Semi-cut-off packaging material and preparation method and application thereof

Abstract

The invention provides a semi-cut-off packaging material and a preparation method and application thereof.The semi-cut-off packaging material comprises specific parts of matrix resin, an ultraviolet cut-off agent, a main cross-linking agent and an auxiliary cross-linking agent, and the ultraviolet cut-off agent comprises a compound of an ultraviolet cut-off agent A and an ultraviolet cut-off agent B, the ultraviolet cut-off agent A is prepared from homosalate and / or isooctyl salicylate, and the ultraviolet cut-off agent B is prepared from dibenzofuran; the two specific substances are selected to be matched as the ultraviolet cut-off agent, and the two substances can form a combination of'wide spectrum absorption + narrow band enhancement ', so that the obtained semi-cut-off packaging material can accurately cut off a UVB high-energy region and give high transmittance to a UVA region; and the degradation of the packaging material and the TOPCON solar cell due to absorption of ultraviolet light in the actual use process can be reduced, and the ultraviolet stability of the TOPCON solar cell is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of packaging materials, and in particular relates to a semi-cutoff packaging material and a preparation method and application thereof. Background Art

[0002] As the photovoltaic industry iterates towards high-efficiency N-type technology, TOPCON (tunneling oxide passivation contact) cells have become the mainstream direction due to their advantages such as high conversion efficiency (>26%) and low temperature coefficient. TOPCON cells use an N-type silicon substrate, with a backside passivated contact structure formed by an ultra-thin silicon oxide (approximately 12nm) and doped polysilicon layer. Hydrogen passivation is a key process in TOPCON cell manufacturing. During the annealing or deposition process, hydrogen atoms are introduced into the silicon bulk or interface, combining with silicon dangling bonds (defect states) to form stable Si-H bonds. This effectively suppresses recombination centers and improves the conversion efficiency of TOPCON cells. However, this also makes TOPCON cells sensitive to UV light, especially high-energy photons in the UVB band (wavelength 280-320nm). The energy of UVB photons (3.94-4.43eV) is significantly higher than the bond energy of silicon-hydrogen bonds (approximately 3.0-3.5eV), which easily destroys the Si-H bonds in the cell's passivation layer, resulting in a decrease in hydrogen content and a deterioration in the passivation effect. This, in turn, increases the recombination rate of photogenerated carriers, leading to power degradation. This is especially true when TOPCON cells are exposed to outdoor sunlight for long periods of time, triggering a series of reaction mechanisms that make long-term reliability impossible to guarantee.

[0003] Therefore, the unique passivated contact structure of TOPCON photovoltaic modules places higher requirements on packaging materials. Although traditional packaging films can block a certain amount of ultraviolet rays under ultraviolet radiation, they have defects such as insufficient cutoff ability in the UVB area, insufficient transmittance in the UVA area, or instability after UV aging, which leads to a decrease in the transmittance and power attenuation of TOPCON photovoltaic modules, affecting the bifacial power generation performance and long-term reliability of TOPCON cells.

[0004] For example, CN114806422A discloses a UV-cutoff EPE photovoltaic film, its preparation method, and photovoltaic module. The film has an excellent UV-cutoff effect through the synergistic combination of an organic UV absorber (p-dimethylaminocinnamoyloxypropyltrimethoxysilane) and an inorganic nano-oxide (titanium oxide), so as to solve the defect that the photovoltaic film is prone to delamination after wet-heat aging. However, the organic UV absorber introduced into the encapsulation film provided by the invention will have a certain light loss in the UVA band, and the inorganic titanium oxide filler introduced at the same time will reduce the transmittance in the visible light region, thereby reducing the power generation power of the module.

[0005] For example, CN222024285U discloses a UV cutoff film and solar cell, which adds bis-ethylhexyloxyphenol methoxyphenyl triazine UV cutoff agent. The cutoff agent can convert the photon energy absorbed after illumination into heat energy and then quickly return to the ground state, restoring the UV absorption ability, giving the film excellent UV absorption ability and light stability. However, the cutoff agent will have a large amount of absorption in the UVA region, affecting the transmittance in the UVA region, and will be unstable after aging, which will cause a certain loss of component power.

