Wafer visual material sweeping system and material sweeping method

Abstract

The invention relates to a visual wafer scanning system and method, and the system comprises a fixed platform and a camera. The fixing platform is used for fixing a wafer clamping plug; the camera is movably arranged on the fixed platform, and the camera can shoot wafer slots in different areas in the wafer clamping plug when moving to different positions, so that all the wafer slots in the wafer clamping plug are shot in different images respectively. According to the visual wafer scanning system, full-automatic and high-precision detection of wafer arrangement in a wafer clamping plug is realized through an innovative mobile shooting and image splicing technology in combination with an intelligent image recognition algorithm. The device overcomes the limitation of the existing photoelectric sensor and fixed visual angle visual detection, can identify tiny anomalies such as wafer lamination, dislocation and the like, and remarkably improves the reliability and the automation level of the production process.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection, and in particular to a wafer visual scanning system and a scanning method. Background Art

[0002] Wafer pods (also known as wafer pods or wafer boats) are standard containers used to store and transport wafers in semiconductor manufacturing. To ensure the safety and integrity of wafers during transport, the placement of the wafers within the pod must be inspected, a process known as "scanning." Existing technology typically uses fixed-angle vision systems for this inspection.

[0003] The fixed-angle visual system inspection is specifically as follows: using an industrial camera fixedly installed at a specific angle to perform visual inspection on the side of the wafer plug. The camera usually cooperates with a light source to illuminate the edge of the wafer, and by photographing the side profile of the entire wafer plug, it can determine whether there is a wafer in each wafer slot and whether the wafer position is abnormal. Compared with photoelectric sensors, visual systems can obtain richer image information and have the potential to identify problems such as stacking and wafer tilt. However, due to the limitations of the camera lens's field of view and resolution, a single fixed-angle camera is difficult to cover the full height of a standard 300mm wafer plug. In actual applications, when the plug height is large (for example, a standard plug that accommodates 300mm wafers is usually taller), a camera fixed in a certain position cannot simultaneously see all the wafer slots at the top and bottom in a single image. How to solve this problem has become a technical problem that needs to be solved in this field. Summary of the Invention

[0004] In view of this, the present invention provides a wafer visual scanning system and scanning method, which can solve the technical problem in the prior art that when the wafer jam capacity is large or the height exceeds the field of view of the camera lens, a single fixed-angle camera is difficult to cover all wafer slots in the wafer jam.

[0005] To achieve the above objectives, the present invention mainly provides the following technical solutions: An embodiment of the present invention provides a wafer visual scanning system, which includes a fixed platform and a camera; The fixed platform is used to fix the wafer plug; The camera can be movably arranged on the fixed platform, and the camera can move to different positions to take pictures of wafer slots in different areas of the wafer plug, so as to capture all wafer slots in the wafer plug in different images.

[0006] In some embodiments, the camera is configured to move along an arrangement direction of the wafer slots in the wafer plug, and images captured by the camera at two adjacent positions have overlapping areas.

[0007] In some embodiments, the wafer vision scanning system further includes a driving mechanism, and the camera is driven to move by the driving mechanism.

[0008] In some embodiments, the wafer visual scanning system further includes an image stitching module, which is configured to stitch images captured by the camera at different positions to form a panoramic stitching image; The panoramic stitching image includes all wafer slots in the wafer plug, and the arrangement order of the wafer slots in the panoramic stitching image is consistent with the actual arrangement order of the wafer slots in the wafer plug.

[0009] In some embodiments, when the images captured by the camera at two adjacent positions have an overlapping area, the image stitching module further utilizes the wafer edge features in the overlapping area to align and correct the images captured by the camera at the two adjacent positions when stitching the images.

[0010] In some embodiments, the wafer vision scanning system further includes a recognition module, which is used to identify the wafer status of each wafer slot in the panoramic stitching image.

[0011] In some embodiments, the identification module includes: An image processing module, configured to pre-process the panoramic stitching image to highlight edge contours of wafers in each wafer slot in the panoramic stitching image; An edge detection module is used to extract the edge contour of the wafer in each slot in the panoramic stitching image; A feature judgment module is used to identify the status of the wafer in each wafer slot according to the edge contour of the wafer in each wafer slot; The result output module is used to output the judgment result of the wafer status in each wafer slot.

