High-precision circuit board laser drilling process

Abstract

The invention discloses a high-precision circuit board laser drilling process, and particularly relates to the technical field of circuit board processing, and the high-precision circuit board laser drilling process comprises the following steps: step 1, selecting a high-quality base material and a copper-clad layer, and carrying out pretreatment on the base material, the pretreatment comprises cleaning and deoxidation, and the interaction efficiency of laser and the material is improved; 2, according to the design requirement of the circuit board, the position needing to be drilled and the aperture size are determined and completed through CAD software, a drilling data file is generated, the circuit board to be drilled is fixed to a drilling machine, and it is guaranteed that the board face is smooth and free of deformation; thirdly, a CO2 laser is selected, light beam focusing, laser power stability and laser beam uniformity of laser drilling equipment are optimized, and stability and accuracy of laser are guaranteed. According to the invention, high-precision laser drilling processing can be realized, the drilling processing quality of the circuit board can be ensured, the processing defective rate is obviously reduced, the popularization and the use are facilitated, and meanwhile, the method is suitable for a modern production process.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and more particularly to a high-precision circuit board laser drilling process. Background Art

[0002] The circuit board is the support body of electronic components. The component pins are connected by printed copper foil lines to form a current path, realizing signal transmission and functional collaboration. Circuit board drilling is a key process in the PCB manufacturing process. The main purpose of drilling is to build electrical connection channels between multi-layer boards, that is, to make vias. These vias can realize signal transmission and power connection between different circuit layers.

[0003] The circuit board drilling process in the existing technology has low processing accuracy and cannot guarantee the processing quality, resulting in a low processing defective rate, which is not conducive to promotion and use, and is also not conducive to adapting to modern production processes. Therefore, a high-precision circuit board laser drilling process is urgently needed to solve the above problems. Summary of the Invention

[0004] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a high-precision circuit board laser drilling process. The present invention can realize high-precision laser drilling processing, ensure the quality of circuit board drilling processing, significantly reduce the processing defective rate, and is conducive to promotion and use. At the same time, it is conducive to adapting to modern production processes to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a high-precision circuit board laser drilling process, comprising the following steps: Step 1: Select high-quality substrate and copper cladding, and pre-treat the substrate. Pre-treatment includes cleaning and deoxidation to improve the interaction efficiency between the laser and the material. Step 2: According to the design requirements of the circuit board, determine the location and size of the holes to be drilled, complete it through CAD software, and generate a drilling data file. Fix the circuit board to be drilled on the drilling machine to ensure that the board surface is flat and without deformation; Step 3: Select a CO2 laser and optimize the beam focusing, laser power stability, and laser beam uniformity of the laser drilling equipment to ensure the stability and accuracy of the laser. Adjust the laser power, focal length, and beam diameter to ensure that the laser beam can be accurately focused on the drilling position. Use a high-precision autofocus system to ensure that the laser focus is accurately aligned with the processing surface to avoid inconsistent apertures caused by focus deviation. Use a high-precision beam control system to achieve precise control of the laser size, direction, and focus point position. Set the drilling speed, feed rate, and drilling depth of the drilling machine according to the drilling data file. Step 4: Start the laser drilling machine. The laser beam begins to irradiate the surface of the circuit board, removing material through photothermal ablation to form a hole. During the drilling process, the drilling quality is monitored in real time, including the hole size and whether the hole shape is deformed. Step 5: After drilling is completed, clean the residue and carbide on the hole wall, complete the cleaning by mechanical grinding, electroplate the hole to enhance the conductivity and solderability of the hole wall, and perform quality inspection on the PCB after drilling, including hole size, hole position accuracy and hole wall quality, to ensure that the drilling quality meets the design requirements; Step 6: Use high-precision measuring tools to regularly calibrate the equipment to ensure aperture accuracy and consistency. Perform aperture measurement and statistical analysis on the processed circuit boards to detect and correct deviations in a timely manner.

[0006] In a preferred embodiment, the substrate in step 1 is set to be a FR-4 board.

[0007] In a preferred embodiment, the high-precision auto-focusing system in step three is configured as a high-precision version of an X-ray automatic alignment system.

[0008] In a preferred embodiment, the high-precision beam control system in step three is configured to use an ultraviolet laser and a composite beam positioning architecture in conjunction with an automatic visual calibration system.