[0006] Therefore, in response to the above technical problems, developing a semi-cutoff packaging material with high cutoff rate in the UVB band and high transmittance in the UVA band is still a technical problem that needs to be solved urgently in this field. Summary of the Invention

[0007] In view of the shortcomings of the existing technology, the purpose of the present invention is to provide a semi-cutoff packaging material and its preparation method and application. The semi-cutoff packaging material has a high cutoff rate in the UVB band and a high transmittance in the UVA band, while not affecting the light transmittance in the visible light band, reducing light loss, and making the photovoltaic module containing it have high power and high UV stability.

[0008] To achieve this object, the present invention adopts the following technical solutions:

[0009] In a first aspect, the present invention provides a semi-cutoff type packaging material, wherein the semi-cutoff type packaging material comprises the following components in parts by weight:

[0010] 90-100 parts by weight of base resin;

[0011] 0.2-2 parts by weight of UV cut-off agent;

[0012]

[0013] The ultraviolet cutoff agent includes a compound of ultraviolet cutoff agent A and ultraviolet cutoff agent B;

[0014] The ultraviolet cut-off agent A includes homosalate and / or isooctyl salicylate;

[0015] The ultraviolet cut-off agent B includes dibenzofuran.

[0016] The semi-cutoff packaging material provided by the present invention can undergo thermal crosslinking and has a certain ultraviolet cutting effect. It specifically includes a specific number of base resins, ultraviolet cutoff agents, main crosslinking agents and auxiliary crosslinking agents, and the ultraviolet cutoff agent is limited to a compound of ultraviolet cutoff agent A and ultraviolet cutoff agent B, the ultraviolet cutoff agent A includes homosalate / or isooctyl salicylate, and the ultraviolet cutoff agent B includes dibenzofuran. By selecting the above two substances as ultraviolet cutoff agents, the two can form a combination of "broad spectrum absorption + narrow band enhancement", so that the obtained semi-cutoff packaging material can not only accurately cut off the UVB high energy zone and provide high transmittance in the UVA zone, but also reduce the degradation of the packaging material and TOPCON solar cells caused by absorbing ultraviolet light during actual use, thereby helping to improve the ultraviolet stability of the TOPCON solar cell.

[0017] The amount of the base resin may be 90 parts by weight, 91 parts by weight, 92 parts by weight, 93 parts by weight, 94 parts by weight, 95 parts by weight, 96 parts by weight, 97 parts by weight, 98 parts by weight, 99 parts by weight or 100 parts by weight.

[0018] The amount of the UV cutoff agent can be 0.2 parts by weight, 0.4 parts by weight, 0.6 parts by weight, 0.8 parts by weight, 1 part by weight, 1.2 parts by weight, 1.4 parts by weight, 1.6 parts by weight, 1.8 parts by weight or 2 parts by weight, etc.; on the one hand, when the total amount of the UV cutoff agent is less than 0.2 parts by weight, the UV blocking ability of the obtained packaging material in the UVB band will be insufficient, and the transmittance in the UVB band will be high; on the other hand, when the total amount of the UV cutoff agent is higher than 2 parts by weight, although the UV blocking ability of the obtained packaging material in the UVB band will be strengthened, the transmittance in the UVB band and the visible light region will decrease, and yellowing will easily occur, and the haze will also increase.

[0019] The amount of the primary cross-linking agent can be 0.2 parts by weight, 0.4 parts by weight, 0.6 parts by weight, 0.8 parts by weight, 1 part by weight, 1.2 parts by weight, 1.4 parts by weight or 1.5 parts by weight.

[0020] The amount of the auxiliary cross-linking agent can be 0.5 parts by weight, 0.7 parts by weight, 0.9 parts by weight, 1.1 parts by weight, 1.3 parts by weight, 1.5 parts by weight, 1.7 parts by weight, 1.9 parts by weight or 2 parts by weight.

