Transfer mechanism for circuit board core burying, positioning and glue injection and core burying, positioning and glue injection device
By designing a transfer mechanism for core embedding positioning and glue injection on circuit boards, continuous glue injection on circuit boards is achieved, which solves the problems of complicated operation and low efficiency in the existing technology and improves the quality and efficiency of glue injection.
Patent Information
- Application Number
- CN202511148918.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-18
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2045-08-18
AI Technical Summary
The existing circuit board glue injection device is cumbersome to operate and has complicated processes, which increases the difficulty of operation and human errors, affecting the quality and efficiency of glue injection.
A transfer mechanism for positioning and injecting glue on embedded cores of circuit boards is designed, which includes a workbench, a support bracket, a transmission assembly and a drive assembly. The transmission assembly slides back and forth on the workbench to achieve alternating sliding of the material plates at both ends of the support bracket, and the lifting assembly is combined to perform loading and unloading and glue injection operations.
It realizes continuous glue injection of circuit boards, improves the glue injection quality and production efficiency, and reduces the need for manual operation.
Smart Images

Figure CN120714867A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of circuit board process equipment, and in particular to a transfer mechanism and a core embedding positioning and glue injection device for circuit board core embedding positioning and glue injection. Background Art
[0002] In the field of circuit board processing, glue injection is a key link to ensure the performance and life of the circuit board. Its role is to provide reliable protection for the circuit board.
[0003] However, in the existing circuit board glue injection device, the operation of the device is relatively cumbersome, the process is relatively complicated, and the operator's skills are also required to be high, which not only increases the difficulty of operation, but also makes human errors prone to occur, thus greatly affecting the quality of glue injection and glue injection production efficiency. Summary of the Invention
[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a transfer mechanism for core embedding positioning and glue injection of a circuit board, which can continuously load and inject glue on the circuit board, thereby improving the glue injection quality and efficiency of the circuit board.
[0005] The present invention also provides a core embedding positioning and glue injection device having the above-mentioned transfer mechanism for circuit board core embedding positioning and glue injection.
[0006] According to the first embodiment of the present invention, the transfer mechanism for positioning and injecting glue for a circuit board embedded core comprises: A workbench, wherein the workbench has a glue injection station; A support bracket, the support bracket is reciprocatingly slidably disposed on the workbench, and both ends of the support bracket are configured to place material plates, and the material plates are configured to carry circuit boards; a transmission assembly, the transmission assembly being slidably disposed on the workbench, the support bracket being disposed on the transmission assembly, and the transmission assembly being configured to drive the support bracket to slide back and forth on the workbench; and A driving assembly is provided on the workbench, and the driving assembly is configured to drive the transmission assembly to slide back and forth on the workbench so that the two ends of the supporting bracket slide alternately to the glue injection station.
[0007] The transfer mechanism for positioning and injecting glue for embedded cores on circuit boards according to the first embodiment of the present invention has at least the following beneficial effects: the support bracket slides back and forth on the workbench via the transmission assembly, causing the material boards at both ends of the support bracket to slide alternately onto the injection station, thereby enabling continuous injection of glue onto the circuit boards. Simultaneously, during the injection process, the circuit boards on the material boards that have slid out of the injection station can be loaded and unloaded, thereby improving injection production efficiency.
[0008] According to some embodiments of the present invention, the driving assembly includes a driving block, which can rotate and slide on the workbench. The transmission assembly includes a slide and a first clamping block. The slide is slidably arranged on the workbench, and the two sides of the support bracket are respectively arranged on the slide. There are two first clamping blocks, and the first clamping blocks are respectively rotatably arranged at the two ends of the slide. The driving block can be clamped to the first clamping block in sequence, and the driving block is configured to clamp to the first clamping block in sequence so that the first clamping block drives the slide to slide back and forth on the workbench.
[0009] According to some embodiments of the present invention, a rotating shaft is provided on the slide, and the rotating shaft can be rotatably passed through the slide, and the first clamping block can be rotatably provided on the slide through one end of the rotating shaft, and the first clamping block has a clamping portion, and the clamping portion and the driving block are clamped with each other, and a second clamping block is provided at the other end of the rotating shaft, and the second clamping block is rotatable, and the second clamping block is configured to drive the first clamping block to rotate so that the guide inclined surface of the first clamping block is disengaged from the clamping of the driving block.
[0010] According to some embodiments of the present invention, the transmission assembly further includes two unlocking members, which are arranged relative to each other on the workbench, and the positions of the two unlocking members are respectively arranged to correspond one-to-one with the positions of the second clamping block. The unlocking end of the unlocking member can be pressed against the guide inclined surface of the second clamping block, and the unlocking member is configured to drive the second clamping block to rotate so as to rotate the first clamping block.
[0011] According to some embodiments of the present invention, the unlocking member can be arranged on the workbench in an adjustable manner so as to adjust the unlocking position of the unlocking end of the unlocking member.
[0012] According to some embodiments of the present invention, first limit rods are respectively provided at both ends of the slide seat, and the positions of the two first limit rods correspond to the positions of the first clamping block. The first clamping block has a second limit rod, and the second limit rod can be clamped between the first limit rods. The first limit rod is configured to limit the rotation range of the first clamping block.