[0012] The present invention also provides a scanning method of the above-mentioned wafer visual scanning system, which is characterized by comprising the following steps: Step S1: the camera moves to different positions to take pictures of wafer slots in different areas of the wafer plug, so that all wafer slots in the wafer plug are captured in different images; Step S2: stitching the images captured by the camera at different positions to form a panoramic stitching image; wherein the panoramic stitching image includes all wafer slots in the wafer plug, and the arrangement order of the wafer slots in the panoramic stitching image is consistent with the actual arrangement order of the wafer slots in the wafer plug; Step S3: pre-processing the panoramic stitching image to highlight the edge contour of the wafer in each wafer slot in the panoramic stitching image; Step S4: extracting the wafer edge contour in each wafer slot in the panoramic stitching image; Step S5: judging the status of the wafers in each wafer slot according to the wafer edge profile in each wafer slot; Step S6: outputting the determination result of the wafer status in each wafer slot.

[0013] In some embodiments, in step S1, the camera is used to move along the arrangement direction of each wafer slot in the wafer plug; and in step S2, the panoramic stitching image is formed by stitching the images taken by the camera at each two adjacent positions in sequence.

[0014] In some embodiments, in step S2, the images captured by the camera at two adjacent positions are sequentially stitched together using formula (1) to form the panoramic stitched image; wherein formula (1) is: .

[0015] By means of the above technical solution, the wafer vision scanning system and scanning method of the present invention have at least the following beneficial effects: 1. Since the camera is movable, when the wafer jammer capacity is large or the height exceeds the field of view of a single lens, the camera can be moved to different positions to take pictures of wafer slots in different areas of the wafer jammer, so that all wafer slots in the wafer jammer can be photographed in different images. Then, the images taken by the camera at different positions can be stitched together by an algorithm to form a panoramic stitched image, which includes all wafer slots in the wafer jammer. This solves the technical problem in the prior art that when the wafer jammer capacity is large or the height exceeds the field of view of the camera lens, a single fixed-angle camera is difficult to cover all wafer slots in the wafer jammer.

[0016] 2. The wafer visual scanning system of this invention utilizes innovative mobile capture and image stitching technology, combined with intelligent image recognition algorithms, to achieve fully automatic, high-precision detection of wafer alignment within a wafer jam. This overcomes the limitations of existing photoelectric sensors and fixed-viewing angle visual inspection, enabling identification of subtle anomalies such as wafer overlap and misalignment, significantly improving the reliability and automation level of the production process. This technical solution has broad application prospects in the semiconductor manufacturing sector and can be used for automated inventory and safety checks during wafer transport, ensuring the safety and efficiency of wafer transport.

[0017] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0019] Figure 1 1 is a schematic structural diagram of a wafer visual scanning system provided by one embodiment of the present invention;

[0020] Figure 2 This is a flow chart of a wafer visual scanning method provided by one embodiment of the present invention.

[0021] Reference numerals: 1. fixed platform; 2. camera; 3. motor; 10. wafer plug; 101. wafer slot. DETAILED DESCRIPTION

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0023] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0024] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0025] like Figure 1As shown, an embodiment of the present invention provides a wafer visual scanning system, which includes a fixed platform 1 and a camera 2. The fixed platform 1 is used to fix the wafer plug 10. The camera 2 is movably arranged on the fixed platform 1. The camera 2 can move to different positions to take pictures of wafer slots 101 in different areas of the wafer plug 10, so that all wafer slots 101 in the wafer plug 10 are captured in different images.

[0026] In the above example, since the camera 2 is movable, when the capacity of the wafer plug 10 is large or the height exceeds the field of view of a single lens, the wafer slots 101 in different areas of the wafer plug 10 can be photographed by moving the camera 2 to different positions, so that all the wafer slots 101 in the wafer plug 10 can be photographed in different images respectively, and then the images taken by the camera 2 at different positions can be stitched together by an algorithm to form a panoramic stitched image, which includes all the wafer slots 101 in the wafer plug 10. This solves the technical problem in the prior art that when the capacity of the wafer plug 10 is large or the height exceeds the field of view of the camera lens, a single fixed-angle camera is difficult to cover all the wafer slots 101 in the wafer plug 10.

[0027] The camera 2 may be a high-resolution industrial camera.

