the total strain minus the elastic strain, and V is the volume of the molded part, in m 3 , ds means the integral operation on s.

[0050] The stamping state value S2 of the stamping machine determined based on the second stamping state determination method satisfies the following conditions: S2=x1×(1-DF)+x2×HUI-x3×Dp; Among them, DF is the defect ratio in the stamped part, HUI is the pattern uniformity index of the stamped part, Dp is the stamping parameter deviation, x1 is the first set value, x2 is the second set value, and x3 is the third set value.

[0051] In an exemplary embodiment of the present invention, DF satisfies the following conditions: DF=∑ H i=1 DF i .

[0052] Among them, DF i is the defect ratio of the i-th defect, i ranges from 1 to H, H is the number of defect types, and in this embodiment of the present invention, it includes two types of defects: bubbles and cracks. i =(∑ z（i） j=1 L ij ) / L i-max , where L ij L is the size of the jth defect in the i-th defect category, j ranges from 1 to z(i), and z(i) is the number of defects corresponding to the i-th defect category, for example, 3 cracks or 4 bubbles. i-max is the maximum size corresponding to the i-th type defect.

[0053] In the embodiment of the present invention, if the defect is a crack, the size of the crack is the crack length; if the defect is a bubble, the size of the bubble is the area of the bubble.

[0054] In another exemplary embodiment of the present invention, DF satisfies the following condition: DF=∑ H i=1 g i ×DF i . g i is the weight corresponding to the i-th type of defect, which may be an empirical value, and the sum of the weights of all types of defects may be 1. In an exemplary embodiment, the weight of a crack may be greater than the weight of a bubble.

[0055] In an embodiment of the present invention, the pattern uniformity index of the stamped part can be calculated by an image recognition algorithm, and the value range is [0,1]. The larger the value, the more uniform the pattern. The specific calculation method can be the existing technology.

[0056] In an embodiment of the present invention, the stamping parameter deviation is used to measure the degree of deviation between the current stamping parameters and the benchmark stamping parameters. The benchmark stamping parameters may be experimental values obtained based on historical data. The stamping parameter deviation may specifically be the distance or similarity between the current stamping parameters and the benchmark stamping parameters.

[0057] S40: If the defect information indicates that there is no defect in the current stamping part, the first stamping state determination method is used as the current stamping state determination method.

[0058] S50, using the current stamping state determination method to determine the current stamping state of the stamping machine, if the current stamping state determined is the first stamping state, output the first stamping parameter adjustment prompt information indicating that the current stamping parameters do not need to be adjusted; if the current stamping state determined is the second stamping state, output the second stamping parameter adjustment prompt information indicating that the current stamping parameters need to be adjusted.

[0059] Furthermore, if the stamping state value of the stamping machine determined by the current stamping state determination method is greater than or equal to the set stamping state value, the current stamping state is determined to be the first stamping state; otherwise, the current stamping state is the second stamping state.

[0060] In the embodiment of the present invention, the set stamping state value may be an empirical value, and the stamping parameter adjustment prompt information will be saved in the set location.

[0061] In actual application scenarios, users can determine whether to adjust the current stamping parameters based on the output stamping parameter adjustment prompt information. The specific adjustment method can be determined according to actual conditions. The present invention does not make any special limitations. The present invention aims to provide a stamping parameter adjustment prompt information to prompt the status of the current stamping parameters.

[0062] An embodiment of the present invention also provides an electronic device, comprising: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are configured to execute the method described in the embodiment of the present invention.

[0063] An embodiment of the present invention further provides a computer-readable storage medium storing computer-executable instructions, wherein the computer instructions are used to execute the method described in the embodiment of the present invention.

[0064] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in the present invention can be achieved. This is not limited herein.

