Portable laser cleaning device, built-in control system and safety configuration method

Abstract

The invention provides a portable laser cleaning device, a built-in control system and a safety configuration method, and relates to the technical field of laser equipment. The built-in control system stores rapid conversion information for laser patterns; wherein the rapid conversion information is used for roughly estimating the fixed point temperature of the current laser parameter configuration applied to the current laser pattern; through the difference quantity of the current laser parameter configuration compared with the reference laser parameter configuration, the roughly estimated laser source hot spot temperature of each point under the current laser parameter configuration can be roughly estimated, and the whole process only needs simple mathematical calculation and does not involve complex parameter iteration and simulation environment operation; according to the safety configuration method, only the reference laser source hot spot temperatures corresponding to the maximum temperature point and the minimum temperature point need to be quickly converted and estimated, and the laser parameter configuration is adjusted based on the parameter adjustment strategy, so that when the adjusted laser parameter configuration is used for laser pattern drawing, the temperatures at all positions can be kept within the target temperature interval.

Description

Technical Field

[0001] The present invention relates to the technical field of laser equipment, and in particular to a portable laser cleaning device, a built-in control system and a safety configuration method. Background Art

[0002] Laser cleaning is a green and environmentally friendly industrial surface treatment technology that utilizes a high-energy laser beam to illuminate the surface of a workpiece, causing dirt, rust, or coatings to instantly evaporate, disintegrate, or sublimate, resulting in a surface that appears as clean as new. Laser cleaning is non-abrasive, non-polluting, non-contact, and heat-free, and is suitable for a wide range of processing environments and industrial materials. The process requires no chemicals or cleaning fluids, making it the most reliable, effective, and environmentally friendly solution for industrial surface treatment today. It is also the future trend and preferred choice for industrial cleaning.

[0003] Most of the existing laser cleaning devices on the market are table-operated devices, which require the objects to be cleaned to be placed on the cleaning table. Their advantages are high precision, strong functions and good safety. Their disadvantages are that the equipment is not easy to carry and install. In order to meet the flexible and changeable cleaning needs, portable laser cleaning devices have also been proposed. The current portable laser cleaning devices have omitted many auxiliary functions and only retain the most basic laser generation and logic control functions. This is an inevitable choice for portability.

[0004] In addition, since portable laser cleaning devices are mostly used for temporary operations, their related configurations are basically set by the users themselves. Users cannot verify the configurations they set with the help of auxiliary functions (such as simulation calculations or temperature monitoring functions). They can only roughly evaluate the configurations based on their own experience. Often, due to inaccurate temperature assessments and incorrect configuration settings, the cleaning temperature may be too low or too high, which in turn manifests as substandard cleaning ability or overheating that damages the surface of the object.

[0005] Therefore, it is necessary to provide a portable laser cleaning device, a built-in control system and a safety configuration method to solve the technical problem that the existing portable laser cleaning devices in the prior art can only rely on the user's own experience to roughly evaluate the configuration without the help of other auxiliary functional equipment. Summary of the Invention

[0006] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a portable laser cleaning device, a built-in control system and a safety configuration method, aiming to provide a fast laser parameter safety configuration strategy without the need for complex simulation analysis and calculation without the aid of other auxiliary function equipment, thereby meeting the user's rough assessment configuration needs and ensuring temperature safety during the cleaning process.

[0007] To achieve the above objectives, the present application proposes a portable laser cleaning device, including a laser cleaning tool, a control board and an operation panel: wherein, The laser cleaning tool comprises a head structure and a tool structure connected by an adjustable rotating shaft; wherein the head structure is provided with a laser generating module and a blowing motor module, and a wire outlet is provided at the bottom of the tool structure, and the laser generating module and the blowing module are electrically connected to the control board through the wire outlet; The laser generating module includes a laser generator, a focusing field lens and a laser head connected in sequence; wherein, the laser generator transmits the laser path to the focusing field lens through a reflective lens, and the focusing field lens is used to focus the laser to the laser head. X Axis and Y The axis sets the laser galvanometer motor for angle adjustment; The control board is based on ARM The single chip is set up and connected to the laser galvanometer motor driver, blower motor driver, temperature acquisition module, data storage module and RS 232 communication module is electrically connected, the laser generating module is electrically connected to the laser galvanometer motor driver, the blowing motor driver is electrically connected to the blowing motor module, the RS The 232 communication module is electrically connected to the operation panel, and the temperature acquisition module is used to acquire the temperature status of the device.

[0008] On the other hand, the present invention also provides a built-in control system deployed in a control board of a portable laser cleaning device, wherein the control board performs laser cleaning control based on a configuration file, wherein the configuration file includes a laser pattern configuration, a laser parameter configuration, a cleaning object configuration, and a target temperature range; wherein, The laser pattern configuration is used to describe the laser pattern used; the laser parameter configuration includes cleaning speed, laser frequency, laser pulse width and laser power; the cleaning object configuration is based on manual input matching, including the object substrate type and surface attachment type; the target temperature range is set based on manual input.

[0009] As a further solution, the data storage module pre-stores a laser pattern configuration library, which stores a number of laser patterns and rapid conversion information corresponding to the laser patterns; wherein, The laser pattern is drawn in a segmented order based on a number of segmented lines; the rapid conversion information includes the temperature maximum point and temperature minimum point of the laser pattern, the temperature maximum point and temperature minimum point of each segmented line, the reference laser source hotspot temperature corresponding to each point, and the reference laser parameter configuration.