[0021] Preferably, the mass ratio of the UV cutoff agent A to the UV cutoff agent B is (0.5-3):1, for example, 0.5:1, 0.7:1, 0.9:1, 1.1:1, 1.3:1, 1.5:1, 1.7:1, 1.9:1, 2.1:1, 2.3:1, 2.5:1, 2.7:1, 2.9:1 or 3:1, and more preferably (1-2):1.

[0022] Preferably, the melt index of the matrix resin under the test conditions of 190°C and 2.16 kg is 3 to 30 g / 10 min, for example, 3 g / 10 min, 6 g / 10 min, 9 g / 10 min, 12 g / 10 min, 15 g / 10 min, 18 g / 10 min, 21 g / 10 min, 24 g / 10 min, 27 g / 10 min or 30 g / 10 min, etc.

[0023] Preferably, the matrix resin is tested using a differential scanning calorimeter and has a melting temperature of ≤80°C, such as 80°C, 75°C, 70°C, 65°C, 60°C, 55°C or 50°C.

[0024] Preferably, the matrix resin includes any one or a combination of at least two of ethylene-vinyl acetate copolymer, ethylene-α-olefin copolymer, ethylene-methyl methacrylate polymer, ethylene-methyl acrylate polymer, ethylene-butyl acrylate polymer or ethylene-octene copolymer, and is further preferably ethylene-vinyl acetate copolymer and / or ethylene-α-olefin copolymer.

[0025] Preferably, the mass percentage of the vinyl acetate structure in the ethylene-vinyl acetate copolymer is 20-35%, for example, 20%, 22%, 24%, 26%, 28%, 30%, 32%, 34% or 35%.

[0026] Preferably, the α-olefin in the ethylene-α-olefin copolymer includes any one of 1-butene, 1-hexene or 1-octene.

[0027] Preferably, the mass percentage of the α-olefin structure in the ethylene-α-olefin copolymer is 15-35%, for example, 15%, 17%, 19%, 21%, 23%, 25%, 27%, 29%, 31%, 33% or 35%.

[0028] Preferably, the main cross-linking agent is an organic peroxide cross-linking agent.

[0029] Preferably, the organic peroxide crosslinking agent includes any one or a combination of at least two of t-pentyl peroxycarbonate-2-ethylhexanoate, t-butyl peroxyneohexanoate, t-hexyl peroxycarbonate-2-ethylhexanoate, t-butyl peroxyisobutyrate, 1,1-bis(t-pentylperoxy)-3,3,5-trimethylcyclohexane or 2,5-dimethyl-2,5(bis-t-butylperoxy)hexane.

[0030] Preferably, the auxiliary cross-linking agent includes any one or a combination of at least two of 1,6-hexanediol diacrylate, tricyclodecane dimethanol diacrylate, propoxylated glycerol triacrylate, trimethylolpropane trimethacrylate, ethoxylated trimethylolpropane triacrylate or triallyl isocyanurate.

[0031] Preferably, the semi-cutoff type packaging material further includes a coupling agent.

[0032] Preferably, the content of the coupling agent in the semi-cutoff packaging material is 0.05 to 1 part by weight, for example, 0.05 part by weight, 0.1 part by weight, 0.2 part by weight, 0.3 part by weight, 0.4 part by weight, 0.5 part by weight, 0.6 part by weight, 0.7 part by weight, 0.8 part by weight, 0.9 part by weight or 1 part by weight, etc.

[0033] Preferably, the coupling agent includes any one or a combination of at least two of vinyltriethoxysilane, vinyltri(β-methoxyethoxy)silane, γ-methacryloxypropoxytrimethoxysilane, octyltriethoxysilane oligomer or dodecyltrimethoxysilane oligomer, and is more preferably vinyltri(β-methoxyethoxy)silane.

[0034] Preferably, the semi-cutoff type packaging material further includes an antioxidant.