[0013] According to some embodiments of the present invention, the drive assembly includes two sprockets and a chain, the two sprockets are spaced apart, the chain can be wound around the two sprockets, the drive block is arranged on the chain, and the sprocket is configured to drive the chain transmission so that the chain drives the drive block to rotate and slide on the workbench.
[0014] According to some embodiments of the present invention, a jacking assembly is further included, which is arranged on the workbench and located below the glue injection station. The jacking assembly includes a jacking seat, which is liftably arranged on the workbench and located on the glue injection station. The jacking seat is configured to lift the material plate.
[0015] According to some embodiments of the present invention, the jacking assembly includes two groups of lever members, which are respectively arranged on the workbench and located on both sides of the supporting bracket. One end of the two groups of lever members is respectively hinged to the lower end of the jacking seat, and the other end of the two groups of lever members can be raised and lowered on both sides of the injection station. A driving inclined plane is provided on one side of both ends of the supporting bracket, and the driving inclined plane is configured to drive the other end of the lever member to descend so that one end of the lever member lifts the jacking seat upward.
[0016] A circuit board embedded core positioning and glue injection device according to a second embodiment of the present invention comprises a glue injection mechanism and a transfer mechanism for circuit board embedded core positioning and glue injection according to any one of the first embodiments. The glue injection mechanism is located above the glue injection station and is configured to inject glue into the circuit board.
[0017] The circuit board embedded core positioning and glue injection device according to the second embodiment of the present invention has at least the following beneficial effects: This circuit board embedded core positioning and glue injection device has all the beneficial effects provided by the aforementioned circuit board transfer mechanism, which will not be repeated here. Furthermore, the glue injection mechanism can replace manual operation, thereby improving the quality and production efficiency of glue injection.
[0018] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which: Figure 1 This is a structural diagram of a circuit board core embedding positioning and glue injection device according to an embodiment of the second aspect of the present invention; Figure 2 for Figure 1 A schematic diagram of a portion of the structure of a circuit board embedded core positioning and glue injection device is shown (the glue injection structure is omitted); Figure 3 for Figure 1 The schematic diagram of the structure of the circuit board transfer mechanism of the circuit board core embedding positioning and glue injection device is shown; Figure 4 for Figure 3 A partial structural diagram of the circuit board transfer mechanism is shown (omitting the lifting assembly, support bracket and material plate); Figure 5 for Figure 4 An enlarged schematic diagram of part A of the circuit board transfer mechanism is shown.
[0020] Figure Number: Circuit board 1; circuit board embedded core positioning glue injection transfer mechanism 2; circuit board embedded core positioning glue injection device 3; Workbench 10; Glue injection station 11; Support bracket 20; Material plate 21; Transmission assembly 30; slide 31; shaft 311; first limiting rod 312; first clamping block 32; clamping portion 321; second limiting rod 322; second clamping block 33; unlocking member 34; Drive assembly 40; drive block 41; sprocket 42; chain 43; Lifting assembly 50; lifting seat 51; lever member 52; driving inclined surface 53. DETAILED DESCRIPTION
[0021] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.
[0022] In the description of the present invention, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0023] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.
[0024] Reference Figures 1 to 3According to the first embodiment of the present invention, the transfer mechanism 2 for positioning and injecting glue for embedded cores of circuit boards comprises a workbench 10, a support bracket 20, a transmission assembly 30, and a drive assembly 40. The workbench 10 has a glue injection station 11; the support bracket 20 can be reciprocatingly slidably arranged on the workbench 10, and the two ends of the support bracket 20 are configured to place material plates 21, and the material plates 21 are configured to carry the circuit board 1; the transmission assembly 30 can be slidably arranged on the workbench 10, and the support bracket 20 is arranged on the transmission assembly 30, and the transmission assembly 30 is configured to drive the support bracket 20 to slide back and forth on the workbench 10; the drive assembly 40 is arranged on the workbench 10, and the drive assembly 40 is configured to drive the transmission assembly 30 to slide back and forth on the workbench 10, so that the two ends of the support bracket 20 slide alternately to the glue injection station 11.
[0025] It can be understood that the drive component 40 drives the transmission component 30 to slide back and forth on the workbench 10 along the left and right directions shown in the figure, so that the transmission component 30 can drive the support bracket 20 to slide back and forth on the workbench 10, and then drive the material plates 21 at both ends of the support bracket 20 to slide alternately to the glue injection station 11 on the workbench 10. Specifically, when one end of the support bracket 20 (the left end in the figure) is located on the glue injection station 11, glue injection can be performed on the circuit board 1 on the material plate 21. At this time, the material plate 21 located at the other end of the support bracket 20 (the right end in the figure) is outside the workbench 10. At this time, the circuit board 1 on the material plate 21 can be unloaded and loaded simultaneously. When the circuit board 1 on the glue injection station 11 is glued, the transmission assembly 30 can be driven to move the support bracket 20 to the left, so that the material plate 21 at the left end of the support bracket 20 slides leftward out of the glue injection station 11, and the material plate 21 at the right end of the support bracket 20 can move toward the position of the glue injection station 11. This cycle is repeated, and the glue injection work is continuously performed.
