A tin soldering vacuum furnace for chip manufacturing

Abstract

This invention relates to the field of chip packaging technology, specifically to a soldering vacuum furnace for chip manufacturing. It includes a vacuum furnace body, a base frame below the furnace body, and first cylinders on both sides of the base frame. Each first cylinder has a pneumatic telescopic rod, the telescopic ends of which are fixedly connected to the bottom of the vacuum furnace body. A double-layer support is fixedly mounted on the base frame, and the double-layer support can move up and down within the vacuum furnace body. A constant pressure core device is located within the double-layer support, and a swing coating brush is located on one side of the constant pressure core device. An intermittent rotating tray is rotatably connected to the bottom of the double-layer support, and an intermittent rotating bracket is located below the intermittent rotating tray. The intermittent rotating bracket contains an intermittent rotation mechanism fixedly connected to the bottom of the intermittent rotating tray. This invention provides a soldering vacuum furnace for chip manufacturing with better heat dissipation, allowing for the fixation of chips of different heights or thicknesses without damaging the chips or substrate.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, specifically to a soldering vacuum furnace for chip manufacturing. Background Technology

[0002] Soldering vacuum furnaces play a crucial role in chip manufacturing. They enable soldering in a vacuum environment, effectively reducing bubbles and voids during the soldering process, thereby improving soldering quality and ensuring chip reliability and performance. The correct use of soldering vacuum furnaces and the optimization of process parameters are essential for enhancing the overall reliability of electronic products.

[0003] Existing soldering vacuum furnaces heat electronic components in a vacuum environment during the soldering process, melting and connecting them to the circuit board. This soldering method can improve soldering quality and reduce soldering defects. The vacuum environment can effectively prevent oxidation reactions and improve soldering quality. The soldering vacuum furnace is equipped with cooling bosses. When heating, the platform rises and separates from the cooling bosses, resulting in rapid heating without being affected by the cooling pipes, ensuring uniform heating. After heating, rapid cooling is required, so the platform is lowered to fit against the cooling bosses, resulting in fast cooling.

[0004] However, during the cooling process, the electronic components are still located inside the soldering vacuum furnace, where the temperature drops rapidly. This results in a significant temperature difference between the contact surface between the electronic components and the cooling boss and the side away from the cooling boss, leading to a large difference in heating between the two sides of the electronic components. In addition, the soldering robot inside the soldering vacuum furnace needs a lot of freedom of movement to meet the soldering requirements of the pins on all four sides of the chip. This method is costly. Furthermore, the chip needs to be pressed during soldering, but existing technologies use CNC to press and fix chips of different heights or thicknesses, which can easily cause damage. Summary of the Invention

[0005] To solve the above problems, the present invention provides a soldering vacuum furnace for chip manufacturing, which has better heat dissipation and can fix chips of different heights or thicknesses without damaging the chips or substrates.

[0006] To solve the above-mentioned technical problems, the technical solution provided by the present invention is as follows: a soldering vacuum furnace for chip manufacturing, which includes a vacuum furnace body, a base frame provided below the vacuum furnace body, a first cylinder provided on both sides of the base frame, a pneumatic telescopic rod provided on the first cylinder, and the telescopic ends of the two pneumatic telescopic rods being fixedly connected to the bottom of the vacuum furnace body.

[0007] A double-layer support is fixedly installed on the base frame. The double-layer support can move up and down inside the vacuum furnace body. A constant pressure core device is provided inside the double-layer support. A swing paint brush is provided on one side of the constant pressure core device. An intermittent rotating tray is rotatably connected to the bottom of the double-layer support. An intermittent rotating bracket is provided below the intermittent rotating tray. An intermittent rotating mechanism is fixedly connected to the bottom of the intermittent rotating tray inside the intermittent rotating bracket.

[0008] As an improvement, the vacuum furnace body includes a hollow furnace body, the bottom of which is provided with a through groove that cooperates with the double-layer support, a soldering robot compartment is provided on one side of the hollow furnace body, a micro soldering robot is provided in the soldering robot compartment, and a connecting pipe is provided at one end of the hollow furnace body.