[0010] As a further solution, the laser parameter configuration used at high frequencies is used as the benchmark laser parameter configuration and input into the laser source hotspot model for segmented simulation calculations; Establish the corresponding laser source hotspot model based on the laser generation module; Determine the calculation order and calculation path of the segmented simulation calculation based on the laser pattern configuration, and determine the distribution position and number of laser source hot spots based on the cleaning speed and calculation path; The model parameters of the laser source hotspot model are determined based on the cleaning speed, laser frequency, laser pulse width and laser power, and segmented simulation calculation iterations are performed to obtain the laser source hotspot distribution map corresponding to each iteration stage of the laser pattern; Based on the laser source hot spot distribution map at each iterative stage, the temperature maximum point and temperature minimum point of the laser pattern, as well as the temperature maximum point and temperature minimum point of each segmented line are determined.

[0011] In another aspect, the present invention further provides a security configuration method, which is applied to a built-in control system as described in any one of the above items, and quickly matches the security configuration through the following steps: Step 1: Obtain the configuration file and perform configuration analysis to obtain the laser pattern configuration, laser parameter configuration, cleaning object configuration, and target temperature range; Step 2: Match the corresponding safe temperature range based on the cleaning object configuration; the maximum safe temperature is determined by the maximum tolerance temperature of the object substrate type, and the minimum safe temperature is determined by the minimum cleaning temperature of the surface attachment type; Step 3: Determine whether the target temperature range is within the safe temperature range; if so, accept the current target temperature range; otherwise, ask whether to adjust the target temperature range and accept the target temperature range determined by the user; Step 4: Obtain the fast conversion information corresponding to the laser pattern used in the laser pattern configuration library, convert the parameter changes between the current laser parameter configuration and the reference laser parameter configuration into independent influencing factors corresponding to each laser parameter; perform weighted conversion on the reference laser source hotspot temperatures at the maximum and minimum temperature points based on each independent influencing factor to obtain a rough estimate of the laser source hotspot temperatures at the maximum and minimum temperature points; Step 5: Determine a rough estimated temperature range based on the rough estimated laser source hotspot temperatures at the maximum and minimum temperature points, and determine whether the rough estimated temperature range is within the target temperature range; if so, accept the current configuration file as a safe configuration and end; otherwise, proceed to step 6; Step 6: Ask whether to automatically match the security configuration; if so, obtain the parameter adjustment policy and execute step 7; otherwise, ask whether to adjust the current configuration file, accept the configuration file determined by the user, and end; Step 7: Adjust the laser parameter configuration based on the parameter adjustment strategy, re-obtain the rough estimate of the laser source hotspot temperature at the maximum temperature point and the minimum temperature point, and update the rough estimate temperature range; wherein, when the rough estimate temperature range is within the target temperature range, output the current laser parameter configuration; Step 8: Ask the user whether to accept the current laser parameter configuration; if so, update the current laser parameter configuration to the configuration file, and accept the current configuration file as a safe configuration, and end; otherwise, based on the user's selection, return to step 7 or accept the configuration file determined by the user, and end.

[0012] As a further solution, the parameter adjustment strategy includes a single parameter adjustment strategy and a mixed parameter adjustment strategy; wherein, Single parameter adjustment strategy: only adjust any one of the cleaning speed, laser frequency, laser pulse width and laser power; Mixed parameter adjustment strategy: adjust at least one of the cleaning speed, laser frequency, laser pulse width and laser power according to a preset parameter adjustment ratio.

[0013] As a further solution, when adjusting the laser parameters: When the roughly estimated laser source hotspot temperature at the temperature minimum point is lower than the target temperature range, the laser source hotspot temperature is increased by iteratively reducing the cleaning speed, iteratively increasing the laser frequency, iteratively increasing the laser pulse width, and / or iteratively increasing the laser power; When the roughly estimated laser source hotspot temperature at the temperature maximum point is greater than the target temperature range, the laser source hotspot temperature is reduced by iteratively increasing the cleaning speed, iteratively decreasing the laser frequency, iteratively decreasing the laser pulse width and / or iteratively decreasing the laser power.

[0014] As a further solution, when the same laser parameter configuration cannot make the roughly estimated laser source hotspot temperatures of the temperature maximum point and the temperature minimum point simultaneously within the target temperature range, the laser parameters of each segmented line are adjusted separately until the roughly estimated laser source hotspot temperatures of the temperature maximum point and the temperature minimum point of each segmented line simultaneously fall within the target temperature range, and this is used as the laser parameter configuration for each segmented line segment independently.

[0015] As a further solution, when the same laser parameter configuration cannot make the roughly estimated laser source hotspot temperatures of the temperature maximum point and the temperature minimum point in the same segmented line simultaneously within the target temperature range, a temporary segmentation point is automatically generated between the two points and the segmented line is divided into two sub-segmented lines. The laser parameters of each sub-segmented line are adjusted separately until the roughly estimated laser source hotspot temperatures of the temperature maximum point / temperature minimum point of each sub-segmented line are within the target temperature range, and this is used as the laser parameter configuration for each sub-segmented line segment independently.