[0026] Therefore, it can be understood that the transfer mechanism 2 for positioning and injecting glue for circuit board core embedding according to the first embodiment of the present invention has at least the following beneficial effects: the support bracket 20 slides back and forth on the workbench 10 via the transmission assembly 30, so that the material plates 21 at both ends of the support bracket 20 slide alternately onto the glue injection station 11, thereby continuously injecting glue into the circuit boards 1. At the same time, during the glue injection process, the circuit boards 1 on the material plates 21 that have slid out of the glue injection station 11 can also be loaded and unloaded, thereby improving the production efficiency of glue injection.
[0027] Reference Figures 3 to 5In some embodiments of the present invention, the driving assembly 40 includes a driving block 41, which can rotate and slide on the workbench 10. The transmission assembly 30 includes a slide 31 and a first clamping block 32. The slide 31 is slidably set on the workbench 10, and the two sides of the support bracket 20 are respectively set on the slide 31. The first clamping block 32 is provided with two pieces, and the first clamping blocks 32 are respectively rotatably set at the two ends of the slide 31. The driving block 41 can be clamped in turn with the first clamping block 32. The driving block 41 is configured to clamp the first clamping block 32 in turn so that the first clamping block 32 drives the slide 31 to slide back and forth on the workbench 10.
[0028] Furthermore, the drive assembly 40 and transmission assembly 30 have been further optimized. The overall structure still relies on the workbench 10 as its support base, with the support bracket 20 used to support the material plate 21. The drive assembly 40 and transmission assembly 30 enable efficient and precise reciprocating sliding of the support bracket 20 on the workbench 10. First, the material plate 21 carrying the circuit board 1 is placed on the support bracket 20. The drive assembly 40 is activated, and the drive block 41 begins to rotate along a preset trajectory on the workbench 10. As the drive block 41 slides toward the right, until it reaches a position where it engages with a first latching block 32 on the rear side, the latching engagement between the drive block 41 and the first latching block 32 causes the drive block 41 to rotate. Since the first latching block 32 is fixedly connected to the slide 31, it drives the slide 31 to slide to the right of the slide rail (not shown) on the workbench 10. As the drive block 41 continues to slide, once it disengages from the first clamping block 32, the slide 31 stops sliding to the right. The material plate 21 on the left end of the support bracket 20 slides onto the glue injection station 11 to facilitate glue injection, while the material plate 21 on the right end of the support bracket 20 slides outside the workbench 10 to facilitate loading and unloading of the circuit board 1. After the drive block 41 disengages from the first clamping block 32, the drive assembly 40 rotates and continues along its rotation trajectory. After rotating, the drive block 41 moves toward the left until it engages with the other first clamping block 32 on the slide 31. Similarly, this engagement drives the other first clamping block 32 to move, which in turn drives the slide 31 to slide back (to the left), ultimately driving the support bracket 20 to the left. By sequentially engaging the two first clamping blocks 32 with the drive block 41, the slide 31 achieves reciprocating sliding on the workbench 10.
[0029] It should be noted that, during the process from the drive block 41 disengaging from the first first clamping block 32 to the rotation process and then engaging with the other first clamping block 32, the drive block 41 stops driving the slide 31. At this time, the support bracket 20 is in a stopped state, and the two ends of the support bracket 20 are respectively located on the glue injection station 11 and the outside of the workbench 10. Therefore, at this time, the circuit board 1 on the glue injection station 11 can be glued, and the circuit board 1 outside the workbench 10 can be unloaded first and then loaded. When these two processes are completed at the same time, the drive block 41 is just engaged with the other first clamping block 32, and the engaged first clamping block 32 can drive the slide 31 to slide back, and then drive the support bracket 20 to slide back, so that the material board 21 located outside the workbench 10 slides toward the glue injection station 11, and the material board 21 located at the glue injection station 11 slides toward the outside of the workbench 10. Since the support bracket 20 is installed on both sides of the slide 31, the reciprocating sliding of the slide 31 will drive the support bracket 20 and the material plate 21 carrying the circuit board 1 thereon to move together, so that the two ends of the support bracket 20 slide alternately to the glue injection station 11, realizing continuous glue injection production of the circuit board 1.
[0030] Reference Figures 3 to 5 In some embodiments of the present invention, a rotating shaft 311 is provided on the slide 31, and the rotating shaft 311 can be rotatably provided on the slide 31. The first clamping block 32 can be rotatably provided on the slide 31 through one end of the rotating shaft 311. The first clamping block 32 has a clamping portion 321, and the clamping portion 321 is clamped with the driving block 41. A second clamping block 33 is provided at the other end of the rotating shaft 311. The second clamping block 33 is rotatable. The second clamping block 33 is configured to drive the first clamping block 32 to rotate so that the guide inclined surface of the first clamping block 32 is disengaged from the clamping of the driving block 41.
[0031] Furthermore, in this embodiment, the structure and connection relationship of the slide 31, first clamping block 32, and second clamping block 33 have been further optimized. The overall structure still uses the workbench 10 as a support base. The support bracket 20 is used to support the material plate 21 of the circuit board 1. The drive assembly 40 is powered by the drive block 41. The slide 31, first clamping block 32, and second clamping block 33 of the transmission assembly 30 work together to achieve efficient and precise reciprocating sliding of the support bracket 20 on the workbench 10.