[0009] As an improvement, the double-layer support includes a base plate fixedly installed on the base frame, a top plate on the base plate, a support column between the base plate and the top plate, and a circular groove in the base plate that is rotatably connected to the intermittent rotating tray.

[0010] As an improvement, the constant pressure core device includes a second cylinder fixedly installed below the top plate. A stepped rod is fixedly connected to the telescopic end of the second cylinder. A rectangular slider is fixedly connected to the bottom of the stepped rod. An outer shell is fitted over the rectangular slider. A first shaft hole is provided inside the rectangular slider. A first strip groove is provided on the outer shell to cooperate with the first shaft hole. A first limiting shaft is provided in the first shaft hole and the first strip groove. A second strip groove is provided inside the rectangular slider. A second shaft hole is provided on the outer shell to cooperate with the second strip groove. A second limiting shaft is provided between the second shaft hole and the second strip groove. A first spring is provided on the top of the outer shell and fitted over the stepped rod. A chip pin is rotatably connected to the bottom of the outer shell.

[0011] As an improvement, the intermittent rotating bracket includes a cylindrical frame, the cylindrical frame having a drive device mounting slot, the inner wall of the drive device mounting slot having four evenly distributed grooves, and the drive device mounting slot having an annular limiting groove located above the grooves.

[0012] As an improvement, the intermittent rotation mechanism includes a turntable that mates with the drive device mounting slot. Four spring dampers are fixedly connected to each of the four grooves. A trapezoidal locking block is provided near one end of each of the four spring dampers on the turntable. A triangular locking groove that mates with the trapezoidal locking block is provided on the edge of the turntable. A rotating shaft is rotatably connected to the bottom center of the turntable. A bracket that slidably connects to the turntable and mates with the trapezoidal locking block is fixedly connected to the rotating shaft. A first fixed post is fixedly connected to the bottom side of one end of the bracket. A second fixed post is fixedly connected to the lower end of the turntable. A second spring is fixedly connected between the first and second fixed posts. A drive motor is fixedly connected to the rotating shaft.

[0013] As an improvement, the thickness of the trapezoidal block is greater than or equal to the sum of the thickness of the turntable and the thickness of the bracket, and the angle between the second fixed column to the axis of rotation and the bracket is greater than 90 degrees.

[0014] As an improvement, the intermittent rotating tray is fixedly connected to the turntable, and the intermittent rotating tray is provided with a packaging substrate mounting frame.

[0015] With the above structure, the present invention has the following advantages:

[0016] 1. The entire vacuum furnace body can be moved up and down by controlling the first cylinder, thereby controlling the position of the hollow furnace body. When the bottom plate of the hollow furnace body is in contact with the through groove, the hollow furnace body is closed. When the bottom plate of the hollow furnace body is separated from the through groove, the hollow furnace body is in an open state. This allows the substrate and chip to be completely exposed to the air for heat dissipation and cooling, eliminating the need for heat dissipation protrusions in existing technologies and achieving better heat dissipation. Furthermore, since the vacuum furnace body moves while the double-layer support remains stationary, it facilitates the transportation of materials in the automated production line.

[0017] 2. The extension end of the second cylinder drives the stepped rod to press down, the stepped rod drives the rectangular slider to move downward, the rectangular slider drives the outer shell to move downward, thereby driving the chip pin to press the chip onto the substrate. The extension end of the second cylinder 801 continues to move downward, the rectangular slider and the outer shell move relative to each other, and the force applied by the chip pin to the chip is provided by the first spring, thereby applying a relatively constant force, thus fixing chips of different heights or thicknesses without damaging the chip or the substrate.

[0018] 3. By using an intermittent rotating bracket and an intermittent rotating mechanism, the intermittent rotating tray can be rotated 90 degrees intermittently to meet the soldering requirements of the pins on all four sides of the chip, eliminating the need for micro-soldering robots to have multiple degrees of freedom and greatly reducing production costs. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a soldering vacuum furnace for chip manufacturing according to the present invention.

[0020] Figure 2 This is a schematic diagram of the structure of the vacuum furnace body of a soldering vacuum furnace for chip manufacturing according to the present invention.