[0016] As a further solution, the rough estimate of the laser source hotspot temperature is converted by weight using the following formula: T= ( K P + K τ + K f + K v ) / 4·(1+ β ) T 0; in, K P 、 K τ 、 K f 、 K v are the independent influencing factors corresponding to laser power, laser pulse width, laser frequency and cleaning speed, T To roughly estimate the hotspot temperature of the laser source, T 0 is the hot spot temperature of the reference laser source, β To roughly estimate the temperature margin, it is a negative value at the minimum temperature point or the extreme minimum temperature point, and a positive value at the maximum temperature point or the extreme maximum temperature point.

[0017] Compared with related technologies, the portable laser cleaning device, built-in control system, and safety configuration method provided by the present invention have the following advantages: 1. The present invention is based on ARM The single-chip microcomputer provides a portable laser cleaning device with certain control and computing capabilities. It uses a temperature acquisition module to monitor the device's temperature status in real time. When the laser cleaning tool overheats due to operation, the device cools down by blowing air inside the device through the blower motor driver and the blower motor module. When drawing segmented lines above the target temperature range, the blower motor module is activated in advance to blow air. After the drawing is completed, the air is delayed to shut off to quickly cool the high-temperature area, ensuring that the substrate is not damaged by high temperature. 2. The built-in control system of the present invention also stores rapid conversion information corresponding to laser patterns pre-stored in the laser pattern configuration library. The rapid conversion information is used to roughly estimate the fixed point temperature of the current laser pattern when the current laser parameter configuration is applied. The reference laser source hotspot temperature corresponding to each point is corrected by the difference between the current laser parameter configuration and the reference laser parameter configuration. This allows a rough assessment of the laser source hotspot temperature at each point under the current laser parameter configuration. The entire process requires only simple mathematical calculations and does not involve complex parameter iteration or simulation environment operation. 3. The safety configuration method of the present invention combines the rapid conversion information of the laser pattern used and the current laser parameter configuration, rapidly converts and estimates the hotspot temperature of the reference laser source corresponding to the maximum temperature point and the minimum temperature point, and adjusts the laser parameter configuration based on the parameter adjustment strategy, so that the adjusted laser parameter configuration can keep the temperature at all locations within the target temperature range when used for laser pattern drawing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0020] Figure 1 A schematic structural diagram of a portable laser cleaning device provided by the present invention; Figure 2 A schematic diagram of the main interface of a built-in control system provided by the present invention; Figure 3 A schematic diagram of a system setting interface of a built-in control system provided by the present invention; Figure 4 Schematic diagram of the cleaning setting interface of a built-in control system provided by the present invention Figure 1 ; Figure 5 Schematic diagram of the cleaning setting interface of a built-in control system provided by the present invention Figure 2 ; Figure 6 A schematic diagram of the steps of a security configuration method provided by the present invention; Figure 7 A schematic diagram of a laser pattern configuration provided by the present invention; Among them, the figure markings are: 1. Head structure; 11. Laser generator; 12. Focusing field lens; 13. Laser light output head; 14. Laser galvanometer motor; 2. Air blowing motor module; 3. Handpiece structure; 31. Adjustable rotating shaft; 32. Wire outlet; 4. Operation panel.

[0021] The purpose, features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0023] Example 1 See also Figure 1 The embodiment of the present application provides a portable laser cleaning device, including a laser cleaning tool, a control board and an operation panel 4: wherein, The laser cleaning tool includes a head structure 1 and a tool structure 3 connected by an adjustable rotating shaft 31; wherein the head structure 1 is provided with a laser generating module and a blowing motor module 2, and the bottom of the tool structure 3 is provided with an outlet 32, and the laser generating module and the blowing module are electrically connected to the control board through the outlet 32; The laser generating module comprises a laser generator 11, a focusing field lens 12 and a laser head 13 connected in sequence; wherein, the laser generator 11 transmits the laser path to the focusing field lens 12 through a reflective lens, and the focusing field lens 12 is used to focus the laser to the laser head 13. X Axis and Y The axis sets the laser galvanometer motor 14 for angle adjustment; The control board is based on ARM The single chip is set up and connected to the laser galvanometer motor 14 driver, the blower motor driver, the temperature acquisition module, the data storage module and RS 232 communication module is electrically connected, the laser generating module is electrically connected to the laser galvanometer motor 14 driver, the blowing motor driver is electrically connected to the blowing motor module 2, the RS The 232 communication module is electrically connected to the operation panel 4, and the temperature acquisition module is used to acquire the temperature status of the device.

[0024] It should be noted that: This embodiment is based on ARM The single-chip microcomputer provides a portable laser cleaning device with certain control and computing capabilities, and monitors the temperature status of the device in real time through a temperature acquisition module; when the laser cleaning tool overheats due to operation, the device can be cooled by blowing air inside the device through the blowing motor driver and the blowing motor module 2; in addition, when cleaning the surface, the blowing motor module 2 can also keep blowing air to remove surface residues and debris.

[0025] Example 2 See also Figures 2 to 5This embodiment provides a built-in control system deployed in a control board of a portable laser cleaning device. The control board performs laser cleaning control based on a configuration file. The configuration file includes a laser pattern configuration, a laser parameter configuration, a cleaning object configuration, and a target temperature range. The laser pattern configuration is used to describe the laser pattern used; the laser parameter configuration includes cleaning speed, laser frequency, laser pulse width and laser power; the cleaning object configuration is based on manual input matching, including the object substrate type and surface attachment type; the target temperature range is set based on manual input.

[0026] like Figure 2 As shown, the corresponding cleaning settings, system settings, I / O Device and view device information; among them, system settings such as Figure 3 As shown, some parameters that need to be set in advance are saved here, such as whether to enable security configuration matching, or set the alarm temperature, as well as login parameters and related system parameters.