[0032] During operation, the material plate 21 carrying the circuit board 1 is first placed on the support bracket 20. The drive assembly 40 is activated, driving the drive block 41 to begin rotating and sliding. When the drive block 41 rotates to a position where it engages the engaging portion 321 of the first engaging block 32, the engagement between the drive block 41 and the first engaging block 32 causes the drive block 41 to synchronously slide the first engaging block 32, thereby driving the slide 31 along the slide rails on the workbench 10. To disengage the first engaging block 32 from the drive block 41, an external drive device (such as a cylinder (not shown)) is activated. The cylinder's piston rod extends, pushing the second engaging block 33 to rotate. Since the second engaging block 33 is connected to the first engaging block 32 via the rotating shaft 311, the rotation of the second engaging block 33 drives the first engaging block 32 to rotate, causing the guide bevel of the first engaging block 32 to gradually disengage from the engagement with the drive block 41. After the first engaging block 32 is completely disengaged from the driver block 41, the driver block 41 continues to slide and rotate until it engages with another first engaging block 32, again driving the slide 31 to slide. The driver block 41 sequentially engages the two first engaging blocks 32, and the second engaging block 33 disengages the first engaging blocks 32, thereby enabling the slide 31 to slide back and forth on the workbench 10. Because the support bracket 20 is mounted on both sides of the slide 31, the reciprocating movement of the slide 31 moves the support bracket 20 and the material plate 21 supporting the circuit board 1 thereon, causing the two ends of the support bracket 20 to slide alternately onto the glue injection station 11, enabling continuous glue injection production of the circuit boards 1.
[0033] Reference Figures 3 to 5 In some embodiments of the present invention, the transmission assembly 30 further includes two unlocking members 34, which are arranged relative to each other on the workbench 10. The positions of the two unlocking members 34 correspond to the positions of the second clamping block 33 respectively. The unlocking end of the unlocking member 34 can be pressed against the guide inclined surface of the second clamping block 33. The unlocking member 34 is configured to drive the second clamping block 33 to rotate so as to rotate the first clamping block 32.
[0034] Furthermore, in order to facilitate the first clamping block 32 to be disengaged from the driving block 41 , an unlocking member 34 is added to the transmission assembly 30 to drive the second clamping block 33 and thereby control the rotation of the first clamping block 32 .
[0035] Two unlocking members 34 are positioned opposite each other on the workbench 10, namely, on the left and right sides of the workbench 10, one in front of the other, and corresponding to the positions of the two second clamping blocks 33 on the slide 31. One end of the unlocking member 34 is fixed, secured to a pre-set mounting base (not shown) on the workbench 10 via bolts or other fasteners. The other end is an unlocking end, which is shaped like a sphere or arc, and is capable of abutting against the guide ramps of the second clamping blocks 33. During operation, when the first clamping block 32 needs to be disengaged from the drive block 41, the drive assembly 40 drives the drive block 41 to move the slide 31 in the left and right directions toward the unlocking ends of the unlocking members 34. When the slide 31 approaches the unlocking ends, the unlocking ends of the unlocking members 34 abut against the guide ramps of the second clamping blocks 33. Due to the inclination of the guide ramps, the unlocking members 34 exert a tangential force on the second clamping blocks 33, causing them to rotate about the rotation axis 311. The rotation of the second clamping block 33 is transmitted to the first clamping block 32 via the rotating shaft 311, and the first clamping block 32 also rotates accordingly, causing the guide inclined surface of the first clamping block 32 to gradually disengage from the engagement of the drive block 41. At this time, the drive block 41 continues to slide and rotate until it enters an engaged state with another first clamping block 32, driving the slide 31 to slide again. The coordinated operation of the drive block 41 sequentially engaging the two first clamping blocks 32, and the unlocking member 34 driving the second clamping block 33 to disengage the first clamping block 32, enables the reciprocating sliding of the slide 31 on the workbench 10. Because the support bracket 20 is mounted on both sides of the slide 31, the reciprocating sliding of the slide 31 drives the support bracket 20 and the material plate 21 carrying the circuit board 1 thereon to move together, causing the two ends of the support bracket 20 to slide alternately to the glue injection station 11, realizing continuous glue injection production of the circuit boards 1.
[0036] Further, refer to Figures 3 to 5 In some embodiments of the present invention, the unlocking member 34 can be adjustably positioned on the workbench 10 to adjust the unlocking position of the unlocking end of the unlocking member 34. The unlocking member 34 can be screwed onto a mounting seat provided on the workbench 10 via a threaded connection. By rotating the unlocking member 34, the position of the unlocking end can be adjusted, thereby adjusting the position of the unlocking drive block 41 of the unlocking member 34 engaging the first engaging block 32, thereby adjusting the left and right sliding stroke of the support bracket 20, thereby meeting the requirements of different material board 21 specifications, and ultimately meeting the requirements of different circuit board 1 specifications.
[0037] Reference Figure 5 In some embodiments of the present invention, first limit rods 312 are respectively provided at both ends of the slide 31, and the positions of the two first limit rods 312 correspond to the positions of the first clamping block 32. The first clamping block 32 has a second limit rod 322, and the second limit rod 322 can be clamped between the first limit rods 312. The first limit rod 312 is configured to limit the rotation range of the first clamping block 32.