[0009] Technical effects and advantages of the present invention: The present invention first selects a high-quality substrate and copper cladding layer, and pre-treats the substrate. The pre-treatment includes cleaning and deoxidation to improve the interaction efficiency between the laser and the material. According to the design requirements of the circuit board, the position and aperture size of the hole to be drilled are determined, and the hole is completed through CAD software. A drilling data file is generated, and the circuit board to be drilled is fixed on the drilling machine to ensure that the board surface is flat and without deformation. A CO2 laser is selected to optimize the beam focusing, laser power stability, and laser beam uniformity of the laser drilling equipment to ensure the stability and accuracy of the laser. The power, focal length and beam diameter of the laser are adjusted to ensure that the laser beam can be accurately focused on the drilling position. A high-precision autofocus system is used to ensure that the laser focus is accurately aligned with the processing surface to avoid inconsistent apertures caused by focus deviation. A high-precision beam control system is used to achieve fine control of the size, direction and focal point position of the laser. The drilling machine is set to drill according to the drilling data file. Speed, feed rate, drilling depth, start the laser drilling machine, the laser beam begins to irradiate the surface of the circuit board, and removes material by photothermal ablation to form a hole. During the drilling process, the drilling quality is monitored in real time, including monitoring the aperture size and whether the hole shape is deformed. After drilling is completed, the residue and carbide on the hole wall are cleaned and the cleaning is completed by mechanical grinding. The hole is electroplated to enhance the conductivity and solderability of the hole wall. The circuit board after drilling is quality checked, including the aperture size, hole position accuracy and hole wall quality to ensure that the drilling quality meets the design requirements. High-precision measuring tools are used to calibrate the equipment regularly to ensure aperture accuracy and consistency. The aperture of the processed circuit board is measured and statistically analyzed to detect and correct deviations in time. The present invention can achieve high-precision laser drilling processing, ensure the quality of circuit board drilling processing, significantly reduce the defective processing rate, and is conducive to promotion and use, while also being conducive to adapting to modern production processes. DETAILED DESCRIPTION

[0010] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0011] Example The present invention provides a high-precision circuit board laser drilling process, comprising the following steps: Step 1: Select high-quality substrate and copper cladding, and pre-treat the substrate. Pre-treatment includes cleaning and deoxidation to improve the interaction efficiency between the laser and the material. Step 2: According to the design requirements of the circuit board, determine the location and size of the holes to be drilled, complete it through CAD software, and generate a drilling data file. Fix the circuit board to be drilled on the drilling machine to ensure that the board surface is flat and without deformation; Step 3: Select a CO2 laser and optimize the beam focusing, laser power stability, and laser beam uniformity of the laser drilling equipment to ensure the stability and accuracy of the laser. Adjust the laser power, focal length, and beam diameter to ensure that the laser beam can be accurately focused on the drilling position. Use a high-precision autofocus system to ensure that the laser focus is accurately aligned with the processing surface to avoid inconsistent apertures caused by focus deviation. Use a high-precision beam control system to achieve precise control of the laser size, direction, and focus point position. Set the drilling speed, feed rate, and drilling depth of the drilling machine according to the drilling data file. Step 4: Start the laser drilling machine. The laser beam begins to irradiate the surface of the circuit board, removing material through photothermal ablation to form a hole. During the drilling process, the drilling quality is monitored in real time, including the hole size and whether the hole shape is deformed. Step 5: After drilling is completed, clean the residue and carbide on the hole wall, complete the cleaning by mechanical grinding, electroplate the hole to enhance the conductivity and solderability of the hole wall, and perform quality inspection on the PCB after drilling, including hole size, hole position accuracy and hole wall quality, to ensure that the drilling quality meets the design requirements; Step 6: Use high-precision measuring tools to regularly calibrate the equipment to ensure aperture accuracy and consistency. Perform aperture measurement and statistical analysis on the processed circuit boards to detect and correct deviations in a timely manner.

[0012] The substrate in step 1 is set to be a FR-4 board.

[0013] The high-precision autofocus system in step three is set as a high-precision version of the X-ray automatic alignment system.

[0014] The high-precision beam control system in step three is configured to use an ultraviolet laser and a composite beam positioning architecture in conjunction with an automatic visual calibration system.