[0027] Cleaning settings such as Figure 4 As shown, here you can adjust the laser pattern configuration, laser parameter configuration, cleaning object configuration and target temperature range. If the safety configuration matching function is turned on, you can also set the appropriate laser parameter configuration by clicking on the safety configuration matching to ensure that the overall temperature of the laser when drawing the pattern remains within the target temperature range during the entire cleaning process, thereby ensuring the effectiveness of cleaning without damaging the substrate.

[0028] like Figure 4 and Figure 5 As shown, here you can select the laser pattern through the preview interface, and different laser patterns have some specific adjustment parameters, such as the square pattern can adjust the outer and inner lengths. These laser patterns are stored in the laser pattern configuration library. The laser pattern is drawn in a segmented order based on several segmented lines. Furthermore, since the portable laser cleaning device omits many auxiliary functions and has limited computing power, it is unable to accurately perform complex simulation calculations and real-time light source temperature monitoring. Therefore, the laser parameter configuration can only be roughly evaluated and configured by the user based on his or her own experience. Often, due to inaccurate temperature assessment and incorrect configuration settings, the cleaning temperature may be too low or too high, which in turn manifests as substandard cleaning ability or overheating that damages the surface of the object.

[0029] To this end, for the laser patterns pre-stored in the laser pattern configuration library, fast conversion information is also stored. The fast conversion information is used to roughly estimate the temperature of fixed points of the current laser pattern when the current laser parameter configuration is applied. These fixed points include the maximum and minimum temperature points of the laser pattern, and the maximum and minimum temperature points of each segmented line. Since the temperature maximum and minimum points of the laser pattern, as well as the temperature maximum and minimum points of each segmented line, are highly coincident under different laser parameter configurations, these points can be found in advance through simulation and bound to the pre-existing laser pattern for use. When in use, this embodiment corrects the reference laser source hotspot temperature corresponding to each point by using the difference between the current laser parameter configuration and the reference laser parameter configuration, thereby roughly evaluating the laser source hotspot temperature at each point under the current laser parameter configuration. The entire process requires only simple mathematical calculations and does not involve complex parameter iterations and simulation environment operations.

[0030] It should be noted that the rough estimate of the laser source hotspot temperature may have a certain error, but it can largely reflect the temperature conditions of each point and is useful when judging the temperature range. It can also ensure the accuracy of the interval estimation by leaving a certain temperature margin, and can provide users with parameter references without adding additional equipment.

[0031] In order to realize the pre-construction of fast conversion information, this embodiment uses the laser parameter configuration used frequently as the reference laser parameter configuration and inputs it into the laser source hotspot model for segmented simulation calculation; wherein, Specifically, the laser source hotspot model is established based on the laser generation module. It is necessary to simulate and model the laser generator 11, focusing field lens 12 and laser output head 13 of the laser generation module, and determine the model parameters of the laser source hotspot model based on the cleaning speed, laser frequency, laser pulse width and laser power for model simulation control. In addition, the calculation order and calculation path of the segmented simulation calculation need to be determined based on the laser pattern configuration, and the distribution position and number of laser source hot spots need to be determined based on the cleaning speed and calculation path; And perform segmented simulation calculation iteration to obtain the laser source hot spot distribution map corresponding to each iteration stage of the laser pattern; This embodiment can determine the temperature maximum point and temperature minimum point of the laser pattern, as well as the temperature maximum point and temperature minimum point of each segmented line through the laser source hot spot distribution diagram at each iteration stage.

[0032] Example 3 See also Figure 6This embodiment is applied to a built-in control system as described in Example 2, and provides a security configuration method for quickly matching security configurations through the following steps: Step 1: Obtain the configuration file and perform configuration analysis to obtain the laser pattern configuration, laser parameter configuration, cleaning object configuration, and target temperature range; Step 2: Match the corresponding safe temperature range based on the cleaning object configuration; the maximum safe temperature is determined by the maximum tolerance temperature of the object substrate type, and the minimum safe temperature is determined by the minimum cleaning temperature of the surface attachment type; Step 3: Determine whether the target temperature range is within the safe temperature range; if so, accept the current target temperature range; otherwise, ask whether to adjust the target temperature range and accept the target temperature range determined by the user; Step 4: Obtain the fast conversion information corresponding to the laser pattern used in the laser pattern configuration library, convert the parameter changes between the current laser parameter configuration and the reference laser parameter configuration into independent influencing factors corresponding to each laser parameter; perform weighted conversion on the reference laser source hotspot temperatures at the maximum and minimum temperature points based on each independent influencing factor to obtain a rough estimate of the laser source hotspot temperatures at the maximum and minimum temperature points; Step 5: Determine a rough estimated temperature range based on the rough estimated laser source hotspot temperatures at the maximum and minimum temperature points, and determine whether the rough estimated temperature range is within the target temperature range; if so, accept the current configuration file as a safe configuration and end; otherwise, proceed to step 6; Step 6: Ask whether to automatically match the security configuration; if so, obtain the parameter adjustment policy and execute step 7; otherwise, ask whether to adjust the current configuration file, accept the configuration file determined by the user, and end; Step 7: Adjust the laser parameter configuration based on the parameter adjustment strategy, re-obtain the rough estimate of the laser source hotspot temperature at the maximum temperature point and the minimum temperature point, and update the rough estimate temperature range; wherein, when the rough estimate temperature range is within the target temperature range, output the current laser parameter configuration; Step 8: Ask the user whether to accept the current laser parameter configuration; if so, update the current laser parameter configuration to the configuration file, and accept the current configuration file as a safe configuration, and end; otherwise, based on the user's selection, return to step 7 or accept the configuration file determined by the user, and end.