[0035] Preferably, the content of the antioxidant in the semi-cutoff type packaging material is 0.03 to 0.5 parts by weight, for example, 0.03 parts by weight, 0.05 parts by weight, 0.1 parts by weight, 0.15 parts by weight, 0.2 parts by weight, 0.25 parts by weight, 0.3 parts by weight, 0.35 parts by weight, 0.4 parts by weight, 0.45 parts by weight or 0.5 parts by weight, etc.

[0036] Preferably, the antioxidant includes any one of antioxidant 1076, antioxidant 1010, antioxidant 1098, antioxidant 168, antioxidant 626 or antioxidant 1520, or a combination of at least two thereof, and more preferably a combination of antioxidant 1076 and antioxidant 626.

[0037] Preferably, the semi-cutoff type packaging material further includes a light stabilizer.

[0038] Preferably, the content of the light stabilizer in the semi-cutoff packaging material is 0.03 to 0.3 parts by weight, for example, 0.03 parts by weight, 0.05 parts by weight, 0.07 parts by weight, 0.09 parts by weight, 0.11 parts by weight, 0.15 parts by weight, 0.2 parts by weight, 0.25 parts by weight or 0.3 parts by weight.

[0039] Preferably, the light stabilizer includes any one of light stabilizer 770, light stabilizer 944, light stabilizer 2020, light stabilizer 3853 or light stabilizer Uvinul 4050FF, or a combination of at least two thereof, and light stabilizer 2020 is further preferred.

[0040] In a second aspect, the present invention provides a method for preparing the semi-cutoff type packaging material as described in the first aspect, the preparation method comprising: mixing a base resin, a UV cutoff agent, a main cross-linking agent, an auxiliary cross-linking agent, an optional coupling agent, an optional antioxidant and an optional light stabilizer, and melt-extruding to obtain the semi-cutoff type packaging material.

[0041] Preferably, the temperature of the melt extrusion is 90-100°C, for example, 90°C, 92°C, 94°C, 96°C, 98°C or 100°C.

[0042] Preferably, the melt extrusion is carried out in a single screw extruder.

[0043] In a second aspect, the present invention provides a semi-cut-off type sealing film, which is obtained by casting the semi-cut-off type packaging material as described in the first aspect.

[0044] Preferably, the tape casting is performed in a tape casting machine.

[0045] Preferably, the thickness of the semi-stop type sealing film is 100-400 μm, for example, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm or 400 μm, and more preferably 200-400 μm.

[0046] In a fourth aspect, the present invention provides a TOPCON photovoltaic module, wherein the TOPCON photovoltaic module comprises the semi-cutoff encapsulation film as described in the third aspect.

[0047] Compared with the prior art, the present invention has the following beneficial effects:

[0048] (1) The semi-cutoff packaging material provided by the present invention includes a specific number of base resins, ultraviolet cutoff agents, main cross-linking agents and auxiliary cross-linking agents, and the ultraviolet cutoff agent is limited to a compound of homosalate and dibenzofuran. By introducing homosalate and dibenzofuran as ultraviolet cutoff agents, the two can form a "broad spectrum absorption + narrow band enhancement" combination, which can not only accurately cut off the UVB high energy region and provide high transmittance in the UVA region, but also reduce the degradation of the packaging material and TOPCON solar cells caused by absorbing ultraviolet light during actual use, thereby improving the ultraviolet stability of the TOPCON solar cells;

[0049] (2) Specifically, the semi-cutoff packaging material provided by the present invention can selectively absorb light in the UVB region (280-320 nm), with a light transmittance in the UVB region of less than 5%, and a transmittance in the UVA region (320-380 nm) of greater than 75%, while not affecting the transmittance in the visible light region (380-1100 nm), with a transmittance in the visible light region of greater than 90%, thereby reducing light loss. The initial power attenuation rate of the photovoltaic module prepared with the semi-cutoff packaging material (compared to the high-transmittance module prepared with the non-cutoff packaging material) is less than 0.5%, and the UV60KW power attenuation is ≤1.0%, and the yellowing value ΔYi / % is less than 3%; whereas the UV60KW power attenuation of the high-transmittance module prepared with the non-cutoff packaging material is greater than 3.0%. DETAILED DESCRIPTION