[0038] Furthermore, first limit rods 312 are provided at intervals at both ends of the slide 31, and a second limit rod 322 is provided on the first clamping block 32. Through the cooperation of the first limit rod 312 and the second limit rod 322, the rotation range of the first clamping block 32 is limited.
[0039] During operation, the material plate 21 carrying the circuit board 1 is first placed on the support bracket 20. The drive assembly 40 is activated, driving the drive block 41 to begin sliding and rotating. When the drive block 41 rotates to a position where it engages with the engaging portion 321 of the first engaging block 32, the engagement between the drive block 41 and the first engaging block 32 causes the drive block 41 to rotate, thereby driving the slide 31 along the slide rails on the workbench 10. Taking the rear first engaging block 32 as an example, as the drive block 41 engages with the first engaging block 32, the second limiting rod 322 disposed on the first engaging block 32 engages with the left-side first limiting rod 312, thereby preventing the first engaging block 32 from rotating when the drive block 41 engages with the first engaging block 32. In other words, due to the restraining action of the first limiting rod 312, the second limiting rod 322 cannot continue to rotate, thereby limiting the rotation range of the first engaging block 32. This restriction can prevent the first clamping block 32 from excessively rotating, avoid abnormalities in the clamping relationship between the first clamping block 32 and the driving block 41 , and ensure the stability and reliability of the sliding movement of the slide 31 .
[0040] When the first clamping block 32 needs to be disengaged from the drive block 41, a signal is sent from an external control device (e.g., a controller) to activate a drive device (e.g., a cylinder, electromagnet, etc.) mounted on the workbench 10. The drive device pushes the unlocking member 34 toward the second clamping block 33. The unlocking end of the unlocking member 34 abuts against the guide ramp of the second clamping block 33, causing the second clamping block 33 to rotate about the rotation axis 311. Alternatively, the position-adjustable unlocking member 34 provided in the above embodiment can be used to drive the second clamping block 33 to rotate. The rotation of the second clamping block 33 is transmitted to the first clamping block 32 via the rotation axis 311, causing the first clamping block 32 to rotate accordingly, gradually disengaging the guide ramp of the first clamping block 32 from the drive block 41. A first limiting rod 312 on the other side (i.e., the right side shown in the figure) prevents the second clamping block 33 from rotating excessively when driven by the unlocking member 34, ensuring the rotation range of the first clamping block 32. The reciprocating movement of the slide 31 on the workbench 10 is achieved by the drive block 41 sequentially engaging the two first engaging blocks 32, and the unlocking member 34 driving the second engaging block 33 to disengage the first engaging blocks 32. Because the support bracket 20 is mounted on both sides of the slide 31, the reciprocating movement of the slide 31 drives the support bracket 20 and the material plate 21 supporting the circuit board 1 thereon to move together, causing the two ends of the support bracket 20 to slide alternately onto the glue injection station 11, thereby achieving continuous glue injection production of the circuit boards 1.
[0041] Reference Figures 3 to 5 In some embodiments of the present invention, the driving assembly 40 includes two sprockets 42 and a chain 43. The two sprockets 42 are spaced apart, and the chain 43 can be wound around the two sprockets 42. The driving block 41 is set on the chain 43. The sprocket 42 is configured to drive the chain 43 to transmit, so that the chain 43 drives the driving block 41 to rotate and slide on the workbench 10.
[0042] Furthermore, the embodiment of the present invention optimizes the design of the drive assembly 40, employing a transmission method comprising two sprockets 42 and a chain 43 to drive the drive block 41 to rotate and slide on the workbench 10. The overall structure, supported by the workbench 10, utilizes the slide 31 and other components of the transmission assembly 30, driven by the drive assembly 40, to achieve reciprocating motion of the support bracket 20 on the workbench 10, thereby driving the circuit board 1 and the material board 21 to move between the injection stations 11.
[0043] Specifically, two sprockets 42 are spaced apart on the workbench 10 via rotating connectors such as bearings. The bearings are mounted within the central axis holes of the sprockets 42, and the central axis of the sprockets 42 is fixed to brackets on the workbench 10 at both ends, ensuring stable rotation of the sprockets 42. The tooth profile of the sprockets 42 is designed to meet the transmission requirements of the chain 43 to ensure meshing accuracy and transmission efficiency between the chain 43 and the sprockets 42. The chain 43 utilizes a standard roller chain, consisting of chain plates, pins, sleeves, and rollers. The pitch of the chain 43 matches the tooth pitch of the sprockets 42, ensuring smooth winding of the chain 43 around the two sprockets 42. The chain plates of the chain 43 are made of high-quality steel and surface-treated to enhance their corrosion and wear resistance. The two ends of the chain 43 are connected by connecting pins to form a closed loop, allowing for a cyclic transmission between the two sprockets 42. The drive block 41 is a metal block of a specific shape and size, and its material can be selected according to actual needs, such as aluminum alloy or steel. The drive block 41 is fixed to the links of the chain 43 by welding, bolting, or other means, ensuring a secure and reliable connection between the drive block 41 and the chain 43. The drive block 41 is shaped to engage with the first engaging block 32 of the transmission assembly 30. For example, a protrusion or groove is provided on one side of the drive block 41 to match the engaging portion 321 of the first engaging block 32, thereby achieving stable engaging transmission.