[0033] It should be noted that user-configured laser parameter configurations can easily lead to inaccurate temperature assessments and incorrect configuration settings. For example, for a concentric laser pattern with the same laser parameter configuration, the center temperature may be higher than the periphery temperature. The user may set a laser parameter configuration based on center stability, resulting in a periphery temperature that is insufficient to clean surface deposits. Alternatively, the user may set a laser parameter configuration based on periphery temperature stability, resulting in a center temperature that is too high, thereby damaging the substrate. To this end, steps 2 and 3 are used to determine an approximate safe temperature range based on the object substrate type and surface attachment type set by the user, and to determine whether the target temperature range is within the safe temperature range, thereby prompting the user to modify the target temperature range to a reasonable level. If the user has not set the object substrate type and surface attachment type, steps 2 and 3 can be skipped and step 4 can be performed directly. Steps 4 to 8 combine the rapid conversion information of the laser pattern used and the current laser parameter configuration to quickly convert and estimate the benchmark laser source hotspot temperatures corresponding to the maximum and minimum temperature points, and adjust the laser parameter configuration based on the parameter adjustment strategy, so that the adjusted laser parameter configuration can keep the temperature at all locations within the target temperature range when used for laser pattern drawing.

[0034] The principle of the above method is: since the maximum temperature point and the minimum temperature point have been selected in advance, during execution, it is only necessary to roughly estimate the hot spot temperature of the laser source at these two points to obtain a rough estimate of the temperature range; it utilizes the fact that when the pattern does not change, the maximum temperature point and the minimum temperature point will most likely not change, and the deviation of the change will also be very small, similar to the fact that as long as the structure of the cup does not change, the hot part of the cup will always be in the same place; therefore, without performing simulation calculations, the temperature range corresponding to the laser parameter configuration can be quickly estimated.

[0035] Among them, the hot spot temperatures of the reference laser source at the maximum temperature point and the minimum temperature point are representative as a whole, and can determine the rough temperature range of the entire laser pattern without the need for complex simulation iterative calculations on the device side.

[0036] Furthermore, the parameter adjustment strategy includes a single parameter adjustment strategy and a mixed parameter adjustment strategy; wherein, Single parameter adjustment strategy: only adjust any one of the cleaning speed, laser frequency, laser pulse width and laser power; Mixed parameter adjustment strategy: adjust at least one of the cleaning speed, laser frequency, laser pulse width and laser power according to a preset parameter adjustment ratio.

[0037] Furthermore, when adjusting the laser parameters: When the roughly estimated laser source hotspot temperature at the temperature minimum point is lower than the target temperature range, the laser source hotspot temperature is increased by iteratively reducing the cleaning speed, iteratively increasing the laser frequency, iteratively increasing the laser pulse width, and / or iteratively increasing the laser power; When the roughly estimated laser source hotspot temperature at the temperature maximum point is greater than the target temperature range, the laser source hotspot temperature is reduced by iteratively increasing the cleaning speed, iteratively decreasing the laser frequency, iteratively decreasing the laser pulse width and / or iteratively decreasing the laser power.

[0038] It should be noted that: in some cases, the same laser parameter configuration can be used as a whole to make the roughly estimated laser source hotspot temperatures of the maximum temperature point and the minimum temperature point fall within the target temperature range at the same time; but sometimes, the same laser parameter configuration cannot make the roughly estimated laser source hotspot temperatures of the maximum temperature point and the minimum temperature point fall within the target temperature range at the same time. Or concentric circles ( Figure 4 and Figure 5 For example, the laser pattern in the last item (laser pattern) is too far away from the center and the outer ring. No matter how the same laser parameter configuration is adjusted, it is impossible to ensure that the outer ring does not fall below the target temperature range and the inner ring does not exceed the target temperature range. The innovative concept of this embodiment lies in that, since the laser pattern is obtained based on segmented lines arranged in a certain order, the laser parameters can be adjusted for each segmented line individually until the roughly estimated laser source hotspot temperatures at the temperature maximum and temperature minimum points of each segmented line are simultaneously within the target temperature range, and this is used as the laser parameter configuration for each segmented line independently. Doing so is equivalent to reducing the laser pattern into a combination of multiple "sub-images" again, which can shorten the span of the matching distance and thus reduce the probability of the rough estimate of the laser source hotspot temperature being within the target temperature range while failing to take into account both the maximum and minimum temperature points.

[0039] If adopted Figure 7 The laser pattern shown above, the segmented line processing method still cannot meet the temperature adjustment requirements, specifically: Figure 7 The overall pattern can be divided into 6 "arc" segmented lines, thereby providing a more refined laser parameter configuration division strategy; however, in the same "arc" segmented line, the 1P point has a high pattern density and high overlap, while the 2P point is relatively sparse and far away from the 1P point (center); therefore, if the same set of laser parameter configurations is used for the "arc" segmented line, it is very likely that "either the center temperature is high or the far end temperature is insufficient."