[0065] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A stamping state monitoring method, characterized in that: The method comprises the following steps: In response to receiving the current stamping parameters, controlling the stamping machine to perform a stamping operation on the part to be stamped using the current stamping parameters to obtain a corresponding stamped part as the current stamped part; Acquire state parameters and defect information of the current stamped part, and acquire a state vector of the current stamped part based on the acquired state parameters and defect information; the state parameters include stress, strain rate, and stamping instantaneous temperature change; If the defect information indicates that there is a defect in the current stamped part, a stamping state determination method for obtaining a stamping state value is determined based on the stamping parameter adjustment prompt information within a preset historical time period, as the current stamping state determination method; wherein the stamping state determination method includes a first stamping state determination method and a second stamping state determination method, the first stamping state determination method determines the stamping state value based on a state vector of the current stamped part, and the second stamping state determination method determines the stamping state value based on the defect information of the current stamped part; If the defect information indicates that there is no defect in the current stamping part, the first stamping state determination method is used as the current stamping state determination method; The current stamping state of the stamping machine is determined using the current stamping state determination method. If the current stamping state determined is the first stamping state, the output indicates that the first stamping parameter adjustment prompt information does not need to be adjusted for the current stamping parameters. If the current stamping state determined is the second stamping state, the output indicates that the second stamping parameter adjustment prompt information needs to be adjusted for the current stamping parameters.

2. The stamping state monitoring method according to claim 1, characterized in that: The state vector of the current stamped part includes thickness, chemical composition, corrected strain rate, corrected stamping instantaneous temperature change and defect risk index.

3. The stamping state monitoring method according to claim 1, characterized in that: If the defect information indicates that there is a defect in the current stamped part, a stamping state determination method for obtaining the stamping state is determined based on the stamping parameter adjustment prompt information within a preset historical time period, as the current stamping state determination method, specifically including: If the number of second stamping parameter adjustment prompt information in the stamping parameter adjustment prompt information within the preset historical time period is less than or equal to the set number, the second stamping state determination method is determined to be the current stamping state determination method; otherwise, the first stamping state determination method is determined to be the current stamping state determination method.

4. The stamping state monitoring method according to claim 2, characterized in that: If the stamping state value of the stamping machine determined by the current stamping state determination method is greater than or equal to the set stamping state value, the current stamping state is determined to be the first stamping state; otherwise, the current stamping state is determined to be the second stamping state.

5. The stamping state monitoring method according to claim 4, characterized in that: in, The stamping state value S1 of the stamping machine determined based on the first stamping state determination method satisfies the following condition: S1=w1×C1+w2×C2+w3×C3; Among them, C1 is the first sub-state value, C2 is the second sub-state value, C3 is the third sub-state value, w1 is the first weight, w2 is the second weight, w3 is the third weight, w1+w2+w3=1; C1=1-SP, SP is the predicted value of the crack area rate of the current stamped part; C2=1-△s, △s is the dimensional deviation of the current stamped part, and C3 is used to characterize the energy consumption increment of the stamped part.

6. The stamping state monitoring method according to claim 4, characterized in that: in, The stamping state value S2 of the stamping machine determined based on the second stamping state determination method satisfies the following conditions: S2=x1×(1-DF)+x2×HUI-x3×Dp; Among them, DF is the defect ratio in the stamped part, HUI is the pattern uniformity index of the stamped part, Dp is the stamping parameter deviation, x1 is the first set value, x2 is the second set value, and x3 is the third set value.

7. The stamping state monitoring method according to claim 5, characterized in that: The defect risk index of the current stamped parts meets the following conditions: Rick=1 / (1+e -f（y） ); Where Rick is the defect risk index, e is a natural constant, f(y) is a preset function expression, f(y)=f1×ε+f2×△T+f3×m; Among them, ε is the strain rate of the current stamped part, △T is the instantaneous stamping temperature change of the current stamped part, m is the content of the chemical component that affects the detection performance of the stamped part, f1 is the first coefficient, f2 is the second coefficient, and f3 is the third coefficient.

8. The stamping state monitoring method according to claim 1, characterized in that: Defects include cracks and bubbles.

9. An electronic device, characterized in that: including processor and memory; The processor is configured to execute the steps of the stamping state monitoring method according to any one of claims 1 to 8 by calling the program or instructions stored in the memory.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium is used to store a program or instruction, and the program or instruction enables a computer to execute the steps of the stamping state monitoring method according to any one of claims 1 to 8.

Images