[0050] The technical solution of the present invention is further described below by way of specific embodiments. It should be understood by those skilled in the art that the embodiments are merely to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0051] The information of the raw materials involved in the following specific embodiments of the present invention is as follows:

[0052] (1) Ethylene-vinyl acetate copolymer: purchased from Sailbon Chemical, brand EVA28 / 25;

[0053] (2) Ethylene-α-olefin copolymer: purchased from LG Chemical, brand LF675;

[0054] (3) Ethylene-octene copolymer: purchased from Dow Chemical, brand 8669;

[0055] (4) Ethylene-butyl acrylate copolymer: purchased from Dow Chemical, brand AC34035;

[0056] (5) Homosalate: purchased from Hubei Wonder Chemical Co., Ltd.

[0057] (6) 2-Ethylhexyl salicylate: purchased from Hubei Hongjing Chemical Co., Ltd.;

[0058] (7) Dibenzofuran: purchased from Shanghai Qiti Technology Chemical, brand number 168.

[0059] Examples 1 to 12 and Comparative Examples 1 to 5

[0060] Examples 1 to 12 and Comparative Examples 1 to 5 respectively provide a semi-cutoff type packaging material, the components and amounts thereof are shown in Table 1 and Table 2;

[0061] In Tables 1 and 2, the units of the amounts of each component are "parts by weight";

[0062] Table 1

[0063]

[0064] Table 2

[0065]

[0066]

[0067] The preparation method of the semi-cut-off type packaging material provided in Examples 1 to 12 and Comparative Examples 1 to 5 comprises: mixing the above components, and melt-extruding them at 90 to 100° C. through a single-screw extruder to obtain the semi-cut-off type packaging material.

[0068] Performance testing:

[0069] (1) Sample preparation:

[0070] ① Preparation of semi-cutoff encapsulation film: The semi-cutoff encapsulation material is cooled and pulled through a casting machine, and then the thickness is measured and rolled up to obtain a semi-cutoff encapsulation film with a thickness of 300 μm.

[0071] ② Preparation of TOPCON photovoltaic module: laminating glass, semi-cutoff encapsulation film, TOPCON cell, high-transmittance material and glass at a lamination temperature of 145° C., a vacuuming time of 5 minutes, and a lamination time of 10 minutes to obtain the TOPCON photovoltaic module;

[0072] Among them, the glass is 2mm rolled glass;

[0073] TOPCON cells use 182×72 standard TOPCON cells with a thickness of about 130μm;

[0074] The high-transmittance material is ethylene-vinyl acetate copolymer.

[0075] (2) Test items:

[0076] ① Transmittance: Referring to GB / T 29848-2018, the semi-cutoff encapsulation films made of the semi-cutoff type encapsulation materials provided in Examples 1 to 12 and Comparative Examples 1 to 5 were tested using an ultraviolet spectrophotometer, and the transmittance data obtained in the UVB band (280-320 nm), UVA band (320-380 nm) and visible light band (380-1100 nm) are summarized in Table 3.

[0077] ② Yellowing value: Referring to GB / T 39294-2020, the semi-cutoff encapsulation films made of the semi-cutoff encapsulation materials provided in Examples 1 to 12 and Comparative Examples 1 to 5 were tested using an UltraScan VIS spectrophotometer. The test results are summarized in Table 4.

[0078] ③ Power test: The power test was performed on the TOPCON photovoltaic modules containing the semi-cutoff type encapsulation materials provided in Examples 1 to 12 and Comparative Examples 1 to 5 according to the test method provided in IEC 61215-2:2016, and the test results are summarized in Table 4.

[0079] ④UV aging performance: UV aging conditions are UV box test temperature of 85℃, relative humidity of 85%, irradiation intensity of 60kWh / m 2 ;

[0080] The yellowing value ΔYi / %, front power attenuation / %, UV60KW yellowing value ΔYi / %, and UV60KW module front power attenuation / % of the TOPCON photovoltaic module obtained from the above tests are summarized in Table 4.