[0040] To this end, this embodiment adopts a method of automatically generating temporary segmentation points. Specifically, when the same laser parameter configuration cannot make the roughly estimated laser source hotspot temperatures of the temperature maximum point and the temperature minimum point in the same segmented line simultaneously within the target temperature range, a temporary segmentation point is automatically generated between the two points and the segmented line is divided into two sub-segmented lines. The laser parameters of each sub-segmented line are adjusted separately until the roughly estimated laser source hotspot temperatures of the temperature maximum point / temperature minimum point of each sub-segmented line are within the target temperature range, and this is used as the laser parameter configuration for each sub-segmented line segment to be used independently.

[0041] Through the above method, it is possible to adjust the laser parameter configuration of two segments in the same segmented line according to actual conditions and actual needs, so that a more detailed laser parameter configuration strategy can be achieved by making simple changes based on the original function.

[0042] In a specific embodiment, points 1P and 2P are respectively the temperature maximum point and the temperature minimum point of the current segmented line. This embodiment obtains the minimum temperature adjustment amount (absolute value) for adjusting the roughly estimated laser source hotspot temperature of 1P and 2P to the target temperature range based on the current laser parameter configuration strategy; that is, how much the upper limit of the target temperature range corresponding to 1P needs to be lowered, and how much the lower limit of the target temperature range corresponding to 2P needs to be increased; Then, the temperature influence range is determined by the minimum temperature adjustment amount of 1P and 2P, that is, the larger the minimum temperature adjustment amount, the larger the temperature influence range; correspondingly, in order to limit the temperature influence range, this embodiment takes the inverse ratio of the minimum temperature adjustment amount of 1P and 2P to determine the position ratio of the two ends of the automatically generated temporary segmentation point between the two points, in order to limit and offset the temperature influence range.

[0043] The principle can be understood as follows: the larger the temperature influence range, the more intense the laser parameter configuration adjustment. This influence is the root cause of "either the center temperature is high or the remote temperature is insufficient"; therefore, it needs to be limited to a smaller range to avoid affecting the other nearby party; and the other party, because its temperature influence range is smaller, is allocated to a larger proportion of the two end positions. Since it is farther away from the range of intense laser parameter configuration adjustment, it will not significantly affect the party with a larger temperature influence range, and the degree of influence on its own adjustment will also decrease.

[0044] like Figure 7 As shown, this embodiment determines the position coordinates of points 1P and 2P, and substitutes the position ratio of the two ends to obtain the position coordinates of the temporary segmentation point; specifically, the coordinate expression of the current segmentation line can be obtained, and then the horizontal / vertical coordinates of points 1P and 2P are converted according to the position ratio of the two ends, and substituted into the coordinate expression for calculation, and the output is the position coordinates of the temporary segmentation point corresponding to 3P.

[0045] Based on this, we can get the following unified processing steps to automatically generate temporary segmentation points: Obtain the coordinate expression of the current segmented line, as well as the position coordinates of the temperature maximum and temperature minimum points, and roughly estimate the hot spot temperature of the laser source; Calculate the temperature difference between the roughly estimated laser source hotspot temperature at the temperature maximum point and the upper limit of the target temperature range to obtain the minimum temperature adjustment amount of the upper limit; Calculate the temperature difference between the roughly estimated laser source hotspot temperature at the temperature minimum point and the target temperature range summer boundary, and obtain the minimum temperature adjustment amount of the lower boundary; The inverse ratio of the upper limit minimum temperature adjustment amount to the lower limit minimum temperature adjustment amount is used as the position ratio of the temporary segment point to the temperature maximum point and the temperature minimum point; Determine the independent variable coordinates in the coordinate analytical expression (in this embodiment, the X-axis coordinates), and determine the independent variable coordinates of the temporary segmentation point based on the position ratio of the temperature maximum point and the temperature minimum point; Substitute the independent variable coordinates of the temporary segmentation point into the coordinate analytical expression, calculate the dependent variable coordinates of the temporary segmentation point (the Y-axis coordinate in this embodiment), and obtain the coordinate position of the temporary segmentation point (X-axis coordinate, Y-axis coordinate).

[0046] Furthermore, the rough estimate of the laser source hotspot temperature is converted by weighting using the following formula: T= ( K P + K τ + K f + K v ) / 4·(1+ β ) T 0; in, K P 、 K τ 、 K f 、 K v are the independent influencing factors corresponding to laser power, laser pulse width, laser frequency and cleaning speed, T To roughly estimate the hotspot temperature of the laser source, T 0 is the hot spot temperature of the reference laser source, β To roughly estimate the temperature margin, it is a negative value at the minimum temperature point or the extreme minimum temperature point, and a positive value at the maximum temperature point or the extreme maximum temperature point.

[0047] Furthermore, based on Example 2, this embodiment proposes the following independent influencing factors based only on the independent adjustment of each parameter of the system (the adjustment of parameters does not affect each other and does not constitute a limitation) (this embodiment does not discuss more complex and mutually existing control systems): When other conditions remain unchanged, the temperature rise value of the laser source hot spot temperature ΔT With laser energy E There is a linear relationship, that is: ΔT = k `· E ;in, k ` is the linear coefficient, and since E = P · t Therefore, the laser power and the temperature rise ΔT There is also a nearly linear relationship. P is the laser power, t is the irradiation time; therefore, the independent influencing factor of laser power is: K P =( P / P 0); among them, P is the current laser power, P 0 is the laser power configured with the reference laser parameters; Furthermore, when other conditions remain unchanged, the cleaning is performed relatively statically by default; when the laser is irradiated statically, the irradiation time t =Equal to the laser pulse width (laser pulse width); therefore, the laser pulse width and the temperature rise value ΔT It also shows a nearly linear relationship, so the independent influencing factor of laser pulse width is: K τ =( τ / τ 0); among them, τ is the current laser pulse width, τ 0 is the laser pulse width configured with the reference laser parameters; Furthermore, under the condition that other conditions remain unchanged, the higher the laser frequency (the laser frequency here refers to the irradiation frequency of the laser beam, not the light wave frequency of the laser light source), the more times the laser source hotspot area is irradiated. E = E p · f ;in, E p is the single pulse energy (considered constant here), so the independent influencing factor of laser frequency is: K f =( f / f 0); among them, f is the current laser frequency,f 0 is the laser frequency of the baseline laser parameter configuration.