[0015] The present invention first selects a high-quality substrate and copper cladding layer, and pre-treats the substrate. The pre-treatment includes cleaning and deoxidation to improve the interaction efficiency between the laser and the material. According to the design requirements of the circuit board, the position and aperture size of the hole to be drilled are determined, and the hole is completed through CAD software. A drilling data file is generated, and the circuit board to be drilled is fixed on the drilling machine to ensure that the board surface is flat and without deformation. A CO2 laser is selected to optimize the beam focusing, laser power stability, and laser beam uniformity of the laser drilling equipment to ensure the stability and accuracy of the laser. The power, focal length and beam diameter of the laser are adjusted to ensure that the laser beam can be accurately focused on the drilling position. A high-precision autofocus system is used to ensure that the laser focus is accurately aligned with the processing surface to avoid inconsistent apertures caused by focus deviation. A high-precision beam control system is used to achieve fine control of the size, direction and focal point position of the laser. The drilling machine is set to drill according to the drilling data file. Speed, feed rate, drilling depth, start the laser drilling machine, the laser beam begins to irradiate the surface of the circuit board, and removes material by photothermal ablation to form a hole. During the drilling process, the drilling quality is monitored in real time, including monitoring the aperture size and whether the hole shape is deformed. After drilling is completed, the residue and carbide on the hole wall are cleaned and the cleaning is completed by mechanical grinding. The hole is electroplated to enhance the conductivity and solderability of the hole wall. The circuit board after drilling is quality checked, including the aperture size, hole position accuracy and hole wall quality to ensure that the drilling quality meets the design requirements. High-precision measuring tools are used to calibrate the equipment regularly to ensure aperture accuracy and consistency. The aperture of the processed circuit board is measured and statistically analyzed to detect and correct deviations in time. The present invention can achieve high-precision laser drilling processing, ensure the quality of circuit board drilling processing, significantly reduce the defective processing rate, and is conducive to promotion and use, while also being conducive to adapting to modern production processes.

[0016] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-precision circuit board laser drilling process, characterized in that: The following steps are involved: Step 1: Select high-quality substrate and copper cladding, and pre-treat the substrate. Pre-treatment includes cleaning and deoxidation to improve the interaction efficiency between the laser and the material. Step 2: According to the design requirements of the circuit board, determine the location and size of the holes to be drilled, complete it through CAD software, and generate a drilling data file. Fix the circuit board to be drilled on the drilling machine to ensure that the board surface is flat and without deformation; Step 3: Select a CO2 laser and optimize the beam focusing, laser power stability, and laser beam uniformity of the laser drilling equipment to ensure the stability and accuracy of the laser. Adjust the laser power, focal length, and beam diameter to ensure that the laser beam can be accurately focused on the drilling position. Use a high-precision autofocus system to ensure that the laser focus is accurately aligned with the processing surface to avoid inconsistent apertures caused by focus deviation. Use a high-precision beam control system to achieve precise control of the laser size, direction, and focus point position. Set the drilling speed, feed rate, and drilling depth of the drilling machine according to the drilling data file. Step 4: Start the laser drilling machine. The laser beam begins to irradiate the surface of the circuit board, removing material through photothermal ablation to form a hole. During the drilling process, the drilling quality is monitored in real time, including the hole size and whether the hole shape is deformed. Step 5: After drilling is completed, clean the residue and carbide on the hole wall, complete the cleaning by mechanical grinding, electroplate the hole to enhance the conductivity and solderability of the hole wall, and perform quality inspection on the PCB after drilling, including hole size, hole position accuracy and hole wall quality, to ensure that the drilling quality meets the design requirements; Step 6: Use high-precision measuring tools to regularly calibrate the equipment to ensure aperture accuracy and consistency. Perform aperture measurement and statistical analysis on the processed circuit boards to detect and correct deviations in a timely manner.

2. A high-precision circuit board laser drilling process according to claim 1, characterized in that: The substrate in step 1 is set to be a FR-4 board.

3. The high-precision circuit board laser drilling process according to claim 1, characterized in that: The high-precision autofocus system in step three is set as a high-precision version of the X-ray automatic alignment system.

4. The high-precision circuit board laser drilling process according to claim 1, characterized in that: The high-precision beam control system in step three is configured to use an ultraviolet laser and a composite beam positioning architecture in conjunction with an automatic visual calibration system.