[0081] Table 3

[0082]

[0083]

[0084] Table 4

[0085]

[0086] According to the data in Table 3 and Table 4, we can see that:

[0087] (1) The semi-cutoff packaging materials provided in Examples 1 to 12 have a transmittance of less than 5% in the UVB region, greater than 75% in the UVA region, and greater than 90% in the visible light region by introducing an ultraviolet cutoff agent; and the yellowing value ΔYi / % after being made into photovoltaic modules is less than 3%; the power attenuation of the front side of the module is less than 0.5%; and the UV60KW power attenuation is ≤1.0%.

[0088] (2) Compared with Examples 1 to 12, the packaging material provided in Comparative Example 1 without the addition of an ultraviolet cutoff agent has a transmittance of 88.6% in the UVB region and 91.69% in the UVA region, and does not yellow. However, after UV 60KW, the component power attenuation reaches 3.5%, which does not meet the requirements.

[0089] (3) Compared with Examples 1 to 12, the packaging material provided in Comparative Example 2, in which only dibenzofuran is added as a UV cutoff agent, has a transmittance of about 23.5% in the UVB region, about 90.75% in the UVA region, and 93.05% in the visible light region. The yellowing value after UV60KW reaches 3.1%, and the component power attenuation reaches 1.18%, which does not meet the requirements.

[0090] (4) Compared with Examples 1 to 12, the packaging material provided in Comparative Example 3, in which only homosalate is added as a UV cutoff agent, has a transmittance of approximately 8.45% in the UVB region, a transmittance of approximately 76.02% in the UVA region, and a transmittance of only 92.87% in the visible light region. The yellowing value after UV 60 kW reaches 3.55%, and the component power attenuation reaches 1.15%, which does not meet the requirements.

[0091] (5) Compared with Examples 1 to 12, the total content of the UV cutoff agent in the packaging material provided in Comparative Example 4 is lower, the transmittance in the UVB region is about 13.65%, the transmittance in the UVA region is about 80.5%, the transmittance in the visible light region is 93.23%, the yellowing value after UV60KW reaches 2.56%, and the component power attenuation reaches 1.38%, which does not meet the requirements.

[0092] (6) Compared with Examples 1 to 12, the total content of the UV cutoff agent in the packaging material provided in Comparative Example 5 is too high. The transmittance in the UVB region is about 1.5%, the transmittance in the UVA region is about 65.5%, and the transmittance in the visible light region is only 90.52%. The yellowing value reaches 2.84%, and the component power attenuation is 0.75%. After UV60KW, the yellowing value reaches 4.68%, and the component power attenuation reaches 0.8%, which does not meet the requirements.

[0093] (7) In addition, by comparing the data of Example 1 and Examples 9 to 11, it can be seen that the transmittance of the semi-cutoff type packaging materials made of different base resins will have certain differences, but it is still within the controllable standard range.

[0094] The applicant declares that the present invention, through the above-described embodiments, illustrates a semi-cutoff packaging material, its preparation method, and its application. However, the present invention is not limited to the above-described embodiments, which does not necessarily mean that the present invention must rely on the above-described embodiments for implementation. Those skilled in the art should understand that any improvements to the present invention, equivalent replacements for the raw materials of the present invention, additions of auxiliary components, and selection of specific methods, etc., fall within the scope of protection and disclosure of the present invention.

Claims

1. A semi-cutoff packaging material, characterized in that: The semi-cutoff packaging material comprises the following components in parts by weight: The ultraviolet cutoff agent includes a compound of ultraviolet cutoff agent A and ultraviolet cutoff agent B; The ultraviolet cut-off agent A includes homosalate and / or isooctyl salicylate; The ultraviolet cut-off agent B includes dibenzofuran.

2. The semi-cutoff type packaging material according to claim 1, characterized in that: The mass ratio of the ultraviolet cutoff agent A to the ultraviolet cutoff agent B is (0.2-3):1, preferably (0.5-2):

1.