[0028] The aforementioned wafer visual scanning system can also include a backlight. A uniform backlight is provided behind the wafer jammer 10, creating a clear contrast of the wafer edge outline within the field of view of the camera 2. Backlighting enhances the clarity of the wafer edge outline in the image, facilitating subsequent image processing algorithms to extract edge contour features. The backlight brightness is adjustable to accommodate wafers of varying materials or thicknesses, achieving optimal imaging results.

[0029] In some embodiments, the aforementioned camera 2 is used to move along the arrangement direction of the wafer slots 101 in the wafer plug 10 , and the images captured by the camera 2 at two adjacent positions have overlapping areas.

[0030] In the above example, since the images taken by camera 2 at two adjacent positions have overlapping areas, the wafer edge features in the overlapping areas can be used to align and correct the images taken by camera 2 at two adjacent positions when stitching the images later, so as to improve the accuracy of stitching.

[0031] In some implementations, the aforementioned wafer vision scanning system further includes a driving mechanism, and the camera 2 is driven to move by the driving mechanism, which can save manpower and facilitate automatic control.

[0032] like Figure 1 As shown, the driving mechanism may include a motor 3 to drive the camera 2 to move via the motor 3. The motor 3 may be a precision servo motor.

[0033] The aforementioned wafer vision scanning system may further include a guide mechanism for guiding the movement of the camera 2 to improve the movement accuracy of the camera 2. The guide mechanism may include a guide rail to guide the movement of the camera 2 through the guide rail.

[0034] In the above example, a precision servo motor 3 can be used to drive the camera 2 to perform vertical linear motion along the guide rail. The wafer visual scanning system can also include a position feedback device to ensure that the camera 2 moves to a predetermined position for image acquisition. Through a pre-set motion trajectory, the motor 3 can drive the camera 2 to scan and photograph the wafer slots 101 in different areas of the wafer plug 10 in turn. In a specific application example, the motor 3 can drive the camera 2 to scan and photograph the wafer slots in the upper half and the wafer slots in the lower half of the wafer plug 10 in turn.

[0035] In some embodiments, the aforementioned wafer visual scanning system may further include an image stitching module. The image stitching module is used to stitch images captured by the camera 2 at different positions to form a panoramic stitching image. The panoramic stitching image includes all wafer slots 101 in the wafer plug 10, and the arrangement order of the wafer slots 101 in the panoramic stitching image is consistent with the actual arrangement order of the wafer slots 101 in the wafer plug 10.

[0036] In the above example, the images taken by the camera 2 are stitched into a panoramic stitched image through the image stitching module, which is conducive to the subsequent processing of the panoramic stitched image through an algorithm to identify whether each wafer slot 101 in the panoramic stitched image has a single wafer.

[0037] Among them, when the images taken by camera 2 at two adjacent positions have overlapping areas, the image stitching module also uses the wafer edge features of the overlapping area to align and correct the images taken by camera 2 at two adjacent positions when stitching the images to improve the accuracy of stitching.

[0038] In some embodiments, the aforementioned wafer vision scanning system further includes a recognition module, which is used to identify the wafer status of each wafer slot 101 in the panoramic stitching image.

[0039] In the above example, automatic recognition can be achieved through the set recognition module, thereby improving recognition efficiency.

[0040] In order to realize the functions of the aforementioned recognition module, in some embodiments, the aforementioned recognition module may include an image processing module, an edge detection module, a feature judgment module and a result output module.

[0041] The image processing module is used to preprocess the panoramic stitching image to highlight the edge contours of the wafers in each wafer slot 101 within the panoramic stitching image. This preprocessing includes grayscale adjustment and filtering to remove noise. The aforementioned camera 2 can utilize backlit imaging. Due to backlit imaging, the wafer edges appear as dark arcs corresponding to the positions of each wafer slot 101.

[0042] The edge detection module is used to extract the wafer edge contours within each slot in the panoramic stitching image. Threshold segmentation can be used to extract all possible wafer edge contour curves in the panoramic stitching image. Combined with the known spacing between wafer slots 101 within wafer plug 10, the detected wafer edge contours can be grouped by height to preliminarily determine the position range of each wafer slot 101.