[0021] Figure 3 This is a schematic diagram of the internal structure of the vacuum furnace body of a soldering vacuum furnace for chip manufacturing according to the present invention.

[0022] Figure 4 This is a schematic diagram of the constant pressure core device of a soldering vacuum furnace for chip manufacturing according to the present invention.

[0023] Figure 5This is an exploded view of the constant pressure core device of a soldering vacuum furnace for chip manufacturing according to the present invention.

[0024] Figure 6 This is a perspective view of the outer casing of a constant pressure core device for a soldering vacuum furnace used in chip manufacturing according to the present invention.

[0025] Figure 7 This is a schematic diagram of the structure of a double-layer support for a soldering vacuum furnace used in chip manufacturing according to the present invention.

[0026] Figure 8 This is a schematic diagram of the intermittent rotating bracket of a soldering vacuum furnace for chip manufacturing according to the present invention.

[0027] Figure 9 This is a schematic diagram of the intermittent rotation mechanism of a soldering vacuum furnace for chip manufacturing according to the present invention. Figure 1 .

[0028] Figure 10 This is a schematic diagram of the intermittent rotation mechanism of a soldering vacuum furnace for chip manufacturing according to the present invention. Figure 2 .

[0029] As shown in the figure: 1. Vacuum furnace body; 101. Hollow furnace body; 102. Through slot; 103. Soldering robot compartment; 104. Connecting pipe; 2. Base frame; 3. Double-layer support; 301. Base plate; 302. Circular slot; 303. Top plate; 304. Support column; 4. First cylinder; 5. Pneumatic telescopic rod; 6. Intermittent rotating tray; 7. Encapsulation substrate mounting frame; 8. Constant pressure core device; 801. Second cylinder; 802. Outer shell; 803. Rectangular slider; 804. Stepped rod; 805. First spring; 806. First strip groove; 807. First limiting shaft; 808. Second shaft hole; 809. Second... 810. Limiting shaft; 811. Chip pin; 812. First shaft hole; 813. Second strip groove; 9. Swinging paint brush; 10. Miniature soldering robot; 11. Intermittent rotation mechanism; 1101. Turntable; 1102. Triangular slot; 1103. Trapezoidal block; 1104. Spring damper; 1105. Rotating shaft; 1106. Drive motor; 1107. Bracket; 1108. Second fixed post; 1109. Second spring; 1110. First fixed post; 12. Intermittent rotation bracket; 1201. Cylindrical frame; 1202. Drive device mounting slot; 1203. Annular limiting groove; 1204. Groove. Detailed Implementation

[0030] The present invention will now be described in further detail with reference to the accompanying drawings.

[0031] Combined with appendix Figure 1 Appendix Figure 2 and attached Figure 3 :

[0032] A soldering vacuum furnace for chip manufacturing includes a vacuum furnace body 1, which includes a hollow furnace body 101. The bottom of the hollow furnace body 101 is provided with a through groove 102 that cooperates with a double-layer support 3. A soldering robot compartment 103 is provided on one side of the hollow furnace body 101, and a micro soldering robot 10 is provided inside the soldering robot compartment 103. A connecting pipe 104 is provided at one end of the hollow furnace body 101.

[0033] Through this structure, the connecting tube 104 is connected to the vacuum pump, which is existing technology and therefore will not be described in detail here. The micro soldering robot 10 can be remotely controlled, and the robotic arm of the micro soldering robot 10 can be fully retracted into the connecting tube 104 to perform soldering while holding the solder bar, which is existing technology and will not be described in detail here.

[0034] Combined with appendix Figure 1 Appendix Figure 2 Appendix Figure 3 and attached Figure 7

[0035] A base frame 2 is provided below the vacuum furnace body 1. First cylinders 4 are provided on both sides of the base frame 2. Pneumatic telescopic rods 5 are provided on the first cylinders 4. The telescopic ends of the two pneumatic telescopic rods 5 are fixedly connected to the bottom of the vacuum furnace body 1. A double-layer support 3 is fixedly installed on the base frame 2. The double-layer support 3 can move up and down inside the vacuum furnace body 1. The double-layer support 3 includes a base plate 301 fixedly installed on the base frame 2. A top plate 303 is provided on the base plate 301. A support column 304 is provided between the base plate 301 and the top plate 303. A circular groove 302 is provided in the base plate 301 that is rotatably connected to the intermittent rotating tray 6.