[0048] Furthermore, under the condition that other conditions remain unchanged, the higher the cleaning speed, the shorter the time received by the laser source hot spot area. E = P · t , t = d / v ;in, d is the hot spot diameter of the laser source; therefore, the independent influencing factor of the cleaning speed is: k v =( v 0 / v ); Furthermore, in order to ensure the reliability of the calculation that the rough estimated temperature range falls within the target temperature range, this embodiment also adds a rough estimated temperature margin when roughly estimating the laser source hotspot temperature. β ; Among them, the rough temperature margin β When roughly estimating the lower limit of the temperature, it will go down a little through the negative value, and when roughly estimating the upper limit of the temperature, it will go up a little through the positive value, leaving margin on both sides to accommodate unpredictable temperature fluctuations.

[0049] In addition, since the device in Example 1 is equipped with a blowing motor module 2, when the configuration file determined by the user is not a safe configuration, a segmented line higher than the target temperature range is determined according to the configuration file determined by the user, and a blowing motor module 2 configuration is generated and applied to the blowing motor driver; wherein, the blowing motor module 2 configuration determines the blowing point and the air closing point of the blowing motor module 2 according to the starting point and the end point of the segmented line, combined with the advance blowing parameter and the delayed air closing parameter set by the user ( Figure 3 As shown in the figure, this is the system parameter set by the user).

[0050] In actual use, since the blowing motor module 2 configuration is set in advance, when drawing the laser pattern, as long as the next segmented line is a segmented line higher than the target temperature range, the blowing motor module 2 will be started in advance according to the blowing motor module 2 configuration to perform advance blowing, and the air will be delayed to be shut off after the drawing is completed so that the high-temperature area can be cooled down quickly to ensure that the substrate is not damaged by high temperature.

[0051] The above are only some embodiments of the present application and are not intended to limit the patent scope of the present application. All equivalent structural transformations made using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A portable laser cleaning device, characterized in that: It includes a laser cleaning tool, a control board and an operation panel (4): wherein, The laser cleaning hand tool comprises a head structure (1) and a hand tool structure (3) connected via an adjustable rotating shaft (31); wherein the head structure (1) is provided with a laser generating module and an air blowing motor module (2); a wire outlet (32) is provided at the bottom of the hand tool structure (3); and the laser generating module and the air blowing module are electrically connected to the control board via the wire outlet (32); The laser generating module comprises a laser generator (11), a focusing field lens (12) and a laser output head (13) connected in sequence; wherein the laser generator (11) transmits the laser path to the focusing field lens (12) through a reflective lens, and the focusing field lens (12) is used to focus the laser to the laser output head (13), and the focusing field lens (12) is respectively X Axis and Y The axis sets the laser galvanometer motor (14) for angle adjustment; The control board is based on ARM The single chip microcomputer is set up and connected to the laser galvanometer motor (14) driver, the blower motor driver, the temperature acquisition module, the data storage module and RS 232 communication module is electrically connected, the laser generating module is electrically connected to the laser galvanometer motor (14) driver, the blowing motor driver is electrically connected to the blowing motor module (2), the RS The 232 communication module is electrically connected to the operation panel (4), and the temperature acquisition module is used to acquire the temperature status of the device.

2. A built-in control system, deployed in the control board of a portable laser cleaning device, characterized in that: The control board performs laser cleaning control based on a configuration file, wherein the configuration file includes laser pattern configuration, laser parameter configuration, cleaning object configuration and target temperature range; wherein, The laser pattern configuration is used to describe the laser pattern used; the laser parameter configuration includes cleaning speed, laser frequency, laser pulse width and laser power; the cleaning object configuration is based on manual input matching, including the object substrate type and surface attachment type; the target temperature range is set based on manual input.

3. A built-in control system according to claim 2, characterized in that: The data storage module pre-stores a laser pattern configuration library, which stores a number of laser patterns and rapid conversion information corresponding to the laser patterns; wherein, The laser pattern is drawn in a segmented order based on a number of segmented lines; the rapid conversion information includes the temperature maximum point and temperature minimum point of the laser pattern, the temperature maximum point and temperature minimum point of each segmented line, the reference laser source hotspot temperature corresponding to each point, and the reference laser parameter configuration.