[0044] To drive the sprockets 42, this embodiment also includes a drive device (not shown). This drive device can be a motor, whose output shaft is connected to the central axis of one of the sprockets 42 via a coupling. This motor uses a variable-frequency speed control motor, which can adjust its speed based on actual production requirements, thereby controlling the transmission speed of the chain 43 and the rotational slip speed of the drive block 41. The motor is mounted on a motor bracket, which is fixed to the workbench 10 to ensure stable installation.
[0045] During actual operation, the material plate 21 carrying the circuit board 1 is first placed on the support bracket 20. The motor is started, and the motor drives one of the sprockets 42 to rotate through the coupling. Since the chain 43 is wound around the two sprockets 42, the rotation of the sprocket 42 drives the chain 43. As the chain 43 is driven, the drive block 41 fixed to the chain 43 also rotates and slides. When the drive block 41 moves to a position corresponding to the first clamping block 32 of the transmission assembly 30, the drive block 41 and the first clamping block 32 engage with each other. Because the drive block 41 has the power to rotate and slide under the drive of the chain 43, it drives the slide 31 to slide along the slide rail on the workbench 10 through the first clamping block 32. As the chain 43 continues to drive, the drive block 41 drives the slide 31 to reciprocate on the workbench 10. When the driving block 41 moves to the other end of the chain 43, due to the ring structure of the chain 43, the driving block 41 will continue to drive along the chain 43 to achieve rotational sliding. At the same time, another first clamping block 32 will enter a clamping state with the next driving block 41, driving the slide 31 to continue sliding again.
[0046] It is understandable that in order to drive the driving block 41 to rotate and slide on the workbench 10, a rotary slide rail mechanism can also be used for driving. Therefore, in this embodiment, no specific structural limitation is made to the driving component 40.
[0047] Reference Figures 1 to 3 In some embodiments of the present invention, the transfer mechanism 2 for core embedding positioning and glue injection of the circuit board further includes a lifting assembly 50, which is arranged on the workbench 10 and located below the glue injection station 11. The lifting assembly 50 includes a lifting seat 51, which is liftable and arranged on the workbench 10 and located on the glue injection station 11. The lifting seat 51 is configured to lift the material plate 21.
[0048] In this embodiment, the transfer mechanism 2 for positioning and injecting glue for the circuit board core embedding is additionally equipped with a lifting assembly 50. The lifting assembly 50 is disposed on the workbench 10 and is located below the glue injection station 11. When the material plate 21 moves to the glue injection station 11, the lifting assembly 50 can lift the material plate 21 to facilitate the glue injection operation.
[0049] Lifting assembly 50 is secured to workbench 10 via a mounting frame (not shown). The mounting frame is welded from section steel, and its shape and dimensions are designed based on the installation requirements of lifting assembly 50. The bottom of the mounting frame is fixedly connected to workbench 10 via bolts and other fasteners, ensuring a secure and reliable installation of lifting assembly 50.
[0050] Specifically, during the actual operation, the material plate 21 carrying the circuit board 1 is first placed on the support bracket 20. The transmission assembly 30 drives the support bracket 20 and the material plate 21 thereon to slide back and forth on the workbench 10. When the material plate 21 moves to the glue injection station 11, the support bracket 20 stops moving due to the loss of the drive block 41. At this time, the lifting seat 51 is pushed upward. Because the lifting seat 51 is located on the glue injection station 11 and its shape and size match the material plate 21, the lifting seat 51 contacts the material plate 21 and lifts it up. After the material plate 21 is lifted, the distance between it and the glue injection head of the glue injection equipment reaches the appropriate glue injection position, and the glue injection equipment begins the glue injection operation on the circuit board 1. During the glue injection process, the lifting seat 51 remains stable, ensuring that the position of the material plate 21 remains unchanged, thereby ensuring the accuracy and quality of the glue injection. When the glue injection is completed, the lifting seat 51 moves downward, and the material plate 21 is replaced on the support bracket 20. The support bracket 20 leaves the glue injection area under the sliding movement of the driving block 41 so as to carry out subsequent operations.
[0051] Further, refer to Figures 1 to 3 In some embodiments of the present invention, the lifting assembly 50 includes two groups of lever members 52, which are respectively arranged on the workbench 10 and located on both sides of the supporting bracket 20. One end of the two groups of lever members 52 is respectively hinged to the lower end of the lifting seat 51, and the other ends of the two groups of lever members 52 can be raised and lowered on both sides of the injection station 11. A driving inclined surface 53 is provided on one side of both ends of the supporting bracket 20. The driving inclined surface 53 is configured to drive the other end of the lever member 52 to descend so that one end of the lever member 52 lifts the lifting seat 51 upward.
[0052] In this embodiment, the lifting assembly 50 uses two sets of levers 52 to raise and lower the lifting seat 51. When the material plate 21 moves to the glue injection station 11, the driving inclined surface 53 on the support bracket 20 cooperates with the levers 52 to drive the levers 52, thereby causing the lifting seat 51 to lift the material plate 21 for glue injection.