[0036] Through this structure, the first cylinder 4 can be controlled to move the entire vacuum furnace body 1 up and down, thereby controlling the position of the hollow furnace body 101. When the bottom plate 301 at the bottom of the hollow furnace body 101 is in contact with the through groove 102, the hollow furnace body 101 is closed. When the bottom plate 301 at the bottom of the hollow furnace body 101 is separated from the through groove 102, the hollow furnace body 101 is in a non-closed state.

[0037] Combined with appendix Figure 1 Appendix Figure 4 Appendix Figure 5 Appendix Figure 6 and attached Figure 7 :

[0038] The double-layer support 3 is equipped with a constant pressure core device 8. A swing paint brush 9 is located on one side of the constant pressure core device 8. The constant pressure core device 8 includes a second cylinder 801 fixedly installed below the top plate 303. A stepped rod 804 is fixedly connected to the telescopic end of the second cylinder 801. A rectangular slider 803 is fixedly connected to the bottom of the stepped rod 804. A housing 802 is fitted over the rectangular slider 803. A first shaft hole 811 is provided inside the rectangular slider 803. The housing 802 has a fitting that matches the first shaft hole 811. The first groove 806 is connected to the first shaft hole 811 and the first groove 806 is provided with a first limiting shaft 807. The rectangular slider 803 is provided with a second groove 812. The outer shell 802 is provided with a second shaft hole 808 that cooperates with the second groove 812. A second limiting shaft 809 is provided between the second shaft hole 808 and the second groove 812. The top of the outer shell 802 is provided with a first spring 805 that is sleeved on the stepped rod 804. The bottom of the outer shell 802 is rotatably connected with a chip pin 810.

[0039] With this structure, the telescopic end of the second cylinder 801 drives the stepped rod 804 to press down. The stepped rod 804 drives the rectangular slider 803 to move downward, and the rectangular slider 803 drives the outer shell 802 to move downward, thereby causing the chip pin 810 to press the chip onto the substrate. As the telescopic end of the second cylinder 801 continues to move downward, the rectangular slider 803 and the outer shell 802 move relative to each other. At this time, the first limiting shaft 807 moves downward along the first groove 806 with the first shaft hole 811, while the position of the second limiting shaft 809 remains unchanged. The second groove 812 moves downward with the second limiting shaft 809, thereby reducing the distance between the top of the outer casing 802 and the top of the stepped rod 804. The top of the stepped rod 804 is provided with a limiting ring for limiting the first spring 805. This is prior art and will not be described in detail here. This compresses the first spring 805. At this time, the force applied by the chip pin 810 to the chip is provided by the first spring 805, thereby applying a relatively constant force, thus fixing chips of different heights or thicknesses without damaging the chip or substrate.

[0040] Combined with appendix Figure 1 Appendix Figure 7 Appendix Figure 8 Appendix Figure 9 and attached Figure 10 :

[0041] The bottom of the double-layer bracket 3 is rotatably connected to an intermittent rotating tray 6. An intermittent rotating bracket 12 is provided below the intermittent rotating tray 6. The intermittent rotating bracket 12 includes a cylindrical frame 1201. A drive device mounting groove 1202 is provided inside the cylindrical frame 1201. Four evenly distributed grooves 1204 are provided on the inner wall of the drive device mounting groove 1202. An annular limiting groove 1203 is provided inside the drive device mounting groove 1202, located above the grooves 1204.