4. A built-in control system according to claim 3, characterized in that: The laser parameter configuration used at high frequency is used as the benchmark laser parameter configuration and input into the laser source hotspot model for segmented simulation calculation; Establish the corresponding laser source hotspot model based on the laser generation module; Determine the calculation order and calculation path of the segmented simulation calculation based on the laser pattern configuration, and determine the distribution position and number of laser source hot spots based on the cleaning speed and calculation path; The model parameters of the laser source hotspot model are determined based on the cleaning speed, laser frequency, laser pulse width and laser power, and segmented simulation calculation iterations are performed to obtain the laser source hotspot distribution map corresponding to each iteration stage of the laser pattern; Based on the laser source hot spot distribution map at each iterative stage, the temperature maximum point and temperature minimum point of the laser pattern, as well as the temperature maximum point and temperature minimum point of each segmented line are determined.

5. A security configuration method, applied to a built-in control system according to any one of claims 2 to 4, characterized in that: Quickly match the security configuration by following the steps below: Step 1: Obtain the configuration file and perform configuration analysis to obtain the laser pattern configuration, laser parameter configuration, cleaning object configuration, and target temperature range; Step 2: Match the corresponding safe temperature range based on the cleaning object configuration; the maximum safe temperature is determined by the maximum tolerance temperature of the object substrate type, and the minimum safe temperature is determined by the minimum cleaning temperature of the surface attachment type; Step 3: Determine whether the target temperature range is within the safe temperature range; if so, accept the current target temperature range; otherwise, ask whether to adjust the target temperature range and accept the target temperature range determined by the user; Step 4: Obtain the fast conversion information corresponding to the laser pattern used in the laser pattern configuration library, convert the parameter changes between the current laser parameter configuration and the reference laser parameter configuration into independent influencing factors corresponding to each laser parameter; perform weighted conversion on the reference laser source hotspot temperatures at the maximum and minimum temperature points based on each independent influencing factor to obtain a rough estimate of the laser source hotspot temperatures at the maximum and minimum temperature points; Step 5: Determine a rough estimated temperature range based on the rough estimated laser source hotspot temperatures at the maximum and minimum temperature points, and determine whether the rough estimated temperature range is within the target temperature range; if so, accept the current configuration file as a safe configuration and end; otherwise, proceed to step 6; Step 6: Ask whether to automatically match the security configuration; if so, obtain the parameter adjustment policy and execute step 7; otherwise, ask whether to adjust the current configuration file, accept the configuration file determined by the user, and end; Step 7: Adjust the laser parameter configuration based on the parameter adjustment strategy, re-obtain the rough estimate of the laser source hotspot temperature at the maximum temperature point and the minimum temperature point, and update the rough estimate temperature range; wherein, when the rough estimate temperature range is within the target temperature range, output the current laser parameter configuration; Step 8: Ask the user whether to accept the current laser parameter configuration; if so, update the current laser parameter configuration to the configuration file, and accept the current configuration file as a safe configuration, and end; otherwise, based on the user's selection, return to step 7 or accept the configuration file determined by the user, and end.

6. A security configuration method according to claim 5, characterized in that: The parameter adjustment strategy includes a single parameter adjustment strategy and a mixed parameter adjustment strategy; wherein, Single parameter adjustment strategy: only adjust any one of the cleaning speed, laser frequency, laser pulse width and laser power; Mixed parameter adjustment strategy: adjust at least one of the cleaning speed, laser frequency, laser pulse width and laser power according to a preset parameter adjustment ratio.

7. A security configuration method according to claim 6, characterized in that: When adjusting laser parameters: When the roughly estimated laser source hotspot temperature at the temperature minimum point is lower than the target temperature range, the laser source hotspot temperature is increased by iteratively reducing the cleaning speed, iteratively increasing the laser frequency, iteratively increasing the laser pulse width, and / or iteratively increasing the laser power; When the roughly estimated laser source hotspot temperature at the temperature maximum point is greater than the target temperature range, the laser source hotspot temperature is reduced by iteratively increasing the cleaning speed, iteratively decreasing the laser frequency, iteratively decreasing the laser pulse width and / or iteratively decreasing the laser power.

8. A security configuration method according to claim 7, characterized in that: When the same laser parameter configuration cannot make the roughly estimated laser source hotspot temperatures of the temperature maximum point and the temperature minimum point simultaneously within the target temperature range, the laser parameters of each segmented line are adjusted separately until the roughly estimated laser source hotspot temperatures of the temperature maximum point and the temperature minimum point of each segmented line simultaneously fall within the target temperature range, and this is used as the laser parameter configuration for each segmented line segment independently.

9. A security configuration method according to claim 8, characterized in that: When the same laser parameter configuration cannot make the roughly estimated laser source hotspot temperatures of the temperature maximum point and the temperature minimum point in the same segmented line simultaneously within the target temperature range, a temporary segmentation point is automatically generated between the two points and the segmented line is divided into two sub-segmented lines. The laser parameters of each sub-segmented line are adjusted separately until the roughly estimated laser source hotspot temperatures of the temperature maximum point / temperature minimum point of each sub-segmented line are within the target temperature range, and this is used as the laser parameter configuration for each sub-segmented line segment independently.

10. A security configuration method according to claim 5, characterized in that: The rough estimate of the laser source hotspot temperature is converted by weight using the following formula: T= ( K P + K τ + K f + K v ) / 4·(1+ β ) T 0； in, K P 、 K τ 、 K f 、 K v are the independent influencing factors corresponding to laser power, laser pulse width, laser frequency and cleaning speed, T To roughly estimate the hotspot temperature of the laser source, T 0 is the hot spot temperature of the reference laser source, β To roughly estimate the temperature margin, it is a negative value at the minimum temperature point or the extreme minimum temperature point, and a positive value at the maximum temperature point or the extreme maximum temperature point.

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