[0043] The feature determination module is used to identify the state of the wafer in each wafer slot 101 based on the wafer edge contour in each wafer slot 101. Specifically, for each wafer slot 101 image area, the shape features of the wafer edge contour are further analyzed to determine the state of the wafer in the wafer slot 101. If a clear wafer edge contour curve is detected in a wafer slot 101 area, it is determined that a wafer is correctly placed in the wafer slot 101; if two adjacent wafer edge contour curves are detected in a wafer slot 101 area, and the height interval between the two adjacent wafer edge contour curves is significantly smaller than the normal wafer slot 101 distance, it can be determined that two wafers may be stacked in the same wafer slot 101 (stacked); if a wafer slot 101 should have a wafer but the corresponding wafer edge contour curve is not detected, it is determined that the wafer in the wafer slot 101 is missing; if the wafer edge contour curve is significantly offset or tilted relative to the standard wafer slot 101 position, it is determined that the wafer in the wafer slot 101 is misplaced or tilted.

[0044] The result output module is used to output the results of the wafer status determination in each wafer slot 101. The result output module summarizes and analyzes the status of the wafers in each wafer slot 101 and generates an inspection report. The report includes the total number of wafers, whether each wafer slot 101 contains a wafer, and any abnormalities such as overlap or misalignment. If an abnormality is detected, the wafer visual scanning system can issue a warning signal or transmit the information to the upper control system for timely processing.

[0045] It should be noted that each of the aforementioned modules can be integrated into a host computer. This host computer can serve as the main control computer, connected to camera 2 and motor 3, and responsible for overall system control and data processing. The host computer controls the movement and positioning of motor 3 via the motion control module, acquires images through the camera 2 interface, and runs image stitching and recognition algorithms. The host computer also manages communication with external devices or the production line, outputting inspection results for subsequent use.

[0046] The present invention also provides a scanning method of the above-mentioned wafer visual scanning system, which comprises the following steps:

[0047] Step S1: The camera 2 moves to different positions to take pictures of the wafer slots 101 in different areas of the wafer plug 10, so that all the wafer slots 101 in the wafer plug 10 are captured in different images.

[0048] Step S2: stitching the images captured by the camera 2 at different positions to form a panoramic stitching image. The panoramic stitching image includes all wafer slots 101 in the wafer plug 10, and the arrangement order of the wafer slots 101 in the panoramic stitching image is consistent with the actual arrangement order of the wafer slots 101 in the wafer plug 10.

[0049] Step S3: pre-processing the panoramic stitching image to highlight the edge contours of the wafers in each wafer slot 101 in the panoramic stitching image.

[0050] Step S4: extracting the wafer edge contour in each wafer slot 101 in the panoramic stitching image.

[0051] Step S5: judging the state of the wafer in each wafer slot 101 according to the edge profile of the wafer in each wafer slot 101;

[0052] Step S6: outputting the determination result of the wafer status in each wafer slot 101 .

[0053] In order to facilitate the stitching of the images taken by camera 2 into a panoramic stitched image, in step S1, camera 2 is used to move along the arrangement direction of each wafer slot 101 in the wafer plug 10; and in step S2, a panoramic stitched image is formed by stitching the images taken by camera 2 at each two adjacent positions in sequence, so that it is convenient to stitch the images into a complete panoramic image, and prevent the order of the wafer slots 101 from being disordered in the stitched image.

[0054] In some embodiments, in the aforementioned step S2, the images captured by the camera 2 at two adjacent positions can be sequentially stitched together using formula (1) to form a panoramic stitched image. Formula (1) is: .

[0055] In the above example, by introducing the weight coefficient, the importance of the wafer slots 101 in different areas can be adjusted to adapt to actual working conditions.

[0056] Where I1 and I2 are images of adjacent shooting areas. Assume that the shooting position difference of camera 2 at each position can be expressed as a translation matrix T, and the distortion correction is performed through the distortion model.

[0057] In a specific application example, the camera 2 only moves to two different positions to take pictures of the wafer slots 101 in different areas of the wafer plug 10, so that all the wafer slots 101 in the wafer plug 10 are photographed in different images. For example, when the camera 2 is used to move to the first position, it takes pictures of the wafer slots 101 in the lower half of the wafer plug 10 to obtain a first image. When the camera 2 is used to move to the second position, it takes pictures of the wafer slots 101 in the upper half of the wafer plug 10 to obtain a second image. All the wafer slots 101 in the wafer plug 10 are photographed in the first image and the second image respectively. The aforementioned image stitching module is used to stitch the first image and the second image into the aforementioned panoramic stitching image.