[0042] The intermittent rotating bracket 12 is provided with an intermittent rotating mechanism 11 fixedly connected to the bottom of the intermittent rotating tray 6. The intermittent rotating mechanism 11 includes a turntable 1101 that mates with the drive device mounting slot 1202. Four spring dampers 1104 are fixedly connected in each of the four grooves 1204. A trapezoidal locking block 1103 is provided at one end of each spring damper 1104 near the turntable 1101. A triangular locking groove 1102 that mates with the trapezoidal locking block 1103 is provided on the edge of the turntable 1101. A rotating shaft 1105 is rotatably connected to the bottom center of the turntable 1101. A bracket 1107 that is slidably connected to the turntable 1101 and cooperates with the trapezoidal locking block 1103 is fixedly connected to the rotating shaft 1105. A first fixing post 1110 is fixedly connected to the bottom side of one end of the bracket 1107. A second fixing post 1108 is fixedly connected to the lower end of the turntable 1101. A second spring 1109 is fixedly connected between the first fixing post 1110 and the second fixing post 1108. A drive motor 1106 is fixedly connected to the rotating shaft 1105.

[0043] The thickness of the trapezoidal block 1103 is greater than or equal to the sum of the thickness of the turntable 1101 and the thickness of the bracket 1107, and the angle between the line segment from the second fixed column 1108 to the rotating shaft 1105 and the bracket 1107 is greater than 90 degrees.

[0044] With the above structure, the drive motor 1106 drives the rotating shaft 1105 to rotate clockwise, and the bracket 1107 rotates with the rotating shaft 1105. At this time, because the trapezoidal block 1103 and the triangular slot 1102 are locked together, the turntable 1101 does not rotate, so the distance between the first fixed post 1110 and the second fixed post 1108 increases as the bracket 1107 rotates clockwise, which causes the second spring 1109 to stretch and store force. When the bracket 1107 rotates to the trapezoidal block 1103 that is locked together with the triangular slot 1102, the trapezoidal block 1103 is squeezed by the bracket 1107 and enters the groove 1204 and disengages from the triangular slot 1102. At this time, the turntable 1101 rotates clockwise rapidly under the action of the second spring 1109, and the triangular slot 1102 locks together with the next trapezoidal block 1103 in the clockwise direction, so that the intermittent rotating tray 6 rotates intermittently.

[0045] Combined with appendix Figure 7 :

[0046] The intermittent rotating tray 6 is fixedly connected to the turntable 1101. The intermittent rotating tray 6 is provided with a packaging substrate mounting frame 7, which is used to fix the substrate. This is prior art, so it will not be described in detail here.

[0047] In a specific implementation of the present invention, the substrate is placed in the packaging substrate mounting frame 7, and then the chip is placed in the substrate soldering position. The second cylinder 801 is activated, and the force applied to the chip by the chip pin 810 is provided by the first spring 805, thereby applying a relatively constant force, thus fixing chips of different heights or thicknesses without damaging the chip or the substrate.

[0048] The first cylinder 4 is controlled to move the entire vacuum furnace body 1 downwards, so that the bottom plate 301 is in contact with the through groove 102 and the hollow furnace body 101 is in a closed state. The vacuum pump is started to extract air from the hollow furnace body 101 to achieve the required vacuum state. The oscillating paint brush 9 is started to apply flux. The micro soldering robot 10 is started to solder the pins on one side of the chip.

[0049] Start the drive motor 1106 to make the intermittent rotating tray 6 rotate intermittently, rotating 90 degrees each time, so as to solder the pins on the four sides of the chip. After the soldering is completed, the hollow furnace body 101 is filled with gas, and then the first cylinder 4 is started to move the entire vacuum furnace body 1 upward, so that the substrate and chip are completely exposed to the air for heat dissipation and cooling.

[0050] The present invention and its embodiments have been described above. This description is not restrictive, and the actual structure is not limited thereto. In short, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the invention, such designs should fall within the protection scope of the present invention.