[0053] Space is reserved on the workbench 10 on both sides and below the injection station 11 for installing the lever members 52, and a corresponding support structure (not shown) is provided for installing and securing the lifting ends of the lever members 52. Two sets of lever members 52 are respectively arranged on the workbench 10 and located on both sides of the support bracket 20. The lever members 52 are made of a metal material with a certain strength and rigidity, such as alloy steel. Each set of lever members 52 includes a lever (not shown) with a hinge point in the middle of the lever, allowing the lever to rotate about the hinge axis. The two ends of the lever are respectively hinged to lifting rods, and the lower ends of the lifting rods are respectively hinged to the two ends of the lever. The upper end of one lifting rod is hinged to the bottom of the lifting seat 51, and the other lifting rod can be used to support the driving inclined surface 53 of the support bracket 20. The hinge points of the levers are provided with hinge shafts and bearings to ensure flexible rotation between the levers and the lifting seat 51. The lifting rod of the driving inclined surface 53 that pushes against the supporting bracket 20 can be used as a lifting end and can be set to be lifted on both sides of the injection station 11. The bottom of the lifting seat 51 is connected to one end of the two groups of lever members 52 respectively by a hinged manner. When the lever members 52 rotate around the hinge axis, the lifting seat 51 can be driven to move up and down. Support structures are provided on both sides of the injection station 11 on the workbench 10 to support and guide the lifting ends of the lever members 52. The support structure can be in the form of a ring, a slide rail, and a slider, so that the lifting end of the lever member 52 can be lifted and lowered along a predetermined trajectory. For example, vertical rings are installed on the workbench 10 on both sides of the injection station 11, and the lifting rod of the lever member 52 is inserted into the ring. The lifting rods at both ends of the lever can slide up and down in the ring, thereby ensuring the stability and accuracy of the lifting of the lever member 52.
[0054] During operation, the material plate 21 carrying the circuit board 1 is first placed on the support bracket 20. The transmission assembly 30 drives the support bracket 20 and the material plate 21 on it to slide back and forth across the workbench 10. When the material plate 21 reaches the glue injection station 11, the drive block 41 disengages the first latch 32, and the support bracket 20 stops moving. At this point, the driving ramps 53 at each end of the support bracket 20 contact the upper ends of the levers 52. The driving ramps 53 apply downward pressure to the levers, causing them to rotate about their central hinges. Because the levers at the other ends of the levers are hinged to the lower ends of the lifting base 51, the downward movement of the levers drives one end upward, lifting the lifting base 51. Once lifted, the lifting base 51 contacts the material plate 21 and lifts it, bringing the distance between the material plate 21 and the glue injection head to the desired injection position. The glue injection equipment then begins to inject glue into the circuit board 1. During the glue injection process, the lifting seat 51 remains stable to ensure that the position of the material plate 21 remains unchanged, thereby ensuring the accuracy and quality of the glue injection.
[0055] After glue injection is complete, the transmission assembly 30 drives the support bracket 20 and the material plate 21 thereon away from the glue injection station 11. At this point, the driving ramp 53 separates from the lifting rod of the lever member 52. The lever member 52 returns to its initial position under the action of its own gravity or other reset mechanism (such as a spring, which can be selected based on actual design requirements). The lifting seat 51 also descends, and the material plate 21 is replaced on the support bracket 20. The transmission assembly 30 continues to drive the support bracket 20 and the material plate 21 thereon to the next glue injection station 11 or out of the glue injection area for subsequent operations.
[0056] Reference Figure 1 , the circuit board embedded core positioning glue injection device 3 according to the embodiment of the second aspect of the present invention comprises a glue injection mechanism (not shown in the figure) and a transfer mechanism 2 for positioning glue injection for the circuit board embedded core according to any one of the embodiments of the first aspect mentioned above. The glue injection mechanism is located above the glue injection station 11, and the glue injection mechanism is configured to inject glue into the circuit board 1. As can be seen from the embodiment of the first aspect, the circuit board embedded core positioning glue injection device 3 according to the embodiment of the second aspect of the present invention has at least the following beneficial effects: the present circuit board embedded core positioning glue injection device 3 has all the beneficial effects brought about by the transfer mechanism 2 for positioning glue injection for the circuit board embedded core, which will not be repeated here. At the same time, the glue injection mechanism can also replace manual operation, thereby improving the quality of glue injection and the production efficiency of glue injection.
[0057] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0058] Of course, the present invention is not limited to the above-mentioned embodiments. Those skilled in the art may make equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.
Claims
1. A transfer mechanism for positioning and injecting glue for embedded cores on circuit boards, characterized in that: include: A workbench (10), wherein the workbench (10) has a glue injection station (11); A support frame (20), the support frame (20) being reciprocatingly slidably disposed on the workbench (10), with both ends of the support frame (20) configured to place material plates (21), and the material plates (21) being configured to carry the circuit board (1); A transmission assembly (30), wherein the transmission assembly (30) is slidably disposed on the workbench (10), the support bracket (20) is disposed on the transmission assembly (30), and the transmission assembly (30) is configured to drive the support bracket (20) to slide back and forth on the workbench (10); and A drive assembly (40) is provided on the workbench (10), and the drive assembly (40) is configured to drive the transmission assembly (30) to slide back and forth on the workbench (10), so that the two ends of the support bracket (20) slide alternately onto the glue injection station (11).