3. The semi-cutoff type packaging material according to claim 1, characterized in that: The base resin has a melt index of 3 to 30 g / 10 min under test conditions of 190° C. and 2.16 kg; Preferably, the matrix resin includes any one or a combination of at least two of ethylene-vinyl acetate copolymer, ethylene-α-olefin copolymer, ethylene-methyl methacrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-butyl acrylate copolymer or ethylene-octene copolymer, and more preferably ethylene-vinyl acetate copolymer and / or ethylene-α-olefin copolymer.

4. The semi-cutoff type packaging material according to any one of claims 1 to 3, characterized in that: The main cross-linking agent is an organic peroxide cross-linking agent; Preferably, the organic peroxide crosslinking agent includes any one or a combination of at least two of t-pentyl peroxycarbonate-2-ethylhexanoate, t-butyl peroxyneohexanoate, t-hexyl peroxycarbonate-2-ethylhexanoate, t-butyl peroxyisobutyrate, 1,1-bis(t-pentylperoxy)-3,3,5-trimethylcyclohexane or 2,5-dimethyl-2,5(bis-t-butylperoxy)hexane; Preferably, the auxiliary crosslinking agent includes any one or a combination of at least two of 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, tricyclodecane dimethanol diacrylate, propoxylated glycerol triacrylate, trimethylolpropane trimethacrylate, ethoxylated trimethylolpropane triacrylate or triallyl isocyanurate.

5. The semi-cutoff type packaging material according to any one of claims 1 to 4, characterized in that: The semi-cutoff type packaging material also includes a coupling agent; Preferably, the content of the coupling agent in the semi-cutoff type packaging material is 0.05 to 1 parts by weight; Preferably, the coupling agent includes any one or a combination of at least two of vinyltriethoxysilane, vinyltri(β-methoxyethoxy)silane, γ-methacryloxypropoxytrimethoxysilane, octyltriethoxysilane oligomer or dodecyltrimethoxysilane oligomer, and is more preferably vinyltri(β-methoxyethoxy)silane.

6. The semi-cutoff type packaging material according to any one of claims 1 to 5, characterized in that: The semi-cutoff type packaging material also includes an antioxidant; Preferably, the content of the antioxidant in the semi-cutoff type packaging material is 0.03 to 0.5 parts by weight; Preferably, the antioxidant includes any one of antioxidant 1076, antioxidant 1010, antioxidant 1098, antioxidant 168, antioxidant 626 or antioxidant 1520, or a combination of at least two thereof, and more preferably a combination of antioxidant 1076 and antioxidant 626.

7. The semi-cutoff type packaging material according to any one of claims 1 to 6, characterized in that: The semi-cutoff type packaging material also includes a light stabilizer; Preferably, the content of the light stabilizer in the semi-cutoff type packaging material is 0.03 to 0.3 parts by weight; Preferably, the light stabilizer includes any one of light stabilizer 770, light stabilizer 944, light stabilizer 2020, light stabilizer 3853 or light stabilizer Uvinul 4050FF, or a combination of at least two thereof, and light stabilizer 2020 is more preferred.

8. A method for preparing the semi-cutoff type packaging material according to any one of claims 1 to 7, characterized in that: The preparation method comprises: mixing a base resin, a UV cut-off agent, a main cross-linking agent, an auxiliary cross-linking agent, an optional coupling agent, an optional antioxidant, and an optional light stabilizer, and melt-extruding the mixture to obtain the semi-cut-off packaging material; Preferably, the temperature of the melt extrusion is 90-100°C.

9. A semi-cut-off sealing film, characterized in that: The semi-stop type sealing film is obtained by casting the semi-stop type packaging material according to any one of claims 1 to 7; Preferably, the thickness of the semi-stop type sealing film is 100-400 μm, more preferably 200-400 μm.

10. A TOPCON photovoltaic module, characterized in that: The TOPCON photovoltaic module includes the semi-cutoff sealing film according to claim 9.

Images