Claims

1. A soldering vacuum furnace for chip manufacturing, comprising a vacuum furnace body (1), a base frame (2) below the vacuum furnace body (1), first cylinders (4) on both sides of the base frame (2), pneumatic telescopic rods (5) on the first cylinders (4), and the telescopic ends of the two pneumatic telescopic rods (5) being fixedly connected to the bottom of the vacuum furnace body (1), characterized in that: A double-layer bracket (3) is fixedly installed on the base frame (2). The double-layer bracket (3) can move up and down inside the vacuum furnace body (1). A constant pressure core device (8) is provided inside the double-layer bracket (3). A swing paint brush (9) is provided on one side of the constant pressure core device (8). An intermittent rotating tray (6) is rotatably connected to the bottom of the double-layer bracket (3). An intermittent rotating bracket (12) is provided below the intermittent rotating tray (6). An intermittent rotating mechanism (11) is fixedly connected to the bottom of the intermittent rotating tray (6) inside the intermittent rotating bracket (12). The vacuum furnace body (1) includes a hollow furnace body (101), the bottom of the hollow furnace body (101) is provided with a through groove (102) that cooperates with the double-layer support (3), a soldering robot compartment (103) is provided on one side of the hollow furnace body (101), a micro soldering robot (10) is provided in the soldering robot compartment (103), and a connecting pipe (104) is provided at one end of the hollow furnace body (101). The double-layer support (3) includes a base plate (301) fixedly installed on the base frame (2), a top plate (303) on the base plate (301), a support column (304) between the base plate (301) and the top plate (303), and a circular groove (302) in the base plate (301) that is rotatably connected to the intermittent rotating tray (6).

2. The soldering vacuum furnace for chip manufacturing according to claim 1, characterized in that: The constant pressure core device (8) includes a second cylinder (801) fixedly installed below the top plate (303). A stepped rod (804) is fixedly connected to the telescopic end of the second cylinder (801). A rectangular slider (803) is fixedly connected to the bottom of the stepped rod (804). An outer shell (802) is fitted over the rectangular slider (803). A first shaft hole (811) is provided inside the rectangular slider (803). A first strip groove (806) is provided on the outer shell (802) that mates with the first shaft hole (811). The first limiting shaft (807) is provided in the first strip groove (806), the second strip groove (812) is provided in the rectangular slider (803), the second shaft hole (808) that cooperates with the second strip groove (812) is provided on the outer shell (802), the second limiting shaft (809) is provided between the second shaft hole (808) and the second strip groove (812), the top of the outer shell (802) is provided with a first spring (805) that is sleeved on the stepped rod (804), and the bottom of the outer shell (802) is rotatably connected with a chip pin (810).

3. The soldering vacuum furnace for chip manufacturing according to claim 1, characterized in that: The intermittent rotating bracket (12) includes a cylindrical frame (1201), a drive device mounting groove (1202) is provided inside the cylindrical frame (1201), four evenly distributed grooves (1204) are provided on the inner wall of the drive device mounting groove (1202), and an annular limiting groove (1203) is provided inside the drive device mounting groove (1202) above the grooves (1204).

4. The soldering vacuum furnace for chip manufacturing according to claim 3, characterized in that: The intermittent rotation mechanism (11) includes a turntable (1101) that cooperates with the drive device mounting slot (1202). Each of the four grooves (1204) is fixedly connected with a spring damper (1104). Each of the four spring dampers (1104) has a trapezoidal locking block (1103) near one end of the turntable (1101). The edge of the turntable (1101) is provided with a triangular locking groove (1102) that cooperates with the trapezoidal locking block (1103). A rotating shaft (1105) is rotatably connected to the bottom center of the turntable (1101). A bracket (1107) that is slidably connected to the turntable (1101) and cooperates with the trapezoidal block (1103) is fixedly connected to the rotating shaft (1105). A first fixing post (1110) is fixedly connected to the bottom side of one end of the bracket (1107). A second fixing post (1108) is fixedly connected to the lower end of the turntable (1101). A second spring (1109) is fixedly connected between the first fixing post (1110) and the second fixing post (1108). A drive motor (1106) is fixedly connected to the rotating shaft (1105).

5. A soldering vacuum furnace for chip manufacturing according to claim 4, characterized in that: The thickness of the trapezoidal block (1103) is greater than or equal to the sum of the thickness of the turntable (1101) and the thickness of the bracket (1107), and the angle between the line segment from the second fixed column (1108) to the rotating shaft (1105) and the bracket (1107) is greater than 90 degrees.

6. A soldering vacuum furnace for chip manufacturing according to claim 4, characterized in that: The intermittent rotating tray (6) is fixedly connected to the turntable (1101), and the intermittent rotating tray (6) is provided with a packaging substrate mounting frame (7).

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