Miniature capillary heat conductor, miniature high-heat-density equipment and heat conductor installation method

By designing a micro capillary heat conductor and adopting a combination of a cross-shaped square structure and a microcirculation unit, efficient heat dissipation of high heat density devices such as optical modules is achieved, solving the problem of unsatisfactory thermal conductivity in existing technologies and meeting the stability and miniaturization requirements of micro devices.

CN120751579AActive Publication Date: 2025-10-03SHENZHEN HUANGUANG ERA TECH CO LTD
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Patent Information

Application Number
CN202511202819.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-08-27
Publication Date
2025-10-03
Estimated Expiration
2045-08-27

AI Technical Summary

Technical Problem

Existing optical modules conduct heat through PCB vias on the back of the chip, but the thermal conductivity is not ideal and it is difficult to meet the heat dissipation requirements of high heat density equipment.

Method used

A micro capillary heat conductor is designed, which adopts a cross-shaped square structure of heat conducting blocks and microcirculation units. Multiple microcirculation units are stacked and heat is transferred using phase change working fluid, including a heat absorption zone, an evaporation zone and a heat dissipation zone, a combination of a capillary array and a connecting tube to achieve efficient heat conduction.

Benefits of technology

It improves the thermal conductivity and can dissipate heat efficiently in a limited space. It is suitable for micro-high heat density equipment, ensuring stable and reliable operation of the equipment, meeting the requirements of miniaturization and low noise, and reducing the difficulty of PCB circuit board design.

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Abstract

The invention belongs to the technical field of optical communication, and relates to a miniature capillary heat conductor, miniature high-heat-density equipment and a heat conductor installation method, and the heat conductor comprises a shell and a heat conduction module packaged in the shell; the heat conduction module comprises a first heat conduction block, a second heat conduction block, a third heat conduction block and a fourth heat conduction block, each of the first heat conduction block, the second heat conduction block, the third heat conduction block and the fourth heat conduction block comprises a plurality of layers of microcirculation units, and each microcirculation unit is filled with a phase change working medium; the microcirculation unit comprises a heat absorption area, an evaporation area and a heat dissipation area which are communicated in sequence, the heat absorption area is used for making contact with the back face of the chip to conduct heat, the evaporation area extends downwards and outwards from the heat absorption area to the heat dissipation area, the heat dissipation area is used for dissipating heat to the back face of the PCB, the area of the heat dissipation area is larger than that of the heat absorption area, and the heat dissipation area is located on the outer side of the heat absorption area; the beneficial effect of the invention is that the technical problem that the heat conduction efficiency is not ideal because the existing optical module conducts heat through the PCB via hole on the back of the chip is solved.
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