[0058] The wafer visual scanning system of the present invention can achieve the following functions: 1. Dynamic Video Capture and Seamless Stitching: Camera 2, driven by motor 3, performs mobile capture. Driven by motor 3, camera 2 moves along the height of the wafer plug 10, capturing segmented images of the upper and lower portions of the wafer plug 10. An algorithm seamlessly stitches these two images together to form a complete side view of the wafer plug. Compared to fixed-angle capture, this solution covers the entire height of the wafer plug, eliminating blind spots, improving detection range and image resolution. Seamless stitching ensures consistent image quality across the entire final image, facilitating subsequent analysis.

[0059] 2. Intelligent Image Recognition Algorithm: Advanced image processing and pattern recognition algorithms are used to analyze the stitched panoramic images. The algorithm automatically identifies the status of each wafer slot 101 within the panoramic stitched image, including determining whether a wafer is present in slot 101, the number of wafers (to prevent stacking of two wafers per slot), and whether the wafer position deviates from the normal slot (to detect misalignment or tilt). By extracting and comparing wafer edge contour features, the system can accurately distinguish between normal single wafers, stacked wafers, and skewed wafers, significantly improving the comprehensiveness and accuracy of detection.

[0060] 3. Higher Automation and Efficiency: Thanks to the motor 3-driven camera 2 movement and software-automated analysis, the system of the present invention can perform comprehensive scanning inspections of wafer jams 10 without human intervention. The camera 2 movement and image acquisition process are automatically controlled by a program; stitching and recognition algorithms process images in real time, rapidly delivering inspection results. Compared to traditional methods that require manual adjustments or multiple operations, this system reduces the number of manual steps, significantly improving inspection efficiency and better adapting to production line cycle times. Furthermore, the automated inspection process reduces the potential for human error and improves the consistency and reliability of results.

[0061] The above three functions complement each other, enabling the present invention to effectively overcome the limitations of the prior art and achieve all-round, high-precision automatic detection of the wafers in the wafer plug 10.

[0062] The working process of the wafer visual scanning system of the present invention is as follows: At the beginning of the inspection, the host computer controls the motor 3 to move the camera 2 to the initial position at the bottom of the wafer plug 10 for the first photo. Then the camera 2 is moved upward according to the pre-set height step. After reaching the specified position, the camera 2 is triggered to take a second photo to obtain a local wafer edge image of the wafer plug 10 at this position. Since the field of view of the camera 2 is limited and distorted, each photo can only cover a part of the height of the plug. Therefore, two shots are taken to ensure that the entire wafer plug 10 is covered from bottom to top. In order to achieve seamless splicing of images, the fields of view of adjacent shooting positions will partially overlap, which makes it convenient to find the correspondence between the overlapping areas through image processing. After obtaining all the images, the host computer uses a stitching algorithm to synthesize these local images into a complete panoramic stitching image, namely the side view of the plug. During the stitching process, the wafer edge features of the overlapping area are used for alignment correction to eliminate the slight deviation caused by the movement of the camera 2 viewing angle, ensuring that the stitched panoramic image accurately reflects the positional relationship of each wafer. The final panoramic stitched image covers all wafer slots 101 in the wafer plug 10, thereby presenting a complete picture of the wafer arrangement.

[0063] Among them, the entire detection process is automatically performed by the system. The operator only needs to place the wafer plug 10 containing the wafer at a designated position on the fixed platform 1. After starting the detection program, the system will complete the scanning and identification according to the set process without human intervention. In terms of design, the moving speed of the motor 3 and the shooting speed of the camera 2 have been optimized, and the scanning of the entire wafer plug 10 can be completed in a short time. The image processing algorithm has also been optimized, and splicing and analysis can be completed in real time or quasi-real time. When the detection is completed, the host computer outputs the results and sends them to the manufacturing execution system. Through this automated process, the system of the present invention can greatly improve the efficiency of the wafer plug 10 material scanning detection, making it adaptable to the batch and fast-paced semiconductor production environment.

[0064] In summary, the wafer visual scanning system of the present invention realizes fully automatic and high-precision detection of the wafer arrangement inside the wafer plug 10 through innovative mobile shooting and image stitching technology, combined with intelligent image recognition algorithms. It overcomes the limitations of existing photoelectric sensors and fixed-angle visual detection, can identify subtle anomalies such as wafer stacking and misalignment, and significantly improves the reliability and automation level of the production process. In the field of semiconductor manufacturing, this technical solution has broad application prospects and can be used for automatic inventory and safety inspection during wafer transmission to ensure the safety and efficiency of wafer transmission.

