Photoelectric co-packaging optical coupling passive alignment packaging structure and method
By using the adapter plate vias and solder ball tension effects in the photoelectric co-packaging, the passive alignment of optical components and grating couplers is solved, and the high-precision alignment problem of optical fiber coupling technology is achieved, and the efficient and low-cost photoelectric co-packaging is achieved, suitable for large-scale production and multi-type optical device integration.
Patent Information
- Application Number
- CN202510691531.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-27
- Publication Date
- 2025-08-15
AI Technical Summary
The existing fiber coupling technology has high precision alignment difficulty in photoelectric co-packaging. Active alignment relies on high precision equipment and complex processes, is costly and difficult to produce on a large scale. Traditional passive alignment technology is difficult to compatible with electrical packaging, and the packaging complexity and cost are high.
The optical coupling passive alignment package structure is adopted with the optoelectronic co-package, and the adapter plate vias is used as the limit structure of the optical element. The high-precision alignment between the optical chip and the adapter vias is achieved through the solder ball tension effect. Combined with the solder ball reflow process and the curing glue fixation, the passive coupling between the optical element and the grating coupler is realized.
It realizes efficient and compatible packaging of multiple types of optical devices, reduces packaging costs, improves packaging efficiency, supports large-scale photoelectric integration, and has a compact package size, making it easy to dissipate heat and air-seal packaging.