2. The transfer mechanism for positioning and injecting glue for embedded cores of circuit boards according to claim 1, characterized in that: The driving assembly (40) includes a driving block (41), and the driving block (41) can rotate and slide on the workbench (10). The transmission assembly (30) includes a slide (31) and a first clamping block (32). The slide (31) is slidably arranged on the workbench (10). Both sides of the support bracket (20) are respectively arranged on the slide (31). The first clamping block (32) is provided with two blocks. The first clamping blocks (32) are respectively rotatably arranged at the two ends of the slide (31). The driving block (41) can be sequentially clamped to the first clamping block (32). The driving block (41) is configured to sequentially clamp to the first clamping block (32) so that the first clamping block (32) drives the slide (31) to slide back and forth on the workbench (10).
3. The transfer mechanism for positioning and injecting glue for embedded cores of circuit boards according to claim 2, characterized in that: The slide (31) is provided with a rotating shaft (311), and the rotating shaft (311) can be rotatably passed through the slide (31). The first clamping block (32) is rotatably provided on the slide (31) through one end of the rotating shaft (311). The first clamping block (32) has a clamping portion (321), and the clamping portion (321) and the driving block (41) are mutually clamped. A second clamping block (33) is provided at the other end of the rotating shaft (311). The second clamping block (33) is rotatable and is configured to drive the first clamping block (32) to rotate so that the guide inclined surface of the first clamping block (32) is disengaged from the clamping of the driving block (41).
4. The transfer mechanism for positioning and injecting glue for embedded cores on circuit boards according to claim 3, characterized in that: The transmission assembly (30) further includes two unlocking members (34), which are arranged on the workbench (10) relative to each other. The positions of the two unlocking members (34) are respectively arranged in a one-to-one correspondence with the positions of the second clamping block (33). The unlocking ends of the unlocking members (34) can abut against the guide inclined surface of the second clamping block (33). The unlocking members (34) are configured to drive the second clamping block (33) to rotate so as to rotate the first clamping block (32).
5. The transfer mechanism for positioning and injecting glue for embedded cores on circuit boards according to claim 4, characterized in that: The unlocking member (34) can be arranged on the workbench (10) in an adjustable manner so as to adjust the unlocking position of the unlocking end of the unlocking member (34).
6. The transfer mechanism for positioning and injecting glue for embedded cores on circuit boards according to claim 3, characterized in that: Two ends of the slide seat (31) are respectively provided with first limiting rods (312) arranged at intervals, and the positions of the two first limiting rods (312) correspond to the position of the first clamping block (32). The first clamping block (32) has a second limiting rod (322), and the second limiting rod (322) can be clamped between the first limiting rods (312). The first limiting rod (312) is configured to limit the rotation range of the first clamping block (32).
7. The transfer mechanism for positioning and injecting glue for embedded cores on circuit boards according to claim 2, characterized in that: The driving assembly (40) includes two sprockets (42) and a chain (43). The two sprockets (42) are spaced apart, and the chain (43) can be wound around the two sprockets (42). The driving block (41) is arranged on the chain (43). The sprocket (42) is configured to drive the chain (43) so that the chain (43) drives the driving block (41) to rotate and slide on the workbench (10).
8. The transfer mechanism for positioning and injecting glue for embedded cores on circuit boards according to claim 1, characterized in that: The invention also includes a lifting assembly (50), wherein the lifting assembly (50) is arranged on the workbench (10) and is located below the glue injection station (11), and the lifting assembly (50) includes a lifting seat (51), wherein the lifting seat (51) is movably arranged on the workbench (10) and is located on the glue injection station (11), and the lifting seat (51) is configured to lift the material plate (21).
9. The transfer mechanism for positioning and injecting glue for embedded cores on circuit boards according to claim 8, characterized in that: The lifting assembly (50) includes two groups of lever members (52), and the two groups of lever members (52) are respectively arranged on the workbench (10) and located on both sides of the support frame (20). One end of the two groups of lever members (52) is respectively hinged to the lower end of the lifting seat (51), and the other end of the two groups of lever members (52) can be raised and lowered on both sides of the injection station (11). One side of both ends of the support frame (20) is provided with a driving inclined surface (53), and the driving inclined surface (53) is configured to drive the other end of the lever member (52) to descend so that one end of the lever member (52) lifts the lifting seat (51) upward.
10. A circuit board embedded core positioning glue injection device, characterized in that: It comprises a glue injection mechanism and a transfer mechanism for embedding core positioning glue injection of a circuit board according to any one of claims 1 to 9, wherein the glue injection mechanism is located above the glue injection station (11), and the glue injection mechanism is configured to inject glue into the circuit board (1).
Citation Information
Patent Citations
Novel sintering device and method for silicon carbide embedded core-embedded module packaging circuit board
CN120379153A
Full-automatic single-rail dispensing machine
CN209901609U
Conveying device of glue injection jig
CN218171163U
Substrate transfer device
JP1988213355A