[0065] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A wafer visual scanning system, characterized in that: It includes a fixed platform (1) and a camera (2); The fixed platform (1) is used to fix the wafer plug (10); The camera (2) is movably arranged on the fixed platform (1), and the camera (2) can move to different positions to take pictures of wafer slots (101) in different areas within the wafer plug (10), so as to capture all wafer slots (101) in the wafer plug (10) in different images.

2. The wafer visual scanning system according to claim 1, wherein: The camera (2) is used to move along the arrangement direction of each wafer slot (101) in the wafer plug (10), and the images captured by the camera (2) at two adjacent positions have overlapping areas.

3. The wafer visual scanning system according to claim 1 or 2, characterized in that: It also includes a driving mechanism, and the camera (2) is driven to move by the driving mechanism.

4. The wafer visual scanning system according to claim 1 or 2, characterized in that: It also includes an image stitching module, which is used to stitch images taken by the camera (2) at different positions to form a panoramic stitching image; The panoramic stitching image includes all wafer slots (101) in the wafer plug (10), and the arrangement order of the wafer slots (101) in the panoramic stitching image is consistent with the actual arrangement order of the wafer slots (101) in the wafer plug (10).

5. The wafer visual scanning system according to claim 4, characterized in that: When the images captured by the camera (2) at two adjacent positions have overlapping areas, the image stitching module also uses the wafer edge features in the overlapping areas to align and correct the images captured by the camera (2) at the two adjacent positions when stitching the images.

6. The wafer visual scanning system according to claim 4, wherein: It also includes an identification module, which is used to identify the wafer status of each wafer slot (101) in the panoramic stitching image.

7. The wafer visual scanning system according to claim 6, characterized in that: The identification module includes: An image processing module is used to pre-process the panoramic stitching image to highlight the edge contour of the wafer in each wafer slot (101) in the panoramic stitching image; An edge detection module is used to extract the edge contour of the wafer in each slot in the panoramic stitching image; A feature judgment module is used to identify the state of the wafer in each wafer slot (101) based on the edge contour of the wafer in each wafer slot (101); The result output module is used to output the judgment result of the wafer status in each wafer slot (101).

8. A scanning method of the wafer vision scanning system according to claim 7, characterized in that: The following steps are involved: Step S1: the camera (2) moves to different positions to take pictures of wafer slots (101) in different areas of the wafer plug (10), so that all wafer slots (101) in the wafer plug (10) are captured in different images; Step S2: stitching images captured by the camera (2) at different positions to form a panoramic stitching image; wherein the panoramic stitching image includes all wafer slots (101) in the wafer plug (10), and the arrangement order of the wafer slots (101) in the panoramic stitching image is consistent with the actual arrangement order of the wafer slots (101) in the wafer plug (10); Step S3: pre-processing the panoramic stitching image to highlight the edge contours of the wafers in each wafer slot (101) in the panoramic stitching image; Step S4: extracting the wafer edge contour in each wafer slot (101) in the panoramic stitching image; Step S5: judging the state of the wafer in each wafer slot (101) according to the wafer edge profile in each wafer slot (101); Step S6: outputting the determination result of the wafer status in each wafer slot (101).

9. The material sweeping method according to claim 8, characterized in that: In step S1, the camera (2) is used to move along the arrangement direction of each wafer slot (101) in the wafer plug (10); and in step S2, the panoramic stitching image is formed by stitching the images taken by the camera (2) at each two adjacent positions in sequence.

10. The material sweeping method according to claim 9, characterized in that: In step S2, the images captured by the camera (2) at two adjacent positions are sequentially stitched together using formula (1) to form the panoramic stitched image; wherein formula (1) is: Wherein, α is the weight coefficient of the images taken by the camera (2) at two adjacent positions, and α is greater than 0 and less than 1; (x, y) is the pixel coordinate in the image; Δx and Δy are the translation deviations between the images taken by the camera (2) at two adjacent positions; I1 (x, y) and I2 (x+Δx, y+Δy) are the images taken by the camera (2) at two adjacent positions respectively; I final (x, y) is an image obtained by stitching images taken by the camera (2) at two adjacent positions.

Images